Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34648) > Seite 440 nach 578
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PCAL9539AHF,128 | NXP USA Inc. |
 Description: IC I/O EXPANDER 16BIT 24HWQFN |
Produkt ist nicht verfügbar |
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| MPC8343EVRADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620BGA Packaging: Bulk Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-PBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI Part Status: Active |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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BFU668F,115 | NXP USA Inc. |
Description: TRANSISTOR NPN SOT343F Packaging: Cut Tape (CT) Package / Case: SOT-343F Mounting Type: Surface Mount Supplier Device Package: 4-DFP Part Status: Obsolete |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5744PK1MLQ8R | NXP USA Inc. |
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2.5MB (2.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| BUK7M21-40E,115 | NXP USA Inc. | Description: BUK7M21-40E - N-CHANNEL 40V MOSF |
Produkt ist nicht verfügbar |
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MIMX8MM4CVTKZAA | NXP USA Inc. |
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA Packaging: Tray Package / Case: 486-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 486-LFBGA (14x14) Ethernet: GbE USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: I2C, PCIe, SDHC, SPI, UART Part Status: Active |
auf Bestellung 51 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XEQ512ACAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP |
Produkt ist nicht verfügbar |
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| A2T21H360-23NR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM1230-42 Packaging: Tape & Reel (TR) Package / Case: OM-1230-4L2L Current Rating (Amps): 10µA Frequency: 2.11GHz ~ 2.2GHz Configuration: Dual Power - Output: 373W Gain: 16.8dB Technology: LDMOS Supplier Device Package: OM-1230-4L2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 500 mA |
Produkt ist nicht verfügbar |
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| A3I20X050GNR1 | NXP USA Inc. |
Description: AIRFAST RF LDMOS WIDEBAND INTEGR Packaging: Tape & Reel (TR) Package / Case: OM-400G-8 Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 1.8GHz ~ 2.2GHz Configuration: Dual Voltage - Supply: 20V ~ 32V Power - Output: 6.3W Gain: 29.3dB Technology: LDMOS Supplier Device Package: OM-400G-8 Part Status: Active Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 145 mA |
Produkt ist nicht verfügbar |
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| A3I20X050NR1 | NXP USA Inc. |
Description: AIRFAST RF LDMOS WIDEBAND INTEGR Packaging: Tape & Reel (TR) Package / Case: OM-400-8 Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 1.8GHz ~ 2.2GHz Configuration: Dual Voltage - Supply: 20V ~ 32V Power - Output: 6.3W Gain: 29.3dB Technology: LDMOS Supplier Device Package: OM-400-8 Part Status: Active Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 145 mA |
Produkt ist nicht verfügbar |
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74LV165DB118 | NXP USA Inc. |
Description: NOW NEXPERIA 74LV165DB - PARALLE |
Produkt ist nicht verfügbar |
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| PCF85176T/1Y | NXP USA Inc. |
Description: 40 X 4 UNIVERSAL LCD DRIVER FOR Packaging: Tape & Reel (TR) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: I2C Configuration: 40 Segment Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 10 Characters, 20 Characters, 160 Elements Supplier Device Package: 56-TSSOP Current - Supply: 3.5 µA Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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| PCF85176T/1Y | NXP USA Inc. |
Description: 40 X 4 UNIVERSAL LCD DRIVER FOR Packaging: Cut Tape (CT) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: I2C Configuration: 40 Segment Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 10 Characters, 20 Characters, 160 Elements Supplier Device Package: 56-TSSOP Current - Supply: 3.5 µA Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 5395 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-B5V1215 | NXP USA Inc. |
Description: DIODE ZENER 5.1V 250MW TO236AB |
Produkt ist nicht verfügbar |
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S9S08RNA60W1VLHR | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64LQFP Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 55 DigiKey Programmable: Not Verified |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC3240FET296015 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 296TFBGA Packaging: Bulk Package / Case: 296-TFBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM926EJ-S Data Converters: A/D 3x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT Supplier Device Package: 296-TFBGA (15x15) Part Status: Active Number of I/O: 51 |
Produkt ist nicht verfügbar |
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MCZ33903CS5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
auf Bestellung 61 Stücke: Lieferzeit 10-14 Tag (e) |
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CGD944C,112 | NXP USA Inc. |
Description: IC AMP CATV SOT115J |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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| A3T23H300W23SR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| PCX2131TF | NXP USA Inc. |
Description: USB TYPE-C REV 3.0 PD PHY Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SPC5603BK0MLL4 | NXP USA Inc. | Description: IC MCU 32BIT 384KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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SPC5603BK0MLL4R | NXP USA Inc. | Description: IC MCU 32BIT 384KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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PEMB15,115 | NXP USA Inc. |
Description: NOW NEXPERIA PEMB15 - SMALL SIGN |
auf Bestellung 62428 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33772BTP1AE | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: TPL Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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PCF8578HT/1,518 | NXP USA Inc. |
Description: IC DRVR DOT MATRIX 64TQFP Packaging: Cut Tape (CT) Package / Case: 64-TQFP Display Type: LCD Mounting Type: Surface Mount Interface: I2C Configuration: Dot Matrix Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V ~ 6V Supplier Device Package: 64-TQFP (10x10) |
Produkt ist nicht verfügbar |
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S9KEAZN64ACLH | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 57 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCU-LINK-PRO | NXP USA Inc. |
Description: ARM CORTEX-M DEBUG PROBE Packaging: Box Type: Debugger Contents: Board(s), Cable(s), Accessories Part Status: Active |
auf Bestellung 38 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV32DB,112 | NXP USA Inc. |
Description: IC GATE OR 4CH 2-INP 14SSOP Packaging: Tube Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5.5V Current - Output High, Low: 12mA, 12mA Number of Inputs: 2 Supplier Device Package: 14-SSOP Input Logic Level - High: 0.9V ~ 2V Input Logic Level - Low: 0.3V ~ 0.8V Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF Part Status: Obsolete Number of Circuits: 4 Current - Quiescent (Max): 40 µA |
auf Bestellung 10866 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC11PW-Q100118 | NXP USA Inc. |
Description: IC GATE AND 3CH 3-INP 14TSSOP Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Active Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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MC9S08SE4MWL | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 28SOIC |
auf Bestellung 3666 Stücke: Lieferzeit 10-14 Tag (e) |
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BB199,115 | NXP USA Inc. |
Description: DIODE RF VCO/FM RAD TUNE SOD-523 Packaging: Cut Tape (CT) Package / Case: SC-79, SOD-523 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz Capacitance Ratio Condition: C0.5/C2 Supplier Device Package: SOD-523 Part Status: Obsolete Voltage - Peak Reverse (Max): 20 V Capacitance Ratio: 2.8 |
Produkt ist nicht verfügbar |
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BB199,115 | NXP USA Inc. |
Description: DIODE RF VCO/FM RAD TUNE SOD-523 Packaging: Bulk Package / Case: SC-79, SOD-523 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz Capacitance Ratio Condition: C0.5/C2 Supplier Device Package: SOD-523 Part Status: Obsolete Voltage - Peak Reverse (Max): 20 V Capacitance Ratio: 2.8 |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12GN16AMLFR | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: 12V1 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| LX2082RC82029B | NXP USA Inc. | Description: 8XA72 64-BIT ARM 2GHZ CAN-FD |
Produkt ist nicht verfügbar |
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BAP70AM135 | NXP USA Inc. |
Description: DIODE PIN 50V 100MA 6TSSOP |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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BAP70AM/A115 | NXP USA Inc. |
Description: BAP70AM - PIN DIODE |
Produkt ist nicht verfügbar |
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| LX2160XC72029B | NXP USA Inc. | Description: SSL MATRIX CONTROLLER |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHC126D,112 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 14SO Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 14-SO Part Status: Active |
auf Bestellung 28426 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHC126PW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES Packaging: Bulk |
Produkt ist nicht verfügbar |
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| NBP8FD4T1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 24HQFN |
Produkt ist nicht verfügbar |
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BFG31,115 | NXP USA Inc. |
Description: RF TRANS PNP 15V 5GHZ SOT223 Packaging: Tape & Reel (TR) Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 175°C (TJ) Power - Max: 1W Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 70mA, 10V Frequency - Transition: 5GHz Supplier Device Package: SC-73 |
Produkt ist nicht verfügbar |
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BFG310/XR,215 | NXP USA Inc. |
Description: RF TRANS NPN 6V 14GHZ SOT143R Packaging: Tape & Reel (TR) Package / Case: SOT-143R Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Gain: 18dB Power - Max: 60mW Current - Collector (Ic) (Max): 10mA Voltage - Collector Emitter Breakdown (Max): 6V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V Frequency - Transition: 14GHz Noise Figure (dB Typ @ f): 1dB @ 2GHz Supplier Device Package: SOT-143R |
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MC9S12DT256MPVE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP |
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| MC33797BPEWR2518 | NXP USA Inc. |
Description: FOUR CHANNEL SQUIB DRIVER IC Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| BA591/A115 | NXP USA Inc. |
Description: MIXER DIODE, VERY HIGH FREQUENCY Packaging: Bulk Part Status: Active Package / Case: SC-76, SOD-323 Diode Type: Standard - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz Resistance @ If, F: 500mOhm @ 10mA, 100MHz Voltage - Peak Reverse (Max): 35V Supplier Device Package: SOD-323 Current - Max: 100 mA Power Dissipation (Max): 500 mW Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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74AVCH4T245PW118 | NXP USA Inc. |
Description: IC TRANSLATION TXRX 3.6V 16TSSOP |
Produkt ist nicht verfügbar |
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MIMXRT117FCVM8A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 800MHz RAM Size: 2M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b SAR; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active Number of I/O: 13 DigiKey Programmable: Not Verified |
auf Bestellung 760 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT117FDVMAA | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 800MHz RAM Size: 2M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b SAR; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active Number of I/O: 13 DigiKey Programmable: Not Verified |
auf Bestellung 760 Stücke: Lieferzeit 10-14 Tag (e) |
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| PXLS83722AESR2 | NXP USA Inc. |
Description: 2 AXIS MED/MED YZ Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74AVC8T245PW-Q100118 | NXP USA Inc. |
Description: IC TRANSLATION TXRX 3.6V 24TSSOP Packaging: Bulk Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Translation Transceiver Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 8 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 24-TSSOP Part Status: Active |
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74AVC8T245PW112 | NXP USA Inc. |
Description: IC TRANSLATION TXRX 3.6V 24TSSOP Packaging: Bulk Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Translation Transceiver Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 8 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 24-TSSOP Part Status: Active |
Produkt ist nicht verfügbar |
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UJA1167ATK/X/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 14HVSON Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3V ~ 28V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-HVSON (3x4.5) Receiver Hysteresis: 800 mV Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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BZX84-C5V6/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 5.6V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 5.6 V Impedance (Max) (Zzt): 40 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 1 µA @ 2 V |
Produkt ist nicht verfügbar |
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BZX84-C5V6/LF1R | NXP USA Inc. |
Description: DIODE ZENER 5.6V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 5.6 V Impedance (Max) (Zzt): 40 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 1 µA @ 2 V |
Produkt ist nicht verfügbar |
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PIP202-12M-2,518 | NXP USA Inc. |
Description: IC HALF BRIDGE DRVR 25A 68HVQFN Packaging: Cut Tape (CT) Features: Bootstrap Circuit Package / Case: 68-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: PWM Operating Temperature: -55°C ~ 150°C (TJ) Output Configuration: Half Bridge Voltage - Supply: 3.3V ~ 12V Applications: Synchronous Buck Converters Current - Output / Channel: 25A Current - Peak Output: 200A Technology: Power MOSFET Voltage - Load: 25V (Max) Supplier Device Package: 68-HVQFN (10x10) Load Type: Inductive Part Status: Obsolete |
Produkt ist nicht verfügbar |
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LPC1776FBD208K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Active Number of I/O: 165 DigiKey Programmable: Not Verified |
auf Bestellung 77 Stücke: Lieferzeit 10-14 Tag (e) |
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NHS3100/A1Z | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 24HVQFN Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.7V ~ 3.6V Standards: ISO 14443 Supplier Device Package: 24-HVQFN (4x4) Part Status: Active |
auf Bestellung 475 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33772CTC0AE | NXP USA Inc. |
Description: IC 6-CH LI-ION BATT CTRL 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: I2C, SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
auf Bestellung 502 Stücke: Lieferzeit 10-14 Tag (e) |
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| SPC5643LF2MLQ1R,528 | NXP USA Inc. |
Description: 32 BIT MCU, DUAL- POWER ARCHITEC Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 32x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| WLAN3002CZ | NXP USA Inc. |
Description: IC AMP GPS 4.9-5.925GHZ 8HX2SON Packaging: Tape & Reel (TR) Package / Case: 8-XFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 4.9GHz ~ 5.925GHz RF Type: General Purpose Voltage - Supply: 2.7V ~ 5.25V Gain: 16dB Current - Supply: 10mA Noise Figure: 2.4dB P1dB: 32dBm Test Frequency: 5.4GHz Supplier Device Package: 8-HX2SON (1.5x1.5) Part Status: Active |
Produkt ist nicht verfügbar |
| PCAL9539AHF,128 |
|
Hersteller: NXP USA Inc.
Description: IC I/O EXPANDER 16BIT 24HWQFN
Description: IC I/O EXPANDER 16BIT 24HWQFN
Produkt ist nicht verfügbar
| MPC8343EVRADDB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620BGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-PBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Active
Description: IC MPU MPC83XX 266MHZ 620BGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-PBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Active
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 141 EUR |
| BFU668F,115 |
|
Hersteller: NXP USA Inc.
Description: TRANSISTOR NPN SOT343F
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Supplier Device Package: 4-DFP
Part Status: Obsolete
Description: TRANSISTOR NPN SOT343F
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Supplier Device Package: 4-DFP
Part Status: Obsolete
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| SPC5744PK1MLQ8R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| BUK7M21-40E,115 |
Hersteller: NXP USA Inc.
Description: BUK7M21-40E - N-CHANNEL 40V MOSF
Description: BUK7M21-40E - N-CHANNEL 40V MOSF
Produkt ist nicht verfügbar
| MIMX8MM4CVTKZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Part Status: Active
auf Bestellung 51 Stücke:
Lieferzeit 10-14 Tag (e)| S912XEQ512ACAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Produkt ist nicht verfügbar
| A2T21H360-23NR6 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2L
Current Rating (Amps): 10µA
Frequency: 2.11GHz ~ 2.2GHz
Configuration: Dual
Power - Output: 373W
Gain: 16.8dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2L
Current Rating (Amps): 10µA
Frequency: 2.11GHz ~ 2.2GHz
Configuration: Dual
Power - Output: 373W
Gain: 16.8dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
| A3I20X050GNR1 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Packaging: Tape & Reel (TR)
Package / Case: OM-400G-8
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
Configuration: Dual
Voltage - Supply: 20V ~ 32V
Power - Output: 6.3W
Gain: 29.3dB
Technology: LDMOS
Supplier Device Package: OM-400G-8
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 145 mA
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Packaging: Tape & Reel (TR)
Package / Case: OM-400G-8
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
Configuration: Dual
Voltage - Supply: 20V ~ 32V
Power - Output: 6.3W
Gain: 29.3dB
Technology: LDMOS
Supplier Device Package: OM-400G-8
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 145 mA
Produkt ist nicht verfügbar
| A3I20X050NR1 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Packaging: Tape & Reel (TR)
Package / Case: OM-400-8
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
Configuration: Dual
Voltage - Supply: 20V ~ 32V
Power - Output: 6.3W
Gain: 29.3dB
Technology: LDMOS
Supplier Device Package: OM-400-8
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 145 mA
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Packaging: Tape & Reel (TR)
Package / Case: OM-400-8
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
Configuration: Dual
Voltage - Supply: 20V ~ 32V
Power - Output: 6.3W
Gain: 29.3dB
Technology: LDMOS
Supplier Device Package: OM-400-8
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 145 mA
Produkt ist nicht verfügbar
| 74LV165DB118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LV165DB - PARALLE
Description: NOW NEXPERIA 74LV165DB - PARALLE
Produkt ist nicht verfügbar
| PCF85176T/1Y |
|
Hersteller: NXP USA Inc.
Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2000+ | 1.63 EUR |
| PCF85176T/1Y |
|
Hersteller: NXP USA Inc.
Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5395 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 3.56 EUR |
| 10+ | 3.2 EUR |
| 25+ | 3.02 EUR |
| 100+ | 2.57 EUR |
| 250+ | 2.42 EUR |
| 500+ | 2.11 EUR |
| 1000+ | 1.75 EUR |
| BZX84-B5V1215 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 5.1V 250MW TO236AB
Description: DIODE ZENER 5.1V 250MW TO236AB
Produkt ist nicht verfügbar
| S9S08RNA60W1VLHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 12.25 EUR |
| 10+ | 9.57 EUR |
| 100+ | 7.84 EUR |
| 500+ | 7.68 EUR |
| LPC3240FET296015 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Active
Number of I/O: 51
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Active
Number of I/O: 51
Produkt ist nicht verfügbar
| MCZ33903CS5EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
auf Bestellung 61 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 61+ | 9.8 EUR |
| CGD944C,112 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115J
Description: IC AMP CATV SOT115J
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)| A3T23H300W23SR6 |
|
Produkt ist nicht verfügbar
| PCX2131TF |
Hersteller: NXP USA Inc.
Description: USB TYPE-C REV 3.0 PD PHY
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: USB TYPE-C REV 3.0 PD PHY
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SPC5603BK0MLL4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Produkt ist nicht verfügbar
| SPC5603BK0MLL4R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Produkt ist nicht verfügbar
| PEMB15,115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PEMB15 - SMALL SIGN
Description: NOW NEXPERIA PEMB15 - SMALL SIGN
auf Bestellung 62428 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 7340+ | 0.068 EUR |
| MC33772BTP1AE |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
| PCF8578HT/1,518 |
|
Hersteller: NXP USA Inc.
Description: IC DRVR DOT MATRIX 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 6V
Supplier Device Package: 64-TQFP (10x10)
Description: IC DRVR DOT MATRIX 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 6V
Supplier Device Package: 64-TQFP (10x10)
Produkt ist nicht verfügbar
| S9KEAZN64ACLH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCU-LINK-PRO |
|
Hersteller: NXP USA Inc.
Description: ARM CORTEX-M DEBUG PROBE
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s), Accessories
Part Status: Active
Description: ARM CORTEX-M DEBUG PROBE
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s), Accessories
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 80.52 EUR |
| 74LV32DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Description: IC GATE OR 4CH 2-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
auf Bestellung 10866 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2959+ | 0.16 EUR |
| 74HC11PW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: IC GATE AND 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE AND 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
| MC9S08SE4MWL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Description: IC MCU 8BIT 4KB FLASH 28SOIC
auf Bestellung 3666 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 171+ | 3.23 EUR |
| BB199,115 |
|
Hersteller: NXP USA Inc.
Description: DIODE RF VCO/FM RAD TUNE SOD-523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
Description: DIODE RF VCO/FM RAD TUNE SOD-523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
Produkt ist nicht verfügbar
| BB199,115 |
|
Hersteller: NXP USA Inc.
Description: DIODE RF VCO/FM RAD TUNE SOD-523
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
Description: DIODE RF VCO/FM RAD TUNE SOD-523
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2219+ | 0.23 EUR |
| S9S12GN16AMLFR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LX2082RC82029B |
Hersteller: NXP USA Inc.
Description: 8XA72 64-BIT ARM 2GHZ CAN-FD
Description: 8XA72 64-BIT ARM 2GHZ CAN-FD
Produkt ist nicht verfügbar
| BAP70AM135 |
|
Hersteller: NXP USA Inc.
Description: DIODE PIN 50V 100MA 6TSSOP
Description: DIODE PIN 50V 100MA 6TSSOP
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)| LX2160XC72029B |
Hersteller: NXP USA Inc.
Description: SSL MATRIX CONTROLLER
Description: SSL MATRIX CONTROLLER
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)| 74AHC126D,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 14-SO
Part Status: Active
Description: IC BUFFER NON-INVERT 5.5V 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 14-SO
Part Status: Active
auf Bestellung 28426 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2458+ | 0.19 EUR |
| NBP8FD4T1 |
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Description: IC PRESSURE SENSOR 24HQFN
Produkt ist nicht verfügbar
| BFG31,115 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS PNP 15V 5GHZ SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 175°C (TJ)
Power - Max: 1W
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 70mA, 10V
Frequency - Transition: 5GHz
Supplier Device Package: SC-73
Description: RF TRANS PNP 15V 5GHZ SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 175°C (TJ)
Power - Max: 1W
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 70mA, 10V
Frequency - Transition: 5GHz
Supplier Device Package: SC-73
Produkt ist nicht verfügbar
| BFG310/XR,215 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 6V 14GHZ SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 18dB
Power - Max: 60mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 6V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1dB @ 2GHz
Supplier Device Package: SOT-143R
Description: RF TRANS NPN 6V 14GHZ SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 18dB
Power - Max: 60mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 6V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1dB @ 2GHz
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
| MC9S12DT256MPVE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Produkt ist nicht verfügbar
| MC33797BPEWR2518 |
|
Hersteller: NXP USA Inc.
Description: FOUR CHANNEL SQUIB DRIVER IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FOUR CHANNEL SQUIB DRIVER IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| BA591/A115 |
|
Hersteller: NXP USA Inc.
Description: MIXER DIODE, VERY HIGH FREQUENCY
Packaging: Bulk
Part Status: Active
Package / Case: SC-76, SOD-323
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-323
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Grade: Automotive
Qualification: AEC-Q101
Description: MIXER DIODE, VERY HIGH FREQUENCY
Packaging: Bulk
Part Status: Active
Package / Case: SC-76, SOD-323
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-323
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3806+ | 0.13 EUR |
| 74AVCH4T245PW118 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Produkt ist nicht verfügbar
| MIMXRT117FCVM8A |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 760 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 41.2 EUR |
| 10+ | 33.05 EUR |
| 80+ | 28.22 EUR |
| MIMXRT117FDVMAA |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 760 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 38.39 EUR |
| 10+ | 30.79 EUR |
| 80+ | 26.29 EUR |
| PXLS83722AESR2 |
Produkt ist nicht verfügbar
| 74AVC8T245PW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Part Status: Active
Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
| 74AVC8T245PW112 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Part Status: Active
Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
| UJA1167ATK/X/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| BZX84-C5V6/LF1VL |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 5.6V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Description: DIODE ZENER 5.6V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Produkt ist nicht verfügbar
| BZX84-C5V6/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 5.6V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Description: DIODE ZENER 5.6V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Produkt ist nicht verfügbar
| PIP202-12M-2,518 |
|
Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRVR 25A 68HVQFN
Packaging: Cut Tape (CT)
Features: Bootstrap Circuit
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: PWM
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 3.3V ~ 12V
Applications: Synchronous Buck Converters
Current - Output / Channel: 25A
Current - Peak Output: 200A
Technology: Power MOSFET
Voltage - Load: 25V (Max)
Supplier Device Package: 68-HVQFN (10x10)
Load Type: Inductive
Part Status: Obsolete
Description: IC HALF BRIDGE DRVR 25A 68HVQFN
Packaging: Cut Tape (CT)
Features: Bootstrap Circuit
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: PWM
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 3.3V ~ 12V
Applications: Synchronous Buck Converters
Current - Output / Channel: 25A
Current - Peak Output: 200A
Technology: Power MOSFET
Voltage - Load: 25V (Max)
Supplier Device Package: 68-HVQFN (10x10)
Load Type: Inductive
Part Status: Obsolete
Produkt ist nicht verfügbar
| LPC1776FBD208K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
auf Bestellung 77 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 29.36 EUR |
| 10+ | 23.46 EUR |
| NHS3100/A1Z |
|
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Description: IC RFID READER 13.56MHZ 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
auf Bestellung 475 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 6.67 EUR |
| 10+ | 5.95 EUR |
| 25+ | 5.35 EUR |
| 100+ | 4.88 EUR |
| 250+ | 4.4 EUR |
| MC33772CTC0AE |
|
Hersteller: NXP USA Inc.
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
auf Bestellung 502 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 16.65 EUR |
| 10+ | 15.03 EUR |
| 25+ | 14.33 EUR |
| 80+ | 12.45 EUR |
| 250+ | 11.89 EUR |
| 500+ | 10.84 EUR |
| SPC5643LF2MLQ1R,528 |
Hersteller: NXP USA Inc.
Description: 32 BIT MCU, DUAL- POWER ARCHITEC
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Description: 32 BIT MCU, DUAL- POWER ARCHITEC
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| WLAN3002CZ |
|
Hersteller: NXP USA Inc.
Description: IC AMP GPS 4.9-5.925GHZ 8HX2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 4.9GHz ~ 5.925GHz
RF Type: General Purpose
Voltage - Supply: 2.7V ~ 5.25V
Gain: 16dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 32dBm
Test Frequency: 5.4GHz
Supplier Device Package: 8-HX2SON (1.5x1.5)
Part Status: Active
Description: IC AMP GPS 4.9-5.925GHZ 8HX2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 4.9GHz ~ 5.925GHz
RF Type: General Purpose
Voltage - Supply: 2.7V ~ 5.25V
Gain: 16dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 32dBm
Test Frequency: 5.4GHz
Supplier Device Package: 8-HX2SON (1.5x1.5)
Part Status: Active
Produkt ist nicht verfügbar