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PHT11N06LT,135 PHT11N06LT,135 NXP USA Inc. Description: MOSFET N-CH 55V 4.9A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.9A (Ta)
Rds On (Max) @ Id, Vgs: 40mOhm @ 5A, 5V
Power Dissipation (Max): 1.8W (Ta), 8.3W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): ±13V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 1400 pF @ 25 V
Produkt ist nicht verfügbar
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CBTU4411EE,518 CBTU4411EE,518 NXP USA Inc. PHGLS24915-1.pdf?t.download=true&u=5oefqw Description: CBTU4411 - 11-BIT DDR2 SDRAM MUX
Packaging: Bulk
Package / Case: 72-LFBGA
Mounting Type: Surface Mount
Circuit: 11 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 72-LFBGA (7x7)
Part Status: Active
auf Bestellung 5990 Stücke:
Lieferzeit 10-14 Tag (e)
268+1.76 EUR
Mindestbestellmenge: 268
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CBTU4411EE518 NXP USA Inc. CBTU4411.pdf Description: BUS TRANSCEIVER CBT/FST/QS/5C/B
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NAFE11388B40BSK NAFE11388B40BSK NXP USA Inc. Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Part Status: Active
Number of Channels: 8
Power (Watts): 125 mW
Produkt ist nicht verfügbar
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NAFE11388B40BSK NAFE11388B40BSK NXP USA Inc. Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Part Status: Active
Number of Channels: 8
Power (Watts): 125 mW
auf Bestellung 1299 Stücke:
Lieferzeit 10-14 Tag (e)
1+33.30 EUR
10+26.57 EUR
25+24.89 EUR
100+23.04 EUR
250+22.16 EUR
500+21.63 EUR
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NAFE71388B40BSK NAFE71388B40BSK NXP USA Inc. Description: IC 8-IN HIGH-SPEED 25V AFE
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.63V
Voltage - Supply, Digital: 2.97V ~ 3.63V
Supplier Device Package: 64-HVQFN (9x9)
Part Status: Active
Number of Channels: 8
Power (Watts): 135 mW
auf Bestellung 1300 Stücke:
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1300+21.32 EUR
Mindestbestellmenge: 1300
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NAFE71388B40BSK NAFE71388B40BSK NXP USA Inc. Description: IC 8-IN HIGH-SPEED 25V AFE
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.63V
Voltage - Supply, Digital: 2.97V ~ 3.63V
Supplier Device Package: 64-HVQFN (9x9)
Part Status: Active
Number of Channels: 8
Power (Watts): 135 mW
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
1+38.86 EUR
10+28.59 EUR
25+25.96 EUR
100+23.02 EUR
250+21.59 EUR
500+21.32 EUR
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MPC8343ECZQAGDB NXP USA Inc. FSCLS06083-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC II PRO PROCESSOR
Packaging: Bulk
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
6+94.45 EUR
Mindestbestellmenge: 6
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MPC8247VRTIEA MPC8247VRTIEA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Active
auf Bestellung 40 Stücke:
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1+129.36 EUR
10+108.81 EUR
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MPC8250AZQIHBC MPC8250AZQIHBC NXP USA Inc. MPC8250.pdf Description: IC MPU MPC82XX 200MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8255ACZUMHBB MPC8255ACZUMHBB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7754HV/N205WK NXP USA Inc. Description: DSP AUDIO MULTI-TUNER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SAF7754HV/N205WY NXP USA Inc. Description: DSP AUDIO MULTI-TUNER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74HCT280DB112 74HCT280DB112 NXP USA Inc. 74HC_HCT280.pdf Description: NOW NEXPERIA 74HCT280DB PARITY G
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Number of Circuits: 9
Mounting Type: Surface Mount
Logic Type: Parity Generator/Checker
Operating Temperature: -40°C ~ 125°C
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 14-SSOP
Part Status: Active
Voltage - Supply: 4.5 V ~ 5.5 V
auf Bestellung 1092 Stücke:
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1092+0.60 EUR
Mindestbestellmenge: 1092
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S9S08DN48F2MLH S9S08DN48F2MLH NXP USA Inc. Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
Produkt ist nicht verfügbar
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MCZ33661EFR2 MCZ33661EFR2 NXP USA Inc. Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8007BHL/C3,118 TDA8007BHL/C3,118 NXP USA Inc. TDA8007BHL_Rev8.pdf Description: IC INTERFACE SPECIALIZED 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: Parallel
Voltage - Supply: 2.7V ~ 6V
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8007BHL/C3,118 TDA8007BHL/C3,118 NXP USA Inc. TDA8007BHL_Rev8.pdf Description: IC INTERFACE SPECIALIZED 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: Parallel
Voltage - Supply: 2.7V ~ 6V
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08QE8CWL MC9S08QE8CWL NXP USA Inc. MC9S08QE8.pdf description Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 22
auf Bestellung 8112 Stücke:
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223+3.70 EUR
Mindestbestellmenge: 223
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MC9S08QE8CWL MC9S08QE8CWL NXP USA Inc. MC9S08QE8.pdf description Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 22
Produkt ist nicht verfügbar
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SPC5668EF1AVMG SPC5668EF1AVMG NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 155
Produkt ist nicht verfügbar
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74ALVCH162244DL118 74ALVCH162244DL118 NXP USA Inc. 74ALVCH162244.pdf Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 1608 Stücke:
Lieferzeit 10-14 Tag (e)
535+0.92 EUR
Mindestbestellmenge: 535
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TFF1018HN/N1,115 TFF1018HN/N1,115 NXP USA Inc. TFF1018HN.pdf Description: IC MIXER 10.7-12.75GHZ 16DHVQFN
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 10.7GHz ~ 12.75GHz
RF Type: Ku-Band
Voltage - Supply: 4.5V ~ 5.5V
Gain: 45dB
Current - Supply: 52mA
Secondary Attributes: Down Converter
Noise Figure: 7dB
Number of Mixers: 1
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Obsolete
auf Bestellung 5429 Stücke:
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952+0.54 EUR
Mindestbestellmenge: 952
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TFF1025HN/N1F NXP USA Inc. Description: IC CLOCK
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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IP3338CX24/LF/P135 NXP USA Inc. IP3338CX24.pdf Description: DATA LINE FILTER
Packaging: Bulk
Part Status: Active
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)
656+0.76 EUR
Mindestbestellmenge: 656
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IP3348CX20,135 IP3348CX20,135 NXP USA Inc. IP3348CX5%2C10%2C15%2C20.pdf Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Current: 20 mA
Produkt ist nicht verfügbar
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74AVC16245DGG-Q100118 74AVC16245DGG-Q100118 NXP USA Inc. 74AVC16245_Q100.pdf Description: BUS TRANSCEIVER, AVC SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 600 Stücke:
Lieferzeit 10-14 Tag (e)
329+1.60 EUR
Mindestbestellmenge: 329
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MPC8271CVRTIEA MPC8271CVRTIEA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
1+185.15 EUR
10+155.80 EUR
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S12ZVML-MINIBRD S12ZVML-MINIBRD NXP USA Inc. S12ZVMBFS.pdf Description: LOW COST S12ZVML BLDC MC REFEREN
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVM
Supplied Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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FRDM-32XSF-EVB NXP USA Inc. Description: FRDM EXP BD - 32V IND LIGHTING 5
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC17XSF500
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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KIT22XS4200EKEVB NXP USA Inc. KT22XS4200UG.pdf Description: EVALUATION KIT - MC22XS4200 DUA
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC22XS4200
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08JS8CWJ MC9S08JS8CWJ NXP USA Inc. MC9S08JS16.pdf Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 373 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.68 EUR
10+4.27 EUR
38+3.79 EUR
114+3.51 EUR
266+3.35 EUR
Mindestbestellmenge: 4
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S9S08SG8E2CTJ S9S08SG8E2CTJ NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T2080NSE8PTB557 NXP USA Inc. Description: QORIQ, 64B POWER ARCH, 8X 1.5GHZ
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DN16ACLC MC9S08DN16ACLC NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DN16MLF MC9S08DN16MLF NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC54102J256UK49019 LPC54102J256UK49019 NXP USA Inc. PHGL-S-A0008964602-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
Produkt ist nicht verfügbar
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PEMI2QFN/LT,115 PEMI2QFN/LT,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
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MC9S12XHZ256CAG MC9S12XHZ256CAG NXP USA Inc. MC9S12XHZ512.pdf Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 117
Produkt ist nicht verfügbar
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SPC5746CSK1MKU6,557 NXP USA Inc. Description: MPC574XP MICROCONTROLLER POWER A
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
Produkt ist nicht verfügbar
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74HCT153N,652 74HCT153N,652 NXP USA Inc. 74HC_HCT153.pdf Description: IC MULTIPLEXER 2 X 4:1 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC68302CRC20C157-NXP NXP USA Inc. MOTOS07936-1.pdf?t.download=true&u=5oefqw Description: INTEGRATED MULTIPROTOCOL MICROPR
Packaging: Bulk
Part Status: Active
auf Bestellung 58 Stücke:
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74LVT74D,112 74LVT74D,112 NXP USA Inc. 74LVT74.pdf Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 1 mA
Current - Output High, Low: 20mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 345 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1
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MC06XSD200FK MC06XSD200FK NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:2 23PQFN
Features: Internal PWM, Slew Rate Controlled
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 6mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 9A
Ratio - Input:Output: 1:2
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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S9S12P32J0MLH S9S12P32J0MLH NXP USA Inc. MC9S12P128.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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2+14.24 EUR
10+11.18 EUR
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NX3L1T5157GM,132 NX3L1T5157GM,132 NXP USA Inc. NX3L1T3157.pdf Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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74HC258DB,112 74HC258DB,112 NXP USA Inc. 74HC258.pdf Description: IC MULTIPLEXER 4 X 2:1 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MK20DN32VFM5 MK20DN32VFM5 NXP USA Inc. K20P32M50SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
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81+6.08 EUR
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BGE885,112 BGE885,112 NXP USA Inc. BGE885_Rev_Dec2010.pdf Description: IC VIDEO PUSH-PULL CTRLR SFM9
Packaging: Bulk
Package / Case: SOT-115D
Mounting Type: Chassis Mount
Supplier Device Package: SFM9
Part Status: Obsolete
Produkt ist nicht verfügbar
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BUK764R3-40B,118 BUK764R3-40B,118 NXP USA Inc. BUK764R3-40B.pdf Description: MOSFET N-CH 40V 75A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 254W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 69 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4824 pF @ 25 V
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BUK763R8-80E118 BUK763R8-80E118 NXP USA Inc. BUK763R8-80E.pdf Description: NOW NEXPERIA BUK763R8-80E - POWE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BUK7Y98-80E,115 BUK7Y98-80E,115 NXP USA Inc. BUK7Y98-80E.pdf Description: BUK7Y98-80E - N-CHANNEL 80V, 98
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MWPR1024IZVHT NXP USA Inc. MWPR1124ZVHT.pdf Description: KW40 512 WCT 48LQFN
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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MWPR1124ZVHT NXP USA Inc. MWPR1124ZVHT.pdf Description: KW40 512 WCT 48LQFN
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6X4AVM08ABR MCIMX6X4AVM08ABR NXP USA Inc. Description: I.MX 6 SERIES 32-BIT MPU ARM CO
Packaging: Tape & Reel (TR)
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Produkt ist nicht verfügbar
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HEC4040BT-Q100118 NXP USA Inc. Description: J-K FLIP-FLOP, 2-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX84J-C62115 BZX84J-C62115 NXP USA Inc. BZX84J_SER.pdf Description: NOW NEXPERIA BZX84J-C5V1 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX84J-C5V1115 BZX84J-C5V1115 NXP USA Inc. BZX84J_SER.pdf Description: NOW NEXPERIA BZX84J-C5V1 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NT3H2211W0FTTJ NT3H2211W0FTTJ NXP USA Inc. NT3H2111_2211.pdf Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 5446 Stücke:
Lieferzeit 10-14 Tag (e)
9+2.09 EUR
10+1.81 EUR
25+1.70 EUR
100+1.56 EUR
250+1.48 EUR
500+1.42 EUR
1000+1.36 EUR
Mindestbestellmenge: 9
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MC33XS2410EL NXP USA Inc. MC33XS2410.pdf Description: HIGH-SIDE SWITCH 60V HTSSOP28
Packaging: Tube
Features: Load Discharge, Slew Rate Controlled
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 100mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 60V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.6A
Ratio - Input:Output: 1:4
Supplier Device Package: 28-HTSSOP
Fault Protection: Current Limiting (Fixed), Over Load, Over Temperature, Over Voltage, Short Circuit, UVLO
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PHT11N06LT,135
PHT11N06LT,135
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 4.9A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.9A (Ta)
Rds On (Max) @ Id, Vgs: 40mOhm @ 5A, 5V
Power Dissipation (Max): 1.8W (Ta), 8.3W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): ±13V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 1400 pF @ 25 V
Produkt ist nicht verfügbar
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CBTU4411EE,518 PHGLS24915-1.pdf?t.download=true&u=5oefqw
CBTU4411EE,518
Hersteller: NXP USA Inc.
Description: CBTU4411 - 11-BIT DDR2 SDRAM MUX
Packaging: Bulk
Package / Case: 72-LFBGA
Mounting Type: Surface Mount
Circuit: 11 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 72-LFBGA (7x7)
Part Status: Active
auf Bestellung 5990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
268+1.76 EUR
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CBTU4411EE518 CBTU4411.pdf
Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER CBT/FST/QS/5C/B
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NAFE11388B40BSK
NAFE11388B40BSK
Hersteller: NXP USA Inc.
Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Part Status: Active
Number of Channels: 8
Power (Watts): 125 mW
Produkt ist nicht verfügbar
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NAFE11388B40BSK
NAFE11388B40BSK
Hersteller: NXP USA Inc.
Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Part Status: Active
Number of Channels: 8
Power (Watts): 125 mW
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Lieferzeit 10-14 Tag (e)
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1+33.30 EUR
10+26.57 EUR
25+24.89 EUR
100+23.04 EUR
250+22.16 EUR
500+21.63 EUR
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NAFE71388B40BSK
NAFE71388B40BSK
Hersteller: NXP USA Inc.
Description: IC 8-IN HIGH-SPEED 25V AFE
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.63V
Voltage - Supply, Digital: 2.97V ~ 3.63V
Supplier Device Package: 64-HVQFN (9x9)
Part Status: Active
Number of Channels: 8
Power (Watts): 135 mW
auf Bestellung 1300 Stücke:
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1300+21.32 EUR
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NAFE71388B40BSK
NAFE71388B40BSK
Hersteller: NXP USA Inc.
Description: IC 8-IN HIGH-SPEED 25V AFE
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.63V
Voltage - Supply, Digital: 2.97V ~ 3.63V
Supplier Device Package: 64-HVQFN (9x9)
Part Status: Active
Number of Channels: 8
Power (Watts): 135 mW
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+38.86 EUR
10+28.59 EUR
25+25.96 EUR
100+23.02 EUR
250+21.59 EUR
500+21.32 EUR
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MPC8343ECZQAGDB FSCLS06083-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: POWERQUICC II PRO PROCESSOR
Packaging: Bulk
Part Status: Active
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Anzahl Preis
6+94.45 EUR
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MPC8247VRTIEA MPC8272EC.pdf
MPC8247VRTIEA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Active
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Anzahl Preis
1+129.36 EUR
10+108.81 EUR
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MPC8250AZQIHBC MPC8250.pdf
MPC8250AZQIHBC
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8255ACZUMHBB MPC8260A.pdf
MPC8255ACZUMHBB
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF7754HV/N205WK
Hersteller: NXP USA Inc.
Description: DSP AUDIO MULTI-TUNER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SAF7754HV/N205WY
Hersteller: NXP USA Inc.
Description: DSP AUDIO MULTI-TUNER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74HCT280DB112 74HC_HCT280.pdf
74HCT280DB112
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HCT280DB PARITY G
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Number of Circuits: 9
Mounting Type: Surface Mount
Logic Type: Parity Generator/Checker
Operating Temperature: -40°C ~ 125°C
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 14-SSOP
Part Status: Active
Voltage - Supply: 4.5 V ~ 5.5 V
auf Bestellung 1092 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1092+0.60 EUR
Mindestbestellmenge: 1092
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S9S08DN48F2MLH
S9S08DN48F2MLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
Produkt ist nicht verfügbar
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MCZ33661EFR2
MCZ33661EFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8007BHL/C3,118 TDA8007BHL_Rev8.pdf
TDA8007BHL/C3,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: Parallel
Voltage - Supply: 2.7V ~ 6V
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8007BHL/C3,118 TDA8007BHL_Rev8.pdf
TDA8007BHL/C3,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: Parallel
Voltage - Supply: 2.7V ~ 6V
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08QE8CWL description MC9S08QE8.pdf
MC9S08QE8CWL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 22
auf Bestellung 8112 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
223+3.70 EUR
Mindestbestellmenge: 223
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MC9S08QE8CWL description MC9S08QE8.pdf
MC9S08QE8CWL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 22
Produkt ist nicht verfügbar
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SPC5668EF1AVMG
SPC5668EF1AVMG
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 155
Produkt ist nicht verfügbar
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74ALVCH162244DL118 74ALVCH162244.pdf
74ALVCH162244DL118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 1608 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
535+0.92 EUR
Mindestbestellmenge: 535
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TFF1018HN/N1,115 TFF1018HN.pdf
TFF1018HN/N1,115
Hersteller: NXP USA Inc.
Description: IC MIXER 10.7-12.75GHZ 16DHVQFN
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 10.7GHz ~ 12.75GHz
RF Type: Ku-Band
Voltage - Supply: 4.5V ~ 5.5V
Gain: 45dB
Current - Supply: 52mA
Secondary Attributes: Down Converter
Noise Figure: 7dB
Number of Mixers: 1
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Obsolete
auf Bestellung 5429 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
952+0.54 EUR
Mindestbestellmenge: 952
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TFF1025HN/N1F
Hersteller: NXP USA Inc.
Description: IC CLOCK
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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IP3338CX24/LF/P135 IP3338CX24.pdf
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
Part Status: Active
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
656+0.76 EUR
Mindestbestellmenge: 656
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IP3348CX20,135 IP3348CX5%2C10%2C15%2C20.pdf
IP3348CX20,135
Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Current: 20 mA
Produkt ist nicht verfügbar
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74AVC16245DGG-Q100118 74AVC16245_Q100.pdf
74AVC16245DGG-Q100118
Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER, AVC SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
329+1.60 EUR
Mindestbestellmenge: 329
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MPC8271CVRTIEA MPC8272EC.pdf
MPC8271CVRTIEA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+185.15 EUR
10+155.80 EUR
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S12ZVML-MINIBRD S12ZVMBFS.pdf
S12ZVML-MINIBRD
Hersteller: NXP USA Inc.
Description: LOW COST S12ZVML BLDC MC REFEREN
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVM
Supplied Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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FRDM-32XSF-EVB
Hersteller: NXP USA Inc.
Description: FRDM EXP BD - 32V IND LIGHTING 5
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC17XSF500
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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KIT22XS4200EKEVB KT22XS4200UG.pdf
Hersteller: NXP USA Inc.
Description: EVALUATION KIT - MC22XS4200 DUA
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC22XS4200
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08JS8CWJ MC9S08JS16.pdf
MC9S08JS8CWJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 373 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.68 EUR
10+4.27 EUR
38+3.79 EUR
114+3.51 EUR
266+3.35 EUR
Mindestbestellmenge: 4
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S9S08SG8E2CTJ MC9S08SG8.pdf
S9S08SG8E2CTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T2080NSE8PTB557
Hersteller: NXP USA Inc.
Description: QORIQ, 64B POWER ARCH, 8X 1.5GHZ
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DN16ACLC MC9S08DN60.pdf
MC9S08DN16ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DN16MLF MC9S08DN60.pdf
MC9S08DN16MLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC54102J256UK49019 PHGL-S-A0008964602-1.pdf?t.download=true&u=5oefqw
LPC54102J256UK49019
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
Produkt ist nicht verfügbar
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PEMI2QFN/LT,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/LT,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3806+0.14 EUR
Mindestbestellmenge: 3806
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MC9S12XHZ256CAG MC9S12XHZ512.pdf
MC9S12XHZ256CAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 117
Produkt ist nicht verfügbar
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SPC5746CSK1MKU6,557
Hersteller: NXP USA Inc.
Description: MPC574XP MICROCONTROLLER POWER A
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
Produkt ist nicht verfügbar
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74HCT153N,652 74HC_HCT153.pdf
74HCT153N,652
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC68302CRC20C157-NXP MOTOS07936-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: INTEGRATED MULTIPROTOCOL MICROPR
Packaging: Bulk
Part Status: Active
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+277.02 EUR
Mindestbestellmenge: 2
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74LVT74D,112 74LVT74.pdf
74LVT74D,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 1 mA
Current - Output High, Low: 20mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 345 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1
auf Bestellung 4235 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
833+0.59 EUR
Mindestbestellmenge: 833
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MC06XSD200FK
MC06XSD200FK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:2 23PQFN
Features: Internal PWM, Slew Rate Controlled
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 6mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 9A
Ratio - Input:Output: 1:2
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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S9S12P32J0MLH MC9S12P128.pdf
S9S12P32J0MLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.24 EUR
10+11.18 EUR
80+9.26 EUR
Mindestbestellmenge: 2
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NX3L1T5157GM,132 NX3L1T3157.pdf
NX3L1T5157GM,132
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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74HC258DB,112 74HC258.pdf
74HC258DB,112
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MK20DN32VFM5 K20P32M50SF0.pdf
MK20DN32VFM5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
auf Bestellung 384 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
81+6.08 EUR
Mindestbestellmenge: 81
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BGE885,112 BGE885_Rev_Dec2010.pdf
BGE885,112
Hersteller: NXP USA Inc.
Description: IC VIDEO PUSH-PULL CTRLR SFM9
Packaging: Bulk
Package / Case: SOT-115D
Mounting Type: Chassis Mount
Supplier Device Package: SFM9
Part Status: Obsolete
Produkt ist nicht verfügbar
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BUK764R3-40B,118 BUK764R3-40B.pdf
BUK764R3-40B,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 75A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 254W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 69 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4824 pF @ 25 V
auf Bestellung 7615 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
310+1.59 EUR
Mindestbestellmenge: 310
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BUK763R8-80E118 BUK763R8-80E.pdf
BUK763R8-80E118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK763R8-80E - POWE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BUK7Y98-80E,115 BUK7Y98-80E.pdf
BUK7Y98-80E,115
Hersteller: NXP USA Inc.
Description: BUK7Y98-80E - N-CHANNEL 80V, 98
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MWPR1024IZVHT MWPR1124ZVHT.pdf
Hersteller: NXP USA Inc.
Description: KW40 512 WCT 48LQFN
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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MWPR1124ZVHT MWPR1124ZVHT.pdf
Hersteller: NXP USA Inc.
Description: KW40 512 WCT 48LQFN
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6X4AVM08ABR
MCIMX6X4AVM08ABR
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32-BIT MPU ARM CO
Packaging: Tape & Reel (TR)
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Produkt ist nicht verfügbar
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HEC4040BT-Q100118
Hersteller: NXP USA Inc.
Description: J-K FLIP-FLOP, 2-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX84J-C62115 BZX84J_SER.pdf
BZX84J-C62115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84J-C5V1 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX84J-C5V1115 BZX84J_SER.pdf
BZX84J-C5V1115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84J-C5V1 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NT3H2211W0FTTJ NT3H2111_2211.pdf
NT3H2211W0FTTJ
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 5446 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.09 EUR
10+1.81 EUR
25+1.70 EUR
100+1.56 EUR
250+1.48 EUR
500+1.42 EUR
1000+1.36 EUR
Mindestbestellmenge: 9
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MC33XS2410EL MC33XS2410.pdf
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH 60V HTSSOP28
Packaging: Tube
Features: Load Discharge, Slew Rate Controlled
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 100mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 60V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.6A
Ratio - Input:Output: 1:4
Supplier Device Package: 28-HTSSOP
Fault Protection: Current Limiting (Fixed), Over Load, Over Temperature, Over Voltage, Short Circuit, UVLO
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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