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MC56F80000-EVK MC56F80000-EVK NXP USA Inc. MC56F80000-EVK.pdf Description: DIGITAL SIGNAL CTRL EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s)
Core Processor: 56800EF
Board Type: Evaluation Platform
Utilized IC / Part: MC56F80748
Part Status: Active
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MC56F82348MLH MC56F82348MLH NXP USA Inc. Description: MC56F82348 - 32-BIT DSC, 56800EX
Packaging: Bulk
Part Status: Active
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PMV37EN,215 PMV37EN,215 NXP USA Inc. Description: MOSFET N-CH 30V 3.1A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta)
Rds On (Max) @ Id, Vgs: 36mOhm @ 3.1A, 10V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 10 V
Produkt ist nicht verfügbar
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PMV37EN,215 PMV37EN,215 NXP USA Inc. Description: MOSFET N-CH 30V 3.1A TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta)
Rds On (Max) @ Id, Vgs: 36mOhm @ 3.1A, 10V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 10 V
Produkt ist nicht verfügbar
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MCIMX280DVM4B MCIMX280DVM4B NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Part Status: Active
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A2T20H160W04NR3528 NXP USA Inc. PHGL-S-A0002371724-1.pdf?t.download=true&u=5oefqw Description: RF POWER FIELD-EFFECT TRANSISTOR
Packaging: Bulk
Part Status: Active
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FXLS8967AFR3 NXP USA Inc. FXLS8967AF.pdf Description: IC 3-AXIS ACCELEROMETER 10-DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
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FXLS8967AFR3 NXP USA Inc. FXLS8967AF.pdf Description: IC 3-AXIS ACCELEROMETER 10-DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
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10+4.5 EUR
25+4 EUR
50+3.8 EUR
100+3.7 EUR
500+3.1 EUR
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MCIMX534AVP8C2R2 MCIMX534AVP8C2R2 NXP USA Inc. Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX534AVP8C2 MCIMX534AVP8C2 NXP USA Inc. Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Active
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SAF775CHN/N208W/HK NXP USA Inc. Description: CAR DISP
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT27PW,118 74HCT27PW,118 NXP USA Inc. PHGL-S-A0001295645-1.pdf?t.download=true&u=5oefqw Description: IC GATE NOR 3CH 3-INP 14TSSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 3
Part Status: Active
Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 3
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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TWR-LCD-RGB,598 NXP USA Inc. Description: TOWER SYSTEM, PERIPHERAL MODULE,
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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BF1202WR,135 BF1202WR,135 NXP USA Inc. BF1202(R,WR)_Rev_Sept2010.pdf Description: MOSFET N-CH DUAL GATE 4DFP
Current - Test: 12 mA
Voltage - Test: 5 V
Voltage - Rated: 10 V
Part Status: Obsolete
Supplier Device Package: CMPAK-4
Noise Figure: 0.9dB
Technology: MOSFET
Gain: 30.5dB
Configuration: N-Channel Dual Gate
Frequency: 400MHz
Mounting Type: Surface Mount
Current Rating (Amps): 30mA
Package / Case: SC-82A, SOT-343
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BF1202R,215 BF1202R,215 NXP USA Inc. BF1202%28R%2CWR%29_Rev_Sept2010.pdf Description: RF MOSFET 5V SOT143R
Supplier Device Package: SOT-143R
Noise Figure: 0.9dB
Technology: MOSFET (Metal Oxide)
Gain: 30.5dB
Power - Output: 200mW
Configuration: N-Channel Dual Gate
Frequency: 400MHz
Current Rating (Amps): 30mA
Package / Case: TO-253-4, TO-253AA
Packaging: Tape & Reel (TR)
Current - Test: 12 mA
Voltage - Test: 5 V
Voltage - Rated: 10 V
Part Status: Obsolete
Produkt ist nicht verfügbar
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BF1202R,215 BF1202R,215 NXP USA Inc. BF1202%28R%2CWR%29_Rev_Sept2010.pdf Description: RF MOSFET 5V SOT143R
Noise Figure: 0.9dB
Technology: MOSFET (Metal Oxide)
Gain: 30.5dB
Power - Output: 200mW
Configuration: N-Channel Dual Gate
Frequency: 400MHz
Current Rating (Amps): 30mA
Package / Case: TO-253-4, TO-253AA
Packaging: Cut Tape (CT)
Current - Test: 12 mA
Voltage - Test: 5 V
Voltage - Rated: 10 V
Part Status: Obsolete
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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74AUP1G79GS,132 74AUP1G79GS,132 NXP USA Inc. PHGLS24882-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 6XSON
Current - Quiescent (Iq): 500 nA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 6-XFDFN
Packaging: Bulk
Number of Bits per Element: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Input Capacitance: 0.8 pF
Clock Frequency: 309 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 4mA
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BF1204,115 BF1204,115 NXP USA Inc. BF1204_Rev_Sept2010.pdf Description: FET RF 10V 400MHZ 6TSSOP
Noise Figure: 0.9dB
Technology: MOSFET
Gain: 30dB
Configuration: N-Channel Dual Gate
Frequency: 400MHz
Mounting Type: Surface Mount
Current Rating (Amps): 30mA
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
Current - Test: 12 mA
Voltage - Test: 5 V
Voltage - Rated: 10 V
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
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MMG3012NT1 MMG3012NT1 NXP USA Inc. MMG3012NT1.pdf Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Part Status: Obsolete
Supplier Device Package: SOT-89-4
Test Frequency: 900MHz
P1dB: 18.5dBm
Noise Figure: 3.8dB
Current - Supply: 82mA
Gain: 19dB
Voltage - Supply: 5V
RF Type: Cellular, PCS, PHS, WLL
Frequency: 0Hz ~ 6GHz
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC8349ECVVAJDB MPC8349ECVVAJDB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Produkt ist nicht verfügbar
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SPC5602PEF0VLL6R SPC5602PEF0VLL6R NXP USA Inc. MPC5602P.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
Produkt ist nicht verfügbar
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MPC9456AC MPC9456AC NXP USA Inc. MPC9456.pdf Description: IC CLK BUFFER 1:10 250MHZ 32TQFP
Packaging: Tray
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution), Divider, Multiplexer
Input: LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 1:10
Differential - Input:Output: Yes/No
Supplier Device Package: 32-TQFP (7x7)
Part Status: Obsolete
Frequency - Max: 250 MHz
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SSL5235TE/1518 SSL5235TE/1518 NXP USA Inc. Description: 5 OHM/550 VOLT MAINS DIMMABLE BU
Packaging: Bulk
Part Status: Active
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SSL5235BTE/1518 NXP USA Inc. Description: 5 OHM/550 V MAINS
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SSL5235BTE/1Y NXP USA Inc. Description: IC LED DRIVER
Packaging: Bulk
Part Status: Active
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PCA9633D16,112 PCA9633D16,112 NXP USA Inc. PCA9633.pdf Description: IC LED DRIVER PS PWM 25MA 16SO
Number of Outputs: 4
Mounting Type: Surface Mount
Voltage - Output: 5.5V
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Part Status: Obsolete
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: PWM
Supplier Device Package: 16-SO
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Power Switch
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PCA9633D16,118 PCA9633D16,118 NXP USA Inc. PCA9633.pdf Description: IC LED DRIVER PS PWM 25MA 16SO
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Power Switch
Number of Outputs: 4
Mounting Type: Surface Mount
Voltage - Output: 5.5V
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Part Status: Obsolete
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: I²C
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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FXPQ3115BVST1 FXPQ3115BVST1 NXP USA Inc. FXPQ3115BV.pdf Description: IC PRESSURE SENSOR I2C 8-TSON
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Output: 7 b
Operating Pressure: 2.9PSI ~ 15.95PSI (20kPa ~ 110kPa)
Pressure Type: Absolute
Accuracy: ±0.11PSI (±0.75kPa)
Operating Temperature: -40°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 1.95V ~ 3.6V
Applications: Medical Ventilation
Supplier Device Package: 8-LGA (3x5)
Port Style: No Port
Maximum Pressure: 72.52PSI (500kPa)
Part Status: Active
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PCA9531PW118 PCA9531PW118 NXP USA Inc. PCA9531.pdf Description: IC LED DRVR LIN DIM 25MA 16TSSOP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TWR-CM3120-EVM TWR-CM3120-EVM NXP USA Inc. KTTWRCM3120UG.pdf Description: TOWER BOARD - CM3120 IO-LINK MA
Packaging: Bulk
Function: IO-Link
Type: Interface
Contents: Board(s)
Utilized IC / Part: CM3120
Platform: Freescale Tower System
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6QP7CVT8AB,557 NXP USA Inc. IMX6DQPIEC.pdf Description: I.MX 6 SERIES 32 BIT MPU, QUAD A
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6QP5EYM1AA557 NXP USA Inc. IMX6DQPCEC.pdf Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6Q4AVT08AC MCIMX6Q4AVT08AC NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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BTA330Y-800BT127 BTA330Y-800BT127 NXP USA Inc. PHGL-S-A0001060295-1.pdf?t.download=true&u=5oefqw Description: 3 QUADRANT TRIAC TO 220AB
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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S32G-VNP-GLDBOX3 S32G-VNP-GLDBOX3 NXP USA Inc. S32G-VNP-GLDBOX3UG.pdf Description: EVAL BOARD FOR S32G2
Contents: Board(s)
Part Status: Active
Embedded: Yes
Supplied Contents: Board(s)
Utilized IC / Part: S32G2, SJA1110, TJA1102-TJA1102S, TJA1043, TJA1463VR5510
Type: Reference Design
Function: Networking
Packaging: Box
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MPC8541PXAPF MPC8541PXAPF NXP USA Inc. MPC8541EEC.pdf Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 833MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
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S9S12GN32F0MLFR S9S12GN32F0MLFR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: 12V1
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MRF6V3090NR1 MRF6V3090NR1 NXP USA Inc. Description: RF MOSFET LDMOS 50V TO270-4
Current - Test: 350 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Obsolete
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 22dB
Power - Output: 18W
Frequency: 860MHz
Mounting Type: Surface Mount
Package / Case: TO-270AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LD6836CX4/25P,315 LD6836CX4/25P,315 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 2.5V 300MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.16V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
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MK10DX64VLK7R MK10DX64VLK7R NXP USA Inc. K10P81M72SF1.pdf Description: IC MCU 32BIT 64KB FLASH 80FQFP
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 56
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 31x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
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MCIMX6D7CZK08AD NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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N74F02D,623 N74F02D,623 NXP USA Inc. DS_568_74F02.pdf Description: IC GATE NOR 4CH 2-INP 14-SO
Part Status: Active
Packaging: Bulk
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SAF7751HN/N208W/SK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SAF7751HN/N208W/MP NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SPC5742PFK1AMLQ9557 SPC5742PFK1AMLQ9557 NXP USA Inc. MPC5744P.pdf Description: MPC574XP MICROCONTROLLER POWER A
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Produkt ist nicht verfügbar
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BZX79-C36143 BZX79-C36143 NXP USA Inc. BZX79.pdf Description: NOW NEXPERIA BZX79-C36 - ZENER D
Part Status: Active
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 36 V
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
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S32G-VNP-RDB3 S32G-VNP-RDB3 NXP USA Inc. RMS32G-VNP-RDB3.pdf Description: VEHICLE NETWORKING REFERENCE DES
Part Status: Active
Utilized IC / Part: S32G3
Board Type: Single Board Computers (SBC)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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BF1108,215 BF1108,215 NXP USA Inc. PHGLS15576-1.pdf?t.download=true&u=5oefqw Description: BF1108 - SILICON RF SWITCHES
Packaging: Bulk
Part Status: Active
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S912ZVC64AMKHR S912ZVC64AMKHR NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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S912ZVC64AMKH S912ZVC64AMKH NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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S912ZVCA19AMKH S912ZVCA19AMKH NXP USA Inc. Description: IC MCU 16BIT 192KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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S912ZVC12F0MKHR S912ZVC12F0MKHR NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912ZVC19F0MKH S912ZVC19F0MKH NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 192KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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S912ZVC19F0MKHR S912ZVC19F0MKHR NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 192KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912ZVC12F0MKH S912ZVC12F0MKH NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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N74F574D,623 N74F574D,623 NXP USA Inc. 74F573,4.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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N74F574D,623 N74F574D,623 NXP USA Inc. 74F573,4.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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N74F574D,623 N74F574D,623 NXP USA Inc. 74F573,4.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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N74F574D,602 N74F574D,602 NXP USA Inc. 74F573,4.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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SAF7751HV/N205/SCK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC56F80000-EVK MC56F80000-EVK.pdf
MC56F80000-EVK
Hersteller: NXP USA Inc.
Description: DIGITAL SIGNAL CTRL EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s)
Core Processor: 56800EF
Board Type: Evaluation Platform
Utilized IC / Part: MC56F80748
Part Status: Active
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MC56F82348MLH
MC56F82348MLH
Hersteller: NXP USA Inc.
Description: MC56F82348 - 32-BIT DSC, 56800EX
Packaging: Bulk
Part Status: Active
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PMV37EN,215
PMV37EN,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 3.1A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta)
Rds On (Max) @ Id, Vgs: 36mOhm @ 3.1A, 10V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 10 V
Produkt ist nicht verfügbar
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PMV37EN,215
PMV37EN,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 3.1A TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta)
Rds On (Max) @ Id, Vgs: 36mOhm @ 3.1A, 10V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 10 V
Produkt ist nicht verfügbar
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MCIMX280DVM4B IMX28CEC.pdf
MCIMX280DVM4B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Part Status: Active
Produkt ist nicht verfügbar
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A2T20H160W04NR3528 PHGL-S-A0002371724-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF POWER FIELD-EFFECT TRANSISTOR
Packaging: Bulk
Part Status: Active
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AnzahlPreis
4+144.07 EUR
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FXLS8967AFR3 FXLS8967AF.pdf
Hersteller: NXP USA Inc.
Description: IC 3-AXIS ACCELEROMETER 10-DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Produkt ist nicht verfügbar
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FXLS8967AFR3 FXLS8967AF.pdf
Hersteller: NXP USA Inc.
Description: IC 3-AXIS ACCELEROMETER 10-DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
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10+4.5 EUR
25+4 EUR
50+3.8 EUR
100+3.7 EUR
500+3.1 EUR
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MCIMX534AVP8C2R2
MCIMX534AVP8C2R2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX534AVP8C2
MCIMX534AVP8C2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
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SAF775CHN/N208W/HK
Hersteller: NXP USA Inc.
Description: CAR DISP
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT27PW,118 PHGL-S-A0001295645-1.pdf?t.download=true&u=5oefqw
74HCT27PW,118
Hersteller: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14TSSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 3
Part Status: Active
Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 3
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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TWR-LCD-RGB,598
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM, PERIPHERAL MODULE,
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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BF1202WR,135 BF1202(R,WR)_Rev_Sept2010.pdf
BF1202WR,135
Hersteller: NXP USA Inc.
Description: MOSFET N-CH DUAL GATE 4DFP
Current - Test: 12 mA
Voltage - Test: 5 V
Voltage - Rated: 10 V
Part Status: Obsolete
Supplier Device Package: CMPAK-4
Noise Figure: 0.9dB
Technology: MOSFET
Gain: 30.5dB
Configuration: N-Channel Dual Gate
Frequency: 400MHz
Mounting Type: Surface Mount
Current Rating (Amps): 30mA
Package / Case: SC-82A, SOT-343
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BF1202R,215 BF1202%28R%2CWR%29_Rev_Sept2010.pdf
BF1202R,215
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V SOT143R
Supplier Device Package: SOT-143R
Noise Figure: 0.9dB
Technology: MOSFET (Metal Oxide)
Gain: 30.5dB
Power - Output: 200mW
Configuration: N-Channel Dual Gate
Frequency: 400MHz
Current Rating (Amps): 30mA
Package / Case: TO-253-4, TO-253AA
Packaging: Tape & Reel (TR)
Current - Test: 12 mA
Voltage - Test: 5 V
Voltage - Rated: 10 V
Part Status: Obsolete
Produkt ist nicht verfügbar
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BF1202R,215 BF1202%28R%2CWR%29_Rev_Sept2010.pdf
BF1202R,215
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V SOT143R
Noise Figure: 0.9dB
Technology: MOSFET (Metal Oxide)
Gain: 30.5dB
Power - Output: 200mW
Configuration: N-Channel Dual Gate
Frequency: 400MHz
Current Rating (Amps): 30mA
Package / Case: TO-253-4, TO-253AA
Packaging: Cut Tape (CT)
Current - Test: 12 mA
Voltage - Test: 5 V
Voltage - Rated: 10 V
Part Status: Obsolete
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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74AUP1G79GS,132 PHGLS24882-1.pdf?t.download=true&u=5oefqw
74AUP1G79GS,132
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Current - Quiescent (Iq): 500 nA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 6-XFDFN
Packaging: Bulk
Number of Bits per Element: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Input Capacitance: 0.8 pF
Clock Frequency: 309 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 4mA
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3484+0.15 EUR
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BF1204,115 BF1204_Rev_Sept2010.pdf
BF1204,115
Hersteller: NXP USA Inc.
Description: FET RF 10V 400MHZ 6TSSOP
Noise Figure: 0.9dB
Technology: MOSFET
Gain: 30dB
Configuration: N-Channel Dual Gate
Frequency: 400MHz
Mounting Type: Surface Mount
Current Rating (Amps): 30mA
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
Current - Test: 12 mA
Voltage - Test: 5 V
Voltage - Rated: 10 V
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
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995+0.53 EUR
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MMG3012NT1 MMG3012NT1.pdf
MMG3012NT1
Hersteller: NXP USA Inc.
Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Part Status: Obsolete
Supplier Device Package: SOT-89-4
Test Frequency: 900MHz
P1dB: 18.5dBm
Noise Figure: 3.8dB
Current - Supply: 82mA
Gain: 19dB
Voltage - Supply: 5V
RF Type: Cellular, PCS, PHS, WLL
Frequency: 0Hz ~ 6GHz
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC8349ECVVAJDB MPC8349EAEC.pdf
MPC8349ECVVAJDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Produkt ist nicht verfügbar
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SPC5602PEF0VLL6R MPC5602P.pdf
SPC5602PEF0VLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
Produkt ist nicht verfügbar
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MPC9456AC MPC9456.pdf
MPC9456AC
Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 1:10 250MHZ 32TQFP
Packaging: Tray
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution), Divider, Multiplexer
Input: LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 1:10
Differential - Input:Output: Yes/No
Supplier Device Package: 32-TQFP (7x7)
Part Status: Obsolete
Frequency - Max: 250 MHz
Produkt ist nicht verfügbar
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SSL5235TE/1518
SSL5235TE/1518
Hersteller: NXP USA Inc.
Description: 5 OHM/550 VOLT MAINS DIMMABLE BU
Packaging: Bulk
Part Status: Active
auf Bestellung 2500 Stücke:
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AnzahlPreis
579+0.83 EUR
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SSL5235BTE/1518
Hersteller: NXP USA Inc.
Description: 5 OHM/550 V MAINS
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SSL5235BTE/1Y
Hersteller: NXP USA Inc.
Description: IC LED DRIVER
Packaging: Bulk
Part Status: Active
auf Bestellung 7465 Stücke:
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628+0.79 EUR
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PCA9633D16,112 PCA9633.pdf
PCA9633D16,112
Hersteller: NXP USA Inc.
Description: IC LED DRIVER PS PWM 25MA 16SO
Number of Outputs: 4
Mounting Type: Surface Mount
Voltage - Output: 5.5V
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Part Status: Obsolete
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: PWM
Supplier Device Package: 16-SO
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Power Switch
Produkt ist nicht verfügbar
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PCA9633D16,118 PCA9633.pdf
PCA9633D16,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER PS PWM 25MA 16SO
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Power Switch
Number of Outputs: 4
Mounting Type: Surface Mount
Voltage - Output: 5.5V
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Part Status: Obsolete
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: I²C
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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FXPQ3115BVST1 FXPQ3115BV.pdf
FXPQ3115BVST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR I2C 8-TSON
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Output: 7 b
Operating Pressure: 2.9PSI ~ 15.95PSI (20kPa ~ 110kPa)
Pressure Type: Absolute
Accuracy: ±0.11PSI (±0.75kPa)
Operating Temperature: -40°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 1.95V ~ 3.6V
Applications: Medical Ventilation
Supplier Device Package: 8-LGA (3x5)
Port Style: No Port
Maximum Pressure: 72.52PSI (500kPa)
Part Status: Active
Produkt ist nicht verfügbar
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PCA9531PW118 PCA9531.pdf
PCA9531PW118
Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN DIM 25MA 16TSSOP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TWR-CM3120-EVM KTTWRCM3120UG.pdf
TWR-CM3120-EVM
Hersteller: NXP USA Inc.
Description: TOWER BOARD - CM3120 IO-LINK MA
Packaging: Bulk
Function: IO-Link
Type: Interface
Contents: Board(s)
Utilized IC / Part: CM3120
Platform: Freescale Tower System
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6QP7CVT8AB,557 IMX6DQPIEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32 BIT MPU, QUAD A
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6QP5EYM1AA557 IMX6DQPCEC.pdf
Hersteller: NXP USA Inc.
Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6Q4AVT08AC IMX6DQAEC.pdf
MCIMX6Q4AVT08AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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BTA330Y-800BT127 PHGL-S-A0001060295-1.pdf?t.download=true&u=5oefqw
BTA330Y-800BT127
Hersteller: NXP USA Inc.
Description: 3 QUADRANT TRIAC TO 220AB
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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S32G-VNP-GLDBOX3 S32G-VNP-GLDBOX3UG.pdf
S32G-VNP-GLDBOX3
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR S32G2
Contents: Board(s)
Part Status: Active
Embedded: Yes
Supplied Contents: Board(s)
Utilized IC / Part: S32G2, SJA1110, TJA1102-TJA1102S, TJA1043, TJA1463VR5510
Type: Reference Design
Function: Networking
Packaging: Box
auf Bestellung 1 Stücke:
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AnzahlPreis
1+5271.66 EUR
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MPC8541PXAPF MPC8541EEC.pdf
MPC8541PXAPF
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 833MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12GN32F0MLFR MC9S12GRMV1.pdf
S9S12GN32F0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: 12V1
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MRF6V3090NR1
MRF6V3090NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Current - Test: 350 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Obsolete
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 22dB
Power - Output: 18W
Frequency: 860MHz
Mounting Type: Surface Mount
Package / Case: TO-270AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LD6836CX4/25P,315 LD6836.pdf
LD6836CX4/25P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 300MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.16V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
auf Bestellung 17957 Stücke:
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AnzahlPreis
2664+0.18 EUR
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MK10DX64VLK7R K10P81M72SF1.pdf
MK10DX64VLK7R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80FQFP
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 56
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 31x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Produkt ist nicht verfügbar
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MCIMX6D7CZK08AD IMX6DQAEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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N74F02D,623 DS_568_74F02.pdf
N74F02D,623
Hersteller: NXP USA Inc.
Description: IC GATE NOR 4CH 2-INP 14-SO
Part Status: Active
Packaging: Bulk
auf Bestellung 13800 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2420+0.2 EUR
Mindestbestellmenge: 2420 Stücke
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SAF7751HN/N208W/SK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SAF7751HN/N208W/MP
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SPC5742PFK1AMLQ9557 MPC5744P.pdf
SPC5742PFK1AMLQ9557
Hersteller: NXP USA Inc.
Description: MPC574XP MICROCONTROLLER POWER A
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Produkt ist nicht verfügbar
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BZX79-C36143 BZX79.pdf
BZX79-C36143
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C36 - ZENER D
Part Status: Active
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 36 V
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Produkt ist nicht verfügbar
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S32G-VNP-RDB3 RMS32G-VNP-RDB3.pdf
S32G-VNP-RDB3
Hersteller: NXP USA Inc.
Description: VEHICLE NETWORKING REFERENCE DES
Part Status: Active
Utilized IC / Part: S32G3
Board Type: Single Board Computers (SBC)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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BF1108,215 PHGLS15576-1.pdf?t.download=true&u=5oefqw
BF1108,215
Hersteller: NXP USA Inc.
Description: BF1108 - SILICON RF SWITCHES
Packaging: Bulk
Part Status: Active
auf Bestellung 11230 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1082+0.49 EUR
Mindestbestellmenge: 1082 Stücke
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S912ZVC64AMKHR
S912ZVC64AMKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912ZVC64AMKH
S912ZVC64AMKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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S912ZVCA19AMKH
S912ZVCA19AMKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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S912ZVC12F0MKHR S12ZVCFS.pdf
S912ZVC12F0MKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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S912ZVC19F0MKH S12ZVCFS.pdf
S912ZVC19F0MKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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S912ZVC19F0MKHR S12ZVCFS.pdf
S912ZVC19F0MKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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S912ZVC12F0MKH S12ZVCFS.pdf
S912ZVC12F0MKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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N74F574D,623 74F573,4.pdf
N74F574D,623
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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N74F574D,623 74F573,4.pdf
N74F574D,623
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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N74F574D,623 74F573,4.pdf
N74F574D,623
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
auf Bestellung 8695 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1924+0.28 EUR
Mindestbestellmenge: 1924 Stücke
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N74F574D,602 74F573,4.pdf
N74F574D,602
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
auf Bestellung 4750 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1776+0.27 EUR
Mindestbestellmenge: 1776 Stücke
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SAF7751HV/N205/SCK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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