Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34444) > Seite 509 nach 575

Wählen Sie Seite:   [  << Vorherige Seite ]  1 57 114 171 228 285 342 399 456 504 505 506 507 508 509 510 511 512 513 514 570 575  [ Nächste Seite >> ]
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
ohne MwSt
MKL05Z32VLF4 MKL05Z32VLF4 NXP USA Inc. KL05P48M48SF1.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.63 EUR
10+ 8.29 EUR
Mindestbestellmenge: 2
S9KEAZN8AMFKR S9KEAZN8AMFKR NXP USA Inc. Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
5000+2.6 EUR
Mindestbestellmenge: 5000
S9KEAZN8AMFKR S9KEAZN8AMFKR NXP USA Inc. Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
3+5.9 EUR
10+ 4.61 EUR
100+ 3.7 EUR
500+ 3.5 EUR
1000+ 2.9 EUR
2500+ 2.7 EUR
Mindestbestellmenge: 3
PEMI2STD/WG,115 PEMI2STD/WG,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/11PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 11pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Produkt ist nicht verfügbar
PTN3222CUKZ PTN3222CUKZ NXP USA Inc. PTN3222_CUK.pdf Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
8000+1.43 EUR
Mindestbestellmenge: 8000
PTN3222CUKZ PTN3222CUKZ NXP USA Inc. PTN3222_CUK.pdf Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.26 EUR
Mindestbestellmenge: 6
Z0107NA,116 Z0107NA,116 NXP USA Inc. WEEN-S-A0001703492-1.pdf?t.download=true&u=5oefqw Description: TRIAC SENS GATE 800V 1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 8.5A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Supplier Device Package: TO-92-3
Part Status: Active
Current - On State (It (RMS)) (Max): 1 A
Voltage - Off State: 800 V
auf Bestellung 99890 Stücke:
Lieferzeit 10-14 Tag (e)
2699+0.18 EUR
Mindestbestellmenge: 2699
74ABT652AD,118 74ABT652AD,118 NXP USA Inc. 74ABT652A.pdf Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
452+1.16 EUR
Mindestbestellmenge: 452
74LVC32245AEC,551 74LVC32245AEC,551 NXP USA Inc. PHGLS23919-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
auf Bestellung 5700 Stücke:
Lieferzeit 10-14 Tag (e)
89+5.95 EUR
Mindestbestellmenge: 89
74LVC32245AEC,518 74LVC32245AEC,518 NXP USA Inc. PHGLS23919-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
auf Bestellung 80605 Stücke:
Lieferzeit 10-14 Tag (e)
89+5.95 EUR
Mindestbestellmenge: 89
MPXHZ6116A6U MPXHZ6116A6U NXP USA Inc. MPXHZ6116A.pdf Description: SENSOR 16.68PSIA 4.645V 8SSOP
Packaging: Tube
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.399 V ~ 4.645 V
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
MPXHZ6116A6T1 MPXHZ6116A6T1 NXP USA Inc. MPXHZ6116A.pdf Description: SENSOR 16.68PSIA 4.645V 8SSOP
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.399 V ~ 4.645 V
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
Produkt ist nicht verfügbar
STMP3770XXBJEA3N NXP USA Inc. Description: STMP3770XXBJEA3N
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
STMP3770XXLAEA3N NXP USA Inc. Description: STMP3770XXLAEA3N
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
74LVC1G3157GM,132 74LVC1G3157GM,132 NXP USA Inc. PHGLS25912-1.pdf?t.download=true&u=5oefqw Description: IC SWITCH SPDT X 1 10OHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 6-XSON (1.45x1)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Switch Time (Ton, Toff) (Max): 4ns, 3.5ns
Channel Capacitance (CS(off), CD(off)): 6pF
Current - Leakage (IS(off)) (Max): 5µA
Part Status: Active
Number of Circuits: 1
auf Bestellung 60636 Stücke:
Lieferzeit 10-14 Tag (e)
2659+0.18 EUR
Mindestbestellmenge: 2659
LX2160XN72232B LX2160XN72232B NXP USA Inc. Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)
1+1306.85 EUR
MPC8560VTAQFC MPC8560VTAQFC NXP USA Inc. DS_568_mpc8560.pdf Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART
Produkt ist nicht verfügbar
MPC8248VRTMFA MPC8248VRTMFA NXP USA Inc. FSCLS05947-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC82XX 400MHZ 516FPBGA
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-FPBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
auf Bestellung 266 Stücke:
Lieferzeit 10-14 Tag (e)
4+163.26 EUR
Mindestbestellmenge: 4
MC9S08GT8ACFBE MC9S08GT8ACFBE NXP USA Inc. MC9S08GT16A.pdf Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74LVC1G66GS,132 74LVC1G66GS,132 NXP USA Inc. PHGL-S-A0000283116-1.pdf?t.download=true&u=5oefqw Description: IC SWITCH SPST-NOX1 10OHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 500MHz
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 4.2ns, 5ns
Channel Capacitance (CS(off), CD(off)): 6.5pF
Current - Leakage (IS(off)) (Max): 5µA
Number of Circuits: 1
auf Bestellung 1311689 Stücke:
Lieferzeit 10-14 Tag (e)
3985+0.13 EUR
Mindestbestellmenge: 3985
NCF29A1XHN/0500IJ NCF29A1XHN/0500IJ NXP USA Inc. Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
NCF29A1XHN/0500IJ NCF29A1XHN/0500IJ NXP USA Inc. Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 5970 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.72 EUR
10+ 14.2 EUR
25+ 13.54 EUR
100+ 11.76 EUR
250+ 11.23 EUR
500+ 10.24 EUR
1000+ 8.92 EUR
Mindestbestellmenge: 2
PESD5V0L5UV/DG125 PESD5V0L5UV/DG125 NXP USA Inc. PHGLS15257-1.pdf?t.download=true&u=5oefqw Description: TVS DIODE
Packaging: Bulk
auf Bestellung 7049119 Stücke:
Lieferzeit 10-14 Tag (e)
1902+0.27 EUR
Mindestbestellmenge: 1902
KITPF5200SKTEVM NXP USA Inc. getting-started-with-the-kitpf5200sktevm-evaluation-board:GS-KITPF5200SKTEVM Description: PF5200 CONFIG TOOL 32-QFN
Packaging: Box
Function: Automotive
Type: Power Management
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Embedded: Yes, MCU
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+624.08 EUR
SAF776DEL/200SK NXP USA Inc. Description: SAF776DEL
Packaging: Tray
Produkt ist nicht verfügbar
MRF8S9120NR3 MRF8S9120NR3 NXP USA Inc. MRF8S9120N.pdf Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 33W
Gain: 19.8dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
MRF8S9120NR3 MRF8S9120NR3 NXP USA Inc. MRF8S9120N.pdf Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Cut Tape (CT)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 33W
Gain: 19.8dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 800 mA
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+128.97 EUR
KC13237CHT NXP USA Inc. Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
PCK351DB,112 PCK351DB,112 NXP USA Inc. PCK351.pdf Description: IC CLK BUFFER 1:10 125MHZ 24SSOP
Packaging: Tube
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVTTL
Type: Fanout Buffer (Distribution)
Input: LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:10
Differential - Input:Output: No/No
Supplier Device Package: 24-SSOP
Frequency - Max: 125 MHz
auf Bestellung 654 Stücke:
Lieferzeit 10-14 Tag (e)
212+2.5 EUR
Mindestbestellmenge: 212
74HC4050DB,112 74HC4050DB,112 NXP USA Inc. PHGL-S-A0001459877-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74HC4050DB - BUFFER
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 6
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SSOP
auf Bestellung 3627 Stücke:
Lieferzeit 10-14 Tag (e)
807+0.61 EUR
Mindestbestellmenge: 807
NT2H1001G0DUDV NXP USA Inc. NT2L1001_NT2H1001.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: Die
Produkt ist nicht verfügbar
NCF3340AHN/00330Y NCF3340AHN/00330Y NXP USA Inc. Description: AUTOMOTIVE QUALIFIED NFC CONTROL
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 24.12MHz
Interface: I²C, SPI
Type: RFID Reader/Transponder
Voltage - Supply: 2.3V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
NCJ3340AHN/00330Y NXP USA Inc. Description: NFC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
74ABT74DB,112 74ABT74DB,112 NXP USA Inc. 74ABT74.pdf Description: IC DUAL D-TYPE F-F 14-SSOP
Packaging: Tube
auf Bestellung 756 Stücke:
Lieferzeit 10-14 Tag (e)
523+1 EUR
Mindestbestellmenge: 523
1N4748A,133 1N4748A,133 NXP USA Inc. PHGLS20363-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 22V 1W DO41
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 23 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 16.7 V
auf Bestellung 54080 Stücke:
Lieferzeit 10-14 Tag (e)
9072+0.049 EUR
Mindestbestellmenge: 9072
MC56F8013VFAE MC56F8013VFAE NXP USA Inc. MC56F8013.pdf Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 3052 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.02 EUR
10+ 17.59 EUR
80+ 14.86 EUR
440+ 14.77 EUR
LFBGAINTPU3A NXP USA Inc. Description: NXP LEAD FREE 324 PIN 1.0 MM PIT
Packaging: Bulk
Produkt ist nicht verfügbar
LFBGAINTPY2A NXP USA Inc. Description: 473 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
LFBGAINTPT5A NXP USA Inc. Description: NXP LEAD FREE 269 PIN. 0.80 MM P
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
LFBGAINTPS1A NXP USA Inc. Description: 256 PIN 1.0MM BGA TO PGA ADAPTER
Packaging: Bulk
Produkt ist nicht verfügbar
LFBGAINTPH1A NXP USA Inc. Description: 100 PIN 1.0MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
LFBGAINTPV1A NXP USA Inc. Description: 356 PIN 0.8 MM BGA TO PGA ADAPTE
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
LFBGAINTPS2A NXP USA Inc. Description: 252 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
LFBGAINTPT3A NXP USA Inc. Description: 257 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
LFBGAINTPT4A NXP USA Inc. Description: 292 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
LFBGAINTPZ3A NXP USA Inc. Description: 512 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
LFBGAINTJ33QLT NXP USA Inc. Description: 208 PIN 1.0MM PGA TO 144 PIN 0.5
Packaging: Bulk
For Use With/Related Products: MPC563x
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
MPC8270VVUPEA MPC8270VVUPEA NXP USA Inc. MPC8280EC.pdf Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+315.29 EUR
S912XDG128F2MAL S912XDG128F2MAL NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEA1938T/1J TEA1938T/1J NXP USA Inc. Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 17.5 V
Control Features: EN, Soft Start
Produkt ist nicht verfügbar
HT2ICS2002W/V6F/RZ NXP USA Inc. Description: HITAG 2 TRANSPONDER IC
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: -0.5V ~ 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
MC908QVY4CDWER NXP USA Inc. PHGL-S-A0002263340-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
132+6.69 EUR
Mindestbestellmenge: 132
MC908JL8MDWE MC908JL8MDWE NXP USA Inc. MC68HC908JL8.pdf Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 5092 Stücke:
Lieferzeit 10-14 Tag (e)
203+4.35 EUR
Mindestbestellmenge: 203
MC908JK8MDWE MC908JK8MDWE NXP USA Inc. MC68HC908JL8.pdf Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
auf Bestellung 4522 Stücke:
Lieferzeit 10-14 Tag (e)
167+5.28 EUR
Mindestbestellmenge: 167
MC908EY8AMFJE MC908EY8AMFJE NXP USA Inc. MC68HC908EY16A.pdf Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 5439 Stücke:
Lieferzeit 10-14 Tag (e)
130+6.81 EUR
Mindestbestellmenge: 130
MC908LK24CFUE MC908LK24CFUE NXP USA Inc. MC68HC908LJ24.pdf Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I²C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 2688 Stücke:
Lieferzeit 10-14 Tag (e)
79+11.16 EUR
Mindestbestellmenge: 79
MC908JL16CDWE MC908JL16CDWE NXP USA Inc. MC68HC908JL16.pdf Description: IC MCU 8BIT 16KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 1594 Stücke:
Lieferzeit 10-14 Tag (e)
69+12.92 EUR
Mindestbestellmenge: 69
MC908GT16CFBER MC908GT16CFBER NXP USA Inc. MC68HC908GT16.pdf Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 1470 Stücke:
Lieferzeit 10-14 Tag (e)
60+14.68 EUR
Mindestbestellmenge: 60
MC908GT16CFBE MC908GT16CFBE NXP USA Inc. MC68HC908GT16.pdf Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Bulk
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 110 Stücke:
Lieferzeit 10-14 Tag (e)
60+14.68 EUR
Mindestbestellmenge: 60
MC908AP8CFAE MC908AP8CFAE NXP USA Inc. MC68HC908AP64.pdf Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKL05Z32VLF4 KL05P48M48SF1.pdf
MKL05Z32VLF4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.63 EUR
10+ 8.29 EUR
Mindestbestellmenge: 2
S9KEAZN8AMFKR
S9KEAZN8AMFKR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5000+2.6 EUR
Mindestbestellmenge: 5000
S9KEAZN8AMFKR
S9KEAZN8AMFKR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+5.9 EUR
10+ 4.61 EUR
100+ 3.7 EUR
500+ 3.5 EUR
1000+ 2.9 EUR
2500+ 2.7 EUR
Mindestbestellmenge: 3
PEMI2STD/WG,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/WG,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/11PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 11pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Produkt ist nicht verfügbar
PTN3222CUKZ PTN3222_CUK.pdf
PTN3222CUKZ
Hersteller: NXP USA Inc.
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
8000+1.43 EUR
Mindestbestellmenge: 8000
PTN3222CUKZ PTN3222_CUK.pdf
PTN3222CUKZ
Hersteller: NXP USA Inc.
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+3.26 EUR
Mindestbestellmenge: 6
Z0107NA,116 WEEN-S-A0001703492-1.pdf?t.download=true&u=5oefqw
Z0107NA,116
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 800V 1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 8.5A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Supplier Device Package: TO-92-3
Part Status: Active
Current - On State (It (RMS)) (Max): 1 A
Voltage - Off State: 800 V
auf Bestellung 99890 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2699+0.18 EUR
Mindestbestellmenge: 2699
74ABT652AD,118 74ABT652A.pdf
74ABT652AD,118
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
452+1.16 EUR
Mindestbestellmenge: 452
74LVC32245AEC,551 PHGLS23919-1.pdf?t.download=true&u=5oefqw
74LVC32245AEC,551
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
auf Bestellung 5700 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
89+5.95 EUR
Mindestbestellmenge: 89
74LVC32245AEC,518 PHGLS23919-1.pdf?t.download=true&u=5oefqw
74LVC32245AEC,518
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
auf Bestellung 80605 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
89+5.95 EUR
Mindestbestellmenge: 89
MPXHZ6116A6U MPXHZ6116A.pdf
MPXHZ6116A6U
Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Packaging: Tube
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.399 V ~ 4.645 V
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
MPXHZ6116A6T1 MPXHZ6116A.pdf
MPXHZ6116A6T1
Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.399 V ~ 4.645 V
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
Produkt ist nicht verfügbar
STMP3770XXBJEA3N
Hersteller: NXP USA Inc.
Description: STMP3770XXBJEA3N
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
STMP3770XXLAEA3N
Hersteller: NXP USA Inc.
Description: STMP3770XXLAEA3N
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
74LVC1G3157GM,132 PHGLS25912-1.pdf?t.download=true&u=5oefqw
74LVC1G3157GM,132
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 10OHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 6-XSON (1.45x1)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Switch Time (Ton, Toff) (Max): 4ns, 3.5ns
Channel Capacitance (CS(off), CD(off)): 6pF
Current - Leakage (IS(off)) (Max): 5µA
Part Status: Active
Number of Circuits: 1
auf Bestellung 60636 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2659+0.18 EUR
Mindestbestellmenge: 2659
LX2160XN72232B
LX2160XN72232B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+1306.85 EUR
MPC8560VTAQFC DS_568_mpc8560.pdf
MPC8560VTAQFC
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART
Produkt ist nicht verfügbar
MPC8248VRTMFA FSCLS05947-1.pdf?t.download=true&u=5oefqw
MPC8248VRTMFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ 516FPBGA
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-FPBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
auf Bestellung 266 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+163.26 EUR
Mindestbestellmenge: 4
MC9S08GT8ACFBE MC9S08GT16A.pdf
MC9S08GT8ACFBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74LVC1G66GS,132 PHGL-S-A0000283116-1.pdf?t.download=true&u=5oefqw
74LVC1G66GS,132
Hersteller: NXP USA Inc.
Description: IC SWITCH SPST-NOX1 10OHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 500MHz
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 4.2ns, 5ns
Channel Capacitance (CS(off), CD(off)): 6.5pF
Current - Leakage (IS(off)) (Max): 5µA
Number of Circuits: 1
auf Bestellung 1311689 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3985+0.13 EUR
Mindestbestellmenge: 3985
NCF29A1XHN/0500IJ
NCF29A1XHN/0500IJ
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
NCF29A1XHN/0500IJ
NCF29A1XHN/0500IJ
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 5970 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+15.72 EUR
10+ 14.2 EUR
25+ 13.54 EUR
100+ 11.76 EUR
250+ 11.23 EUR
500+ 10.24 EUR
1000+ 8.92 EUR
Mindestbestellmenge: 2
PESD5V0L5UV/DG125 PHGLS15257-1.pdf?t.download=true&u=5oefqw
PESD5V0L5UV/DG125
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
auf Bestellung 7049119 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1902+0.27 EUR
Mindestbestellmenge: 1902
KITPF5200SKTEVM getting-started-with-the-kitpf5200sktevm-evaluation-board:GS-KITPF5200SKTEVM
Hersteller: NXP USA Inc.
Description: PF5200 CONFIG TOOL 32-QFN
Packaging: Box
Function: Automotive
Type: Power Management
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Embedded: Yes, MCU
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+624.08 EUR
SAF776DEL/200SK
Hersteller: NXP USA Inc.
Description: SAF776DEL
Packaging: Tray
Produkt ist nicht verfügbar
MRF8S9120NR3 MRF8S9120N.pdf
MRF8S9120NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 33W
Gain: 19.8dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
MRF8S9120NR3 MRF8S9120N.pdf
MRF8S9120NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Cut Tape (CT)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 33W
Gain: 19.8dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 800 mA
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+128.97 EUR
KC13237CHT
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
PCK351DB,112 PCK351.pdf
PCK351DB,112
Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 1:10 125MHZ 24SSOP
Packaging: Tube
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVTTL
Type: Fanout Buffer (Distribution)
Input: LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:10
Differential - Input:Output: No/No
Supplier Device Package: 24-SSOP
Frequency - Max: 125 MHz
auf Bestellung 654 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
212+2.5 EUR
Mindestbestellmenge: 212
74HC4050DB,112 PHGL-S-A0001459877-1.pdf?t.download=true&u=5oefqw
74HC4050DB,112
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HC4050DB - BUFFER
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 6
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SSOP
auf Bestellung 3627 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
807+0.61 EUR
Mindestbestellmenge: 807
NT2H1001G0DUDV NT2L1001_NT2H1001.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: Die
Produkt ist nicht verfügbar
NCF3340AHN/00330Y
NCF3340AHN/00330Y
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE QUALIFIED NFC CONTROL
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 24.12MHz
Interface: I²C, SPI
Type: RFID Reader/Transponder
Voltage - Supply: 2.3V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
NCJ3340AHN/00330Y
Hersteller: NXP USA Inc.
Description: NFC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
74ABT74DB,112 74ABT74.pdf
74ABT74DB,112
Hersteller: NXP USA Inc.
Description: IC DUAL D-TYPE F-F 14-SSOP
Packaging: Tube
auf Bestellung 756 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
523+1 EUR
Mindestbestellmenge: 523
1N4748A,133 PHGLS20363-1.pdf?t.download=true&u=5oefqw
1N4748A,133
Hersteller: NXP USA Inc.
Description: DIODE ZENER 22V 1W DO41
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 23 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 16.7 V
auf Bestellung 54080 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9072+0.049 EUR
Mindestbestellmenge: 9072
MC56F8013VFAE MC56F8013.pdf
MC56F8013VFAE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 3052 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+22.02 EUR
10+ 17.59 EUR
80+ 14.86 EUR
440+ 14.77 EUR
LFBGAINTPU3A
Hersteller: NXP USA Inc.
Description: NXP LEAD FREE 324 PIN 1.0 MM PIT
Packaging: Bulk
Produkt ist nicht verfügbar
LFBGAINTPY2A
Hersteller: NXP USA Inc.
Description: 473 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
LFBGAINTPT5A
Hersteller: NXP USA Inc.
Description: NXP LEAD FREE 269 PIN. 0.80 MM P
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
LFBGAINTPS1A
Hersteller: NXP USA Inc.
Description: 256 PIN 1.0MM BGA TO PGA ADAPTER
Packaging: Bulk
Produkt ist nicht verfügbar
LFBGAINTPH1A
Hersteller: NXP USA Inc.
Description: 100 PIN 1.0MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
LFBGAINTPV1A
Hersteller: NXP USA Inc.
Description: 356 PIN 0.8 MM BGA TO PGA ADAPTE
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
LFBGAINTPS2A
Hersteller: NXP USA Inc.
Description: 252 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
LFBGAINTPT3A
Hersteller: NXP USA Inc.
Description: 257 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
LFBGAINTPT4A
Hersteller: NXP USA Inc.
Description: 292 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
LFBGAINTPZ3A
Hersteller: NXP USA Inc.
Description: 512 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
LFBGAINTJ33QLT
Hersteller: NXP USA Inc.
Description: 208 PIN 1.0MM PGA TO 144 PIN 0.5
Packaging: Bulk
For Use With/Related Products: MPC563x
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
MPC8270VVUPEA MPC8280EC.pdf
MPC8270VVUPEA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+315.29 EUR
S912XDG128F2MAL
S912XDG128F2MAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEA1938T/1J
TEA1938T/1J
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 17.5 V
Control Features: EN, Soft Start
Produkt ist nicht verfügbar
HT2ICS2002W/V6F/RZ
Hersteller: NXP USA Inc.
Description: HITAG 2 TRANSPONDER IC
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: -0.5V ~ 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
MC908QVY4CDWER PHGL-S-A0002263340-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
132+6.69 EUR
Mindestbestellmenge: 132
MC908JL8MDWE MC68HC908JL8.pdf
MC908JL8MDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 5092 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
203+4.35 EUR
Mindestbestellmenge: 203
MC908JK8MDWE MC68HC908JL8.pdf
MC908JK8MDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
auf Bestellung 4522 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
167+5.28 EUR
Mindestbestellmenge: 167
MC908EY8AMFJE MC68HC908EY16A.pdf
MC908EY8AMFJE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 5439 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
130+6.81 EUR
Mindestbestellmenge: 130
MC908LK24CFUE MC68HC908LJ24.pdf
MC908LK24CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I²C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 2688 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
79+11.16 EUR
Mindestbestellmenge: 79
MC908JL16CDWE MC68HC908JL16.pdf
MC908JL16CDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 1594 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
69+12.92 EUR
Mindestbestellmenge: 69
MC908GT16CFBER MC68HC908GT16.pdf
MC908GT16CFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 1470 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
60+14.68 EUR
Mindestbestellmenge: 60
MC908GT16CFBE MC68HC908GT16.pdf
MC908GT16CFBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Bulk
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 110 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
60+14.68 EUR
Mindestbestellmenge: 60
MC908AP8CFAE MC68HC908AP64.pdf
MC908AP8CFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Wählen Sie Seite:   [  << Vorherige Seite ]  1 57 114 171 228 285 342 399 456 504 505 506 507 508 509 510 511 512 513 514 570 575  [ Nächste Seite >> ]