Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36588) > Seite 444 nach 610
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
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K32WAM-001-T10 | NXP USA Inc. |
 Description: K32W041AM UPGRADE BOARDPackaging: Bulk For Use With/Related Products: K32W041AM Frequency: 2.4GHz Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE) Supplied Contents: Board(s) Part Status: Active Contents: Board(s) Utilized IC / Part: K32W041AM |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF54453CVP200 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360BGA Number of I/O: 132 Part Status: Active Supplier Device Package: 360-BGA (23x23) Peripherals: DMA, WDT Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Core Size: 32-Bit Core Processor: Coldfire V4 Program Memory Type: ROMless Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Speed: 200MHz Mounting Type: Surface Mount Package / Case: 360-BBGA Packaging: Tray DigiKey Programmable: Not Verified |
auf Bestellung 294 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K146UAT0VLLR | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 89 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: POR, PWM, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 24x12b SAR; D/A1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 128K x 8 Program Memory Size: 1MB (1M x 8) Speed: 112MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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LD6806CX4/13P,315 | NXP USA Inc. |
Description: IC REG LINEAR 1.3V 200MA 4-WLCSP Current - Supply (Max): 250 µA Protection Features: Over Current, Over Temperature PSRR: 55dB (1kHz) Control Features: Enable Voltage - Output (Min/Fixed): 1.3V Supplier Device Package: 4-WLCSP (0.76x0.76) Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 100 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 200mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: 4-XFBGA, WLCSP Packaging: Bulk Voltage Dropout (Max): 0.1V @ 200mA |
auf Bestellung 27000 Stücke: Lieferzeit 10-14 Tag (e) |
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| AFT26HW050GSR3-NXP | NXP USA Inc. |
Description: RF MOSFET Packaging: Bulk |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6836TD/29P,125 | NXP USA Inc. |
Description: IC REG LINEAR 2.9V 300MA 5TSOP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1818 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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LPC54607J256ET180551 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 180TFBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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LPC54606J256BD100551 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 64 Supplier Device Package: 100-LQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M4 EEPROM Size: 16K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 136K x 8 Program Memory Size: 256KB (256K x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| LPC54607J256ET180 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 180TFBGA Core Processor: ARM® Cortex®-M4 EEPROM Size: 16K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 136K x 8 Program Memory Size: 256KB (256K x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 180-TFBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 145 Part Status: Active Supplier Device Package: 180-TFBGA (12x12) Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Connectivity: I²C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b SAR |
auf Bestellung 1827 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54606J512BD208K | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 208LQFP Supplier Device Package: 208-LQFP (28x28) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 12x12b SAR Core Processor: ARM® Cortex®-M4 EEPROM Size: 16K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 200K x 8 Program Memory Size: 512KB (512K x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 208-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 171 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| M83261G13,557 | NXP USA Inc. | Description: C1K 650MHZ VOIP IC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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74ABT2244DB,112 | NXP USA Inc. |
Description: IC BUF NON-INVERT 5.5V 20SSOP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1518 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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74ABT2244DB,118 | NXP USA Inc. |
Description: IC BUF NON-INVERT 5.5V 20SSOP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
| 74HC221DB112 | NXP USA Inc. |
Description: IC MULTIVIBRATOR 19NS 16SSOP Voltage - Supply: 4.5 V ~ 5.5 V Part Status: Obsolete Supplier Device Package: 16-SSOP Schmitt Trigger Input: No Independent Circuits: 2 Propagation Delay: 23 ns Operating Temperature: -40°C ~ 125°C Logic Type: Monostable Mounting Type: Surface Mount Package / Case: 16-SSOP (0.209", 5.30mm Width) Packaging: Tube |
auf Bestellung 1992 Stücke: Lieferzeit 10-14 Tag (e) |
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| JN5179-001-M10 | NXP USA Inc. |
Description: ZIGBEE 3.0, ZIGBEE PRO, THREAD A |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 21 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
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EK-MPC5744P | NXP USA Inc. |
Description: ADVANCED AUTOMOTIVE ANALOG Utilized IC / Part: MPC5744P Core Processor: e200 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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CBTL04083ABS,558 | NXP USA Inc. |
Description: DIFFERENTIAL MULTIPLEXER, 4 FUNC Packaging: Bulk Part Status: Active |
auf Bestellung 286403 Stücke: Lieferzeit 10-14 Tag (e) |
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CBTL04083BBS | NXP USA Inc. |
Description: IC MUX/DEMUX 2:1 4CH 42HVQFN Packaging: Bulk Part Status: Active |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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| CBTL04083ABS | NXP USA Inc. |
Description: DIFFERENTIAL MULTIPLEXER, 4 FUNC Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| CBTL04GP043EX118 | NXP USA Inc. |
Description: DUAL 2 X 2 CROSSBAR SWITCH Part Status: Active Packaging: Bulk |
auf Bestellung 27200 Stücke: Lieferzeit 10-14 Tag (e) |
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| CBTL08GP053EV531 | NXP USA Inc. |
Description: CBTL08GP053- USB TYPE-C HIGH PER DigiKey Programmable: Not Verified Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| CBTL06GP213EE118 | NXP USA Inc. |
Description: 2ND GEN HIGH PERF HEX DP SWITCH/ Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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74LVT652DB,118 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 3.6V 24SSOP Supplier Device Package: 24-SSOP Current - Output High, Low: 32mA, 64mA Number of Bits per Element: 8 Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 24-SSOP (0.209", 5.30mm Width) Packaging: Bulk |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K118LIT0VLFR | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 43 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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FS32K118LIT0VLFT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 43 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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BUK7E07-55B,127 | NXP USA Inc. |
Description: MOSFET N-CH 55V 75A I2PAK Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V Drain to Source Voltage (Vdss): 55 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 10V Supplier Device Package: I2PAK Vgs(th) (Max) @ Id: 4V @ 1mA Power Dissipation (Max): 203W (Tc) Rds On (Max) @ Id, Vgs: 7.1mOhm @ 25A, 10V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Packaging: Tube Qualification: AEC-Q101 Grade: Automotive Part Status: Obsolete |
auf Bestellung 650 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV4052PW-Q100118 | NXP USA Inc. |
Description: DIFFERENTIAL MUX, 4 CHANNEL |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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S9S08DZ32F2MLFR | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 39 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x12b Core Processor: S08 EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Program Memory Size: 32KB (32K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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LD6805K/16P,115 | NXP USA Inc. |
Description: IC REG LIN 1.6V 150MA DFN1010C-4 Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 150mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: 4-UDFN Exposed Pad Packaging: Bulk Current - Supply (Max): 150 µA Protection Features: Over Current, Transient Voltage Voltage Dropout (Max): 0.25V @ 150mA PSRR: 75dB (1kHz) Part Status: Obsolete Control Features: Enable Voltage - Output (Min/Fixed): 1.6V Supplier Device Package: DFN1010C-4 Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 35 µA |
auf Bestellung 60000 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF54455CVP200 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360BGA DigiKey Programmable: Not Verified Number of I/O: 132 Part Status: Active Supplier Device Package: 360-BGA (23x23) Peripherals: DMA, WDT Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Core Size: 32-Bit Single-Core Core Processor: Coldfire V4 Program Memory Type: ROMless Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Speed: 200MHz Mounting Type: Surface Mount Package / Case: 360-BBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MFS8631BMBA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-QFN (7x7) Applications: Camera Voltage - Supply: 4.5V ~ 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
| SAF3560EL/V1100K | NXP USA Inc. | Description: IC DGTL HD RADIO PROCESSOR 170LB |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| BUK9675-100A118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK9675-100A - POWE |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 834 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
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SPC5644CK0VLU8 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP DigiKey Programmable: Not Verified Number of I/O: 147 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 27x10b, 5x12b Core Processor: e200z4d, e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 192K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 80MHz/120MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SPC5644CK0VLU8R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Core Size: 32-Bit Dual-Core Data Converters: A/D 27x10b, 5x12b Core Processor: e200z4d, e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 192K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 80MHz/120MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 147 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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P5020NXE7QMB | NXP USA Inc. |
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA Part Status: Obsolete SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Co-Processors/DSP: Security; SEC 4.2 Number of Cores/Bus Width: 2 Core, 64-Bit USB: USB 2.0 + PHY (2) Ethernet: 1Gbps (5), 10Gbps (1) Supplier Device Package: 1295-FCPBGA (37.5x37.5) Core Processor: PowerPC e5500 Operating Temperature: -40°C ~ 105°C (TA) Speed: 2.0GHz Mounting Type: Surface Mount Package / Case: 1295-BBGA, FCBGA Packaging: Bulk |
auf Bestellung 105 Stücke: Lieferzeit 10-14 Tag (e) |
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P5020NXE7QMB | NXP USA Inc. |
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA Part Status: Obsolete SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Co-Processors/DSP: Security; SEC 4.2 Number of Cores/Bus Width: 2 Core, 64-Bit USB: USB 2.0 + PHY (2) Ethernet: 1Gbps (5), 10Gbps (1) Supplier Device Package: 1295-FCPBGA (37.5x37.5) Core Processor: PowerPC e5500 Operating Temperature: -40°C ~ 105°C (TA) Speed: 2.0GHz Mounting Type: Surface Mount Package / Case: 1295-BBGA, FCBGA Packaging: Bulk |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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MC07XS6517BEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Supplier Device Package: 54-HSOP Ratio - Input:Output: 1:1 Current - Output (Max): 5.5A, 11A Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Voltage - Load: 7V ~ 18V Rds On (Typ): 7mOhm, 17mOhm Output Configuration: High Side Operating Temperature: -40°C ~ 125°C (TA) Switch Type: General Purpose Interface: SPI Number of Outputs: 6 Mounting Type: Surface Mount Output Type: N-Channel Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Features: Internal PWM Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| LS2084ASE7QQB | NXP USA Inc. |
Description: IC MPU QORIQ 1.6GHZ 1292FCPBGA RAM Controllers: DDR4 Number of Cores/Bus Width: 8 Core, 64-Bit USB: USB 3.0 + PHY (2) Ethernet: 10GbE (8), 2.5GbE (16) Supplier Device Package: 1292-FCPBGA (37.5x37.5) Core Processor: ARM® Cortex®-A72 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.6GHz Mounting Type: Surface Mount Package / Case: 1292-BBGA, FCBGA Packaging: Tray Part Status: Active SATA: SATA (2) Security Features: Secure Boot, TrustZone® |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 21 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
| PCAL9538ABS128 | NXP USA Inc. |
Description: IC I/O EXPANDER 8BIT 16HVQFN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 386 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
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S9S08DZ32F2MLH | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64LQFP Package / Case: 64-LQFP Packaging: Bulk Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 24x12b Core Processor: S08 EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Program Memory Size: 32KB (32K x 8) Speed: 40MHz Mounting Type: Surface Mount DigiKey Programmable: Not Verified Number of I/O: 53 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT |
auf Bestellung 1022 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT1G02GV-Q100125 | NXP USA Inc. |
Description: IC GATE NOR 1CH 2-INP SC74A Input Logic Level - High: 2V Supplier Device Package: 5-TSOP Number of Inputs: 2 Current - Output High, Low: 2mA, 2mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C Logic Type: NOR Gate Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Packaging: Bulk Current - Quiescent (Max): 20 µA Number of Circuits: 1 Part Status: Active Max Propagation Delay @ V, Max CL: 11ns @ 4.5V, 50pF Input Logic Level - Low: 0.8V |
auf Bestellung 5900 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6805K/29P,115 | NXP USA Inc. |
Description: IC REG LIN 2.9V 150MA DFN1010C-4 Current - Supply (Max): 150 µA Protection Features: Over Current, Transient Voltage Voltage Dropout (Max): 0.25V @ 150mA PSRR: 75dB (1kHz) Part Status: Obsolete Control Features: Enable Voltage - Output (Min/Fixed): 2.9V Supplier Device Package: DFN1010C-4 Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 35 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 150mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: 4-UDFN Exposed Pad Packaging: Bulk |
auf Bestellung 40000 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX27VJP4A | NXP USA Inc. |
Description: IC MPU I.MX27 400MHZ 404LFBGA Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: DDR Co-Processors/DSP: Security; SAHARAH2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (3) Ethernet: 10/100Mbps (1) Supplier Device Package: 404-LFBGA (17x17) Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V Core Processor: ARM926EJ-S Operating Temperature: -20°C ~ 85°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 404-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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CBTU04082BS,518 | NXP USA Inc. |
Description: IC MUX 4 X 2:1 42HVQFN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
| 74LVT16244BBX,518 | NXP USA Inc. |
Description: IC BUFF NON-INVERT 3.6V 60HXQFN Part Status: Active Supplier Device Package: 60-HXQFN (4x6) Current - Output High, Low: 32mA, 64mA Number of Bits per Element: 4 Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 4 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 60-XFQFN Dual Rows, Exposed Pad Packaging: Bulk |
auf Bestellung 4900 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8544VJAQGA | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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BZX84-B4V3/LF1R | NXP USA Inc. |
Description: DIODE ZENER 4.3V 250MW SOT23 Current - Reverse Leakage @ Vr: 3 µA @ 1 V Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Qualification: AEC-Q101 Grade: Automotive Power - Max: 250 mW Part Status: Active Supplier Device Package: SOT-23 (TO-236AB) Impedance (Max) (Zzt): 90 Ohms Voltage - Zener (Nom) (Vz): 4.3 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Tolerance: ±2% Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
 |
MC9S08QD2VSCR | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 8SOIC Number of I/O: 4 Part Status: Active Supplier Device Package: 8-SOIC Peripherals: LVD, POR, PWM, WDT Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 128 x 8 Program Memory Size: 2KB (2K x 8) Speed: 16MHz Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
 |
MC68LC302AF16CT | NXP USA Inc. |
Description: IC MPU M683XX 16MHZ 100LQFP Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 8/16-Bit Supplier Device Package: 100-LQFP (14x14) Voltage - I/O: 5.0V Core Processor: M68000 Operating Temperature: 0°C ~ 70°C (TA) Speed: 16MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Bulk |
auf Bestellung 55 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74LVC1G57GS132 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC1G57GS LOGIC C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| IP3254CZ16-8TTL | NXP USA Inc. |
Description: 8-CH PASSIVE EMI-FILTER NETWORK Packaging: Bulk |
auf Bestellung 1430 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5645BK0VLT1R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 208TQFP DigiKey Programmable: Not Verified Number of I/O: 177 Supplier Device Package: 208-TQFP (28x28) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 33x10b, 10x12b Core Processor: e200z4d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 160K x 8 Program Memory Size: 2MB (2M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 208-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 180 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
 |
S9KEAZN8AVFKR | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 24QFN DigiKey Programmable: Not Verified Number of I/O: 22 Supplier Device Package: 24-QFN (4x4) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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|
S9KEAZN8AVFK | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 24QFN Connectivity: I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 22 Supplier Device Package: 24-QFN (4x4) Peripherals: LVD, POR, PWM, WDT |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
 |
S9S08RN60W1MLF | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MIMX8MN1CVPIZAA | NXP USA Inc. |
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA Packaging: Tray Package / Case: 306-TFBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Supplier Device Package: 306-TFBGA (11x11) Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART |
auf Bestellung 43 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK7618-55/C,118 | NXP USA Inc. |
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL Part Status: Active Packaging: Bulk |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCT2202UK012 | NXP USA Inc. |
Description: DIGITAL TEMPERATURE SENSOR Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
 |
KIT-TPLSNIFEVB | NXP USA Inc. |
Description: TRANSFORMER PHYSICAL LAYER SNIFF Packaging: Box For Use With/Related Products: Logic Analyzer Accessory Type: Interface Board Part Status: Active Utilized IC / Part: Logic Analyzer |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
| K32WAM-001-T10 |
|
Hersteller: NXP USA Inc.
Description: K32W041AM UPGRADE BOARD
Packaging: Bulk
For Use With/Related Products: K32W041AM
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: K32W041AM
Description: K32W041AM UPGRADE BOARD
Packaging: Bulk
For Use With/Related Products: K32W041AM
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: K32W041AM
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 77.28 EUR |
| MCF54453CVP200 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Number of I/O: 132
Part Status: Active
Supplier Device Package: 360-BGA (23x23)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Core Size: 32-Bit
Core Processor: Coldfire V4
Program Memory Type: ROMless
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360BGA
Number of I/O: 132
Part Status: Active
Supplier Device Package: 360-BGA (23x23)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Core Size: 32-Bit
Core Processor: Coldfire V4
Program Memory Type: ROMless
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 294 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 59.36 EUR |
| 10+ | 48.37 EUR |
| 25+ | 45.62 EUR |
| 100+ | 43.73 EUR |
| FS32K146UAT0VLLR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 1MB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LD6806CX4/13P,315 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.3V 200MA 4-WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
Voltage Dropout (Max): 0.1V @ 200mA
Description: IC REG LINEAR 1.3V 200MA 4-WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
Voltage Dropout (Max): 0.1V @ 200mA
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3328+ | 0.18 EUR |
| AFT26HW050GSR3-NXP |
|
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 229.35 EUR |
| LD6836TD/29P,125 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.9V 300MA 5TSOP
Description: IC REG LINEAR 2.9V 300MA 5TSOP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1818 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC54607J256ET180551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC54606J256BD100551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Bulk
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC54607J256ET180 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 145
Part Status: Active
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b SAR
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 145
Part Status: Active
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b SAR
auf Bestellung 1827 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 32+ | 32.84 EUR |
| LPC54606J512BD208K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 200K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 171
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 200K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 171
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| M83261G13,557 |
Hersteller: NXP USA Inc.
Description: C1K 650MHZ VOIP IC
Description: C1K 650MHZ VOIP IC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74ABT2244DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20SSOP
Description: IC BUF NON-INVERT 5.5V 20SSOP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1518 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74ABT2244DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20SSOP
Description: IC BUF NON-INVERT 5.5V 20SSOP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74HC221DB112 |
Hersteller: NXP USA Inc.
Description: IC MULTIVIBRATOR 19NS 16SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Part Status: Obsolete
Supplier Device Package: 16-SSOP
Schmitt Trigger Input: No
Independent Circuits: 2
Propagation Delay: 23 ns
Operating Temperature: -40°C ~ 125°C
Logic Type: Monostable
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Description: IC MULTIVIBRATOR 19NS 16SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Part Status: Obsolete
Supplier Device Package: 16-SSOP
Schmitt Trigger Input: No
Independent Circuits: 2
Propagation Delay: 23 ns
Operating Temperature: -40°C ~ 125°C
Logic Type: Monostable
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
auf Bestellung 1992 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 424+ | 2.48 EUR |
| JN5179-001-M10 |
|
Hersteller: NXP USA Inc.
Description: ZIGBEE 3.0, ZIGBEE PRO, THREAD A
Description: ZIGBEE 3.0, ZIGBEE PRO, THREAD A
Produkt ist nicht verfügbar
Mindestbestellmenge: 21 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| EK-MPC5744P |
|
Hersteller: NXP USA Inc.
Description: ADVANCED AUTOMOTIVE ANALOG
Utilized IC / Part: MPC5744P
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: ADVANCED AUTOMOTIVE ANALOG
Utilized IC / Part: MPC5744P
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CBTL04083ABS,558 |
|
Hersteller: NXP USA Inc.
Description: DIFFERENTIAL MULTIPLEXER, 4 FUNC
Packaging: Bulk
Part Status: Active
Description: DIFFERENTIAL MULTIPLEXER, 4 FUNC
Packaging: Bulk
Part Status: Active
auf Bestellung 286403 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 259+ | 2.43 EUR |
| CBTL04083BBS |
|
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 259+ | 2.43 EUR |
| CBTL04083ABS |
|
Hersteller: NXP USA Inc.
Description: DIFFERENTIAL MULTIPLEXER, 4 FUNC
Packaging: Bulk
Part Status: Active
Description: DIFFERENTIAL MULTIPLEXER, 4 FUNC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CBTL04GP043EX118 |
|
auf Bestellung 27200 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 292+ | 2.15 EUR |
| CBTL08GP053EV531 |
|
Hersteller: NXP USA Inc.
Description: CBTL08GP053- USB TYPE-C HIGH PER
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Description: CBTL08GP053- USB TYPE-C HIGH PER
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVT652DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 24SSOP
Supplier Device Package: 24-SSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Description: IC TXRX NON-INVERT 3.6V 24SSOP
Supplier Device Package: 24-SSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 307+ | 1.9 EUR |
| FS32K118LIT0VLFR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| FS32K118LIT0VLFT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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| BUK7E07-55B,127 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A I2PAK
Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 203W (Tc)
Rds On (Max) @ Id, Vgs: 7.1mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
Qualification: AEC-Q101
Grade: Automotive
Part Status: Obsolete
Description: MOSFET N-CH 55V 75A I2PAK
Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 203W (Tc)
Rds On (Max) @ Id, Vgs: 7.1mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
Qualification: AEC-Q101
Grade: Automotive
Part Status: Obsolete
auf Bestellung 650 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 314+ | 1.93 EUR |
| 74LV4052PW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: DIFFERENTIAL MUX, 4 CHANNEL
Description: DIFFERENTIAL MUX, 4 CHANNEL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S08DZ32F2MLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 8BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| LD6805K/16P,115 |
|
Hersteller: NXP USA Inc.
Description: IC REG LIN 1.6V 150MA DFN1010C-4
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.6V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Description: IC REG LIN 1.6V 150MA DFN1010C-4
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.6V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2959+ | 0.19 EUR |
| MCF54455CVP200 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
DigiKey Programmable: Not Verified
Number of I/O: 132
Part Status: Active
Supplier Device Package: 360-BGA (23x23)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V4
Program Memory Type: ROMless
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 360BGA
DigiKey Programmable: Not Verified
Number of I/O: 132
Part Status: Active
Supplier Device Package: 360-BGA (23x23)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V4
Program Memory Type: ROMless
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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| MFS8631BMBA0ES |
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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| SAF3560EL/V1100K |
Hersteller: NXP USA Inc.
Description: IC DGTL HD RADIO PROCESSOR 170LB
Description: IC DGTL HD RADIO PROCESSOR 170LB
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BUK9675-100A118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK9675-100A - POWE
Description: NOW NEXPERIA BUK9675-100A - POWE
Produkt ist nicht verfügbar
Mindestbestellmenge: 834 Stücke
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| SPC5644CK0VLU8 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d, e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d, e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| SPC5644CK0VLU8R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Core Size: 32-Bit Dual-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d, e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Core Size: 32-Bit Dual-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d, e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| P5020NXE7QMB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 2.0GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Bulk
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 2.0GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Bulk
auf Bestellung 105 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 1151.92 EUR |
| P5020NXE7QMB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 2.0GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Bulk
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 2.0GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Bulk
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1275.55 EUR |
| MC07XS6517BEKR2 |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 54-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 5.5A, 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 7mOhm, 17mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM
Packaging: Cut Tape (CT)
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 54-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 5.5A, 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 7mOhm, 17mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LS2084ASE7QQB |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1292FCPBGA
RAM Controllers: DDR4
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (8), 2.5GbE (16)
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 1292-BBGA, FCBGA
Packaging: Tray
Part Status: Active
SATA: SATA (2)
Security Features: Secure Boot, TrustZone®
Description: IC MPU QORIQ 1.6GHZ 1292FCPBGA
RAM Controllers: DDR4
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (8), 2.5GbE (16)
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 1292-BBGA, FCBGA
Packaging: Tray
Part Status: Active
SATA: SATA (2)
Security Features: Secure Boot, TrustZone®
Produkt ist nicht verfügbar
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| PCAL9538ABS128 |
|
Hersteller: NXP USA Inc.
Description: IC I/O EXPANDER 8BIT 16HVQFN
Description: IC I/O EXPANDER 8BIT 16HVQFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 386 Stücke
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| S9S08DZ32F2MLH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Package / Case: 64-LQFP
Packaging: Bulk
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Package / Case: 64-LQFP
Packaging: Bulk
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
auf Bestellung 1022 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 43+ | 13.93 EUR |
| 74HCT1G02GV-Q100125 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NOR 1CH 2-INP SC74A
Input Logic Level - High: 2V
Supplier Device Package: 5-TSOP
Number of Inputs: 2
Current - Output High, Low: 2mA, 2mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Packaging: Bulk
Current - Quiescent (Max): 20 µA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 11ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Description: IC GATE NOR 1CH 2-INP SC74A
Input Logic Level - High: 2V
Supplier Device Package: 5-TSOP
Number of Inputs: 2
Current - Output High, Low: 2mA, 2mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Packaging: Bulk
Current - Quiescent (Max): 20 µA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 11ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
auf Bestellung 5900 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5900+ | 0.13 EUR |
| LD6805K/29P,115 |
|
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.9V 150MA DFN1010C-4
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.9V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Description: IC REG LIN 2.9V 150MA DFN1010C-4
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.9V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
auf Bestellung 40000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2959+ | 0.21 EUR |
| MCIMX27VJP4A |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 404LFBGA
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: DDR
Co-Processors/DSP: Security; SAHARAH2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 404-LFBGA (17x17)
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Core Processor: ARM926EJ-S
Operating Temperature: -20°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 404-LFBGA
Packaging: Tray
Description: IC MPU I.MX27 400MHZ 404LFBGA
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: DDR
Co-Processors/DSP: Security; SAHARAH2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 404-LFBGA (17x17)
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Core Processor: ARM926EJ-S
Operating Temperature: -20°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 404-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
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| CBTU04082BS,518 |
|
Hersteller: NXP USA Inc.
Description: IC MUX 4 X 2:1 42HVQFN
Description: IC MUX 4 X 2:1 42HVQFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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Stück im Wert von UAH
| 74LVT16244BBX,518 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 60HXQFN
Part Status: Active
Supplier Device Package: 60-HXQFN (4x6)
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 4
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Packaging: Bulk
Description: IC BUFF NON-INVERT 3.6V 60HXQFN
Part Status: Active
Supplier Device Package: 60-HXQFN (4x6)
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 4
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Packaging: Bulk
auf Bestellung 4900 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 833+ | 0.7 EUR |
| MPC8544VJAQGA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-B4V3/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.3V 250MW SOT23
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Qualification: AEC-Q101
Grade: Automotive
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 4.3 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Description: DIODE ZENER 4.3V 250MW SOT23
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Qualification: AEC-Q101
Grade: Automotive
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 4.3 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08QD2VSCR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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| MC68LC302AF16CT |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 100LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 100-LQFP (14x14)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Bulk
Description: IC MPU M683XX 16MHZ 100LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 100-LQFP (14x14)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Bulk
auf Bestellung 55 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 68.79 EUR |
| 74LVC1G57GS132 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G57GS LOGIC C
Description: NOW NEXPERIA 74LVC1G57GS LOGIC C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IP3254CZ16-8TTL |
|
auf Bestellung 1430 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1430+ | 0.4 EUR |
| SPC5645BK0VLT1R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 177
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 33x10b, 10x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 160K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 2MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 177
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 33x10b, 10x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 160K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 180 Stücke
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| S9KEAZN8AVFKR |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 8KB FLASH 24QFN
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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| S9KEAZN8AVFK |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: LVD, POR, PWM, WDT
Description: IC MCU 32BIT 8KB FLASH 24QFN
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: LVD, POR, PWM, WDT
Produkt ist nicht verfügbar
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| S9S08RN60W1MLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
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| MIMX8MN1CVPIZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 47.84 EUR |
| 10+ | 38.41 EUR |
| 25+ | 36.07 EUR |
| BUK7618-55/C,118 |
|
Hersteller: NXP USA Inc.
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL
Part Status: Active
Packaging: Bulk
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL
Part Status: Active
Packaging: Bulk
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 468+ | 1.29 EUR |
| KIT-TPLSNIFEVB |
|
Hersteller: NXP USA Inc.
Description: TRANSFORMER PHYSICAL LAYER SNIFF
Packaging: Box
For Use With/Related Products: Logic Analyzer
Accessory Type: Interface Board
Part Status: Active
Utilized IC / Part: Logic Analyzer
Description: TRANSFORMER PHYSICAL LAYER SNIFF
Packaging: Box
For Use With/Related Products: Logic Analyzer
Accessory Type: Interface Board
Part Status: Active
Utilized IC / Part: Logic Analyzer
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 430.59 EUR |