Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35464) > Seite 473 nach 592
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SGTL5000XNBA3R2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Type: Stereo Audio Data Interface: I2C, I2S, PCM, SPI Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply, Analog: 1.62V ~ 3.6V Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V Dynamic Range, ADCs / DACs (db) Typ: 87 / 100 Number of ADCs / DACs: 1 / 1 S/N Ratio, ADCs / DACs (db) Typ: 90 / 100 Sigma Delta: No Part Status: Active |
Produkt ist nicht verfügbar |
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SGTL5000XNBA3 | NXP USA Inc. |
![]() Packaging: Tray Type: Stereo Audio Data Interface: I2C, I2S, PCM, SPI Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply, Analog: 1.62V ~ 3.6V Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V Dynamic Range, ADCs / DACs (db) Typ: 87 / 100 Number of ADCs / DACs: 1 / 1 S/N Ratio, ADCs / DACs (db) Typ: 90 / 100 Sigma Delta: No Part Status: Active |
auf Bestellung 284 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6U5DVM10ACR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 1379 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI6QFN/CG,132 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 11pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 9dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Part Status: Obsolete Number of Channels: 6 |
Produkt ist nicht verfügbar |
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PEMI6QFN/CG,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 11pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 9dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Part Status: Obsolete Number of Channels: 6 |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XD64F2MAA557 | NXP USA Inc. |
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auf Bestellung 1260 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12XS128J1MAA557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S912XEG128J2MAA557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S912XD128F2MAA557 | NXP USA Inc. | Description: MICROCONTROLLER, 16-BIT, FLASH, |
Produkt ist nicht verfügbar |
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AFT23H201-24SR6 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: ACP-1230S-4L2L Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 2.3GHz ~ 2.4GHz Power - Output: 210W Gain: 15.6dB Technology: LDMOS Supplier Device Package: ACP-1230S-4L2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 500 mA |
Produkt ist nicht verfügbar |
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BGO807C/SC0112 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 10848 Stücke: Lieferzeit 10-14 Tag (e) |
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BGO807C/FC0112 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 16029 Stücke: Lieferzeit 10-14 Tag (e) |
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SC16C752BIBS,157 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 64 Byte Data Rate (Max): 5Mbps Supplier Device Package: 32-HVQFN (5x5) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
auf Bestellung 2020 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08DN32F2CLC | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.5K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 25 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC33772BTP2AE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: TPL Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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MC33772BTC0AER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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MC33772BSA2AE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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MC33772BSP1AER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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MC34PF3000A3EPR2,528 | NXP USA Inc. |
Description: IC BATT PWR MGMT Packaging: Bulk |
Produkt ist nicht verfügbar |
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MC32PF3000A2EP557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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SL3S1204FUD/BG/MVZ | NXP USA Inc. | Description: IC RFID CHIP UCODE 7 UNCASED |
Produkt ist nicht verfügbar |
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74LV86DB,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5.5V Current - Output High, Low: 12mA, 12mA Number of Inputs: 2 Supplier Device Package: 14-SSOP Input Logic Level - High: 0.9V ~ 2V Input Logic Level - Low: 0.3V ~ 0.8V Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF Part Status: Obsolete Number of Circuits: 4 Current - Quiescent (Max): 40 µA |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC852TVR100A | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
Produkt ist nicht verfügbar |
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BZX84-C33/LF1VL | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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BZX84-C33/LF1R | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MK30DX128VLL7 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 70 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P3041NXN7PNC | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MCIMX6L3EVN10AC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6X3CVN08AC | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MKE02Z32VQH2 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 57 DigiKey Programmable: Not Verified |
auf Bestellung 420 Stücke: Lieferzeit 10-14 Tag (e) |
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BGM1011,115 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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SPC5602BK0MLH4R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 12x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5603BK0CLQ6R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 36x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 123 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCIMX6G2CVM05AA | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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SPC5603BK0CLQ6 | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 36x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 123 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9KEAZ64AVLHR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKL27Z128VLH4R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 50 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5602BK0MLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 12x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MMA9555LR1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor Package / Case: 16-VFLGA Output Type: I²C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 1.89V Bandwidth: 1.9Hz ~ 244Hz Supplier Device Package: 16-LGA (3x3) Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g) |
Produkt ist nicht verfügbar |
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MMA9555LR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor Package / Case: 16-VFLGA Output Type: I²C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 1.89V Bandwidth: 1.9Hz ~ 244Hz Supplier Device Package: 16-LGA (3x3) Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g) |
Produkt ist nicht verfügbar |
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PEMI8QFN/LM,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 65Ohms, C = 16pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 17dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 65 ESD Protection: Yes Part Status: Obsolete Number of Channels: 8 |
auf Bestellung 16000 Stücke: Lieferzeit 10-14 Tag (e) |
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IP4285CZ6-TD125 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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SL3S1002FTB1,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 3-XDFN Mounting Type: Surface Mount Frequency: 840MHz ~ 960MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C Standards: ISO 15693, ISO 18000-6 Supplier Device Package: 3-XSON (1x1.45) Part Status: Obsolete |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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KITPF8101FRDMEVM | NXP USA Inc. | Description: FRDM EXPANSION BOARD PF8101 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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LS2088ASE7V1B | NXP USA Inc. |
Description: IC MPU QORIQ 2.0GHZ 1292FCPBGA Packaging: Tray Package / Case: 1292-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 2.0GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 1292-FCPBGA (37.5x37.5) Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR4 SATA: SATA 6Gbps (2) |
Produkt ist nicht verfügbar |
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NXH3670SDKUL | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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SAF775DHN/N208W/AK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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S912ZVMC12F3VKH | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MPF7100BVBA0ES | NXP USA Inc. | Description: PF7100 PMIC OTP |
Produkt ist nicht verfügbar |
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LS2088AXE7V1B | NXP USA Inc. | Description: LS2088A XT WE 2000 R1.1 |
Produkt ist nicht verfügbar |
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CBT3384PW,112 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 24-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 5 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 2 Voltage Supply Source: Single Supply Supplier Device Package: 24-TSSOP Part Status: Active |
auf Bestellung 3150 Stücke: Lieferzeit 10-14 Tag (e) |
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CBTD3384D,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Circuit: 5 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 2 Voltage Supply Source: Single Supply Supplier Device Package: 24-SO Part Status: Active |
auf Bestellung 3183 Stücke: Lieferzeit 10-14 Tag (e) |
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DEMO-BYL1-EVB | NXP USA Inc. |
Description: EVAL BOARD FOR FS8500 Packaging: Bulk Function: Special Purpose: Mobiles Type: Power Management Utilized IC / Part: FS8500, PF5020, PF5024 Supplied Contents: Board(s), Cable(s) Part Status: Active Contents: Board(s), Cable(s) |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33FS8530A0ES | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
auf Bestellung 160 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XDT256F1MAL | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5644BK0MLU8R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 147 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC33PF8200ESESR2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC56F84789VLL557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74LVC3G06GN,115 | NXP USA Inc. |
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auf Bestellung 189977 Stücke: Lieferzeit 10-14 Tag (e) |
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BGA2851,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 2.2GHz RF Type: General Purpose Voltage - Supply: 4.5V ~ 5.5V Gain: 25.2dB Current - Supply: 7mA Noise Figure: 3dB P1dB: -5dBm Test Frequency: 2.15GHz Supplier Device Package: 6-TSSOP |
auf Bestellung 8637 Stücke: Lieferzeit 10-14 Tag (e) |
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SGTL5000XNBA3R2 |
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Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tape & Reel (TR)
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tape & Reel (TR)
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SGTL5000XNBA3 |
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Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tray
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tray
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
auf Bestellung 284 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 7.96 EUR |
10+ | 6.07 EUR |
25+ | 5.6 EUR |
100+ | 5.08 EUR |
MCIMX6U5DVM10ACR |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 1379 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 72.67 EUR |
10+ | 59.55 EUR |
25+ | 56.27 EUR |
100+ | 52.67 EUR |
250+ | 50.95 EUR |
PEMI6QFN/CG,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
PEMI6QFN/CG,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1902+ | 0.28 EUR |
S912XD64F2MAA557 |
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Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12X CORE, 64KB FLAS
Description: 16-BIT MCU, S12X CORE, 64KB FLAS
auf Bestellung 1260 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
24+ | 21.34 EUR |
S9S12XS128J1MAA557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 16-BIT, HCS12 C
Description: MICROCONTROLLER 16-BIT, HCS12 C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S912XEG128J2MAA557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 16-BIT FLASH,
Description: MICROCONTROLLER 16-BIT FLASH,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S912XD128F2MAA557 |
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, FLASH,
Description: MICROCONTROLLER, 16-BIT, FLASH,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AFT23H201-24SR6 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 210W
Gain: 15.6dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 28V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 210W
Gain: 15.6dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BGO807C/SC0112 |
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auf Bestellung 10848 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 119.31 EUR |
BGO807C/FC0112 |
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auf Bestellung 16029 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 114.24 EUR |
SC16C752BIBS,157 |
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Hersteller: NXP USA Inc.
Description: IC DUAL UART 64BYTE 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: IC DUAL UART 64BYTE 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
auf Bestellung 2020 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.03 EUR |
10+ | 6.9 EUR |
25+ | 6.75 EUR |
100+ | 5.8 EUR |
250+ | 5.75 EUR |
S9S08DN32F2CLC |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC33772BTP2AE |
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Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC33772BTC0AER2 |
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Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC33772BSA2AE |
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Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC33772BSP1AER2 |
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Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC32PF3000A2EP557 |
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Hersteller: NXP USA Inc.
Description: IC BATT PWR MGMT
Description: IC BATT PWR MGMT
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SL3S1204FUD/BG/MVZ |
Hersteller: NXP USA Inc.
Description: IC RFID CHIP UCODE 7 UNCASED
Description: IC RFID CHIP UCODE 7 UNCASED
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74LV86DB,118 |
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Hersteller: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Description: IC GATE XOR 4CH 2-INP 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2959+ | 0.17 EUR |
MPC852TVR100A |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BZX84-C33/LF1VL |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 33V 250MW TO236AB
Description: DIODE ZENER 33V 250MW TO236AB
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BZX84-C33/LF1R |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 33V 250MW TO236AB
Description: DIODE ZENER 33V 250MW TO236AB
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MK30DX128VLL7 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
P3041NXN7PNC |
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Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.5GHZ 1295FCBGA
Description: IC MPU Q OR IQ 1.5GHZ 1295FCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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MCIMX6L3EVN10AC |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 49.6 EUR |
10+ | 40.08 EUR |
25+ | 37.69 EUR |
160+ | 34.4 EUR |
320+ | 33.55 EUR |
480+ | 33.12 EUR |
MCIMX6X3CVN08AC |
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Hersteller: NXP USA Inc.
Description: I.MX 6SX ROM PERF ENHAN
Description: I.MX 6SX ROM PERF ENHAN
Produkt ist nicht verfügbar
Im Einkaufswagen
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MKE02Z32VQH2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 420 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.42 EUR |
10+ | 4.87 EUR |
84+ | 4.09 EUR |
168+ | 3.92 EUR |
252+ | 3.84 EUR |
BGM1011,115 |
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Hersteller: NXP USA Inc.
Description: IC RF AMP ISM 0HZ-3GHZ 6TSSOP
Description: IC RF AMP ISM 0HZ-3GHZ 6TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5602BK0MLH4R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5603BK0CLQ6R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MCIMX6G2CVM05AA |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MC6UL 528MHZ 289BGA
Description: IC MPU I.MC6UL 528MHZ 289BGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5603BK0CLQ6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9KEAZ64AVLHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MKL27Z128VLH4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5602BK0MLH4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MMA9555LR1 |
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Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Package / Case: 16-VFLGA
Output Type: I²C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Package / Case: 16-VFLGA
Output Type: I²C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
Produkt ist nicht verfügbar
Im Einkaufswagen
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MMA9555LR1 |
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Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Packaging: Cut Tape (CT)
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Package / Case: 16-VFLGA
Output Type: I²C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Packaging: Cut Tape (CT)
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Package / Case: 16-VFLGA
Output Type: I²C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
PEMI8QFN/LM,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1567+ | 0.31 EUR |
IP4285CZ6-TD125 |
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Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 4.2VC 6TSOP
Description: TVS DIODE 5.5VWM 4.2VC 6TSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SL3S1002FTB1,115 |
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Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 840-960MHZ 3XSON
Packaging: Bulk
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, ISO 18000-6
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Obsolete
Description: IC RFID TRANSP 840-960MHZ 3XSON
Packaging: Bulk
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, ISO 18000-6
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Obsolete
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1520+ | 0.32 EUR |
KITPF8101FRDMEVM |
Hersteller: NXP USA Inc.
Description: FRDM EXPANSION BOARD PF8101
Description: FRDM EXPANSION BOARD PF8101
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 694.67 EUR |
LS2088ASE7V1B |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 2.0GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Description: IC MPU QORIQ 2.0GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
NXH3670SDKUL |
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Hersteller: NXP USA Inc.
Description: NXH3670SDK
Description: NXH3670SDK
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S912ZVMC12F3VKH |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MPF7100BVBA0ES |
Hersteller: NXP USA Inc.
Description: PF7100 PMIC OTP
Description: PF7100 PMIC OTP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LS2088AXE7V1B |
Hersteller: NXP USA Inc.
Description: LS2088A XT WE 2000 R1.1
Description: LS2088A XT WE 2000 R1.1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
CBT3384PW,112 |
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Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 5 X 1:1 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 5 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 24-TSSOP
Part Status: Active
Description: IC BUS SWITCH 5 X 1:1 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 5 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 24-TSSOP
Part Status: Active
auf Bestellung 3150 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1100+ | 0.43 EUR |
CBTD3384D,118 |
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Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 5 X 1:1 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Circuit: 5 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 24-SO
Part Status: Active
Description: IC BUS SWITCH 5 X 1:1 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Circuit: 5 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 24-SO
Part Status: Active
auf Bestellung 3183 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
927+ | 0.52 EUR |
DEMO-BYL1-EVB |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS8500
Packaging: Bulk
Function: Special Purpose: Mobiles
Type: Power Management
Utilized IC / Part: FS8500, PF5020, PF5024
Supplied Contents: Board(s), Cable(s)
Part Status: Active
Contents: Board(s), Cable(s)
Description: EVAL BOARD FOR FS8500
Packaging: Bulk
Function: Special Purpose: Mobiles
Type: Power Management
Utilized IC / Part: FS8500, PF5020, PF5024
Supplied Contents: Board(s), Cable(s)
Part Status: Active
Contents: Board(s), Cable(s)
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 571.88 EUR |
MC33FS8530A0ES |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8500
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: SYSTEM BASIS CHIP FS8500
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.08 EUR |
10+ | 14.94 EUR |
25+ | 13.91 EUR |
80+ | 12.93 EUR |
S912XDT256F1MAL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5644BK0MLU8R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC33PF8200ESESR2 |
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Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC56F84789VLL557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 32-BIT FLASH
Description: MICROCONTROLLER 32-BIT FLASH
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74LVC3G06GN,115 |
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Hersteller: NXP USA Inc.
Description: IC INVERTER OD 3CH 3-INP 8XSON
Description: IC INVERTER OD 3CH 3-INP 8XSON
auf Bestellung 189977 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1381+ | 0.35 EUR |
BGA2851,115 |
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Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Gain: 25.2dB
Current - Supply: 7mA
Noise Figure: 3dB
P1dB: -5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Gain: 25.2dB
Current - Supply: 7mA
Noise Figure: 3dB
P1dB: -5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
auf Bestellung 8637 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
24+ | 0.74 EUR |
28+ | 0.64 EUR |
30+ | 0.6 EUR |
100+ | 0.55 EUR |
250+ | 0.52 EUR |
500+ | 0.5 EUR |
1000+ | 0.48 EUR |