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BRKTSTBAPA7250S NXP USA Inc. UM11863.pdf Description: PRESSURE EVAL BREAKOUT BOARD
Packaging: Box
Interface: I2C, Serial, SPI
Sensor Type: Pressure
Utilized IC / Part: FXPS7250X
Supplied Contents: Board(s)
Embedded: No
Produkt ist nicht verfügbar
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S9S12DG25F0VPVE S9S12DG25F0VPVE NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12DG25F0CPVE S9S12DG25F0CPVE NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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S9S12DG25F0MPVE S9S12DG25F0MPVE NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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MC9S12DG256VPVE MC9S12DG256VPVE NXP USA Inc. HCS12DFAMILYPP.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Verified
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MC9S12DG256CCFU MC9S12DG256CCFU NXP USA Inc. MC9S12DP256B.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC9S12DG256CCPV MC9S12DG256CCPV NXP USA Inc. MC9S12DP256B.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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MC9S12DG256BVPV MC9S12DG256BVPV NXP USA Inc. MC9S12DP256B.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC852TZT66A MPC852TZT66A NXP USA Inc. MPC852T.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
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MPC852TZT66A MPC852TZT66A NXP USA Inc. MPC852T.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
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MPC852TCVR80A MPC852TCVR80A NXP USA Inc. MPC852T.pdf Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
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74LVC2G3157GMX 74LVC2G3157GMX NXP USA Inc. 74LVC2G3157.pdf Description: IC SWITCH SPDT X 2 15OHM 10XQFN
Number of Circuits: 2
Current - Leakage (IS(off)) (Max): 5µA
Channel Capacitance (CS(off), CD(off)): 6pF
Switch Time (Ton, Toff) (Max): 5.7ns, 3.8ns
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Crosstalk: -54dB @ 10MHz
Charge Injection: 7.5pC
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Supplier Device Package: 10-XQFN (1.55x2)
-3db Bandwidth: 300MHz
On-State Resistance (Max): 15Ohm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-XFQFN
Packaging: Bulk
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MFS8633BMBA0ES MFS8633BMBA0ES NXP USA Inc. FS8600_SDS.pdf?pspll=1 Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MCF54452VP266R MCF54452VP266R NXP USA Inc. MCF54455.pdf Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tape & Reel (TR)
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
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SPC5646CK0MMJ1 SPC5646CK0MMJ1 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
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SPC5646CK0MMJ1R SPC5646CK0MMJ1R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
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K32L2B11VFT0AR NXP USA Inc. K32%20L2B.pdf Description: K32 L2B, 48QFN
Number of I/O: 36
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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K32L2B11VMP0AR K32L2B11VMP0AR NXP USA Inc. K32%20L2B.pdf Description: K32 L2B, 64MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 50
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K32L2B21VFT0AR K32L2B21VFT0AR NXP USA Inc. K32%20L2B.pdf Description: K32 L2B, 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 36
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K32L2B21VLH0AR K32L2B21VLH0AR NXP USA Inc. K32%20L2B.pdf Description: K32 L2B, 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
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MCF5249LCAG120 MCF5249LCAG120 NXP USA Inc. MCF5249.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I²S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC68302AG20C MC68302AG20C NXP USA Inc. MC68302TIMING.pdf Description: IC MPU M683XX 20MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC33665ATS4AER2 NXP USA Inc. MC33665A_SDS.pdf Description: HIGH SPEED TRANSCEIVER WITH SPI
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33665ATF4AER2 MC33665ATF4AER2 NXP USA Inc. MC33665A_SDS.pdf Description: HIGH SPEED TRANSCEIVER WITH CAN
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33696FCER2 MC33696FCER2 NXP USA Inc. MC33696.pdf Description: IC RF TXRX ISM<1GHZ 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -106.5dBm
Mounting Type: Surface Mount
Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Power - Output: 7.25dBm
Current - Receiving: 10.3mA ~ 24mA
Data Rate (Max): 22.6kbps
Current - Transmitting: 6.1mA ~ 13.5mA
Supplier Device Package: 32-QFN-EP (5x5)
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
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SAC57D52LCVLT NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
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SAC57D52LCVLTR NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 208LQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
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SPC5605BK0VLU6R SPC5605BK0VLU6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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QN9080-001-M17Y QN9080-001-M17Y NXP USA Inc. QN9080-001-M17.pdf Description: IC RF TXRX+MCU BLE 54LFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
RF Family/Standard: Bluetooth
Modulation: FSK
GPIO: 32
Supplier Device Package: 54-LFLGA (9.7x6)
Current - Transmitting: 3.5mA
Data Rate (Max): 2Mbps
Current - Receiving: 4mA
Protocol: Bluetooth v5.0
Voltage - Supply: 1.67V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB SRAM
Frequency: 2.4GHz ~ 2.4835GHz
Mounting Type: Surface Mount
Sensitivity: -92.7dBm
Package / Case: 54-LFLGA
Packaging: Tape & Reel (TR)
Power - Output: 2dBm
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QN9080-001-M17Z QN9080-001-M17Z NXP USA Inc. QN9080-001-M17.pdf Description: IC RF TXRX+MCU BLE 54LFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
RF Family/Standard: Bluetooth
Modulation: FSK
GPIO: 32
Supplier Device Package: 54-LFLGA (9.7x6)
Current - Transmitting: 3.5mA
Data Rate (Max): 2Mbps
Current - Receiving: 4mA
Protocol: Bluetooth v5.0
Power - Output: 2dBm
Voltage - Supply: 1.67V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB SRAM
Frequency: 2.4GHz ~ 2.4835GHz
Mounting Type: Surface Mount
Sensitivity: -92.7dBm
Package / Case: 54-LFLGA
Packaging: Tape & Reel (TR)
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FS32K148HAT0MMHT FS32K148HAT0MMHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
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MPX2102A MPX2102A NXP USA Inc. MPX2102.pdf Description: SENSOR 14.5PSIA .04V
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Applications: Board Mount
Voltage - Supply: 10V ~ 16V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1%
Pressure Type: Absolute
Operating Pressure: 14.5PSI (100kPa)
Output: 0 mV ~ 40 mV (10V)
Mounting Type: Through Hole
Output Type: Wheatstone Bridge
Package / Case: 4-SIP Module
Features: Temperature Compensated
Packaging: Tray
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P1011NXE2FFB P1011NXE2FFB NXP USA Inc. QorIQ_P1.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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WLAN7102CZ NXP USA Inc. Description: WI-FI 6 FRONT-END IC, 5 GHZ
Features: SPDT
Packaging: Tape & Reel (TR)
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5.15GHz ~ 5.925GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
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WLAN7102CY NXP USA Inc. Description: MMIC
Packaging: Bulk
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PCF7953ATT/M1AC1500118 PCF7953ATT/M1AC1500118 NXP USA Inc. NXP_75017275.pdf?t.download=true&u=ovmfp3 Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Bulk
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PCF7953ATT/M1AC1500 PCF7953ATT/M1AC1500 NXP USA Inc. NXP_75017275.pdf?t.download=true&u=ovmfp3 Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Bulk
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PCF7945ATTM1AC1500 NXP USA Inc. Description: IC MCU RISC 28TSSOP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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NCF2984AHN/T0BE/UY NCF2984AHN/T0BE/UY NXP USA Inc. Description: IC REMOTE KEYLESS ENTRY 40HVQFN
DigiKey Programmable: Not Verified
Packaging: Tape & Reel (TR)
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MMPF0200F6AEPR2 MMPF0200F6AEPR2 NXP USA Inc. MMPF0200.pdf Description: IC REG CONV I.MX6 11OUT 56HVQFN
Supplier Device Package: 56-HVQFN (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 11
Mounting Type: Surface Mount
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MC9S08DZ32AMLC MC9S08DZ32AMLC NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MCHC908QY4MDWER MCHC908QY4MDWER NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
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LPC1774FBD144,551 LPC1774FBD144,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 128KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 109
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 40K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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MCF51JE256VLK MCF51JE256VLK NXP USA Inc. MCF51JE256.pdf Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 47
DigiKey Programmable: Not Verified
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MCIMX6Y2DVM05AAR MCIMX6Y2DVM05AAR NXP USA Inc. MCIMX6YxD.pdf Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
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MCIMX6Y2DVM05AA MCIMX6Y2DVM05AA NXP USA Inc. MCIMX6YxD.pdf Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
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BZX79-C20,113 BZX79-C20,113 NXP USA Inc. BZX79.pdf Description: DIODE ZENER 20V 400MW ALF2
Packaging: Tape & Reel (TR)
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MPC8315VRAGDA MPC8315VRAGDA NXP USA Inc. MPC8315EEC.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
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MKW21Z256VHT4 MKW21Z256VHT4 NXP USA Inc. Description: IC RF TXRX+MCU 802.15.4 48VFQFN
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Zigbee®
Current - Receiving: 6.2mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
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MC32PF3001A5EP MC32PF3001A5EP NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
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MMPF0100FDAEPR2 MMPF0100FDAEPR2 NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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PEMI2STD/CR,115 PEMI2STD/CR,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/21PF SMD
Height: 0.024" (0.60mm)
Values: R = 20Ohms, C = 21pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Tape & Reel (TR)
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 20
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
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MCIMX31CJMN4CR2 MCIMX31CJMN4CR2 NXP USA Inc. MCIMX31C.pdf Description: IC MPU I.MX31 400MHZ 473LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
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BAS16QA147 BAS16QA147 NXP USA Inc. BAS16QA.pdf Description: DIODE STD 100V 290MA DFN1010D3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 290mA
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Qualification: AEC-Q101
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MPC17529EV MPC17529EV NXP USA Inc. MPC17529.pdf Description: IC MTR DRV BIPLR 2.7-5.6V 20VMFP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MPC17533EV MPC17533EV NXP USA Inc. DS_568_MPC17533.pdf Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 16-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MCIMX515CJM6C MCIMX515CJM6C NXP USA Inc. IMX51CONINDFS.pdf Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 95°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
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SLN-SVUI-IOT SLN-SVUI-IOT NXP USA Inc. SLN-SVUI-IOT-UG.pdf Description: VOICE COMMAND EVAL BOARD
Packaging: Bulk
Function: Voice Recognition
Type: Audio/Voice
Contents: Board(s), Cable(s), Accessories
Supplied Contents: Board(s), Cable(s), Accessories
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MC33812EKR2 MC33812EKR2 NXP USA Inc. Description: IC DVR IGNITION/INJECTOR 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
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MC33812EK MC33812EK NXP USA Inc. Description: IC DVR IGNITION/INJECTOR 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
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BRKTSTBAPA7250S UM11863.pdf
Hersteller: NXP USA Inc.
Description: PRESSURE EVAL BREAKOUT BOARD
Packaging: Box
Interface: I2C, Serial, SPI
Sensor Type: Pressure
Utilized IC / Part: FXPS7250X
Supplied Contents: Board(s)
Embedded: No
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S9S12DG25F0VPVE
S9S12DG25F0VPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12DG25F0CPVE 9S12DT128DGV2.pdf
S9S12DG25F0CPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12DG25F0MPVE
S9S12DG25F0MPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12DG256VPVE HCS12DFAMILYPP.pdf
MC9S12DG256VPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC9S12DG256CCFU MC9S12DP256B.pdf
MC9S12DG256CCFU
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12DG256CCPV MC9S12DP256B.pdf
MC9S12DG256CCPV
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12DG256BVPV MC9S12DP256B.pdf
MC9S12DG256BVPV
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC852TZT66A MPC852T.pdf
MPC852TZT66A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
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MPC852TZT66A MPC852T.pdf
MPC852TZT66A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Produkt ist nicht verfügbar
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MPC852TCVR80A MPC852T.pdf
MPC852TCVR80A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Produkt ist nicht verfügbar
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74LVC2G3157GMX 74LVC2G3157.pdf
74LVC2G3157GMX
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 2 15OHM 10XQFN
Number of Circuits: 2
Current - Leakage (IS(off)) (Max): 5µA
Channel Capacitance (CS(off), CD(off)): 6pF
Switch Time (Ton, Toff) (Max): 5.7ns, 3.8ns
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Crosstalk: -54dB @ 10MHz
Charge Injection: 7.5pC
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Supplier Device Package: 10-XQFN (1.55x2)
-3db Bandwidth: 300MHz
On-State Resistance (Max): 15Ohm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-XFQFN
Packaging: Bulk
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MFS8633BMBA0ES FS8600_SDS.pdf?pspll=1
MFS8633BMBA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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2+12.09 EUR
10+9.35 EUR
25+8.66 EUR
100+7.91 EUR
260+7.54 EUR
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MCF54452VP266R MCF54455.pdf
MCF54452VP266R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tape & Reel (TR)
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5646CK0MMJ1
SPC5646CK0MMJ1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5646CK0MMJ1R
SPC5646CK0MMJ1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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K32L2B11VFT0AR K32%20L2B.pdf
Hersteller: NXP USA Inc.
Description: K32 L2B, 48QFN
Number of I/O: 36
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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K32L2B11VMP0AR K32%20L2B.pdf
K32L2B11VMP0AR
Hersteller: NXP USA Inc.
Description: K32 L2B, 64MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 50
Produkt ist nicht verfügbar
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K32L2B21VFT0AR K32%20L2B.pdf
K32L2B21VFT0AR
Hersteller: NXP USA Inc.
Description: K32 L2B, 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 36
Produkt ist nicht verfügbar
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K32L2B21VLH0AR K32%20L2B.pdf
K32L2B21VLH0AR
Hersteller: NXP USA Inc.
Description: K32 L2B, 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
Produkt ist nicht verfügbar
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MCF5249LCAG120 MCF5249.pdf
MCF5249LCAG120
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I²S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68302AG20C MC68302TIMING.pdf
MC68302AG20C
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC33665ATS4AER2 MC33665A_SDS.pdf
Hersteller: NXP USA Inc.
Description: HIGH SPEED TRANSCEIVER WITH SPI
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33665ATF4AER2 MC33665A_SDS.pdf
MC33665ATF4AER2
Hersteller: NXP USA Inc.
Description: HIGH SPEED TRANSCEIVER WITH CAN
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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2000+9.68 EUR
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MC33696FCER2 MC33696.pdf
MC33696FCER2
Hersteller: NXP USA Inc.
Description: IC RF TXRX ISM<1GHZ 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -106.5dBm
Mounting Type: Surface Mount
Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Power - Output: 7.25dBm
Current - Receiving: 10.3mA ~ 24mA
Data Rate (Max): 22.6kbps
Current - Transmitting: 6.1mA ~ 13.5mA
Supplier Device Package: 32-QFN-EP (5x5)
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAC57D52LCVLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAC57D52LCVLTR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208LQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0VLU6R MPC560XBFAMFS.pdf
SPC5605BK0VLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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QN9080-001-M17Y QN9080-001-M17.pdf
QN9080-001-M17Y
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 54LFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
RF Family/Standard: Bluetooth
Modulation: FSK
GPIO: 32
Supplier Device Package: 54-LFLGA (9.7x6)
Current - Transmitting: 3.5mA
Data Rate (Max): 2Mbps
Current - Receiving: 4mA
Protocol: Bluetooth v5.0
Voltage - Supply: 1.67V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB SRAM
Frequency: 2.4GHz ~ 2.4835GHz
Mounting Type: Surface Mount
Sensitivity: -92.7dBm
Package / Case: 54-LFLGA
Packaging: Tape & Reel (TR)
Power - Output: 2dBm
Produkt ist nicht verfügbar
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QN9080-001-M17Z QN9080-001-M17.pdf
QN9080-001-M17Z
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 54LFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
RF Family/Standard: Bluetooth
Modulation: FSK
GPIO: 32
Supplier Device Package: 54-LFLGA (9.7x6)
Current - Transmitting: 3.5mA
Data Rate (Max): 2Mbps
Current - Receiving: 4mA
Protocol: Bluetooth v5.0
Power - Output: 2dBm
Voltage - Supply: 1.67V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB SRAM
Frequency: 2.4GHz ~ 2.4835GHz
Mounting Type: Surface Mount
Sensitivity: -92.7dBm
Package / Case: 54-LFLGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K148HAT0MMHT S32K1xx.pdf
FS32K148HAT0MMHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPX2102A MPX2102.pdf
MPX2102A
Hersteller: NXP USA Inc.
Description: SENSOR 14.5PSIA .04V
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Applications: Board Mount
Voltage - Supply: 10V ~ 16V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1%
Pressure Type: Absolute
Operating Pressure: 14.5PSI (100kPa)
Output: 0 mV ~ 40 mV (10V)
Mounting Type: Through Hole
Output Type: Wheatstone Bridge
Package / Case: 4-SIP Module
Features: Temperature Compensated
Packaging: Tray
Produkt ist nicht verfügbar
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P1011NXE2FFB QorIQ_P1.pdf
P1011NXE2FFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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WLAN7102CZ
Hersteller: NXP USA Inc.
Description: WI-FI 6 FRONT-END IC, 5 GHZ
Features: SPDT
Packaging: Tape & Reel (TR)
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5.15GHz ~ 5.925GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
Produkt ist nicht verfügbar
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WLAN7102CY
Hersteller: NXP USA Inc.
Description: MMIC
Packaging: Bulk
Produkt ist nicht verfügbar
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PCF7953ATT/M1AC1500118 NXP_75017275.pdf?t.download=true&u=ovmfp3
PCF7953ATT/M1AC1500118
Hersteller: NXP USA Inc.
Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Bulk
auf Bestellung 56100 Stücke:
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PCF7953ATT/M1AC1500 NXP_75017275.pdf?t.download=true&u=ovmfp3
PCF7953ATT/M1AC1500
Hersteller: NXP USA Inc.
Description: IC KEYLESS ENTRY/GO 28TSSOP
Packaging: Bulk
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PCF7945ATTM1AC1500
Hersteller: NXP USA Inc.
Description: IC MCU RISC 28TSSOP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NCF2984AHN/T0BE/UY
NCF2984AHN/T0BE/UY
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 40HVQFN
DigiKey Programmable: Not Verified
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMPF0200F6AEPR2 MMPF0200.pdf
MMPF0200F6AEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56HVQFN
Supplier Device Package: 56-HVQFN (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 11
Mounting Type: Surface Mount
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S08DZ32AMLC MC9S08DV60.pdf
MC9S08DZ32AMLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MCHC908QY4MDWER MC68HC908QY4.pdf
MCHC908QY4MDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1774FBD144,551 LPC178X_7X.pdf
LPC1774FBD144,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 109
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 40K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
auf Bestellung 120 Stücke:
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AnzahlPreis
1+19.71 EUR
10+15.52 EUR
60+13.69 EUR
120+13.19 EUR
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MCF51JE256VLK MCF51JE256.pdf
MCF51JE256VLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6Y2DVM05AAR MCIMX6YxD.pdf
MCIMX6Y2DVM05AAR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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MCIMX6Y2DVM05AA MCIMX6YxD.pdf
MCIMX6Y2DVM05AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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BZX79-C20,113 BZX79.pdf
BZX79-C20,113
Hersteller: NXP USA Inc.
Description: DIODE ZENER 20V 400MW ALF2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC8315VRAGDA MPC8315EEC.pdf
MPC8315VRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
Produkt ist nicht verfügbar
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MKW21Z256VHT4
MKW21Z256VHT4
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 48VFQFN
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Zigbee®
Current - Receiving: 6.2mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC32PF3001A5EP PF3001.pdf
MC32PF3001A5EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MMPF0100FDAEPR2
MMPF0100FDAEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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PEMI2STD/CR,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/CR,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/21PF SMD
Height: 0.024" (0.60mm)
Values: R = 20Ohms, C = 21pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Tape & Reel (TR)
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 20
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
Produkt ist nicht verfügbar
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MCIMX31CJMN4CR2 MCIMX31C.pdf
MCIMX31CJMN4CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX31 400MHZ 473LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Produkt ist nicht verfügbar
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BAS16QA147 BAS16QA.pdf
BAS16QA147
Hersteller: NXP USA Inc.
Description: DIODE STD 100V 290MA DFN1010D3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 290mA
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MPC17529EV MPC17529.pdf
MPC17529EV
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.6V 20VMFP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
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MPC17533EV DS_568_MPC17533.pdf
MPC17533EV
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 16-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
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MCIMX515CJM6C IMX51CONINDFS.pdf
MCIMX515CJM6C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 95°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Produkt ist nicht verfügbar
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SLN-SVUI-IOT SLN-SVUI-IOT-UG.pdf
SLN-SVUI-IOT
Hersteller: NXP USA Inc.
Description: VOICE COMMAND EVAL BOARD
Packaging: Bulk
Function: Voice Recognition
Type: Audio/Voice
Contents: Board(s), Cable(s), Accessories
Supplied Contents: Board(s), Cable(s), Accessories
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AnzahlPreis
1+422.19 EUR
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MC33812EKR2
MC33812EKR2
Hersteller: NXP USA Inc.
Description: IC DVR IGNITION/INJECTOR 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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MC33812EK
MC33812EK
Hersteller: NXP USA Inc.
Description: IC DVR IGNITION/INJECTOR 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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