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MX8-DSI-OLED1A MX8-DSI-OLED1A NXP USA Inc. IMX8MDQLQIEC.pdf Description: OLED DISPLAY MIPI-DSI 1080P
Packaging: Box
Function: OLED
Type: Display
Contents: Board(s)
Utilized IC / Part: i.MX 8M Mini
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+986.20 EUR
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BZB784-C10,115 BZB784-C10,115 NXP USA Inc. PHGLS17646-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZB784-C10 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
Produkt ist nicht verfügbar
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BZB784-C4V3115 NXP USA Inc. BZB784_SERIES.pdf Description: NOW NEXPERIA BZB784-C4V3 - ZENER
Packaging: Bulk
Produkt ist nicht verfügbar
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BZB784-C4V3,115 NXP USA Inc. BZB784_SERIES.pdf Description: DIODE ZENER DUAL 4.3V SOT323
Packaging: Bulk
auf Bestellung 113500 Stücke:
Lieferzeit 10-14 Tag (e)
10452+0.05 EUR
Mindestbestellmenge: 10452
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BZB784-C2V4,115 NXP USA Inc. BZB784_SERIES.pdf Description: DIODE ZENER DUAL 2.4V SOT323
Packaging: Bulk
auf Bestellung 23500 Stücke:
Lieferzeit 10-14 Tag (e)
10452+0.05 EUR
Mindestbestellmenge: 10452
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MBC13917EPR2 MBC13917EPR2 NXP USA Inc. MBC13917.pdf Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Tape & Reel (TR)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
Produkt ist nicht verfügbar
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MBC13917EPR2 MBC13917EPR2 NXP USA Inc. MBC13917.pdf Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
Produkt ist nicht verfügbar
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S9S12VR48AACLCR S9S12VR48AACLCR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
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S9S12VR48AACLC NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
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S9S12VR48AACLFR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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S9S12VR48AACLF NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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S9S12VR48AAVLCR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
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S9S12VR48AAMLCR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
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S9S12VR48AAMLC NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
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S9S12VR48AAMLFR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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S9S12VR48AAVLC NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
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S9S12VR48AAVLFR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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S9S12VR48AAMLF NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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S9S12VR48AAVLF NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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PCA9450B-EVK NXP USA Inc. Description: PCA9450B-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
Produkt ist nicht verfügbar
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PCA9450C-EVK NXP USA Inc. Description: PCA9450C-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
Produkt ist nicht verfügbar
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PCA9450AA-EVK NXP USA Inc. getting-started-with-the-pca9450-evaluation-board:GS-PCA9450-EVK Description: PCA9450AA-EVK
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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AFLP5G25641T6 NXP USA Inc. Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 32dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 2.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
Produkt ist nicht verfügbar
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A3M40PD012T7 NXP USA Inc. Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 12-WFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: Cellular
Voltage - Supply: 3.3V
Gain: 34dB
Current - Supply: 90mA
P1dB: 25dBm
Test Frequency: 3.5GHz
Supplier Device Package: 12-PLGA (2.2x2.2)
Produkt ist nicht verfügbar
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AFLP5G35645T6 NXP USA Inc. Description: AIRFAST PRE-DRIVER MODULE, 3400-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 31.5dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 3.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
Produkt ist nicht verfügbar
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AFSC5G23E37T2 NXP USA Inc. AFSC5G23E37.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 35dB
Test Frequency: 2.3GHz, 2.4GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G26E38T2 AFSC5G26E38T2 NXP USA Inc. AFSC5G26E38.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 31V
Gain: 32dB
Current - Supply: 48mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G26F38T2 NXP USA Inc. AFSC5G26F38.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 36.7dB
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G35E38T2 NXP USA Inc. AFSC5G35E38.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 24V ~ 31V
Gain: 30.5dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G40E38T2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dB
Test Frequency: 4GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G23E39T2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G26E39T2 NXP USA Inc. AFSC5G26E39.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28dB
Current - Supply: 65mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A3M35TL039T2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dBm
Test Frequency: 3.4GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A3M39TL039T2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.6dB
Test Frequency: 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A3M37TL039T2 NXP USA Inc. A3M37TL039.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.1dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A3M34TL139T2 NXP USA Inc. A3M34TL139.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.58GHz
RF Type: LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.3GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A3M36SL039SAAT2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: Wireless LAN
Voltage - Supply: 29V
Gain: 29.8dB
Test Frequency: 3.4GHz ~ 3.8GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
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A3M36SL039IAAT2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: LTE
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.2dB
Test Frequency: 3.4GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
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A3M34SL039IAAT2 NXP USA Inc. A3M34SL039.pdf Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
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A3M38SL039IAAT2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
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A3M39SL039IAAT2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.3dB
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
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A5M39TG140T2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 32.7dB
Current - Supply: 40mA
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A5M36TG140T2 NXP USA Inc. Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.8dB
Test Frequency: 3.3GHz ~ 3.8GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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74AUP1G885GN115 NXP USA Inc. 74AUP1G885.pdf Description: NOW NEXPERIA 74AUP1G885GN - XOR
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (1.2x1)
Number of Circuits: 1
Produkt ist nicht verfügbar
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PCF85103C-2T/00:11 PCF85103C-2T/00:11 NXP USA Inc. PCF85103C-2.pdf Description: IC EEPROM 2KBIT I2C 100KHZ 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6.0V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68030CRC25C MC68030CRC25C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030CRC33C MC68030CRC33C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 33MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030FE16C MC68030FE16C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 166MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030FE20C MC68030FE20C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 20MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030RC16C MC68030RC16C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 166MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030RC25C MC68030RC25C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030RC50C MC68030RC50C NXP USA Inc. MC68030UM.pdf Description: IC MPU M680X0 50MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 50MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68040RC25V NXP USA Inc. MC68040UM.pdf Description: IC MPU M680X0 25MHZ 182PGA
Packaging: Tray
Package / Case: 182-BEPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 182-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC33FS8500A0KSR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS8500A0ESR2 MC33FS8500A0ESR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MFS8600BMBA0ESR2 MFS8600BMBA0ESR2 NXP USA Inc. FS8600_SDS.pdf Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS8600BMDA0ESR2 MFS8600BMDA0ESR2 NXP USA Inc. FS8600_SDS.pdf Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS8600BMBA0ES MFS8600BMBA0ES NXP USA Inc. FS8600_SDS.pdf?pspll=1 Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.62 EUR
10+8.97 EUR
25+8.31 EUR
100+7.58 EUR
260+7.22 EUR
Mindestbestellmenge: 2
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MFS8600BMDA0ES MFS8600BMDA0ES NXP USA Inc. FS8600_SDS.pdf?pspll=1 Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.94 EUR
10+10.02 EUR
25+9.29 EUR
100+8.48 EUR
260+8.09 EUR
Mindestbestellmenge: 2
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PTN3393BS/F1Y PTN3393BS/F1Y NXP USA Inc. PTN3393.pdf Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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MX8-DSI-OLED1A IMX8MDQLQIEC.pdf
MX8-DSI-OLED1A
Hersteller: NXP USA Inc.
Description: OLED DISPLAY MIPI-DSI 1080P
Packaging: Box
Function: OLED
Type: Display
Contents: Board(s)
Utilized IC / Part: i.MX 8M Mini
auf Bestellung 3 Stücke:
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Anzahl Preis
1+986.20 EUR
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BZB784-C10,115 PHGLS17646-1.pdf?t.download=true&u=5oefqw
BZB784-C10,115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C10 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
Produkt ist nicht verfügbar
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BZB784-C4V3115 BZB784_SERIES.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C4V3 - ZENER
Packaging: Bulk
Produkt ist nicht verfügbar
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BZB784-C4V3,115 BZB784_SERIES.pdf
Hersteller: NXP USA Inc.
Description: DIODE ZENER DUAL 4.3V SOT323
Packaging: Bulk
auf Bestellung 113500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10452+0.05 EUR
Mindestbestellmenge: 10452
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BZB784-C2V4,115 BZB784_SERIES.pdf
Hersteller: NXP USA Inc.
Description: DIODE ZENER DUAL 2.4V SOT323
Packaging: Bulk
auf Bestellung 23500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10452+0.05 EUR
Mindestbestellmenge: 10452
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MBC13917EPR2 MBC13917.pdf
MBC13917EPR2
Hersteller: NXP USA Inc.
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Tape & Reel (TR)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
Produkt ist nicht verfügbar
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MBC13917EPR2 MBC13917.pdf
MBC13917EPR2
Hersteller: NXP USA Inc.
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
Produkt ist nicht verfügbar
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S9S12VR48AACLCR
S9S12VR48AACLCR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
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S9S12VR48AACLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
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S9S12VR48AACLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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S9S12VR48AACLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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S9S12VR48AAVLCR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
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S9S12VR48AAMLCR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
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S9S12VR48AAMLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
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S9S12VR48AAMLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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S9S12VR48AAVLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
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S9S12VR48AAVLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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S9S12VR48AAMLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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S9S12VR48AAVLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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PCA9450B-EVK
Hersteller: NXP USA Inc.
Description: PCA9450B-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
Produkt ist nicht verfügbar
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PCA9450C-EVK
Hersteller: NXP USA Inc.
Description: PCA9450C-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
Produkt ist nicht verfügbar
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PCA9450AA-EVK getting-started-with-the-pca9450-evaluation-board:GS-PCA9450-EVK
Hersteller: NXP USA Inc.
Description: PCA9450AA-EVK
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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AFLP5G25641T6
Hersteller: NXP USA Inc.
Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 32dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 2.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
Produkt ist nicht verfügbar
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A3M40PD012T7
Hersteller: NXP USA Inc.
Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 12-WFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: Cellular
Voltage - Supply: 3.3V
Gain: 34dB
Current - Supply: 90mA
P1dB: 25dBm
Test Frequency: 3.5GHz
Supplier Device Package: 12-PLGA (2.2x2.2)
Produkt ist nicht verfügbar
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AFLP5G35645T6
Hersteller: NXP USA Inc.
Description: AIRFAST PRE-DRIVER MODULE, 3400-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 31.5dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 3.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
Produkt ist nicht verfügbar
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AFSC5G23E37T2 AFSC5G23E37.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 35dB
Test Frequency: 2.3GHz, 2.4GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G26E38T2 AFSC5G26E38.pdf
AFSC5G26E38T2
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 31V
Gain: 32dB
Current - Supply: 48mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G26F38T2 AFSC5G26F38.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 36.7dB
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G35E38T2 AFSC5G35E38.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 24V ~ 31V
Gain: 30.5dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G40E38T2
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dB
Test Frequency: 4GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G23E39T2
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G26E39T2 AFSC5G26E39.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28dB
Current - Supply: 65mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A3M35TL039T2
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dBm
Test Frequency: 3.4GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A3M39TL039T2
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.6dB
Test Frequency: 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A3M37TL039T2 A3M37TL039.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.1dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A3M34TL139T2 A3M34TL139.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.58GHz
RF Type: LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.3GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A3M36SL039SAAT2
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: Wireless LAN
Voltage - Supply: 29V
Gain: 29.8dB
Test Frequency: 3.4GHz ~ 3.8GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
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A3M36SL039IAAT2
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: LTE
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.2dB
Test Frequency: 3.4GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
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A3M34SL039IAAT2 A3M34SL039.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
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A3M38SL039IAAT2
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
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A3M39SL039IAAT2
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.3dB
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
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A5M39TG140T2
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 32.7dB
Current - Supply: 40mA
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A5M36TG140T2
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.8dB
Test Frequency: 3.3GHz ~ 3.8GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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74AUP1G885GN115 74AUP1G885.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AUP1G885GN - XOR
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (1.2x1)
Number of Circuits: 1
Produkt ist nicht verfügbar
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PCF85103C-2T/00:11 PCF85103C-2.pdf
PCF85103C-2T/00:11
Hersteller: NXP USA Inc.
Description: IC EEPROM 2KBIT I2C 100KHZ 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6.0V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68030CRC25C MC68030UM.pdf
MC68030CRC25C
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030CRC33C MC68030UM.pdf
MC68030CRC33C
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 33MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030FE16C MC68030UM.pdf
MC68030FE16C
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 166MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030FE20C MC68030UM.pdf
MC68030FE20C
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030RC16C MC68030UM.pdf
MC68030RC16C
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 166MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030RC25C MC68030UM.pdf
MC68030RC25C
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68030RC50C MC68030UM.pdf
MC68030RC50C
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 50MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 50MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68040RC25V MC68040UM.pdf
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 182PGA
Packaging: Tray
Package / Case: 182-BEPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 182-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC33FS8500A0KSR2 FS84_FS85C_DS.pdf
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS8500A0ESR2 FS84_FS85C_DS.pdf
MC33FS8500A0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MFS8600BMBA0ESR2 FS8600_SDS.pdf
MFS8600BMBA0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS8600BMDA0ESR2 FS8600_SDS.pdf
MFS8600BMDA0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS8600BMBA0ES FS8600_SDS.pdf?pspll=1
MFS8600BMBA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.62 EUR
10+8.97 EUR
25+8.31 EUR
100+7.58 EUR
260+7.22 EUR
Mindestbestellmenge: 2
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MFS8600BMDA0ES FS8600_SDS.pdf?pspll=1
MFS8600BMDA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.94 EUR
10+10.02 EUR
25+9.29 EUR
100+8.48 EUR
260+8.09 EUR
Mindestbestellmenge: 2
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PTN3393BS/F1Y PTN3393.pdf
PTN3393BS/F1Y
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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