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TDA3683J/N2S,112 TDA3683J/N2S,112 NXP USA Inc. TDA3683.pdf Description: IC REG MULTIPLE VOLTAGE DBS23P
Packaging: Tube
Package / Case: 23-SIP Formed Leads
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Applications: Ignition Buffer, Regulator
Current - Supply: 300µA
Supplier Device Package: DBS23P
Produkt ist nicht verfügbar
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S32K322EHT0MPBST S32K322EHT0MPBST NXP USA Inc. S32K3xx.pdf Description: S32K322 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 166 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.48 EUR
10+17.17 EUR
25+16.35 EUR
100+15.99 EUR
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74AUP1T1326GT115 NXP USA Inc. 74AUP1T1326.pdf Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 8-XSON (1.95x1)
auf Bestellung 4700 Stücke:
Lieferzeit 10-14 Tag (e)
1664+0.32 EUR
Mindestbestellmenge: 1664
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74LVC3G06GT115 NXP USA Inc. 74LVC3G06.pdf Description: NOW NEXPERIA 74LVC3G06GT INVERTE
Packaging: Bulk
Produkt ist nicht verfügbar
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BUK7E3R1-40E,127-NXP NXP USA Inc. Description: PFET, 100A I(D), 40V, 0.0031OHM,
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 234W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 79 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6200 pF @ 25 V
Produkt ist nicht verfügbar
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ON5233,118 ON5233,118 NXP USA Inc. Description: RF MOSFET SOT428 DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Supplier Device Package: DPAK
Produkt ist nicht verfügbar
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P1010NSN5HFB P1010NSN5HFB NXP USA Inc. QP1010FS.pdf Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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BZX585-C36115 NXP USA Inc. BZX585_SERIES.pdf Description: NOW NEXPERIA BZX585-C36 ZENER DI
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOD-523
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Produkt ist nicht verfügbar
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74ALVCH16843DGG653 NXP USA Inc. 74ALVCH16843.pdf Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
423+1.25 EUR
Mindestbestellmenge: 423
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74ALVCH16843DGG518 NXP USA Inc. 74ALVCH16843.pdf Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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MC908JK3EMDWE MC908JK3EMDWE NXP USA Inc. MC68HC908Jx(1,3).pdf Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDF8541JV/N3ZU TDF8541JV/N3ZU NXP USA Inc. TDF8541.PDF Description: TDF8541JV
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Supplier Device Package: DBS27P
Mounting Type: Through Hole
Produkt ist nicht verfügbar
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TJA1103AHN/0Z TJA1103AHN/0Z NXP USA Inc. TJA1103FS.pdf Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
4000+1.59 EUR
Mindestbestellmenge: 4000
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TJA1103AHN/0Z TJA1103AHN/0Z NXP USA Inc. TJA1103FS.pdf Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5698 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.68 EUR
10+3.5 EUR
25+3.21 EUR
100+2.89 EUR
250+2.73 EUR
500+2.64 EUR
1000+2.57 EUR
Mindestbestellmenge: 4
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OM13053UL NXP USA Inc. Description: LPC812-LPCXPRESSO BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC812
Platform: LPCXpresso™
Produkt ist nicht verfügbar
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NCK2910AHN/10203Y NCK2910AHN/10203Y NXP USA Inc. Description: NCK2910AHN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
6000+4.56 EUR
Mindestbestellmenge: 6000
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NCK2910AHN/10203Y NCK2910AHN/10203Y NXP USA Inc. Description: NCK2910AHN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.13 EUR
10+6.46 EUR
25+6.32 EUR
50+6.29 EUR
100+5.64 EUR
250+5.62 EUR
500+5.41 EUR
1000+5.15 EUR
Mindestbestellmenge: 3
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FRDM-XS2410EVB NXP USA Inc. UM11313.pdf Description: FRDM EXP BOARD XS2410
Packaging: Bulk
Function: Voltage Reference
Type: Power Management
Utilized IC / Part: XS2410EVB
Supplied Contents: Board(s)
auf Bestellung 22 Stücke:
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1+162.52 EUR
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MC34PF8100EREPR2 MC34PF8100EREPR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MC68332GCAG16 MC68332GCAG16 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332GVAG25 MC68332GVAG25 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332AMEH16 MC68332AMEH16 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332AVEH20 MC68332AVEH20 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332GVEH25 MC68332GVEH25 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33797BPEWR2 MC33797BPEWR2 NXP USA Inc. MC33797.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
Produkt ist nicht verfügbar
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MC33797BPEWR2 MC33797BPEWR2 NXP USA Inc. MC33797.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
auf Bestellung 942 Stücke:
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1+17.72 EUR
10+13.9 EUR
25+12.95 EUR
100+11.9 EUR
250+11.4 EUR
500+11.1 EUR
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MC33797BPEW MC33797BPEW NXP USA Inc. MC33797.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
auf Bestellung 27 Stücke:
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1+17.92 EUR
10+16.48 EUR
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PN7642EV/C100Y NXP USA Inc. Description: SINGLE-CHIP SOLUTION WITH HIGH-P
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I²C, SPI, UART, USB
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.5V
Standards: FeliCa, ISO 14443, ISO 14443-A, ISO 15693-B, ISO 18092
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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PN7642EV/C100K NXP USA Inc. Description: SINGLE-CHIP SOLUTION WITH HIGH-P
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I²C, SPI, UART, USB
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.5V
Standards: FeliCa, ISO 14443, ISO 14443-A, ISO 15693-B, ISO 18092
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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OM27642DB NXP USA Inc. Description: DEVELOPMENT BOARD
Packaging: Bulk
For Use With/Related Products: PN7642
Type: Near Field Communication (NFC)
Supplied Contents: Board(s), Accessories
Contents: Board(s), Accessories
Utilized IC / Part: PN7642
auf Bestellung 3 Stücke:
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1+464.22 EUR
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OM27642EVK NXP USA Inc. Description: DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: PN7642
Type: Near Field Communication (NFC)
Supplied Contents: Board(s), Cable(s)
Contents: Board(s), Cable(s)
Utilized IC / Part: PN7642
auf Bestellung 3 Stücke:
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1+545.69 EUR
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ISI-QMC-DB02 NXP USA Inc. QUADMTRCNTRLGEN2FS.pdf Description: INTERFACE DEVELOPMENT TOOLS ISI-
Packaging: Bulk
Function: Expansion Board
Type: Interface
Contents: Board(s)
Utilized IC / Part: NAFE13388, PCT2075, PN7462, SE05x, TJA146x
Produkt ist nicht verfügbar
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XC7SH86GV,125 XC7SH86GV,125 NXP USA Inc. NEXP-S-A0002881988-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA XC7SH86GV - XOR GAT
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
auf Bestellung 147000 Stücke:
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1679+0.32 EUR
Mindestbestellmenge: 1679
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FRDMDUAL33664EVB FRDMDUAL33664EVB NXP USA Inc. get-started-with-the-frdmdual33664evb:GS-FRDMDUAL33664EVB Description: EVAL BOARD FOR MC33664
Packaging: Bulk
Function: Transceiver
Type: Interface
Utilized IC / Part: MC33664
Supplied Contents: Board(s)
Primary Attributes: Isolated
Embedded: Yes, MCU
Contents: Board(s)
Secondary Attributes: On-Board LEDs
auf Bestellung 1 Stücke:
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1+681.47 EUR
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MC32PF4210A3ESR2 MC32PF4210A3ESR2 NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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S9S08DV16F2MLF S9S08DV16F2MLF NXP USA Inc. Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE16F512VLL16 MKE16F512VLL16 NXP USA Inc. KE1xFP100M168SF0.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.53 EUR
10+12.9 EUR
25+11.99 EUR
90+11.05 EUR
270+10.48 EUR
450+10.26 EUR
Mindestbestellmenge: 2
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MCIMX6Y1CVK05AA MCIMX6Y1CVK05AA NXP USA Inc. Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Produkt ist nicht verfügbar
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MIMXRT595SFAWCR MIMXRT595SFAWCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
6000+23.63 EUR
Mindestbestellmenge: 6000
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SPC5744PK1AMMM9 SPC5744PK1AMMM9 NXP USA Inc. MPC5744P.pdf Description: IC MCU 32B 2.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5746CHK0AMMH6 SPC5746CHK0AMMH6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5746CHK0AMMJ6 SPC5746CHK0AMMJ6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T1022NSE7WQB NXP USA Inc. T1FAMILYFS.pdf Description: IC MPU QORIQ T1 1.5GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T4161NSN7PQB NXP USA Inc. T4240T4160FS.pdf Description: IC MPU QORIQ T4 1.5GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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MCIMX6G1AVM07AA MCIMX6G1AVM07AA NXP USA Inc. MCIMX6GxAzzzzzA.pdf Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MKV31F512VLL12P MKV31F512VLL12P NXP USA Inc. KV30P64M100SFA.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1043AXN7QQA LS1043AXN7QQA NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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MRF377HR3 NXP USA Inc. MRF377H.pdf Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Tape & Reel (TR)
Package / Case: NI-860C3
Current Rating (Amps): 17A
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 45W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 2 A
Produkt ist nicht verfügbar
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MCIMX6G1AVM07AA557 NXP USA Inc. PHGL-S-A0003204166-1.pdf?t.download=true&u=5oefqw Description: CORTEX A7 RISC MPU 32 BIT
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6Y1DVM05AA557 NXP USA Inc. NEXP-S-A0003108739-1.pdf?t.download=true&u=5oefqw Description: I.MX 32 BIT MPU, ARM CORTEX A7 C
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6G2DVK05AA557-NXP MCIMX6G2DVK05AA557-NXP NXP USA Inc. FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw Description: I.MX 32 BIT MPU, ARM CORTEX A7 C
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6G0DVM05AA557 NXP USA Inc. PHGL-S-A0003204171-1.pdf?t.download=true&u=5oefqw Description: CORTEX A7 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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UBA2024T/N1,518 UBA2024T/N1,518 NXP USA Inc. UBA2024.pdf Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
Produkt ist nicht verfügbar
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UBA2024T/N1,518 UBA2024T/N1,518 NXP USA Inc. UBA2024.pdf Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
auf Bestellung 4413 Stücke:
Lieferzeit 10-14 Tag (e)
376+1.34 EUR
Mindestbestellmenge: 376
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UBA2024AP/N1,112 UBA2024AP/N1,112 NXP USA Inc. UBA2024.pdf Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.35A
Current - Supply: 5 mA
Produkt ist nicht verfügbar
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UBA2024AT/N1,518 UBA2024AT/N1,518 NXP USA Inc. UBA2024.pdf Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 1.2A
Current - Supply: 5 mA
Produkt ist nicht verfügbar
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UBA2211CP/N1,112 UBA2211CP/N1,112 NXP USA Inc. UBA2211.pdf Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 10.7V ~ 13.8V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.85A
Produkt ist nicht verfügbar
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MCIMX6X4EVM10AB MCIMX6X4EVM10AB NXP USA Inc. IMX6SXIEC.pdf Description: IC MPU I.MX6SX 1GHZ 529MAPBGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
auf Bestellung 667 Stücke:
Lieferzeit 10-14 Tag (e)
1+58.19 EUR
10+47.4 EUR
84+42.07 EUR
168+40.91 EUR
252+40.33 EUR
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MIMXRT555SFAWCR MIMXRT555SFAWCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT555SFFOCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 249FOWLP
Packaging: Tape & Reel (TR)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+29.15 EUR
Mindestbestellmenge: 2000
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TDA3683J/N2S,112 TDA3683.pdf
TDA3683J/N2S,112
Hersteller: NXP USA Inc.
Description: IC REG MULTIPLE VOLTAGE DBS23P
Packaging: Tube
Package / Case: 23-SIP Formed Leads
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Applications: Ignition Buffer, Regulator
Current - Supply: 300µA
Supplier Device Package: DBS23P
Produkt ist nicht verfügbar
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S32K322EHT0MPBST S32K3xx.pdf
S32K322EHT0MPBST
Hersteller: NXP USA Inc.
Description: S32K322 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 166 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.48 EUR
10+17.17 EUR
25+16.35 EUR
100+15.99 EUR
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74AUP1T1326GT115 74AUP1T1326.pdf
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 8-XSON (1.95x1)
auf Bestellung 4700 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1664+0.32 EUR
Mindestbestellmenge: 1664
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74LVC3G06GT115 74LVC3G06.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC3G06GT INVERTE
Packaging: Bulk
Produkt ist nicht verfügbar
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BUK7E3R1-40E,127-NXP
Hersteller: NXP USA Inc.
Description: PFET, 100A I(D), 40V, 0.0031OHM,
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 234W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 79 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6200 pF @ 25 V
Produkt ist nicht verfügbar
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ON5233,118
ON5233,118
Hersteller: NXP USA Inc.
Description: RF MOSFET SOT428 DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Supplier Device Package: DPAK
Produkt ist nicht verfügbar
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P1010NSN5HFB QP1010FS.pdf
P1010NSN5HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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BZX585-C36115 BZX585_SERIES.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX585-C36 ZENER DI
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOD-523
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Produkt ist nicht verfügbar
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74ALVCH16843DGG653 74ALVCH16843.pdf
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
423+1.25 EUR
Mindestbestellmenge: 423
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74ALVCH16843DGG518 74ALVCH16843.pdf
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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MC908JK3EMDWE MC68HC908Jx(1,3).pdf
MC908JK3EMDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDF8541JV/N3ZU TDF8541.PDF
TDF8541JV/N3ZU
Hersteller: NXP USA Inc.
Description: TDF8541JV
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Supplier Device Package: DBS27P
Mounting Type: Through Hole
Produkt ist nicht verfügbar
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TJA1103AHN/0Z TJA1103FS.pdf
TJA1103AHN/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+1.59 EUR
Mindestbestellmenge: 4000
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TJA1103AHN/0Z TJA1103FS.pdf
TJA1103AHN/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5698 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.68 EUR
10+3.5 EUR
25+3.21 EUR
100+2.89 EUR
250+2.73 EUR
500+2.64 EUR
1000+2.57 EUR
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OM13053UL
Hersteller: NXP USA Inc.
Description: LPC812-LPCXPRESSO BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC812
Platform: LPCXpresso™
Produkt ist nicht verfügbar
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NCK2910AHN/10203Y
NCK2910AHN/10203Y
Hersteller: NXP USA Inc.
Description: NCK2910AHN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+4.56 EUR
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NCK2910AHN/10203Y
NCK2910AHN/10203Y
Hersteller: NXP USA Inc.
Description: NCK2910AHN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.13 EUR
10+6.46 EUR
25+6.32 EUR
50+6.29 EUR
100+5.64 EUR
250+5.62 EUR
500+5.41 EUR
1000+5.15 EUR
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FRDM-XS2410EVB UM11313.pdf
Hersteller: NXP USA Inc.
Description: FRDM EXP BOARD XS2410
Packaging: Bulk
Function: Voltage Reference
Type: Power Management
Utilized IC / Part: XS2410EVB
Supplied Contents: Board(s)
auf Bestellung 22 Stücke:
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1+162.52 EUR
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MC34PF8100EREPR2 PF8100_PF8200.pdf
MC34PF8100EREPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MC68332GCAG16 MC68332TS.pdf
MC68332GCAG16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332GVAG25 MC68332TS.pdf
MC68332GVAG25
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332AMEH16 MC68332TS.pdf
MC68332AMEH16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332AVEH20 MC68332TS.pdf
MC68332AVEH20
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332GVEH25 MC68332TS.pdf
MC68332GVEH25
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33797BPEWR2 MC33797.pdf
MC33797BPEWR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
Produkt ist nicht verfügbar
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MC33797BPEWR2 MC33797.pdf
MC33797BPEWR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
auf Bestellung 942 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+17.72 EUR
10+13.9 EUR
25+12.95 EUR
100+11.9 EUR
250+11.4 EUR
500+11.1 EUR
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MC33797BPEW MC33797.pdf
MC33797BPEW
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
auf Bestellung 27 Stücke:
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Anzahl Preis
1+17.92 EUR
10+16.48 EUR
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PN7642EV/C100Y
Hersteller: NXP USA Inc.
Description: SINGLE-CHIP SOLUTION WITH HIGH-P
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I²C, SPI, UART, USB
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.5V
Standards: FeliCa, ISO 14443, ISO 14443-A, ISO 15693-B, ISO 18092
Supplier Device Package: 64-VFBGA (4.5x4.5)
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PN7642EV/C100K
Hersteller: NXP USA Inc.
Description: SINGLE-CHIP SOLUTION WITH HIGH-P
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I²C, SPI, UART, USB
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.5V
Standards: FeliCa, ISO 14443, ISO 14443-A, ISO 15693-B, ISO 18092
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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OM27642DB
Hersteller: NXP USA Inc.
Description: DEVELOPMENT BOARD
Packaging: Bulk
For Use With/Related Products: PN7642
Type: Near Field Communication (NFC)
Supplied Contents: Board(s), Accessories
Contents: Board(s), Accessories
Utilized IC / Part: PN7642
auf Bestellung 3 Stücke:
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Anzahl Preis
1+464.22 EUR
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OM27642EVK
Hersteller: NXP USA Inc.
Description: DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: PN7642
Type: Near Field Communication (NFC)
Supplied Contents: Board(s), Cable(s)
Contents: Board(s), Cable(s)
Utilized IC / Part: PN7642
auf Bestellung 3 Stücke:
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Anzahl Preis
1+545.69 EUR
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ISI-QMC-DB02 QUADMTRCNTRLGEN2FS.pdf
Hersteller: NXP USA Inc.
Description: INTERFACE DEVELOPMENT TOOLS ISI-
Packaging: Bulk
Function: Expansion Board
Type: Interface
Contents: Board(s)
Utilized IC / Part: NAFE13388, PCT2075, PN7462, SE05x, TJA146x
Produkt ist nicht verfügbar
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XC7SH86GV,125 NEXP-S-A0002881988-1.pdf?t.download=true&u=5oefqw
XC7SH86GV,125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA XC7SH86GV - XOR GAT
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
auf Bestellung 147000 Stücke:
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Anzahl Preis
1679+0.32 EUR
Mindestbestellmenge: 1679
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FRDMDUAL33664EVB get-started-with-the-frdmdual33664evb:GS-FRDMDUAL33664EVB
FRDMDUAL33664EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33664
Packaging: Bulk
Function: Transceiver
Type: Interface
Utilized IC / Part: MC33664
Supplied Contents: Board(s)
Primary Attributes: Isolated
Embedded: Yes, MCU
Contents: Board(s)
Secondary Attributes: On-Board LEDs
auf Bestellung 1 Stücke:
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Anzahl Preis
1+681.47 EUR
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MC32PF4210A3ESR2 PF4210.pdf
MC32PF4210A3ESR2
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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S9S08DV16F2MLF
S9S08DV16F2MLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE16F512VLL16 KE1xFP100M168SF0.pdf
MKE16F512VLL16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.53 EUR
10+12.9 EUR
25+11.99 EUR
90+11.05 EUR
270+10.48 EUR
450+10.26 EUR
Mindestbestellmenge: 2
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MCIMX6Y1CVK05AA
MCIMX6Y1CVK05AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Produkt ist nicht verfügbar
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MIMXRT595SFAWCR IMXRT500EC.pdf
MIMXRT595SFAWCR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+23.63 EUR
Mindestbestellmenge: 6000
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SPC5744PK1AMMM9 MPC5744P.pdf
SPC5744PK1AMMM9
Hersteller: NXP USA Inc.
Description: IC MCU 32B 2.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5746CHK0AMMH6 MPC5746C.pdf
SPC5746CHK0AMMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5746CHK0AMMJ6 MPC5746C.pdf
SPC5746CHK0AMMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T1022NSE7WQB T1FAMILYFS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.5GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T4161NSN7PQB T4240T4160FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T4 1.5GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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MCIMX6G1AVM07AA MCIMX6GxAzzzzzA.pdf
MCIMX6G1AVM07AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MKV31F512VLL12P KV30P64M100SFA.pdf
MKV31F512VLL12P
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1043AXN7QQA LS1043AFS.pdf
LS1043AXN7QQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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MRF377HR3 MRF377H.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Tape & Reel (TR)
Package / Case: NI-860C3
Current Rating (Amps): 17A
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 45W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 2 A
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MCIMX6G1AVM07AA557 PHGL-S-A0003204166-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: CORTEX A7 RISC MPU 32 BIT
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6Y1DVM05AA557 NEXP-S-A0003108739-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: I.MX 32 BIT MPU, ARM CORTEX A7 C
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6G2DVK05AA557-NXP FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw
MCIMX6G2DVK05AA557-NXP
Hersteller: NXP USA Inc.
Description: I.MX 32 BIT MPU, ARM CORTEX A7 C
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6G0DVM05AA557 PHGL-S-A0003204171-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: CORTEX A7 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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UBA2024T/N1,518 UBA2024.pdf
UBA2024T/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
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UBA2024T/N1,518 UBA2024.pdf
UBA2024T/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
auf Bestellung 4413 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
376+1.34 EUR
Mindestbestellmenge: 376
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UBA2024AP/N1,112 UBA2024.pdf
UBA2024AP/N1,112
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.35A
Current - Supply: 5 mA
Produkt ist nicht verfügbar
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UBA2024AT/N1,518 UBA2024.pdf
UBA2024AT/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 1.2A
Current - Supply: 5 mA
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UBA2211CP/N1,112 UBA2211.pdf
UBA2211CP/N1,112
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 10.7V ~ 13.8V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.85A
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MCIMX6X4EVM10AB IMX6SXIEC.pdf
MCIMX6X4EVM10AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 529MAPBGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
auf Bestellung 667 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+58.19 EUR
10+47.4 EUR
84+42.07 EUR
168+40.91 EUR
252+40.33 EUR
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MIMXRT555SFAWCR IMXRT500EC.pdf
MIMXRT555SFAWCR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
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MIMXRT555SFFOCR IMXRT500EC.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 249FOWLP
Packaging: Tape & Reel (TR)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+29.15 EUR
Mindestbestellmenge: 2000
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