Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36604) > Seite 483 nach 611
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PBLS2024D115 | NXP USA Inc. |
 Description: TRANS PREBIAS 1PNP 1PNP 6-TSOPPackaging: Bulk Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Transistor Type: 1 PNP Pre-Biased, 1 PNP Power - Max: 760mW Current - Collector (Ic) (Max): 100mA, 1.8A Voltage - Collector Emitter Breakdown (Max): 50V, 20V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 210mV @ 100mA, 1.8A Current - Collector Cutoff (Max): 1µA, 100nA DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 200 @ 1A, 2V Frequency - Transition: 130MHz Resistor - Base (R1): 22kOhms Resistor - Emitter Base (R2): 22kOhms Supplier Device Package: 6-TSOP Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC908QY4AMDTE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 128 x 8 Program Memory Size: 4KB (4K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Packaging: Tube DigiKey Programmable: Not Verified Number of I/O: 13 Part Status: Not For New Designs Supplier Device Package: 16-TSSOP Peripherals: LVD, POR, PWM Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 6x10b Core Processor: HC08 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2880 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912XEG384BCAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Speed: 50MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 91 Part Status: Active Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 24K x 8 Program Memory Size: 384KB (384K x 8) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| SC505713MZP33R2 | NXP USA Inc. |
Description: IC Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MC908QY4ACPE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16DIP Packaging: Bulk Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-PDIP Part Status: Obsolete Number of I/O: 13 DigiKey Programmable: Not Verified |
auf Bestellung 44563 Stücke: Lieferzeit 10-14 Tag (e) |
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| SC141715VFUER | NXP USA Inc. |
Description: IC Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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PCA9306JKZ | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-X2SON Packaging: Tape & Reel (TR) Package / Case: 8-XFDFN Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Supplier Device Package: 8-X2SON (1.35x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCHC908QT4CDWE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 8SO Packaging: Tube Package / Case: 8-SOIC (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-SO Part Status: Obsolete Number of I/O: 5 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PZU14DB2,115 | NXP USA Inc. |
Description: ZENER DIODE, 14V V(Z), 2.14%, 0. Tolerance: ±2% Packaging: Bulk Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Configuration: 2 Independent Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 14 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: 5-TSSOP Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 11 V |
auf Bestellung 45000 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5607BF1VLU6R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 29x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 149 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5607BF1VLU6R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Cut Tape (CT) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 29x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 149 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PN7120A0EV/C10801 | NXP USA Inc. |
Description: NFC FORUM COMPLIANT CONTROLLER W Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MC9S12C32CFAE25 | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 31 DigiKey Programmable: Verified |
auf Bestellung 691 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FN1M0VMC12R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA Packaging: Tape & Reel (TR) Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Part Status: Not For New Designs Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MK22FN1M0VMC12R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA Packaging: Cut Tape (CT) Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Part Status: Not For New Designs Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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KITPF0100SKTEVBE | NXP USA Inc. |
Description: EVALUATION BOARD - MMPF0100 OTP Packaging: Bulk For Use With/Related Products: PF0x00 Module/Board Type: Socket Module - QFN Part Status: Active Utilized IC / Part: PF0x00 |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08SG16E1WTL | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 28TSSOP DigiKey Programmable: Not Verified Number of I/O: 22 Part Status: Active Supplier Device Package: 28-TSSOP Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 28-TSSOP (0.173", 4.40mm Width) Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC8640DTHJ1250HE | NXP USA Inc. |
Description: IC MPU MPC86XX 1.25GHZ 1023BGA Packaging: Tray Package / Case: 1023-BCBGA, FCBGA Mounting Type: Surface Mount Speed: 1.25GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e600 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1023-FCCBGA (33x33) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PMMA1270KEG | NXP USA Inc. |
Description: IC ACCEL COLOSSUS 2.5G Packaging: Tube Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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BCP56-10H,115 | NXP USA Inc. |
Description: 80 V, 1 A NPN MEDIUM POWER TRAN Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC5534JBD100K | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 100HLQFP RAM Size: 96K x 8 Program Memory Size: 128KB (128K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 66 Part Status: Active Supplier Device Package: 100-HLQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0 Data Converters: A/D 23x16b; D/A 2x12b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Single-Core |
auf Bestellung 450 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT106ADVL6AR | NXP USA Inc. |
Description: CROSSOVER PROCESSOR WITH ARM COR Packaging: Tape & Reel (TR) Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Discontinued at Digi-Key Number of I/O: 127 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMXRT106ADVL6A | NXP USA Inc. |
Description: CROSSOVER PROCESSOR WITH ARM COR Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Discontinued at Digi-Key Number of I/O: 127 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMXRT1171AVM8AR | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289MAPBGA Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 800MHz RAM Size: 2M x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b SAR; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active Number of I/O: 13 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMXRT1176AVM8AR | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289MAPBGA Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 800MHz RAM Size: 2M x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4, Cortex®-M7 Data Converters: A/D 20x12b SAR; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active Number of I/O: 13 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC1769FBD100/P1K | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 70 |
auf Bestellung 321 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF5249LAG120 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz RAM Size: 96K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Data Converters: A/D 4x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SCF5249LAG120 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz RAM Size: 96K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Data Converters: A/D 4x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PCAL9539APW,118 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP Features: POR Packaging: Tape & Reel (TR) Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-TSSOP Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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PCAL9539APW,118 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP Features: POR Packaging: Cut Tape (CT) Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-TSSOP Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 2506 Stücke: Lieferzeit 10-14 Tag (e) |
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| T1042NSE7PQPB | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART Part Status: Active SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Graphics Acceleration: No RAM Controllers: DDR3L, DDR4 Number of Cores/Bus Width: 4 Core, 64-Bit USB: USB 2.0 + PHY (2) Ethernet: 1Gbps (5) Supplier Device Package: 780-FCPBGA (23x23) Core Processor: PowerPC e5500 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.4GHz Mounting Type: Surface Mount Package / Case: 780-FBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF7741HV/N118518 | NXP USA Inc. |
Description: CAR RADIO DIGITAL SIGNAL PROCESS Packaging: Bulk Part Status: Active |
auf Bestellung 2250 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF3561EL/V1101,51 | NXP USA Inc. |
Description: IC DAB RADIO 170LFBGA Part Status: Obsolete Supplier Device Package: 170-LFBGA (12x12) Clock Rate: 96kHz Voltage - Core: 3.30V Voltage - I/O: 3.30V On-Chip RAM: 64KB Operating Temperature: -40°C ~ 85°C (TA) Type: Digital Radio Processor Interface: I²C, I²S, SPI, UART Mounting Type: Surface Mount Package / Case: 170-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF3561EL/V1103,51 | NXP USA Inc. |
Description: IC DAB RADIO 170LFBGA Part Status: Obsolete Supplier Device Package: 170-LFBGA (12x12) Clock Rate: 96kHz Voltage - Core: 3.30V Voltage - I/O: 3.30V On-Chip RAM: 64KB Operating Temperature: -40°C ~ 85°C (TA) Type: Digital Radio Processor Interface: I²C, I²S, SPI, UART Mounting Type: Surface Mount Package / Case: 170-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF3561EL/V1102,51 | NXP USA Inc. |
Description: IC DAB RADIO 170LFBGA Part Status: Obsolete Supplier Device Package: 170-LFBGA (12x12) Clock Rate: 96kHz Voltage - Core: 3.30V Voltage - I/O: 3.30V On-Chip RAM: 64KB Operating Temperature: -40°C ~ 85°C (TA) Type: Digital Radio Processor Interface: I²C, I²S, SPI, UART Mounting Type: Surface Mount Package / Case: 170-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF3561EL/V1100K | NXP USA Inc. |
Description: IC DAB RADIO 170LFBGA Part Status: Obsolete Supplier Device Package: 170-LFBGA (12x12) Clock Rate: 96kHz Voltage - Core: 3.30V Voltage - I/O: 3.30V On-Chip RAM: 64KB Operating Temperature: -40°C ~ 85°C (TA) Type: Digital Radio Processor Interface: I²C, I²S, SPI, UART Mounting Type: Surface Mount Package / Case: 170-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF3561EL/V1101,55 | NXP USA Inc. |
Description: IC DAB RADIO 170LFBGA Part Status: Obsolete Supplier Device Package: 170-LFBGA (12x12) Clock Rate: 96kHz Voltage - Core: 3.30V Voltage - I/O: 3.30V On-Chip RAM: 64KB Operating Temperature: -40°C ~ 85°C (TA) Type: Digital Radio Processor Interface: I²C, I²S, SPI, UART Mounting Type: Surface Mount Package / Case: 170-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF3561HV/V1103,55 | NXP USA Inc. |
Description: IC DGTL RADIO PROCESSOR 144HLQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF3560HV/V1100,51 | NXP USA Inc. |
Description: IC DGTL RADIO PROCESSOR 144HLQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF3560HV/V1102,55 | NXP USA Inc. |
Description: IC DGTL RADIO PROCESSOR 144HLQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF3561HV/V1101,51 | NXP USA Inc. |
Description: IC DGTL RADIO PROCESSOR 144HLQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF3561HV/V1103,51 | NXP USA Inc. |
Description: IC DGTL RADIO PROCESSOR 144HLQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF3560HV/V1106K | NXP USA Inc. |
Description: IC DGTL RADIO PROCESSOR 144HLQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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74AHCT2G32GD,125 | NXP USA Inc. |
Description: IC GATE OR 2CH 2-INP 8XSON Current - Quiescent (Max): 1 µA Number of Circuits: 2 Part Status: Active Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF Input Logic Level - Low: 0.8V Input Logic Level - High: 2V Supplier Device Package: 8-XSON (2x3) Number of Inputs: 2 Current - Output High, Low: 8mA, 8mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C Logic Type: OR Gate Mounting Type: Surface Mount Package / Case: 8-XFDFN Packaging: Bulk |
auf Bestellung 5387 Stücke: Lieferzeit 10-14 Tag (e) |
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PRF13750HR9 | NXP USA Inc. |
Description: RF MOSFET LDMOS NI1230 Gain: 20.6dB Power - Output: 650W Configuration: Dual Frequency: 700MHz ~ 1.3GHz Current Rating (Amps): 10µA Package / Case: SOT-979A Packaging: Strip Voltage - Rated: 105 V Part Status: Obsolete Supplier Device Package: NI-1230-4H Technology: LDMOS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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K32W1480VFTBT | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 48HVQFN Package / Case: 48-VFQFN Exposed Pad Packaging: Tray Part Status: Active Serial Interfaces: I2C, I2S, SPI, UART RF Family/Standard: 802.15.4, Bluetooth Modulation: FSK, GFSK, GMSK, MSK Supplier Device Package: 48-HVQFN (7x7) Current - Transmitting: 22.4mA Data Rate (Max): 2Mbps Current - Receiving: 8.7mA Protocol: Bluetooth v5.2, Thread, Zigbee® Power - Output: 10dBm Voltage - Supply: 1.71V ~ 3.6V Operating Temperature: -40°C ~ 105°C Type: TxRx + MCU Memory Size: 1MB Flash, 128kB SRAM Frequency: 2.4GHz Mounting Type: Surface Mount, Wettable Flank Sensitivity: -106dBm |
auf Bestellung 1258 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74AHCT1G04GV | NXP USA Inc. |
Description: NOW NEXPERIA 74AHCT1G04GV - INVE Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| 74AHCT1G04GW-Q100125 | NXP USA Inc. |
Description: INVERTER, AHCT/VHCT/VT SERIES Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| 74AHCT1G04GM115 | NXP USA Inc. |
Description: NOW NEXPERIA 74AHCT1G04GM - INVE Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MMW9014KZ | NXP USA Inc. |
Description: 4-CHANNEL DUAL-POLARIZED ANALOG Function: Transmitter Mounting Type: Surface Mount Package / Case: 182-UFBGA Packaging: Tape & Reel (TR) Part Status: Active Supplier Device Package: 182-HUBGA (6.1x6.5) RF Type: General Purpose Frequency: 24.25GHz |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MMW9012KZ | NXP USA Inc. |
Description: 4-CHANNEL DUAL-POLARIZED ANALOG Part Status: Active Supplier Device Package: 182-HUBGA (6.1x6.5) RF Type: General Purpose Frequency: 26.5GHz ~ 29.5GHz Function: Transmitter Mounting Type: Surface Mount Package / Case: 182-UFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PCA9634D | NXP USA Inc. |
Description: LED DRIVER 8-SEGMENT Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PCA9634D118 | NXP USA Inc. |
Description: IC LED DRIVER LIN DIM 25MA 20SO Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MC9S12DB128MPVE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Obsolete Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC9S12DB128CFUE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Obsolete Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 252 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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N74F541D,623 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 20SO Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 20-SO Part Status: Obsolete |
auf Bestellung 946 Stücke: Lieferzeit 10-14 Tag (e) |
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| PMMA2241KEG | NXP USA Inc. |
Description: IC ACCEL X-LATERAL 10G Packaging: Tube Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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LM75BDP/DG,118 | NXP USA Inc. |
Description: SENSOR DIGITAL -55C-125C 8TSSOP Features: Output Switch, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: I2C Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.8V ~ 5.5V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 8-TSSOP Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±2°C (±3°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Obsolete |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC56F83766VLK | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFP DigiKey Programmable: Not Verified Number of I/O: 68 Part Status: Active Supplier Device Package: 80-FQFP (12x12) Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Connectivity: CANbus, I²C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 20x12b; D/A 2x12b Core Processor: 56800EX Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 48K x 8 Program Memory Size: 128KB (128K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPXV2202DP | NXP USA Inc. |
 Description: SENSOR 29.01PSID 0.13" .04V 8SOPFeatures: Temperature Compensated Packaging: Tray Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 40 mV (10V) Operating Pressure: 29.01PSI (200kPa) Pressure Type: Differential Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Port Size: Male - 0.13" (3.17mm) Tube Applications: Board Mount Supplier Device Package: 8-SOP Port Style: Barbed Maximum Pressure: 58.02PSI (400kPa) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| PBLS2024D115 |
|
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS 1PNP 1PNP 6-TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Transistor Type: 1 PNP Pre-Biased, 1 PNP
Power - Max: 760mW
Current - Collector (Ic) (Max): 100mA, 1.8A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 210mV @ 100mA, 1.8A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 200 @ 1A, 2V
Frequency - Transition: 130MHz
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: 6-TSOP
Part Status: Active
Description: TRANS PREBIAS 1PNP 1PNP 6-TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Transistor Type: 1 PNP Pre-Biased, 1 PNP
Power - Max: 760mW
Current - Collector (Ic) (Max): 100mA, 1.8A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 210mV @ 100mA, 1.8A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 200 @ 1A, 2V
Frequency - Transition: 130MHz
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: 6-TSOP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC908QY4AMDTE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 13
Part Status: Not For New Designs
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: HC08
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 13
Part Status: Not For New Designs
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: HC08
Produkt ist nicht verfügbar
Mindestbestellmenge: 2880 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912XEG384BCAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC908QY4ACPE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16DIP
Packaging: Bulk
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16DIP
Packaging: Bulk
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 44563 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 160+ | 6.7 EUR |
| PCA9306JKZ |
|
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-X2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-X2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCHC908QT4CDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Verified
Description: IC MCU 8BIT 4KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PZU14DB2,115 |
|
Hersteller: NXP USA Inc.
Description: ZENER DIODE, 14V V(Z), 2.14%, 0.
Tolerance: ±2%
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Configuration: 2 Independent
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 14 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: 5-TSSOP
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 11 V
Description: ZENER DIODE, 14V V(Z), 2.14%, 0.
Tolerance: ±2%
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Configuration: 2 Independent
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 14 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: 5-TSSOP
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 11 V
auf Bestellung 45000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8876+ | 0.063 EUR |
| SPC5607BF1VLU6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| SPC5607BF1VLU6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PN7120A0EV/C10801 |
|
Hersteller: NXP USA Inc.
Description: NFC FORUM COMPLIANT CONTROLLER W
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NFC FORUM COMPLIANT CONTROLLER W
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12C32CFAE25 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Verified
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Verified
auf Bestellung 691 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 39.77 EUR |
| 10+ | 31.81 EUR |
| 25+ | 29.82 EUR |
| 100+ | 27.63 EUR |
| 250+ | 26.58 EUR |
| 500+ | 25.95 EUR |
| MK22FN1M0VMC12R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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Stück im Wert von UAH
| MK22FN1M0VMC12R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| KITPF0100SKTEVBE |
|
Hersteller: NXP USA Inc.
Description: EVALUATION BOARD - MMPF0100 OTP
Packaging: Bulk
For Use With/Related Products: PF0x00
Module/Board Type: Socket Module - QFN
Part Status: Active
Utilized IC / Part: PF0x00
Description: EVALUATION BOARD - MMPF0100 OTP
Packaging: Bulk
For Use With/Related Products: PF0x00
Module/Board Type: Socket Module - QFN
Part Status: Active
Utilized IC / Part: PF0x00
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 412.68 EUR |
| S9S08SG16E1WTL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC8640DTHJ1250HE |
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.25GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC86XX 1.25GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BCP56-10H,115 |
Hersteller: NXP USA Inc.
Description: 80 V, 1 A NPN MEDIUM POWER TRAN
Packaging: Bulk
Part Status: Active
Description: 80 V, 1 A NPN MEDIUM POWER TRAN
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC5534JBD100K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 66
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Data Converters: A/D 23x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 66
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Data Converters: A/D 23x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.85 EUR |
| 10+ | 17.16 EUR |
| 80+ | 14.21 EUR |
| MIMXRT106ADVL6AR |
|
Hersteller: NXP USA Inc.
Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT106ADVL6A |
|
Hersteller: NXP USA Inc.
Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: CROSSOVER PROCESSOR WITH ARM COR
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1171AVM8AR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1176AVM8AR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC1769FBD100/P1K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
auf Bestellung 321 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 38.03 EUR |
| 10+ | 30.37 EUR |
| 25+ | 28.45 EUR |
| 100+ | 26.35 EUR |
| MCF5249LAG120 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SCF5249LAG120 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PCAL9539APW,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2500+ | 2.52 EUR |
| PCAL9539APW,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2506 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.82 EUR |
| 10+ | 3.59 EUR |
| 25+ | 3.28 EUR |
| 100+ | 2.94 EUR |
| 250+ | 2.78 EUR |
| 500+ | 2.69 EUR |
| 1000+ | 2.67 EUR |
| T1042NSE7PQPB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SAF7741HV/N118518 |
|
Hersteller: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
auf Bestellung 2250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 55+ | 11.52 EUR |
| SAF3561EL/V1101,51 |
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF3561EL/V1103,51 |
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF3561EL/V1102,51 |
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF3561EL/V1100K |
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tray
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF3561EL/V1101,55 |
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tray
Description: IC DAB RADIO 170LFBGA
Part Status: Obsolete
Supplier Device Package: 170-LFBGA (12x12)
Clock Rate: 96kHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 64KB
Operating Temperature: -40°C ~ 85°C (TA)
Type: Digital Radio Processor
Interface: I²C, I²S, SPI, UART
Mounting Type: Surface Mount
Package / Case: 170-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF3561HV/V1103,55 |
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF3560HV/V1100,51 |
|
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF3560HV/V1102,55 |
|
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF3561HV/V1101,51 |
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF3561HV/V1103,51 |
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF3560HV/V1106K |
|
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AHCT2G32GD,125 |
|
Hersteller: NXP USA Inc.
Description: IC GATE OR 2CH 2-INP 8XSON
Current - Quiescent (Max): 1 µA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
Description: IC GATE OR 2CH 2-INP 8XSON
Current - Quiescent (Max): 1 µA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
auf Bestellung 5387 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2049+ | 0.29 EUR |
| PRF13750HR9 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS NI1230
Gain: 20.6dB
Power - Output: 650W
Configuration: Dual
Frequency: 700MHz ~ 1.3GHz
Current Rating (Amps): 10µA
Package / Case: SOT-979A
Packaging: Strip
Voltage - Rated: 105 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Description: RF MOSFET LDMOS NI1230
Gain: 20.6dB
Power - Output: 650W
Configuration: Dual
Frequency: 700MHz ~ 1.3GHz
Current Rating (Amps): 10µA
Package / Case: SOT-979A
Packaging: Strip
Voltage - Rated: 105 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| K32W1480VFTBT |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 48HVQFN
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Part Status: Active
Serial Interfaces: I2C, I2S, SPI, UART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Current - Transmitting: 22.4mA
Data Rate (Max): 2Mbps
Current - Receiving: 8.7mA
Protocol: Bluetooth v5.2, Thread, Zigbee®
Power - Output: 10dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
Description: IC RF TXRX+MCU 802.15.4 48HVQFN
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Part Status: Active
Serial Interfaces: I2C, I2S, SPI, UART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: FSK, GFSK, GMSK, MSK
Supplier Device Package: 48-HVQFN (7x7)
Current - Transmitting: 22.4mA
Data Rate (Max): 2Mbps
Current - Receiving: 8.7mA
Protocol: Bluetooth v5.2, Thread, Zigbee®
Power - Output: 10dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx + MCU
Memory Size: 1MB Flash, 128kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -106dBm
auf Bestellung 1258 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.17 EUR |
| 10+ | 10.79 EUR |
| 25+ | 10.29 EUR |
| 40+ | 10.04 EUR |
| 80+ | 9.69 EUR |
| 260+ | 9.42 EUR |
| 74AHCT1G04GV |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT1G04GV - INVE
Part Status: Active
Packaging: Bulk
Description: NOW NEXPERIA 74AHCT1G04GV - INVE
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AHCT1G04GW-Q100125 |
|
Hersteller: NXP USA Inc.
Description: INVERTER, AHCT/VHCT/VT SERIES
Part Status: Active
Packaging: Bulk
Description: INVERTER, AHCT/VHCT/VT SERIES
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AHCT1G04GM115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT1G04GM - INVE
Part Status: Active
Packaging: Bulk
Description: NOW NEXPERIA 74AHCT1G04GM - INVE
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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| MMW9014KZ |
Hersteller: NXP USA Inc.
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 24.25GHz
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 24.25GHz
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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| MMW9012KZ |
Hersteller: NXP USA Inc.
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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| PCA9634D |
|
Hersteller: NXP USA Inc.
Description: LED DRIVER 8-SEGMENT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: LED DRIVER 8-SEGMENT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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| PCA9634D118 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRIVER LIN DIM 25MA 20SO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC LED DRIVER LIN DIM 25MA 20SO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MC9S12DB128MPVE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MC9S12DB128CFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| N74F541D,623 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Part Status: Obsolete
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Part Status: Obsolete
auf Bestellung 946 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 946+ | 0.63 EUR |
| LM75BDP/DG,118 |
|
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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| MC56F83766VLK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| MPXV2202DP |
|
Hersteller: NXP USA Inc.
Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
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