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MCIMX287CVM4C MCIMX287CVM4C NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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S912XET256J2CAL S912XET256J2CAL NXP USA Inc. FSCLS07857-1.pdf?t.download=true&u=5oefqw Description: 16-BIT MCU, S12X CORE, 256KB FLA
auf Bestellung 880 Stücke:
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27+20.18 EUR
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MC908JK1ECDWER MC908JK1ECDWER NXP USA Inc. Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 14
DigiKey Programmable: Not Verified
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A3V07H600-42NR6 NXP USA Inc. A3V07H600-42N.pdf Description: RF MOSFET LDMOS 48V OM1230-6
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-6L
Current Rating (Amps): 10µA
Frequency: 616MHz ~ 870MHz
Configuration: Triple
Power - Output: 112W
Gain: 16.9dB
Technology: LDMOS
Supplier Device Package: OM-1230-6L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 900 mA
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MSC8122TVT4800V MSC8122TVT4800V NXP USA Inc. MSC8122.pdf Description: IC DSP QUAD 16B 300MHZ 431FCBGA
Packaging: Bulk
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 300MHz
Supplier Device Package: 431-FCPBGA (20x20)
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S9KEAZN16ACLH S9KEAZN16ACLH NXP USA Inc. S9KEA64P64M20SF0.pdf Description: IC MCU 32BIT 16KB FLASH 64LQFP
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MC9S08DZ32ACLH557 MC9S08DZ32ACLH557 NXP USA Inc. MC9S08DZ60AD.pdf Description: MICROCONTROLLER, 8-BIT, HC08/S08
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PMZB550UNE315 PMZB550UNE315 NXP USA Inc. PMZB550UNE.pdf Description: NOW NEXPERIA PMZB550UNE SMALL SI
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BUK7619-100B,118 BUK7619-100B,118 NXP USA Inc. BUK7619-100B.pdf Description: MOSFET N-CH 100V 64A D2PAK
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 3400 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 200W (Tc)
Rds On (Max) @ Id, Vgs: 19mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Bulk
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BUK7613-75B118 NXP USA Inc. BUK7613-75B.pdf Description: NOW NEXPERIA BUK7613-75 - POWER
Produkt ist nicht verfügbar
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NX5DV330DS,112 NX5DV330DS,112 NXP USA Inc. NX5DV330.pdf Description: IC VIDEO MUX/DEMUX 1X2 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SSOP
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
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MC9RS08KA8CWGR MC9RS08KA8CWGR NXP USA Inc. SC9RS08KA2.pdf Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-SOIC
Number of I/O: 14
DigiKey Programmable: Verified
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1000+2.03 EUR
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A5G35H120NT2 NXP USA Inc. A5G35H120N.pdf Description: RF MOSFET GAN 48V 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-PowerLDFN
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
Power - Output: 18W
Gain: 14.1dB
Technology: GaN
Supplier Device Package: 10-DFN (7x10)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 70 mA
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PN7160A1EV/C100K PN7160A1EV/C100K NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER I2C VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
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2+13.32 EUR
10+11.55 EUR
25+10.94 EUR
100+10.1 EUR
250+9.59 EUR
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PN7160B1EV/C100Y PN7160B1EV/C100Y NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER SPI VFBGA64
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
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PN7161B1EV/C100Y PN7161B1EV/C100Y NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER SPI VFBGA64
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
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PN7161A1EV/C100Y PN7161A1EV/C100Y NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER I2C VFBGA64
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
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PN7160A1EV/C100Y PN7160A1EV/C100Y NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER I2C VFBGA64
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
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MWCT1213VLH NXP USA Inc. Description: NEVIS2 64LQFP
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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PMV45EN2215 PMV45EN2215 NXP USA Inc. PMV45EN2.pdf Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Produkt ist nicht verfügbar
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OM13589JP OM13589JP NXP USA Inc. A1006.pdf Description: A1006 DEMONSTRATION KIT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A1006
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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S9S12ZVL16F0WLF S9S12ZVL16F0WLF NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
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MHT1803B MHT1803B NXP USA Inc. EB212.pdf Description: RF MOSFET TO247
Packaging: Tube
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1+60.68 EUR
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240+42.01 EUR
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S9S12P64J0CFT S9S12P64J0CFT NXP USA Inc. MC9S12P128RMV1.pdf Description: IC MCU 16BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
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10+6.67 EUR
25+6.17 EUR
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LD6806F/12P,115 LD6806F/12P,115 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 1.2V 200MA 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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74ABT20N,112 74ABT20N,112 NXP USA Inc. 74ABT20.pdf Description: IC GATE NAND 2CH 4-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 4
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 3.9ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 2
Current - Quiescent (Max): 50 µA
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PEMI1QFN/LG,315 PEMI1QFN/LG,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 1
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PEMI1QFN/LE,315 PEMI1QFN/LE,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 11dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 1
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S9S08DV96F2CLF S9S08DV96F2CLF NXP USA Inc. Description: IC MCU 8BIT 96KB FLASH 48LQFP
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N74F827D,602 N74F827D,602 NXP USA Inc. 74F827_Rev2004.pdf Description: IC BUFFER NON-INVERT 5.5V 24SO
Supplier Device Package: 24-SO
Current - Output High, Low: 24mA, 64mA
Number of Bits per Element: 10
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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BZV49-C7V5115 NXP USA Inc. Description: DIODE ZENER 75V 1W SOT89
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-89
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 1 µA @ 5 V
Produkt ist nicht verfügbar
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BLF988S,112 NXP USA Inc. PHGLS25650-1.pdf?t.download=true&u=5oefqw Description: RF PFET, 2-ELEMENT, ULTRA HIGH F
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74LVT162245BDGG112 NXP USA Inc. 74LVT162245B.pdf Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVT162245BDGG118 NXP USA Inc. Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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B4420NSN7QQMD NXP USA Inc. B4420.pdf Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, SPI, UART
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G4860NSN7QUMD NXP USA Inc. Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
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B4420NXN7QQMD NXP USA Inc. B4420.pdf Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, SPI, UART
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G4860NXN7QUMD NXP USA Inc. Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
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G4860NSE7QUMD NXP USA Inc. Download?colCode=B4860&amp;location=null Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 (1)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
Supplier Device Package: 1020-FCPBGA (33x33)
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Core Processor: PowerPC e6500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 1020-BBGA, FCBGA
Packaging: Tray
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G4860NXE7QUMD NXP USA Inc. Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 (1)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
Supplier Device Package: 1020-FCPBGA (33x33)
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Core Processor: PowerPC e6500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 1020-BBGA, FCBGA
Packaging: Tray
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LPC845M301JHI33K LPC845M301JHI33K NXP USA Inc. LPC84x.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
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100+2.57 EUR
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500+2.34 EUR
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PSMN5R0-100ES PSMN5R0-100ES NXP USA Inc. PHGLS23342-1.pdf?t.download=true&u=5oefqw Description: ELEMENT, NCHANNEL, SILICON, MOSF
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PSMN5R5-60YS115 PSMN5R5-60YS115 NXP USA Inc. PSMN5R5-60YS.pdf Description: NOW NEXPERIA 100A, 60V, 0.055OHM
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74LVC32245AEC/DG518 NXP USA Inc. 74LVC32245A.pdf Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
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MMA6853BKW574 MMA6853BKW574 NXP USA Inc. MMA685x.pdf Description: SINGLE-AXIS SPI INERTIAL SENSOR
Part Status: Active
Packaging: Bulk
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S912XDP512J1VAGR S912XDP512J1VAGR NXP USA Inc. Description: IC MCU 16BIT 512KB FLASH 144LQFP
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74AVC16834ADGV,112 74AVC16834ADGV,112 NXP USA Inc. 74AVC16834A.pdf Description: IC UNIV BUS DVR 18BIT 56TVSOP
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BSC9131NJE7HHHB NXP USA Inc. BSC913xNW.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Produkt ist nicht verfügbar
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BSC9131NLE7HHHB NXP USA Inc. BSC913xNW.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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BSC9131NSN7KHKB NXP USA Inc. BSC913xNW.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Produkt ist nicht verfügbar
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BSC9131NXE7KHKB NXP USA Inc. BSC913xNW.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Produkt ist nicht verfügbar
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MK10DX128VMC7R,518 NXP USA Inc. K10P100M72SF1.pdf Description: KINETIS K10: MICROCONTROLLER, FL
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MK10DX128VMC7R518 NXP USA Inc. FSCLS07691-1.pdf?t.download=true&u=5oefqw Description: KINETIS K10: 72MHZ CORTEX-M4 PER
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MKL81Z128VMC7R MKL81Z128VMC7R NXP USA Inc. KNTSKL8XFS.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 85
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKL81Z128VMC7R MKL81Z128VMC7R NXP USA Inc. KNTSKL8XFS.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 85
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MCIMX6DP6AVT8AAR NXP USA Inc. IMX6DQPAEC.pdf Description: IC MPU I.MX6DP 852MHZ 624FCBGA
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
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LPC5534JBD64K LPC5534JBD64K NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
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LPC5536JBD64K LPC5536JBD64K NXP USA Inc. LPC553x.pdf Description: IC MCU M33 256KB/128KB HTQFP64
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MCIMX6X1CVO08ACR MCIMX6X1CVO08ACR NXP USA Inc. IMX6SXIEC.pdf Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKW35A512VFP4R MKW35A512VFP4R NXP USA Inc. MKW36A512.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 5.7mA
Data Rate (Max): 1Mbps
Current - Receiving: 6.3mA
Protocol: Bluetooth v5.0
Power - Output: 5dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -95dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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MCIMX287CVM4C IMX28CEC.pdf
MCIMX287CVM4C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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S912XET256J2CAL FSCLS07857-1.pdf?t.download=true&u=5oefqw
S912XET256J2CAL
Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12X CORE, 256KB FLA
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AnzahlPreis
27+20.18 EUR
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MC908JK1ECDWER
MC908JK1ECDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A3V07H600-42NR6 A3V07H600-42N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM1230-6
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-6L
Current Rating (Amps): 10µA
Frequency: 616MHz ~ 870MHz
Configuration: Triple
Power - Output: 112W
Gain: 16.9dB
Technology: LDMOS
Supplier Device Package: OM-1230-6L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 900 mA
Produkt ist nicht verfügbar
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MSC8122TVT4800V MSC8122.pdf
MSC8122TVT4800V
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 16B 300MHZ 431FCBGA
Packaging: Bulk
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 300MHz
Supplier Device Package: 431-FCPBGA (20x20)
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AnzahlPreis
2+247.81 EUR
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S9KEAZN16ACLH S9KEA64P64M20SF0.pdf
S9KEAZN16ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 64LQFP
Produkt ist nicht verfügbar
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MC9S08DZ32ACLH557 MC9S08DZ60AD.pdf
MC9S08DZ32ACLH557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Produkt ist nicht verfügbar
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PMZB550UNE315 PMZB550UNE.pdf
PMZB550UNE315
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMZB550UNE SMALL SI
auf Bestellung 338000 Stücke:
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AnzahlPreis
6231+0.08 EUR
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BUK7619-100B,118 BUK7619-100B.pdf
BUK7619-100B,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 64A D2PAK
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 3400 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 200W (Tc)
Rds On (Max) @ Id, Vgs: 19mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Bulk
auf Bestellung 667 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
398+1.27 EUR
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BUK7613-75B118 BUK7613-75B.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK7613-75 - POWER
Produkt ist nicht verfügbar
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NX5DV330DS,112 NX5DV330.pdf
NX5DV330DS,112
Hersteller: NXP USA Inc.
Description: IC VIDEO MUX/DEMUX 1X2 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SSOP
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
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469+1.03 EUR
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MC9RS08KA8CWGR SC9RS08KA2.pdf
MC9RS08KA8CWGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-SOIC
Number of I/O: 14
DigiKey Programmable: Verified
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1000+2.03 EUR
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A5G35H120NT2 A5G35H120N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-PowerLDFN
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
Power - Output: 18W
Gain: 14.1dB
Technology: GaN
Supplier Device Package: 10-DFN (7x10)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 70 mA
Produkt ist nicht verfügbar
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PN7160A1EV/C100K PN7160_PN7161.pdf
PN7160A1EV/C100K
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER I2C VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
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AnzahlPreis
2+13.32 EUR
10+11.55 EUR
25+10.94 EUR
100+10.1 EUR
250+9.59 EUR
500+9.23 EUR
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PN7160B1EV/C100Y PN7160_PN7161.pdf
PN7160B1EV/C100Y
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER SPI VFBGA64
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Produkt ist nicht verfügbar
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PN7161B1EV/C100Y PN7160_PN7161.pdf
PN7161B1EV/C100Y
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER SPI VFBGA64
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Produkt ist nicht verfügbar
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PN7161A1EV/C100Y PN7160_PN7161.pdf
PN7161A1EV/C100Y
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER I2C VFBGA64
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Produkt ist nicht verfügbar
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PN7160A1EV/C100Y PN7160_PN7161.pdf
PN7160A1EV/C100Y
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER I2C VFBGA64
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Produkt ist nicht verfügbar
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MWCT1213VLH
Hersteller: NXP USA Inc.
Description: NEVIS2 64LQFP
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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PMV45EN2215 PMV45EN2.pdf
PMV45EN2215
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Produkt ist nicht verfügbar
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OM13589JP A1006.pdf
OM13589JP
Hersteller: NXP USA Inc.
Description: A1006 DEMONSTRATION KIT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A1006
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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S9S12ZVL16F0WLF
S9S12ZVL16F0WLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Produkt ist nicht verfügbar
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MHT1803B EB212.pdf
MHT1803B
Hersteller: NXP USA Inc.
Description: RF MOSFET TO247
Packaging: Tube
auf Bestellung 574 Stücke:
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1+60.68 EUR
10+49.36 EUR
25+46.54 EUR
240+42.01 EUR
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S9S12P64J0CFT MC9S12P128RMV1.pdf
S9S12P64J0CFT
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+8.68 EUR
10+6.67 EUR
25+6.17 EUR
100+5.72 EUR
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LD6806F/12P,115 LD6806_Series.pdf
LD6806F/12P,115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.2V 200MA 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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2219+0.24 EUR
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74ABT20N,112 74ABT20.pdf
74ABT20N,112
Hersteller: NXP USA Inc.
Description: IC GATE NAND 2CH 4-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 4
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 3.9ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 2
Current - Quiescent (Max): 50 µA
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444+1.12 EUR
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PEMI1QFN/LG,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/LG,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 1
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3806+0.13 EUR
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PEMI1QFN/LE,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/LE,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 11dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 1
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3806+0.13 EUR
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S9S08DV96F2CLF
S9S08DV96F2CLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 48LQFP
Produkt ist nicht verfügbar
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N74F827D,602 74F827_Rev2004.pdf
N74F827D,602
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 24SO
Supplier Device Package: 24-SO
Current - Output High, Low: 24mA, 64mA
Number of Bits per Element: 10
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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452+1.07 EUR
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BZV49-C7V5115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 75V 1W SOT89
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-89
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 1 µA @ 5 V
Produkt ist nicht verfügbar
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BLF988S,112 PHGLS25650-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF PFET, 2-ELEMENT, ULTRA HIGH F
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AnzahlPreis
1+899.94 EUR
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74LVT162245BDGG112 74LVT162245B.pdf
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVT162245BDGG118
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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B4420NSN7QQMD B4420.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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G4860NSN7QUMD
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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B4420NXN7QQMD B4420.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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G4860NXN7QUMD
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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G4860NSE7QUMD Download?colCode=B4860&amp;location=null
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 (1)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
Supplier Device Package: 1020-FCPBGA (33x33)
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Core Processor: PowerPC e6500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 1020-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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G4860NXE7QUMD
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 (1)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
Supplier Device Package: 1020-FCPBGA (33x33)
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Core Processor: PowerPC e6500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 1020-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC845M301JHI33K LPC84x.pdf
LPC845M301JHI33K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
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AnzahlPreis
5+4.21 EUR
10+3.13 EUR
25+2.86 EUR
100+2.57 EUR
250+2.43 EUR
500+2.34 EUR
1000+2.27 EUR
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PSMN5R0-100ES PHGLS23342-1.pdf?t.download=true&u=5oefqw
PSMN5R0-100ES
Hersteller: NXP USA Inc.
Description: ELEMENT, NCHANNEL, SILICON, MOSF
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PSMN5R5-60YS115 PSMN5R5-60YS.pdf
PSMN5R5-60YS115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 100A, 60V, 0.055OHM
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74LVC32245AEC/DG518 74LVC32245A.pdf
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 27271 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
245+2.16 EUR
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MMA6853BKW574 MMA685x.pdf
MMA6853BKW574
Hersteller: NXP USA Inc.
Description: SINGLE-AXIS SPI INERTIAL SENSOR
Part Status: Active
Packaging: Bulk
auf Bestellung 70 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
50+9.76 EUR
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S912XDP512J1VAGR
S912XDP512J1VAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
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74AVC16834ADGV,112 74AVC16834A.pdf
74AVC16834ADGV,112
Hersteller: NXP USA Inc.
Description: IC UNIV BUS DVR 18BIT 56TVSOP
auf Bestellung 1050 Stücke:
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AnzahlPreis
407+1.36 EUR
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BSC9131NJE7HHHB BSC913xNW.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
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BSC9131NLE7HHHB BSC913xNW.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
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BSC9131NSN7KHKB BSC913xNW.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
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BSC9131NXE7KHKB BSC913xNW.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
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MK10DX128VMC7R,518 K10P100M72SF1.pdf
Hersteller: NXP USA Inc.
Description: KINETIS K10: MICROCONTROLLER, FL
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MK10DX128VMC7R518 FSCLS07691-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: KINETIS K10: 72MHZ CORTEX-M4 PER
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MKL81Z128VMC7R KNTSKL8XFS.pdf
MKL81Z128VMC7R
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 85
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKL81Z128VMC7R KNTSKL8XFS.pdf
MKL81Z128VMC7R
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 85
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Cut Tape (CT)
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MCIMX6DP6AVT8AAR IMX6DQPAEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC5534JBD64K LPC553x.pdf
LPC5534JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Produkt ist nicht verfügbar
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LPC5536JBD64K LPC553x.pdf
LPC5536JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU M33 256KB/128KB HTQFP64
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
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MCIMX6X1CVO08ACR IMX6SXIEC.pdf
MCIMX6X1CVO08ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKW35A512VFP4R MKW36A512.pdf
MKW35A512VFP4R
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 5.7mA
Data Rate (Max): 1Mbps
Current - Receiving: 6.3mA
Protocol: Bluetooth v5.0
Power - Output: 5dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -95dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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