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BGA2815,115 BGA2815,115 NXP USA Inc. BGA2815.pdf Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.2dB
Current - Supply: 55mA
Noise Figure: 3.7dB
P1dB: 1dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Part Status: Active
auf Bestellung 2984 Stücke:
Lieferzeit 10-14 Tag (e)
32+0.56 EUR
37+0.48 EUR
39+0.45 EUR
100+0.42 EUR
250+0.39 EUR
500+0.38 EUR
1000+0.36 EUR
Mindestbestellmenge: 32
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MIMXRT117HCVM8A MIMXRT117HCVM8A NXP USA Inc. Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 1316 Stücke:
Lieferzeit 10-14 Tag (e)
1+36.19 EUR
10+29.16 EUR
25+27.43 EUR
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BGA2866 NXP USA Inc. BGA2866.pdf Description: WIDE BAND LOW POWER AMPLIFIER 0
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BGA2866115 NXP USA Inc. BGA2866.pdf Description: WIDE BAND LOW POWER AMPLIFIER 0
Produkt ist nicht verfügbar
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BGA2850,115 BGA2850,115 NXP USA Inc. BGA2850_Rev5.pdf Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Gain: 22.9dB
Current - Supply: 36mA
Noise Figure: 4dB
P1dB: -2dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCF5270VM100 MCF5270VM100 NXP USA Inc. MCF5271EC.pdf Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 61
DigiKey Programmable: Not Verified
auf Bestellung 853 Stücke:
Lieferzeit 10-14 Tag (e)
1+52.45 EUR
10+42.44 EUR
25+39.95 EUR
80+37.57 EUR
230+36 EUR
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S912ZVCA19F0WKH S912ZVCA19F0WKH NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 192KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 42
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TDA8023TT/C1,118 TDA8023TT/C1,118 NXP USA Inc. TDA8023.pdf Description: IC INTERFACE SPECIALIZED 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8023TT/C1,118 TDA8023TT/C1,118 NXP USA Inc. TDA8023.pdf Description: IC INTERFACE SPECIALIZED 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74LV4020N,112 74LV4020N,112 NXP USA Inc. 74LV4020.pdf Description: IC 14BIT BINARY RIPPLE 16-DIP
auf Bestellung 547 Stücke:
Lieferzeit 10-14 Tag (e)
307+1.66 EUR
Mindestbestellmenge: 307
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MIMXRT117HDVMAA MIMXRT117HDVMAA NXP USA Inc. Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 1433 Stücke:
Lieferzeit 10-14 Tag (e)
1+34.06 EUR
10+27.38 EUR
25+25.71 EUR
80+25.66 EUR
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MPC8314ECVRAFDA MPC8314ECVRAFDA NXP USA Inc. MPC8314EEC.pdf Description: IC MPU MPC83XX 333MHZ 620BGA
Produkt ist nicht verfügbar
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MC9S12C32VFAE16 MC9S12C32VFAE16 NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Produkt ist nicht verfügbar
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MC9S08QB4CWL MC9S08QB4CWL NXP USA Inc. www.nxp.com Description: IC MCU 8BIT 4KB FLASH 28SOIC
Produkt ist nicht verfügbar
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LS2088ASE7QQB NXP USA Inc. Description: LS2088A ST WE 1600 R1.1
Produkt ist nicht verfügbar
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MRFX1K80H-64MHZ MRFX1K80H-64MHZ NXP USA Inc. MRFX1K80H.pdf Description: MRFX1K80H REF BRD 64MHZ 1800W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 64MHz
Type: Transistor
Supplied Contents: Board(s)
Contents: Board(s)
Utilized IC / Part: MRFX1K80H
Produkt ist nicht verfügbar
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MRFX1K80HR5178 NXP USA Inc. PHGL-S-A0006350182-1.pdf?t.download=true&u=5oefqw Description: WIDEBAND RF POWER TRANSISTOR, 18
Produkt ist nicht verfügbar
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MRFX1K80H-VHFDHY MRFX1K80H-VHFDHY NXP USA Inc. MRFX1K80H.pdf?pspll=1 Description: MRFX1K80H REF BRD 230MHZ 1200W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 174MHz ~ 230MHz
Type: Transistor
Supplied Contents: Board(s)
Contents: Board(s)
Utilized IC / Part: MRFX1K80H
Produkt ist nicht verfügbar
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MRFX1K80N-230MHZ MRFX1K80N-230MHZ NXP USA Inc. MRFX1K80N.pdf Description: MRFX1K80N REF BOARD - 230MHZ
Packaging: Bulk
For Use With/Related Products: MRFX1K80N
Frequency: 230MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: MRFX1K80N
Produkt ist nicht verfügbar
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A5G26H110NT4 NXP USA Inc. A5G26H110N.pdf Description: RF MOSFET GAN 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 15W
Gain: 17.7dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 50 mA
Produkt ist nicht verfügbar
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A5G37H110NT4 NXP USA Inc. A5G37H110N.pdf Description: AIRFAST RF POWER GAN TRANSISTOR,
Produkt ist nicht verfügbar
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A5G35H110NT4 NXP USA Inc. A5G35H110N.pdf Description: AIRFAST RF POWER GAN TRANSISTOR,
Produkt ist nicht verfügbar
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MC9S08SH16CTG,574 MC9S08SH16CTG,574 NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Produkt ist nicht verfügbar
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MC9S08SH16CTLR MC9S08SH16CTLR NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF9002NR2 NXP USA Inc. MRF9002NR2.pdf Description: RF MOSFET LDMOS 26V 16PFP
Produkt ist nicht verfügbar
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PXLS83333AESR2 NXP USA Inc. Description: 2 AXIS HI/HI XY
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PSMN7R5-25YLC,115 PSMN7R5-25YLC,115 NXP USA Inc. Description: MOSFET N-CH 25V 56A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Power Dissipation (Max): 42W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Produkt ist nicht verfügbar
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PSMN7R5-25YLC,115 PSMN7R5-25YLC,115 NXP USA Inc. Description: MOSFET N-CH 25V 56A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Power Dissipation (Max): 42W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Produkt ist nicht verfügbar
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NCF2922AHN3/0212CY NXP USA Inc. Description: RECEIVER 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FRDMPKPT2000EVM NXP USA Inc. Description: FREEDOM BOARD KIT - PT2000 PROG
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: PT2000
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
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S9S12HY64J0CLLR S9S12HY64J0CLLR NXP USA Inc. MC9S12HY64RMV1.pdf Description: IC MCU 16BIT 64KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68LK332GCAG16-NXP MC68LK332GCAG16-NXP NXP USA Inc. FSCLS03151-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
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PEMI1QFN/RP,315 PEMI1QFN/RP,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
Produkt ist nicht verfügbar
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74AHCT2G126GD,125 74AHCT2G126GD,125 NXP USA Inc. PHGLS27955-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
auf Bestellung 68069 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.24 EUR
Mindestbestellmenge: 2049
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74AHCT2G241DP125 NXP USA Inc. 74AHC_AHCT2G241.pdf Description: IC BUFFER NON-INVERT 5.5V 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 3087 Stücke:
Lieferzeit 10-14 Tag (e)
1567+0.33 EUR
Mindestbestellmenge: 1567
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74AHCT2G125GD,125-NX NXP USA Inc. Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Produkt ist nicht verfügbar
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BUK7Y28-75B,115 BUK7Y28-75B,115 NXP USA Inc. BUK7Y28-75B.pdf Description: TRANSISTOR >30MHZ
Produkt ist nicht verfügbar
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LD6836TD/36H,125 LD6836TD/36H,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 3.6V 300MA 5TSOP
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
2885+0.17 EUR
Mindestbestellmenge: 2885
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LD6836TD/22H,125 LD6836TD/22H,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 2.2V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
2885+0.17 EUR
Mindestbestellmenge: 2885
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74HCT2G08DP 74HCT2G08DP NXP USA Inc. PHGLS18956-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 2CH 2-INP 8TSSOP
Produkt ist nicht verfügbar
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BZX79-C51143 NXP USA Inc. BZX79.pdf Description: NOW NEXPERIA BZX79-C51 - ZENER D
auf Bestellung 35000 Stücke:
Lieferzeit 10-14 Tag (e)
15000+0.034 EUR
Mindestbestellmenge: 15000
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BZX79-C56133 NXP USA Inc. BZX79.pdf Description: NOW NEXPERIA BZX79-C56 - ZENER D
Produkt ist nicht verfügbar
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BAP51L,315 BAP51L,315 NXP USA Inc. BAP51L_1.pdf Description: RF DIODE PIN 60V 500MW DFN1006-2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006-2
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Produkt ist nicht verfügbar
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MC35FS6511NAER2 MC35FS6511NAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS6511NAE MC35FS6511NAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Produkt ist nicht verfügbar
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RAPIDRF-26E39 RAPIDRF-26E39 NXP USA Inc. RAPIDRF-26E39.pdf Description: 28 V LDMOS RF FRONT END 5G 50W
Packaging: Bulk
Frequency: 2.496GHz ~ 2.69GHz
Type: Front End
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+1158.47 EUR
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LPC3152FET208,551 LPC3152FET208,551 NXP USA Inc. LPC3152%2C54.pdf Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 208-TFBGA (12x12)
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCAL6408AHK NXP USA Inc. PCAL6408A.pdf Description: LOW-VOLTAGE TRANSLATING, 8-BIT I
Produkt ist nicht verfügbar
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MC9S08AW16MFUE MC9S08AW16MFUE NXP USA Inc. PHGL-S-A0002794566-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 16KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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BZV90-C56115 BZV90-C56115 NXP USA Inc. BZV90.pdf Description: NOW NEXPERIA BZV90-C56 ZENER DIO
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 56 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: SOT-223
Grade: Automotive
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Qualification: AEC-Q100
auf Bestellung 1990 Stücke:
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74AHCT374D118 74AHCT374D118 NXP USA Inc. 74AHC_AHCT374.pdf Description: NOW NEXPERIA 74AHCT374D - BUS DR
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 130 MHz
Input Capacitance: 3 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF
Number of Bits per Element: 8
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MCIMX537CVP8C2 MCIMX537CVP8C2 NXP USA Inc. Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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HOMEKIT-SDK NXP USA Inc. HMKITSDKFS.pdf Description: HOMEKIT SOFTWARE DEVELOPMENT KIT
Produkt ist nicht verfügbar
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S912XEQ512BVAAR S912XEQ512BVAAR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512BVAA S912XEQ512BVAA NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LD6816CX4/33P,315 LD6816CX4/33P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 3.3V 150MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
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PEMI2QFN/LP,115 PEMI2QFN/LP,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
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UBA2211AT/N1,518 UBA2211AT/N1,518 NXP USA Inc. UBA2211.pdf Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 10.7V ~ 13.8V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCA9502BS,157 PCA9502BS,157 NXP USA Inc. PCA9502.pdf Description: IC XPNDR 400KHZ I2C SPI 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SPI
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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UJA1169AF-EVB UJA1169AF-EVB NXP USA Inc. UM11758.pdf Description: EVAL BOARD FOR UJA1169A
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: UJA1169A
Supplied Contents: Board(s)
Primary Attributes: 12V Supply
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
Part Status: Active
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BGA2815,115 BGA2815.pdf
BGA2815,115
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.2dB
Current - Supply: 55mA
Noise Figure: 3.7dB
P1dB: 1dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Part Status: Active
auf Bestellung 2984 Stücke:
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32+0.56 EUR
37+0.48 EUR
39+0.45 EUR
100+0.42 EUR
250+0.39 EUR
500+0.38 EUR
1000+0.36 EUR
Mindestbestellmenge: 32
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MIMXRT117HCVM8A
MIMXRT117HCVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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1+36.19 EUR
10+29.16 EUR
25+27.43 EUR
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BGA2866 BGA2866.pdf
Hersteller: NXP USA Inc.
Description: WIDE BAND LOW POWER AMPLIFIER 0
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BGA2866115 BGA2866.pdf
Hersteller: NXP USA Inc.
Description: WIDE BAND LOW POWER AMPLIFIER 0
Produkt ist nicht verfügbar
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BGA2850,115 BGA2850_Rev5.pdf
BGA2850,115
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Gain: 22.9dB
Current - Supply: 36mA
Noise Figure: 4dB
P1dB: -2dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCF5270VM100 MCF5271EC.pdf
MCF5270VM100
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 61
DigiKey Programmable: Not Verified
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1+52.45 EUR
10+42.44 EUR
25+39.95 EUR
80+37.57 EUR
230+36 EUR
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S912ZVCA19F0WKH S12ZVCFS.pdf
S912ZVCA19F0WKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 42
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TDA8023TT/C1,118 TDA8023.pdf
TDA8023TT/C1,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8023TT/C1,118 TDA8023.pdf
TDA8023TT/C1,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74LV4020N,112 74LV4020.pdf
74LV4020N,112
Hersteller: NXP USA Inc.
Description: IC 14BIT BINARY RIPPLE 16-DIP
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307+1.66 EUR
Mindestbestellmenge: 307
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MIMXRT117HDVMAA
MIMXRT117HDVMAA
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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1+34.06 EUR
10+27.38 EUR
25+25.71 EUR
80+25.66 EUR
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MPC8314ECVRAFDA MPC8314EEC.pdf
MPC8314ECVRAFDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 620BGA
Produkt ist nicht verfügbar
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MC9S12C32VFAE16 MC9S12C128V1.pdf
MC9S12C32VFAE16
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Produkt ist nicht verfügbar
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MC9S08QB4CWL www.nxp.com
MC9S08QB4CWL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Produkt ist nicht verfügbar
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LS2088ASE7QQB
Hersteller: NXP USA Inc.
Description: LS2088A ST WE 1600 R1.1
Produkt ist nicht verfügbar
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MRFX1K80H-64MHZ MRFX1K80H.pdf
MRFX1K80H-64MHZ
Hersteller: NXP USA Inc.
Description: MRFX1K80H REF BRD 64MHZ 1800W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 64MHz
Type: Transistor
Supplied Contents: Board(s)
Contents: Board(s)
Utilized IC / Part: MRFX1K80H
Produkt ist nicht verfügbar
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MRFX1K80HR5178 PHGL-S-A0006350182-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: WIDEBAND RF POWER TRANSISTOR, 18
Produkt ist nicht verfügbar
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MRFX1K80H-VHFDHY MRFX1K80H.pdf?pspll=1
MRFX1K80H-VHFDHY
Hersteller: NXP USA Inc.
Description: MRFX1K80H REF BRD 230MHZ 1200W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 174MHz ~ 230MHz
Type: Transistor
Supplied Contents: Board(s)
Contents: Board(s)
Utilized IC / Part: MRFX1K80H
Produkt ist nicht verfügbar
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MRFX1K80N-230MHZ MRFX1K80N.pdf
MRFX1K80N-230MHZ
Hersteller: NXP USA Inc.
Description: MRFX1K80N REF BOARD - 230MHZ
Packaging: Bulk
For Use With/Related Products: MRFX1K80N
Frequency: 230MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: MRFX1K80N
Produkt ist nicht verfügbar
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A5G26H110NT4 A5G26H110N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 15W
Gain: 17.7dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 50 mA
Produkt ist nicht verfügbar
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A5G37H110NT4 A5G37H110N.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR,
Produkt ist nicht verfügbar
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A5G35H110NT4 A5G35H110N.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR,
Produkt ist nicht verfügbar
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MC9S08SH16CTG,574 MC9S08SH32.pdf
MC9S08SH16CTG,574
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Produkt ist nicht verfügbar
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MC9S08SH16CTLR MC9S08SH32.pdf
MC9S08SH16CTLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF9002NR2 MRF9002NR2.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V 16PFP
Produkt ist nicht verfügbar
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PXLS83333AESR2
Hersteller: NXP USA Inc.
Description: 2 AXIS HI/HI XY
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PSMN7R5-25YLC,115
PSMN7R5-25YLC,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 56A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Power Dissipation (Max): 42W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Produkt ist nicht verfügbar
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PSMN7R5-25YLC,115
PSMN7R5-25YLC,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 56A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Power Dissipation (Max): 42W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Produkt ist nicht verfügbar
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NCF2922AHN3/0212CY
Hersteller: NXP USA Inc.
Description: RECEIVER 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FRDMPKPT2000EVM
Hersteller: NXP USA Inc.
Description: FREEDOM BOARD KIT - PT2000 PROG
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: PT2000
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
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S9S12HY64J0CLLR MC9S12HY64RMV1.pdf
S9S12HY64J0CLLR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68LK332GCAG16-NXP FSCLS03151-1.pdf?t.download=true&u=5oefqw
MC68LK332GCAG16-NXP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
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PEMI1QFN/RP,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/RP,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
Produkt ist nicht verfügbar
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74AHCT2G126GD,125 PHGLS27955-1.pdf?t.download=true&u=5oefqw
74AHCT2G126GD,125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
auf Bestellung 68069 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.24 EUR
Mindestbestellmenge: 2049
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74AHCT2G241DP125 74AHC_AHCT2G241.pdf
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 3087 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1567+0.33 EUR
Mindestbestellmenge: 1567
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74AHCT2G125GD,125-NX
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Produkt ist nicht verfügbar
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BUK7Y28-75B,115 BUK7Y28-75B.pdf
BUK7Y28-75B,115
Hersteller: NXP USA Inc.
Description: TRANSISTOR >30MHZ
Produkt ist nicht verfügbar
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LD6836TD/36H,125 LD6836.pdf
LD6836TD/36H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.6V 300MA 5TSOP
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2885+0.17 EUR
Mindestbestellmenge: 2885
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LD6836TD/22H,125 LD6836.pdf
LD6836TD/22H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2885+0.17 EUR
Mindestbestellmenge: 2885
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74HCT2G08DP PHGLS18956-1.pdf?t.download=true&u=5oefqw
74HCT2G08DP
Hersteller: NXP USA Inc.
Description: IC GATE AND 2CH 2-INP 8TSSOP
Produkt ist nicht verfügbar
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BZX79-C51143 BZX79.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C51 - ZENER D
auf Bestellung 35000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15000+0.034 EUR
Mindestbestellmenge: 15000
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BZX79-C56133 BZX79.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C56 - ZENER D
Produkt ist nicht verfügbar
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BAP51L,315 BAP51L_1.pdf
BAP51L,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 60V 500MW DFN1006-2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006-2
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Produkt ist nicht verfügbar
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MC35FS6511NAER2 35FS4500-35FS6500SDS.pdf
MC35FS6511NAER2
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS6511NAE 35FS4500-35FS6500SDS.pdf
MC35FS6511NAE
Hersteller: NXP USA Inc.
Description: FS6500
Produkt ist nicht verfügbar
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RAPIDRF-26E39 RAPIDRF-26E39.pdf
RAPIDRF-26E39
Hersteller: NXP USA Inc.
Description: 28 V LDMOS RF FRONT END 5G 50W
Packaging: Bulk
Frequency: 2.496GHz ~ 2.69GHz
Type: Front End
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1158.47 EUR
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LPC3152FET208,551 LPC3152%2C54.pdf
LPC3152FET208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 208-TFBGA (12x12)
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCAL6408AHK PCAL6408A.pdf
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING, 8-BIT I
Produkt ist nicht verfügbar
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MC9S08AW16MFUE PHGL-S-A0002794566-1.pdf?t.download=true&u=5oefqw
MC9S08AW16MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 163 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
36+15.08 EUR
Mindestbestellmenge: 36
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BZV90-C56115 BZV90.pdf
BZV90-C56115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV90-C56 ZENER DIO
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 56 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: SOT-223
Grade: Automotive
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Qualification: AEC-Q100
auf Bestellung 1990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1990+0.27 EUR
Mindestbestellmenge: 1990
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74AHCT374D118 74AHC_AHCT374.pdf
74AHCT374D118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT374D - BUS DR
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 130 MHz
Input Capacitance: 3 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF
Number of Bits per Element: 8
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1348+0.37 EUR
Mindestbestellmenge: 1348
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MCIMX537CVP8C2
MCIMX537CVP8C2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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HOMEKIT-SDK HMKITSDKFS.pdf
Hersteller: NXP USA Inc.
Description: HOMEKIT SOFTWARE DEVELOPMENT KIT
Produkt ist nicht verfügbar
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S912XEQ512BVAAR MC9S12XEPB.pdf
S912XEQ512BVAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512BVAA MC9S12XEPB.pdf
S912XEQ512BVAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LD6816CX4/33P,315 LD6816.pdf
LD6816CX4/33P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 150MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
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PEMI2QFN/LP,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/LP,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3806+0.13 EUR
Mindestbestellmenge: 3806
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UBA2211AT/N1,518 UBA2211.pdf
UBA2211AT/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 10.7V ~ 13.8V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCA9502BS,157 PCA9502.pdf
PCA9502BS,157
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SPI 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SPI
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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UJA1169AF-EVB UM11758.pdf
UJA1169AF-EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR UJA1169A
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: UJA1169A
Supplied Contents: Board(s)
Primary Attributes: 12V Supply
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+129.99 EUR
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