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MIMX8QX2FVLFZAC MIMX8QX2FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8QX5FVLFZAC MIMX8QX5FVLFZAC NXP USA Inc. IMX8QXPAEC.pdf Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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MIMX8QX6FVLFZAC MIMX8QX6FVLFZAC NXP USA Inc. Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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A7102CGHN1/T0B0AEL A7102CGHN1/T0B0AEL NXP USA Inc. Description: AU10TICS
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908GR16CFAE MC908GR16CFAE NXP USA Inc. MC68HC908GR16.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 1108 Stücke:
Lieferzeit 10-14 Tag (e)
1+23.09 EUR
10+18.31 EUR
25+17.12 EUR
100+15.81 EUR
250+15.75 EUR
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PDTC114TMB315 PDTC114TMB315 NXP USA Inc. PDTC114TMB.pdf Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 110000 Stücke:
Lieferzeit 10-14 Tag (e)
11225+0.05 EUR
Mindestbestellmenge: 11225
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MC56F82748VLHR MC56F82748VLHR NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F82748VLHR MC56F82748VLHR NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1450 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.33 EUR
10+11.93 EUR
25+11.08 EUR
100+10.14 EUR
250+9.69 EUR
500+9.43 EUR
Mindestbestellmenge: 2
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S9S12G48BVLCR S9S12G48BVLCR NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC32PF3001A5EPR2 MC32PF3001A5EPR2 NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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S9S12G64AMLFR S9S12G64AMLFR NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC34PF3001A2EPR2 MC34PF3001A2EPR2 NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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FS32K142HRT0VLHR FS32K142HRT0VLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5607BK0VLL6R SPC5607BK0VLL6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC32PF1510A6EPR2 MC32PF1510A6EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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FS32K118BRT0VLHR FS32K118BRT0VLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K118LAT0MLFR FS32K118LAT0MLFR NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K146HAT0MLLR FS32K146HAT0MLLR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK61FX512VMD15 MK61FX512VMD15 NXP USA Inc. KINK6XFS.pdf Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 53x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 95
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.82 EUR
10+20.94 EUR
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PMN52XP115 PMN52XP115 NXP USA Inc. PMN52XP.pdf Description: P-CHANNEL MOSFET
Packaging: Bulk
auf Bestellung 636000 Stücke:
Lieferzeit 10-14 Tag (e)
3723+0.14 EUR
Mindestbestellmenge: 3723
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NCF2961EHN2/0200EJ NXP USA Inc. Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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P2020NSE2KHC P2020NSE2KHC NXP USA Inc. QP20XXFS.pdf Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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FRDMSTBANBP8XD NXP USA Inc. UM11568.pdf Description: BPMS FREEDOM SHIELD EVAL BOARD
Packaging: Box
Interface: SPI
Sensor Type: Pressure
Utilized IC / Part: NBP8FD4T1
Supplied Contents: Board(s)
Embedded: Yes, MCU
Sensing Range: 40 ~ 250 kPa
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
1+107.11 EUR
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LPC811M001JDH16FP LPC811M001JDH16FP NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 659 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.50 EUR
10+1.83 EUR
96+1.40 EUR
192+1.39 EUR
288+1.37 EUR
576+1.20 EUR
Mindestbestellmenge: 8
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XC56309VF100A-NXP NXP USA Inc. Description: 24-BIT DIGITAL SIGNAL PROCESSOR
Packaging: Bulk
Produkt ist nicht verfügbar
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SPAKXC309AG100A SPAKXC309AG100A NXP USA Inc. DSP56303.pdf Description: IC DSP 24BIT 100MHZ 144-LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 144-LQFP (20x20)
Produkt ist nicht verfügbar
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XC56309AG100A XC56309AG100A NXP USA Inc. DSP56309UM.pdf Description: IC DSP 24BIT 100MHZ 144-TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 144-LQFP (20x20)
Produkt ist nicht verfügbar
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XC56309AG100AR2 XC56309AG100AR2 NXP USA Inc. DSP56309PB.pdf Description: IC DSP 24BIT 100MHZ 144-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 144-LQFP (20x20)
Produkt ist nicht verfügbar
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NBP9FD4T1 NXP USA Inc. Description: SENSOR BATTERY PRESSURE
Packaging: Tape & Reel (TR)
Sensor Type: Battery Pressure
Produkt ist nicht verfügbar
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NBP9FD4T1 NXP USA Inc. Description: SENSOR BATTERY PRESSURE
Packaging: Cut Tape (CT)
Sensor Type: Battery Pressure
Produkt ist nicht verfügbar
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NBP8FD5T1 NXP USA Inc. Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT423N,112 74HCT423N,112 NXP USA Inc. 74HC_HCT423_Rev_6.pdf Description: IC MULTIVIBRATOR 22NS 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 22 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-DIP
Voltage - Supply: 4.5 V ~ 5.5 V
Produkt ist nicht verfügbar
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SPC5744PK1MLQ8 SPC5744PK1MLQ8 NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA3683J/N2S,112 TDA3683J/N2S,112 NXP USA Inc. TDA3683.pdf Description: IC REG MULTIPLE VOLTAGE DBS23P
Packaging: Tube
Package / Case: 23-SIP Formed Leads
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Applications: Ignition Buffer, Regulator
Current - Supply: 300µA
Supplier Device Package: DBS23P
Produkt ist nicht verfügbar
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S32K322EHT0MPBST S32K322EHT0MPBST NXP USA Inc. S32K3xx.pdf Description: S32K322 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
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74AUP1T1326GT115 NXP USA Inc. 74AUP1T1326.pdf Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 8-XSON (1.95x1)
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74LVC3G06GT115 NXP USA Inc. 74LVC3G06.pdf Description: NOW NEXPERIA 74LVC3G06GT INVERTE
Packaging: Bulk
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BUK7E3R1-40E,127-NXP NXP USA Inc. Description: PFET, 100A I(D), 40V, 0.0031OHM,
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 234W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 79 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6200 pF @ 25 V
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ON5233,118 ON5233,118 NXP USA Inc. Description: RF MOSFET SOT428 DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Supplier Device Package: DPAK
Produkt ist nicht verfügbar
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P1010NSN5HFB P1010NSN5HFB NXP USA Inc. QP1010FS.pdf Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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BZX585-C36115 NXP USA Inc. BZX585_SERIES.pdf Description: NOW NEXPERIA BZX585-C36 ZENER DI
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOD-523
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Produkt ist nicht verfügbar
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74ALVCH16843DGG653 NXP USA Inc. 74ALVCH16843.pdf Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
auf Bestellung 2000 Stücke:
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423+1.25 EUR
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74ALVCH16843DGG518 NXP USA Inc. 74ALVCH16843.pdf Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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MC908JK3EMDWE MC908JK3EMDWE NXP USA Inc. MC68HC908Jx(1,3).pdf Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
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TDF8541JV/N3ZU TDF8541JV/N3ZU NXP USA Inc. Description: TDF8541JV
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Supplier Device Package: DBS27P
Mounting Type: Through Hole
Produkt ist nicht verfügbar
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TJA1103AHN/0Z TJA1103AHN/0Z NXP USA Inc. Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
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Lieferzeit 10-14 Tag (e)
4000+2.53 EUR
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TJA1103AHN/0Z TJA1103AHN/0Z NXP USA Inc. Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6401 Stücke:
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OM13053UL NXP USA Inc. Description: LPC812-LPCXPRESSO BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC812
Platform: LPCXpresso™
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NCK2910AHN/10203Y NCK2910AHN/10203Y NXP USA Inc. Description: NCK2910AHN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 12000 Stücke:
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6000+4.56 EUR
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NCK2910AHN/10203Y NCK2910AHN/10203Y NXP USA Inc. Description: NCK2910AHN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 12000 Stücke:
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1000+5.15 EUR
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FRDM-XS2410EVB NXP USA Inc. UM11313.pdf Description: FRDM EXP BOARD XS2410
Packaging: Bulk
Function: Voltage Reference
Type: Power Management
Utilized IC / Part: XS2410EVB
Supplied Contents: Board(s)
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MC34PF8100EREPR2 MC34PF8100EREPR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MC68332GCAG16 MC68332GCAG16 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332GVAG25 MC68332GVAG25 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332AMEH16 MC68332AMEH16 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332AVEH20 MC68332AVEH20 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332GVEH25 MC68332GVEH25 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33797BPEWR2 MC33797BPEWR2 NXP USA Inc. MC33797.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
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MC33797BPEWR2 MC33797BPEWR2 NXP USA Inc. MC33797.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
auf Bestellung 972 Stücke:
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1+18.13 EUR
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100+12.17 EUR
250+11.66 EUR
500+11.35 EUR
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MC33797BPEW MC33797BPEW NXP USA Inc. MC33797.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
auf Bestellung 27 Stücke:
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1+17.92 EUR
10+16.48 EUR
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MIMX8QX2FVLFZAC IMX8QXPAEC.pdf
MIMX8QX2FVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8QX5FVLFZAC IMX8QXPAEC.pdf
MIMX8QX5FVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
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MIMX8QX6FVLFZAC
MIMX8QX6FVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
Produkt ist nicht verfügbar
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A7102CGHN1/T0B0AEL
A7102CGHN1/T0B0AEL
Hersteller: NXP USA Inc.
Description: AU10TICS
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908GR16CFAE MC68HC908GR16.pdf
MC908GR16CFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 1108 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+23.09 EUR
10+18.31 EUR
25+17.12 EUR
100+15.81 EUR
250+15.75 EUR
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PDTC114TMB315 PDTC114TMB.pdf
PDTC114TMB315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 110000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11225+0.05 EUR
Mindestbestellmenge: 11225
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MC56F82748VLHR MC56F827XXDS.pdf
MC56F82748VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F82748VLHR MC56F827XXDS.pdf
MC56F82748VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.33 EUR
10+11.93 EUR
25+11.08 EUR
100+10.14 EUR
250+9.69 EUR
500+9.43 EUR
Mindestbestellmenge: 2
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S9S12G48BVLCR S12G%20Family%20Fact%20Sheet.pdf
S9S12G48BVLCR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC32PF3001A5EPR2 PF3001.pdf
MC32PF3001A5EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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S9S12G64AMLFR
S9S12G64AMLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC34PF3001A2EPR2 PF3001.pdf
MC34PF3001A2EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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FS32K142HRT0VLHR S32K1xx.pdf
FS32K142HRT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5607BK0VLL6R MPC560XBFAMFS.pdf
SPC5607BK0VLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC32PF1510A6EPR2 PF1510.pdf
MC32PF1510A6EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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FS32K118BRT0VLHR S32K1xx.pdf
FS32K118BRT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K118LAT0MLFR S32K-DS.pdf
FS32K118LAT0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K146HAT0MLLR S32K1xx.pdf
FS32K146HAT0MLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK61FX512VMD15 KINK6XFS.pdf
MK61FX512VMD15
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 53x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 95
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.82 EUR
10+20.94 EUR
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PMN52XP115 PMN52XP.pdf
PMN52XP115
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
auf Bestellung 636000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3723+0.14 EUR
Mindestbestellmenge: 3723
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NCF2961EHN2/0200EJ
Hersteller: NXP USA Inc.
Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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P2020NSE2KHC QP20XXFS.pdf
P2020NSE2KHC
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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FRDMSTBANBP8XD UM11568.pdf
Hersteller: NXP USA Inc.
Description: BPMS FREEDOM SHIELD EVAL BOARD
Packaging: Box
Interface: SPI
Sensor Type: Pressure
Utilized IC / Part: NBP8FD4T1
Supplied Contents: Board(s)
Embedded: Yes, MCU
Sensing Range: 40 ~ 250 kPa
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+107.11 EUR
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LPC811M001JDH16FP LPC81XM.pdf
LPC811M001JDH16FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 659 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.50 EUR
10+1.83 EUR
96+1.40 EUR
192+1.39 EUR
288+1.37 EUR
576+1.20 EUR
Mindestbestellmenge: 8
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XC56309VF100A-NXP
Hersteller: NXP USA Inc.
Description: 24-BIT DIGITAL SIGNAL PROCESSOR
Packaging: Bulk
Produkt ist nicht verfügbar
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SPAKXC309AG100A DSP56303.pdf
SPAKXC309AG100A
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 144-LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 144-LQFP (20x20)
Produkt ist nicht verfügbar
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XC56309AG100A DSP56309UM.pdf
XC56309AG100A
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 144-TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 144-LQFP (20x20)
Produkt ist nicht verfügbar
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XC56309AG100AR2 DSP56309PB.pdf
XC56309AG100AR2
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 144-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 144-LQFP (20x20)
Produkt ist nicht verfügbar
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NBP9FD4T1
Hersteller: NXP USA Inc.
Description: SENSOR BATTERY PRESSURE
Packaging: Tape & Reel (TR)
Sensor Type: Battery Pressure
Produkt ist nicht verfügbar
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NBP9FD4T1
Hersteller: NXP USA Inc.
Description: SENSOR BATTERY PRESSURE
Packaging: Cut Tape (CT)
Sensor Type: Battery Pressure
Produkt ist nicht verfügbar
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NBP8FD5T1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT423N,112 74HC_HCT423_Rev_6.pdf
74HCT423N,112
Hersteller: NXP USA Inc.
Description: IC MULTIVIBRATOR 22NS 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 22 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-DIP
Voltage - Supply: 4.5 V ~ 5.5 V
Produkt ist nicht verfügbar
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SPC5744PK1MLQ8
SPC5744PK1MLQ8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA3683J/N2S,112 TDA3683.pdf
TDA3683J/N2S,112
Hersteller: NXP USA Inc.
Description: IC REG MULTIPLE VOLTAGE DBS23P
Packaging: Tube
Package / Case: 23-SIP Formed Leads
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Applications: Ignition Buffer, Regulator
Current - Supply: 300µA
Supplier Device Package: DBS23P
Produkt ist nicht verfügbar
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S32K322EHT0MPBST S32K3xx.pdf
S32K322EHT0MPBST
Hersteller: NXP USA Inc.
Description: S32K322 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 592 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+19.45 EUR
10+18.05 EUR
25+17.20 EUR
100+16.98 EUR
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74AUP1T1326GT115 74AUP1T1326.pdf
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 8-XSON (1.95x1)
auf Bestellung 4700 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1664+0.32 EUR
Mindestbestellmenge: 1664
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74LVC3G06GT115 74LVC3G06.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC3G06GT INVERTE
Packaging: Bulk
Produkt ist nicht verfügbar
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BUK7E3R1-40E,127-NXP
Hersteller: NXP USA Inc.
Description: PFET, 100A I(D), 40V, 0.0031OHM,
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 234W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 79 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6200 pF @ 25 V
Produkt ist nicht verfügbar
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ON5233,118
ON5233,118
Hersteller: NXP USA Inc.
Description: RF MOSFET SOT428 DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Supplier Device Package: DPAK
Produkt ist nicht verfügbar
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P1010NSN5HFB QP1010FS.pdf
P1010NSN5HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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BZX585-C36115 BZX585_SERIES.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX585-C36 ZENER DI
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOD-523
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Produkt ist nicht verfügbar
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74ALVCH16843DGG653 74ALVCH16843.pdf
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
423+1.25 EUR
Mindestbestellmenge: 423
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74ALVCH16843DGG518 74ALVCH16843.pdf
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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MC908JK3EMDWE MC68HC908Jx(1,3).pdf
MC908JK3EMDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDF8541JV/N3ZU
TDF8541JV/N3ZU
Hersteller: NXP USA Inc.
Description: TDF8541JV
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Supplier Device Package: DBS27P
Mounting Type: Through Hole
Produkt ist nicht verfügbar
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TJA1103AHN/0Z
TJA1103AHN/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+2.53 EUR
Mindestbestellmenge: 4000
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TJA1103AHN/0Z
TJA1103AHN/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6401 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.82 EUR
10+3.61 EUR
25+3.31 EUR
100+2.98 EUR
250+2.82 EUR
500+2.72 EUR
1000+2.65 EUR
Mindestbestellmenge: 4
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OM13053UL
Hersteller: NXP USA Inc.
Description: LPC812-LPCXPRESSO BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC812
Platform: LPCXpresso™
Produkt ist nicht verfügbar
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NCK2910AHN/10203Y
NCK2910AHN/10203Y
Hersteller: NXP USA Inc.
Description: NCK2910AHN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+4.56 EUR
Mindestbestellmenge: 6000
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NCK2910AHN/10203Y
NCK2910AHN/10203Y
Hersteller: NXP USA Inc.
Description: NCK2910AHN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.13 EUR
10+6.46 EUR
25+6.32 EUR
50+6.29 EUR
100+5.64 EUR
250+5.62 EUR
500+5.41 EUR
1000+5.15 EUR
Mindestbestellmenge: 3
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FRDM-XS2410EVB UM11313.pdf
Hersteller: NXP USA Inc.
Description: FRDM EXP BOARD XS2410
Packaging: Bulk
Function: Voltage Reference
Type: Power Management
Utilized IC / Part: XS2410EVB
Supplied Contents: Board(s)
auf Bestellung 22 Stücke:
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Anzahl Preis
1+162.52 EUR
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MC34PF8100EREPR2 PF8100_PF8200.pdf
MC34PF8100EREPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MC68332GCAG16 MC68332TS.pdf
MC68332GCAG16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332GVAG25 MC68332TS.pdf
MC68332GVAG25
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332AMEH16 MC68332TS.pdf
MC68332AMEH16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332AVEH20 MC68332TS.pdf
MC68332AVEH20
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68332GVEH25 MC68332TS.pdf
MC68332GVEH25
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33797BPEWR2 MC33797.pdf
MC33797BPEWR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
Produkt ist nicht verfügbar
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MC33797BPEWR2 MC33797.pdf
MC33797BPEWR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
auf Bestellung 972 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.13 EUR
10+14.23 EUR
25+13.25 EUR
100+12.17 EUR
250+11.66 EUR
500+11.35 EUR
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MC33797BPEW MC33797.pdf
MC33797BPEW
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+17.92 EUR
10+16.48 EUR
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