Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35546) > Seite 460 nach 593
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FXTH870902DT1528 | NXP USA Inc. |
Description: TPMS 7X7 900KPA Z AXIS Packaging: Bulk |
Produkt ist nicht verfügbar |
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MWCT1001AVLHR528 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MWCT1001AVLH557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MPL3150A2T1 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MPL3150A2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC33FS8510B6ESR2 | NXP USA Inc. |
Description: FS8500 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MC33FS8510B6ES | NXP USA Inc. |
Description: FS8500 Packaging: Tray |
Produkt ist nicht verfügbar |
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LPC11E13FBD48/301 | NXP USA Inc. | Description: IC MCU ARM CORTEX-M0 32BIT FLASH |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XET512BVAL | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XET512BVALR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74ABT162245ADGG512 | NXP USA Inc. |
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auf Bestellung 975 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5604CF2VLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKL28Z512VLL7R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 27x16b SAR; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 90 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MFS8603BMDA0ES | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 60V Applications: Camera Supplier Device Package: 48-QFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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S912ZVC64F0MLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 10x10b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVC64F0MLFR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 10x10b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12GN16F1CLC557 | NXP USA Inc. |
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S9S12GN32F1CLC557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S9S12G48BCLC557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S9S12GN48F1CLC557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC9S08DZ16ACLC557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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BZB784-C2V7,115 | NXP USA Inc. |
![]() Packaging: Bulk Tolerance: ±5% Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-323 Part Status: Active Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 20 µA @ 1 V |
auf Bestellung 168000 Stücke: Lieferzeit 10-14 Tag (e) |
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BZB784-C8V2,115 | NXP USA Inc. |
![]() Packaging: Bulk Tolerance: ±5% Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 8.2 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: SOT-323 Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 700 nA @ 5 V |
auf Bestellung 129290 Stücke: Lieferzeit 10-14 Tag (e) |
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BZB84-C75215 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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BZB84-C11215 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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BZX84-C2V7/LF1R | NXP USA Inc. |
![]() Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 20 µA @ 1 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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BZX84-C2V7/LF1VL | NXP USA Inc. |
![]() Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 20 µA @ 1 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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BUK7640-100A118 | NXP USA Inc. |
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auf Bestellung 4269 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX250DJM4A | NXP USA Inc. | Description: IC MPU I.MX25 400MAPBGA |
Produkt ist nicht verfügbar |
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MCIMX250CJM4A | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MPC8260AZUPJDB-NXP | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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TDF8599TH/N2,512 | NXP USA Inc. |
Description: IC AMP D MONO/STEREO 85W 36HSOP Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection Packaging: Tube Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 8V ~ 18V Max Output Power x Channels @ Load: 85W x 1 @ 1Ohm; 70W x 2 @ 2Ohm Supplier Device Package: 36-HSOP Part Status: Obsolete |
auf Bestellung 660 Stücke: Lieferzeit 10-14 Tag (e) |
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TDF8531HH/N3K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-FQFP Exposed Pad Output Type: 3-Channel Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm Supplier Device Package: 100-HLQFP (14x14) |
Produkt ist nicht verfügbar |
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TDF8534HH/N3K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-FQFP Exposed Pad Output Type: 5-Channel Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm Supplier Device Package: 100-HLQFP (14x14) |
Produkt ist nicht verfügbar |
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TDF8531HH/N3Y | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 100-FQFP Exposed Pad Output Type: 3-Channel Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm Supplier Device Package: 100-HLQFP (14x14) |
Produkt ist nicht verfügbar |
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TDF8534HH/N3Y | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 100-FQFP Exposed Pad Output Type: 5-Channel Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm Supplier Device Package: 100-HLQFP (14x14) |
Produkt ist nicht verfügbar |
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TDF8532HH/N3Y | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 100-FQFP Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm Supplier Device Package: 100-HLQFP (14x14) |
Produkt ist nicht verfügbar |
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TDF8532HH/N3K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-FQFP Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm Supplier Device Package: 100-HLQFP (14x14) |
Produkt ist nicht verfügbar |
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P1021NXN2DFB | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Additional Interfaces: DUART, I2C, MMC/SD, SPI |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6L2EVN10ACR | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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LD6806F/18P,115 | NXP USA Inc. |
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auf Bestellung 6669 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDMSTBI-B3115 | NXP USA Inc. |
![]() Packaging: Bulk Interface: I2C, Serial Voltage - Supply: 1.95V ~ 3.6V Sensor Type: Pressure Utilized IC / Part: FXPQ3115BV Supplied Contents: Board(s) Sensing Range: 20 ~ 110 kPa Part Status: Active |
Produkt ist nicht verfügbar |
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BRKTSTBI-B3115 | NXP USA Inc. |
![]() Packaging: Bulk Interface: I2C, Serial Voltage - Supply: 2.5V Sensor Type: Pressure Utilized IC / Part: FXPQ3115BV Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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FXPQ3115BV | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MPC8544VJALFA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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MC32PF4210A0ESR2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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TEA1936XDB1463UL | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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P302D217UD/T0K092V | NXP USA Inc. |
Description: P302D217UD/T0K092V Packaging: Bulk Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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LD6815TD/33H,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 3.3V Control Features: Enable PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA (Typ) Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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S912ZVMBA6F0WLFR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 5x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: LINbus, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 15 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BLF10M6LS200U112 | NXP USA Inc. |
Description: RF MOSFET LDMOS Packaging: Bulk |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK9Y113-100E115 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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BUK7Y113-100E115 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S9KEAZ128AVLHR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
auf Bestellung 2885 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI8QFN/CT,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 16dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Part Status: Obsolete Number of Channels: 8 |
auf Bestellung 12000 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI4QFN/LE,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 65Ohms, C = 8.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 11dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 65 ESD Protection: Yes Part Status: Obsolete Number of Channels: 4 |
auf Bestellung 112000 Stücke: Lieferzeit 10-14 Tag (e) |
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A2I35H060NR1,528 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MKL27Z32VLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 19x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I²S, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 51 |
auf Bestellung 1589 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF8545BTT/A118 | NXP USA Inc. |
![]() Packaging: Bulk |
auf Bestellung 1900 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF8545BTT/AY | NXP USA Inc. |
Description: UNIVERSAL LCD DRIVER FOR MULTIPL Packaging: Tape & Reel (TR) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: SPI Configuration: 320 Segment Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 20 Characters, 40 Characters, 320 Elements Supplier Device Package: 56-TSSOP Grade: Automotive Current - Supply: 30 µA Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
MWCT1001AVLHR528 |
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Hersteller: NXP USA Inc.
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR
Produkt ist nicht verfügbar
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MWCT1001AVLH557 |
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Hersteller: NXP USA Inc.
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR
Produkt ist nicht verfügbar
Im Einkaufswagen
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MPL3150A2T1 |
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Hersteller: NXP USA Inc.
Description: PRESS SENSOR 2.5V 50/110KPA TSON
Description: PRESS SENSOR 2.5V 50/110KPA TSON
Produkt ist nicht verfügbar
Im Einkaufswagen
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MPL3150A2 |
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Hersteller: NXP USA Inc.
Description: PRESS SENSOR 2.5V 50/110KPA TSON
Description: PRESS SENSOR 2.5V 50/110KPA TSON
Produkt ist nicht verfügbar
Im Einkaufswagen
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LPC11E13FBD48/301 |
Hersteller: NXP USA Inc.
Description: IC MCU ARM CORTEX-M0 32BIT FLASH
Description: IC MCU ARM CORTEX-M0 32BIT FLASH
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
49+ | 9.52 EUR |
S912XET512BVAL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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S912XET512BVALR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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74ABT162245ADGG512 |
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Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER, ABT SERIES
Description: BUS TRANSCEIVER, ABT SERIES
auf Bestellung 975 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
704+ | 0.74 EUR |
SPC5604CF2VLL6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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MKL28Z512VLL7R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x16b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 90
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x16b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 90
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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MFS8603BMDA0ES |
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Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 14.63 EUR |
10+ | 11.38 EUR |
25+ | 10.56 EUR |
100+ | 9.67 EUR |
260+ | 9.23 EUR |
S912ZVC64F0MLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S912ZVC64F0MLFR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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S9S12GN16F1CLC557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 16-BIT, HCS12 C
Description: MICROCONTROLLER 16-BIT, HCS12 C
Produkt ist nicht verfügbar
Im Einkaufswagen
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S9S12GN32F1CLC557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Produkt ist nicht verfügbar
Im Einkaufswagen
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S9S12G48BCLC557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Produkt ist nicht verfügbar
Im Einkaufswagen
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S9S12GN48F1CLC557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Produkt ist nicht verfügbar
Im Einkaufswagen
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MC9S08DZ16ACLC557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Produkt ist nicht verfügbar
Im Einkaufswagen
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BZB784-C2V7,115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C2V7 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-323
Part Status: Active
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Description: NOW NEXPERIA BZB784-C2V7 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-323
Part Status: Active
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
auf Bestellung 168000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
10452+ | 0.05 EUR |
BZB784-C8V2,115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C8V2 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
Description: NOW NEXPERIA BZB784-C8V2 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
auf Bestellung 129290 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
10452+ | 0.05 EUR |
BZB84-C75215 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB84-C75 - ZENER D
Description: NOW NEXPERIA BZB84-C75 - ZENER D
Produkt ist nicht verfügbar
Im Einkaufswagen
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BZB84-C11215 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB84-C10 - ZENER D
Description: NOW NEXPERIA BZB84-C10 - ZENER D
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BZX84-C2V7/LF1R |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 2.7V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Qualification: AEC-Q101
Description: DIODE ZENER 2.7V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BZX84-C2V7/LF1VL |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 2.7V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Qualification: AEC-Q101
Description: DIODE ZENER 2.7V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BUK7640-100A118 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK7640-100A - POWE
Description: NOW NEXPERIA BUK7640-100A - POWE
auf Bestellung 4269 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
478+ | 1.09 EUR |
MCIMX250DJM4A |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MAPBGA
Description: IC MPU I.MX25 400MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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MCIMX250CJM4A |
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Hersteller: NXP USA Inc.
Description: IC MPU IMX25 IND 400MAPBGA
Description: IC MPU IMX25 IND 400MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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MPC8260AZUPJDB-NXP |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Bulk
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Bulk
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 512.62 EUR |
TDF8599TH/N2,512 |
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 85W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 85W x 1 @ 1Ohm; 70W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Description: IC AMP D MONO/STEREO 85W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 85W x 1 @ 1Ohm; 70W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
auf Bestellung 660 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
24+ | 21.83 EUR |
TDF8531HH/N3K |
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Hersteller: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 3-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 3-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
Produkt ist nicht verfügbar
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TDF8534HH/N3K |
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Hersteller: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 5-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 5-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
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TDF8531HH/N3Y |
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Hersteller: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 3-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 3-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
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TDF8534HH/N3Y |
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Hersteller: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 5-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 5-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
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TDF8532HH/N3Y |
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Hersteller: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
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TDF8532HH/N3K |
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Hersteller: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
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P1021NXN2DFB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 147.25 EUR |
MCIMX6L2EVN10ACR |
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Hersteller: NXP USA Inc.
Description: I.MX 6SL ROM PERF ENHAN
Description: I.MX 6SL ROM PERF ENHAN
Produkt ist nicht verfügbar
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LD6806F/18P,115 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 6XSON
Description: IC REG LINEAR 1.8V 200MA 6XSON
auf Bestellung 6669 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2404+ | 0.21 EUR |
FRDMSTBI-B3115 |
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Hersteller: NXP USA Inc.
Description: SENSOR TOOLBOX DEVELOPMENT PLATF
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Sensing Range: 20 ~ 110 kPa
Part Status: Active
Description: SENSOR TOOLBOX DEVELOPMENT PLATF
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Sensing Range: 20 ~ 110 kPa
Part Status: Active
Produkt ist nicht verfügbar
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BRKTSTBI-B3115 |
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Hersteller: NXP USA Inc.
Description: SENSOR BREAKOUT BOARD FOR FXPQ31
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 2.5V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Part Status: Active
Description: SENSOR BREAKOUT BOARD FOR FXPQ31
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 2.5V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Part Status: Active
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FXPQ3115BV |
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Hersteller: NXP USA Inc.
Description: PRESS SENSOR 2.5V 20/110KPA TSON
Description: PRESS SENSOR 2.5V 20/110KPA TSON
Produkt ist nicht verfügbar
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MPC8544VJALFA |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 271.66 EUR |
10+ | 230.47 EUR |
36+ | 216.78 EUR |
MC32PF4210A0ESR2 |
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Hersteller: NXP USA Inc.
Description: PF4210
Description: PF4210
Produkt ist nicht verfügbar
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TEA1936XDB1463UL |
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Hersteller: NXP USA Inc.
Description: TEA1936X DEMOBOARD 1463
Description: TEA1936X DEMOBOARD 1463
Produkt ist nicht verfügbar
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LD6815TD/33H,125 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 150MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: IC REG LINEAR 3.3V 150MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3328+ | 0.15 EUR |
S912ZVMBA6F0WLFR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BLF10M6LS200U112 |
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 158.84 EUR |
BUK9Y113-100E115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK9Y113-100E 12A,
Description: NOW NEXPERIA BUK9Y113-100E 12A,
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BUK7Y113-100E115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK7Y113-100E - POW
Description: NOW NEXPERIA BUK7Y113-100E - POW
Produkt ist nicht verfügbar
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S9KEAZ128AVLHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 2885 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 7.66 EUR |
10+ | 6.47 EUR |
25+ | 6.29 EUR |
100+ | 6.10 EUR |
250+ | 5.82 EUR |
500+ | 5.49 EUR |
PEMI8QFN/CT,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Description: FILTER RC(PI) 20 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1567+ | 0.32 EUR |
PEMI4QFN/LE,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 11dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
Description: FILTER RC(PI) 65 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 11dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
auf Bestellung 112000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2959+ | 0.16 EUR |
A2I35H060NR1,528 |
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Hersteller: NXP USA Inc.
Description: RF LDMOS WIDEBAND INTEGRATED POW
Description: RF LDMOS WIDEBAND INTEGRATED POW
Produkt ist nicht verfügbar
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MKL27Z32VLH4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 19x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 19x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
auf Bestellung 1589 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
50+ | 17.85 EUR |
PCF8545BTT/A118 |
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auf Bestellung 1900 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
208+ | 2.33 EUR |
PCF8545BTT/AY |
Hersteller: NXP USA Inc.
Description: UNIVERSAL LCD DRIVER FOR MULTIPL
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 320 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 320 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 30 µA
Qualification: AEC-Q100
Description: UNIVERSAL LCD DRIVER FOR MULTIPL
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 320 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 320 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 30 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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