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MC33HB2002ESR2 NXP USA Inc. Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: DC Motors
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Produkt ist nicht verfügbar
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S9S12GN48AMLF S9S12GN48AMLF NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPF5024AVNA0ESR2 MPF5024AVNA0ESR2 NXP USA Inc. Description: PF5024
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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NX3L1G3157GMZ NX3L1G3157GMZ NXP USA Inc. NX3L1G3157.pdf Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32G274AABK0CUCT NXP USA Inc. S32G2RSERDESRM.pdf Description: IC MPU AEC-Q100 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
Produkt ist nicht verfügbar
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SPC5746CK1MMJ6 SPC5746CK1MMJ6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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2PA1774QMB315 2PA1774QMB315 NXP USA Inc. 2PA1774XMB_SER.pdf Description: NOW NEXPERIA 2PA1774QMB - SMALL
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 57940 Stücke:
Lieferzeit 10-14 Tag (e)
6935+0.06 EUR
Mindestbestellmenge: 6935
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PDTC144VMB315 PDTC144VMB315 NXP USA Inc. PDTC144VMB.pdf Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
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11225+0.05 EUR
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LPC11E13FBD48301 LPC11E13FBD48301 NXP USA Inc. PHGLS28857-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 48LQFP
Produkt ist nicht verfügbar
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SPC5747CHK0AVKU6 SPC5747CHK0AVKU6 NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5747CHK0AVKU6R SP5747CHK0AVKU6R NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MML09211HT1 MML09211HT1 NXP USA Inc. MML09211HT1.pdf Description: IC RF AMP GSM 400MHZ-1.4GHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 1.4GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 5V
Gain: 21.3dB
Current - Supply: 60mA
Noise Figure: 0.66dB
P1dB: 20dBm
Test Frequency: 1.4GHz
Supplier Device Package: 8-DFN (2x2)
Part Status: Obsolete
auf Bestellung 24000 Stücke:
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69+12.92 EUR
Mindestbestellmenge: 69
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NX3V1T66GM,115 NX3V1T66GM,115 NXP USA Inc. NX3V1T66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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3328+0.15 EUR
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S912ZVC12F0VLFR S912ZVC12F0VLFR NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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2000+7.44 EUR
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TDA18225HN/C1 NXP USA Inc. Description: INTEGRATED CIRCUIT
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MC9S12E64MFUE MC9S12E64MFUE NXP USA Inc. FSCLS02076-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
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15+36.48 EUR
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MC9S12DJ64MFUE MC9S12DJ64MFUE NXP USA Inc. S12DP256B_ZIP.zip Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Produkt ist nicht verfügbar
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P60D144PX34/9A0409 NXP USA Inc. Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
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BZX79-B6V2143 BZX79-B6V2143 NXP USA Inc. BZX79.pdf Description: NOW NEXPERIA BZX79-B6V2 - ZENER
auf Bestellung 105000 Stücke:
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15000+0.03 EUR
Mindestbestellmenge: 15000
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BAP65-05 NXP USA Inc. Description: PIN DIODE, 30V V(BR), SILICON, T
Produkt ist nicht verfügbar
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S9S12G64AVLFR S9S12G64AVLFR NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SWAC58R-ICC01L NXP USA Inc. Description: AUTO SOFTWARE SAC58R INTER CORE
Produkt ist nicht verfügbar
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SWAC58R-ICC01V NXP USA Inc. Description: AUTO SOFTWARE SAC58R INTER CORE
Produkt ist nicht verfügbar
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SWAC58R-ICC01P NXP USA Inc. Description: AUTO SOFTWARE SAC58R INTER CORE
Produkt ist nicht verfügbar
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LD6806TD/18P,125 LD6806TD/18P,125 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 1.8V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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MPC5775B-EVB MPC5775B-EVB NXP USA Inc. get-started-with-the-mpc5775b-e-low-cost-development-board-for-battery-management-and-inverter:GS-MPC5775B-E-EVB Description: MPC5775B-EVB DEV BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
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S32K14WEVB-Q064 S32K14WEVB-Q064 NXP USA Inc. getting-started-with-the-s32k14w-q064-evaluation-board:GS-S32K14WEVB-Q064 Description: S32K144W EVAL BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K144W
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S12VR64EVB3 NXP USA Inc. Description: S12VR64 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: S12
Utilized IC / Part: S12VR64
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MIMXRT1060-EVKB MIMXRT1060-EVKB NXP USA Inc. MIMXRT1060-EVKB.pdf Description: I.MX RT1060 EVAL BRD REVB
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: i.MX RT1060
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S32K3X4EVBQ257ND S32K3X4EVBQ257ND NXP USA Inc. Description: S32K344 EVAL BOARD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
Produkt ist nicht verfügbar
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S32K116EVB2Q048 S32K116EVB2Q048 NXP USA Inc. S32K116EVB-QSG.pdf Description: EVAL BOARD S32K116
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K116
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S32K118EVB2Q048 S32K118EVB2Q048 NXP USA Inc. getting-started-with-the-s32k118evb2q048-evaluation-board:GS-S32K118EVB Description: EVAL BOARD S32K118 GEN PURPOSE
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K118
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KIT33772CTPLEVB NXP USA Inc. Description: EVAL BOARD FOR MC33772C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Part Status: Active
Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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FRDM33772CSPEVB FRDM33772CSPEVB NXP USA Inc. K15077.pdf Description: EVAL BOARD FOR MC33772C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Part Status: Active
Contents: Board(s), Cable(s)
Secondary Attributes: On-Board LEDs, Test Points
Produkt ist nicht verfügbar
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UJA1161A-EVB NXP USA Inc. UM11379.pdf Description: UJA1161A EVAL BOARD
Packaging: Bulk
Function: CAN Transceiver
Type: Interface
Utilized IC / Part: UJA1161A
Supplied Contents: Board(s)
Embedded: Yes, MCU
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CGY1049112 NXP USA Inc. PHGLS22340-1.pdf?t.download=true&u=5oefqw Description: NARROW BAND HIGH POWER AMPLIFIER
auf Bestellung 6870 Stücke:
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9+68.16 EUR
Mindestbestellmenge: 9
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S912XET256J2MAGR S912XET256J2MAGR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1548JBD64151 LPC1548JBD64151 NXP USA Inc. PHGL-S-A0000136915-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EV-INVERTERHDBT NXP USA Inc. EVINVERTERHDA4.pdf Description: IGBT PWR INVTR CTRL REF PLATFORM
Packaging: Box
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes
Produkt ist nicht verfügbar
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XC7SET02GV,125 XC7SET02GV,125 NXP USA Inc. NEXP-S-A0002882222-1.pdf?t.download=true&u=5oefqw Description: IC GATE NOR 1CH 2-INP SC74A
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
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SAF7770EL/101S130Y NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Produkt ist nicht verfügbar
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BUK6207-30C,118 BUK6207-30C,118 NXP USA Inc. Description: MOSFET N-CH 30V 90A DPAK
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
Rds On (Max) @ Id, Vgs: 5.2mOhm @ 15A, 10V
Power Dissipation (Max): 128W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 54.8 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3470 pF @ 25 V
Produkt ist nicht verfügbar
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P1011NSE2HFB NXP USA Inc. FSCLS07089-1.pdf?hkey=EC6BD57738AE6E33B588C5F9AD3CEFA7 Description: QORIQ, POWER ARCH 32-BIT SOC, 80
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
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PCT2202UKZ NXP USA Inc. PCT2202.pdf Description: SENSOR DIGITAL -40C-125C 6WLCSP
Features: One-Shot, Output Switch, Shutdown Mode
Packaging: Cut Tape (CT)
Package / Case: 6-XFBGA, WLCSP
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 1.65V ~ 1.95V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-WLCSP (0.69x1.09)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Obsolete
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NCF2961MHN3/0200E NXP USA Inc. Description: RFID TRANSPONDER
Produkt ist nicht verfügbar
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BLM6G10-30G,118 BLM6G10-30G,118 NXP USA Inc. PHGLS22858-1.pdf?t.download=true&u=5oefqw Description: IC RF AMP CDMA 920-960MHZ 16HSOP
Packaging: Bulk
Package / Case: 16-SMD Module
Mounting Type: Surface Mount
Frequency: 920MHz ~ 960MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 29dB
Supplier Device Package: 16-HSOP
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LS1084AXE7MQA NXP USA Inc. Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
Produkt ist nicht verfügbar
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MPC8270VVQLDA MPC8270VVQLDA NXP USA Inc. FSCLS05948-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC82XX 333MHZ 480TBGA
Packaging: Bulk
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Active
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MC34PF3000A2EPR2 MC34PF3000A2EPR2 NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
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SAF4000EL/101S43AY NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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SAF4000EL/101S235K NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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SAF4000EL/101S574Y NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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SAF4000EL/101S57AK NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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SAF7770EL/101S170K NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Produkt ist nicht verfügbar
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SAF4000EL/101S23CY NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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SAF4000EL/101S530K NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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SAF4000EL/101S53BK NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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SAF4000EL/101S230Y NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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SAF4000EL/101S504K NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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SAF7770EL/101S120Y NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Produkt ist nicht verfügbar
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MC33HB2002ESR2
Hersteller: NXP USA Inc.
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: DC Motors
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Produkt ist nicht verfügbar
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S9S12GN48AMLF
S9S12GN48AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPF5024AVNA0ESR2
MPF5024AVNA0ESR2
Hersteller: NXP USA Inc.
Description: PF5024
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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NX3L1G3157GMZ NX3L1G3157.pdf
NX3L1G3157GMZ
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32G274AABK0CUCT S32G2RSERDESRM.pdf
Hersteller: NXP USA Inc.
Description: IC MPU AEC-Q100 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
Produkt ist nicht verfügbar
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SPC5746CK1MMJ6 MPC5746C.pdf
SPC5746CK1MMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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2PA1774QMB315 2PA1774XMB_SER.pdf
2PA1774QMB315
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 2PA1774QMB - SMALL
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
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Anzahl Preis
6935+0.06 EUR
Mindestbestellmenge: 6935
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PDTC144VMB315 PDTC144VMB.pdf
PDTC144VMB315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
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Anzahl Preis
11225+0.05 EUR
Mindestbestellmenge: 11225
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LPC11E13FBD48301 PHGLS28857-1.pdf?t.download=true&u=5oefqw
LPC11E13FBD48301
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Produkt ist nicht verfügbar
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SPC5747CHK0AVKU6
SPC5747CHK0AVKU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5747CHK0AVKU6R
SP5747CHK0AVKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MML09211HT1 MML09211HT1.pdf
MML09211HT1
Hersteller: NXP USA Inc.
Description: IC RF AMP GSM 400MHZ-1.4GHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 1.4GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 5V
Gain: 21.3dB
Current - Supply: 60mA
Noise Figure: 0.66dB
P1dB: 20dBm
Test Frequency: 1.4GHz
Supplier Device Package: 8-DFN (2x2)
Part Status: Obsolete
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Anzahl Preis
69+12.92 EUR
Mindestbestellmenge: 69
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NX3V1T66GM,115 NX3V1T66.pdf
NX3V1T66GM,115
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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3328+0.15 EUR
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S912ZVC12F0VLFR S12ZVCFS.pdf
S912ZVC12F0VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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Anzahl Preis
2000+7.44 EUR
Mindestbestellmenge: 2000
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TDA18225HN/C1
Hersteller: NXP USA Inc.
Description: INTEGRATED CIRCUIT
auf Bestellung 938 Stücke:
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MC9S12E64MFUE FSCLS02076-1.pdf?t.download=true&u=5oefqw
MC9S12E64MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
auf Bestellung 924 Stücke:
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Anzahl Preis
15+36.48 EUR
Mindestbestellmenge: 15
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MC9S12DJ64MFUE S12DP256B_ZIP.zip
MC9S12DJ64MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Produkt ist nicht verfügbar
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P60D144PX34/9A0409
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
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BZX79-B6V2143 BZX79.pdf
BZX79-B6V2143
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-B6V2 - ZENER
auf Bestellung 105000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15000+0.03 EUR
Mindestbestellmenge: 15000
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BAP65-05
Hersteller: NXP USA Inc.
Description: PIN DIODE, 30V V(BR), SILICON, T
Produkt ist nicht verfügbar
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S9S12G64AVLFR
S9S12G64AVLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SWAC58R-ICC01L
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE SAC58R INTER CORE
Produkt ist nicht verfügbar
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SWAC58R-ICC01V
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE SAC58R INTER CORE
Produkt ist nicht verfügbar
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SWAC58R-ICC01P
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE SAC58R INTER CORE
Produkt ist nicht verfügbar
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LD6806TD/18P,125 LD6806_Series.pdf
LD6806TD/18P,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 15901 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2959+0.17 EUR
Mindestbestellmenge: 2959
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MPC5775B-EVB get-started-with-the-mpc5775b-e-low-cost-development-board-for-battery-management-and-inverter:GS-MPC5775B-E-EVB
MPC5775B-EVB
Hersteller: NXP USA Inc.
Description: MPC5775B-EVB DEV BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+486.52 EUR
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S32K14WEVB-Q064 getting-started-with-the-s32k14w-q064-evaluation-board:GS-S32K14WEVB-Q064
S32K14WEVB-Q064
Hersteller: NXP USA Inc.
Description: S32K144W EVAL BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K144W
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+298.27 EUR
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S12VR64EVB3
Hersteller: NXP USA Inc.
Description: S12VR64 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: S12
Utilized IC / Part: S12VR64
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+861.22 EUR
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MIMXRT1060-EVKB MIMXRT1060-EVKB.pdf
MIMXRT1060-EVKB
Hersteller: NXP USA Inc.
Description: I.MX RT1060 EVAL BRD REVB
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: i.MX RT1060
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+203.32 EUR
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S32K3X4EVBQ257ND
S32K3X4EVBQ257ND
Hersteller: NXP USA Inc.
Description: S32K344 EVAL BOARD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
Produkt ist nicht verfügbar
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S32K116EVB2Q048 S32K116EVB-QSG.pdf
S32K116EVB2Q048
Hersteller: NXP USA Inc.
Description: EVAL BOARD S32K116
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K116
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+187.69 EUR
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S32K118EVB2Q048 getting-started-with-the-s32k118evb2q048-evaluation-board:GS-S32K118EVB
S32K118EVB2Q048
Hersteller: NXP USA Inc.
Description: EVAL BOARD S32K118 GEN PURPOSE
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K118
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+173.29 EUR
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KIT33772CTPLEVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33772C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Part Status: Active
Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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FRDM33772CSPEVB K15077.pdf
FRDM33772CSPEVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33772C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Part Status: Active
Contents: Board(s), Cable(s)
Secondary Attributes: On-Board LEDs, Test Points
Produkt ist nicht verfügbar
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UJA1161A-EVB UM11379.pdf
Hersteller: NXP USA Inc.
Description: UJA1161A EVAL BOARD
Packaging: Bulk
Function: CAN Transceiver
Type: Interface
Utilized IC / Part: UJA1161A
Supplied Contents: Board(s)
Embedded: Yes, MCU
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+143.11 EUR
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CGY1049112 PHGLS22340-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NARROW BAND HIGH POWER AMPLIFIER
auf Bestellung 6870 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+68.16 EUR
Mindestbestellmenge: 9
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S912XET256J2MAGR
S912XET256J2MAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1548JBD64151 PHGL-S-A0000136915-1.pdf?t.download=true&u=5oefqw
LPC1548JBD64151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EV-INVERTERHDBT EVINVERTERHDA4.pdf
Hersteller: NXP USA Inc.
Description: IGBT PWR INVTR CTRL REF PLATFORM
Packaging: Box
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes
Produkt ist nicht verfügbar
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XC7SET02GV,125 NEXP-S-A0002882222-1.pdf?t.download=true&u=5oefqw
XC7SET02GV,125
Hersteller: NXP USA Inc.
Description: IC GATE NOR 1CH 2-INP SC74A
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1926+0.28 EUR
Mindestbestellmenge: 1926
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SAF7770EL/101S130Y
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Produkt ist nicht verfügbar
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BUK6207-30C,118
BUK6207-30C,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 90A DPAK
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
Rds On (Max) @ Id, Vgs: 5.2mOhm @ 15A, 10V
Power Dissipation (Max): 128W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 54.8 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3470 pF @ 25 V
Produkt ist nicht verfügbar
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P1011NSE2HFB FSCLS07089-1.pdf?hkey=EC6BD57738AE6E33B588C5F9AD3CEFA7
Hersteller: NXP USA Inc.
Description: QORIQ, POWER ARCH 32-BIT SOC, 80
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
Produkt ist nicht verfügbar
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PCT2202UKZ PCT2202.pdf
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 6WLCSP
Features: One-Shot, Output Switch, Shutdown Mode
Packaging: Cut Tape (CT)
Package / Case: 6-XFBGA, WLCSP
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 1.65V ~ 1.95V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-WLCSP (0.69x1.09)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
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NCF2961MHN3/0200E
Hersteller: NXP USA Inc.
Description: RFID TRANSPONDER
Produkt ist nicht verfügbar
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BLM6G10-30G,118 PHGLS22858-1.pdf?t.download=true&u=5oefqw
BLM6G10-30G,118
Hersteller: NXP USA Inc.
Description: IC RF AMP CDMA 920-960MHZ 16HSOP
Packaging: Bulk
Package / Case: 16-SMD Module
Mounting Type: Surface Mount
Frequency: 920MHz ~ 960MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 29dB
Supplier Device Package: 16-HSOP
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+64.55 EUR
Mindestbestellmenge: 8
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LS1084AXE7MQA
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
Produkt ist nicht verfügbar
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MPC8270VVQLDA FSCLS05948-1.pdf?t.download=true&u=5oefqw
MPC8270VVQLDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 480TBGA
Packaging: Bulk
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Active
auf Bestellung 335 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+209.46 EUR
Mindestbestellmenge: 3
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MC34PF3000A2EPR2 PF3000.pdf
MC34PF3000A2EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
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SAF4000EL/101S43AY
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF4000EL/101S235K
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF4000EL/101S574Y
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF4000EL/101S57AK
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7770EL/101S170K
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF4000EL/101S23CY
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF4000EL/101S530K
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF4000EL/101S53BK
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF4000EL/101S230Y
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF4000EL/101S504K
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7770EL/101S120Y
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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