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SPC5603BK0VLH4R SPC5603BK0VLH4R NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IMXRT600-AUD-EVK IMXRT600-AUD-EVK NXP USA Inc. PdfFile_113041.pdf Description: I.MX RT685 AUDIO EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT685
Part Status: Active
auf Bestellung 1 Stücke:
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1+302.68 EUR
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74ALVCH16827DGGS 74ALVCH16827DGGS NXP USA Inc. 74ALVCH16827.pdf Description: IC BUF NON-INVERT 3.6V 56TSSOP
auf Bestellung 2605 Stücke:
Lieferzeit 10-14 Tag (e)
402+1.27 EUR
Mindestbestellmenge: 402
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PCF1252-4T/F4,112 PCF1252-4T/F4,112 NXP USA Inc. PCF1252-X_Family.pdf Description: IC SUPERVISOR 1 CHANNEL 8SO
Produkt ist nicht verfügbar
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BGU7258115 NXP USA Inc. PHGL-S-A0006118242-1.pdf?t.download=true&u=5oefqw Description: IC AMP ISM 4.9GHZ-5.925GHZ 6DFN
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 4.9GHz ~ 5.925GHz
RF Type: ISM
Voltage - Supply: 3V ~ 3.6V
Gain: 15dB
Current - Supply: 13mA
Noise Figure: 1.6dB
P1dB: -4dBm
Test Frequency: 5.5GHz
Supplier Device Package: DFN1616-6
Produkt ist nicht verfügbar
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SPC5644BAMLU8 SPC5644BAMLU8 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384BCALR S912XEQ384BCALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384BCAL S912XEQ384BCAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG384AVAL S912XEG384AVAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BAMLU8R SPC5644BAMLU8R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BAMLU1R SPC5644BAMLU1R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMDS36254HT1 MMDS36254HT1 NXP USA Inc. MMDS36254H.pdf Description: ADAM - ADVANCED DOHERTY ALIGNMEN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Advanced Doherty Alignment Module
Frequency: 3.4GHz ~ 3.8GHz
RF Type: General Purpose
Supplier Device Package: 32-QFN (6x6)
Produkt ist nicht verfügbar
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74ALVC16245DL,112-NXP 74ALVC16245DL,112-NXP NXP USA Inc. Description: IC TXRX NON-INVERT 3.6V 48SSOP
Produkt ist nicht verfügbar
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PCAL6534EV-ARD PCAL6534EV-ARD NXP USA Inc. UM11712.pdf Description: 34-BIT GPIO ARDUINO SHIELD
Packaging: Bulk
Function: I/O Expansion
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6534
Platform: Arduino
Part Status: Active
auf Bestellung 5 Stücke:
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1+201.08 EUR
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OM-A5000ARD OM-A5000ARD NXP USA Inc. Description: A5000 ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A5000
Platform: Arduino
auf Bestellung 2 Stücke:
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1+127.67 EUR
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S9KEAZ128ACLHR S9KEAZ128ACLHR NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEP100BMAGR S912XEP100BMAGR NXP USA Inc. Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12G96AVLHR S9S12G96AVLHR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 64LQFP
Produkt ist nicht verfügbar
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S912ZVC64F0VLFR S912ZVC64F0VLFR NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTVS60VP1UTP,115 PTVS60VP1UTP,115 NXP USA Inc. PTVSXP1UTP_SER.pdf Description: TVS DIODE 60VWM 96.8VC CFP5
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 185°C (TA)
Applications: Automotive
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: SOD-128/CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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PTVS64VP1UTP115 PTVS64VP1UTP115 NXP USA Inc. PTVSXP1UTP_SER.pdf Description: NOW NEXPERIA PTVS64VP1UTP TRANS
Produkt ist nicht verfügbar
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PTVS60VP1UTP115 PTVS60VP1UTP115 NXP USA Inc. PTVSXP1UTP_SER.pdf Description: NOW NEXPERIA PTVS60VP1UTP - TRAN
Produkt ist nicht verfügbar
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PCA8553DTT/AJ PCA8553DTT/AJ NXP USA Inc. PCA8553.pdf Description: IC DRVR 160 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 160 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Part Status: Obsolete
Current - Supply: 1.8 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCA8553DTT/AJ PCA8553DTT/AJ NXP USA Inc. PCA8553.pdf Description: IC DRVR 160 SEGMENT 56TSSOP
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 160 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Part Status: Obsolete
Current - Supply: 1.8 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LPC2290FBD144/01551 LPC2290FBD144/01551 NXP USA Inc. PHGLS14515-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
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MC34PF8100F3EPR2 MC34PF8100F3EPR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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K32W041K K32W041K NXP USA Inc. K32W061.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.94 EUR
10+8.62 EUR
25+8.16 EUR
100+7.53 EUR
250+7.15 EUR
500+6.88 EUR
2450+6.32 EUR
Mindestbestellmenge: 2
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A2T18H160-24SR3 NXP USA Inc. A2T18H160-24S.pdf Description: RF MOSFET LDMOS DL 28V NI780S
auf Bestellung 430 Stücke:
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3+191.53 EUR
Mindestbestellmenge: 3
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M68LC302CAF20VCT M68LC302CAF20VCT NXP USA Inc. MC68LC302.pdf Description: IC MPU M683XX 20MHZ 100LQFP
auf Bestellung 140 Stücke:
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6+94.95 EUR
Mindestbestellmenge: 6
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S912XEG384F1VAG,557 NXP USA Inc. Description: MICROCONTROLLER, 16 BIT, HCS12 C
Produkt ist nicht verfügbar
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SP03160-01UL NXP USA Inc. Description: SP03160-01
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA19363
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MC9S12XEQ384CAL MC9S12XEQ384CAL NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
auf Bestellung 309 Stücke:
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1+41.92 EUR
10+33.62 EUR
80+28.71 EUR
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S912XEQ384AMAL S912XEQ384AMAL NXP USA Inc. Description: 16-BIT MCU, S12X CORE, 384KB FLA
Produkt ist nicht verfügbar
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S912XEQ384F1MAGR S912XEQ384F1MAGR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384BCAG S912XEQ384BCAG NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384BCAGR S912XEQ384BCAGR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384J3VALR S912XEQ384J3VALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384F1MAL S912XEQ384F1MAL NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
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S912XEQ384BCAAR S912XEQ384BCAAR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384BVAA S912XEQ384BVAA NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384ACAL S912XEQ384ACAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
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S912XEQ384ACALR S912XEQ384ACALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
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S912XEQ384BVAAR S912XEQ384BVAAR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 80QFP
Produkt ist nicht verfügbar
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S912XEQ384BMAAR S912XEQ384BMAAR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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QN9021/D518 QN9021/D518 NXP USA Inc. QN902X.pdf Description: ULTRA LOW POWER BLUETOOTH LE SYS
auf Bestellung 14000 Stücke:
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125+3.96 EUR
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QN9022/D518 QN9022/D518 NXP USA Inc. NEXP-S-A0003116189-1.pdf?t.download=true&u=5oefqw Description: ULTRA LOW POWER BLUETOOTH LE SYS
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QN9021/D QN9021/D NXP USA Inc. QN902X.pdf Description: ULTRA LOW POWER BLUETOOTH LE SOC
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QN9021/EY QN9021/EY NXP USA Inc. QN902X.pdf Description: ULTRA LOW POWER BLUETOOTH LE SYS
Produkt ist nicht verfügbar
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SPC5607BK0VLQ6 SPC5607BK0VLQ6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5607BK0VLQ6R SPC5607BK0VLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MWCT1011BVLH557 MWCT1011BVLH557 NXP USA Inc. PHGL-S-A0008141776-1.pdf?t.download=true&u=5oefqw Description: WIRELESS CHARGING IC
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LD6805K/25P,115 LD6805K/25P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 2.5V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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FXTH8718116T1 NXP USA Inc. Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
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A7005CGHN1/T1AGBEL A7005CGHN1/T1AGBEL NXP USA Inc. Description: A7005 - SECURE AUTHENTICATION MI
Produkt ist nicht verfügbar
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74LV86BQ,115 74LV86BQ,115 NXP USA Inc. 74LV86_Rev3_2017.pdf Description: IC GATE XOR 4CH 2-INP 14DHVQFN
Packaging: Bulk
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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S912ZVC64F0MKHR S912ZVC64F0MKHR NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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X3G-OH047,005 NXP USA Inc. X3G_T_OH047_048.pdf Description: IC MAGN FIELD SENSOR DBL DIE
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LPC1768FBD100 NXP USA Inc. Description: ARM CORTEX-M3 SERIES MICROCONTRO
Produkt ist nicht verfügbar
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PDTC144VT215 PDTC144VT215 NXP USA Inc. PDTC144V_SER.pdf Description: NOW NEXPERIA PDTC144VT - SMALL S
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCF8578T/1,118 PCF8578T/1,118 NXP USA Inc. PCF8578.pdf Description: IC DRVR DOT MATRIX 56VSOP
Produkt ist nicht verfügbar
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SPC5603BK0VLH4R
SPC5603BK0VLH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IMXRT600-AUD-EVK PdfFile_113041.pdf
IMXRT600-AUD-EVK
Hersteller: NXP USA Inc.
Description: I.MX RT685 AUDIO EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT685
Part Status: Active
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74ALVCH16827DGGS 74ALVCH16827.pdf
74ALVCH16827DGGS
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 56TSSOP
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PCF1252-4T/F4,112 PCF1252-X_Family.pdf
PCF1252-4T/F4,112
Hersteller: NXP USA Inc.
Description: IC SUPERVISOR 1 CHANNEL 8SO
Produkt ist nicht verfügbar
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BGU7258115 PHGL-S-A0006118242-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC AMP ISM 4.9GHZ-5.925GHZ 6DFN
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 4.9GHz ~ 5.925GHz
RF Type: ISM
Voltage - Supply: 3V ~ 3.6V
Gain: 15dB
Current - Supply: 13mA
Noise Figure: 1.6dB
P1dB: -4dBm
Test Frequency: 5.5GHz
Supplier Device Package: DFN1616-6
Produkt ist nicht verfügbar
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SPC5644BAMLU8
SPC5644BAMLU8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384BCALR
S912XEQ384BCALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384BCAL
S912XEQ384BCAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG384AVAL
S912XEG384AVAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BAMLU8R
SPC5644BAMLU8R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BAMLU1R
SPC5644BAMLU1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMDS36254HT1 MMDS36254H.pdf
MMDS36254HT1
Hersteller: NXP USA Inc.
Description: ADAM - ADVANCED DOHERTY ALIGNMEN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Advanced Doherty Alignment Module
Frequency: 3.4GHz ~ 3.8GHz
RF Type: General Purpose
Supplier Device Package: 32-QFN (6x6)
Produkt ist nicht verfügbar
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74ALVC16245DL,112-NXP
74ALVC16245DL,112-NXP
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 48SSOP
Produkt ist nicht verfügbar
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PCAL6534EV-ARD UM11712.pdf
PCAL6534EV-ARD
Hersteller: NXP USA Inc.
Description: 34-BIT GPIO ARDUINO SHIELD
Packaging: Bulk
Function: I/O Expansion
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6534
Platform: Arduino
Part Status: Active
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1+201.08 EUR
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OM-A5000ARD
OM-A5000ARD
Hersteller: NXP USA Inc.
Description: A5000 ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A5000
Platform: Arduino
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S9KEAZ128ACLHR S9KEA128P80M48SF0.pdf
S9KEAZ128ACLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEP100BMAGR
S912XEP100BMAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12G96AVLHR
S9S12G96AVLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Produkt ist nicht verfügbar
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S912ZVC64F0VLFR S12ZVCFS.pdf
S912ZVC64F0VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTVS60VP1UTP,115 PTVSXP1UTP_SER.pdf
PTVS60VP1UTP,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 60VWM 96.8VC CFP5
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 185°C (TA)
Applications: Automotive
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: SOD-128/CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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PTVS64VP1UTP115 PTVSXP1UTP_SER.pdf
PTVS64VP1UTP115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PTVS64VP1UTP TRANS
Produkt ist nicht verfügbar
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PTVS60VP1UTP115 PTVSXP1UTP_SER.pdf
PTVS60VP1UTP115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PTVS60VP1UTP - TRAN
Produkt ist nicht verfügbar
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PCA8553DTT/AJ PCA8553.pdf
PCA8553DTT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 160 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 160 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Part Status: Obsolete
Current - Supply: 1.8 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCA8553DTT/AJ PCA8553.pdf
PCA8553DTT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 160 SEGMENT 56TSSOP
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 160 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Part Status: Obsolete
Current - Supply: 1.8 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LPC2290FBD144/01551 PHGLS14515-1.pdf?t.download=true&u=5oefqw
LPC2290FBD144/01551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
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MC34PF8100F3EPR2 PF8100_PF8200.pdf
MC34PF8100F3EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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K32W041K K32W061.pdf
K32W041K
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.94 EUR
10+8.62 EUR
25+8.16 EUR
100+7.53 EUR
250+7.15 EUR
500+6.88 EUR
2450+6.32 EUR
Mindestbestellmenge: 2
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A2T18H160-24SR3 A2T18H160-24S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS DL 28V NI780S
auf Bestellung 430 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+191.53 EUR
Mindestbestellmenge: 3
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M68LC302CAF20VCT MC68LC302.pdf
M68LC302CAF20VCT
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 100LQFP
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+94.95 EUR
Mindestbestellmenge: 6
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S912XEG384F1VAG,557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16 BIT, HCS12 C
Produkt ist nicht verfügbar
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SP03160-01UL
Hersteller: NXP USA Inc.
Description: SP03160-01
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA19363
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MC9S12XEQ384CAL MC9S12XEP100RMV1.pdf
MC9S12XEQ384CAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
auf Bestellung 309 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+41.92 EUR
10+33.62 EUR
80+28.71 EUR
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S912XEQ384AMAL
S912XEQ384AMAL
Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12X CORE, 384KB FLA
Produkt ist nicht verfügbar
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S912XEQ384F1MAGR MC9S12XEPB.pdf
S912XEQ384F1MAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384BCAG
S912XEQ384BCAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384BCAGR
S912XEQ384BCAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384J3VALR MC9S12XEPB.pdf
S912XEQ384J3VALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384F1MAL MC9S12XEPB.pdf
S912XEQ384F1MAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
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S912XEQ384BCAAR
S912XEQ384BCAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384BVAA MC9S12XEPB.pdf
S912XEQ384BVAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384ACAL
S912XEQ384ACAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
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S912XEQ384ACALR
S912XEQ384ACALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
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S912XEQ384BVAAR MC9S12XEPB.pdf
S912XEQ384BVAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Produkt ist nicht verfügbar
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S912XEQ384BMAAR
S912XEQ384BMAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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QN9021/D518 QN902X.pdf
QN9021/D518
Hersteller: NXP USA Inc.
Description: ULTRA LOW POWER BLUETOOTH LE SYS
auf Bestellung 14000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
125+3.96 EUR
Mindestbestellmenge: 125
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QN9022/D518 NEXP-S-A0003116189-1.pdf?t.download=true&u=5oefqw
QN9022/D518
Hersteller: NXP USA Inc.
Description: ULTRA LOW POWER BLUETOOTH LE SYS
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
138+3.58 EUR
Mindestbestellmenge: 138
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QN9021/D QN902X.pdf
QN9021/D
Hersteller: NXP USA Inc.
Description: ULTRA LOW POWER BLUETOOTH LE SOC
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
125+3.96 EUR
Mindestbestellmenge: 125
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QN9021/EY QN902X.pdf
QN9021/EY
Hersteller: NXP USA Inc.
Description: ULTRA LOW POWER BLUETOOTH LE SYS
Produkt ist nicht verfügbar
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SPC5607BK0VLQ6 MPC560XBFAMFS.pdf
SPC5607BK0VLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5607BK0VLQ6R MPC560XBFAMFS.pdf
SPC5607BK0VLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MWCT1011BVLH557 PHGL-S-A0008141776-1.pdf?t.download=true&u=5oefqw
MWCT1011BVLH557
Hersteller: NXP USA Inc.
Description: WIRELESS CHARGING IC
auf Bestellung 99900 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
48+11.56 EUR
Mindestbestellmenge: 48
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LD6805K/25P,115 LD6805.pdf
LD6805K/25P,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.5V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 50000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2959+0.16 EUR
Mindestbestellmenge: 2959
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FXTH8718116T1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
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A7005CGHN1/T1AGBEL
A7005CGHN1/T1AGBEL
Hersteller: NXP USA Inc.
Description: A7005 - SECURE AUTHENTICATION MI
Produkt ist nicht verfügbar
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74LV86BQ,115 74LV86_Rev3_2017.pdf
74LV86BQ,115
Hersteller: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14DHVQFN
Packaging: Bulk
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
auf Bestellung 3300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2219+0.23 EUR
Mindestbestellmenge: 2219
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S912ZVC64F0MKHR S12ZVCFS.pdf
S912ZVC64F0MKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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X3G-OH047,005 X3G_T_OH047_048.pdf
Hersteller: NXP USA Inc.
Description: IC MAGN FIELD SENSOR DBL DIE
auf Bestellung 78742 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
307+1.61 EUR
Mindestbestellmenge: 307
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LPC1768FBD100
Hersteller: NXP USA Inc.
Description: ARM CORTEX-M3 SERIES MICROCONTRO
Produkt ist nicht verfügbar
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PDTC144VT215 PDTC144V_SER.pdf
PDTC144VT215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTC144VT - SMALL S
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCF8578T/1,118 PCF8578.pdf
PCF8578T/1,118
Hersteller: NXP USA Inc.
Description: IC DRVR DOT MATRIX 56VSOP
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