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MPC8548VJATGD NXP USA Inc. FSCLS11828-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC RISC MICROPROCESSOR,
Packaging: Bulk
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KMPC8548EVUAUJ KMPC8548EVUAUJ NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Produkt ist nicht verfügbar
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MPC8548EPXAUJB MPC8548EPXAUJB NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Produkt ist nicht verfügbar
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MPC8548EPXAVHB MPC8548EPXAVHB NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.5GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
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MPC8548PXAUJC MPC8548PXAUJC NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
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MPC8548PXATGD MPC8548PXATGD NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.2GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
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SC26C92C1A,529 SC26C92C1A,529 NXP USA Inc. SC26C92.pdf Description: IC DUART 1MBPS 44PLCC
With Modem Control: Yes
With False Start Bit Detection: Yes
With Auto Flow Control: Yes
Supplier Device Package: 44-PLCC (16.59x16.59)
Data Rate (Max): 1Mbps
FIFO's: 8 Byte
Voltage - Supply: 5V
Mounting Type: Surface Mount
Number of Channels: 2, DUART
Package / Case: 44-LCC (J-Lead)
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Tube
Produkt ist nicht verfügbar
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SP05127-05UL NXP USA Inc. Description: EVAL BOARD FOR TEA1936X
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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SP05145-01UL NXP USA Inc. Description: SP05145-01
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
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S9S12VR32F0CLCR S9S12VR32F0CLCR NXP USA Inc. 15944_MC9S12VRRMV3.pdf Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
DigiKey Programmable: Not Verified
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S9S12VR32F0CLC S9S12VR32F0CLC NXP USA Inc. 15944_MC9S12VRRMV3.pdf Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
DigiKey Programmable: Not Verified
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MPF5200AMMG3ES MPF5200AMMG3ES NXP USA Inc. R_MPF5200AMMG3ES.pdf Description: IC REG BUCK 1.2V/1.2V DL 32HWQFN
Packaging: Tray
Package / Case: 32-PowerWFQFN
Output Type: Fixed
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 2
Function: Step-Down
Output Configuration: Positive
Frequency - Switching: 2MHz
Topology: Buck
Supplier Device Package: 32-HWQFN (5x5)
Synchronous Rectifier: No
Voltage - Output (Min/Fixed): 1.2V, 1.2V
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MPF5200AMMG2ES MPF5200AMMG2ES NXP USA Inc. R_MPF5200AMMG2ES.pdf Description: IC REG BUCK 1.2V/1.2V DL 32HWQFN
Packaging: Tray
Package / Case: 32-PowerWFQFN
Output Type: Fixed
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 2
Function: Step-Down
Output Configuration: Positive
Frequency - Switching: 2MHz
Topology: Buck
Supplier Device Package: 32-HWQFN (5x5)
Synchronous Rectifier: No
Voltage - Output (Min/Fixed): 1.2V, 1.2V
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MPF5200AMMG2ESR2 NXP USA Inc. Description: POWER MANAGEMENT SPECIALIZED - P
Packaging: Tape & Reel (TR)
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MPF5200AMMG3ESR2 NXP USA Inc. Description: POWER MANAGEMENT SPECIALIZED - P
Packaging: Tape & Reel (TR)
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MPF5200AMMG0ESR2 MPF5200AMMG0ESR2 NXP USA Inc. PF5200.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 32-HWQFN (5x5)
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MPF5200AMMG0ES MPF5200AMMG0ES NXP USA Inc. PF5200.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 40µA
Supplier Device Package: 32-HWQFN (5x5)
Grade: Automotive
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SPC5668EAMMG NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 208BGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
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SPC5668EF1AMMG NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 208BGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
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MIMXRT1170-EVKB MIMXRT1170-EVKB NXP USA Inc. IMXRT1170CEC.pdf Description: I.MX RT1170 EVAL KIT REV.B
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Utilized IC / Part: RT1170
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MCIMX6D4AVT08AC-NXP NXP USA Inc. PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw Description: I.MX 6 SERIES 32 BIT MPU, DUAL A
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MC33FS8430G1ESR2 NXP USA Inc. Description: SYSTEM BASIS CHIP FS8430
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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P1012NSN2HFB P1012NSN2HFB NXP USA Inc. QP1021FS.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC13201FCR2 MC13201FCR2 NXP USA Inc. MC13201.pdf Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F8006VWL MC56F8006VWL NXP USA Inc. MC56F8006.pdf Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
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PTN3360DBS518 PTN3360DBS518 NXP USA Inc. PTN3360D.pdf Description: ENHANCED PERFORMANCE HDMI/DVI LE
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: DVI, HDMI
Voltage - Supply: 3V ~ 3.6V
Applications: DisplayPort to HDMI, DVI Adapters
Supplier Device Package: 48-HVQFN (7x7)
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S9S08QD2J1CSCR S9S08QD2J1CSCR NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
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500+2.94 EUR
1000+2.84 EUR
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OM-SE050ARD-E NXP USA Inc. Description: SE050E ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SE050
Platform: Arduino
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1+154.21 EUR
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OMA1006UK-SKT NXP USA Inc. A1006_Demo-Dev_Kit.pdf Description: EVAL BOARD FOR A1006UK
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A1006UK
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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OM67201ULUL NXP USA Inc. Description: A1007 DEMONSTRATION BOARD
Packaging: Box
Produkt ist nicht verfügbar
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OMPCA9957LEDEV NXP USA Inc. PCA9957DS.pdf Description: EVAL BOARD FOR PCA9957
Features: Dimmable
Packaging: Bulk
Voltage - Output: 5.5V
Voltage - Input: 2.7V ~ 5.5V
Contents: Board(s)
Current - Output / Channel: 32mA
Utilized IC / Part: PCA9957
Supplied Contents: Board(s)
Outputs and Type: 24 Non-Isolated Outputs
Produkt ist nicht verfügbar
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OM-SE050ARD-F OM-SE050ARD-F NXP USA Inc. SE050-DATASHEET.pdf?pspll=1 Description: SE050F ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SE050
Platform: Arduino
Produkt ist nicht verfügbar
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OM13582UL NXP USA Inc. Description: TYPE-C DOCK BOARD
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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OM13581UL NXP USA Inc. Description: TYPE-C HOST BOARD
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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OM13580JP NXP USA Inc. Description: COMPLETE TYE-C DEMONSTRATION KIT
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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PTVS13VP1UP/WD115 PTVS13VP1UP/WD115 NXP USA Inc. PHGLS23376-1.pdf?t.download=true&u=5oefqw Description: TVS DIODE 13VWM 21.5VC CFP5
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Current - Peak Pulse (10/1000µs): 27.9A
Voltage - Reverse Standoff (Typ): 13V (Max)
Supplier Device Package: CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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AFT05MS031GNR1 AFT05MS031GNR1 NXP USA Inc. AFT05MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
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AFT05MS031GNR1 AFT05MS031GNR1 NXP USA Inc. AFT05MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
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MC33FS4501CAER2 MC33FS4501CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC35FS4501CAER2 MC35FS4501CAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS4501CAE MC33FS4501CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC35FS4501CAE MC35FS4501CAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MPC8535AVJANGA NXP USA Inc. PHGL-S-A0002263525-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCH SOC
Packaging: Bulk
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MPC8533VTALFA NXP USA Inc. FSCL-S-A0001172477-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC RISC MICROPROCESSOR
Packaging: Bulk
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MKL15Z64VFT4 MKL15Z64VFT4 NXP USA Inc. KL15P80M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 15x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, LINbus, SPI, TSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P1022NXE2HFB P1022NXE2HFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1022NXN2HFB P1022NXN2HFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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NZX11D133 NZX11D133 NXP USA Inc. NZX_SER.pdf Description: NOW NEXPERIA NZX11D - ZENER DIOD
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 25 Ohms
Voltage - Zener (Nom) (Vz): 11.35 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±2%
Packaging: Bulk
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PXLS83322AESR2 NXP USA Inc. Description: 2 AXIS MED/MED XY
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SCIMX6S6AVM083CR NXP USA Inc. Description: I.MX 6 SERIES 32-BIT MPU ARM COR
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX20P3483AUKZ NXP USA Inc. NX20P3483AUK.pdf Description: NX20P3483AUK
Packaging: Tape & Reel (TR)
Features: 5V Regulated Output, Slew Rate Controlled
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 28mOhm, 38mOhm
Input Type: Non-Inverting
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Current - Output (Max): 3.4A, 5A
Ratio - Input:Output: 1:1
Supplier Device Package: 42-WLCSP (2.91x2.51)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Reverse Current, UVLO
Produkt ist nicht verfügbar
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LPC1114FBD48/333J LPC1114FBD48/333J NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 56KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 56KB (56K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
Produkt ist nicht verfügbar
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MK52DN512CMD10 MK52DN512CMD10 NXP USA Inc. K52P144M100SF2V2.pdf Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
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25+25.76 EUR
160+23.32 EUR
320+22.69 EUR
640+22.18 EUR
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MCIMX508CVK8B MCIMX508CVK8B NXP USA Inc. IMX50CEC.pdf Description: IC MPU I.MX50 800MHZ 416MAPBGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: Boot Security, Cryptography, Secure JTAG
Display & Interface Controllers: EPDC, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, LPDDR2, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 416-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 416-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8308CVMADD MPC8308CVMADD NXP USA Inc. MPC8308EC.pdf Description: IC MPU MPC83XX 266MHZ 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 473-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, MMC/SD/SDIO, SPI
Produkt ist nicht verfügbar
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MPF7100BVMA2ES MPF7100BVMA2ES NXP USA Inc. Description: PF7100 PMIC I.MX8XL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPC8377VRALGA MPC8377VRALGA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8377CVRALGA MPC8377CVRALGA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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MPC8377VRAJFA MPC8377VRAJFA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8377VRAJFA MPC8377VRAJFA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8548VJATGD FSCLS11828-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: POWERQUICC RISC MICROPROCESSOR,
Packaging: Bulk
auf Bestellung 4 Stücke:
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AnzahlPrivatkunde
2+509.94 EUR
Mindestbestellmenge: 2 Stücke
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KMPC8548EVUAUJ MPC8548EEC.pdf
KMPC8548EVUAUJ
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Produkt ist nicht verfügbar
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MPC8548EPXAUJB MPC8548EEC.pdf
MPC8548EPXAUJB
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Produkt ist nicht verfügbar
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MPC8548EPXAVHB MPC8548EEC.pdf
MPC8548EPXAVHB
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.5GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Produkt ist nicht verfügbar
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MPC8548PXAUJC MPC8548EEC.pdf
MPC8548PXAUJC
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MPC8548PXATGD MPC8548EEC.pdf
MPC8548PXATGD
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.2GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Produkt ist nicht verfügbar
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SC26C92C1A,529 SC26C92.pdf
SC26C92C1A,529
Hersteller: NXP USA Inc.
Description: IC DUART 1MBPS 44PLCC
With Modem Control: Yes
With False Start Bit Detection: Yes
With Auto Flow Control: Yes
Supplier Device Package: 44-PLCC (16.59x16.59)
Data Rate (Max): 1Mbps
FIFO's: 8 Byte
Voltage - Supply: 5V
Mounting Type: Surface Mount
Number of Channels: 2, DUART
Package / Case: 44-LCC (J-Lead)
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Tube
Produkt ist nicht verfügbar
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SP05127-05UL
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1936X
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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SP05145-01UL
Hersteller: NXP USA Inc.
Description: SP05145-01
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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S9S12VR32F0CLCR 15944_MC9S12VRRMV3.pdf
S9S12VR32F0CLCR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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S9S12VR32F0CLC 15944_MC9S12VRRMV3.pdf
S9S12VR32F0CLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPF5200AMMG3ES R_MPF5200AMMG3ES.pdf
MPF5200AMMG3ES
Hersteller: NXP USA Inc.
Description: IC REG BUCK 1.2V/1.2V DL 32HWQFN
Packaging: Tray
Package / Case: 32-PowerWFQFN
Output Type: Fixed
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 2
Function: Step-Down
Output Configuration: Positive
Frequency - Switching: 2MHz
Topology: Buck
Supplier Device Package: 32-HWQFN (5x5)
Synchronous Rectifier: No
Voltage - Output (Min/Fixed): 1.2V, 1.2V
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2+13.66 EUR
10+10.54 EUR
25+9.77 EUR
100+8.91 EUR
490+8.26 EUR
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MPF5200AMMG2ES R_MPF5200AMMG2ES.pdf
MPF5200AMMG2ES
Hersteller: NXP USA Inc.
Description: IC REG BUCK 1.2V/1.2V DL 32HWQFN
Packaging: Tray
Package / Case: 32-PowerWFQFN
Output Type: Fixed
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 2
Function: Step-Down
Output Configuration: Positive
Frequency - Switching: 2MHz
Topology: Buck
Supplier Device Package: 32-HWQFN (5x5)
Synchronous Rectifier: No
Voltage - Output (Min/Fixed): 1.2V, 1.2V
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2+13.07 EUR
10+10.08 EUR
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100+8.52 EUR
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MPF5200AMMG2ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT SPECIALIZED - P
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPF5200AMMG3ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT SPECIALIZED - P
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPF5200AMMG0ESR2 PF5200.pdf
MPF5200AMMG0ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 32-HWQFN (5x5)
Produkt ist nicht verfügbar
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MPF5200AMMG0ES PF5200.pdf
MPF5200AMMG0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 40µA
Supplier Device Package: 32-HWQFN (5x5)
Grade: Automotive
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2+12.09 EUR
10+11.02 EUR
25+10.82 EUR
40+10.73 EUR
80+9.64 EUR
230+9.6 EUR
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SPC5668EAMMG
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208BGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
Produkt ist nicht verfügbar
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SPC5668EF1AMMG
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208BGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
Produkt ist nicht verfügbar
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MIMXRT1170-EVKB IMXRT1170CEC.pdf
MIMXRT1170-EVKB
Hersteller: NXP USA Inc.
Description: I.MX RT1170 EVAL KIT REV.B
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Utilized IC / Part: RT1170
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MCIMX6D4AVT08AC-NXP PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32 BIT MPU, DUAL A
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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5+109.56 EUR
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MC33FS8430G1ESR2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8430
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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P1012NSN2HFB QP1021FS.pdf
P1012NSN2HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC13201FCR2 MC13201.pdf
MC13201FCR2
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F8006VWL MC56F8006.pdf
MC56F8006VWL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTN3360DBS518 PTN3360D.pdf
PTN3360DBS518
Hersteller: NXP USA Inc.
Description: ENHANCED PERFORMANCE HDMI/DVI LE
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: DVI, HDMI
Voltage - Supply: 3V ~ 3.6V
Applications: DisplayPort to HDMI, DVI Adapters
Supplier Device Package: 48-HVQFN (7x7)
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290+1.99 EUR
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S9S08QD2J1CSCR MC9S08QD4.pdf
S9S08QD2J1CSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
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4+5.24 EUR
10+3.9 EUR
25+3.57 EUR
100+3.21 EUR
250+3.03 EUR
500+2.94 EUR
1000+2.84 EUR
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OM-SE050ARD-E
Hersteller: NXP USA Inc.
Description: SE050E ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SE050
Platform: Arduino
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1+154.21 EUR
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OMA1006UK-SKT A1006_Demo-Dev_Kit.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR A1006UK
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A1006UK
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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OM67201ULUL
Hersteller: NXP USA Inc.
Description: A1007 DEMONSTRATION BOARD
Packaging: Box
Produkt ist nicht verfügbar
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OMPCA9957LEDEV PCA9957DS.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PCA9957
Features: Dimmable
Packaging: Bulk
Voltage - Output: 5.5V
Voltage - Input: 2.7V ~ 5.5V
Contents: Board(s)
Current - Output / Channel: 32mA
Utilized IC / Part: PCA9957
Supplied Contents: Board(s)
Outputs and Type: 24 Non-Isolated Outputs
Produkt ist nicht verfügbar
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OM-SE050ARD-F SE050-DATASHEET.pdf?pspll=1
OM-SE050ARD-F
Hersteller: NXP USA Inc.
Description: SE050F ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SE050
Platform: Arduino
Produkt ist nicht verfügbar
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OM13582UL
Hersteller: NXP USA Inc.
Description: TYPE-C DOCK BOARD
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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OM13581UL
Hersteller: NXP USA Inc.
Description: TYPE-C HOST BOARD
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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OM13580JP
Hersteller: NXP USA Inc.
Description: COMPLETE TYE-C DEMONSTRATION KIT
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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PTVS13VP1UP/WD115 PHGLS23376-1.pdf?t.download=true&u=5oefqw
PTVS13VP1UP/WD115
Hersteller: NXP USA Inc.
Description: TVS DIODE 13VWM 21.5VC CFP5
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Current - Peak Pulse (10/1000µs): 27.9A
Voltage - Reverse Standoff (Typ): 13V (Max)
Supplier Device Package: CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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AFT05MS031GNR1 AFT05MS031N.pdf
AFT05MS031GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
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500+42.76 EUR
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AFT05MS031GNR1 AFT05MS031N.pdf
AFT05MS031GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
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1+63.4 EUR
10+51.49 EUR
25+48.53 EUR
100+45.26 EUR
250+44.07 EUR
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MC33FS4501CAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS4501CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC35FS4501CAER2 35FS4500-35FS6500SDS.pdf
MC35FS4501CAER2
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS4501CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS4501CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC35FS4501CAE 35FS4500-35FS6500SDS.pdf
MC35FS4501CAE
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPC8535AVJANGA PHGL-S-A0002263525-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCH SOC
Packaging: Bulk
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2+306.38 EUR
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MPC8533VTALFA FSCL-S-A0001172477-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: POWERQUICC RISC MICROPROCESSOR
Packaging: Bulk
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4+149.9 EUR
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MKL15Z64VFT4 KL15P80M48SF0.pdf
MKL15Z64VFT4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 15x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, LINbus, SPI, TSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P1022NXE2HFB QP1022FS.pdf
P1022NXE2HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1022NXN2HFB QP1022FS.pdf
P1022NXN2HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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NZX11D133 NZX_SER.pdf
NZX11D133
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA NZX11D - ZENER DIOD
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 25 Ohms
Voltage - Zener (Nom) (Vz): 11.35 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±2%
Packaging: Bulk
auf Bestellung 86600 Stücke:
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15000+0.039 EUR
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PXLS83322AESR2
Hersteller: NXP USA Inc.
Description: 2 AXIS MED/MED XY
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SCIMX6S6AVM083CR
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32-BIT MPU ARM COR
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX20P3483AUKZ NX20P3483AUK.pdf
Hersteller: NXP USA Inc.
Description: NX20P3483AUK
Packaging: Tape & Reel (TR)
Features: 5V Regulated Output, Slew Rate Controlled
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 28mOhm, 38mOhm
Input Type: Non-Inverting
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Current - Output (Max): 3.4A, 5A
Ratio - Input:Output: 1:1
Supplier Device Package: 42-WLCSP (2.91x2.51)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Reverse Current, UVLO
Produkt ist nicht verfügbar
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LPC1114FBD48/333J LPC1102_1104.pdf
LPC1114FBD48/333J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 56KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 56KB (56K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
Produkt ist nicht verfügbar
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MK52DN512CMD10 K52P144M100SF2V2.pdf
MK52DN512CMD10
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
auf Bestellung 790 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+34.56 EUR
10+27.52 EUR
25+25.76 EUR
160+23.32 EUR
320+22.69 EUR
640+22.18 EUR
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MCIMX508CVK8B IMX50CEC.pdf
MCIMX508CVK8B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX50 800MHZ 416MAPBGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: Boot Security, Cryptography, Secure JTAG
Display & Interface Controllers: EPDC, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, LPDDR2, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 416-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 416-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8308CVMADD MPC8308EC.pdf
MPC8308CVMADD
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 473-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, MMC/SD/SDIO, SPI
Produkt ist nicht verfügbar
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MPF7100BVMA2ES
MPF7100BVMA2ES
Hersteller: NXP USA Inc.
Description: PF7100 PMIC I.MX8XL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPC8377VRALGA MPC8377E.pdf
MPC8377VRALGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8377CVRALGA MPC8377E.pdf
MPC8377CVRALGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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MPC8377VRAJFA MPC8377E.pdf
MPC8377VRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 19 Stücke:
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AnzahlPrivatkunde
4+148.67 EUR
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MPC8377VRAJFA MPC8377E.pdf
MPC8377VRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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