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74AHCT2G126GD,125 74AHCT2G126GD,125 NXP USA Inc. PHGLS27955-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 5.5V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
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74AHCT2G241DP125 NXP USA Inc. 74AHC_AHCT2G241.pdf Description: IC BUFFER NON-INVERT 5.5V 8TSSOP
Part Status: Active
Supplier Device Package: 8-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Bulk
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74AHCT2G125GD,125-NX NXP USA Inc. Description: IC BUFFER NON-INVERT 5.5V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
Produkt ist nicht verfügbar
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LD6836TD/36H,125 LD6836TD/36H,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 3.6V 300MA 5TSOP
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2885+0.2 EUR
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LD6836TD/22H,125 LD6836TD/22H,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 2.2V 300MA 5TSOP
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
Current - Supply (Max): 250 µA
Mounting Type: Surface Mount
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74HCT2G08DP 74HCT2G08DP NXP USA Inc. PHGLS18956-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 2CH 2-INP 8TSSOP
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BZX79-C51143 NXP USA Inc. BZX79.pdf Description: NOW NEXPERIA BZX79-C51 - ZENER D
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BZX79-C56133 NXP USA Inc. BZX79.pdf Description: NOW NEXPERIA BZX79-C56 - ZENER D
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MC35FS6511NAER2 MC35FS6511NAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC35FS6511NAE MC35FS6511NAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
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RAPIDRF-26E39 RAPIDRF-26E39 NXP USA Inc. RAPIDRF-26E39.pdf Description: 28 V LDMOS RF FRONT END 5G 50W
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Front End
Frequency: 2.496GHz ~ 2.69GHz
Packaging: Bulk
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PCAL6408AHK NXP USA Inc. PCAL6408A.pdf Description: LOW-VOLTAGE TRANSLATING, 8-BIT I
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MC9S08AW16MFUE MC9S08AW16MFUE NXP USA Inc. PHGL-S-A0002794566-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 16KB FLASH 64QFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
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36+17.95 EUR
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BZV90-C56115 BZV90-C56115 NXP USA Inc. BZV90.pdf Description: NOW NEXPERIA BZV90-C56 ZENER DIO
Power - Max: 1.5 W
Supplier Device Package: SOT-223
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 56 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Package / Case: TO-261-4, TO-261AA
Tolerance: ±5%
Packaging: Bulk
auf Bestellung 1990 Stücke:
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1990+0.32 EUR
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74AHCT374D118 74AHCT374D118 NXP USA Inc. 74AHC_AHCT374.pdf Description: NOW NEXPERIA 74AHCT374D - BUS DR
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 3 pF
Clock Frequency: 130 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 8mA, 8mA
Current - Quiescent (Iq): 4 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
auf Bestellung 2000 Stücke:
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1348+0.44 EUR
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MCIMX537CVP8C2 MCIMX537CVP8C2 NXP USA Inc. IMX53IEC.pdf Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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10+122.95 EUR
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HOMEKIT-SDK NXP USA Inc. HMKITSDKFS.pdf Description: HOMEKIT SOFTWARE DEVELOPMENT KIT
Produkt ist nicht verfügbar
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S912XEQ512BVAAR S912XEQ512BVAAR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tape & Reel (TR)
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S912XEQ512BVAA S912XEQ512BVAA NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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LD6816CX4/33P,315 LD6816CX4/33P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 3.3V 150MA 4-WLCSP
Package / Case: 4-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 3.3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
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PEMI2QFN/LP,115 PEMI2QFN/LP,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 18.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 5000 Stücke:
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3806+0.15 EUR
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UBA2211AT/N1,518 UBA2211AT/N1,518 NXP USA Inc. UBA2211.pdf Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Part Status: Obsolete
Current - Output Source/Sink: 900mA
Dimming: No
Supplier Device Package: 14-SO
Voltage - Supply: 10.7V ~ 13.8V
Operating Temperature: -40°C ~ 150°C
Type: CFL/TL Driver
Frequency: 40.05kHz ~ 42.68kHz
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA9502BS,157 PCA9502BS,157 NXP USA Inc. PCA9502.pdf Description: IC XPNDR 400KHZ I2C SPI 24HVQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 24-HVQFN (4x4)
Interrupt Output: No
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SPI
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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UJA1169AF-EVB UJA1169AF-EVB NXP USA Inc. UM11758.pdf Description: EVAL BOARD FOR UJA1169A
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: UJA1169A
Supplied Contents: Board(s)
Primary Attributes: 12V Supply
Embedded: Yes, MCU
Part Status: Active
Secondary Attributes: SPI Interface(s)
Contents: Board(s)
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PHPT60603PY115 PHPT60603PY115 NXP USA Inc. PHPT60603PY.pdf Description: POWER BIPOLAR TRANSISTOR, LFPAK
Packaging: Bulk
Produkt ist nicht verfügbar
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MC13202FC MC13202FC NXP USA Inc. MC13202.pdf Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCA24S08AD PCA24S08AD NXP USA Inc. PHGLS20439-1.pdf?t.download=true&u=5oefqw Description: IC EEPROM 8KBIT 400KHZ 8SO
Memory Interface: I2C
Supplier Device Package: 8-SO
Memory Format: EEPROM
Clock Frequency: 400 kHz
Technology: EEPROM
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 8Kbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
DigiKey Programmable: Not Verified
Memory Organization: 1K x 8
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740+0.8 EUR
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PCA24S08AD112 NXP USA Inc. Description: EEPROM 1MX8
Produkt ist nicht verfügbar
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FXLS8964AFR3 FXLS8964AFR3 NXP USA Inc. FXLS8964AF.pdf Description: ACCELEROMETER 2-16G 10DFN
Part Status: Active
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Supplier Device Package: 10-DFN (2x2)
Bandwidth: 1.6kHz
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: Digital
Mounting Type: Surface Mount
Output Type: I2C, SPI
Package / Case: 10-VFDFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Acceleration Range: ±2g, 4g, 8g, 16g
Axis: X, Y, Z
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FXLS8964AFR3 FXLS8964AFR3 NXP USA Inc. FXLS8964AF.pdf Description: ACCELEROMETER 2-16G 10DFN
Part Status: Active
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Supplier Device Package: 10-DFN (2x2)
Bandwidth: 1.6kHz
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±2g, 4g, 8g, 16g
Axis: X, Y, Z
Type: Digital
Mounting Type: Surface Mount
Output Type: I2C, SPI
Package / Case: 10-VFDFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
auf Bestellung 636 Stücke:
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5+4.31 EUR
10+4.11 EUR
25+3.88 EUR
50+3.71 EUR
100+3.57 EUR
500+3.27 EUR
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MC56F80746MLF MC56F80746MLF NXP USA Inc. MC56F80XXX.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: 56800EF
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10+10.4 EUR
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100+8.79 EUR
250+8.39 EUR
500+8.15 EUR
1000+7.95 EUR
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MC56F80646VLF MC56F80646VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
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MC56F80626VLF MC56F80626VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
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MC56F80736VLF MC56F80736VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
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MC56F80746VLF MC56F80746VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
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MC56F80726VLF MC56F80726VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
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MC56F8027VLHR MC56F8027VLHR NXP USA Inc. MC56F8037.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 2x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 2892 Stücke:
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1+27.61 EUR
10+21.78 EUR
25+20.31 EUR
100+18.71 EUR
250+17.95 EUR
500+17.48 EUR
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BLF7G24L-100,112 BLF7G24L-100,112 NXP USA Inc. PHGLS23273-1.pdf?t.download=true&u=5oefqw Description: RF TRANSISTOR
auf Bestellung 45 Stücke:
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6+114.29 EUR
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MPC860ENCVR66D4 MPC860ENCVR66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
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NVT4858UKZ NVT4858UKZ NXP USA Inc. Description: IC TRANSLATOR BIDIR 16WLCSP
Channel Type: Bidirectional
Supplier Device Package: 16-WLCSP (1.84x1.87)
Data Rate: 104Mbps
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 16-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Part Status: Active
Voltage - VCCB: 1.65 V ~ 3.6 V
Voltage - VCCA: 1.08 V ~ 1.95 V
Channels per Circuit: 6
Translator Type: Voltage Level
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NVT4858UKZ NVT4858UKZ NXP USA Inc. Description: IC TRANSLATOR BIDIR 16WLCSP
Number of Circuits: 1
Part Status: Active
Voltage - VCCB: 1.65 V ~ 3.6 V
Voltage - VCCA: 1.08 V ~ 1.95 V
Channels per Circuit: 6
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 16-WLCSP (1.84x1.87)
Data Rate: 104Mbps
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 16-UFBGA, WLCSP
Packaging: Cut Tape (CT)
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MC68HC908QY4CDTE MC68HC908QY4CDTE NXP USA Inc. MC68HLC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
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74CBTLVD3245DS,118 74CBTLVD3245DS,118 NXP USA Inc. 74CBTLVD3245_Rev_Mar2017.pdf Description: IC BUS SWITCH 8 X 1:1 20SSOP
Part Status: Obsolete
Supplier Device Package: 20-SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Bus Switch
Circuit: 8 x 1:1
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Packaging: Bulk
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MC33FS8530A1ESR2 NXP USA Inc. FS84QFN48EP.pdf Description: SYSTEM BASIS CHIP FS8500
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 4000 Stücke
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SPC5606BK0VLQ6 SPC5606BK0VLQ6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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74ALVCH16373DL,118 74ALVCH16373DL,118 NXP USA Inc. PHGLS25099-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, ALVC/VCX/A SERIES, 2
Part Status: Active
Supplier Device Package: 48-SSOP
Delay Time - Propagation: 2.1ns
Current - Output High, Low: 24mA, 24mA
Independent Circuits: 2
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Packaging: Bulk
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BUJD203A,127 BUJD203A,127 NXP USA Inc. PHGLS21815-1.pdf?t.download=true&u=5oefqw Description: TRANS NPN 425V 4A TO-220AB
Power - Max: 80 W
Voltage - Collector Emitter Breakdown (Max): 425 V
Current - Collector (Ic) (Max): 4 A
Supplier Device Package: TO-220AB
DC Current Gain (hFE) (Min) @ Ic, Vce: 11 @ 2A, 5V
Current - Collector Cutoff (Max): 100µA
Vce Saturation (Max) @ Ib, Ic: 1V @ 600mA, 3A
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
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BUJD103AD,118 BUJD103AD,118 NXP USA Inc. PHGLS22085-1.pdf?t.download=true&u=5oefqw Description: NOW WEEN - BUJD103AD - POWER BIP
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MPC860ENVR50D4 MPC860ENVR50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
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BZX79-B36,133 NXP USA Inc. PHGLS19463-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 36V 400MW ALF2
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K32W041AY K32W041AY NXP USA Inc. K32W041AM.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
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K32W041AMK K32W041AMK NXP USA Inc. K32W041AM.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
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K32W041AMY K32W041AMY NXP USA Inc. K32W041AM.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5634MF2MMG80 SPC5634MF2MMG80 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
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IMXEBOOKDC4 NXP USA Inc. Description: KIT EVAL
Packaging: Bulk
For Use With/Related Products: i.MX 6SoloLite
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Produkt ist nicht verfügbar
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MCZ33905CS5EKR2,518 MCZ33905CS5EKR2,518 NXP USA Inc. MC33903-MC33904-MC33905.pdf Description: SYSTEM BASIS CHIP, LIN, 2X 5.0V
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MCZ33905CD5EK MCZ33905CD5EK NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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MCZ33905CS5EK MCZ33905CS5EK NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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MCZ33905CS5EKR2 MCZ33905CS5EKR2 NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Produkt ist nicht verfügbar
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MC908GR16MFAE MC908GR16MFAE NXP USA Inc. MC68HC908GR16.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Produkt ist nicht verfügbar
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74AHCT2G126GD,125 PHGLS27955-1.pdf?t.download=true&u=5oefqw
74AHCT2G126GD,125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
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74AHCT2G241DP125 74AHC_AHCT2G241.pdf
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8TSSOP
Part Status: Active
Supplier Device Package: 8-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Bulk
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74AHCT2G125GD,125-NX
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
Produkt ist nicht verfügbar
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LD6836TD/36H,125 LD6836.pdf
LD6836TD/36H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.6V 300MA 5TSOP
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LD6836TD/22H,125 LD6836.pdf
LD6836TD/22H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 300MA 5TSOP
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
Current - Supply (Max): 250 µA
Mounting Type: Surface Mount
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74HCT2G08DP PHGLS18956-1.pdf?t.download=true&u=5oefqw
74HCT2G08DP
Hersteller: NXP USA Inc.
Description: IC GATE AND 2CH 2-INP 8TSSOP
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BZX79-C51143 BZX79.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C51 - ZENER D
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BZX79-C56133 BZX79.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C56 - ZENER D
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MC35FS6511NAER2 35FS4500-35FS6500SDS.pdf
MC35FS6511NAER2
Hersteller: NXP USA Inc.
Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC35FS6511NAE 35FS4500-35FS6500SDS.pdf
MC35FS6511NAE
Hersteller: NXP USA Inc.
Description: FS6500
Produkt ist nicht verfügbar
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RAPIDRF-26E39 RAPIDRF-26E39.pdf
RAPIDRF-26E39
Hersteller: NXP USA Inc.
Description: 28 V LDMOS RF FRONT END 5G 50W
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Front End
Frequency: 2.496GHz ~ 2.69GHz
Packaging: Bulk
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PCAL6408AHK PCAL6408A.pdf
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING, 8-BIT I
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MC9S08AW16MFUE PHGL-S-A0002794566-1.pdf?t.download=true&u=5oefqw
MC9S08AW16MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 64QFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
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BZV90-C56115 BZV90.pdf
BZV90-C56115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV90-C56 ZENER DIO
Power - Max: 1.5 W
Supplier Device Package: SOT-223
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 56 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Package / Case: TO-261-4, TO-261AA
Tolerance: ±5%
Packaging: Bulk
auf Bestellung 1990 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1990+0.32 EUR
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74AHCT374D118 74AHC_AHCT374.pdf
74AHCT374D118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT374D - BUS DR
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 3 pF
Clock Frequency: 130 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 8mA, 8mA
Current - Quiescent (Iq): 4 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
auf Bestellung 2000 Stücke:
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1348+0.44 EUR
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MCIMX537CVP8C2 IMX53IEC.pdf
MCIMX537CVP8C2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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HOMEKIT-SDK HMKITSDKFS.pdf
Hersteller: NXP USA Inc.
Description: HOMEKIT SOFTWARE DEVELOPMENT KIT
Produkt ist nicht verfügbar
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S912XEQ512BVAAR MC9S12XEPB.pdf
S912XEQ512BVAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tape & Reel (TR)
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S912XEQ512BVAA MC9S12XEPB.pdf
S912XEQ512BVAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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LD6816CX4/33P,315 LD6816.pdf
LD6816CX4/33P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 150MA 4-WLCSP
Package / Case: 4-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 3.3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Produkt ist nicht verfügbar
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PEMI2QFN/LP,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/LP,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 18.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Package / Case: 6-XFDFN
Packaging: Bulk
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UBA2211AT/N1,518 UBA2211.pdf
UBA2211AT/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Part Status: Obsolete
Current - Output Source/Sink: 900mA
Dimming: No
Supplier Device Package: 14-SO
Voltage - Supply: 10.7V ~ 13.8V
Operating Temperature: -40°C ~ 150°C
Type: CFL/TL Driver
Frequency: 40.05kHz ~ 42.68kHz
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA9502BS,157 PCA9502.pdf
PCA9502BS,157
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SPI 24HVQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 24-HVQFN (4x4)
Interrupt Output: No
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SPI
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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UJA1169AF-EVB UM11758.pdf
UJA1169AF-EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR UJA1169A
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: UJA1169A
Supplied Contents: Board(s)
Primary Attributes: 12V Supply
Embedded: Yes, MCU
Part Status: Active
Secondary Attributes: SPI Interface(s)
Contents: Board(s)
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PHPT60603PY115 PHPT60603PY.pdf
PHPT60603PY115
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR, LFPAK
Packaging: Bulk
Produkt ist nicht verfügbar
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MC13202FC MC13202.pdf
MC13202FC
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCA24S08AD PHGLS20439-1.pdf?t.download=true&u=5oefqw
PCA24S08AD
Hersteller: NXP USA Inc.
Description: IC EEPROM 8KBIT 400KHZ 8SO
Memory Interface: I2C
Supplier Device Package: 8-SO
Memory Format: EEPROM
Clock Frequency: 400 kHz
Technology: EEPROM
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 8Kbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
DigiKey Programmable: Not Verified
Memory Organization: 1K x 8
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PCA24S08AD112
Hersteller: NXP USA Inc.
Description: EEPROM 1MX8
Produkt ist nicht verfügbar
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FXLS8964AFR3 FXLS8964AF.pdf
FXLS8964AFR3
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Part Status: Active
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Supplier Device Package: 10-DFN (2x2)
Bandwidth: 1.6kHz
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: Digital
Mounting Type: Surface Mount
Output Type: I2C, SPI
Package / Case: 10-VFDFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Acceleration Range: ±2g, 4g, 8g, 16g
Axis: X, Y, Z
Produkt ist nicht verfügbar
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FXLS8964AFR3 FXLS8964AF.pdf
FXLS8964AFR3
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Part Status: Active
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Supplier Device Package: 10-DFN (2x2)
Bandwidth: 1.6kHz
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±2g, 4g, 8g, 16g
Axis: X, Y, Z
Type: Digital
Mounting Type: Surface Mount
Output Type: I2C, SPI
Package / Case: 10-VFDFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
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MC56F80746MLF MC56F80XXX.pdf
MC56F80746MLF
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: 56800EF
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MC56F80646VLF MC56F80XXX.pdf
MC56F80646VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
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MC56F80626VLF MC56F80XXX.pdf
MC56F80626VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
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MC56F80736VLF MC56F80XXX.pdf
MC56F80736VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
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MC56F80746VLF MC56F80XXX.pdf
MC56F80746VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
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MC56F80726VLF MC56F80XXX.pdf
MC56F80726VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
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MC56F8027VLHR MC56F8037.pdf
MC56F8027VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 2x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
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BLF7G24L-100,112 PHGLS23273-1.pdf?t.download=true&u=5oefqw
BLF7G24L-100,112
Hersteller: NXP USA Inc.
Description: RF TRANSISTOR
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MPC860ENCVR66D4 MPC860EC.pdf
MPC860ENCVR66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
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NVT4858UKZ
NVT4858UKZ
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 16WLCSP
Channel Type: Bidirectional
Supplier Device Package: 16-WLCSP (1.84x1.87)
Data Rate: 104Mbps
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 16-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Part Status: Active
Voltage - VCCB: 1.65 V ~ 3.6 V
Voltage - VCCA: 1.08 V ~ 1.95 V
Channels per Circuit: 6
Translator Type: Voltage Level
Produkt ist nicht verfügbar
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NVT4858UKZ
NVT4858UKZ
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 16WLCSP
Number of Circuits: 1
Part Status: Active
Voltage - VCCB: 1.65 V ~ 3.6 V
Voltage - VCCA: 1.08 V ~ 1.95 V
Channels per Circuit: 6
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 16-WLCSP (1.84x1.87)
Data Rate: 104Mbps
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 16-UFBGA, WLCSP
Packaging: Cut Tape (CT)
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MC68HC908QY4CDTE MC68HLC908QY4.pdf
MC68HC908QY4CDTE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
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74CBTLVD3245DS,118 74CBTLVD3245_Rev_Mar2017.pdf
74CBTLVD3245DS,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Part Status: Obsolete
Supplier Device Package: 20-SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Bus Switch
Circuit: 8 x 1:1
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Packaging: Bulk
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1110+0.54 EUR
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MC33FS8530A1ESR2 FS84QFN48EP.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8500
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5606BK0VLQ6 MPC5606B.pdf
SPC5606BK0VLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74ALVCH16373DL,118 PHGLS25099-1.pdf?t.download=true&u=5oefqw
74ALVCH16373DL,118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES, 2
Part Status: Active
Supplier Device Package: 48-SSOP
Delay Time - Propagation: 2.1ns
Current - Output High, Low: 24mA, 24mA
Independent Circuits: 2
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Packaging: Bulk
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430+1.37 EUR
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BUJD203A,127 PHGLS21815-1.pdf?t.download=true&u=5oefqw
BUJD203A,127
Hersteller: NXP USA Inc.
Description: TRANS NPN 425V 4A TO-220AB
Power - Max: 80 W
Voltage - Collector Emitter Breakdown (Max): 425 V
Current - Collector (Ic) (Max): 4 A
Supplier Device Package: TO-220AB
DC Current Gain (hFE) (Min) @ Ic, Vce: 11 @ 2A, 5V
Current - Collector Cutoff (Max): 100µA
Vce Saturation (Max) @ Ib, Ic: 1V @ 600mA, 3A
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
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908+0.65 EUR
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BUJD103AD,118 PHGLS22085-1.pdf?t.download=true&u=5oefqw
BUJD103AD,118
Hersteller: NXP USA Inc.
Description: NOW WEEN - BUJD103AD - POWER BIP
Produkt ist nicht verfügbar
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MPC860ENVR50D4 MPC860EC.pdf
MPC860ENVR50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
auf Bestellung 2997 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+371.58 EUR
Mindestbestellmenge: 2 Stücke
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BZX79-B36,133 PHGLS19463-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: DIODE ZENER 36V 400MW ALF2
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
16000+0.039 EUR
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K32W041AY K32W041AM.pdf
K32W041AY
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4000+6.96 EUR
Mindestbestellmenge: 4000 Stücke
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K32W041AMK K32W041AM.pdf
K32W041AMK
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 2440 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+12.92 EUR
10+11.2 EUR
25+10.6 EUR
100+9.77 EUR
250+9.28 EUR
500+8.94 EUR
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K32W041AMY K32W041AM.pdf
K32W041AMY
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5634MF2MMG80 MPC5634M.pdf
SPC5634MF2MMG80
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IMXEBOOKDC4
Hersteller: NXP USA Inc.
Description: KIT EVAL
Packaging: Bulk
For Use With/Related Products: i.MX 6SoloLite
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Produkt ist nicht verfügbar
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MCZ33905CS5EKR2,518 MC33903-MC33904-MC33905.pdf
MCZ33905CS5EKR2,518
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LIN, 2X 5.0V
Produkt ist nicht verfügbar
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MCZ33905CD5EK MC33903%2C4%2C5.pdf
MCZ33905CD5EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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MCZ33905CS5EK MC33903%2C4%2C5.pdf
MCZ33905CS5EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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MCZ33905CS5EKR2 MC33903%2C4%2C5.pdf
MCZ33905CS5EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Produkt ist nicht verfügbar
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MC908GR16MFAE MC68HC908GR16.pdf
MC908GR16MFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Produkt ist nicht verfügbar
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