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G4860NSE7QUMD NXP USA Inc. Download?colCode=B4860&amp;location=null Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 (1)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
Supplier Device Package: 1020-FCPBGA (33x33)
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Core Processor: PowerPC e6500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 1020-BBGA, FCBGA
Packaging: Tray
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G4860NXE7QUMD NXP USA Inc. Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 (1)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
Supplier Device Package: 1020-FCPBGA (33x33)
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Core Processor: PowerPC e6500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 1020-BBGA, FCBGA
Packaging: Tray
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LPC845M301JHI33K LPC845M301JHI33K NXP USA Inc. LPC84x.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
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100+3.61 EUR
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PSMN5R0-100ES PSMN5R0-100ES NXP USA Inc. PHGLS23342-1.pdf?t.download=true&u=5oefqw Description: ELEMENT, NCHANNEL, SILICON, MOSF
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PSMN5R5-60YS115 PSMN5R5-60YS115 NXP USA Inc. PSMN5R5-60YS.pdf Description: NOW NEXPERIA 100A, 60V, 0.055OHM
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74LVC32245AEC/DG518 NXP USA Inc. 74LVC32245A.pdf Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
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MMA6853BKW574 MMA6853BKW574 NXP USA Inc. MMA685x.pdf Description: SINGLE-AXIS SPI INERTIAL SENSOR
Part Status: Active
Packaging: Bulk
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S912XDP512J1VAGR S912XDP512J1VAGR NXP USA Inc. Description: IC MCU 16BIT 512KB FLASH 144LQFP
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74AVC16834ADGV,112 74AVC16834ADGV,112 NXP USA Inc. 74AVC16834A.pdf Description: IC UNIV BUS DVR 18BIT 56TVSOP
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BSC9131NJE7HHHB NXP USA Inc. BSC913xNW.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
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BSC9131NLE7HHHB NXP USA Inc. BSC913xNW.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
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BSC9131NSN7KHKB NXP USA Inc. BSC913xNW.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
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BSC9131NXE7KHKB NXP USA Inc. BSC913xNW.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
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MK10DX128VMC7R,518 NXP USA Inc. K10P100M72SF1.pdf Description: KINETIS K10: MICROCONTROLLER, FL
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MK10DX128VMC7R518 NXP USA Inc. FSCLS07691-1.pdf?t.download=true&u=5oefqw Description: KINETIS K10: 72MHZ CORTEX-M4 PER
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MKL81Z128VMC7R MKL81Z128VMC7R NXP USA Inc. KNTSKL8XFS.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 85
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tape & Reel (TR)
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MKL81Z128VMC7R MKL81Z128VMC7R NXP USA Inc. KNTSKL8XFS.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 85
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Cut Tape (CT)
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MCIMX6DP6AVT8AAR NXP USA Inc. IMX6DQPAEC.pdf Description: IC MPU I.MX6DP 852MHZ 624FCBGA
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
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LPC5534JBD64K LPC5534JBD64K NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
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LPC5536JBD64K LPC5536JBD64K NXP USA Inc. LPC553x.pdf Description: IC MCU M33 256KB/128KB HTQFP64
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MCIMX6X1CVO08ACR MCIMX6X1CVO08ACR NXP USA Inc. IMX6SXIEC.pdf Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
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MKW35A512VFP4R MKW35A512VFP4R NXP USA Inc. MKW36A512.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 5.7mA
Data Rate (Max): 1Mbps
Current - Receiving: 6.3mA
Protocol: Bluetooth v5.0
Power - Output: 5dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -95dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
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MFS8623BMDA0ES MFS8623BMDA0ES NXP USA Inc. FS8600_SDS.pdf Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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IP4251CZ12-6,118 IP4251CZ12-6,118 NXP USA Inc. IP4251%2C52%2C53%2C54-TTL.pdf Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN Exposed Pad
Size / Dimension: 0.098" L x 0.053" W (2.50mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 10pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
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IP3048CX5,135 NXP USA Inc. Description: FILTER LC(PI) 3NH/190PF ESD SMD
Packaging: Bulk
Package / Case: 5-WFBGA, WLCSP
Size / Dimension: 0.059" L x 0.045" W (1.51mm x 1.14mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 3nH (Total), C = 190pF (Total)
Height: 0.027" (0.69mm)
Attenuation Value: 35dB @ 800MHz ~ 2GHz
Filter Order: 3rd
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Resistance - Channel (Ohms): 0.25
ESD Protection: Yes
Number of Channels: 2
Current: 625 mA
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IP4059CX5/LF,135 IP4059CX5/LF,135 NXP USA Inc. IP4059CX5.pdf Description: TVS DIODE 5.5VWM 5CSP
Packaging: Tape & Reel (TR)
Package / Case: 5-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Ethernet, USB OTG
Capacitance @ Frequency: 3pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 5-CSP (1.33x0.96)
Unidirectional Channels: 3
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
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IP4350CX24/LF,135 NXP USA Inc. IP4350CX24.pdf Description: TVS DIODE 24WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 24-WFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -35°C ~ 85°C (TA)
Applications: Multimedia Card Interface
Supplier Device Package: 24-WLCSP (1.95x2.11)
Unidirectional Channels: 9
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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IP4772CZ16,118 IP4772CZ16,118 NXP USA Inc. Description: IC VIDEO SGNL COND 16SSOP
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IP4772CZ16,118 IP4772CZ16,118 NXP USA Inc. Description: IC VIDEO SGNL COND 16SSOP
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IP4769CZ14,118 IP4769CZ14,118 NXP USA Inc. DiscreteSemiconductors.pdf Description: IC VGA TXRX/DDC LEV SHIF 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
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SPC5746RK1MLU3 SPC5746RK1MLU3 NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 176LQFP
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Grade: Automotive
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
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MCIMX6U5DVM10ADR MCIMX6U5DVM10ADR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Cut Tape (CT)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
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MCIMX6QP4AVT8AA NXP USA Inc. PHGL-S-A0006655098-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6QP 852MHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
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MCIMX6DP6AVT1ABR MCIMX6DP6AVT1ABR NXP USA Inc. IMX6DQPAEC.pdf Description: IC MPU I.MX6DP 1GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
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MCIMX6DP6AVT1ABR MCIMX6DP6AVT1ABR NXP USA Inc. IMX6DQPAEC.pdf Description: IC MPU I.MX6DP 1GHZ 624FCBGA
Packaging: Cut Tape (CT)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
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S9S08SC4E0CTG S9S08SC4E0CTG NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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MK51DN512CLQ10 MK51DN512CLQ10 NXP USA Inc. K51P144M100SF2V2.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 41x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Package / Case: 144-LQFP
Packaging: Tray
Speed: 100MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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MRF24300NR3 MRF24300NR3 NXP USA Inc. Description: RF MOSFET LDMOS 32V OM780-2
Current - Test: 100 mA
Voltage - Test: 32 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: OM-780-2
Technology: LDMOS
Gain: 13.1dB
Power - Output: 330W
Frequency: 2.45GHz
Mounting Type: Surface Mount
Package / Case: OM-780-2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MRF24300NR3 MRF24300NR3 NXP USA Inc. Description: RF MOSFET LDMOS 32V OM780-2
Technology: LDMOS
Gain: 13.1dB
Power - Output: 330W
Frequency: 2.45GHz
Mounting Type: Surface Mount
Package / Case: OM-780-2
Packaging: Cut Tape (CT)
Current - Test: 100 mA
Voltage - Test: 32 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: OM-780-2
Produkt ist nicht verfügbar
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BLL6H1214L-250,112 NXP USA Inc. Description: TRANS L-BAND RADAR LDMOS SOT502A
Packaging: Tube
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SPC5604BK0CLQ6R SPC5604BK0CLQ6R NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
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SPC5604BK0CLQ6 SPC5604BK0CLQ6 NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12D64CPVE,557 NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 112LQFP
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: PWM, WDT
Connectivity: CANbus, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: HCS12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12D64VFUE MC9S12D64VFUE NXP USA Inc. MC9S12DJ64%20Guide.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: HCS12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
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MC9S12D64MPVE MC9S12D64MPVE NXP USA Inc. MC9S12DP256.pdf Description: IC MCU 16BIT 64KB FLASH 112LQFP
DigiKey Programmable: Verified
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: HCS12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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RD-UAMP-SENSOR RD-UAMP-SENSOR NXP USA Inc. UM11470.pdf Description: SUB-A CURRENT SENSOR BOARD
Part Status: Active
Sensing Range: 60nA ~ 5mA
Embedded: Yes, MCU
Supplied Contents: Board(s)
Sensor Type: Current Sensor
Voltage - Supply: 3.3V
Interface: I2C
Packaging: Bulk
Contents: Board(s)
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MRF6V12500HR5 MRF6V12500HR5 NXP USA Inc. MRF6V12500H.pdf Description: RF MOSFET LDMOS 50V NI780
Current - Test: 200 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Active
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 19.7dB
Power - Output: 500W
Frequency: 1.03GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Cut Tape (CT)
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BZX84-C3V9/LF1R BZX84-C3V9/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 3.9V 250MW TO236AB
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 3.9 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA9539BSHP PCA9539BSHP NXP USA Inc. PCA9539_PCA9539R.pdf Description: IC XPNDR 400KHZ I2C 24HVQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 50mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC852TVR80A MPC852TVR80A NXP USA Inc. MPC852T.pdf Description: IC MPU MPC8XX 80MHZ 256BGA
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Produkt ist nicht verfügbar
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MPC860SRZQ50D4 MPC860SRZQ50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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TDA8542TS/N1,112 TDA8542TS/N1,112 NXP USA Inc. TDA8542TS.pdf Description: IC AMP CLASS AB STER 1.2W 20SSOP
Part Status: Obsolete
Supplier Device Package: 20-SSOP
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 2-Channel (Stereo)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Produkt ist nicht verfügbar
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TDA8547TS/N1/02,11 TDA8547TS/N1/02,11 NXP USA Inc. TDA8547TS.pdf Description: IC AMP CLASS AB STER 1.2W 20SSOP
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Features: Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Supplier Device Package: 20-SSOP
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 2-Channel (Stereo)
Produkt ist nicht verfügbar
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74HC670D,652 74HC670D,652 NXP USA Inc. 74HC%28T%29670.pdf Description: IC REGISTER FILE 1 X 1:1 16-SO
Part Status: Obsolete
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Independent Circuits: 4
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Register File
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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74HC670D,653 74HC670D,653 NXP USA Inc. 74HC%28T%29670.pdf Description: IC REGISTER FILE 1 X 1:1 16-SO
Part Status: Obsolete
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Independent Circuits: 4
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Register File
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IP3253CZ8-4-TTL,132 IP3253CZ8-4-TTL,132 NXP USA Inc. NEXP-S-A0002882664-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA CONSUMER CIRCUIT
Packaging: Bulk
Produkt ist nicht verfügbar
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IP3253CZ8-4-TTL132 IP3253CZ8-4-TTL132 NXP USA Inc. Description: Nexperia IP3253CZ8-4-TT - 4-chan
Packaging: Bulk
Produkt ist nicht verfügbar
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MC9S12B64CFUE-NXP MC9S12B64CFUE-NXP NXP USA Inc. FSCL-S-A0000335998-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16BIT 64KB FLASH 80QFP
Produkt ist nicht verfügbar
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MC908AP32ACFBE MC908AP32ACFBE NXP USA Inc. MC68HC908AP64A.pdf Description: IC MCU 8BIT 32KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Not For New Designs
Supplier Device Package: 44-QFP (10x10)
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Peripherals: LED, LVD, POR, PWM
Connectivity: I2C, IRSCI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Produkt ist nicht verfügbar
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MC908AP32CFAER MC908AP32CFAER NXP USA Inc. MC68HC908AP64.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LED, LVD, POR, PWM
Connectivity: I2C, IRSCI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Produkt ist nicht verfügbar
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G4860NSE7QUMD Download?colCode=B4860&amp;location=null
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 (1)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
Supplier Device Package: 1020-FCPBGA (33x33)
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Core Processor: PowerPC e6500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 1020-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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G4860NXE7QUMD
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 (1)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
Supplier Device Package: 1020-FCPBGA (33x33)
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Core Processor: PowerPC e6500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 1020-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC845M301JHI33K LPC84x.pdf
LPC845M301JHI33K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
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4+5.84 EUR
10+4.37 EUR
25+4.01 EUR
100+3.61 EUR
250+3.4 EUR
500+3.3 EUR
1000+3.2 EUR
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PSMN5R0-100ES PHGLS23342-1.pdf?t.download=true&u=5oefqw
PSMN5R0-100ES
Hersteller: NXP USA Inc.
Description: ELEMENT, NCHANNEL, SILICON, MOSF
Produkt ist nicht verfügbar
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PSMN5R5-60YS115 PSMN5R5-60YS.pdf
PSMN5R5-60YS115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 100A, 60V, 0.055OHM
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74LVC32245AEC/DG518 74LVC32245A.pdf
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
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MMA6853BKW574 MMA685x.pdf
MMA6853BKW574
Hersteller: NXP USA Inc.
Description: SINGLE-AXIS SPI INERTIAL SENSOR
Part Status: Active
Packaging: Bulk
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S912XDP512J1VAGR
S912XDP512J1VAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
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74AVC16834ADGV,112 74AVC16834A.pdf
74AVC16834ADGV,112
Hersteller: NXP USA Inc.
Description: IC UNIV BUS DVR 18BIT 56TVSOP
auf Bestellung 1050 Stücke:
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BSC9131NJE7HHHB BSC913xNW.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
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BSC9131NLE7HHHB BSC913xNW.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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BSC9131NSN7KHKB BSC913xNW.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Produkt ist nicht verfügbar
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BSC9131NXE7KHKB BSC913xNW.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Produkt ist nicht verfügbar
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MK10DX128VMC7R,518 K10P100M72SF1.pdf
Hersteller: NXP USA Inc.
Description: KINETIS K10: MICROCONTROLLER, FL
Produkt ist nicht verfügbar
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MK10DX128VMC7R518 FSCLS07691-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: KINETIS K10: 72MHZ CORTEX-M4 PER
Produkt ist nicht verfügbar
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MKL81Z128VMC7R KNTSKL8XFS.pdf
MKL81Z128VMC7R
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 85
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKL81Z128VMC7R KNTSKL8XFS.pdf
MKL81Z128VMC7R
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 85
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MCIMX6DP6AVT8AAR IMX6DQPAEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC5534JBD64K LPC553x.pdf
LPC5534JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Produkt ist nicht verfügbar
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LPC5536JBD64K LPC553x.pdf
LPC5536JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU M33 256KB/128KB HTQFP64
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
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MCIMX6X1CVO08ACR IMX6SXIEC.pdf
MCIMX6X1CVO08ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKW35A512VFP4R MKW36A512.pdf
MKW35A512VFP4R
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 5.7mA
Data Rate (Max): 1Mbps
Current - Receiving: 6.3mA
Protocol: Bluetooth v5.0
Power - Output: 5dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -95dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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MFS8623BMDA0ES FS8600_SDS.pdf
MFS8623BMDA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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IP4251CZ12-6,118 IP4251%2C52%2C53%2C54-TTL.pdf
IP4251CZ12-6,118
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN Exposed Pad
Size / Dimension: 0.098" L x 0.053" W (2.50mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 10pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
Produkt ist nicht verfügbar
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IP3048CX5,135
Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 3NH/190PF ESD SMD
Packaging: Bulk
Package / Case: 5-WFBGA, WLCSP
Size / Dimension: 0.059" L x 0.045" W (1.51mm x 1.14mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 3nH (Total), C = 190pF (Total)
Height: 0.027" (0.69mm)
Attenuation Value: 35dB @ 800MHz ~ 2GHz
Filter Order: 3rd
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Resistance - Channel (Ohms): 0.25
ESD Protection: Yes
Number of Channels: 2
Current: 625 mA
auf Bestellung 100733 Stücke:
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1567+0.36 EUR
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IP4059CX5/LF,135 IP4059CX5.pdf
IP4059CX5/LF,135
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 5CSP
Packaging: Tape & Reel (TR)
Package / Case: 5-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Ethernet, USB OTG
Capacitance @ Frequency: 3pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 5-CSP (1.33x0.96)
Unidirectional Channels: 3
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Produkt ist nicht verfügbar
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IP4350CX24/LF,135 IP4350CX24.pdf
Hersteller: NXP USA Inc.
Description: TVS DIODE 24WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 24-WFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -35°C ~ 85°C (TA)
Applications: Multimedia Card Interface
Supplier Device Package: 24-WLCSP (1.95x2.11)
Unidirectional Channels: 9
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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IP4772CZ16,118
IP4772CZ16,118
Hersteller: NXP USA Inc.
Description: IC VIDEO SGNL COND 16SSOP
Produkt ist nicht verfügbar
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IP4772CZ16,118
IP4772CZ16,118
Hersteller: NXP USA Inc.
Description: IC VIDEO SGNL COND 16SSOP
auf Bestellung 395224 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
656+1 EUR
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IP4769CZ14,118 DiscreteSemiconductors.pdf
IP4769CZ14,118
Hersteller: NXP USA Inc.
Description: IC VGA TXRX/DDC LEV SHIF 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
auf Bestellung 2500 Stücke:
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AnzahlPrivatkunde
1902+0.31 EUR
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SPC5746RK1MLU3
SPC5746RK1MLU3
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Grade: Automotive
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX6U5DVM10ADR IMX6SDLCEC.pdf
MCIMX6U5DVM10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Cut Tape (CT)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Produkt ist nicht verfügbar
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MCIMX6QP4AVT8AA PHGL-S-A0006655098-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 852MHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 60 Stücke:
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AnzahlPrivatkunde
4+149.4 EUR
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MCIMX6DP6AVT1ABR IMX6DQPAEC.pdf
MCIMX6DP6AVT1ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 500 Stücke:
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AnzahlPrivatkunde
500+156.51 EUR
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MCIMX6DP6AVT1ABR IMX6DQPAEC.pdf
MCIMX6DP6AVT1ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1GHZ 624FCBGA
Packaging: Cut Tape (CT)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+211.37 EUR
10+177.39 EUR
25+168.91 EUR
100+159.59 EUR
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S9S08SC4E0CTG
S9S08SC4E0CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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4+5.37 EUR
10+4.18 EUR
96+3.43 EUR
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MK51DN512CLQ10 K51P144M100SF2V2.pdf
MK51DN512CLQ10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 41x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Package / Case: 144-LQFP
Packaging: Tray
Speed: 100MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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MRF24300NR3
MRF24300NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 32V OM780-2
Current - Test: 100 mA
Voltage - Test: 32 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: OM-780-2
Technology: LDMOS
Gain: 13.1dB
Power - Output: 330W
Frequency: 2.45GHz
Mounting Type: Surface Mount
Package / Case: OM-780-2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MRF24300NR3
MRF24300NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 32V OM780-2
Technology: LDMOS
Gain: 13.1dB
Power - Output: 330W
Frequency: 2.45GHz
Mounting Type: Surface Mount
Package / Case: OM-780-2
Packaging: Cut Tape (CT)
Current - Test: 100 mA
Voltage - Test: 32 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: OM-780-2
Produkt ist nicht verfügbar
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BLL6H1214L-250,112
Hersteller: NXP USA Inc.
Description: TRANS L-BAND RADAR LDMOS SOT502A
Packaging: Tube
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SPC5604BK0CLQ6R
SPC5604BK0CLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
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SPC5604BK0CLQ6 MPC5602D.pdf
SPC5604BK0CLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12D64CPVE,557
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: PWM, WDT
Connectivity: CANbus, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: HCS12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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MC9S12D64VFUE MC9S12DJ64%20Guide.pdf
MC9S12D64VFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: HCS12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12D64MPVE MC9S12DP256.pdf
MC9S12D64MPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
DigiKey Programmable: Verified
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: HCS12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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RD-UAMP-SENSOR UM11470.pdf
RD-UAMP-SENSOR
Hersteller: NXP USA Inc.
Description: SUB-A CURRENT SENSOR BOARD
Part Status: Active
Sensing Range: 60nA ~ 5mA
Embedded: Yes, MCU
Supplied Contents: Board(s)
Sensor Type: Current Sensor
Voltage - Supply: 3.3V
Interface: I2C
Packaging: Bulk
Contents: Board(s)
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MRF6V12500HR5 MRF6V12500H.pdf
MRF6V12500HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Current - Test: 200 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Active
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 19.7dB
Power - Output: 500W
Frequency: 1.03GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Cut Tape (CT)
auf Bestellung 201 Stücke:
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1+1254.76 EUR
10+1171.32 EUR
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BZX84-C3V9/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C3V9/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.9V 250MW TO236AB
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 3.9 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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PCA9539BSHP PCA9539_PCA9539R.pdf
PCA9539BSHP
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24HVQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 50mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC852TVR80A MPC852T.pdf
MPC852TVR80A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
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MPC860SRZQ50D4 MPC860EC.pdf
MPC860SRZQ50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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TDA8542TS/N1,112 TDA8542TS.pdf
TDA8542TS/N1,112
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 1.2W 20SSOP
Part Status: Obsolete
Supplier Device Package: 20-SSOP
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 2-Channel (Stereo)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Produkt ist nicht verfügbar
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TDA8547TS/N1/02,11 TDA8547TS.pdf
TDA8547TS/N1/02,11
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 1.2W 20SSOP
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Features: Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Supplier Device Package: 20-SSOP
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 2-Channel (Stereo)
Produkt ist nicht verfügbar
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74HC670D,652 74HC%28T%29670.pdf
74HC670D,652
Hersteller: NXP USA Inc.
Description: IC REGISTER FILE 1 X 1:1 16-SO
Part Status: Obsolete
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Independent Circuits: 4
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Register File
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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74HC670D,653 74HC%28T%29670.pdf
74HC670D,653
Hersteller: NXP USA Inc.
Description: IC REGISTER FILE 1 X 1:1 16-SO
Part Status: Obsolete
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Independent Circuits: 4
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Register File
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IP3253CZ8-4-TTL,132 NEXP-S-A0002882664-1.pdf?t.download=true&u=5oefqw
IP3253CZ8-4-TTL,132
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA CONSUMER CIRCUIT
Packaging: Bulk
Produkt ist nicht verfügbar
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IP3253CZ8-4-TTL132
IP3253CZ8-4-TTL132
Hersteller: NXP USA Inc.
Description: Nexperia IP3253CZ8-4-TT - 4-chan
Packaging: Bulk
Produkt ist nicht verfügbar
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MC9S12B64CFUE-NXP FSCL-S-A0000335998-1.pdf?t.download=true&u=5oefqw
MC9S12B64CFUE-NXP
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Produkt ist nicht verfügbar
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MC908AP32ACFBE MC68HC908AP64A.pdf
MC908AP32ACFBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Not For New Designs
Supplier Device Package: 44-QFP (10x10)
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Peripherals: LED, LVD, POR, PWM
Connectivity: I2C, IRSCI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Produkt ist nicht verfügbar
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MC908AP32CFAER MC68HC908AP64.pdf
MC908AP32CFAER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LED, LVD, POR, PWM
Connectivity: I2C, IRSCI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Produkt ist nicht verfügbar
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