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MCF51MM256VLL557 MCF51MM256VLL557 NXP USA Inc. MCF51MM256.pdf Description: COLD FIRE MICROCONTROLLER 32-BI
Produkt ist nicht verfügbar
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MCF5475ZP266557 MCF5475ZP266557 NXP USA Inc. MCF5475EC.pdf Description: MCF547X V4ECORE MMU, FPU
Produkt ist nicht verfügbar
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MCF52258CAG66,557 MCF52258CAG66,557 NXP USA Inc. MCF52259.pdf Description: MCF522XX 32 BIT MCU, COLDFIRE V2
Produkt ist nicht verfügbar
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MCF51JF128VHS MCF51JF128VHS NXP USA Inc. MCF51JF128.pdf Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Bulk
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 927 Stücke:
Lieferzeit 10-14 Tag (e)
58+9.20 EUR
Mindestbestellmenge: 58
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FS32K144HAT0VLLR FS32K144HAT0VLLR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K142HFT0MLHR FS32K142HFT0MLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AUP2G07GM,132 74AUP2G07GM,132 NXP USA Inc. 74AUP2G07.pdf Description: IC BUFF DL LOW PWR OP/DR 6XSON
auf Bestellung 108999 Stücke:
Lieferzeit 10-14 Tag (e)
3620+0.14 EUR
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IP4041CX25/LF/P13 NXP USA Inc. IP4041CX25.pdf Description: DATA LINE FILTER
auf Bestellung 2025 Stücke:
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1443+0.36 EUR
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IP4338CX24/LF/P13 IP4338CX24/LF/P13 NXP USA Inc. IP4338CX24LF.pdf Description: DATA LINE FILTER
auf Bestellung 4399 Stücke:
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1803+0.29 EUR
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74HC3G07DC,125 74HC3G07DC,125 NXP USA Inc. PHGLS18944-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 6V 8VSSOP
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
1581+0.32 EUR
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74HC3G07DP,125 74HC3G07DP,125 NXP USA Inc. PHGLS18944-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 6V 8TSSOP
auf Bestellung 21000 Stücke:
Lieferzeit 10-14 Tag (e)
2299+0.22 EUR
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MCZ33903D5EK MCZ33903D5EK NXP USA Inc. MC33903-MC33904-MC33905.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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S912ZVL64F0MLF S912ZVL64F0MLF NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
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MC9S12H128VFVE MC9S12H128VFVE NXP USA Inc. MC9S12H256%20Guide.pdf Description: IC MCU 16BIT 128KB FLASH 144LQFP
Produkt ist nicht verfügbar
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LPC54102J512BD64QL LPC54102J512BD64QL NXP USA Inc. LPC5410X.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 183 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.23 EUR
10+13.46 EUR
25+12.51 EUR
160+11.20 EUR
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MCIMX6X2AVN08AC NXP USA Inc. IMX6SXAEC.pdf Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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MC9S08JM8CLC MC9S08JM8CLC NXP USA Inc. MC9S08JM16.pdf Description: IC MCU 8BIT 8KB FLASH 32LQFP
Produkt ist nicht verfügbar
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SPC5607BK0CLU4 SPC5607BK0CLU4 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5607BK0CLU4R SPC5607BK0CLU4R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6D5EZK08AD NXP USA Inc. PHGL-S-A0006627391-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Bulk
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
auf Bestellung 1648 Stücke:
Lieferzeit 10-14 Tag (e)
5+130.80 EUR
Mindestbestellmenge: 5
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TJA1082TT,112 TJA1082TT,112 NXP USA Inc. TJA1082.pdf Description: IC INTERFACE SPECIALIZED 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 14-TSSOP
Grade: Automotive
Part Status: Obsolete
Produkt ist nicht verfügbar
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BGS8L2X BGS8L2X NXP USA Inc. BGS8L2.pdf Description: IC RF AMP 728MHZ-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13dB
Current - Supply: 5.2mA
Noise Figure: 0.85dB
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
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BGS8L2X BGS8L2X NXP USA Inc. BGS8L2.pdf Description: IC RF AMP 728MHZ-960MHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13dB
Current - Supply: 5.2mA
Noise Figure: 0.85dB
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 2186 Stücke:
Lieferzeit 10-14 Tag (e)
22+0.83 EUR
25+0.72 EUR
26+0.68 EUR
100+0.62 EUR
250+0.58 EUR
500+0.56 EUR
1000+0.54 EUR
Mindestbestellmenge: 22
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MC9S08SH32VTL MC9S08SH32VTL NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NVT4557HKX NVT4557HKX NXP USA Inc. NVT4557.pdf Description: SIM CARD INTERFACE LEVEL TRANSLA
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Voltage - Supply: 1.08V ~ 1.95V, 1.65V ~ 3.6V
Applications: Modems, Mobile Phones, SIM Card
Supplier Device Package: 10-XQFN (1.4x1.8)
Produkt ist nicht verfügbar
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NVT4557HKX NVT4557HKX NXP USA Inc. NVT4557.pdf Description: SIM CARD INTERFACE LEVEL TRANSLA
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Voltage - Supply: 1.08V ~ 1.95V, 1.65V ~ 3.6V
Applications: Modems, Mobile Phones, SIM Card
Supplier Device Package: 10-XQFN (1.4x1.8)
auf Bestellung 3990 Stücke:
Lieferzeit 10-14 Tag (e)
13+1.41 EUR
15+1.20 EUR
16+1.12 EUR
25+1.03 EUR
50+0.98 EUR
100+0.92 EUR
500+0.82 EUR
1000+0.79 EUR
Mindestbestellmenge: 13
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KITFS86AUTFRDMEM NXP USA Inc. Description: EVAL BOARD FS86 12V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Embedded: Yes, MCU, 32-Bit
Contents: Board(s), Cable(s), Power Supply, Accessories
Secondary Attributes: USB Interface(s)
auf Bestellung 4 Stücke:
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1+872.52 EUR
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KITFS86SKTFRDMEM KITFS86SKTFRDMEM NXP USA Inc. getting-started-with-the-kitfs86sktfrdmem-evaluation-board:GS-KITFS86SKTFRDMEM Description: EVAL BOARD FS86 12V/24V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Embedded: Yes, MCU, 32-Bit
Contents: Board(s), Cable(s), Power Supply, Accessories
Secondary Attributes: USB Interface(s)
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+910.55 EUR
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74ALVC244D112 74ALVC244D112 NXP USA Inc. 74ALVC244.pdf Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC33879TEK MC33879TEK NXP USA Inc. MC33879.pdf Description: IC SW SERIAL OCTAL 32SOIC
Produkt ist nicht verfügbar
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MC33879BPEK NXP USA Inc. MC33879.pdf Description: IC SW SERIAL OCTAL 32SOIC
Features: Slew Rate Controlled, Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: Relay, Solenoid Driver
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High/Low Side
Rds On (Typ): 750mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit
auf Bestellung 42 Stücke:
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2+8.94 EUR
10+6.83 EUR
25+6.30 EUR
Mindestbestellmenge: 2
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MC33879BPEKR2 MC33879BPEKR2 NXP USA Inc. MC33879.pdf Description: IC SW SERIAL OCTAL 32SOIC
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High/Low Side
Rds On (Typ): 750mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Battery, Short Circuit, UVLO
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+4.95 EUR
Mindestbestellmenge: 1000
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FRDMDUALK3664EVB FRDMDUALK3664EVB NXP USA Inc. UM11826.pdf Description: EVAL BOARD FOR MC33664ATL
Packaging: Box
Part Status: Active
Produkt ist nicht verfügbar
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UBA2211BT/N1,518 UBA2211BT/N1,518 NXP USA Inc. UBA2211.pdf Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 10.7V ~ 13.8V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 1.35A
auf Bestellung 2769 Stücke:
Lieferzeit 10-14 Tag (e)
10+1.95 EUR
11+1.65 EUR
25+1.54 EUR
100+1.38 EUR
250+1.29 EUR
500+1.22 EUR
1000+1.16 EUR
Mindestbestellmenge: 10
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BGU7044,115 BGU7044,115 NXP USA Inc. BGU7044.pdf Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 3.1V ~ 3.5V
Gain: 14dB
Current - Supply: 34mA
Noise Figure: 2.8dB
P1dB: 13dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Active
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
1138+0.43 EUR
Mindestbestellmenge: 1138
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PCF85263ATL/A115 NXP USA Inc. PHGL-S-A0001295653-1.pdf?t.download=true&u=5oefqw Description: TINY REAL-TIME CLOCK/CALENDAR WI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC100ES6111FAR2 MC100ES6111FAR2 NXP USA Inc. DS_537_MC100ES6111.pdf Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: ECL, HSTL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 2.7 GHz
Produkt ist nicht verfügbar
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MC100ES6111FAR2 MC100ES6111FAR2 NXP USA Inc. DS_537_MC100ES6111.pdf Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: ECL, HSTL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 2.7 GHz
Produkt ist nicht verfügbar
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BUK762R4-60E,118 BUK762R4-60E,118 NXP USA Inc. PHGLS24556-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 60V 120A D2PAK
Produkt ist nicht verfügbar
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S912ZVML31F1WKF557 NXP USA Inc. FSCL-S-A0000953857-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 16-BIT, HCS12 C
Produkt ist nicht verfügbar
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74ABT540DB,118 74ABT540DB,118 NXP USA Inc. 74ABT540.pdf Description: IC BUFFER INVERT 5.5V 20SSOP
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LPC12D27FBD100/301 LPC12D27FBD100/301 NXP USA Inc. LPC12D27.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMI4QFN/LP,132 PEMI4QFN/LP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 4
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LX2122RE82029B NXP USA Inc. Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Packaging: Tray
Package / Case: 1150-FBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 5°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1150-FBGA (23x23)
USB: USB 3.0 (1)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
SATA: SATA 6Gbps (4)
Additional Interfaces: CANbus, I2C, PCIe, SPI, UART
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MK20DX64VFT5 MK20DX64VFT5 NXP USA Inc. K20P48M50SF0.pdf Description: IC MCU 32BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
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SGTL5000XNBA3R2 SGTL5000XNBA3R2 NXP USA Inc. SGTL5000.pdf Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tape & Reel (TR)
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
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SGTL5000XNBA3 NXP USA Inc. SGTL5000.pdf Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tray
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
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MCIMX6U5DVM10ACR MCIMX6U5DVM10ACR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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PEMI6QFN/CG,132 PEMI6QFN/CG,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Produkt ist nicht verfügbar
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PEMI6QFN/CG,132 PEMI6QFN/CG,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
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1902+0.28 EUR
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S912XD64F2MAA557 S912XD64F2MAA557 NXP USA Inc. FSCLS07359-1.pdf?t.download=true&u=5oefqw Description: 16-BIT MCU, S12X CORE, 64KB FLAS
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S9S12XS128J1MAA557 S9S12XS128J1MAA557 NXP USA Inc. MC9S12XS256RMV1.pdf Description: MICROCONTROLLER 16-BIT, HCS12 C
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S912XEG128J2MAA557 NXP USA Inc. MC9S12XEP100RMV1.pdf Description: MICROCONTROLLER 16-BIT FLASH,
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S912XD128F2MAA557 NXP USA Inc. Description: MICROCONTROLLER, 16-BIT, FLASH,
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AFT23H201-24SR6 NXP USA Inc. AFT23H201-24S.pdf Description: RF MOSFET LDMOS 28V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 210W
Gain: 15.6dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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BGO807C/SC0112 NXP USA Inc. PHGLS28061-1.pdf?t.download=true&u=5oefqw Description: 870 MHZ OPTICAL RECEIVERS
Packaging: Bulk
Part Status: Active
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BGO807C/FC0112 NXP USA Inc. PHGLS28061-1.pdf?t.download=true&u=5oefqw Description: 870 MHZ OPTICAL RECEIVERS
Packaging: Bulk
Part Status: Active
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SC16C752BIBS,157 SC16C752BIBS,157 NXP USA Inc. SC16C752B.pdf Description: IC DUAL UART 64BYTE 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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100+6.43 EUR
2450+6.36 EUR
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S9S08DN32F2CLC S9S08DN32F2CLC NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33772BTP2AE MC33772BTP2AE NXP USA Inc. MC33772FS.pdf Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
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MCF51MM256VLL557 MCF51MM256.pdf
MCF51MM256VLL557
Hersteller: NXP USA Inc.
Description: COLD FIRE MICROCONTROLLER 32-BI
Produkt ist nicht verfügbar
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MCF5475ZP266557 MCF5475EC.pdf
MCF5475ZP266557
Hersteller: NXP USA Inc.
Description: MCF547X V4ECORE MMU, FPU
Produkt ist nicht verfügbar
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MCF52258CAG66,557 MCF52259.pdf
MCF52258CAG66,557
Hersteller: NXP USA Inc.
Description: MCF522XX 32 BIT MCU, COLDFIRE V2
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MCF51JF128VHS MCF51JF128.pdf
MCF51JF128VHS
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Bulk
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
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Anzahl Preis
58+9.20 EUR
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FS32K144HAT0VLLR S32K1xx.pdf
FS32K144HAT0VLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K142HFT0MLHR S32K1xx.pdf
FS32K142HFT0MLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AUP2G07GM,132 74AUP2G07.pdf
74AUP2G07GM,132
Hersteller: NXP USA Inc.
Description: IC BUFF DL LOW PWR OP/DR 6XSON
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3620+0.14 EUR
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IP4041CX25/LF/P13 IP4041CX25.pdf
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
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1443+0.36 EUR
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IP4338CX24/LF/P13 IP4338CX24LF.pdf
IP4338CX24/LF/P13
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
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1803+0.29 EUR
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74HC3G07DC,125 PHGLS18944-1.pdf?t.download=true&u=5oefqw
74HC3G07DC,125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 8VSSOP
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Anzahl Preis
1581+0.32 EUR
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74HC3G07DP,125 PHGLS18944-1.pdf?t.download=true&u=5oefqw
74HC3G07DP,125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 8TSSOP
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2299+0.22 EUR
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MCZ33903D5EK MC33903-MC33904-MC33905.pdf
MCZ33903D5EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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S912ZVL64F0MLF S9S12ZVL_FamilyRefManual_DS.pdf
S912ZVL64F0MLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
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MC9S12H128VFVE MC9S12H256%20Guide.pdf
MC9S12H128VFVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 144LQFP
Produkt ist nicht verfügbar
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LPC54102J512BD64QL LPC5410X.pdf
LPC54102J512BD64QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 183 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.23 EUR
10+13.46 EUR
25+12.51 EUR
160+11.20 EUR
Mindestbestellmenge: 2
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MCIMX6X2AVN08AC IMX6SXAEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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MC9S08JM8CLC MC9S08JM16.pdf
MC9S08JM8CLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Produkt ist nicht verfügbar
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SPC5607BK0CLU4 MPC560XBFAMFS.pdf
SPC5607BK0CLU4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5607BK0CLU4R MPC560XBFAMFS.pdf
SPC5607BK0CLU4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6D5EZK08AD PHGL-S-A0006627391-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Bulk
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
auf Bestellung 1648 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+130.80 EUR
Mindestbestellmenge: 5
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TJA1082TT,112 TJA1082.pdf
TJA1082TT,112
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 14-TSSOP
Grade: Automotive
Part Status: Obsolete
Produkt ist nicht verfügbar
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BGS8L2X BGS8L2.pdf
BGS8L2X
Hersteller: NXP USA Inc.
Description: IC RF AMP 728MHZ-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13dB
Current - Supply: 5.2mA
Noise Figure: 0.85dB
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
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BGS8L2X BGS8L2.pdf
BGS8L2X
Hersteller: NXP USA Inc.
Description: IC RF AMP 728MHZ-960MHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13dB
Current - Supply: 5.2mA
Noise Figure: 0.85dB
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 2186 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
22+0.83 EUR
25+0.72 EUR
26+0.68 EUR
100+0.62 EUR
250+0.58 EUR
500+0.56 EUR
1000+0.54 EUR
Mindestbestellmenge: 22
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MC9S08SH32VTL MC9S08SH32.pdf
MC9S08SH32VTL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NVT4557HKX NVT4557.pdf
NVT4557HKX
Hersteller: NXP USA Inc.
Description: SIM CARD INTERFACE LEVEL TRANSLA
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Voltage - Supply: 1.08V ~ 1.95V, 1.65V ~ 3.6V
Applications: Modems, Mobile Phones, SIM Card
Supplier Device Package: 10-XQFN (1.4x1.8)
Produkt ist nicht verfügbar
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NVT4557HKX NVT4557.pdf
NVT4557HKX
Hersteller: NXP USA Inc.
Description: SIM CARD INTERFACE LEVEL TRANSLA
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Voltage - Supply: 1.08V ~ 1.95V, 1.65V ~ 3.6V
Applications: Modems, Mobile Phones, SIM Card
Supplier Device Package: 10-XQFN (1.4x1.8)
auf Bestellung 3990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13+1.41 EUR
15+1.20 EUR
16+1.12 EUR
25+1.03 EUR
50+0.98 EUR
100+0.92 EUR
500+0.82 EUR
1000+0.79 EUR
Mindestbestellmenge: 13
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KITFS86AUTFRDMEM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FS86 12V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Embedded: Yes, MCU, 32-Bit
Contents: Board(s), Cable(s), Power Supply, Accessories
Secondary Attributes: USB Interface(s)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+872.52 EUR
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KITFS86SKTFRDMEM getting-started-with-the-kitfs86sktfrdmem-evaluation-board:GS-KITFS86SKTFRDMEM
KITFS86SKTFRDMEM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FS86 12V/24V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Embedded: Yes, MCU, 32-Bit
Contents: Board(s), Cable(s), Power Supply, Accessories
Secondary Attributes: USB Interface(s)
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+910.55 EUR
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74ALVC244D112 74ALVC244.pdf
74ALVC244D112
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC33879TEK MC33879.pdf
MC33879TEK
Hersteller: NXP USA Inc.
Description: IC SW SERIAL OCTAL 32SOIC
Produkt ist nicht verfügbar
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MC33879BPEK MC33879.pdf
Hersteller: NXP USA Inc.
Description: IC SW SERIAL OCTAL 32SOIC
Features: Slew Rate Controlled, Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: Relay, Solenoid Driver
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High/Low Side
Rds On (Typ): 750mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+8.94 EUR
10+6.83 EUR
25+6.30 EUR
Mindestbestellmenge: 2
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MC33879BPEKR2 MC33879.pdf
MC33879BPEKR2
Hersteller: NXP USA Inc.
Description: IC SW SERIAL OCTAL 32SOIC
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High/Low Side
Rds On (Typ): 750mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Battery, Short Circuit, UVLO
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+4.95 EUR
Mindestbestellmenge: 1000
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FRDMDUALK3664EVB UM11826.pdf
FRDMDUALK3664EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33664ATL
Packaging: Box
Part Status: Active
Produkt ist nicht verfügbar
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UBA2211BT/N1,518 UBA2211.pdf
UBA2211BT/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 10.7V ~ 13.8V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 1.35A
auf Bestellung 2769 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.95 EUR
11+1.65 EUR
25+1.54 EUR
100+1.38 EUR
250+1.29 EUR
500+1.22 EUR
1000+1.16 EUR
Mindestbestellmenge: 10
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BGU7044,115 BGU7044.pdf
BGU7044,115
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 3.1V ~ 3.5V
Gain: 14dB
Current - Supply: 34mA
Noise Figure: 2.8dB
P1dB: 13dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Active
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1138+0.43 EUR
Mindestbestellmenge: 1138
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PCF85263ATL/A115 PHGL-S-A0001295653-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: TINY REAL-TIME CLOCK/CALENDAR WI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC100ES6111FAR2 DS_537_MC100ES6111.pdf
MC100ES6111FAR2
Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: ECL, HSTL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 2.7 GHz
Produkt ist nicht verfügbar
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MC100ES6111FAR2 DS_537_MC100ES6111.pdf
MC100ES6111FAR2
Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: ECL, HSTL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 2.7 GHz
Produkt ist nicht verfügbar
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BUK762R4-60E,118 PHGLS24556-1.pdf?t.download=true&u=5oefqw
BUK762R4-60E,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 120A D2PAK
Produkt ist nicht verfügbar
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S912ZVML31F1WKF557 FSCL-S-A0000953857-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Produkt ist nicht verfügbar
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74ABT540DB,118 74ABT540.pdf
74ABT540DB,118
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20SSOP
Produkt ist nicht verfügbar
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LPC12D27FBD100/301 LPC12D27.pdf
LPC12D27FBD100/301
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMI4QFN/LP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/LP,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 4
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2959+0.17 EUR
Mindestbestellmenge: 2959
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LX2122RE82029B
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Packaging: Tray
Package / Case: 1150-FBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 5°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1150-FBGA (23x23)
USB: USB 3.0 (1)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
SATA: SATA 6Gbps (4)
Additional Interfaces: CANbus, I2C, PCIe, SPI, UART
Produkt ist nicht verfügbar
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MK20DX64VFT5 K20P48M50SF0.pdf
MK20DX64VFT5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.36 EUR
10+6.44 EUR
25+6.34 EUR
Mindestbestellmenge: 3
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SGTL5000XNBA3R2 SGTL5000.pdf
SGTL5000XNBA3R2
Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tape & Reel (TR)
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
Produkt ist nicht verfügbar
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SGTL5000XNBA3 SGTL5000.pdf
Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tray
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
auf Bestellung 355 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.34 EUR
10+6.37 EUR
25+5.87 EUR
100+5.33 EUR
Mindestbestellmenge: 3
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MCIMX6U5DVM10ACR IMX6SDLCEC.pdf
MCIMX6U5DVM10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 1379 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+76.24 EUR
10+62.47 EUR
25+59.03 EUR
100+55.26 EUR
250+53.46 EUR
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PEMI6QFN/CG,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/CG,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Produkt ist nicht verfügbar
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PEMI6QFN/CG,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/CG,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1902+0.28 EUR
Mindestbestellmenge: 1902
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S912XD64F2MAA557 FSCLS07359-1.pdf?t.download=true&u=5oefqw
S912XD64F2MAA557
Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12X CORE, 64KB FLAS
auf Bestellung 1260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
24+21.34 EUR
Mindestbestellmenge: 24
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S9S12XS128J1MAA557 MC9S12XS256RMV1.pdf
S9S12XS128J1MAA557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 16-BIT, HCS12 C
Produkt ist nicht verfügbar
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S912XEG128J2MAA557 MC9S12XEP100RMV1.pdf
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 16-BIT FLASH,
Produkt ist nicht verfügbar
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S912XD128F2MAA557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, FLASH,
Produkt ist nicht verfügbar
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AFT23H201-24SR6 AFT23H201-24S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 210W
Gain: 15.6dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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BGO807C/SC0112 PHGLS28061-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: 870 MHZ OPTICAL RECEIVERS
Packaging: Bulk
Part Status: Active
auf Bestellung 10848 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+119.31 EUR
Mindestbestellmenge: 5
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BGO807C/FC0112 PHGLS28061-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: 870 MHZ OPTICAL RECEIVERS
Packaging: Bulk
Part Status: Active
auf Bestellung 16029 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+114.24 EUR
Mindestbestellmenge: 5
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SC16C752BIBS,157 SC16C752B.pdf
SC16C752BIBS,157
Hersteller: NXP USA Inc.
Description: IC DUAL UART 64BYTE 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.03 EUR
10+7.65 EUR
25+7.49 EUR
100+6.43 EUR
2450+6.36 EUR
Mindestbestellmenge: 2
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S9S08DN32F2CLC
S9S08DN32F2CLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33772BTP2AE MC33772FS.pdf
MC33772BTP2AE
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
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