Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36402) > Seite 479 nach 607
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TEA19381T/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH 10SO Part Status: Obsolete Supplier Device Package: 10-SO Mounting Type: Surface Mount Package / Case: 10-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
TEA19381T/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH 10SO Part Status: Obsolete Supplier Device Package: 10-SO Mounting Type: Surface Mount Package / Case: 10-SOIC (0.154", 3.90mm Width) Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
S9S12GN32AMFT | NXP USA Inc. |
 Description: IC MCU 16BIT 32KB FLASH 48QFNPackaging: Tray Package / Case: 48-TFQFN Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: 12V1 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MC9RS08KA8CWJ | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 254 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-SOIC Part Status: Active Number of I/O: 18 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MRF6V14300HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780H Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 1.4GHz Power - Output: 330W Gain: 18dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Active Voltage - Rated: 100 V Voltage - Test: 50 V Current - Test: 150 mA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| PC34901WNEFR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 8SOIC Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
MP3V5050VC6U | NXP USA Inc. |
Description: SENSOR 7.25PSI 0.13" 2.82V Voltage - Supply: 2.7V ~ 3.3V Termination Style: Gull Wing Operating Temperature: -40°C ~ 125°C Accuracy: ±2.5% Pressure Type: Vacuum Operating Pressure: -7.25PSI (-50kPa) Output: 0.06 V ~ 2.82 V Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 8-SMD, Gull Wing, Top Port Features: Amplified Output, Temperature Compensated Packaging: Tube Part Status: Active Maximum Pressure: -29.01PSI (-200kPa) Port Style: Barbless Applications: Board Mount Port Size: Male - 0.13" (3.17mm) Tube |
auf Bestellung 777 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
SPC5748GK1MMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
SPC5748GSK1MKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLASH 176LQFP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| SPC5748GSK1MMJ6R | NXP USA Inc. |
Description: NXP 32-BIT MCU, TRIPLE CORE, 6MB Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz, 160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b SAR Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG Peripherals: DMA, LVD, I2S, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Grade: Automotive Part Status: Active Number of I/O: 246 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
SPC5748GTK1MMJ6R | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
SPC5748GGK1MMJ6R | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
SPC5748GBK0AMMN6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA Packaging: Tray Package / Case: 324-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 324-MAPBGA (19x19) Part Status: Active Number of I/O: 246 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
SPC5748GBK0ACKU6 | NXP USA Inc. |
Description: TRIPLE CORE, 6M FLASH, 768K RAM Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz, 160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b SAR Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG Peripherals: DMA, LVD, I2S, POR, WDT Supplier Device Package: 176-LQFP (24x24) Grade: Automotive Part Status: Active Number of I/O: 129 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| BUK9614-55A,118 | NXP USA Inc. |
Description: MOSFET N-CH 55V 73A D2PAK Packaging: Bulk Part Status: Active |
auf Bestellung 2273 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
 |
PCF7953ATTM1AC1500 | NXP USA Inc. |
Description: IC KEYLESS ENTRY/GO 28TSSOP Packaging: Tape & Reel (TR) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Supplier Device Package: 28-TSSOP Part Status: Last Time Buy DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
PCF7953ATTM1AC1500 | NXP USA Inc. |
Description: IC KEYLESS ENTRY/GO 28TSSOP Packaging: Cut Tape (CT) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Supplier Device Package: 28-TSSOP Part Status: Last Time Buy DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| T2081NSN8MQLB | NXP USA Inc. |
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| T2081NXE8PTB | NXP USA Inc. |
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
T2081NXN8P1B | NXP USA Inc. |
Description: IC MPU QORIQ T2 1.533GHZ 780FBGA Packaging: Tray Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 780-FBGA (23x23) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| T2081NSE8MQLB | NXP USA Inc. |
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| T2081NSE8T1B | NXP USA Inc. |
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| T2081NSE8P1B | NXP USA Inc. |
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| T2081NSE8PTB | NXP USA Inc. |
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| T2081NSE8MQB | NXP USA Inc. |
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
NX3L1T3157GMZ | NXP USA Inc. |
Description: IC SWITCH SPDT X 1 900MOHM 6XSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 900mOhm -3db Bandwidth: 60MHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 100kHz Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 100mOhm Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Grade: Automotive Part Status: Active Number of Circuits: 1 Qualification: AEC-Q100 |
auf Bestellung 6214 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
MRF101AN-88MHZ | NXP USA Inc. |
Description: MRF101AN REF BRD 108MHZ 115W Packaging: Bulk For Use With/Related Products: MRF101AN Frequency: 87.5MHz ~ 108MHz Type: Transistor Contents: Board(s) Utilized IC / Part: MRF101AN Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MCIMX6X4CVM08AC | NXP USA Inc. |
Description: IC MPU I.MX6SX 800MHZ 529MAPBGA Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC Part Status: Active Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Display & Interface Controllers: Keypad, LCD, LVDS Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 529-MAPBGA (19x19) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Operating Temperature: -40°C ~ 105°C (TA) Speed: 200MHz, 800MHz Mounting Type: Surface Mount Package / Case: 529-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
BF1201WR,115 | NXP USA Inc. |
Description: RF MOSFET 5V CMPAK-4 Packaging: Tape & Reel (TR) Package / Case: SC-82A, SOT-343 Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 400MHz Configuration: N-Channel Dual Gate Gain: 29dB Technology: MOSFET (Metal Oxide) Noise Figure: 1dB Supplier Device Package: CMPAK-4 Part Status: Obsolete Voltage - Rated: 10 V Voltage - Test: 5 V Current - Test: 15 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
BF1201WR,115 | NXP USA Inc. |
Description: RF MOSFET 5V CMPAK-4 Packaging: Cut Tape (CT) Package / Case: SC-82A, SOT-343 Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 400MHz Configuration: N-Channel Dual Gate Gain: 29dB Technology: MOSFET (Metal Oxide) Noise Figure: 1dB Supplier Device Package: CMPAK-4 Part Status: Obsolete Voltage - Rated: 10 V Voltage - Test: 5 V Current - Test: 15 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
BF1201WR,135 | NXP USA Inc. |
Description: MOSFET 2N-CH 10V 30MA SOT343R Packaging: Tape & Reel (TR) Package / Case: SC-82A, SOT-343 Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 400MHz Configuration: N-Channel Dual Gate Gain: 29dB Technology: MOSFET Noise Figure: 1dB Supplier Device Package: CMPAK-4 Part Status: Obsolete Voltage - Rated: 10 V Voltage - Test: 5 V Current - Test: 15 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
PDTC123TM,315 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 250MW SOT883 Packaging: Bulk Part Status: Active |
auf Bestellung 116800 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
SPC5605BK0CLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 7x10b, 5x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 77 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
SPC5646CF0MLU1 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 80MHz/120MHz Program Memory Size: 3MB (3M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d, e200z0h Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 147 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MCIMX6S5EVM10AB | NXP USA Inc. |
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA Operating Temperature: -20°C ~ 105°C (TJ) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 624-LFBGA Packaging: Tray Part Status: Not For New Designs Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-MAPBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit |
auf Bestellung 588 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
| PZU4.3BL315 | NXP USA Inc. |
Description: DIODE ZENER SINGLE Current - Reverse Leakage @ Vr: 3 µA @ 1 V Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Power - Max: 250 mW Part Status: Active Supplier Device Package: DFN1006-2 Impedance (Max) (Zzt): 90 Ohms Voltage - Zener (Nom) (Vz): 4.3 V Operating Temperature: -55°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-882 Tolerance: ±5% Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
MC9S12XD64CAA | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Not For New Designs Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MC9S12C64MFUE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 60 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
MC9S12C64VFUE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 60 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MC9S12C128MPBE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 52TQFP Packaging: Tray Package / Case: 52-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 52-TQFP (10x10) Part Status: Active Number of I/O: 35 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
P2010NSE2KFC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, MMC/SD, SPI Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
SPC5746GK1MKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP DigiKey Programmable: Not Verified Number of I/O: 129 Part Status: Active Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 80x10b, 64x12b Core Processor: e200z2, e200z4, e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 768K x 8 Program Memory Size: 3MB (3M x 8) Speed: 80MHz/160MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
BY329X-1500S,127 | NXP USA Inc. |
Description: DIODE GEN PURP 1.5KV 6A TO220FP Current - Reverse Leakage @ Vr: 250 µA @ 1300 V Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 6.5 A Voltage - DC Reverse (Vr) (Max): 1500 V Part Status: Obsolete Operating Temperature - Junction: 150°C (Max) Supplier Device Package: TO-220FP Current - Average Rectified (Io): 6A Technology: Standard Reverse Recovery Time (trr): 160 ns Speed: Fast Recovery =< 500ns, > 200mA (Io) Mounting Type: Through Hole Package / Case: TO-220-2 Full Pack Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
BY329-1500S,127 | NXP USA Inc. |
Description: DIODE GEN PURP 1.5KV 6A TO220AC Current - Reverse Leakage @ Vr: 250 µA @ 1300 V Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 6.5 A Voltage - DC Reverse (Vr) (Max): 1500 V Part Status: Obsolete Operating Temperature - Junction: 150°C (Max) Supplier Device Package: TO-220AC Current - Average Rectified (Io): 6A Technology: Standard Reverse Recovery Time (trr): 160 ns Speed: Fast Recovery =< 500ns, > 200mA (Io) Mounting Type: Through Hole Package / Case: TO-220-2 Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
BY329X-1500,127 | NXP USA Inc. |
Description: DIODE GEN PURP 1.5KV 6A TO220FP Voltage - Forward (Vf) (Max) @ If: 1.45 V @ 6.5 A Voltage - DC Reverse (Vr) (Max): 1500 V Part Status: Obsolete Operating Temperature - Junction: 150°C (Max) Supplier Device Package: TO-220FP Current - Average Rectified (Io): 6A Technology: Standard Reverse Recovery Time (trr): 230 ns Speed: Fast Recovery =< 500ns, > 200mA (Io) Mounting Type: Through Hole Package / Case: TO-220-2 Full Pack Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
SPC5746CSK1MMH6R | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 3MB (3M x 8) Speed: 80MHz/160MHz Mounting Type: Surface Mount Package / Case: 100-LFBGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Part Status: Active Supplier Device Package: 100-MAPBGA (11x11) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 80x10b, 64x12b Core Processor: e200z2, e200z4 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MPC885VR80 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 80MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Part Status: Obsolete Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
auf Bestellung 44 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
LS1020ASE7KQB | NXP USA Inc. |
Description: IC MPU QORIQ 1.0GHZ 525FCPBGA RAM Controllers: DDR3L, DDR4 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 (1), USB 3.0 + PHY Ethernet: GbE (3) Supplier Device Package: 525-FCPBGA (19x19) Core Processor: ARM® Cortex®-A7 Operating Temperature: 0°C ~ 105°C Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Packaging: Tray Part Status: Active SATA: SATA 3Gbps (1) Security Features: Secure Boot, TrustZone® |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| 74AVC32T245EC518 | NXP USA Inc. |
Description: BUS TRANSCEIVER, AVC SERIES Part Status: Active Supplier Device Package: 96-LFBGA (13.5x5.5) Current - Output High, Low: 12mA, 12mA Number of Bits per Element: 8 Voltage - Supply: 0.8V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Translation Transceiver Number of Elements: 4 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 96-LFBGA Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
74AVC32T245EC,518 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 96LFBGA Part Status: Obsolete Supplier Device Package: 96-LFBGA (13.5x5.5) Current - Output High, Low: 12mA, 12mA Number of Bits per Element: 8 Voltage - Supply: 0.8V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Translation Transceiver Number of Elements: 4 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 96-LFBGA Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| LFDBGJS50 | NXP USA Inc. |
Description: JTAG TO LAUTERBACH SAMTEC 50 PIN Part Status: Active Module/Board Type: Adapter Board Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
MC9S08DZ48AMLF | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 39 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x12b Core Processor: S08 EEPROM Size: 1.5K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 3K x 8 Program Memory Size: 48KB (48K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| P60D144PAA/9A2410M | NXP USA Inc. |
Description: IC SMART CARD CTLR INLAY A DigiKey Programmable: Not Verified Part Status: Obsolete Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
S9S12G48F1CLC | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP DigiKey Programmable: Not Verified Number of I/O: 26 Part Status: Active Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: 12V1 EEPROM Size: 1.5K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 48KB (48K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
XPC8260VVHFBC | NXP USA Inc. |
Description: IC MPU MPC82XX 166MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 166MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
S912XD64F2VAA | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Not For New Designs Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MIMXRT106SDVL6A | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196LFBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Discontinued at Digi-Key Number of I/O: 127 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
EV-INVERTERHD | NXP USA Inc. |
Description: EVAL BOARD FOR FS6500 Packaging: Bulk Function: Gate Driver Type: Power Management Contents: Board(s) Utilized IC / Part: FS6500, GD3160, MPC5775E, TJA1051, TJA1100HN Supplied Contents: Board(s) Primary Attributes: Motors (DC) Embedded: Yes, MCU Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MPC8321ECVRADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Part Status: Active Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 40 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
JN5161/001,515 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 3.6V Power - Output: 2.5dBm Protocol: ZigbeePRO® Current - Receiving: 17mA Data Rate (Max): 1Mbps Current - Transmitting: 15.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 20 Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, JTAG, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH |
| TEA19381T/1J |
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH 10SO
Part Status: Obsolete
Supplier Device Package: 10-SO
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC OFFLINE SWITCH 10SO
Part Status: Obsolete
Supplier Device Package: 10-SO
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA19381T/1J |
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH 10SO
Part Status: Obsolete
Supplier Device Package: 10-SO
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Description: IC OFFLINE SWITCH 10SO
Part Status: Obsolete
Supplier Device Package: 10-SO
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12GN32AMFT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9RS08KA8CWJ |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF6V14300HR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780H
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.4GHz
Power - Output: 330W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 150 mA
Description: RF MOSFET LDMOS 50V NI780H
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.4GHz
Power - Output: 330W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PC34901WNEFR2 |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MP3V5050VC6U |
|
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSI 0.13" 2.82V
Voltage - Supply: 2.7V ~ 3.3V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±2.5%
Pressure Type: Vacuum
Operating Pressure: -7.25PSI (-50kPa)
Output: 0.06 V ~ 2.82 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD, Gull Wing, Top Port
Features: Amplified Output, Temperature Compensated
Packaging: Tube
Part Status: Active
Maximum Pressure: -29.01PSI (-200kPa)
Port Style: Barbless
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Description: SENSOR 7.25PSI 0.13" 2.82V
Voltage - Supply: 2.7V ~ 3.3V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±2.5%
Pressure Type: Vacuum
Operating Pressure: -7.25PSI (-50kPa)
Output: 0.06 V ~ 2.82 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD, Gull Wing, Top Port
Features: Amplified Output, Temperature Compensated
Packaging: Tube
Part Status: Active
Maximum Pressure: -29.01PSI (-200kPa)
Port Style: Barbless
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
auf Bestellung 777 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 24.31 EUR |
| 5+ | 22.13 EUR |
| 10+ | 21.31 EUR |
| 40+ | 19.89 EUR |
| 80+ | 19.26 EUR |
| 120+ | 18.92 EUR |
| 520+ | 17.82 EUR |
| SPC5748GK1MMJ6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5748GSK1MKU6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5748GSK1MMJ6R |
Hersteller: NXP USA Inc.
Description: NXP 32-BIT MCU, TRIPLE CORE, 6MB
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, LVD, I2S, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Grade: Automotive
Part Status: Active
Number of I/O: 246
Qualification: AEC-Q100
Description: NXP 32-BIT MCU, TRIPLE CORE, 6MB
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, LVD, I2S, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Grade: Automotive
Part Status: Active
Number of I/O: 246
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5748GTK1MMJ6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5748GGK1MMJ6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5748GBK0AMMN6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tray
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Part Status: Active
Number of I/O: 246
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tray
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Part Status: Active
Number of I/O: 246
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5748GBK0ACKU6 |
|
Hersteller: NXP USA Inc.
Description: TRIPLE CORE, 6M FLASH, 768K RAM
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, LVD, I2S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Part Status: Active
Number of I/O: 129
Qualification: AEC-Q100
Description: TRIPLE CORE, 6M FLASH, 768K RAM
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, LVD, I2S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Part Status: Active
Number of I/O: 129
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BUK9614-55A,118 |
|
auf Bestellung 2273 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 683+ | 0.7 EUR |
| PCF7953ATTM1AC1500 |
Hersteller: NXP USA Inc.
Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCF7953ATTM1AC1500 |
Hersteller: NXP USA Inc.
Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 28-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| T2081NSN8MQLB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| T2081NXE8PTB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| T2081NXN8P1B |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T2 1.533GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ T2 1.533GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| T2081NSE8MQLB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| T2081NSE8T1B |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| T2081NSE8P1B |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| T2081NSE8PTB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| T2081NSE8MQB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NX3L1T3157GMZ |
|
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
auf Bestellung 6214 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 29+ | 0.62 EUR |
| 42+ | 0.43 EUR |
| 47+ | 0.38 EUR |
| 100+ | 0.33 EUR |
| 250+ | 0.3 EUR |
| 500+ | 0.29 EUR |
| 1000+ | 0.28 EUR |
| 2500+ | 0.27 EUR |
| MRF101AN-88MHZ |
|
Hersteller: NXP USA Inc.
Description: MRF101AN REF BRD 108MHZ 115W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 87.5MHz ~ 108MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
Description: MRF101AN REF BRD 108MHZ 115W
Packaging: Bulk
For Use With/Related Products: MRF101AN
Frequency: 87.5MHz ~ 108MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF101AN
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6X4CVM08AC |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 529MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD, LVDS
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 529-MAPBGA (19x19)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
Description: IC MPU I.MX6SX 800MHZ 529MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD, LVDS
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 529-MAPBGA (19x19)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BF1201WR,115 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
Description: RF MOSFET 5V CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BF1201WR,115 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V CMPAK-4
Packaging: Cut Tape (CT)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
Description: RF MOSFET 5V CMPAK-4
Packaging: Cut Tape (CT)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BF1201WR,135 |
|
Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 10V 30MA SOT343R
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
Description: MOSFET 2N-CH 10V 30MA SOT343R
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PDTC123TM,315 |
|
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Bulk
Part Status: Active
Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Bulk
Part Status: Active
auf Bestellung 116800 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 11871+ | 0.05 EUR |
| SPC5605BK0CLL6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5646CF0MLU1 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6S5EVM10AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Part Status: Not For New Designs
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Part Status: Not For New Designs
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
auf Bestellung 588 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 70.03 EUR |
| 10+ | 57.19 EUR |
| 25+ | 53.98 EUR |
| 80+ | 50.93 EUR |
| 300+ | 48.48 EUR |
| PZU4.3BL315 |
Hersteller: NXP USA Inc.
Description: DIODE ZENER SINGLE
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 4.3 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Tolerance: ±5%
Packaging: Bulk
Description: DIODE ZENER SINGLE
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 4.3 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12XD64CAA |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12C64MFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12C64VFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12C128MPBE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 52-TQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Verified
Description: IC MCU 16BIT 128KB FLASH 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 52-TQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| P2010NSE2KFC |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5746GK1MKU6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 3MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BY329X-1500S,127 |
|
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 6A TO220FP
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 6.5 A
Voltage - DC Reverse (Vr) (Max): 1500 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-220FP
Current - Average Rectified (Io): 6A
Technology: Standard
Reverse Recovery Time (trr): 160 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2 Full Pack
Packaging: Tube
Description: DIODE GEN PURP 1.5KV 6A TO220FP
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 6.5 A
Voltage - DC Reverse (Vr) (Max): 1500 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-220FP
Current - Average Rectified (Io): 6A
Technology: Standard
Reverse Recovery Time (trr): 160 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2 Full Pack
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BY329-1500S,127 |
|
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 6A TO220AC
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 6.5 A
Voltage - DC Reverse (Vr) (Max): 1500 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-220AC
Current - Average Rectified (Io): 6A
Technology: Standard
Reverse Recovery Time (trr): 160 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2
Packaging: Tube
Description: DIODE GEN PURP 1.5KV 6A TO220AC
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 6.5 A
Voltage - DC Reverse (Vr) (Max): 1500 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-220AC
Current - Average Rectified (Io): 6A
Technology: Standard
Reverse Recovery Time (trr): 160 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BY329X-1500,127 |
|
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 6A TO220FP
Voltage - Forward (Vf) (Max) @ If: 1.45 V @ 6.5 A
Voltage - DC Reverse (Vr) (Max): 1500 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-220FP
Current - Average Rectified (Io): 6A
Technology: Standard
Reverse Recovery Time (trr): 230 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2 Full Pack
Packaging: Tube
Description: DIODE GEN PURP 1.5KV 6A TO220FP
Voltage - Forward (Vf) (Max) @ If: 1.45 V @ 6.5 A
Voltage - DC Reverse (Vr) (Max): 1500 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-220FP
Current - Average Rectified (Io): 6A
Technology: Standard
Reverse Recovery Time (trr): 230 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2 Full Pack
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5746CSK1MMH6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC885VR80 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 108.38 EUR |
| 10+ | 89.82 EUR |
| 44+ | 82.87 EUR |
| LS1020ASE7KQB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.0GHZ 525FCPBGA
RAM Controllers: DDR3L, DDR4
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 (1), USB 3.0 + PHY
Ethernet: GbE (3)
Supplier Device Package: 525-FCPBGA (19x19)
Core Processor: ARM® Cortex®-A7
Operating Temperature: 0°C ~ 105°C
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: Secure Boot, TrustZone®
Description: IC MPU QORIQ 1.0GHZ 525FCPBGA
RAM Controllers: DDR3L, DDR4
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 (1), USB 3.0 + PHY
Ethernet: GbE (3)
Supplier Device Package: 525-FCPBGA (19x19)
Core Processor: ARM® Cortex®-A7
Operating Temperature: 0°C ~ 105°C
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: Secure Boot, TrustZone®
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74AVC32T245EC518 |
Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER, AVC SERIES
Part Status: Active
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 8
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Translation Transceiver
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Bulk
Description: BUS TRANSCEIVER, AVC SERIES
Part Status: Active
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 8
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Translation Transceiver
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AVC32T245EC,518 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 96LFBGA
Part Status: Obsolete
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 8
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Translation Transceiver
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Bulk
Description: IC TRANSLATOR BIDIR 96LFBGA
Part Status: Obsolete
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 8
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Translation Transceiver
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFDBGJS50 |
Hersteller: NXP USA Inc.
Description: JTAG TO LAUTERBACH SAMTEC 50 PIN
Part Status: Active
Module/Board Type: Adapter Board
Packaging: Bulk
Description: JTAG TO LAUTERBACH SAMTEC 50 PIN
Part Status: Active
Module/Board Type: Adapter Board
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08DZ48AMLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 3K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 8BIT 48KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 3K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| P60D144PAA/9A2410M |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR INLAY A
DigiKey Programmable: Not Verified
Part Status: Obsolete
Packaging: Bulk
Description: IC SMART CARD CTLR INLAY A
DigiKey Programmable: Not Verified
Part Status: Obsolete
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12G48F1CLC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 16BIT 48KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| XPC8260VVHFBC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 166MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Description: IC MPU MPC82XX 166MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XD64F2VAA |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT106SDVL6A |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| EV-INVERTERHD |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: FS6500, GD3160, MPC5775E, TJA1051, TJA1100HN
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes, MCU
Part Status: Active
Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: FS6500, GD3160, MPC5775E, TJA1051, TJA1100HN
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes, MCU
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8321ECVRADDCA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 40 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| JN5161/001,515 |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH