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SA56004AD,118 SA56004AD,118 NXP USA Inc. SA56004X.pdf Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Active
Produkt ist nicht verfügbar
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SA56004ED,118 SA56004ED,118 NXP USA Inc. SA56004X.pdf Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Active
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SA56004CD,112 SA56004CD,112 NXP USA Inc. SA56004X.pdf Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
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SA56004FD,112 SA56004FD,112 NXP USA Inc. SA56004X.pdf Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX253CJM4A MCIMX253CJM4A NXP USA Inc. IMX25CEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPI, SSI, SSP, UART
Part Status: Active
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MCIMX253DJM4 MCIMX253DJM4 NXP USA Inc. IMX25CEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
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MCIMX253CJM4 MCIMX253CJM4 NXP USA Inc. IMX25CEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX253CVM4 MCIMX253CVM4 NXP USA Inc. IMX25CEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
Produkt ist nicht verfügbar
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P3T1085UK-ARD P3T1085UK-ARD NXP USA Inc. UM11766.pdf Description: P3T1085UK ARD SHIELD EVAL BOARD
Packaging: Box
Function: Temperature
Type: Sensor
Contents: Board(s)
Utilized IC / Part: P3T1085UK
Part Status: Active
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P3T1085UKAZ NXP USA Inc. Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Features: Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA, WLCSP
Output Type: 2-Wire Serial, I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 6-WLCSP (1.18x.84)
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Active
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P3T1085UKZ P3T1085UKZ NXP USA Inc. P3T1085UK.pdf Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Features: Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA, WLCSP
Output Type: 2-Wire Serial, I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 6-WLCSP (1.18x.84)
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Active
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TDA8035HN/C1,151 TDA8035HN/C1,151 NXP USA Inc. TDA8035.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply: 1.8V, 3V, 5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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10+2.2 EUR
14+1.59 EUR
25+1.44 EUR
100+1.27 EUR
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TDA8035HN/C1,118 TDA8035HN/C1,118 NXP USA Inc. TDA8035.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply: 2.7V ~ 5.5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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25+1.45 EUR
100+1.29 EUR
250+1.2 EUR
500+1.15 EUR
1000+1.12 EUR
2500+1.07 EUR
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TDA8029HL/C207151 TDA8029HL/C207151 NXP USA Inc. Description: MICROCONTROLLER, 8 BIT, 8051 CPU
Packaging: Bulk
Part Status: Active
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TDA8023TT/C1 TDA8023TT/C1 NXP USA Inc. TDA8023.pdf Description: IC SMART CARD INTERFACE 28-TSSOP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NTSX2102TLH NTSX2102TLH NXP USA Inc. NTSX2102.pdf Description: IC XLTR VL BIDIR 8-XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 5.5 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTSX2102TLH NTSX2102TLH NXP USA Inc. NTSX2102.pdf Description: IC XLTR VL BIDIR 8-XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 5.5 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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16+1.36 EUR
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100+1.07 EUR
250+1 EUR
500+0.96 EUR
1000+0.94 EUR
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NTS0101GM,115 NTS0101GM,115 NXP USA Inc. NTS0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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NTS0101GM,115 NTS0101GM,115 NXP USA Inc. NTS0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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LPC2368FBD100,518 LPC2368FBD100,518 NXP USA Inc. LPC2364_65_66_67_68.pdf Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Supplier Device Package: 100-LQFP (14x14)
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM7TDMI-S
Data Converters: A/D 6x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 70
Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, SSP, UART/USART, USB
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TJA1021TK/20/S1Z TJA1021TK/20/S1Z NXP USA Inc. TJA1021.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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MPF5030BMDA0ES MPF5030BMDA0ES NXP USA Inc. PF5030_SDS.pdf Description: POWER MANAGEMENT IC, S32, NON-PR
Applications: System Basis Chip
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-PowerVFQFN
Packaging: Tray
Voltage - Supply: 3.3V ~ 5.25V
Part Status: Active
Supplier Device Package: 40-HVQFN (6x6)
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3+9.64 EUR
10+8.54 EUR
25+8.14 EUR
40+7.95 EUR
80+7.66 EUR
230+7.33 EUR
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DSC-MULTILINK DSC-MULTILINK NXP USA Inc. DSCMLTECHSUM.pdf Description: DSC MULTILINK
Packaging: Box
For Use With/Related Products: MCU
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Active
Utilized IC / Part: MCU
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PCA9411AUKZ PCA9411AUKZ NXP USA Inc. PCA9411.pdf Description: IC REG BOOST 5.25V 500MA 9WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Up
Current - Output: 500mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 3MHz
Voltage - Input (Max): 5.25V
Topology: Boost
Supplier Device Package: 9-WLCSP (1.24x1.24)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 5.25V
Part Status: Active
Produkt ist nicht verfügbar
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NX1WP10Z NXP USA Inc. NX1WP10_DS.pdf Description: IC WIRELESS PWR RECEIVER WLCSP42
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Wireless Power Receiver
Supplier Device Package: 42-WLCSP (3.56x3.41)
Part Status: Obsolete
Produkt ist nicht verfügbar
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BB131 NXP USA Inc. Description: VARIABLE CAPACITANCE DIODE, VERY
Capacitance Ratio: 16
Voltage - Peak Reverse (Max): 30 V
Part Status: Active
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C0.5/C28
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
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KW45B41Z82AFTBR KW45B41Z82AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
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KW45B41Z83AFPBT KW45B41Z83AFPBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
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KW45B41Z52AFTBT KW45B41Z52AFTBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
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KW45B41Z82AFTBT KW45B41Z82AFTBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
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KW45B41Z52AFPBT KW45B41Z52AFPBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
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KW45B41Z83AFTBR KW45B41Z83AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
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KW45B41Z83AFPBR KW45B41Z83AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Grade: Automotive
Qualification: AEC-Q100
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
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KW45B41Z82AFPBR KW45B41Z82AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
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KW45B41Z53AFTBR KW45B41Z53AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
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KW45B41Z53AFTBT KW45B41Z53AFTBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Packaging: Tray
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Qualification: AEC-Q100
Grade: Automotive
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
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KW45B41Z82AFPBT KW45B41Z82AFPBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Part Status: Active
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
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KW45B41Z83AFTBT KW45B41Z83AFTBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Packaging: Tray
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
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KW45B41Z52AFTBR KW45B41Z52AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Packaging: Tape & Reel (TR)
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
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KW45B41Z53AFPBT KW45B41Z53AFPBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Part Status: Active
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
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KW45B41Z-EVK KW45B41Z-EVK NXP USA Inc. KW45.pdf Description: KW45B41Z-EVK
Utilized IC / Part: KW45B41Z
Contents: Board(s)
Packaging: Bulk
Supplied Contents: Board(s)
Frequency: 2.4GHz
Part Status: Active
Type: Transceiver; Bluetooth® 5.x (BLE)
For Use With/Related Products: KW45B41Z
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MD7IC2755GNR1 MD7IC2755GNR1 NXP USA Inc. MD7IC2755N.pdf Description: IC RF AMP WIMAX 2.7GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 28V
Gain: 25dB
Current - Supply: 275mA
P1dB: 44.8dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-270 WB-14 GULL
Part Status: Obsolete
Produkt ist nicht verfügbar
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MK11DX128VMC5 MK11DX128VMC5 NXP USA Inc. KNTSK1XFMLYFS.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
Number of I/O: 64
Part Status: Obsolete
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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SP5748CBK0AVKU2R SP5748CBK0AVKU2R NXP USA Inc. Description: IC MCU 32BIT 6MB FLASH 176LQFP
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6L8DVN10AC MCIMX6L8DVN10AC NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tray
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
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MCIMX6L8DVN10ACR MCIMX6L8DVN10ACR NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tape & Reel (TR)
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MHT1005HSR3 NXP USA Inc. Description: IC LDMOS TRANS 120V NI-780S
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MHT1005HSR3 NXP USA Inc. Description: IC LDMOS TRANS 120V NI-780S
Packaging: Bulk
Part Status: Obsolete
auf Bestellung 1750 Stücke:
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TEF7094AHN/V205Y NXP USA Inc. Description: TEF7094AHN
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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BSC9131NJE1HHHB BSC9131NJE1HHHB NXP USA Inc. Description: IC MPU QORIQ 800MHZ 520FCBGA
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Box
Produkt ist nicht verfügbar
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MK10DX64VFM5 MK10DX64VFM5 NXP USA Inc. K10P32M50SF0.pdf Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SSL1523P/N2,112 SSL1523P/N2,112 NXP USA Inc. SSL152X.pdf Description: IC LED DRIVER OFFL 2A 8DIP
Part Status: Obsolete
Voltage - Supply (Max): 276V
Voltage - Supply (Min): 80V
Supplier Device Package: 8-DIP
Topology: Flyback
Internal Switch(s): Yes
Current - Output / Channel: 2A
Applications: Lighting
Operating Temperature: -40°C ~ 145°C (TJ)
Type: AC DC Offline Switcher
Frequency: 10kHz ~ 200kHz
Number of Outputs: 1
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Tube
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X-PLUTUS-FAMPC16 NXP USA Inc. Description: PLUTUS-FAMPC16
Part Status: Obsolete
Packaging: Bulk
Produkt ist nicht verfügbar
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SPC5746BK1AMMH2 SPC5746BK1AMMH2 NXP USA Inc. MPC5746C-Datasheet.pdf Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 384K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MC34904C3EK MC34904C3EK NXP USA Inc. MC34903%2C4%2C5.pdf Description: IC SWITCH HIGH SIDE
Part Status: Obsolete
Supplier Device Package: 32-SOIC-EP
Current - Supply: 2mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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MC68HC908JL8CP MC68HC908JL8CP NXP USA Inc. MC68HC908JL8.pdf Description: IC MCU 8BIT 8KB FLASH 28DIP
DigiKey Programmable: Not Verified
Number of I/O: 23
Part Status: Obsolete
Supplier Device Package: 28-PDIP
Peripherals: LED, LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 13x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Through Hole
Package / Case: 28-DIP (0.600", 15.24mm)
Packaging: Tube
Produkt ist nicht verfügbar
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BB131,115 BB131,115 NXP USA Inc. BB131.pdf Description: DIODE VARACTOR 30V SNGL SOD-323
Capacitance Ratio: 16.0
Voltage - Peak Reverse (Max): 30 V
Part Status: Obsolete
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C0.5/C28
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Tape & Reel (TR)
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BB131,115 BB131,115 NXP USA Inc. BB131.pdf Description: DIODE VARACTOR 30V SNGL SOD-323
Capacitance Ratio: 16.0
Voltage - Peak Reverse (Max): 30 V
Part Status: Obsolete
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C0.5/C28
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Cut Tape (CT)
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MC13851EPR2 MC13851EPR2 NXP USA Inc. MC13851.pdf Description: IC RF AMP GPS 1GHZ-2.5GHZ 8MLPD
Current - Supply: 4.8mA
Gain: 16.4dB
Voltage - Supply: 2.3V ~ 3V
RF Type: General Purpose
Frequency: 1GHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 8-MLPD (2x2)
Test Frequency: 2.14GHz
P1dB: 8dBm
Noise Figure: 1.1dB
Produkt ist nicht verfügbar
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FS32V234CON2VUB FS32V234CON2VUB NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Part Status: Active
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SA56004AD,118 SA56004X.pdf
SA56004AD,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Active
Produkt ist nicht verfügbar
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SA56004ED,118 SA56004X.pdf
SA56004ED,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Active
Produkt ist nicht verfügbar
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SA56004CD,112 SA56004X.pdf
SA56004CD,112
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
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SA56004FD,112 SA56004X.pdf
SA56004FD,112
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX253CJM4A IMX25CEC.pdf
MCIMX253CJM4A
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPI, SSI, SSP, UART
Part Status: Active
auf Bestellung 434 Stücke:
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1+51.23 EUR
10+41.28 EUR
25+38.81 EUR
100+36.07 EUR
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MCIMX253DJM4 IMX25CEC.pdf
MCIMX253DJM4
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX253CJM4 IMX25CEC.pdf
MCIMX253CJM4
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX253CVM4 IMX25CEC.pdf
MCIMX253CVM4
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
Produkt ist nicht verfügbar
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P3T1085UK-ARD UM11766.pdf
P3T1085UK-ARD
Hersteller: NXP USA Inc.
Description: P3T1085UK ARD SHIELD EVAL BOARD
Packaging: Box
Function: Temperature
Type: Sensor
Contents: Board(s)
Utilized IC / Part: P3T1085UK
Part Status: Active
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P3T1085UKAZ
Hersteller: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Features: Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA, WLCSP
Output Type: 2-Wire Serial, I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 6-WLCSP (1.18x.84)
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Active
Produkt ist nicht verfügbar
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P3T1085UKZ P3T1085UK.pdf
P3T1085UKZ
Hersteller: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Features: Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA, WLCSP
Output Type: 2-Wire Serial, I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 6-WLCSP (1.18x.84)
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Active
Produkt ist nicht verfügbar
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TDA8035HN/C1,151 TDA8035.pdf
TDA8035HN/C1,151
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply: 1.8V, 3V, 5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 160 Stücke:
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10+2.2 EUR
14+1.59 EUR
25+1.44 EUR
100+1.27 EUR
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TDA8035HN/C1,118 TDA8035.pdf
TDA8035HN/C1,118
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply: 2.7V ~ 5.5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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10+2.23 EUR
14+1.61 EUR
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100+1.29 EUR
250+1.2 EUR
500+1.15 EUR
1000+1.12 EUR
2500+1.07 EUR
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TDA8029HL/C207151
TDA8029HL/C207151
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, 8051 CPU
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TDA8023TT/C1 TDA8023.pdf
TDA8023TT/C1
Hersteller: NXP USA Inc.
Description: IC SMART CARD INTERFACE 28-TSSOP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NTSX2102TLH NTSX2102.pdf
NTSX2102TLH
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 5.5 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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4000+0.89 EUR
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NTSX2102TLH NTSX2102.pdf
NTSX2102TLH
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 5.5 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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12+1.87 EUR
16+1.36 EUR
25+1.23 EUR
100+1.07 EUR
250+1 EUR
500+0.96 EUR
1000+0.94 EUR
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NTS0101GM,115 NTS0101.pdf
NTS0101GM,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTS0101GM,115 NTS0101.pdf
NTS0101GM,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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LPC2368FBD100,518 LPC2364_65_66_67_68.pdf
LPC2368FBD100,518
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Supplier Device Package: 100-LQFP (14x14)
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM7TDMI-S
Data Converters: A/D 6x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 70
Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, SSP, UART/USART, USB
Produkt ist nicht verfügbar
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TJA1021TK/20/S1Z TJA1021.pdf
TJA1021TK/20/S1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5030BMDA0ES PF5030_SDS.pdf
MPF5030BMDA0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, S32, NON-PR
Applications: System Basis Chip
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-PowerVFQFN
Packaging: Tray
Voltage - Supply: 3.3V ~ 5.25V
Part Status: Active
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 420 Stücke:
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3+9.64 EUR
10+8.54 EUR
25+8.14 EUR
40+7.95 EUR
80+7.66 EUR
230+7.33 EUR
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DSC-MULTILINK DSCMLTECHSUM.pdf
DSC-MULTILINK
Hersteller: NXP USA Inc.
Description: DSC MULTILINK
Packaging: Box
For Use With/Related Products: MCU
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Active
Utilized IC / Part: MCU
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1+216.27 EUR
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PCA9411AUKZ PCA9411.pdf
PCA9411AUKZ
Hersteller: NXP USA Inc.
Description: IC REG BOOST 5.25V 500MA 9WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Up
Current - Output: 500mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 3MHz
Voltage - Input (Max): 5.25V
Topology: Boost
Supplier Device Package: 9-WLCSP (1.24x1.24)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 5.25V
Part Status: Active
Produkt ist nicht verfügbar
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NX1WP10Z NX1WP10_DS.pdf
Hersteller: NXP USA Inc.
Description: IC WIRELESS PWR RECEIVER WLCSP42
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Wireless Power Receiver
Supplier Device Package: 42-WLCSP (3.56x3.41)
Part Status: Obsolete
Produkt ist nicht verfügbar
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BB131
Hersteller: NXP USA Inc.
Description: VARIABLE CAPACITANCE DIODE, VERY
Capacitance Ratio: 16
Voltage - Peak Reverse (Max): 30 V
Part Status: Active
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C0.5/C28
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
auf Bestellung 547000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3572+0.3 EUR
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KW45B41Z82AFTBR KW45.pdf
KW45B41Z82AFTBR
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Produkt ist nicht verfügbar
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KW45B41Z83AFPBT KW45.pdf
KW45B41Z83AFPBT
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Produkt ist nicht verfügbar
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KW45B41Z52AFTBT KW45.pdf
KW45B41Z52AFTBT
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Produkt ist nicht verfügbar
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KW45B41Z82AFTBT KW45.pdf
KW45B41Z82AFTBT
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Produkt ist nicht verfügbar
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KW45B41Z52AFPBT KW45.pdf
KW45B41Z52AFPBT
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tray
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Produkt ist nicht verfügbar
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KW45B41Z83AFTBR KW45.pdf
KW45B41Z83AFTBR
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Produkt ist nicht verfügbar
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KW45B41Z83AFPBR KW45.pdf
KW45B41Z83AFPBR
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Grade: Automotive
Qualification: AEC-Q100
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Produkt ist nicht verfügbar
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KW45B41Z82AFPBR KW45.pdf
KW45B41Z82AFPBR
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Produkt ist nicht verfügbar
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KW45B41Z53AFTBR KW45.pdf
KW45B41Z53AFTBR
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Packaging: Tape & Reel (TR)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Produkt ist nicht verfügbar
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KW45B41Z53AFTBT KW45.pdf
KW45B41Z53AFTBT
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Packaging: Tray
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Qualification: AEC-Q100
Grade: Automotive
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Produkt ist nicht verfügbar
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KW45B41Z82AFPBT KW45.pdf
KW45B41Z82AFPBT
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Part Status: Active
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Produkt ist nicht verfügbar
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KW45B41Z83AFTBT KW45.pdf
KW45B41Z83AFTBT
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Packaging: Tray
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Produkt ist nicht verfügbar
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KW45B41Z52AFTBR KW45.pdf
KW45B41Z52AFTBR
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Part Status: Active
Packaging: Tape & Reel (TR)
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Grade: Automotive
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Produkt ist nicht verfügbar
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KW45B41Z53AFPBT KW45.pdf
KW45B41Z53AFPBT
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Part Status: Active
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: I2C, PWM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 40-HVQFN (6x6)
Data Rate (Max): 2Mbps
Protocol: Bluetooth v5.3
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.36GHz ~ 2.48GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Package / Case: 40-VFQFN Exposed Pad
Current - Transmitting: 4.6mA ~ 22.4mA
Current - Receiving: 4.1mA ~ 10.01mA
Produkt ist nicht verfügbar
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KW45B41Z-EVK KW45.pdf
KW45B41Z-EVK
Hersteller: NXP USA Inc.
Description: KW45B41Z-EVK
Utilized IC / Part: KW45B41Z
Contents: Board(s)
Packaging: Bulk
Supplied Contents: Board(s)
Frequency: 2.4GHz
Part Status: Active
Type: Transceiver; Bluetooth® 5.x (BLE)
For Use With/Related Products: KW45B41Z
auf Bestellung 1 Stücke:
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AnzahlPrivatkunde
1+282.03 EUR
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MD7IC2755GNR1 MD7IC2755N.pdf
MD7IC2755GNR1
Hersteller: NXP USA Inc.
Description: IC RF AMP WIMAX 2.7GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 28V
Gain: 25dB
Current - Supply: 275mA
P1dB: 44.8dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-270 WB-14 GULL
Part Status: Obsolete
Produkt ist nicht verfügbar
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MK11DX128VMC5 KNTSK1XFMLYFS.pdf
MK11DX128VMC5
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
Number of I/O: 64
Part Status: Obsolete
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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SP5748CBK0AVKU2R
SP5748CBK0AVKU2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6L8DVN10AC IMX6SLCEC.pdf
MCIMX6L8DVN10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tray
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Produkt ist nicht verfügbar
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MCIMX6L8DVN10ACR IMX6SLCEC.pdf
MCIMX6L8DVN10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MHT1005HSR3
Hersteller: NXP USA Inc.
Description: IC LDMOS TRANS 120V NI-780S
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MHT1005HSR3
Hersteller: NXP USA Inc.
Description: IC LDMOS TRANS 120V NI-780S
Packaging: Bulk
Part Status: Obsolete
auf Bestellung 1750 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
38+28.27 EUR
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TEF7094AHN/V205Y
Hersteller: NXP USA Inc.
Description: TEF7094AHN
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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BSC9131NJE1HHHB
BSC9131NJE1HHHB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Part Status: Obsolete
Security Features: Boot Security, Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 520-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 520-FBGA, FCBGA
Packaging: Box
Produkt ist nicht verfügbar
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MK10DX64VFM5 K10P32M50SF0.pdf
MK10DX64VFM5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SSL1523P/N2,112 SSL152X.pdf
SSL1523P/N2,112
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL 2A 8DIP
Part Status: Obsolete
Voltage - Supply (Max): 276V
Voltage - Supply (Min): 80V
Supplier Device Package: 8-DIP
Topology: Flyback
Internal Switch(s): Yes
Current - Output / Channel: 2A
Applications: Lighting
Operating Temperature: -40°C ~ 145°C (TJ)
Type: AC DC Offline Switcher
Frequency: 10kHz ~ 200kHz
Number of Outputs: 1
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Tube
auf Bestellung 11400 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
311+2.03 EUR
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X-PLUTUS-FAMPC16
Hersteller: NXP USA Inc.
Description: PLUTUS-FAMPC16
Part Status: Obsolete
Packaging: Bulk
Produkt ist nicht verfügbar
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SPC5746BK1AMMH2 MPC5746C-Datasheet.pdf
SPC5746BK1AMMH2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 384K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MC34904C3EK MC34903%2C4%2C5.pdf
MC34904C3EK
Hersteller: NXP USA Inc.
Description: IC SWITCH HIGH SIDE
Part Status: Obsolete
Supplier Device Package: 32-SOIC-EP
Current - Supply: 2mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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MC68HC908JL8CP MC68HC908JL8.pdf
MC68HC908JL8CP
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28DIP
DigiKey Programmable: Not Verified
Number of I/O: 23
Part Status: Obsolete
Supplier Device Package: 28-PDIP
Peripherals: LED, LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 13x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Through Hole
Package / Case: 28-DIP (0.600", 15.24mm)
Packaging: Tube
Produkt ist nicht verfügbar
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BB131,115 BB131.pdf
BB131,115
Hersteller: NXP USA Inc.
Description: DIODE VARACTOR 30V SNGL SOD-323
Capacitance Ratio: 16.0
Voltage - Peak Reverse (Max): 30 V
Part Status: Obsolete
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C0.5/C28
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BB131,115 BB131.pdf
BB131,115
Hersteller: NXP USA Inc.
Description: DIODE VARACTOR 30V SNGL SOD-323
Capacitance Ratio: 16.0
Voltage - Peak Reverse (Max): 30 V
Part Status: Obsolete
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C0.5/C28
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Cut Tape (CT)
auf Bestellung 13 Stücke:
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MC13851EPR2 MC13851.pdf
MC13851EPR2
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 1GHZ-2.5GHZ 8MLPD
Current - Supply: 4.8mA
Gain: 16.4dB
Voltage - Supply: 2.3V ~ 3V
RF Type: General Purpose
Frequency: 1GHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 8-MLPD (2x2)
Test Frequency: 2.14GHz
P1dB: 8dBm
Noise Figure: 1.1dB
Produkt ist nicht verfügbar
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FS32V234CON2VUB S32V234.pdf
FS32V234CON2VUB
Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Part Status: Active
auf Bestellung 679 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+131.7 EUR
10+114.7 EUR
25+114.19 EUR
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