MCF54455CVP200 NXP Semiconductors
| Anzahl | Preis |
|---|---|
| 1+ | 99 EUR |
| 10+ | 80.84 EUR |
| 25+ | 76.3 EUR |
| 100+ | 71.32 EUR |
| 300+ | 68.94 EUR |
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Technische Details MCF54455CVP200 NXP Semiconductors
Description: IC MCU 32BIT ROMLESS 360BGA, DigiKey Programmable: Not Verified, Number of I/O: 132, Part Status: Active, Supplier Device Package: 360-BGA (23x23), Peripherals: DMA, WDT, Connectivity: I2C, SPI, SSI, UART/USART, USB OTG, Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V, Core Size: 32-Bit Single-Core, Core Processor: Coldfire V4, Program Memory Type: ROMless, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 32K x 8, Speed: 200MHz, Mounting Type: Surface Mount, Package / Case: 360-BBGA, Packaging: Tray.
Weitere Produktangebote MCF54455CVP200
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
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MCF54455CVP200 | NXP USA Inc. |
 Description: IC MCU 32BIT ROMLESS 360BGADigiKey Programmable: Not Verified Number of I/O: 132 Part Status: Active Supplier Device Package: 360-BGA (23x23) Peripherals: DMA, WDT Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Core Size: 32-Bit Single-Core Core Processor: Coldfire V4 Program Memory Type: ROMless Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Speed: 200MHz Mounting Type: Surface Mount Package / Case: 360-BBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH |
| MCF54455CVP200 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
DigiKey Programmable: Not Verified
Number of I/O: 132
Part Status: Active
Supplier Device Package: 360-BGA (23x23)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V4
Program Memory Type: ROMless
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 360BGA
DigiKey Programmable: Not Verified
Number of I/O: 132
Part Status: Active
Supplier Device Package: 360-BGA (23x23)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V4
Program Memory Type: ROMless
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH