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S9S12G64BMLC S9S12G64BMLC NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1250 Stücke
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S9S12GN48BCLC S9S12GN48BCLC NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 48KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1250 Stücke
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PTN3356R1BSMP PTN3356R1BSMP NXP USA Inc. PTN3356R1.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 2.8V ~ 3.6V
Applications: DisplayPort
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 47655 Stücke:
Lieferzeit 10-14 Tag (e)
179+3.34 EUR
Mindestbestellmenge: 179 Stücke
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S9S08DZ32F2CLFR S9S08DZ32F2CLFR NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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S912ZVMBA6F0VLF S912ZVMBA6F0VLF NXP USA Inc. S12ZVMBFS.pdf Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1250 Stücke
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RD33775ACNTEVB NXP USA Inc. Description: RD33775ACNTEVB
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33775A
Supplied Contents: Board(s), Cable(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
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UJA1076ATW/5V0/WDJ UJA1076ATW/5V0/WDJ NXP USA Inc. UJA1076A.pdf Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Part Status: Active
Grade: Automotive
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+4.58 EUR
Mindestbestellmenge: 2000 Stücke
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MMA5148KWR2528 MMA5148KWR2528 NXP USA Inc. FSCLS07279-1.pdf?t.download=true&u=5oefqw Description: PSI INERTIAL SENSOR
Packaging: Bulk
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
48+12.15 EUR
Mindestbestellmenge: 48 Stücke
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FXLS90322AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Mounting Type: Surface Mount, Wettable Flank
Part Status: Active
Supplier Device Package: 16-HLQFNR (4x4)
Operating Temperature: -40°C ~ 125°C
Output Type: I2C, SPI
Package / Case: 16-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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FXLS90322AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Mounting Type: Surface Mount, Wettable Flank
Part Status: Active
Supplier Device Package: 16-HLQFNR (4x4)
Operating Temperature: -40°C ~ 125°C
Output Type: I2C, SPI
Package / Case: 16-LQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 1958 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.57 EUR
10+11.16 EUR
25+10.64 EUR
50+10.27 EUR
100+9.9 EUR
250+9.45 EUR
500+9.1 EUR
1000+8.78 EUR
Mindestbestellmenge: 2 Stücke
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SAF7751HN/N207ZMP NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7755HN/N207ZK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7751HV/N205/S3K NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7755HV/N207ZK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7755HV/N207ZY NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7753HV/N205ZY NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7751HV/N207ZY NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7758HV/N205ZK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7755HN/N208Z/MP NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7753HV/N205Y NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7753HV/N205K NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7753HV/N207ZK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7751HN/N207ZK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7753HV/N205ZK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7758HV/N207ZY NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7758HN/N207ZMP NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7751HN/N208Z/MP NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7751HV/N207ZK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7758HV/N205Y NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC8548CVJAUJD MPC8548CVJAUJD NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MRFX1K80N-88MHZ MRFX1K80N-88MHZ NXP USA Inc. MRFX1K80N.pdf Description: MRFX1K80N REF BOARD 108MHZ 1670W
Packaging: Bulk
For Use With/Related Products: MRFX1K80N
Frequency: 87.5MHz ~ 108MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRFX1K80N
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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MC33FS8430G4ES NXP USA Inc. Description: SYSTEM BASIS CHIP FS8430
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 260 Stücke
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SGTL5000XNBA3R2 SGTL5000XNBA3R2 NXP USA Inc. SGTL5000.pdf Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Cut Tape (CT)
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
auf Bestellung 1640 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.4 EUR
10+7.19 EUR
25+6.63 EUR
100+6.01 EUR
250+5.72 EUR
500+5.55 EUR
1000+5.4 EUR
Mindestbestellmenge: 3 Stücke
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S9S12KG25J2MPVE NXP USA Inc. Description: IC
Packaging: Bulk
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MRFX1K80H-128MHZ MRFX1K80H-128MHZ NXP USA Inc. MRFX1K80H.pdf Description: MRFX1K80H REF BRD 128MHZ 3775W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 128MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRFX1K80H
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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S9S12GN48F0VLFR S9S12GN48F0VLFR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A3T21H400W23SR6 NXP USA Inc. A3T21H400W23S.pdf Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 150 Stücke
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BUK7Y20-30B115 NXP USA Inc. BUK7Y20-30B.pdf Description: NOW NEXPERIA BUK7Y20-30B 39.5A,
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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WCT-5WTXAUTO WCT-5WTXAUTO NXP USA Inc. Description: DEVELOPMENT TOOL 5W AUTO
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: MWCT1001A, MWCT1003A
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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FS32K148UAT0VMHT FS32K148UAT0VMHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF0UL1101DUD,005 NXP USA Inc. MF0ULX1.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Part Status: Active
Supplier Device Package: Die
Standards: ISO 14443, MIFARE
Operating Temperature: -25°C ~ 70°C
Produkt ist nicht verfügbar
 Mindestbestellmenge: 100587 Stücke
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MPC8548EVJAUJD MPC8548EVJAUJD NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Produkt ist nicht verfügbar
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MM908E624AYPEW MM908E624AYPEW NXP USA Inc. MM908E624.pdf Description: IC SW TRPL HISIDE MCU/LIN 54SOIC
DigiKey Programmable: Not Verified
Number of I/O: 16
Part Status: Active
Supplier Device Package: 54-SOIC
Core Processor: HC08
Applications: Mirror Control
Program Memory Type: FLASH (16kB)
Controller Series: 908E
Voltage - Supply: 5.5V ~ 18V
Operating Temperature: -40°C ~ 125°C
RAM Size: 512 x 8
Interface: SCI, SPI
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
Grade: Automotive
Produkt ist nicht verfügbar
 Mindestbestellmenge: 26 Stücke
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LPC812M101JD20FP LPC812M101JD20FP NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SO
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.69 EUR
10+2.71 EUR
Mindestbestellmenge: 6 Stücke
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PEMI6QFN/HK,132 PEMI6QFN/HK,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
1902+0.31 EUR
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NCK2910AHN/00200Y NXP USA Inc. Description: RECEIVER + INTEGRATED UC
Part Status: Obsolete
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S08PL8CTJ MC9S08PL8CTJ NXP USA Inc. MC9S08PL4.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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A5G26S008NT6 NXP USA Inc. A5G26S008N.pdf Description: RF MOSFET GAN 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 27dBm
Gain: 18.4dB
Technology: GaN
Supplier Device Package: 6-PDFN (4x4.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 17 mA
Produkt ist nicht verfügbar
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SPC5644BK0MLU8 SPC5644BK0MLU8 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 147
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Produkt ist nicht verfügbar
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SPC5605BK0VLQ4R SPC5605BK0VLQ4R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0VLQ4 SPC5605BK0VLQ4 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC32PF1550A0EP MC32PF1550A0EP NXP USA Inc. Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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MCF5207CVM166 MCF5207CVM166 NXP USA Inc. MCF5208EC.pdf Description: IC MCU 32BIT ROMLESS 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 166.67MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
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S9S08DZ60F2MLH S9S08DZ60F2MLH NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
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SPC5565MVZ132557 NXP USA Inc. Description: MICROCONTROLLER, 32-BIT,POWER AR
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6Q6AVT08AC MCIMX6Q6AVT08AC NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Not For New Designs
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MKL27Z128VFT4 MKL27Z128VFT4 NXP USA Inc. KL27P64M48SF6.pdf Description: IC MCU 32BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6Y2CVM08AA NXP USA Inc. Description: IC MPU I.MX6 792MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 792MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
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A3G20S350-01SR3 NXP USA Inc. A3G20S350-01S.pdf Description: RF MOSFET N-CHANNEL 48V NI400
Current - Test: 500 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: NI-400S-2SA
Technology: N-Channel
Gain: 18.1dB
Power - Output: 59W
Configuration: N-Channel
Frequency: 2.11GHz ~ 2.17GHz
Mounting Type: Surface Mount
Package / Case: NI-400S-2SA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A3G26H350W17SR3 NXP USA Inc. A3G26H350W17S.pdf Description: RF MOSFET GAN 48V NI780
Current - Test: 250 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: NI-780S-4S2S
Technology: GaN
Gain: 13.3dB
Power - Output: 59W
Frequency: 2.496GHz ~ 2.69GHz
Package / Case: NI-780S-4S2S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 250 Stücke
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S9S12G64BMLC S12G%20Family%20Fact%20Sheet.pdf
S9S12G64BMLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN48BCLC S12G%20Family%20Fact%20Sheet.pdf
S9S12GN48BCLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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PTN3356R1BSMP PTN3356R1.pdf
PTN3356R1BSMP
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 2.8V ~ 3.6V
Applications: DisplayPort
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
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179+3.34 EUR
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S9S08DZ32F2CLFR
S9S08DZ32F2CLFR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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S912ZVMBA6F0VLF S12ZVMBFS.pdf
S912ZVMBA6F0VLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RD33775ACNTEVB
Hersteller: NXP USA Inc.
Description: RD33775ACNTEVB
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33775A
Supplied Contents: Board(s), Cable(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
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UJA1076ATW/5V0/WDJ UJA1076A.pdf
UJA1076ATW/5V0/WDJ
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Part Status: Active
Grade: Automotive
auf Bestellung 2000 Stücke:
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AnzahlPrivatkunde
2000+4.58 EUR
Mindestbestellmenge: 2000 Stücke
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MMA5148KWR2528 FSCLS07279-1.pdf?t.download=true&u=5oefqw
MMA5148KWR2528
Hersteller: NXP USA Inc.
Description: PSI INERTIAL SENSOR
Packaging: Bulk
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
48+12.15 EUR
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FXLS90322AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Mounting Type: Surface Mount, Wettable Flank
Part Status: Active
Supplier Device Package: 16-HLQFNR (4x4)
Operating Temperature: -40°C ~ 125°C
Output Type: I2C, SPI
Package / Case: 16-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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FXLS90322AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Mounting Type: Surface Mount, Wettable Flank
Part Status: Active
Supplier Device Package: 16-HLQFNR (4x4)
Operating Temperature: -40°C ~ 125°C
Output Type: I2C, SPI
Package / Case: 16-LQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 1958 Stücke:
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2+12.57 EUR
10+11.16 EUR
25+10.64 EUR
50+10.27 EUR
100+9.9 EUR
250+9.45 EUR
500+9.1 EUR
1000+8.78 EUR
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SAF7751HN/N207ZMP
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7755HN/N207ZK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7751HV/N205/S3K
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7755HV/N207ZK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7755HV/N207ZY
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7753HV/N205ZY
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7751HV/N207ZY
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7758HV/N205ZK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7755HN/N208Z/MP
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7753HV/N205Y
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7753HV/N205K
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7753HV/N207ZK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7751HN/N207ZK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7753HV/N205ZK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7758HV/N207ZY
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7758HN/N207ZMP
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7751HN/N208Z/MP
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7751HV/N207ZK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7758HV/N205Y
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC8548CVJAUJD MPC8548EEC.pdf
MPC8548CVJAUJD
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MRFX1K80N-88MHZ MRFX1K80N.pdf
MRFX1K80N-88MHZ
Hersteller: NXP USA Inc.
Description: MRFX1K80N REF BOARD 108MHZ 1670W
Packaging: Bulk
For Use With/Related Products: MRFX1K80N
Frequency: 87.5MHz ~ 108MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRFX1K80N
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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MC33FS8430G4ES
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8430
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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SGTL5000XNBA3R2 SGTL5000.pdf
SGTL5000XNBA3R2
Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Cut Tape (CT)
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
auf Bestellung 1640 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.4 EUR
10+7.19 EUR
25+6.63 EUR
100+6.01 EUR
250+5.72 EUR
500+5.55 EUR
1000+5.4 EUR
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S9S12KG25J2MPVE
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRFX1K80H-128MHZ MRFX1K80H.pdf
MRFX1K80H-128MHZ
Hersteller: NXP USA Inc.
Description: MRFX1K80H REF BRD 128MHZ 3775W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 128MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRFX1K80H
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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S9S12GN48F0VLFR MC9S12GRMV1.pdf
S9S12GN48F0VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A3T21H400W23SR6 A3T21H400W23S.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 150 Stücke
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BUK7Y20-30B115 BUK7Y20-30B.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK7Y20-30B 39.5A,
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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WCT-5WTXAUTO
WCT-5WTXAUTO
Hersteller: NXP USA Inc.
Description: DEVELOPMENT TOOL 5W AUTO
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: MWCT1001A, MWCT1003A
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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FS32K148UAT0VMHT S32K1xx.pdf
FS32K148UAT0VMHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF0UL1101DUD,005 MF0ULX1.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Part Status: Active
Supplier Device Package: Die
Standards: ISO 14443, MIFARE
Operating Temperature: -25°C ~ 70°C
Produkt ist nicht verfügbar
Mindestbestellmenge: 100587 Stücke
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MPC8548EVJAUJD MPC8548EEC.pdf
MPC8548EVJAUJD
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Produkt ist nicht verfügbar
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MM908E624AYPEW MM908E624.pdf
MM908E624AYPEW
Hersteller: NXP USA Inc.
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC
DigiKey Programmable: Not Verified
Number of I/O: 16
Part Status: Active
Supplier Device Package: 54-SOIC
Core Processor: HC08
Applications: Mirror Control
Program Memory Type: FLASH (16kB)
Controller Series: 908E
Voltage - Supply: 5.5V ~ 18V
Operating Temperature: -40°C ~ 125°C
RAM Size: 512 x 8
Interface: SCI, SPI
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
Grade: Automotive
Produkt ist nicht verfügbar
Mindestbestellmenge: 26 Stücke
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LPC812M101JD20FP LPC81XM.pdf
LPC812M101JD20FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SO
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6+3.69 EUR
10+2.71 EUR
Mindestbestellmenge: 6 Stücke
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PEMI6QFN/HK,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/HK,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1902+0.31 EUR
Mindestbestellmenge: 1902 Stücke
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NCK2910AHN/00200Y
Hersteller: NXP USA Inc.
Description: RECEIVER + INTEGRATED UC
Part Status: Obsolete
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S08PL8CTJ MC9S08PL4.pdf
MC9S08PL8CTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 2250 Stücke
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A5G26S008NT6 A5G26S008N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 27dBm
Gain: 18.4dB
Technology: GaN
Supplier Device Package: 6-PDFN (4x4.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 17 mA
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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SPC5644BK0MLU8
SPC5644BK0MLU8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 147
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
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SPC5605BK0VLQ4R MPC560XBFAMFS.pdf
SPC5605BK0VLQ4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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SPC5605BK0VLQ4 MPC560XBFAMFS.pdf
SPC5605BK0VLQ4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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MC32PF1550A0EP
MC32PF1550A0EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 487 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+11.63 EUR
10+10.44 EUR
25+9.87 EUR
80+8.54 EUR
230+8.1 EUR
Mindestbestellmenge: 2 Stücke
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MCF5207CVM166 MCF5208EC.pdf
MCF5207CVM166
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 166.67MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 943 Stücke:
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AnzahlPrivatkunde
1+35.06 EUR
10+28.12 EUR
25+26.38 EUR
100+24.69 EUR
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S9S08DZ60F2MLH MC9S08DZ60.pdf
S9S08DZ60F2MLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 777 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+18.49 EUR
10+14.52 EUR
25+13.52 EUR
80+12.97 EUR
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SPC5565MVZ132557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 32-BIT,POWER AR
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6Q6AVT08AC IMX6DQAEC.pdf
MCIMX6Q6AVT08AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Not For New Designs
auf Bestellung 115 Stücke:
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AnzahlPrivatkunde
3+157.2 EUR
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MKL27Z128VFT4 KL27P64M48SF6.pdf
MKL27Z128VFT4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6Y2CVM08AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 792MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 792MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Produkt ist nicht verfügbar
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A3G20S350-01SR3 A3G20S350-01S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET N-CHANNEL 48V NI400
Current - Test: 500 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: NI-400S-2SA
Technology: N-Channel
Gain: 18.1dB
Power - Output: 59W
Configuration: N-Channel
Frequency: 2.11GHz ~ 2.17GHz
Mounting Type: Surface Mount
Package / Case: NI-400S-2SA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A3G26H350W17SR3 A3G26H350W17S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V NI780
Current - Test: 250 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: NI-780S-4S2S
Technology: GaN
Gain: 13.3dB
Power - Output: 59W
Frequency: 2.496GHz ~ 2.69GHz
Package / Case: NI-780S-4S2S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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