S9S12GN16J1VLCR NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
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Technische Details S9S12GN16J1VLCR NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP, Packaging: Tape & Reel (TR), Package / Case: 32-LQFP, Mounting Type: Surface Mount, Speed: 25MHz, Program Memory Size: 16KB (16K x 8), RAM Size: 1K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 512 x 8, Core Processor: S12, Data Converters: A/D 8x10b, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V, Connectivity: IrDA, LINbus, SCI, SPI, Peripherals: LVD, POR, PWM, WDT, Supplier Device Package: 32-LQFP (7x7), Number of I/O: 26.
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| Foto | Bezeichnung | Hersteller | Beschreibung |
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S9S12GN16J1VLCR | Hersteller : NXP Semiconductors |
 16-bit Microcontrollers - MCU 16-bit MCU, S12 core, 16KB Flash, 25MHz, -40/+105degC, Prototype, QFP 32 |
Produkt ist nicht verfügbar |