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T1013NXN7MQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.2GHZ 525FCPBGA
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: GbE (8)
Supplier Device Package: 525-FCPBGA (19x19)
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MCF52211CAE66 MCF52211CAE66 NXP USA Inc. MCF52211.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 43
Part Status: Last Time Buy
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: Coldfire V2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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BZV90-C7V5115 BZV90-C7V5115 NXP USA Inc. BZV90.pdf Description: DIODE ZENER 75V 1.5W 5% UNIDIR
Current - Reverse Leakage @ Vr: 1 µA @ 5 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Power - Max: 1.5 W
Part Status: Active
Supplier Device Package: SOT-223
Impedance (Max) (Zzt): 15 Ohms
Voltage - Zener (Nom) (Vz): 7.5 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Produkt ist nicht verfügbar
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MRFE6P9220HR3 NXP USA Inc. MRFE6P9220H.pdf Description: RF MOSFET LDMOS 28V NI860C3
Current - Test: 1.6 A
Voltage - Test: 28 V
Voltage - Rated: 66 V
Part Status: Obsolete
Supplier Device Package: NI-860C3
Technology: LDMOS
Gain: 20dB
Power - Output: 47W
Frequency: 880MHz
Mounting Type: Chassis Mount
Package / Case: NI-860C3
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S08DZ128F2MLH S9S08DZ128F2MLH NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
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10+15.32 EUR
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80+13.71 EUR
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MPXV5004GC7U MPXV5004GC7U NXP USA Inc. MPXV5004G.pdf Description: SENSOR 0.57PSIG 0.13" 4.9V 8DIP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 1 V ~ 4.9 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Operating Temperature: 0°C ~ 85°C
Termination Style: PC Pin
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: Barbless
Maximum Pressure: 2.32PSI (16kPa)
Part Status: Obsolete
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MC9S08AC32CFUE MC9S08AC32CFUE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 32KB FLASH 64QFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
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MC9S08AC32MFGE MC9S08AC32MFGE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 32KB FLASH 44LQFP
Part Status: Active
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 34
Data Converters: A/D 8x10b
Core Processor: S08
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FS32K118LFT0MLHT FS32K118LFT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
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2+14.99 EUR
10+11.6 EUR
25+10.76 EUR
100+9.83 EUR
250+9.38 EUR
800+8.96 EUR
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MC56F8365VFGE MC56F8365VFGE NXP USA Inc. MC56F8365.pdf Description: IC MCU 16BIT 512KB FLASH 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (256K x 16)
RAM Size: 18K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 128-LQFP (14x20)
Part Status: Last Time Buy
Number of I/O: 49
DigiKey Programmable: Not Verified
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BAS21J/ZL NXP USA Inc. BAS21J.pdf Description: BAS21J - SINGLE HIGH-SPEED SWITC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08JM60CGT MC9S08JM60CGT NXP USA Inc. MC9S08JM16.pdf Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Discontinued at Digi-Key
Number of I/O: 37
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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KMZ49,118 KMZ49,118 NXP USA Inc. KMZ49.pdf Description: SENSOR ANGLE 45DEG SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SO
Rotation Angle - Electrical, Mechanical: 0° ~ 45°
Part Status: Last Time Buy
Resistance: 3.7 kOhms
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KMZ49,118 KMZ49,118 NXP USA Inc. KMZ49.pdf Description: SENSOR ANGLE 45DEG SMD
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SO
Rotation Angle - Electrical, Mechanical: 0° ~ 45°
Part Status: Last Time Buy
Resistance: 3.7 kOhms
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10+4.08 EUR
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50+3.44 EUR
100+3.2 EUR
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MHTG1200HSR3 NXP USA Inc. Description: RF MOSFET GAN NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Configuration: 2 N-Channel
Power - Output: 300W
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 50 V
Produkt ist nicht verfügbar
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MC33665ATU4AER2 MC33665ATU4AER2 NXP USA Inc. MC33665A_SDS.pdf Description: BMS GATEWAY IC UART
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3
Mounting Type: Surface Mount
Function: Power Management
Interface: UART
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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MC33665ATU4AE MC33665ATU4AE NXP USA Inc. MC33665A_SDS.pdf Description: BMS GATEWAY IC UART
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3
Mounting Type: Surface Mount
Function: Power Management
Interface: UART
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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A3I25X050GNR1 NXP USA Inc. A3I25X050N.pdf Description: RF MOSFET LDMOS 28V OM400G-8
Current - Test: 130 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Active
Supplier Device Package: OM-400G-8
Technology: LDMOS (Dual)
Gain: 28.8dB
Power - Output: 5.6W
Configuration: 2 N-Channel
Frequency: 2.3GHz ~ 2.7GHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: OM-400G-8
Packaging: Tape & Reel (TR)
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A3I25X050NR1 NXP USA Inc. A3I25X050N.pdf Description: RF MOSFET LDMOS 28V OM400-8
Packaging: Tape & Reel (TR)
Package / Case: OM-400-8
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
Configuration: 2 N-Channel
Power - Output: 5.6W
Gain: 28.8dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-400-8
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 130 mA
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TJA1028T/5V0/20/DZ TJA1028T/5V0/20/DZ NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
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TJA1028T/5V0/20/DZ TJA1028T/5V0/20/DZ NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
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TJA1028TK/3V3/20/J TJA1028TK/3V3/20/J NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
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TJA1028TK/3V3/20/J TJA1028TK/3V3/20/J NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
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7+3.12 EUR
10+2.28 EUR
25+2.07 EUR
100+1.84 EUR
250+1.74 EUR
500+1.67 EUR
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TJA1028T/3V3/20/DZ TJA1028T/3V3/20/DZ NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
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TJA1028T/3V3/20/DZ TJA1028T/3V3/20/DZ NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
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7+3.12 EUR
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25+2.07 EUR
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250+1.74 EUR
500+1.67 EUR
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TJA1028T/3V3/20/1U TJA1028T/3V3/20/1U NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1028T/5V0/20/1U TJA1028T/5V0/20/1U NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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MWCT1123FVLL MWCT1123FVLL NXP USA Inc. MWCT1123FVLL.pdf Description: KV4X WCT 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Applications: Microcontroller, MCU
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
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MWCT1023IFVLL MWCT1023IFVLL NXP USA Inc. MWCT1123FVLL.pdf Description: KV4X WCT 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Applications: Microcontroller, MCU
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
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74AHC08D-Q100118 74AHC08D-Q100118 NXP USA Inc. 74AHC_AHCT08_Q100.pdf Description: IC GATE AND
Packaging: Bulk
Part Status: Active
auf Bestellung 46687 Stücke:
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74AHC08BQ-Q100115 74AHC08BQ-Q100115 NXP USA Inc. 74AHC_AHCT08_Q100.pdf Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
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74AHC08BQ115 74AHC08BQ115 NXP USA Inc. 74AHC_AHCT08.pdf Description: NOW NEXPERIA 74AHC08BQ - AND GAT
Packaging: Bulk
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74AHC08PW-Q100118 74AHC08PW-Q100118 NXP USA Inc. 74AHC_AHCT08_Q100.pdf Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
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74AHC08BQ/C4115 74AHC08BQ/C4115 NXP USA Inc. 74AHC_AHCT08.pdf Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC08PW/S400118 74AHC08PW/S400118 NXP USA Inc. PHGLS15178-1.pdf?t.download=true&u=5oefqw Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
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74AHC08PW653 74AHC08PW653 NXP USA Inc. PHGLS15178-1.pdf?t.download=true&u=5oefqw Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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KITPF5200FRDMEVM KITPF5200FRDMEVM NXP USA Inc. getting-started-with-the-kitpf5200frdmevm-evaluation-board:GS-KITPF5200FRDMEVM Description: EVAL BOARD FOR KL25Z, PF5200
Packaging: Box
Function: Automotive
Type: Power Management
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
Part Status: Active
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MPC561MZP56 MPC561MZP56 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Not For New Designs
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: ROMless
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A7101CGTK2/T0B040X A7101CGTK2/T0B040X NXP USA Inc. Description: SECURE AUTHENTICATION MICROCONTR
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Program Memory Type: EEPROM (20kB)
Controller Series: A710x
Voltage - Supply: 1.62V ~ 3.6V
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I²C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A7101CGTK2/T0B0405 A7101CGTK2/T0B0405 NXP USA Inc. Description: SECURE AUTHENTICATION MICROCONTR
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Program Memory Type: EEPROM (20kB)
Controller Series: A710x
Voltage - Supply: 1.62V ~ 3.6V
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I²C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
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A7101CGT1/T0B0408, A7101CGT1/T0B0408, NXP USA Inc. Description: SECURE AUTHENTICATION MICROCONTR
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 8-SO
Core Processor: MX51
Applications: Authentication
Program Memory Type: EEPROM (20kB)
Controller Series: A710x
Voltage - Supply: 1.62V ~ 3.6V
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I²C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A7101CGHN1/T0B0406 A7101CGHN1/T0B0406 NXP USA Inc. Description: SECURE AUTHENTICATION MICROCONTR
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Core Processor: MX51
Applications: Authentication
Program Memory Type: EEPROM (20kB)
Controller Series: A710x
Voltage - Supply: 1.62V ~ 3.6V
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I²C
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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A7101CLTK2/T0BC2WJ A7101CLTK2/T0BC2WJ NXP USA Inc. PHGL-S-A0006349687-1.pdf?t.download=true&amp;u=5oefqw Description: PLUG TRUST SECURE ELEMENT
Packaging: Bulk
DigiKey Programmable: Not Verified
Part Status: Last Time Buy
Supplier Device Package: 8-HVSON (4x4)
Core Processor: i.MX6UL
Applications: Authentication
Controller Series: A71CL
Voltage - Supply: 3.6V
Operating Temperature: -25°C ~ 85°C (TA)
Interface: I2C, SmartCard
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Produkt ist nicht verfügbar
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MC34PF1510A2EPR2 MC34PF1510A2EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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SC16C654BIA529 NXP USA Inc. PIRSS01198-1.pdf?t.download=true&u=5oefqw Description: QUAD UART WITH 64-BYTE FIFOS AND
Packaging: Bulk
Part Status: Active
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BZX79-B24133 BZX79-B24133 NXP USA Inc. BZX79.pdf Description: NOW NEXPERIA BZX79-B24 - ZENER D
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX27LVOP4A MCIMX27LVOP4A NXP USA Inc. MCIMX27EC.pdf Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tray
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Part Status: Not For New Designs
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TWR-SB0800-36EVB NXP USA Inc. Description: EVALUATION BOARD - SB0800 SOLEN
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC34SB0800
Platform: Freescale Tower System
Part Status: Active
Produkt ist nicht verfügbar
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PHPT61002PYC115 PHPT61002PYC115 NXP USA Inc. PHPT61002PYC.pdf Description: POWER BIPOLAR TRANSISTOR, PNP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PHPT61006NY115 PHPT61006NY115 NXP USA Inc. PHPT61006NY.pdf Description: POWER BIPOLAR TRANSISTOR NPN
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9450AAHNY PCA9450AAHNY NXP USA Inc. PCA9450.pdf Description: PMIC FOR I.MX8M MINI 845S 56HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 3530 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.34 EUR
10+10.26 EUR
25+9.48 EUR
100+8.64 EUR
250+8.37 EUR
500+7.89 EUR
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SPC5747CK1MMJ6R SPC5747CK1MMJ6R NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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88W8887-A2-CBKE/AZ NXP USA Inc. Description: IC RF TXRX BLE 124WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 124-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v4.2 Dual Mode
Data Rate (Max): 433Mbps
Supplier Device Package: 124-WLCSP
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PCM, SDIO, UART
Part Status: Active
Produkt ist nicht verfügbar
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88W8787-A1-BRDA/BZ NXP USA Inc. Description: IC RF TXRX BLE 120VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 120-VFBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11a/g/b, Bluetooth v2.1 +EDR
Data Rate (Max): 150Mbps
Supplier Device Package: 120-VFBGA (7x7)
Modulation: 4DQPSK, 8DPSK, DSSS, GFSK, OFDM
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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PESD5V0U1BL/315 NXP USA Inc. Description: TVS DIODE 5VWM DFN1006-2
Part Status: Active
Power Line Protection: No
Voltage - Breakdown (Min): 5.5V
Bidirectional Channels: 1
Supplier Device Package: DFN1006-2
Voltage - Reverse Standoff (Typ): 5V (Max)
Capacitance @ Frequency: 2.9pF @ 1MHz
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6L7DVN10AB MCIMX6L7DVN10AB NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A4EP MC34PF1510A4EP NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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MKW21Z512VHT4 MKW21Z512VHT4 NXP USA Inc. MKW41Z512.pdf Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Zigbee®
Current - Receiving: 6.2mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
2+18.27 EUR
10+15.85 EUR
25+15.01 EUR
100+13.85 EUR
260+13.14 EUR
520+12.65 EUR
1040+12.2 EUR
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MC9RS08KA4CPJ MC9RS08KA4CPJ NXP USA Inc. MC9RS08KA%284%2C8%29.pdf Description: IC MCU 8BIT 4KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC54102J256BD64QL LPC54102J256BD64QL NXP USA Inc. LPC5410X.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
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2+20.56 EUR
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T1013NXN7MQA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 525FCPBGA
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: GbE (8)
Supplier Device Package: 525-FCPBGA (19x19)
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MCF52211CAE66 MCF52211.pdf
MCF52211CAE66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 43
Part Status: Last Time Buy
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: Coldfire V2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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BZV90-C7V5115 BZV90.pdf
BZV90-C7V5115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 75V 1.5W 5% UNIDIR
Current - Reverse Leakage @ Vr: 1 µA @ 5 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Power - Max: 1.5 W
Part Status: Active
Supplier Device Package: SOT-223
Impedance (Max) (Zzt): 15 Ohms
Voltage - Zener (Nom) (Vz): 7.5 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Produkt ist nicht verfügbar
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MRFE6P9220HR3 MRFE6P9220H.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI860C3
Current - Test: 1.6 A
Voltage - Test: 28 V
Voltage - Rated: 66 V
Part Status: Obsolete
Supplier Device Package: NI-860C3
Technology: LDMOS
Gain: 20dB
Power - Output: 47W
Frequency: 880MHz
Mounting Type: Chassis Mount
Package / Case: NI-860C3
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S08DZ128F2MLH MC9S08DZ128.pdf
S9S08DZ128F2MLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+19.5 EUR
10+15.32 EUR
25+14.27 EUR
80+13.71 EUR
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MPXV5004GC7U MPXV5004G.pdf
MPXV5004GC7U
Hersteller: NXP USA Inc.
Description: SENSOR 0.57PSIG 0.13" 4.9V 8DIP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 1 V ~ 4.9 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Operating Temperature: 0°C ~ 85°C
Termination Style: PC Pin
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: Barbless
Maximum Pressure: 2.32PSI (16kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08AC32CFUE MC9S08AC60AD.pdf
MC9S08AC32CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
auf Bestellung 394 Stücke:
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AnzahlPrivatkunde
2+16.62 EUR
10+12.94 EUR
25+12.02 EUR
100+11 EUR
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MC9S08AC32MFGE MC9S08AC60AD.pdf
MC9S08AC32MFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Part Status: Active
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 34
Data Converters: A/D 8x10b
Core Processor: S08
Produkt ist nicht verfügbar
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FS32K118LFT0MLHT S32K1xx.pdf
FS32K118LFT0MLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
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2+14.99 EUR
10+11.6 EUR
25+10.76 EUR
100+9.83 EUR
250+9.38 EUR
800+8.96 EUR
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MC56F8365VFGE MC56F8365.pdf
MC56F8365VFGE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (256K x 16)
RAM Size: 18K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 128-LQFP (14x20)
Part Status: Last Time Buy
Number of I/O: 49
DigiKey Programmable: Not Verified
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1+111.66 EUR
10+92.05 EUR
25+87.16 EUR
80+82.5 EUR
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BAS21J/ZL BAS21J.pdf
Hersteller: NXP USA Inc.
Description: BAS21J - SINGLE HIGH-SPEED SWITC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08JM60CGT MC9S08JM16.pdf
MC9S08JM60CGT
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Discontinued at Digi-Key
Number of I/O: 37
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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KMZ49,118 KMZ49.pdf
KMZ49,118
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 45DEG SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SO
Rotation Angle - Electrical, Mechanical: 0° ~ 45°
Part Status: Last Time Buy
Resistance: 3.7 kOhms
Produkt ist nicht verfügbar
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KMZ49,118 KMZ49.pdf
KMZ49,118
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 45DEG SMD
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SO
Rotation Angle - Electrical, Mechanical: 0° ~ 45°
Part Status: Last Time Buy
Resistance: 3.7 kOhms
auf Bestellung 443 Stücke:
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5+4.39 EUR
10+4.08 EUR
25+3.71 EUR
50+3.44 EUR
100+3.2 EUR
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MHTG1200HSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Configuration: 2 N-Channel
Power - Output: 300W
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 50 V
Produkt ist nicht verfügbar
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MC33665ATU4AER2 MC33665A_SDS.pdf
MC33665ATU4AER2
Hersteller: NXP USA Inc.
Description: BMS GATEWAY IC UART
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3
Mounting Type: Surface Mount
Function: Power Management
Interface: UART
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33665ATU4AE MC33665A_SDS.pdf
MC33665ATU4AE
Hersteller: NXP USA Inc.
Description: BMS GATEWAY IC UART
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3
Mounting Type: Surface Mount
Function: Power Management
Interface: UART
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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A3I25X050GNR1 A3I25X050N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM400G-8
Current - Test: 130 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Active
Supplier Device Package: OM-400G-8
Technology: LDMOS (Dual)
Gain: 28.8dB
Power - Output: 5.6W
Configuration: 2 N-Channel
Frequency: 2.3GHz ~ 2.7GHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: OM-400G-8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A3I25X050NR1 A3I25X050N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM400-8
Packaging: Tape & Reel (TR)
Package / Case: OM-400-8
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
Configuration: 2 N-Channel
Power - Output: 5.6W
Gain: 28.8dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-400-8
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 130 mA
Produkt ist nicht verfügbar
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TJA1028T/5V0/20/DZ TJA1028.pdf
TJA1028T/5V0/20/DZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028T/5V0/20/DZ TJA1028.pdf
TJA1028T/5V0/20/DZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 9 Stücke:
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7+3.19 EUR
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TJA1028TK/3V3/20/J TJA1028.pdf
TJA1028TK/3V3/20/J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/3V3/20/J TJA1028.pdf
TJA1028TK/3V3/20/J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 633 Stücke:
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7+3.12 EUR
10+2.28 EUR
25+2.07 EUR
100+1.84 EUR
250+1.74 EUR
500+1.67 EUR
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TJA1028T/3V3/20/DZ TJA1028.pdf
TJA1028T/3V3/20/DZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028T/3V3/20/DZ TJA1028.pdf
TJA1028T/3V3/20/DZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 888 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7+3.12 EUR
10+2.28 EUR
25+2.07 EUR
100+1.84 EUR
250+1.74 EUR
500+1.67 EUR
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TJA1028T/3V3/20/1U TJA1028.pdf
TJA1028T/3V3/20/1U
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1028T/5V0/20/1U TJA1028.pdf
TJA1028T/5V0/20/1U
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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MWCT1123FVLL MWCT1123FVLL.pdf
MWCT1123FVLL
Hersteller: NXP USA Inc.
Description: KV4X WCT 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Applications: Microcontroller, MCU
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Produkt ist nicht verfügbar
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MWCT1023IFVLL MWCT1123FVLL.pdf
MWCT1023IFVLL
Hersteller: NXP USA Inc.
Description: KV4X WCT 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Applications: Microcontroller, MCU
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Produkt ist nicht verfügbar
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74AHC08D-Q100118 74AHC_AHCT08_Q100.pdf
74AHC08D-Q100118
Hersteller: NXP USA Inc.
Description: IC GATE AND
Packaging: Bulk
Part Status: Active
auf Bestellung 46687 Stücke:
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2470+0.24 EUR
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74AHC08BQ-Q100115 74AHC_AHCT08_Q100.pdf
74AHC08BQ-Q100115
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 2520 Stücke:
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2520+0.27 EUR
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74AHC08BQ115 74AHC_AHCT08.pdf
74AHC08BQ115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC08BQ - AND GAT
Packaging: Bulk
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74AHC08PW-Q100118 74AHC_AHCT08_Q100.pdf
74AHC08PW-Q100118
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC08BQ/C4115 74AHC_AHCT08.pdf
74AHC08BQ/C4115
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC08PW/S400118 PHGLS15178-1.pdf?t.download=true&u=5oefqw
74AHC08PW/S400118
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC08PW653 PHGLS15178-1.pdf?t.download=true&u=5oefqw
74AHC08PW653
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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KITPF5200FRDMEVM getting-started-with-the-kitpf5200frdmevm-evaluation-board:GS-KITPF5200FRDMEVM
KITPF5200FRDMEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR KL25Z, PF5200
Packaging: Box
Function: Automotive
Type: Power Management
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
Part Status: Active
auf Bestellung 3 Stücke:
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1+530.6 EUR
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MPC561MZP56 MPC561RM.pdf
MPC561MZP56
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Not For New Designs
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: ROMless
Produkt ist nicht verfügbar
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A7101CGTK2/T0B040X
A7101CGTK2/T0B040X
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Program Memory Type: EEPROM (20kB)
Controller Series: A710x
Voltage - Supply: 1.62V ~ 3.6V
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I²C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A7101CGTK2/T0B0405
A7101CGTK2/T0B0405
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Program Memory Type: EEPROM (20kB)
Controller Series: A710x
Voltage - Supply: 1.62V ~ 3.6V
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I²C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A7101CGT1/T0B0408,
A7101CGT1/T0B0408,
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 8-SO
Core Processor: MX51
Applications: Authentication
Program Memory Type: EEPROM (20kB)
Controller Series: A710x
Voltage - Supply: 1.62V ~ 3.6V
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I²C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A7101CGHN1/T0B0406
A7101CGHN1/T0B0406
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Core Processor: MX51
Applications: Authentication
Program Memory Type: EEPROM (20kB)
Controller Series: A710x
Voltage - Supply: 1.62V ~ 3.6V
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I²C
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A7101CLTK2/T0BC2WJ PHGL-S-A0006349687-1.pdf?t.download=true&amp;u=5oefqw
A7101CLTK2/T0BC2WJ
Hersteller: NXP USA Inc.
Description: PLUG TRUST SECURE ELEMENT
Packaging: Bulk
DigiKey Programmable: Not Verified
Part Status: Last Time Buy
Supplier Device Package: 8-HVSON (4x4)
Core Processor: i.MX6UL
Applications: Authentication
Controller Series: A71CL
Voltage - Supply: 3.6V
Operating Temperature: -25°C ~ 85°C (TA)
Interface: I2C, SmartCard
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Produkt ist nicht verfügbar
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MC34PF1510A2EPR2 PF1510.pdf
MC34PF1510A2EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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SC16C654BIA529 PIRSS01198-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: QUAD UART WITH 64-BYTE FIFOS AND
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX79-B24133 BZX79.pdf
BZX79-B24133
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-B24 - ZENER D
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX27LVOP4A MCIMX27EC.pdf
MCIMX27LVOP4A
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tray
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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TWR-SB0800-36EVB
Hersteller: NXP USA Inc.
Description: EVALUATION BOARD - SB0800 SOLEN
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC34SB0800
Platform: Freescale Tower System
Part Status: Active
Produkt ist nicht verfügbar
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PHPT61002PYC115 PHPT61002PYC.pdf
PHPT61002PYC115
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR, PNP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PHPT61006NY115 PHPT61006NY.pdf
PHPT61006NY115
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR NPN
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9450AAHNY PCA9450.pdf
PCA9450AAHNY
Hersteller: NXP USA Inc.
Description: PMIC FOR I.MX8M MINI 845S 56HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 3530 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+13.34 EUR
10+10.26 EUR
25+9.48 EUR
100+8.64 EUR
250+8.37 EUR
500+7.89 EUR
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SPC5747CK1MMJ6R MPC5748G.pdf
SPC5747CK1MMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8887-A2-CBKE/AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 124WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 124-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v4.2 Dual Mode
Data Rate (Max): 433Mbps
Supplier Device Package: 124-WLCSP
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PCM, SDIO, UART
Part Status: Active
Produkt ist nicht verfügbar
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88W8787-A1-BRDA/BZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 120VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 120-VFBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11a/g/b, Bluetooth v2.1 +EDR
Data Rate (Max): 150Mbps
Supplier Device Package: 120-VFBGA (7x7)
Modulation: 4DQPSK, 8DPSK, DSSS, GFSK, OFDM
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Part Status: Active
Produkt ist nicht verfügbar
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PESD5V0U1BL/315
Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM DFN1006-2
Part Status: Active
Power Line Protection: No
Voltage - Breakdown (Min): 5.5V
Bidirectional Channels: 1
Supplier Device Package: DFN1006-2
Voltage - Reverse Standoff (Typ): 5V (Max)
Capacitance @ Frequency: 2.9pF @ 1MHz
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6L7DVN10AB IMX6SLCEC.pdf
MCIMX6L7DVN10AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A4EP PF1510.pdf
MC34PF1510A4EP
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MKW21Z512VHT4 MKW41Z512.pdf
MKW21Z512VHT4
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Zigbee®
Current - Receiving: 6.2mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+18.27 EUR
10+15.85 EUR
25+15.01 EUR
100+13.85 EUR
260+13.14 EUR
520+12.65 EUR
1040+12.2 EUR
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MC9RS08KA4CPJ MC9RS08KA%284%2C8%29.pdf
MC9RS08KA4CPJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC54102J256BD64QL LPC5410X.pdf
LPC54102J256BD64QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 208 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+20.56 EUR
10+16.08 EUR
25+14.96 EUR
160+13.41 EUR
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