Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34455) > Seite 500 nach 575
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TJA1028T/3V3/20/1U | NXP USA Inc. |
 Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Protocol: LIN Supplier Device Package: 8-SO Receiver Hysteresis: 200 mV Duplex: Half Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TJA1028T/5V0/20/1U | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Protocol: LIN Supplier Device Package: 8-SO Receiver Hysteresis: 200 mV Duplex: Half Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MWCT1123FVLL | NXP USA Inc. |
Description: KV4X WCT 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Applications: Microcontroller, MCU Supplier Device Package: 100-LQFP (14x14) Part Status: Active |
Produkt ist nicht verfügbar |
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MWCT1023IFVLL | NXP USA Inc. |
Description: KV4X WCT 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Applications: Microcontroller, MCU Supplier Device Package: 100-LQFP (14x14) Part Status: Active |
Produkt ist nicht verfügbar |
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74AHC08D-Q100118 | NXP USA Inc. |
Description: IC GATE AND Packaging: Bulk Part Status: Active |
auf Bestellung 46687 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHC08BQ-Q100115 | NXP USA Inc. |
Description: AND GATE, AHC/VHC/H/U/V SERIES Packaging: Bulk Part Status: Active |
auf Bestellung 2520 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHC08BQ115 | NXP USA Inc. |
Description: NOW NEXPERIA 74AHC08BQ - AND GAT Packaging: Bulk Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 5.5V Current - Output High, Low: 8mA, 8mA Number of Inputs: 2 Input Logic Level - High: 1.5V ~ 3.85V Input Logic Level - Low: 0.5V ~ 1.65V Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF Part Status: Active Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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74AHC08PW-Q100118 | NXP USA Inc. |
Description: AND GATE, AHC/VHC/H/U/V SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74AHC08BQ/C4115 | NXP USA Inc. |
Description: AND GATE, AHC/VHC/H/U/V SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74AHC08PW/S400118 | NXP USA Inc. |
Description: AND GATE, AHC/VHC/H/U/V SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74AHC08PW653 | NXP USA Inc. |
Description: AND GATE, AHC/VHC/H/U/V SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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KITPF5200FRDMEVM | NXP USA Inc. |
Description: PF5200 DEV TOOL Packaging: Box Function: Automotive Type: Power Management Utilized IC / Part: KL25Z, PF5200 Supplied Contents: Board(s), Cable(s), Accessories Primary Attributes: 2-Channel (Dual) Embedded: Yes, MCU Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC561MZP56 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Part Status: Not For New Designs Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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A7101CGTK2/T0B040X | NXP USA Inc. |
Description: SECURE AUTHENTICATION MICROCONTR Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Interface: I²C Operating Temperature: -25°C ~ 90°C (TA) Voltage - Supply: 1.62V ~ 3.6V Controller Series: A710x Program Memory Type: EEPROM (20kB) Applications: Authentication Core Processor: MX51 Supplier Device Package: 8-HVSON (4x4) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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A7101CGTK2/T0B0405 | NXP USA Inc. |
Description: SECURE AUTHENTICATION MICROCONTR Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Interface: I²C Operating Temperature: -25°C ~ 90°C (TA) Voltage - Supply: 1.62V ~ 3.6V Controller Series: A710x Program Memory Type: EEPROM (20kB) Applications: Authentication Core Processor: MX51 Supplier Device Package: 8-HVSON (4x4) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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A7101CGT1/T0B0408, | NXP USA Inc. |
Description: SECURE AUTHENTICATION MICROCONTR Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Interface: I²C Operating Temperature: -25°C ~ 90°C (TA) Voltage - Supply: 1.62V ~ 3.6V Controller Series: A710x Program Memory Type: EEPROM (20kB) Applications: Authentication Core Processor: MX51 Supplier Device Package: 8-SO Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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A7101CGHN1/T0B0406 | NXP USA Inc. |
Description: SECURE AUTHENTICATION MICROCONTR Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: I²C Operating Temperature: -25°C ~ 90°C (TA) Voltage - Supply: 1.62V ~ 3.6V Controller Series: A710x Program Memory Type: EEPROM (20kB) Applications: Authentication Core Processor: MX51 Supplier Device Package: 32-HVQFN (5x5) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| A7101CLTK2/T0BC27J | NXP USA Inc. |
Description: HIGH PERFORMANCE AUTHENTICATOR I Packaging: Bulk Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Interface: I²C, Smartcard Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 3.6V Controller Series: A71CL Applications: Authentication Core Processor: i.MX6UL Supplier Device Package: 8-HVSON (4x4) Part Status: Last Time Buy DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| A7101CLTK2/T0BC2WJ | NXP USA Inc. |
Description: PLUG TRUST SECURE ELEMENT Packaging: Bulk Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Interface: I2C, SmartCard Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 3.6V Controller Series: A71CL Applications: Authentication Core Processor: i.MX6UL Supplier Device Package: 8-HVSON (4x4) Part Status: Last Time Buy DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC34PF1510A2EPR2 | NXP USA Inc. |
Description: PF1510 Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
Produkt ist nicht verfügbar |
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| SC16C654BIA529 | NXP USA Inc. |
Description: QUAD UART WITH 64-BYTE FIFOS AND Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BZX79-B24133 | NXP USA Inc. |
Description: NOW NEXPERIA BZX79-B24 - ZENER D Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MCIMX27LVOP4A | NXP USA Inc. |
Description: IC MPU I.MX27 400MHZ 404LFBGA Packaging: Tray Package / Case: 404-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -20°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V Supplier Device Package: 404-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SAHARAH2 RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
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| TWR-SB0800-36EVB | NXP USA Inc. |
Description: EVALUATION BOARD - SB0800 SOLEN Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Contents: Board(s) Utilized IC / Part: MC34SB0800 Platform: Freescale Tower System Part Status: Active |
Produkt ist nicht verfügbar |
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PHPT61002PYC115 | NXP USA Inc. |
Description: POWER BIPOLAR TRANSISTOR, PNP Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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PHPT61006NY115 | NXP USA Inc. |
Description: POWER BIPOLAR TRANSISTOR NPN Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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PCA9450AAHNY | NXP USA Inc. |
Description: PMIC FOR I.MX8M MINI 845S 56HVQF Packaging: Cut Tape (CT) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: i.MX Processors Current - Supply: 23µA Supplier Device Package: 56-HVQFN (7x7) Part Status: Active |
auf Bestellung 2287 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5747CK1MMJ6R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| 88W8887-A2-CBKE/AZ | NXP USA Inc. |
Description: 1X1 11AC DUAL BAND + BT4.0 + FM Packaging: Tape & Reel (TR) Package / Case: 124-BGA, WLCSP Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Type: TxRx Only Protocol: 802.11ac, Bluetooth v4.2 Dual Mode Data Rate (Max): 433Mbps Supplier Device Package: 124-WLCSP RF Family/Standard: Bluetooth, WiFi Serial Interfaces: I2C, I2S, PCM, SDIO, UART Part Status: Active |
Produkt ist nicht verfügbar |
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| 88W8787-A1-BRDA/BZ | NXP USA Inc. |
Description: 11N 1X1 SINGLE-BAND + BT + FM + Packaging: Tape & Reel (TR) Package / Case: 120-VFBGA Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Type: TxRx Only Data Rate (Max): 150Mbps Supplier Device Package: 120-VFBGA (7x7) RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART Part Status: Active Protocol: 802.11a/g/b, Bluetooth v2.1 +EDR Modulation: 4DQPSK, 8DPSK, DSSS, GFSK, OFDM |
Produkt ist nicht verfügbar |
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| PESD5V0U1BL/315 | NXP USA Inc. |
Description: TVS DIODE 5VWM DFN1006-2 Packaging: Bulk Package / Case: SOD-882 Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: General Purpose Capacitance @ Frequency: 2.9pF @ 1MHz Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: DFN1006-2 Bidirectional Channels: 1 Voltage - Breakdown (Min): 5.5V Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
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MCIMX6L7DVN10AB | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Part Status: Active |
Produkt ist nicht verfügbar |
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MC34PF1510A4EP | NXP USA Inc. |
Description: PF1510 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
Produkt ist nicht verfügbar |
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MKW21Z512VHT4 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 48VFQFN Packaging: Tray Package / Case: 64-VFLGA Sensitivity: -100dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 3.6V Power - Output: 3.5dBm Protocol: Zigbee® Current - Receiving: 6.2mA Data Rate (Max): 1Mbps Current - Transmitting: 6mA Supplier Device Package: 64-VFLGA (7x7) Modulation: FSK, GFSK, MSK, O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I²C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9RS08KA4CPJ | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 126 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-DIP Part Status: Obsolete Number of I/O: 18 DigiKey Programmable: Not Verified |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54102J256BD64QL | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 640 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12G64BMLC | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12GN48BCLC | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PTN3356R1BSMP | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HVQFN Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 2.8V ~ 3.6V Applications: DisplayPort Supplier Device Package: 32-HVQFN (5x5) Part Status: Active |
auf Bestellung 59795 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08DZ32F2CLFR | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVMBA6F0VLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 5x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: LINbus, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 15 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| RD33775ACNTEVB | NXP USA Inc. |
Description: RD33775ACNTEVB Packaging: Bulk Function: Battery Cell Controller Type: Power Management Utilized IC / Part: MC33775A Supplied Contents: Board(s), Cable(s) Embedded: No Part Status: Active |
Produkt ist nicht verfügbar |
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UJA1076ATW/5V0/WDJ | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 4.5V ~ 28V Supplier Device Package: 32-HTSSOP Part Status: Active Grade: Automotive |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1076ATW/5V0/WDJ | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Cut Tape (CT) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 4.5V ~ 28V Supplier Device Package: 32-HTSSOP Part Status: Active Grade: Automotive |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MMA5148KWR2528 | NXP USA Inc. |
Description: PSI INERTIAL SENSOR Packaging: Bulk Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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| FXLS90322AESR2 | NXP USA Inc. |
Description: XY DUAL-AXIS MEDIUM-G INERTIAL Packaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) Part Status: Active Mounting Type: Surface Mount, Wettable Flank |
Produkt ist nicht verfügbar |
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| FXLS90322AESR2 | NXP USA Inc. |
Description: XY DUAL-AXIS MEDIUM-G INERTIAL Packaging: Cut Tape (CT) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) Part Status: Active Mounting Type: Surface Mount, Wettable Flank |
auf Bestellung 1985 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF7751HN/N207ZMP | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| SAF7755HN/N207ZK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| SAF7751HV/N205/S3K | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| SAF7755HV/N207ZK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| SAF7755HV/N207ZY | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| SAF7753HV/N205ZY | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||||||||||||||||
| SAF7751HV/N207ZY | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||||||||||||||||
| SAF7758HV/N205ZK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||||||||||||||||
| SAF7755HN/N208Z/MP | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||||||||||||||||
| SAF7753HV/N205Y | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||||||||||||||||
| SAF7753HV/N205K | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||||||||||||||||
| SAF7753HV/N207ZK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||||||||||||||||
| SAF7751HN/N207ZK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
Produkt ist nicht verfügbar |
| TJA1028T/3V3/20/1U |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Obsolete
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
| TJA1028T/5V0/20/1U |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Obsolete
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
| MWCT1123FVLL |
|
Hersteller: NXP USA Inc.
Description: KV4X WCT 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Applications: Microcontroller, MCU
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Description: KV4X WCT 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Applications: Microcontroller, MCU
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Produkt ist nicht verfügbar
| MWCT1023IFVLL |
|
Hersteller: NXP USA Inc.
Description: KV4X WCT 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Applications: Microcontroller, MCU
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Description: KV4X WCT 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Applications: Microcontroller, MCU
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Produkt ist nicht verfügbar
| 74AHC08D-Q100118 |
|
auf Bestellung 46687 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2470+ | 0.2 EUR |
| 74AHC08BQ-Q100115 |
|
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 2520 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2520+ | 0.23 EUR |
| 74AHC08BQ115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC08BQ - AND GAT
Packaging: Bulk
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: NOW NEXPERIA 74AHC08BQ - AND GAT
Packaging: Bulk
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
| 74AHC08PW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74AHC08BQ/C4115 |
|
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74AHC08PW/S400118 |
|
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74AHC08PW653 |
|
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| KITPF5200FRDMEVM |
|
Hersteller: NXP USA Inc.
Description: PF5200 DEV TOOL
Packaging: Box
Function: Automotive
Type: Power Management
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Embedded: Yes, MCU
Part Status: Active
Description: PF5200 DEV TOOL
Packaging: Box
Function: Automotive
Type: Power Management
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Embedded: Yes, MCU
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 538.26 EUR |
| MPC561MZP56 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A7101CGTK2/T0B040X |
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A7101CGTK2/T0B0405 |
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A7101CGT1/T0B0408, |
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-SO
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-SO
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A7101CGHN1/T0B0406 |
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
DigiKey Programmable: Not Verified
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A7101CLTK2/T0BC27J |
|
Hersteller: NXP USA Inc.
Description: HIGH PERFORMANCE AUTHENTICATOR I
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, Smartcard
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 3.6V
Controller Series: A71CL
Applications: Authentication
Core Processor: i.MX6UL
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: HIGH PERFORMANCE AUTHENTICATOR I
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, Smartcard
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 3.6V
Controller Series: A71CL
Applications: Authentication
Core Processor: i.MX6UL
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A7101CLTK2/T0BC2WJ |
|
Hersteller: NXP USA Inc.
Description: PLUG TRUST SECURE ELEMENT
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SmartCard
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 3.6V
Controller Series: A71CL
Applications: Authentication
Core Processor: i.MX6UL
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: PLUG TRUST SECURE ELEMENT
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SmartCard
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 3.6V
Controller Series: A71CL
Applications: Authentication
Core Processor: i.MX6UL
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC34PF1510A2EPR2 |
|
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
| SC16C654BIA529 |
|
Hersteller: NXP USA Inc.
Description: QUAD UART WITH 64-BYTE FIFOS AND
Packaging: Bulk
Part Status: Active
Description: QUAD UART WITH 64-BYTE FIFOS AND
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| BZX79-B24133 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-B24 - ZENER D
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BZX79-B24 - ZENER D
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| MCIMX27LVOP4A |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tray
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Part Status: Not For New Designs
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tray
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Part Status: Not For New Designs
Produkt ist nicht verfügbar
| TWR-SB0800-36EVB |
Hersteller: NXP USA Inc.
Description: EVALUATION BOARD - SB0800 SOLEN
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC34SB0800
Platform: Freescale Tower System
Part Status: Active
Description: EVALUATION BOARD - SB0800 SOLEN
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC34SB0800
Platform: Freescale Tower System
Part Status: Active
Produkt ist nicht verfügbar
| PHPT61002PYC115 |
|
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR, PNP
Packaging: Bulk
Part Status: Active
Description: POWER BIPOLAR TRANSISTOR, PNP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| PCA9450AAHNY |
|
Hersteller: NXP USA Inc.
Description: PMIC FOR I.MX8M MINI 845S 56HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
Description: PMIC FOR I.MX8M MINI 845S 56HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 2287 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 10.68 EUR |
| 10+ | 9.59 EUR |
| 25+ | 9.06 EUR |
| 100+ | 7.86 EUR |
| 250+ | 7.45 EUR |
| 500+ | 6.69 EUR |
| 1000+ | 5.64 EUR |
| SPC5747CK1MMJ6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 88W8887-A2-CBKE/AZ |
Hersteller: NXP USA Inc.
Description: 1X1 11AC DUAL BAND + BT4.0 + FM
Packaging: Tape & Reel (TR)
Package / Case: 124-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v4.2 Dual Mode
Data Rate (Max): 433Mbps
Supplier Device Package: 124-WLCSP
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PCM, SDIO, UART
Part Status: Active
Description: 1X1 11AC DUAL BAND + BT4.0 + FM
Packaging: Tape & Reel (TR)
Package / Case: 124-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v4.2 Dual Mode
Data Rate (Max): 433Mbps
Supplier Device Package: 124-WLCSP
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PCM, SDIO, UART
Part Status: Active
Produkt ist nicht verfügbar
| 88W8787-A1-BRDA/BZ |
Hersteller: NXP USA Inc.
Description: 11N 1X1 SINGLE-BAND + BT + FM +
Packaging: Tape & Reel (TR)
Package / Case: 120-VFBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Data Rate (Max): 150Mbps
Supplier Device Package: 120-VFBGA (7x7)
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Part Status: Active
Protocol: 802.11a/g/b, Bluetooth v2.1 +EDR
Modulation: 4DQPSK, 8DPSK, DSSS, GFSK, OFDM
Description: 11N 1X1 SINGLE-BAND + BT + FM +
Packaging: Tape & Reel (TR)
Package / Case: 120-VFBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Data Rate (Max): 150Mbps
Supplier Device Package: 120-VFBGA (7x7)
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Part Status: Active
Protocol: 802.11a/g/b, Bluetooth v2.1 +EDR
Modulation: 4DQPSK, 8DPSK, DSSS, GFSK, OFDM
Produkt ist nicht verfügbar
| PESD5V0U1BL/315 |
Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 2.9pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 5.5V
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 5VWM DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 2.9pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 5.5V
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
| MCIMX6L7DVN10AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Produkt ist nicht verfügbar
| MC34PF1510A4EP |
|
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
| MKW21Z512VHT4 |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 48VFQFN
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Zigbee®
Current - Receiving: 6.2mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 48VFQFN
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Zigbee®
Current - Receiving: 6.2mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9RS08KA4CPJ |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 3.59 EUR |
| LPC54102J256BD64QL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 640 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 17.58 EUR |
| 10+ | 13.82 EUR |
| 160+ | 11.44 EUR |
| S9S12G64BMLC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S12GN48BCLC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PTN3356R1BSMP |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 2.8V ~ 3.6V
Applications: DisplayPort
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 2.8V ~ 3.6V
Applications: DisplayPort
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 59795 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 174+ | 3.04 EUR |
| S9S08DZ32F2CLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912ZVMBA6F0VLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| RD33775ACNTEVB |
Hersteller: NXP USA Inc.
Description: RD33775ACNTEVB
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33775A
Supplied Contents: Board(s), Cable(s)
Embedded: No
Part Status: Active
Description: RD33775ACNTEVB
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33775A
Supplied Contents: Board(s), Cable(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
| UJA1076ATW/5V0/WDJ |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Part Status: Active
Grade: Automotive
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Part Status: Active
Grade: Automotive
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2000+ | 3.96 EUR |
| UJA1076ATW/5V0/WDJ |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Part Status: Active
Grade: Automotive
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Part Status: Active
Grade: Automotive
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 7.88 EUR |
| 10+ | 7.09 EUR |
| 25+ | 6.7 EUR |
| 100+ | 5.81 EUR |
| 250+ | 5.51 EUR |
| 500+ | 4.95 EUR |
| 1000+ | 4.17 EUR |
| MMA5148KWR2528 |
|
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 48+ | 10.21 EUR |
| FXLS90322AESR2 |
|
Hersteller: NXP USA Inc.
Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Mounting Type: Surface Mount, Wettable Flank
Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Mounting Type: Surface Mount, Wettable Flank
Produkt ist nicht verfügbar
| FXLS90322AESR2 |
|
Hersteller: NXP USA Inc.
Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Packaging: Cut Tape (CT)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Mounting Type: Surface Mount, Wettable Flank
Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Packaging: Cut Tape (CT)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Mounting Type: Surface Mount, Wettable Flank
auf Bestellung 1985 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 10.4 EUR |
| 10+ | 9.49 EUR |
| 25+ | 9.31 EUR |
| 50+ | 9.24 EUR |
| 100+ | 8.29 EUR |
| 250+ | 8.26 EUR |
| 500+ | 7.74 EUR |
| 1000+ | 7.41 EUR |
| SAF7751HN/N207ZMP |
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7755HN/N207ZK |
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7751HV/N205/S3K |
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7755HV/N207ZK |
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7755HV/N207ZY |
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7753HV/N205ZY |
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7751HV/N207ZY |
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7758HV/N205ZK |
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7755HN/N208Z/MP |
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7753HV/N205Y |
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7753HV/N205K |
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7753HV/N207ZK |
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7751HN/N207ZK |
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar