Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34434) > Seite 505 nach 574
Foto | Bezeichnung | Hersteller | Beschreibung |
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MC9S08QD2CSC | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 2KB (2K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Part Status: Active Number of I/O: 4 DigiKey Programmable: Not Verified |
auf Bestellung 7350 Stücke: Lieferzeit 10-14 Tag (e) |
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S912ZVML64F1WKH557 | NXP USA Inc. |
Description: 16-BIT FLASH, CPU12 CPU Packaging: Bulk Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08LG32J0CLH | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.9K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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UBA2024P/N1,112 | NXP USA Inc. |
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 8-DIP Dimming: No Current - Output Source/Sink: 900mA Part Status: Obsolete Current - Supply: 5 mA |
auf Bestellung 335266 Stücke: Lieferzeit 10-14 Tag (e) |
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UBA2024P/N1,112 | NXP USA Inc. |
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 8-DIP Dimming: No Current - Output Source/Sink: 900mA Part Status: Obsolete Current - Supply: 5 mA |
Produkt ist nicht verfügbar |
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AFT05MP075N-54M | NXP USA Inc. |
Description: RF MOSFET Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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P1016NSE5DFB | NXP USA Inc. |
Description: QORIQ, POWER ARCH 32-BIT SOC, 53 Packaging: Bulk Part Status: Active |
auf Bestellung 2155 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08AC96MFUE | NXP USA Inc. |
Description: IC MCU 8BIT 96KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 96KB (96K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P82B96DPZ | NXP USA Inc. |
Description: IC REDRIVER I2C 2CH 8TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Delay Time: 270ns Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2V ~ 15V Applications: I2C Current - Supply: 1.1mA Data Rate (Max): 400kHz Supplier Device Package: 8-TSSOP Part Status: Active Capacitance - Input: 7 pF |
auf Bestellung 2228 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9671PW118 | NXP USA Inc. |
Description: IC I/O EXPANDER I2C 16B 24TSSOP Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCA9509D,118 | NXP USA Inc. |
Description: PCA9509 - INTERFACE CIRCUIT, CMO Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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PCA9501D,118 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C SMBUS 20SO Packaging: Tape & Reel (TR) Features: EEPROM, POR Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V ~ 3.6V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 20-SO Current - Output Source/Sink: 100µA, 25mA Part Status: Obsolete DigiKey Programmable: Not Verified |
auf Bestellung 20440 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9509AGM,125 | NXP USA Inc. |
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN Packaging: Cut Tape (CT) Package / Case: 8-XFQFN Exposed Pad Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Applications: I²C Current - Supply: 5µA Data Rate (Max): 400kHz Supplier Device Package: 8-XQFN (1.6x1.6) Part Status: Obsolete Capacitance - Input: 2 pF |
Produkt ist nicht verfügbar |
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PCF85053ATK-ARD | NXP USA Inc. |
Description: PCF85053ATK-ARD Packaging: Bulk Function: Real Time Clock (RTC) Type: Clock Timing Contents: Board(s) Utilized IC / Part: PCF85053A Platform: Arduino Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT827D,623 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 24SO Packaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 10 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 24-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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74ABT827D,623 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 24SO Packaging: Cut Tape (CT) Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 10 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 24-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MCIMX258CJM4A557 | NXP USA Inc. |
Description: I.MX25 32-BIT MPU, ARM926EJ-S CO Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MCIMX258CVM4 | NXP USA Inc. |
Description: IC MPU I.MX25 400MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection Part Status: Obsolete |
Produkt ist nicht verfügbar |
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FS32K118LFT0MLFT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 43 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCIMX6D7CVT08AD | NXP USA Inc. |
Description: IC MPU I.MX6D 800MHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 336 Stücke: Lieferzeit 10-14 Tag (e) |
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SC550372MFU42R2 | NXP USA Inc. |
Description: IC Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
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2PD601AR,115 | NXP USA Inc. |
Description: TRANS NPN 50V 0.1A SMT3 Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 250mV @ 10mA, 100mA Current - Collector Cutoff (Max): 10nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 210 @ 2mA, 10V Frequency - Transition: 100MHz Supplier Device Package: SMT3; MPAK Part Status: Obsolete Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW |
auf Bestellung 18000 Stücke: Lieferzeit 10-14 Tag (e) |
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WPR1500-HV | NXP USA Inc. |
Description: WPR1500-HV Packaging: Bulk Function: Receiver Type: Interface Utilized IC / Part: WPR1516 Supplied Contents: Board(s) Embedded: No Part Status: Active |
Produkt ist nicht verfügbar |
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WPR1500-LDO | NXP USA Inc. |
Description: BOARD RECEIVER REF PLATFORM LDO Packaging: Box Function: Wireless Power Supply/Charging Type: Power Management Utilized IC / Part: WPR1516 Supplied Contents: Board(s) Primary Attributes: Receiver Embedded: Yes, MCU, 32-Bit Part Status: Active |
Produkt ist nicht verfügbar |
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WPR1500-BUCK | NXP USA Inc. |
Description: BOARD RECEIVER REF PLATFORM BUCK Packaging: Box Function: Wireless Power Supply/Charging Type: Power Management Utilized IC / Part: WPR1516 Supplied Contents: Board(s) Primary Attributes: Receiver Embedded: Yes, MCU, 32-Bit Part Status: Active |
Produkt ist nicht verfügbar |
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MCIMX512CJM6C | NXP USA Inc. |
Description: IC MPU I.MX51 600MHZ 529BGA Packaging: Tray Package / Case: 529-LFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 95°C (TC) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Supplier Device Package: 529-BGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (3), USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Part Status: Active Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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S912ZVML32F3WKHR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Active Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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HTMS1001FUG/AM,026 | NXP USA Inc. |
Description: RFID TAG R/W 100-150KHZ ENCAP Packaging: Bulk Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm) Style: Encapsulated Frequency: 100kHz ~ 150kHz Memory Type: Read/Write Technology: Passive Standards: ISO 11784, ISO 11785 Writable Memory: 1.76kb (User) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MKM33Z64CLL5 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x16b, 4x24b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Not For New Designs Number of I/O: 68 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKM35Z512VLL7R | NXP USA Inc. |
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 75MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LCD, RNG, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 72 |
Produkt ist nicht verfügbar |
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MKM35Z256VLL7R | NXP USA Inc. |
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 75MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LCD, RNG, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 72 |
Produkt ist nicht verfügbar |
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74HC4016D,653 | NXP USA Inc. |
Description: IC SWITCH QUAD SPST 14SOIC Packaging: Bulk Part Status: Active |
auf Bestellung 14668 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP1GU04GS,132 | NXP USA Inc. |
Description: IC INVERTER 1CH 1-INP 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 1 Supplier Device Package: 6-XSON, SOT1202 (1x1) Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 30pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 500 nA |
auf Bestellung 130000 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5747CK1CMJ2 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/120MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5747CK1CMJ2R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/120MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC56F82743VFM | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 100MHz Program Memory Size: 64KB (32K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 6x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MMA5212AKWR2 | NXP USA Inc. |
Description: ACCELEROMETER 120G SPI 16QFN Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X Acceleration Range: ±120g Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.2V ~ 17V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 4 Part Status: Obsolete Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC9S12E256VPVE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP Packaging: Bulk Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 16x10b; D/A 2x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V Connectivity: EBI/EMI, I²C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Not Verified |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC193DB,118 | NXP USA Inc. |
Description: IC 4BIT BINAR UP/DN COUNT 16SSOP Packaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up, Down Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-SSOP Part Status: Active Voltage - Supply: 2 V ~ 6 V Count Rate: 49 MHz Number of Bits per Element: 4 |
auf Bestellung 3983 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF6V2010NBR5 | NXP USA Inc. |
Description: FET RF 110V 220MHZ TO-272-2 Packaging: Cut Tape (CT) Package / Case: TO-272BC Mounting Type: Chassis Mount Frequency: 220MHz Power - Output: 10W Gain: 23.9dB Technology: LDMOS Supplier Device Package: TO-272-2 Part Status: Obsolete Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 30 mA |
Produkt ist nicht verfügbar |
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S32G274ASBK1VUCR | NXP USA Inc. |
Description: S32G274A ARM CORTEX-M7 AND -A53, Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 1/2.5Gbps (4) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Part Status: Active Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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LPC865M201JBD64/0E | NXP USA Inc. |
Description: IC MCU CORTEX M0+ LQFP64 Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 |
auf Bestellung 124 Stücke: Lieferzeit 10-14 Tag (e) |
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PN5120A0HN/C2,551 | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 90°C Voltage - Supply: 2.5V ~ 3.6V Standards: FeliCa, ISO 14443, MIFARE, NFC Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
auf Bestellung 337 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08SG4E2CSC | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Part Status: Active Number of I/O: 4 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC34PF1550A6EP | NXP USA Inc. |
Description: PF1550 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
Produkt ist nicht verfügbar |
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LPC1114FHN33/301:5 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1114FHN33/301:5 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 6939 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVCH16541ADGG112 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
auf Bestellung 312 Stücke: Lieferzeit 10-14 Tag (e) |
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PMPB29XNE,115 | NXP USA Inc. |
Description: MOSFET N-CH 30V 5A DFN2020MD-6 Packaging: Bulk Package / Case: 6-XFDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 5A (Ta) Rds On (Max) @ Id, Vgs: 33mOhm @ 5A, 4.5V Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc) Vgs(th) (Max) @ Id: 900mV @ 250µA Supplier Device Package: DFN1010B-6 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs (Max): ±12V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 18.6 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 1150 pF @ 15 V |
auf Bestellung 19000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5516JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 |
Produkt ist nicht verfügbar |
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LPC5516JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Cut Tape (CT) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 |
auf Bestellung 963 Stücke: Lieferzeit 10-14 Tag (e) |
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TDF19972AEL/C1E | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TDF19972BEL/C1Y | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TDF19972BEL/C1E | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MSC8151SAG1000B | NXP USA Inc. |
Description: IC DSP 1X 1GHZ SC3850 783FCBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Type: SC3850 Single Core Operating Temperature: 0°C ~ 105°C (TJ) Non-Volatile Memory: ROM (96KB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Clock Rate: 1GHz Supplier Device Package: 783-FCPBGA (29x29) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PCA9675PW,118 | NXP USA Inc. |
Description: IC XPNDR 1MHZ I2C 24TSSOP Packaging: Tape & Reel (TR) Features: POR Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 1 MHz Interrupt Output: Yes Supplier Device Package: 24-TSSOP Current - Output Source/Sink: 100µA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9675PW,118 | NXP USA Inc. |
Description: IC XPNDR 1MHZ I2C 24TSSOP Packaging: Cut Tape (CT) Features: POR Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 1 MHz Interrupt Output: Yes Supplier Device Package: 24-TSSOP Current - Output Source/Sink: 100µA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 2978 Stücke: Lieferzeit 10-14 Tag (e) |
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MMRF5018HSR5 | NXP USA Inc. |
Description: RF MOSFET GAN NI400 Packaging: Tape & Reel (TR) Package / Case: NI-400S-2SA Mounting Type: Surface Mount Frequency: 1MHz ~ 2.7GHz Power - Output: 125W Gain: 17.3dB Technology: GaN Supplier Device Package: NI-400S-2SA Part Status: Active Voltage - Rated: 125 V |
Produkt ist nicht verfügbar |
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CBTL04GP043EXJ | NXP USA Inc. |
Description: IC SWITCH DPDT X 2 15OHM 28XFBGA Packaging: Tape & Reel (TR) Package / Case: 28-XFBGA Mounting Type: Surface Mount Operating Temperature: -20°C ~ 85°C (TA) Supplier Device Package: 28-XFBGA (2x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MRF1511NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 7.5V PLD-1.5 Packaging: Tape & Reel (TR) Package / Case: PLD-1.5 Current Rating (Amps): 4A Mounting Type: Surface Mount Frequency: 175MHz Power - Output: 8W Gain: 13dB Technology: LDMOS Supplier Device Package: PLD-1.5 Part Status: Obsolete Voltage - Rated: 40 V Voltage - Test: 7.5 V Current - Test: 150 mA |
Produkt ist nicht verfügbar |
MC9S08QD2CSC |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
auf Bestellung 7350 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.02 EUR |
10+ | 3.92 EUR |
98+ | 3.21 EUR |
588+ | 3.14 EUR |
1078+ | 2.65 EUR |
2548+ | 2.52 EUR |
5096+ | 2.42 EUR |
S912ZVML64F1WKH557 |
Hersteller: NXP USA Inc.
Description: 16-BIT FLASH, CPU12 CPU
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: 16-BIT FLASH, CPU12 CPU
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S08LG32J0CLH |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
UBA2024P/N1,112 |
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
auf Bestellung 335266 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
265+ | 1.81 EUR |
UBA2024P/N1,112 |
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
Produkt ist nicht verfügbar
AFT05MP075N-54M |
Produkt ist nicht verfügbar
P1016NSE5DFB |
Hersteller: NXP USA Inc.
Description: QORIQ, POWER ARCH 32-BIT SOC, 53
Packaging: Bulk
Part Status: Active
Description: QORIQ, POWER ARCH 32-BIT SOC, 53
Packaging: Bulk
Part Status: Active
auf Bestellung 2155 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 127.21 EUR |
MC9S08AC96MFUE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 96KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
P82B96DPZ |
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 270ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 15V
Applications: I2C
Current - Supply: 1.1mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 270ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 15V
Applications: I2C
Current - Supply: 1.1mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 2228 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 7.09 EUR |
10+ | 6.37 EUR |
25+ | 6.02 EUR |
100+ | 5.22 EUR |
250+ | 4.95 EUR |
500+ | 4.44 EUR |
1000+ | 3.75 EUR |
PCA9671PW118 |
Hersteller: NXP USA Inc.
Description: IC I/O EXPANDER I2C 16B 24TSSOP
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC I/O EXPANDER I2C 16B 24TSSOP
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCA9509D,118 |
Hersteller: NXP USA Inc.
Description: PCA9509 - INTERFACE CIRCUIT, CMO
Packaging: Bulk
Part Status: Active
Description: PCA9509 - INTERFACE CIRCUIT, CMO
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PCA9501D,118 |
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 20SO
Packaging: Tape & Reel (TR)
Features: EEPROM, POR
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-SO
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C SMBUS 20SO
Packaging: Tape & Reel (TR)
Features: EEPROM, POR
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-SO
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 20440 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
374+ | 2.36 EUR |
PCA9509AGM,125 |
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I²C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Obsolete
Capacitance - Input: 2 pF
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I²C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
PCF85053ATK-ARD |
Hersteller: NXP USA Inc.
Description: PCF85053ATK-ARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85053A
Platform: Arduino
Part Status: Active
Description: PCF85053ATK-ARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85053A
Platform: Arduino
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 160.3 EUR |
74ABT827D,623 |
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
74ABT827D,623 |
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
MCIMX258CJM4A557 |
Hersteller: NXP USA Inc.
Description: I.MX25 32-BIT MPU, ARM926EJ-S CO
Packaging: Bulk
Part Status: Active
Description: I.MX25 32-BIT MPU, ARM926EJ-S CO
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MCIMX258CVM4 |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Part Status: Obsolete
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Part Status: Obsolete
Produkt ist nicht verfügbar
FS32K118LFT0MLFT |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCIMX6D7CVT08AD |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6D 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 336 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 124.87 EUR |
10+ | 103.16 EUR |
120+ | 95.01 EUR |
SC550372MFU42R2 |
Produkt ist nicht verfügbar
2PD601AR,115 |
Hersteller: NXP USA Inc.
Description: TRANS NPN 50V 0.1A SMT3
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 210 @ 2mA, 10V
Frequency - Transition: 100MHz
Supplier Device Package: SMT3; MPAK
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Description: TRANS NPN 50V 0.1A SMT3
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 210 @ 2mA, 10V
Frequency - Transition: 100MHz
Supplier Device Package: SMT3; MPAK
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
18000+ | 0.032 EUR |
WPR1500-HV |
Hersteller: NXP USA Inc.
Description: WPR1500-HV
Packaging: Bulk
Function: Receiver
Type: Interface
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Description: WPR1500-HV
Packaging: Bulk
Function: Receiver
Type: Interface
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
WPR1500-LDO |
Hersteller: NXP USA Inc.
Description: BOARD RECEIVER REF PLATFORM LDO
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: BOARD RECEIVER REF PLATFORM LDO
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
WPR1500-BUCK |
Hersteller: NXP USA Inc.
Description: BOARD RECEIVER REF PLATFORM BUCK
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: BOARD RECEIVER REF PLATFORM BUCK
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
MCIMX512CJM6C |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 95°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 95°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Produkt ist nicht verfügbar
S912ZVML32F3WKHR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
HTMS1001FUG/AM,026 |
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Bulk
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Part Status: Obsolete
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Bulk
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Part Status: Obsolete
Produkt ist nicht verfügbar
MKM33Z64CLL5 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKM35Z512VLL7R |
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
Produkt ist nicht verfügbar
MKM35Z256VLL7R |
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
Produkt ist nicht verfügbar
74HC4016D,653 |
auf Bestellung 14668 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1931+ | 0.26 EUR |
74AUP1GU04GS,132 |
Hersteller: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
auf Bestellung 130000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1814+ | 0.3 EUR |
SPC5747CK1CMJ2 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5747CK1CMJ2R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC56F82743VFM |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MMA5212AKWR2 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4
Part Status: Obsolete
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4
Part Status: Obsolete
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC9S12E256VPVE |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
13+ | 40.78 EUR |
74HC193DB,118 |
Hersteller: NXP USA Inc.
Description: IC 4BIT BINAR UP/DN COUNT 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Count Rate: 49 MHz
Number of Bits per Element: 4
Description: IC 4BIT BINAR UP/DN COUNT 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Count Rate: 49 MHz
Number of Bits per Element: 4
auf Bestellung 3983 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
882+ | 0.55 EUR |
MRF6V2010NBR5 |
Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-2
Packaging: Cut Tape (CT)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
Description: FET RF 110V 220MHZ TO-272-2
Packaging: Cut Tape (CT)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
Produkt ist nicht verfügbar
S32G274ASBK1VUCR |
Hersteller: NXP USA Inc.
Description: S32G274A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Part Status: Active
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: S32G274A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Part Status: Active
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
LPC865M201JBD64/0E |
Hersteller: NXP USA Inc.
Description: IC MCU CORTEX M0+ LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
Description: IC MCU CORTEX M0+ LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
auf Bestellung 124 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.42 EUR |
10+ | 4.23 EUR |
PN5120A0HN/C2,551 |
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 337 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 11.97 EUR |
10+ | 10.97 EUR |
25+ | 9.97 EUR |
80+ | 8.98 EUR |
230+ | 8.23 EUR |
S9S08SG4E2CSC |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC34PF1550A6EP |
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
LPC1114FHN33/301:5 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4000+ | 4.09 EUR |
LPC1114FHN33/301:5 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 6939 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 8.15 EUR |
10+ | 6.37 EUR |
100+ | 5.22 EUR |
500+ | 5.11 EUR |
1000+ | 4.31 EUR |
74LVCH16541ADGG112 |
auf Bestellung 312 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
312+ | 1.62 EUR |
PMPB29XNE,115 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 5A DFN2020MD-6
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5A (Ta)
Rds On (Max) @ Id, Vgs: 33mOhm @ 5A, 4.5V
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Supplier Device Package: DFN1010B-6
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 18.6 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1150 pF @ 15 V
Description: MOSFET N-CH 30V 5A DFN2020MD-6
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5A (Ta)
Rds On (Max) @ Id, Vgs: 33mOhm @ 5A, 4.5V
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Supplier Device Package: DFN1010B-6
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 18.6 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1150 pF @ 15 V
auf Bestellung 19000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3184+ | 0.14 EUR |
LPC5516JBD100Y |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
Produkt ist nicht verfügbar
LPC5516JBD100Y |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
auf Bestellung 963 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 9.98 EUR |
10+ | 9.1 EUR |
25+ | 8.93 EUR |
50+ | 8.86 EUR |
100+ | 7.95 EUR |
250+ | 7.92 EUR |
500+ | 7.43 EUR |
TDF19972AEL/C1E |
Produkt ist nicht verfügbar
TDF19972BEL/C1Y |
Produkt ist nicht verfügbar
TDF19972BEL/C1E |
Produkt ist nicht verfügbar
MSC8151SAG1000B |
Hersteller: NXP USA Inc.
Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Single Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Part Status: Obsolete
Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Single Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Part Status: Obsolete
Produkt ist nicht verfügbar
PCA9675PW,118 |
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 24TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPNDR 1MHZ I2C 24TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 2.22 EUR |
PCA9675PW,118 |
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 24TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPNDR 1MHZ I2C 24TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2978 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 4.42 EUR |
10+ | 3.97 EUR |
25+ | 3.75 EUR |
100+ | 3.25 EUR |
250+ | 3.08 EUR |
500+ | 2.77 EUR |
1000+ | 2.33 EUR |
MMRF5018HSR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2SA
Mounting Type: Surface Mount
Frequency: 1MHz ~ 2.7GHz
Power - Output: 125W
Gain: 17.3dB
Technology: GaN
Supplier Device Package: NI-400S-2SA
Part Status: Active
Voltage - Rated: 125 V
Description: RF MOSFET GAN NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2SA
Mounting Type: Surface Mount
Frequency: 1MHz ~ 2.7GHz
Power - Output: 125W
Gain: 17.3dB
Technology: GaN
Supplier Device Package: NI-400S-2SA
Part Status: Active
Voltage - Rated: 125 V
Produkt ist nicht verfügbar
CBTL04GP043EXJ |
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDT X 2 15OHM 28XFBGA
Packaging: Tape & Reel (TR)
Package / Case: 28-XFBGA
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C (TA)
Supplier Device Package: 28-XFBGA (2x4)
Part Status: Obsolete
Description: IC SWITCH DPDT X 2 15OHM 28XFBGA
Packaging: Tape & Reel (TR)
Package / Case: 28-XFBGA
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C (TA)
Supplier Device Package: 28-XFBGA (2x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
MRF1511NT1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Current Rating (Amps): 4A
Mounting Type: Surface Mount
Frequency: 175MHz
Power - Output: 8W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 40 V
Voltage - Test: 7.5 V
Current - Test: 150 mA
Description: RF MOSFET LDMOS 7.5V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Current Rating (Amps): 4A
Mounting Type: Surface Mount
Frequency: 175MHz
Power - Output: 8W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 40 V
Voltage - Test: 7.5 V
Current - Test: 150 mA
Produkt ist nicht verfügbar