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LFVBBJ74WA NXP USA Inc. Description: QORIVVA MPC5674A 416 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Produkt ist nicht verfügbar
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LFJ74DBGZWA NXP USA Inc. Description: QORIVVA MPC5674 416 PIN 1.0MM CA
Packaging: Bulk
For Use With/Related Products: MPC5674
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFVBBOJ74Z1A NXP USA Inc. Description: QORIVVA MPC5674F 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
Produkt ist nicht verfügbar
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LFVBBJ74ZA NXP USA Inc. Description: QORIVVA MPC5674A 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Produkt ist nicht verfügbar
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LFVCAL32SYNC4 NXP USA Inc. Description: 32 BIT 4MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Produkt ist nicht verfügbar
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LFVCAL32SYNC8 NXP USA Inc. Description: 32 BIT 8MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Produkt ist nicht verfügbar
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LFVBSJ74ZZ1A NXP USA Inc. Description: QORIVVA MPC5674 522 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Utilized IC / Part: MPC5674
Produkt ist nicht verfügbar
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LFVBSJ74ZW1A NXP USA Inc. Description: QORIVVA MPC5674 422 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Utilized IC / Part: MPC5674
Produkt ist nicht verfügbar
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LFVBSJ74ZWA NXP USA Inc. Description: QORIVVA MPC5674 416 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Utilized IC / Part: MPC5674
Produkt ist nicht verfügbar
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LFVBSJ74ZZA NXP USA Inc. Description: QORIVVA 522 PIN 1.0MM PRE-VERTIC
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Produkt ist nicht verfügbar
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SPC5674KAVJM2R NXP USA Inc. Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5674KAVJM2 NXP USA Inc. Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA8575DB,118 PCA8575DB,118 NXP USA Inc. PCA8575.pdf Description: IC XPNDR 400KHZ I2C 24SSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SSOP
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA8575DB,118 PCA8575DB,118 NXP USA Inc. PCA8575.pdf Description: IC XPNDR 400KHZ I2C 24SSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SSOP
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 307 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.7 EUR
10+2.74 EUR
25+2.5 EUR
100+2.24 EUR
250+2.11 EUR
Mindestbestellmenge: 5
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MCF52232CAF50 MCF52232CAF50 NXP USA Inc. MCF52235.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 680 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.01 EUR
10+25.69 EUR
25+24.11 EUR
80+23.99 EUR
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PMV450ENEA215 PMV450ENEA215 NXP USA Inc. PMV450ENEA.pdf Description: NOW NEXPERIA SMALL SIGNAL FIELD-
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8555EPXAPF MPC8555EPXAPF NXP USA Inc. MPC8555E.pdf Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 833MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Produkt ist nicht verfügbar
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S912ZVHL32F1VLQ S912ZVHL32F1VLQ NXP USA Inc. S912ZVHL32F1VLL# Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6Y2DVM09AA557 NXP USA Inc. PHGL-S-A0003030654-1.pdf?t.download=true&u=5oefqw Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6DP5EYM1AA557 NXP USA Inc. IMX6DQPCEC.pdf Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6S1AVM08AC557 NXP USA Inc. IMX6SDLAEC.pdf Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6U7CVM08AC557 NXP USA Inc. IMX6SDLIEC.pdf Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6V2CVM08AB557 MCIMX6V2CVM08AB557 NXP USA Inc. IMX6SLLIEC.pdf Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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PDZ6.8B/ZL115 PDZ6.8B/ZL115 NXP USA Inc. PDZ-B_SER.pdf Description: DIODE ZENER
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC855TCZQ66D4 MPC855TCZQ66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
100+240.63 EUR
Mindestbestellmenge: 100
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TJA1462BTK/S1Z TJA1462BTK/S1Z NXP USA Inc. TJA1462.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1462ATK/S1Z TJA1462ATK/S1Z NXP USA Inc. TJA1462.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC34PF1510A5EP MC34PF1510A5EP NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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BB172115 BB172115 NXP USA Inc. PHGLS28992-1.pdf?t.download=true&u=5oefqw Description: VARIABLE CAPACITANCE DIODE
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15
Produkt ist nicht verfügbar
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MMA5212KWR2 NXP USA Inc. MMA52xxKW.pdf Description: ACCELEROMETER 120G PCM/SPI 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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RD772BJBCANFDEVB NXP USA Inc. UM11846.pdf Description: EVAL BOARD FOR MC33772C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 9V ~ 13.5V Supply
Secondary Attributes: On-Board LEDs
Embedded: No
Produkt ist nicht verfügbar
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RD772BJBTPLEVB NXP USA Inc. HVBMSFS.pdf Description: EVAL BOARD FOR MC33772C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Embedded: No
Produkt ist nicht verfügbar
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RD772BJBTPL8EVB NXP USA Inc. UM11847.pdf Description: 00 V BATTERY JUNCTION BOX USING
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Contents: Board(s)
Supplied Contents: Board(s)
Secondary Attributes: On-Board LEDs
Embedded: No
Produkt ist nicht verfügbar
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QN9090-001-T10 QN9090-001-T10 NXP USA Inc. QN9090-FS.pdf Description: QN9090 BLE SOC DEV KIT
Packaging: Bulk
For Use With/Related Products: QN9090
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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P3T1755DPZ P3T1755DPZ NXP USA Inc. P3T1755.pdf Description: SENSOR DGTL -40C ~ 125C 8-TSSOP
Packaging: Tape & Reel (TR)
Features: Shutdown Mode, One-Shot
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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P3T1755DPZ P3T1755DPZ NXP USA Inc. P3T1755.pdf Description: SENSOR DGTL -40C ~ 125C 8-TSSOP
Packaging: Cut Tape (CT)
Features: Shutdown Mode, One-Shot
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 1698 Stücke:
Lieferzeit 10-14 Tag (e)
19+0.97 EUR
21+0.84 EUR
22+0.8 EUR
25+0.75 EUR
50+0.71 EUR
100+0.68 EUR
500+0.61 EUR
1000+0.59 EUR
Mindestbestellmenge: 19
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P3T1750DPZ P3T1750DPZ NXP USA Inc. P3T1750DP.pdf Description: IC TEMP SENSOR I3C/I2C-BUS
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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P3T1750DPZ P3T1750DPZ NXP USA Inc. P3T1750DP.pdf Description: IC TEMP SENSOR I3C/I2C-BUS
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 955 Stücke:
Lieferzeit 10-14 Tag (e)
22+0.83 EUR
26+0.69 EUR
28+0.65 EUR
30+0.59 EUR
50+0.56 EUR
100+0.53 EUR
500+0.47 EUR
Mindestbestellmenge: 22
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MCF51JF128VHS MCF51JF128VHS NXP USA Inc. FSCL-S-A0000577550-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Bulk
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
58+9.2 EUR
Mindestbestellmenge: 58
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MC33742PEP MC33742PEP NXP USA Inc. Description: IC INTERFACE SPECIALIZED 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 48-QFN-EP (7x7)
Grade: Automotive
auf Bestellung 210 Stücke:
Lieferzeit 10-14 Tag (e)
66+7.34 EUR
Mindestbestellmenge: 66
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MC33742PEG MC33742PEG NXP USA Inc. Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
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NCF2961VHN2/0200EJ NXP USA Inc. Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCF2961XHN2/0200EJ NXP USA Inc. Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCF2961XHN3/0200EY NXP USA Inc. Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCF2961EHN3/0200EY NXP USA Inc. Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC55S26JBD64Y NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar
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LPC55S26JEV98Y LPC55S26JEV98Y NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+6.24 EUR
Mindestbestellmenge: 2000
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LPC55S26JBD64E NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.19 EUR
10+8.38 EUR
25+8.22 EUR
40+8.16 EUR
160+7.32 EUR
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LPC55S26JBD100Y NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+7.39 EUR
Mindestbestellmenge: 1000
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LPC55S28JBD64Y NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC55S28JEV98Y NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
Produkt ist nicht verfügbar
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LPC55S26JEV98E LPC55S26JEV98E NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.82 EUR
10+8.35 EUR
25+7.73 EUR
100+7.05 EUR
260+6.65 EUR
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Im Einkaufswagen  Stück im Wert von  UAH
LPC55S26JBD100E NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.37 EUR
10+9.46 EUR
25+9.28 EUR
40+9.21 EUR
90+8.27 EUR
Mindestbestellmenge: 2
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LPC55S28JBD64E LPC55S28JBD64E NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 512KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.6 EUR
10+7.07 EUR
25+6.75 EUR
Mindestbestellmenge: 3
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LPC55S28JBD100Y NXP USA Inc. Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC55S28JEV98E NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC55S28JBD100E NXP USA Inc. Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Produkt ist nicht verfügbar
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RHRG5060 RHRG5060 NXP USA Inc. ONSM-S-A0003589247-1.pdf?t.download=true&u=5oefqw Description: DIODE AVALANCHE 600V 50A TO2472
Packaging: Bulk
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Avalanche
Current - Average Rectified (Io): 50A
Supplier Device Package: TO-247-2
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 50 A
Current - Reverse Leakage @ Vr: 250 µA @ 600 V
auf Bestellung 317 Stücke:
Lieferzeit 10-14 Tag (e)
141+3.47 EUR
Mindestbestellmenge: 141
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A3T18H400W23SR6 A3T18H400W23SR6 NXP USA Inc. A3T18H400W23S.pdf Description: RF MOSFET LDMOS 28V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Configuration: Dual
Power - Output: 170W
Gain: 16.8dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 300 mA
Produkt ist nicht verfügbar
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74AHC2G32GD,125 74AHC2G32GD,125 NXP USA Inc. 74AHC_AHCT2G32.pdf Description: IC GATE OR 2CH 2-INP 8-XSON
Packaging: Bulk
auf Bestellung 11541 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.24 EUR
Mindestbestellmenge: 2049
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LFVBBJ74WA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674A 416 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Produkt ist nicht verfügbar
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LFJ74DBGZWA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674 416 PIN 1.0MM CA
Packaging: Bulk
For Use With/Related Products: MPC5674
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFVBBOJ74Z1A
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674F 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
Produkt ist nicht verfügbar
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LFVBBJ74ZA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674A 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Produkt ist nicht verfügbar
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LFVCAL32SYNC4
Hersteller: NXP USA Inc.
Description: 32 BIT 4MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Produkt ist nicht verfügbar
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LFVCAL32SYNC8
Hersteller: NXP USA Inc.
Description: 32 BIT 8MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Produkt ist nicht verfügbar
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LFVBSJ74ZZ1A
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674 522 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Utilized IC / Part: MPC5674
Produkt ist nicht verfügbar
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LFVBSJ74ZW1A
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674 422 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Utilized IC / Part: MPC5674
Produkt ist nicht verfügbar
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LFVBSJ74ZWA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674 416 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Utilized IC / Part: MPC5674
Produkt ist nicht verfügbar
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LFVBSJ74ZZA
Hersteller: NXP USA Inc.
Description: QORIVVA 522 PIN 1.0MM PRE-VERTIC
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Produkt ist nicht verfügbar
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SPC5674KAVJM2R
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5674KAVJM2
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA8575DB,118 PCA8575.pdf
PCA8575DB,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24SSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SSOP
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA8575DB,118 PCA8575.pdf
PCA8575DB,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24SSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SSOP
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 307 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.7 EUR
10+2.74 EUR
25+2.5 EUR
100+2.24 EUR
250+2.11 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
MCF52232CAF50 MCF52235.pdf
MCF52232CAF50
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 680 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+32.01 EUR
10+25.69 EUR
25+24.11 EUR
80+23.99 EUR
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PMV450ENEA215 PMV450ENEA.pdf
PMV450ENEA215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL FIELD-
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8555EPXAPF MPC8555E.pdf
MPC8555EPXAPF
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 833MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Produkt ist nicht verfügbar
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S912ZVHL32F1VLQ S912ZVHL32F1VLL#
S912ZVHL32F1VLQ
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6Y2DVM09AA557 PHGL-S-A0003030654-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6DP5EYM1AA557 IMX6DQPCEC.pdf
Hersteller: NXP USA Inc.
Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6S1AVM08AC557 IMX6SDLAEC.pdf
Hersteller: NXP USA Inc.
Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6U7CVM08AC557 IMX6SDLIEC.pdf
Hersteller: NXP USA Inc.
Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6V2CVM08AB557 IMX6SLLIEC.pdf
MCIMX6V2CVM08AB557
Hersteller: NXP USA Inc.
Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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PDZ6.8B/ZL115 PDZ-B_SER.pdf
PDZ6.8B/ZL115
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC855TCZQ66D4 MPC860EC.pdf
MPC855TCZQ66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
100+240.63 EUR
Mindestbestellmenge: 100
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TJA1462BTK/S1Z TJA1462.pdf
TJA1462BTK/S1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1462ATK/S1Z TJA1462.pdf
TJA1462ATK/S1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC34PF1510A5EP PF1510.pdf
MC34PF1510A5EP
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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BB172115 PHGLS28992-1.pdf?t.download=true&u=5oefqw
BB172115
Hersteller: NXP USA Inc.
Description: VARIABLE CAPACITANCE DIODE
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15
Produkt ist nicht verfügbar
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MMA5212KWR2 MMA52xxKW.pdf
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 120G PCM/SPI 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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RD772BJBCANFDEVB UM11846.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33772C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 9V ~ 13.5V Supply
Secondary Attributes: On-Board LEDs
Embedded: No
Produkt ist nicht verfügbar
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RD772BJBTPLEVB HVBMSFS.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33772C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Embedded: No
Produkt ist nicht verfügbar
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RD772BJBTPL8EVB UM11847.pdf
Hersteller: NXP USA Inc.
Description: 00 V BATTERY JUNCTION BOX USING
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Contents: Board(s)
Supplied Contents: Board(s)
Secondary Attributes: On-Board LEDs
Embedded: No
Produkt ist nicht verfügbar
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QN9090-001-T10 QN9090-FS.pdf
QN9090-001-T10
Hersteller: NXP USA Inc.
Description: QN9090 BLE SOC DEV KIT
Packaging: Bulk
For Use With/Related Products: QN9090
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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P3T1755DPZ P3T1755.pdf
P3T1755DPZ
Hersteller: NXP USA Inc.
Description: SENSOR DGTL -40C ~ 125C 8-TSSOP
Packaging: Tape & Reel (TR)
Features: Shutdown Mode, One-Shot
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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P3T1755DPZ P3T1755.pdf
P3T1755DPZ
Hersteller: NXP USA Inc.
Description: SENSOR DGTL -40C ~ 125C 8-TSSOP
Packaging: Cut Tape (CT)
Features: Shutdown Mode, One-Shot
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 1698 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
19+0.97 EUR
21+0.84 EUR
22+0.8 EUR
25+0.75 EUR
50+0.71 EUR
100+0.68 EUR
500+0.61 EUR
1000+0.59 EUR
Mindestbestellmenge: 19
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P3T1750DPZ P3T1750DP.pdf
P3T1750DPZ
Hersteller: NXP USA Inc.
Description: IC TEMP SENSOR I3C/I2C-BUS
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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P3T1750DPZ P3T1750DP.pdf
P3T1750DPZ
Hersteller: NXP USA Inc.
Description: IC TEMP SENSOR I3C/I2C-BUS
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 955 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
22+0.83 EUR
26+0.69 EUR
28+0.65 EUR
30+0.59 EUR
50+0.56 EUR
100+0.53 EUR
500+0.47 EUR
Mindestbestellmenge: 22
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MCF51JF128VHS FSCL-S-A0000577550-1.pdf?t.download=true&u=5oefqw
MCF51JF128VHS
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Bulk
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
58+9.2 EUR
Mindestbestellmenge: 58
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MC33742PEP
MC33742PEP
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 48-QFN-EP (7x7)
Grade: Automotive
auf Bestellung 210 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
66+7.34 EUR
Mindestbestellmenge: 66
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MC33742PEG
MC33742PEG
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
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NCF2961VHN2/0200EJ
Hersteller: NXP USA Inc.
Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCF2961XHN2/0200EJ
Hersteller: NXP USA Inc.
Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCF2961XHN3/0200EY
Hersteller: NXP USA Inc.
Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCF2961EHN3/0200EY
Hersteller: NXP USA Inc.
Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC55S26JBD64Y LPC55S2x_LPC552x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar
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LPC55S26JEV98Y LPC55S2x_LPC552x.pdf
LPC55S26JEV98Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+6.24 EUR
Mindestbestellmenge: 2000
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LPC55S26JBD64E LPC55S2x_LPC552x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.19 EUR
10+8.38 EUR
25+8.22 EUR
40+8.16 EUR
160+7.32 EUR
Mindestbestellmenge: 2
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LPC55S26JBD100Y LPC55S2x_LPC552x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+7.39 EUR
Mindestbestellmenge: 1000
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LPC55S28JBD64Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar
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LPC55S28JEV98Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
Produkt ist nicht verfügbar
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LPC55S26JEV98E LPC55S2x_LPC552x.pdf
LPC55S26JEV98E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.82 EUR
10+8.35 EUR
25+7.73 EUR
100+7.05 EUR
260+6.65 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
LPC55S26JBD100E LPC55S2x_LPC552x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.37 EUR
10+9.46 EUR
25+9.28 EUR
40+9.21 EUR
90+8.27 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
LPC55S28JBD64E LPC55S2x_LPC552x.pdf
LPC55S28JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.6 EUR
10+7.07 EUR
25+6.75 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
LPC55S28JBD100Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Produkt ist nicht verfügbar
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LPC55S28JEV98E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
Produkt ist nicht verfügbar
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LPC55S28JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Produkt ist nicht verfügbar
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RHRG5060 ONSM-S-A0003589247-1.pdf?t.download=true&u=5oefqw
RHRG5060
Hersteller: NXP USA Inc.
Description: DIODE AVALANCHE 600V 50A TO2472
Packaging: Bulk
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Avalanche
Current - Average Rectified (Io): 50A
Supplier Device Package: TO-247-2
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 50 A
Current - Reverse Leakage @ Vr: 250 µA @ 600 V
auf Bestellung 317 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
141+3.47 EUR
Mindestbestellmenge: 141
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A3T18H400W23SR6 A3T18H400W23S.pdf
A3T18H400W23SR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Configuration: Dual
Power - Output: 170W
Gain: 16.8dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 300 mA
Produkt ist nicht verfügbar
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74AHC2G32GD,125 74AHC_AHCT2G32.pdf
74AHC2G32GD,125
Hersteller: NXP USA Inc.
Description: IC GATE OR 2CH 2-INP 8-XSON
Packaging: Bulk
auf Bestellung 11541 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.24 EUR
Mindestbestellmenge: 2049
Im Einkaufswagen  Stück im Wert von  UAH
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