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PTN38003AEWY PTN38003AEWY NXP USA Inc. PTN38003A.pdf Description: IC USB-C 3.2 / DP1.4 REDRIVER
auf Bestellung 6898 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.43 EUR
10+ 8.48 EUR
25+ 8.02 EUR
100+ 6.95 EUR
250+ 6.59 EUR
500+ 5.92 EUR
1000+ 5.64 EUR
Mindestbestellmenge: 2
TJA1441AT/0Z TJA1441AT/0Z NXP USA Inc. TJA1441.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
auf Bestellung 183 Stücke:
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7+2.6 EUR
10+ 2.33 EUR
25+ 2.21 EUR
100+ 1.81 EUR
Mindestbestellmenge: 7
BLF8G10LS-270,112 BLF8G10LS-270,112 NXP USA Inc. PHGLS25261-1.pdf?t.download=true&u=5oefqw Description: RF PFET, 1-ELEMENT, ULTRA HIGH F
Packaging: Tube
Package / Case: SOT-502B
Current Rating (Amps): 4.2µA
Mounting Type: Chassis Mount
Frequency: 820MHz ~ 960MHz
Power - Output: 270W
Gain: 18.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 2 A
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)
4+124.82 EUR
Mindestbestellmenge: 4
MK28FN2M0CAU15R NXP USA Inc. K28P210M150SF5.pdf Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 210-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: 210-WLCSP (6.94x6.94)
Part Status: Active
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BZX84-C4V7/LF1R BZX84-C4V7/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 4.7V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Produkt ist nicht verfügbar
BZX84-C4V7/LF1VL BZX84-C4V7/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 4.7V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Produkt ist nicht verfügbar
PEMI1QFN/LT,315 PEMI1QFN/LT,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/23PF SMD
Packaging: Cut Tape (CT)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 1
Produkt ist nicht verfügbar
PEMI1QFN/LT,315 PEMI1QFN/LT,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/23PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 1
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
3806+0.14 EUR
Mindestbestellmenge: 3806
LPC4325JBD144551 LPC4325JBD144551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
LPC4322JBD144551 LPC4322JBD144551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
NTM88H065T1 NTM88H065T1 NXP USA Inc. Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
NTM88H065T1 NTM88H065T1 NXP USA Inc. Description: IC PRESSURE SENSOR 24HQFN
Packaging: Cut Tape (CT)
Part Status: Obsolete
auf Bestellung 1847 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.7 EUR
5+ 12.97 EUR
10+ 11.46 EUR
25+ 9.3 EUR
50+ 8.22 EUR
100+ 8 EUR
500+ 6.7 EUR
1000+ 6.27 EUR
Mindestbestellmenge: 2
BC53-10PA,115 BC53-10PA,115 NXP USA Inc. PHGLS29384-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BC53-10PA - SMALL S
auf Bestellung 33000 Stücke:
Lieferzeit 10-14 Tag (e)
SPC5603BAMLL4R SPC5603BAMLL4R NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 100LQFP
Produkt ist nicht verfügbar
S9S12P64J0MFTR NXP USA Inc. MC9S12P128RMV1.pdf Description: IC MCU 16BIT 64KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: CPU12V1
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPC8314EVRAFDA MPC8314EVRAFDA NXP USA Inc. MPC8314EEC.pdf Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
6+87.63 EUR
Mindestbestellmenge: 6
S912XEG384BMAL S912XEG384BMAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K142MAT0MLHT FS32K142MAT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5746CHK1AVKU6 SPC5746CHK1AVKU6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
SAF3560EL/V1100Y NXP USA Inc. Description: IC DGTL HD RADIO PROCESSOR 170LB
Produkt ist nicht verfügbar
MRFE6VP6600NR3,528 NXP USA Inc. MRFE6VP6600N.pdf Description: WIDEBAND RF POWER LDMOS TRANSIST
Produkt ist nicht verfügbar
BUK9K89-100E115 NXP USA Inc. BUK9K89-100E.pdf Description: NOW NEXPERIA BUK9K89-100E - POWE
Packaging: Bulk
Produkt ist nicht verfügbar
K32W041AZ K32W041AZ NXP USA Inc. K32W041AM.pdf Description: IC MCU K32W041 +15DBM 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+5.79 EUR
Mindestbestellmenge: 1000
K32W041AZ K32W041AZ NXP USA Inc. K32W041AM.pdf Description: IC MCU K32W041 +15DBM 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 1890 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.28 EUR
10+ 9.43 EUR
25+ 8.57 EUR
100+ 7.72 EUR
250+ 7.07 EUR
500+ 6.43 EUR
Mindestbestellmenge: 2
BZX84-C36/LF1R BZX84-C36/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 36V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
BZX84-C36/LF1VL BZX84-C36/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 36V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
PSMN7R6-60XSQ PSMN7R6-60XSQ NXP USA Inc. Description: MOSFET N-CH 60V 51.5A TO220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 51.5A (Tc)
Rds On (Max) @ Id, Vgs: 7.8mOhm @ 25A, 10V
Power Dissipation (Max): 46W (Tc)
Vgs(th) (Max) @ Id: 4.6V @ 1mA
Supplier Device Package: TO-220F
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 38.7 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2651 pF @ 30 V
auf Bestellung 685 Stücke:
Lieferzeit 10-14 Tag (e)
685+0.81 EUR
Mindestbestellmenge: 685
MCZ33903DS5EK MCZ33903DS5EK NXP USA Inc. MC33903-MC33904-MC33905.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Part Status: Active
Produkt ist nicht verfügbar
NHS3100UK/A1Z NHS3100UK/A1Z NXP USA Inc. NHS3100.pdf Description: IC RFID READER 13.56MHZ 25WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 25-WLCSP (2.51x2.51)
Part Status: Active
Produkt ist nicht verfügbar
NHS3100UK/A1Z NHS3100UK/A1Z NXP USA Inc. NHS3100.pdf Description: IC RFID READER 13.56MHZ 25WLCSP
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 25-WLCSP (2.51x2.51)
Part Status: Active
Produkt ist nicht verfügbar
NHS3100UK/A1Z NHS3100UK/A1Z NXP USA Inc. NHS3100.pdf Description: IC RFID READER 13.56MHZ 25WLCSP
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 25-WLCSP (2.51x2.51)
Part Status: Active
auf Bestellung 11835 Stücke:
Lieferzeit 10-14 Tag (e)
115+4.59 EUR
Mindestbestellmenge: 115
BCW30235 BCW30235 NXP USA Inc. BCW29_BCW30.pdf Description: NOW NEXPERIA BCW30 - SMALL SIGNA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
KITFS5600FRDMEVM NXP USA Inc. UM11526.pdf Description: FS56 EVAL KIT FRDM
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+843.32 EUR
PCA9564D,112 PCA9564D,112 NXP USA Inc. PCA9564.pdf Description: IC CONTROLLER PARALLEL INTERFACE
auf Bestellung 75396 Stücke:
Lieferzeit 10-14 Tag (e)
PCA9564D,118 PCA9564D,118 NXP USA Inc. PCA9564.pdf Description: IC CONTROLLER PARALLEL INTERFACE
auf Bestellung 5459 Stücke:
Lieferzeit 10-14 Tag (e)
IP3348CX10,135 IP3348CX10,135 NXP USA Inc. IP3348CX5,10,15,20.pdf Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Bulk
Package / Case: 10-UFBGA, WLCSP
Size / Dimension: 0.064" L x 0.042" W (1.56mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
Current: 20 mA
auf Bestellung 355500 Stücke:
Lieferzeit 10-14 Tag (e)
4121+0.12 EUR
Mindestbestellmenge: 4121
MK28FN2M0ACAU15R NXP USA Inc. K28P210M150SF5.pdf Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Produkt ist nicht verfügbar
FS32K144ULT0VLLR FS32K144ULT0VLLR NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MVR5510AVMAHEPR2 MVR5510AVMAHEPR2 NXP USA Inc. Description: IC PMIC VR5510 QM
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Produkt ist nicht verfügbar
RDDRONE-CUPK64 NXP USA Inc. Description: NXP CUP DRONE MAINBOARD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K64
Platform: Mikroe NXP Cup Mainboard
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
1+262.63 EUR
SPC5746CBK1AMMJ6 SPC5746CBK1AMMJ6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC22XS4200CEKR2 MC22XS4200CEKR2 NXP USA Inc. MC22XS4200.pdf Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Packaging: Cut Tape (CT)
Features: Internal PWM, Slew Rate Controlled
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 22mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
FS32K142HAT0MLHR FS32K142HAT0MLHR NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LD6816CX4/25H,315 LD6816CX4/25H,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 2.5V 150MA 4WLCSP
Packaging: Cut Tape (CT)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
LD6816CX4/25H,315 LD6816CX4/25H,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 2.5V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 17999 Stücke:
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3328+0.15 EUR
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OT413127 OT413127 NXP USA Inc. Description: OT413 - TBC - TO 220AB
Packaging: Bulk
Part Status: Active
auf Bestellung 671 Stücke:
Lieferzeit 10-14 Tag (e)
671+0.92 EUR
Mindestbestellmenge: 671
OT418115 OT418115 NXP USA Inc. Description: NOW WEEN - OT418 - TBC - SC-73
Packaging: Bulk
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
2404+0.21 EUR
Mindestbestellmenge: 2404
OT411127 OT411127 NXP USA Inc. Description: OT411 - TRIAC
Packaging: Bulk
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
614+0.86 EUR
Mindestbestellmenge: 614
OT412115 OT412115 NXP USA Inc. Description: NOW WEEN - OT412 - TBC - SC-73
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
LPC11E37HFBD64/401 NXP USA Inc. Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 6080 Stücke:
Lieferzeit 10-14 Tag (e)
38+23.5 EUR
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LPC11E36FBD64/501 NXP USA Inc. Description: IC MCU 32BIT FLASH
Packaging: Bulk
Mounting Type: Surface Mount
Speed: 50MHz
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 4960 Stücke:
Lieferzeit 10-14 Tag (e)
35+25.56 EUR
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LPC54102J512BD64151 LPC54102J512BD64151 NXP USA Inc. PHGL-S-A0008964602-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
MPXC2011DT1 NXP USA Inc. MPXC2011DT1.pdf Description: SENSOR 1.45PSID .025V CHIP PAK
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 4-SSIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Operating Temperature: 15°C ~ 40°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 10V
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Active
Produkt ist nicht verfügbar
LPC1224FBD64/121151 LPC1224FBD64/121151 NXP USA Inc. PHGLS23259-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 48KB FLASH 64LQFP
Produkt ist nicht verfügbar
PCU9669B/S911 NXP USA Inc. Description: NO DESCRIPTION
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
BB156/DG/B2 NXP USA Inc. Description: NO DESCRIPTION
Produkt ist nicht verfügbar
XC508262ZP25R2 NXP USA Inc. Description: NO DESCRIPTION
Produkt ist nicht verfügbar
G9S12C32F1MFA2E NXP USA Inc. Description: NO DESCRIPTION
Produkt ist nicht verfügbar
SM912G634EV2APR2 NXP USA Inc. Description: NO DESCRIPTION
Produkt ist nicht verfügbar
PWPR1516CALR NXP USA Inc. Description: NO DESCRIPTION
Packaging: Bulk
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
auf Bestellung 1100 Stücke:
Lieferzeit 10-14 Tag (e)
569+1.55 EUR
Mindestbestellmenge: 569
PTN38003AEWY PTN38003A.pdf
PTN38003AEWY
Hersteller: NXP USA Inc.
Description: IC USB-C 3.2 / DP1.4 REDRIVER
auf Bestellung 6898 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.43 EUR
10+ 8.48 EUR
25+ 8.02 EUR
100+ 6.95 EUR
250+ 6.59 EUR
500+ 5.92 EUR
1000+ 5.64 EUR
Mindestbestellmenge: 2
TJA1441AT/0Z TJA1441.pdf
TJA1441AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
auf Bestellung 183 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
7+2.6 EUR
10+ 2.33 EUR
25+ 2.21 EUR
100+ 1.81 EUR
Mindestbestellmenge: 7
BLF8G10LS-270,112 PHGLS25261-1.pdf?t.download=true&u=5oefqw
BLF8G10LS-270,112
Hersteller: NXP USA Inc.
Description: RF PFET, 1-ELEMENT, ULTRA HIGH F
Packaging: Tube
Package / Case: SOT-502B
Current Rating (Amps): 4.2µA
Mounting Type: Chassis Mount
Frequency: 820MHz ~ 960MHz
Power - Output: 270W
Gain: 18.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 2 A
auf Bestellung 41 Stücke:
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4+124.82 EUR
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MK28FN2M0CAU15R K28P210M150SF5.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 210-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: 210-WLCSP (6.94x6.94)
Part Status: Active
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BZX84-C4V7/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C4V7/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.7V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Produkt ist nicht verfügbar
BZX84-C4V7/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C4V7/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.7V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Produkt ist nicht verfügbar
PEMI1QFN/LT,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/LT,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/23PF SMD
Packaging: Cut Tape (CT)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 1
Produkt ist nicht verfügbar
PEMI1QFN/LT,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/LT,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/23PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 1
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3806+0.14 EUR
Mindestbestellmenge: 3806
LPC4325JBD144551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
LPC4325JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
LPC4322JBD144551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
LPC4322JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
NTM88H065T1
NTM88H065T1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
NTM88H065T1
NTM88H065T1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Cut Tape (CT)
Part Status: Obsolete
auf Bestellung 1847 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.7 EUR
5+ 12.97 EUR
10+ 11.46 EUR
25+ 9.3 EUR
50+ 8.22 EUR
100+ 8 EUR
500+ 6.7 EUR
1000+ 6.27 EUR
Mindestbestellmenge: 2
BC53-10PA,115 PHGLS29384-1.pdf?t.download=true&u=5oefqw
BC53-10PA,115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC53-10PA - SMALL S
auf Bestellung 33000 Stücke:
Lieferzeit 10-14 Tag (e)
SPC5603BAMLL4R
SPC5603BAMLL4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Produkt ist nicht verfügbar
S9S12P64J0MFTR MC9S12P128RMV1.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: CPU12V1
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPC8314EVRAFDA MPC8314EEC.pdf
MPC8314EVRAFDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+87.63 EUR
Mindestbestellmenge: 6
S912XEG384BMAL
S912XEG384BMAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K142MAT0MLHT S32K1xx.pdf
FS32K142MAT0MLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5746CHK1AVKU6 MPC5746C.pdf
SPC5746CHK1AVKU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
SAF3560EL/V1100Y
Hersteller: NXP USA Inc.
Description: IC DGTL HD RADIO PROCESSOR 170LB
Produkt ist nicht verfügbar
MRFE6VP6600NR3,528 MRFE6VP6600N.pdf
Hersteller: NXP USA Inc.
Description: WIDEBAND RF POWER LDMOS TRANSIST
Produkt ist nicht verfügbar
BUK9K89-100E115 BUK9K89-100E.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK9K89-100E - POWE
Packaging: Bulk
Produkt ist nicht verfügbar
K32W041AZ K32W041AM.pdf
K32W041AZ
Hersteller: NXP USA Inc.
Description: IC MCU K32W041 +15DBM 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1000+5.79 EUR
Mindestbestellmenge: 1000
K32W041AZ K32W041AM.pdf
K32W041AZ
Hersteller: NXP USA Inc.
Description: IC MCU K32W041 +15DBM 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 1890 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.28 EUR
10+ 9.43 EUR
25+ 8.57 EUR
100+ 7.72 EUR
250+ 7.07 EUR
500+ 6.43 EUR
Mindestbestellmenge: 2
BZX84-C36/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C36/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 36V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
BZX84-C36/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C36/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 36V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
PSMN7R6-60XSQ
PSMN7R6-60XSQ
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 51.5A TO220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 51.5A (Tc)
Rds On (Max) @ Id, Vgs: 7.8mOhm @ 25A, 10V
Power Dissipation (Max): 46W (Tc)
Vgs(th) (Max) @ Id: 4.6V @ 1mA
Supplier Device Package: TO-220F
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 38.7 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2651 pF @ 30 V
auf Bestellung 685 Stücke:
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Anzahl Preis ohne MwSt
685+0.81 EUR
Mindestbestellmenge: 685
MCZ33903DS5EK MC33903-MC33904-MC33905.pdf
MCZ33903DS5EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Part Status: Active
Produkt ist nicht verfügbar
NHS3100UK/A1Z NHS3100.pdf
NHS3100UK/A1Z
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 25WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 25-WLCSP (2.51x2.51)
Part Status: Active
Produkt ist nicht verfügbar
NHS3100UK/A1Z NHS3100.pdf
NHS3100UK/A1Z
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 25WLCSP
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 25-WLCSP (2.51x2.51)
Part Status: Active
Produkt ist nicht verfügbar
NHS3100UK/A1Z NHS3100.pdf
NHS3100UK/A1Z
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 25WLCSP
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 25-WLCSP (2.51x2.51)
Part Status: Active
auf Bestellung 11835 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
115+4.59 EUR
Mindestbestellmenge: 115
BCW30235 BCW29_BCW30.pdf
BCW30235
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BCW30 - SMALL SIGNA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
KITFS5600FRDMEVM UM11526.pdf
Hersteller: NXP USA Inc.
Description: FS56 EVAL KIT FRDM
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+843.32 EUR
PCA9564D,112 PCA9564.pdf
PCA9564D,112
Hersteller: NXP USA Inc.
Description: IC CONTROLLER PARALLEL INTERFACE
auf Bestellung 75396 Stücke:
Lieferzeit 10-14 Tag (e)
PCA9564D,118 PCA9564.pdf
PCA9564D,118
Hersteller: NXP USA Inc.
Description: IC CONTROLLER PARALLEL INTERFACE
auf Bestellung 5459 Stücke:
Lieferzeit 10-14 Tag (e)
IP3348CX10,135 IP3348CX5,10,15,20.pdf
IP3348CX10,135
Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Bulk
Package / Case: 10-UFBGA, WLCSP
Size / Dimension: 0.064" L x 0.042" W (1.56mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
Current: 20 mA
auf Bestellung 355500 Stücke:
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4121+0.12 EUR
Mindestbestellmenge: 4121
MK28FN2M0ACAU15R K28P210M150SF5.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 210WLCSP
Produkt ist nicht verfügbar
FS32K144ULT0VLLR S32K-DS.pdf
FS32K144ULT0VLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MVR5510AVMAHEPR2
MVR5510AVMAHEPR2
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 QM
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Produkt ist nicht verfügbar
RDDRONE-CUPK64
Hersteller: NXP USA Inc.
Description: NXP CUP DRONE MAINBOARD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K64
Platform: Mikroe NXP Cup Mainboard
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+262.63 EUR
SPC5746CBK1AMMJ6 MPC5746C.pdf
SPC5746CBK1AMMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC22XS4200CEKR2 MC22XS4200.pdf
MC22XS4200CEKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Packaging: Cut Tape (CT)
Features: Internal PWM, Slew Rate Controlled
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 22mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
FS32K142HAT0MLHR S32K-DS.pdf
FS32K142HAT0MLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LD6816CX4/25H,315 LD6816.pdf
LD6816CX4/25H,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 150MA 4WLCSP
Packaging: Cut Tape (CT)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
LD6816CX4/25H,315 LD6816.pdf
LD6816CX4/25H,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 17999 Stücke:
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Anzahl Preis ohne MwSt
3328+0.15 EUR
Mindestbestellmenge: 3328
OT413127
OT413127
Hersteller: NXP USA Inc.
Description: OT413 - TBC - TO 220AB
Packaging: Bulk
Part Status: Active
auf Bestellung 671 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
671+0.92 EUR
Mindestbestellmenge: 671
OT418115
OT418115
Hersteller: NXP USA Inc.
Description: NOW WEEN - OT418 - TBC - SC-73
Packaging: Bulk
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2404+0.21 EUR
Mindestbestellmenge: 2404
OT411127
OT411127
Hersteller: NXP USA Inc.
Description: OT411 - TRIAC
Packaging: Bulk
Part Status: Active
auf Bestellung 2000 Stücke:
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Anzahl Preis ohne MwSt
614+0.86 EUR
Mindestbestellmenge: 614
OT412115
OT412115
Hersteller: NXP USA Inc.
Description: NOW WEEN - OT412 - TBC - SC-73
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
LPC11E37HFBD64/401
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 6080 Stücke:
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Anzahl Preis ohne MwSt
38+23.5 EUR
Mindestbestellmenge: 38
LPC11E36FBD64/501
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT FLASH
Packaging: Bulk
Mounting Type: Surface Mount
Speed: 50MHz
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 4960 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
35+25.56 EUR
Mindestbestellmenge: 35
LPC54102J512BD64151 PHGL-S-A0008964602-1.pdf?t.download=true&u=5oefqw
LPC54102J512BD64151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
MPXC2011DT1 MPXC2011DT1.pdf
Hersteller: NXP USA Inc.
Description: SENSOR 1.45PSID .025V CHIP PAK
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 4-SSIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Operating Temperature: 15°C ~ 40°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 10V
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Active
Produkt ist nicht verfügbar
LPC1224FBD64/121151 PHGLS23259-1.pdf?t.download=true&u=5oefqw
LPC1224FBD64/121151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 64LQFP
Produkt ist nicht verfügbar
PCU9669B/S911
Hersteller: NXP USA Inc.
Description: NO DESCRIPTION
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
BB156/DG/B2
Hersteller: NXP USA Inc.
Description: NO DESCRIPTION
Produkt ist nicht verfügbar
XC508262ZP25R2
Hersteller: NXP USA Inc.
Description: NO DESCRIPTION
Produkt ist nicht verfügbar
G9S12C32F1MFA2E
Hersteller: NXP USA Inc.
Description: NO DESCRIPTION
Produkt ist nicht verfügbar
SM912G634EV2APR2
Hersteller: NXP USA Inc.
Description: NO DESCRIPTION
Produkt ist nicht verfügbar
PWPR1516CALR
Hersteller: NXP USA Inc.
Description: NO DESCRIPTION
Packaging: Bulk
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
auf Bestellung 1100 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
569+1.55 EUR
Mindestbestellmenge: 569
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