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74LVC16240ADGG/C4118 NXP USA Inc. 74LVC16240A.pdf Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
auf Bestellung 6093 Stücke:
Lieferzeit 10-14 Tag (e)
452+1.16 EUR
Mindestbestellmenge: 452
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MPF5020CMMACESR2 NXP USA Inc. PF5020.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34VR500VCESR2 NXP USA Inc. MC34VR500.pdf Description: REGULATOR, BUCK, QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Processor
Current - Supply: 297µA
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MX93AUD-HAT MX93AUD-HAT NXP USA Inc. MX93AUD-HAT-UM.pdf Description: ACCESSORY BOARD:AUDIO HAT
Packaging: Box
auf Bestellung 9 Stücke:
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1+231.12 EUR
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MKL36Z256VMC4 MKL36Z256VMC4 NXP USA Inc. KL36P121M48SF4.pdf Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 84
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T2080NSN8MQB NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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P3041NSE7NNC P3041NSE7NNC NXP USA Inc. P3041PB.pdf Description: IC MPU QORIQ 1.333GHZ 1295FCPBGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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SCC2692AC1A44,518 SCC2692AC1A44,518 NXP USA Inc. SCC2692.pdf Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Tape & Reel (TR)
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
Produkt ist nicht verfügbar
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SCC2692AC1A44,512 SCC2692AC1A44,512 NXP USA Inc. SCC2692.pdf Description: UART IC 2, DUART CHANNEL 44-PLCC
Packaging: Tube
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
Produkt ist nicht verfügbar
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MPC8349EVVAJDB MPC8349EVVAJDB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
auf Bestellung 24 Stücke:
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1+266.31 EUR
24+220.62 EUR
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BFT25,215 BFT25,215 NXP USA Inc. BFT25A.pdf Description: RF TRANS NPN 5V 2.3GHZ TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 30mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V
Frequency - Transition: 2.3GHz
Noise Figure (dB Typ @ f): 5.5dB @ 500MHz
Supplier Device Package: SOT-23 (TO-236AB)
auf Bestellung 4782 Stücke:
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MC33MR3003AXVKR2 NXP USA Inc. Description: RF TXRX MOD ISM>1GHZSMD
Packaging: Bulk
Package / Case: 214-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Operating Temperature: 125°C
Antenna Type: Antenna Not Included
Modulation: BPSK
RF Family/Standard: General ISM > 1GHz
Produkt ist nicht verfügbar
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74AHCT08PW/C1118 NXP USA Inc. PHGLS15178-1.pdf?t.download=true&u=5oefqw Description: AND GATE, AHCT/VHCT/VT SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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MPX2010D MPX2010D NXP USA Inc. MPX2010.pdf Description: SENSOR 1.45PSID .025V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
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1+27.79 EUR
5+25.31 EUR
10+24.39 EUR
25+23.29 EUR
40+22.77 EUR
125+21.64 EUR
500+20.46 EUR
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MC68040FE25V MC68040FE25V NXP USA Inc. MC68040UM.pdf Description: IC MPU M680X0 25MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68EC040FE40A MC68EC040FE40A NXP USA Inc. MC68040UM.pdf Description: IC MPU M680X0 40MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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PESD5V0C1UZF315 NXP USA Inc. PESD5V0C1USF.pdf Description: PESD5V0C1UZF - ULTRA LOW CAPACIT
Packaging: Bulk
auf Bestellung 171000 Stücke:
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8876+0.05 EUR
Mindestbestellmenge: 8876
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S9S08SL8F1MTLR S9S08SL8F1MTLR NXP USA Inc. Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08SL8F1MTL S9S08SL8F1MTL NXP USA Inc. Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8272CVRMIBA MPC8272CVRMIBA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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TEA1936XDB1530UL TEA1936XDB1530UL NXP USA Inc. TEA19361T.pdf Description: TEA1936X DEMOBOARD 1530
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
auf Bestellung 5 Stücke:
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1+568.52 EUR
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SAF4000EL/101Z224Y NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/101Q224Y NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q2240
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XEQ512J3VALR S912XEQ512J3VALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5603BK0MLH6 SPC5603BK0MLH6 NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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HEF4515BP,652 HEF4515BP,652 NXP USA Inc. Description: IC DECODER/DEMUX 1X4:16 24DIP
Packaging: Tube
Package / Case: 24-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 15.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 3mA
Voltage Supply Source: Dual Supply
Supplier Device Package: 24-DIP
Produkt ist nicht verfügbar
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74AUP1T58GF NXP USA Inc. PHGLS25276-1.pdf?t.download=true&u=5oefqw Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Packaging: Bulk
Features: Configurable Gate Logic Functions
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 6-XSON (1x1)
Channel Type: Unidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.8 V ~ 2.7 V
Voltage - VCCB: 2.3 V ~ 3.6 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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MCIMX6G2DVM05AB MCIMX6G2DVM05AB NXP USA Inc. IMX6ULCEC.pdf Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 1519 Stücke:
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1+27.46 EUR
10+21.82 EUR
25+20.41 EUR
152+18.51 EUR
304+18.00 EUR
608+17.58 EUR
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TEA88182HT/1J NXP USA Inc. Description: PFC CONTROLLER
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF4SAM3X84/9BA6AUJ NXP USA Inc. Description: MF4SAM3X84
Packaging: Tape & Reel (TR)
Package / Case: Module
Mounting Type: Surface Mount
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 6V
Standards: Mifare, ISO 14443, ISO 7816
Supplier Device Package: PCM1.1
Produkt ist nicht verfügbar
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LFVBBJ76ZA NXP USA Inc. Description: QORIVVA MPC5676R 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5676R
Accessory Type: Logic Analyzer
Produkt ist nicht verfügbar
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LFLAIBW1A NXP USA Inc. Description: 422 PIN 1.0MM PITCH LOGIC ANALYZ
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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LFLAIBS1A NXP USA Inc. Description: 256 PIN 1.0 MM LOGIC ANALYZER BO
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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LFVDBVLAIB NXP USA Inc. Description: VERTICAL LOGIC ANALYZER BOARD FO
Packaging: Bulk
For Use With/Related Products: MPC55xx, MPC56xx, MPC57xx
Accessory Type: Logic Analyzer
Produkt ist nicht verfügbar
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LFLAIBHT NXP USA Inc. Description: 100 PIN 0.5MM QFP LOGIC ANALYZER
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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LFLAIBLT NXP USA Inc. Description: 144 PIN 0.5MM QFP LOGIC ANALYZER
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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PCA9515AD PCA9515AD NXP USA Inc. pca9515a.pdf?t.download=true&u=5oefqw description Description: PCA9515A DUAL BIDIRECTIONAL I2C
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: I2C
Current - Supply: 500µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SOIC
Capacitance - Input: 7 pF
auf Bestellung 1509 Stücke:
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239+2.13 EUR
Mindestbestellmenge: 239
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S32K342EHT0MPAST S32K342EHT0MPAST NXP USA Inc. S32K3xx.pdf Description: S32K342, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 438 Stücke:
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1+26.35 EUR
10+24.32 EUR
25+23.29 EUR
100+21.58 EUR
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S32K310NHT0VPASR S32K310NHT0VPASR NXP USA Inc. S32K3xx.pdf Description: S32K310, 512KB FLASH, ARM M7
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
Produkt ist nicht verfügbar
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S32K310NHT0VPAST S32K310NHT0VPAST NXP USA Inc. S32K3xx.pdf Description: IC MCU 32BIT 512KB FLASH 100QFP
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
Produkt ist nicht verfügbar
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S32K312NHT0VPASR S32K312NHT0VPASR NXP USA Inc. S32K3xx.pdf Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K312NHT0VPAST S32K312NHT0VPAST NXP USA Inc. S32K3xx.pdf Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K312NHT0VPBST S32K312NHT0VPBST NXP USA Inc. S32K3xx.pdf Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PSMN3R9-60PSQ PSMN3R9-60PSQ NXP USA Inc. PSMN3R9-60PS.pdf Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 103 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5600 pF @ 25 V
Produkt ist nicht verfügbar
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PX1011BI-EL1/G,551 PX1011BI-EL1/G,551 NXP USA Inc. PX1011B.pdf Description: INTERFACE CIRCUIT, PBGA81
Packaging: Tray
Package / Case: 81-LFBGA
Mounting Type: Surface Mount
Interface: JTAG
Voltage - Supply: 1.2V
Applications: PCI Express MAX to PCI Express PHY
Supplier Device Package: 81-LFBGA (9x9)
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MKE02Z64VLD4R MKE02Z64VLD4R NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE02Z64VLD4R MKE02Z64VLD4R NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
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100+4.34 EUR
250+4.12 EUR
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MKE17Z256VLH7 MKE17Z256VLH7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE17Z256VLL7 MKE17Z256VLL7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 900 Stücke:
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2+11.65 EUR
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80+7.68 EUR
230+7.26 EUR
450+7.05 EUR
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MKE02Z16VLC4R MKE02Z16VLC4R NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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MKE15Z64VFP4R NXP USA Inc. KE1xZP48M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
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MKE02Z64VFM4R NXP USA Inc. MKE02P64M40SF0.pdf Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
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MKE02Z32VLH4R NXP USA Inc. MKE02P64M40SF0.pdf Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
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MKV11Z128VFM7R NXP USA Inc. KV11P64M75.pdf Description: KINETIS KV11: 75MHZ CORTEX-M0+ R
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
Produkt ist nicht verfügbar
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MKL27Z64VFM4R NXP USA Inc. Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE04Z64VLH4R NXP USA Inc. MKE04P80M48SF0.pdf Description: KINETIS KE04: 48MHZ CORTEX-M0+ 5
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
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MKE12Z128VLF7 MKE12Z128VLF7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
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3+5.98 EUR
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MKE13Z128VLF7 MKE13Z128VLF7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
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3+6.28 EUR
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80+4.04 EUR
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MKV10Z128VLF7R NXP USA Inc. KV11P64M75.pdf Description: KINETIS KV10: 75MHZ CORTEX-M0+ R
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
Produkt ist nicht verfügbar
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MKE17Z128VLF7 MKE17Z128VLF7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
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3+6.58 EUR
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74LVC16240ADGG/C4118 74LVC16240A.pdf
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
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452+1.16 EUR
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MPF5020CMMACESR2 PF5020.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34VR500VCESR2 MC34VR500.pdf
Hersteller: NXP USA Inc.
Description: REGULATOR, BUCK, QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Processor
Current - Supply: 297µA
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MX93AUD-HAT MX93AUD-HAT-UM.pdf
MX93AUD-HAT
Hersteller: NXP USA Inc.
Description: ACCESSORY BOARD:AUDIO HAT
Packaging: Box
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1+231.12 EUR
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MKL36Z256VMC4 KL36P121M48SF4.pdf
MKL36Z256VMC4
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 84
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T2080NSN8MQB T2080FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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P3041NSE7NNC P3041PB.pdf
P3041NSE7NNC
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.333GHZ 1295FCPBGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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SCC2692AC1A44,518 SCC2692.pdf
SCC2692AC1A44,518
Hersteller: NXP USA Inc.
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Tape & Reel (TR)
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
Produkt ist nicht verfügbar
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SCC2692AC1A44,512 SCC2692.pdf
SCC2692AC1A44,512
Hersteller: NXP USA Inc.
Description: UART IC 2, DUART CHANNEL 44-PLCC
Packaging: Tube
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
Produkt ist nicht verfügbar
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MPC8349EVVAJDB MPC8349EAEC.pdf
MPC8349EVVAJDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+266.31 EUR
24+220.62 EUR
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BFT25,215 BFT25A.pdf
BFT25,215
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 5V 2.3GHZ TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 30mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V
Frequency - Transition: 2.3GHz
Noise Figure (dB Typ @ f): 5.5dB @ 500MHz
Supplier Device Package: SOT-23 (TO-236AB)
auf Bestellung 4782 Stücke:
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MC33MR3003AXVKR2
Hersteller: NXP USA Inc.
Description: RF TXRX MOD ISM>1GHZSMD
Packaging: Bulk
Package / Case: 214-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Operating Temperature: 125°C
Antenna Type: Antenna Not Included
Modulation: BPSK
RF Family/Standard: General ISM > 1GHz
Produkt ist nicht verfügbar
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74AHCT08PW/C1118 PHGLS15178-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: AND GATE, AHCT/VHCT/VT SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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MPX2010D MPX2010.pdf
MPX2010D
Hersteller: NXP USA Inc.
Description: SENSOR 1.45PSID .025V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
auf Bestellung 1225 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+27.79 EUR
5+25.31 EUR
10+24.39 EUR
25+23.29 EUR
40+22.77 EUR
125+21.64 EUR
500+20.46 EUR
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MC68040FE25V MC68040UM.pdf
MC68040FE25V
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68EC040FE40A MC68040UM.pdf
MC68EC040FE40A
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 40MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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PESD5V0C1UZF315 PESD5V0C1USF.pdf
Hersteller: NXP USA Inc.
Description: PESD5V0C1UZF - ULTRA LOW CAPACIT
Packaging: Bulk
auf Bestellung 171000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8876+0.05 EUR
Mindestbestellmenge: 8876
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S9S08SL8F1MTLR
S9S08SL8F1MTLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08SL8F1MTL
S9S08SL8F1MTL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8272CVRMIBA MPC8272EC.pdf
MPC8272CVRMIBA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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TEA1936XDB1530UL TEA19361T.pdf
TEA1936XDB1530UL
Hersteller: NXP USA Inc.
Description: TEA1936X DEMOBOARD 1530
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+568.52 EUR
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SAF4000EL/101Z224Y
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/101Q224Y
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q2240
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XEQ512J3VALR MC9S12XEPB.pdf
S912XEQ512J3VALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5603BK0MLH6
SPC5603BK0MLH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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HEF4515BP,652
HEF4515BP,652
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1X4:16 24DIP
Packaging: Tube
Package / Case: 24-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 15.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 3mA
Voltage Supply Source: Dual Supply
Supplier Device Package: 24-DIP
Produkt ist nicht verfügbar
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74AUP1T58GF PHGLS25276-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Packaging: Bulk
Features: Configurable Gate Logic Functions
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 6-XSON (1x1)
Channel Type: Unidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.8 V ~ 2.7 V
Voltage - VCCB: 2.3 V ~ 3.6 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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MCIMX6G2DVM05AB IMX6ULCEC.pdf
MCIMX6G2DVM05AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 1519 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+27.46 EUR
10+21.82 EUR
25+20.41 EUR
152+18.51 EUR
304+18.00 EUR
608+17.58 EUR
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TEA88182HT/1J
Hersteller: NXP USA Inc.
Description: PFC CONTROLLER
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF4SAM3X84/9BA6AUJ
Hersteller: NXP USA Inc.
Description: MF4SAM3X84
Packaging: Tape & Reel (TR)
Package / Case: Module
Mounting Type: Surface Mount
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 6V
Standards: Mifare, ISO 14443, ISO 7816
Supplier Device Package: PCM1.1
Produkt ist nicht verfügbar
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LFVBBJ76ZA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5676R 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5676R
Accessory Type: Logic Analyzer
Produkt ist nicht verfügbar
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LFLAIBW1A
Hersteller: NXP USA Inc.
Description: 422 PIN 1.0MM PITCH LOGIC ANALYZ
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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LFLAIBS1A
Hersteller: NXP USA Inc.
Description: 256 PIN 1.0 MM LOGIC ANALYZER BO
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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LFVDBVLAIB
Hersteller: NXP USA Inc.
Description: VERTICAL LOGIC ANALYZER BOARD FO
Packaging: Bulk
For Use With/Related Products: MPC55xx, MPC56xx, MPC57xx
Accessory Type: Logic Analyzer
Produkt ist nicht verfügbar
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LFLAIBHT
Hersteller: NXP USA Inc.
Description: 100 PIN 0.5MM QFP LOGIC ANALYZER
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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LFLAIBLT
Hersteller: NXP USA Inc.
Description: 144 PIN 0.5MM QFP LOGIC ANALYZER
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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PCA9515AD description pca9515a.pdf?t.download=true&u=5oefqw
PCA9515AD
Hersteller: NXP USA Inc.
Description: PCA9515A DUAL BIDIRECTIONAL I2C
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: I2C
Current - Supply: 500µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SOIC
Capacitance - Input: 7 pF
auf Bestellung 1509 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
239+2.13 EUR
Mindestbestellmenge: 239
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S32K342EHT0MPAST S32K3xx.pdf
S32K342EHT0MPAST
Hersteller: NXP USA Inc.
Description: S32K342, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 438 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+26.35 EUR
10+24.32 EUR
25+23.29 EUR
100+21.58 EUR
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S32K310NHT0VPASR S32K3xx.pdf
S32K310NHT0VPASR
Hersteller: NXP USA Inc.
Description: S32K310, 512KB FLASH, ARM M7
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
Produkt ist nicht verfügbar
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S32K310NHT0VPAST S32K3xx.pdf
S32K310NHT0VPAST
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100QFP
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
Produkt ist nicht verfügbar
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S32K312NHT0VPASR S32K3xx.pdf
S32K312NHT0VPASR
Hersteller: NXP USA Inc.
Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K312NHT0VPAST S32K3xx.pdf
S32K312NHT0VPAST
Hersteller: NXP USA Inc.
Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K312NHT0VPBST S32K3xx.pdf
S32K312NHT0VPBST
Hersteller: NXP USA Inc.
Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PSMN3R9-60PSQ PSMN3R9-60PS.pdf
PSMN3R9-60PSQ
Hersteller: NXP USA Inc.
Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 103 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5600 pF @ 25 V
Produkt ist nicht verfügbar
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PX1011BI-EL1/G,551 PX1011B.pdf
PX1011BI-EL1/G,551
Hersteller: NXP USA Inc.
Description: INTERFACE CIRCUIT, PBGA81
Packaging: Tray
Package / Case: 81-LFBGA
Mounting Type: Surface Mount
Interface: JTAG
Voltage - Supply: 1.2V
Applications: PCI Express MAX to PCI Express PHY
Supplier Device Package: 81-LFBGA (9x9)
auf Bestellung 4735 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
50+17.60 EUR
Mindestbestellmenge: 50
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MKE02Z64VLD4R MKE02P64M40SF0.pdf
MKE02Z64VLD4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE02Z64VLD4R MKE02P64M40SF0.pdf
MKE02Z64VLD4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.90 EUR
10+5.23 EUR
25+4.81 EUR
100+4.34 EUR
250+4.12 EUR
500+3.99 EUR
Mindestbestellmenge: 3
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MKE17Z256VLH7 KE1xZP100M72SF1.pdf
MKE17Z256VLH7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE17Z256VLL7 KE1xZP100M72SF1.pdf
MKE17Z256VLL7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.65 EUR
10+8.98 EUR
25+8.31 EUR
80+7.68 EUR
230+7.26 EUR
450+7.05 EUR
Mindestbestellmenge: 2
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MKE02Z16VLC4R MKE02P64M40SF0.pdf
MKE02Z16VLC4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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MKE15Z64VFP4R KE1xZP48M48SF0.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5000+3.38 EUR
Mindestbestellmenge: 5000
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MKE02Z64VFM4R MKE02P64M40SF0.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5000+3.54 EUR
Mindestbestellmenge: 5000
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MKE02Z32VLH4R MKE02P64M40SF0.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1500+3.87 EUR
Mindestbestellmenge: 1500
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MKV11Z128VFM7R KV11P64M75.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KV11: 75MHZ CORTEX-M0+ R
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
Produkt ist nicht verfügbar
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MKL27Z64VFM4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE04Z64VLH4R MKE04P80M48SF0.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KE04: 48MHZ CORTEX-M0+ 5
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1500+3.96 EUR
Mindestbestellmenge: 1500
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MKE12Z128VLF7 KE1xZP100M72SF1.pdf
MKE12Z128VLF7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+5.98 EUR
10+4.54 EUR
25+4.18 EUR
80+3.83 EUR
230+3.78 EUR
Mindestbestellmenge: 3
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MKE13Z128VLF7 KE1xZP100M72SF1.pdf
MKE13Z128VLF7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1248 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.28 EUR
10+4.77 EUR
25+4.40 EUR
80+4.04 EUR
230+3.99 EUR
Mindestbestellmenge: 3
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MKV10Z128VLF7R KV11P64M75.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KV10: 75MHZ CORTEX-M0+ R
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
Produkt ist nicht verfügbar
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MKE17Z128VLF7 KE1xZP100M72SF1.pdf
MKE17Z128VLF7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.58 EUR
10+5.02 EUR
25+4.63 EUR
80+4.25 EUR
230+4.21 EUR
Mindestbestellmenge: 3
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