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MCIMX6L3EVN10AC

MCIMX6L3EVN10AC NXP USA Inc.


IMX6SLCEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tray
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
auf Bestellung 800 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+49.6 EUR
10+40.08 EUR
25+37.69 EUR
160+34.4 EUR
320+33.55 EUR
480+33.12 EUR
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Technische Details MCIMX6L3EVN10AC NXP USA Inc.

Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA, Core Processor: ARM® Cortex®-A9, Operating Temperature: -40°C ~ 105°C (TA), Speed: 1.0GHz, Mounting Type: Surface Mount, Package / Case: 432-TFBGA, Packaging: Tray, Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART, Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection, Display & Interface Controllers: Keypad, LCD, Graphics Acceleration: Yes, RAM Controllers: LPDDR2, LVDDR3, DDR3, Co-Processors/DSP: Multimedia; NEON™ SIMD, Number of Cores/Bus Width: 1 Core, 32-Bit, USB: USB 2.0 + PHY (3), Ethernet: 10/100Mbps (1), Supplier Device Package: 432-MAPBGA (13x13), Voltage - I/O: 1.2V, 1.8V, 3.0V.

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MCIMX6L3EVN10AC MCIMX6L3EVN10AC Hersteller : NXP Semiconductors IMX6SLCEC-1388715.pdf Processors - Application Specialised i.MX 6SL ROM Perf Enhan
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