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MC9S12XS128MAER MC9S12XS128MAER NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF0UL1101DUD2A NXP USA Inc. MF0ULX1.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Produkt ist nicht verfügbar
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NT2H0301F0DTL125 NT2H0301F0DTL125 NXP USA Inc. Description: IC SMART TAG NFC TYPE 2 4HXSON
Packaging: Bulk
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T2081NXE8MQB NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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MCF51AC256ACPUER MCF51AC256ACPUER NXP USA Inc. MCF51AC256.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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MPC8533VJALFA MPC8533VJALFA NXP USA Inc. MPC8533EEC.pdf Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI
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HT2MOA4S20/E/3/RJ HT2MOA4S20/E/3/RJ NXP USA Inc. HT2X_SDS.pdf Description: IC RFID TRANSP 125KHZ PLLMC
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Voltage - Supply: 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: PLLMC
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HT2MOA4S20/E/3/RJ HT2MOA4S20/E/3/RJ NXP USA Inc. HT2X_SDS.pdf Description: IC RFID TRANSP 125KHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Voltage - Supply: 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: PLLMC
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250+3.21 EUR
500+3.09 EUR
1000+2.98 EUR
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AFV10700GSR5 AFV10700GSR5 NXP USA Inc. AFV10700H.pdf Description: RF MOSFET LDMOS 50V NI780
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 105 V
Supplier Device Package: NI-780GS-4L
Technology: LDMOS
Gain: 19.2dB
Power - Output: 700W
Configuration: Dual
Frequency: 1.03GHz ~ 1.09GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: NI-780GS-4L
Packaging: Tape & Reel (TR)
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AFT26HW050GSR3 NXP USA Inc. AFT26HW050(G)SR3,_AFT26H050W26SR3.pdf Description: RF MOSFET LDMOS 28V NI780
Current - Test: 100 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780GS-4L4L
Technology: LDMOS
Gain: 14.2dB
Power - Output: 9W
Configuration: Dual
Frequency: 2.69GHz
Mounting Type: Surface Mount
Package / Case: NI-780GS-4L4L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IP4043CX5/P135 IP4043CX5/P135 NXP USA Inc. Description: CONSUMER CIRCUIT
Packaging: Bulk
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IP4043CX5/LF135 IP4043CX5/LF135 NXP USA Inc. Description: CONSUMER CIRCUIT
Packaging: Bulk
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IP4043CX5/P,135 IP4043CX5/P,135 NXP USA Inc. Description: TVS DIODE 5VWM 5CSP
Packaging: Tape & Reel (TR)
Package / Case: 5-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: 5-CSP (1.12x1.12)
Bidirectional Channels: 4
Power Line Protection: No
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IP4043CX5/LF,135 IP4043CX5/LF,135 NXP USA Inc. Description: TVS DIODE 5VWM 5CSP
Packaging: Tape & Reel (TR)
Package / Case: 5-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: 5-CSP (1.12x1.12)
Bidirectional Channels: 4
Power Line Protection: No
Produkt ist nicht verfügbar
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MCIMX515DJM8C MCIMX515DJM8C NXP USA Inc. IMX51CEC.pdf Description: IC MPU I.MX51 800MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
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MCZ33789BAER2528 MCZ33789BAER2528 NXP USA Inc. MC33789.pdf Description: AIRBAG SYSTEM BASIS CHIP WITH PO
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.2V ~ 20V
Applications: System Basis Chip
Current - Supply: 13.5mA
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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MC32PF1510A6EP MC32PF1510A6EP NXP USA Inc. PF1510.pdf Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
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S9S12GN16F0WLF S9S12GN16F0WLF NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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MCF51JM64EVLH MCF51JM64EVLH NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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MMA3201KEGR2 MMA3201KEGR2 NXP USA Inc. FSCLS07536-1.pdf?t.download=true&u=5oefqw Description: IC SENSOR ACCEL +/-40G 20-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±45g
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 20-SOIC
Produkt ist nicht verfügbar
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MC56F8346VFVER2 MC56F8346VFVER2 NXP USA Inc. MC56F8346.pdf Description: IC MCU 16BIT 128KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 6K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 62
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8801-B0-NMDC/AZ NXP USA Inc. 88W8801_SDS.pdf?pspll=1 Description: IC RF TXRX WIFI 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 26dBm
Protocol: 802.11n/g/b
Current - Receiving: 68mA ~ 82mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 285mA ~ 359mA
Supplier Device Package: 48-HVQFN (6x6)
Modulation: DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, SDIO, UART, USB
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MIMX8DX1AVOFZAC MIMX8DX1AVOFZAC NXP USA Inc. Description: I.MX 8DUALXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 417-FBGA (17x17)
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SC705C8AE0VFNE SC705C8AE0VFNE NXP USA Inc. Description: IC MCU
Packaging: Tube
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P3T1085UKZ P3T1085UKZ NXP USA Inc. P3T1085UK.pdf Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Features: Shutdown Mode
Packaging: Cut Tape (CT)
Package / Case: 6-XFBGA, WLCSP
Output Type: 2-Wire Serial, I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 6-WLCSP (1.18x.84)
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
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PCF7952XTT/C2BC21J PCF7952XTT/C2BC21J NXP USA Inc. Description: RF TRANSMITTER UHF 24TSSOP
DigiKey Programmable: Not Verified
Supplier Device Package: 24-TSSOP
Applications: Remote Keyless Entry
Modulation or Protocol: UHF
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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MCIMX353CVM5B MCIMX353CVM5B NXP USA Inc. MCIMX35SR2CEC.pdf Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
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MCIMX351AVM4B MCIMX351AVM4B NXP USA Inc. MCIMX35SR2AEC.pdf Description: IC MPU I.MX35 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
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MCIMX357CVM5B MCIMX357CVM5B NXP USA Inc. MCIMX35SR2CEC.pdf Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
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MCIMX355AJQ5C MCIMX355AJQ5C NXP USA Inc. MCIMX35SR2AEC.pdf Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
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MCIMX355AVM4B MCIMX355AVM4B NXP USA Inc. MCIMX35SR2AEC.pdf Description: IC MPU I.MX35 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
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MCIMX356AJQ5C MCIMX356AJQ5C NXP USA Inc. MCIMX35SR2AEC.pdf Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
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74AUP1G17GF132 74AUP1G17GF132 NXP USA Inc. 74AUP1G17.pdf Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (1x1)
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MC33FS8520A0KSR2 MC33FS8520A0KSR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS8520A0ESR2 NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
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MC33FS8510D3KSR2 NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS8510A2KSR2 NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS8510A0ESR2 MC33FS8510A0ESR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS8510A0KSR2 NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC32BC3770CSR2 MC32BC3770CSR2 NXP USA Inc. MC32BC3770.pdf Description: IC BATT CHG LI-ION 1CELL 25WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 25-WFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 25-WLCSP (2.27x2.17)
Charge Current - Max: 2A
Programmable Features: Current
Voltage - Supply (Max): 6.2V
Battery Pack Voltage: 4.475V (Max)
Current - Charging: Constant - Programmable
Produkt ist nicht verfügbar
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MC68HC11E0CFNE3R MC68HC11E0CFNE3R NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IP4338CX24/LF/P135 IP4338CX24/LF/P135 NXP USA Inc. IP4338CX24LF.pdf Description: DATA LINE FILTER
Packaging: Bulk
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88W8987-A2-NYEA/AK NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: IC RF TXRX BLE 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
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IP4359CX4/LF-H500315 IP4359CX4/LF-H500315 NXP USA Inc. PHGLS22114-1.pdf?t.download=true&u=5oefqw Description: DATA LINE FILTER
Power Line Protection: Yes
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 2
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Capacitance @ Frequency: 1.3pF @ 1MHz
Applications: DVI, HDMI, USB
Operating Temperature: -35°C ~ 85°C (TA)
Type: Steering (Rail to Rail)
Mounting Type: Surface Mount
Package / Case: 4-UFBGA, WLCSP
Packaging: Bulk
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88W8964-B0-BTWC/AK NXP USA Inc. 88W8964-FACT-SHEET.pdf Description: 4X4 802.11AC WAVE2 WIFI WITH BF
Packaging: Tray
Frequency: 20MHz ~ 160MHz
Type: TxRx Only
Protocol: 802.11ac
Data Rate (Max): 2.6Gbps
Modulation: 256-QAM
RF Family/Standard: WiFi
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ASL5115SHV/0Y ASL5115SHV/0Y NXP USA Inc. PB_ASL5xxxyHz.pdf Description: IC LED DRV CTRL PWM 1.5A 48HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 48-HLQFP (7x7)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
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MCIMX6D7CZK08AE NXP USA Inc. IMX6DQCPOPEC.pdf Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MRF21030LR3 NXP USA Inc. MRF21030.pdf Description: RF MOSFET LDMOS 28V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400
Mounting Type: Chassis Mount
Frequency: 2.14GHz
Power - Output: 30W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: NI-400
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 250 mA
Produkt ist nicht verfügbar
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MC33897CTEFR2 MC33897CTEFR2 NXP USA Inc. MC33897.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MC33897CTEFR2 MC33897CTEFR2 NXP USA Inc. MC33897.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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S32K324EHT1MMMSR NXP USA Inc. S32K3xx.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
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74AHC2G241DP-Q100125 74AHC2G241DP-Q100125 NXP USA Inc. 74AHC_AHCT2G241_Q100.pdf Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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MC908QT2AMDWE MC908QT2AMDWE NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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GTL2005PW,112 GTL2005PW,112 NXP USA Inc. GTL2005.pdf Description: IC XLTR MS BIDIR 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: LVTTL, TTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: GTL
Number of Circuits: 1
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GTL2014PW,112 GTL2014PW,112 NXP USA Inc. GTL2014.pdf Description: IC XLTR MS BIDIR 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: LVTTL
Number of Circuits: 1
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PCAL9714HNMP PCAL9714HNMP NXP USA Inc. PCAL9714.pdf Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
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PCAL9714HNMP PCAL9714HNMP NXP USA Inc. PCAL9714.pdf Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
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PCAL9714HN/Q900MP PCAL9714HN/Q900MP NXP USA Inc. PCAL9714.pdf Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
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PCAL9714HN/Q900MP PCAL9714HN/Q900MP NXP USA Inc. PCAL9714.pdf Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
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S9S08RN16W2VTJR S9S08RN16W2VTJR NXP USA Inc. S9S08RN16DS.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
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MC9S12XS128MAER MC9S12XS256RMV1.pdf
MC9S12XS128MAER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
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MF0UL1101DUD2A MF0ULX1.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Produkt ist nicht verfügbar
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NT2H0301F0DTL125
NT2H0301F0DTL125
Hersteller: NXP USA Inc.
Description: IC SMART TAG NFC TYPE 2 4HXSON
Packaging: Bulk
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T2081NXE8MQB T2080FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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MCF51AC256ACPUER MCF51AC256.pdf
MCF51AC256ACPUER
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8533VJALFA MPC8533EEC.pdf
MPC8533VJALFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI
Produkt ist nicht verfügbar
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HT2MOA4S20/E/3/RJ HT2X_SDS.pdf
HT2MOA4S20/E/3/RJ
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 125KHZ PLLMC
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Voltage - Supply: 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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HT2MOA4S20/E/3/RJ HT2X_SDS.pdf
HT2MOA4S20/E/3/RJ
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 125KHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Voltage - Supply: 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: PLLMC
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5+4.55 EUR
10+3.92 EUR
25+3.7 EUR
100+3.4 EUR
250+3.21 EUR
500+3.09 EUR
1000+2.98 EUR
5000+2.71 EUR
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AFV10700GSR5 AFV10700H.pdf
AFV10700GSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 105 V
Supplier Device Package: NI-780GS-4L
Technology: LDMOS
Gain: 19.2dB
Power - Output: 700W
Configuration: Dual
Frequency: 1.03GHz ~ 1.09GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: NI-780GS-4L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AFT26HW050GSR3 AFT26HW050(G)SR3,_AFT26H050W26SR3.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 100 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780GS-4L4L
Technology: LDMOS
Gain: 14.2dB
Power - Output: 9W
Configuration: Dual
Frequency: 2.69GHz
Mounting Type: Surface Mount
Package / Case: NI-780GS-4L4L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IP4043CX5/P135
IP4043CX5/P135
Hersteller: NXP USA Inc.
Description: CONSUMER CIRCUIT
Packaging: Bulk
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IP4043CX5/LF135
IP4043CX5/LF135
Hersteller: NXP USA Inc.
Description: CONSUMER CIRCUIT
Packaging: Bulk
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IP4043CX5/P,135
IP4043CX5/P,135
Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM 5CSP
Packaging: Tape & Reel (TR)
Package / Case: 5-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: 5-CSP (1.12x1.12)
Bidirectional Channels: 4
Power Line Protection: No
Produkt ist nicht verfügbar
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IP4043CX5/LF,135
IP4043CX5/LF,135
Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM 5CSP
Packaging: Tape & Reel (TR)
Package / Case: 5-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: 5-CSP (1.12x1.12)
Bidirectional Channels: 4
Power Line Protection: No
Produkt ist nicht verfügbar
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MCIMX515DJM8C IMX51CEC.pdf
MCIMX515DJM8C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 800MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
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25+112.43 EUR
100+105.81 EUR
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MCZ33789BAER2528 MC33789.pdf
MCZ33789BAER2528
Hersteller: NXP USA Inc.
Description: AIRBAG SYSTEM BASIS CHIP WITH PO
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.2V ~ 20V
Applications: System Basis Chip
Current - Supply: 13.5mA
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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MC32PF1510A6EP PF1510.pdf
MC32PF1510A6EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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S9S12GN16F0WLF MC9S12GRMV1.pdf
S9S12GN16F0WLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF51JM64EVLH MCF51JM128.pdf
MCF51JM64EVLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMA3201KEGR2 FSCLS07536-1.pdf?t.download=true&u=5oefqw
MMA3201KEGR2
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL +/-40G 20-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±45g
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 20-SOIC
Produkt ist nicht verfügbar
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MC56F8346VFVER2 MC56F8346.pdf
MC56F8346VFVER2
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 6K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 62
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8801-B0-NMDC/AZ 88W8801_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: IC RF TXRX WIFI 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 26dBm
Protocol: 802.11n/g/b
Current - Receiving: 68mA ~ 82mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 285mA ~ 359mA
Supplier Device Package: 48-HVQFN (6x6)
Modulation: DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, SDIO, UART, USB
Produkt ist nicht verfügbar
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MIMX8DX1AVOFZAC
MIMX8DX1AVOFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8DUALXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 417-FBGA (17x17)
Produkt ist nicht verfügbar
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SC705C8AE0VFNE
SC705C8AE0VFNE
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tube
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P3T1085UKZ P3T1085UK.pdf
P3T1085UKZ
Hersteller: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Features: Shutdown Mode
Packaging: Cut Tape (CT)
Package / Case: 6-XFBGA, WLCSP
Output Type: 2-Wire Serial, I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 6-WLCSP (1.18x.84)
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
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11+1.95 EUR
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25+1.51 EUR
50+1.44 EUR
100+1.38 EUR
500+1.25 EUR
1000+1.2 EUR
5000+1.11 EUR
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PCF7952XTT/C2BC21J
PCF7952XTT/C2BC21J
Hersteller: NXP USA Inc.
Description: RF TRANSMITTER UHF 24TSSOP
DigiKey Programmable: Not Verified
Supplier Device Package: 24-TSSOP
Applications: Remote Keyless Entry
Modulation or Protocol: UHF
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX353CVM5B MCIMX35SR2CEC.pdf
MCIMX353CVM5B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX351AVM4B MCIMX35SR2AEC.pdf
MCIMX351AVM4B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX357CVM5B MCIMX35SR2CEC.pdf
MCIMX357CVM5B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX355AJQ5C MCIMX35SR2AEC.pdf
MCIMX355AJQ5C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX355AVM4B MCIMX35SR2AEC.pdf
MCIMX355AVM4B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX356AJQ5C MCIMX35SR2AEC.pdf
MCIMX356AJQ5C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Produkt ist nicht verfügbar
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74AUP1G17GF132 74AUP1G17.pdf
74AUP1G17GF132
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (1x1)
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2338+0.25 EUR
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MC33FS8520A0KSR2 FS84_FS85C_DS.pdf
MC33FS8520A0KSR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS8520A0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MC33FS8510D3KSR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS8510A2KSR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS8510A0ESR2 FS84_FS85C_DS.pdf
MC33FS8510A0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS8510A0KSR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC32BC3770CSR2 MC32BC3770.pdf
MC32BC3770CSR2
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 25WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 25-WFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 25-WLCSP (2.27x2.17)
Charge Current - Max: 2A
Programmable Features: Current
Voltage - Supply (Max): 6.2V
Battery Pack Voltage: 4.475V (Max)
Current - Charging: Constant - Programmable
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MC68HC11E0CFNE3R M68HC11E.pdf
MC68HC11E0CFNE3R
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IP4338CX24/LF/P135 IP4338CX24LF.pdf
IP4338CX24/LF/P135
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
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88W8987-A2-NYEA/AK 88W8987_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
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IP4359CX4/LF-H500315 PHGLS22114-1.pdf?t.download=true&u=5oefqw
IP4359CX4/LF-H500315
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Power Line Protection: Yes
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 2
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Capacitance @ Frequency: 1.3pF @ 1MHz
Applications: DVI, HDMI, USB
Operating Temperature: -35°C ~ 85°C (TA)
Type: Steering (Rail to Rail)
Mounting Type: Surface Mount
Package / Case: 4-UFBGA, WLCSP
Packaging: Bulk
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88W8964-B0-BTWC/AK 88W8964-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: 4X4 802.11AC WAVE2 WIFI WITH BF
Packaging: Tray
Frequency: 20MHz ~ 160MHz
Type: TxRx Only
Protocol: 802.11ac
Data Rate (Max): 2.6Gbps
Modulation: 256-QAM
RF Family/Standard: WiFi
Produkt ist nicht verfügbar
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ASL5115SHV/0Y PB_ASL5xxxyHz.pdf
ASL5115SHV/0Y
Hersteller: NXP USA Inc.
Description: IC LED DRV CTRL PWM 1.5A 48HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 48-HLQFP (7x7)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Produkt ist nicht verfügbar
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MCIMX6D7CZK08AE IMX6DQCPOPEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MRF21030LR3 MRF21030.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400
Mounting Type: Chassis Mount
Frequency: 2.14GHz
Power - Output: 30W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: NI-400
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 250 mA
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MC33897CTEFR2 MC33897.pdf
MC33897CTEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MC33897CTEFR2 MC33897.pdf
MC33897CTEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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4+6.28 EUR
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S32K324EHT1MMMSR S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
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74AHC2G241DP-Q100125 74AHC_AHCT2G241_Q100.pdf
74AHC2G241DP-Q100125
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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MC908QT2AMDWE MC68HC908QY4A.pdf
MC908QT2AMDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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GTL2005PW,112 GTL2005.pdf
GTL2005PW,112
Hersteller: NXP USA Inc.
Description: IC XLTR MS BIDIR 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: LVTTL, TTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: GTL
Number of Circuits: 1
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GTL2014PW,112 GTL2014.pdf
GTL2014PW,112
Hersteller: NXP USA Inc.
Description: IC XLTR MS BIDIR 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: LVTTL
Number of Circuits: 1
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PCAL9714HNMP PCAL9714.pdf
PCAL9714HNMP
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCAL9714HNMP PCAL9714.pdf
PCAL9714HNMP
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
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PCAL9714HN/Q900MP PCAL9714.pdf
PCAL9714HN/Q900MP
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
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PCAL9714HN/Q900MP PCAL9714.pdf
PCAL9714HN/Q900MP
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
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S9S08RN16W2VTJR S9S08RN16DS.pdf
S9S08RN16W2VTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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