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LPC1110FD20Y NXP USA Inc. LPC111X.pdf Description: SCALABLE ENTRY LEVEL 32-BIT MICR
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-SO
Number of I/O: 16
Produkt ist nicht verfügbar
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LPC1112FD20/102Y NXP USA Inc. LPC111X.pdf Description: SCALABLE ENTRY LEVEL 32-BIT MICR
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-SO
Number of I/O: 16
Produkt ist nicht verfügbar
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LPC11U68JBD64Y NXP USA Inc. LPC11U6X.pdf Description: SCALABLE ENTRY LEVEL 32-BIT MICR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 48
Produkt ist nicht verfügbar
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MC9S08QE4CTGR MC9S08QE4CTGR NXP USA Inc. MC9S08QE8.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1021CAG4AR MIMXRT1021CAG4AR NXP USA Inc. IMXRT1020IEC.pdf Description: IC MCU 32BIT 96KB ROM 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
Produkt ist nicht verfügbar
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LS1088AXN7MQA LS1088AXN7MQA NXP USA Inc. LS1088AFS.pdf Description: IC MPU QORIQ 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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NX3L4053HR-Q100115 NX3L4053HR-Q100115 NXP USA Inc. PHGLS28082-1.pdf?t.download=true&u=5oefqw Description: MULTIPLEXERS/SWITCHES, 3 FUNC, C
Packaging: Bulk
auf Bestellung 1350 Stücke:
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567+0.88 EUR
Mindestbestellmenge: 567
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74ABT373AD,112 74ABT373AD,112 NXP USA Inc. 74ABT373A.pdf Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.6ns
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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MCIMX-MF0810 NXP USA Inc. Description: MCIMX-MF0810
Packaging: Bulk
Produkt ist nicht verfügbar
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BZX84-B33/DG/B2215 BZX84-B33/DG/B2215 NXP USA Inc. BZX84_SER.pdf Description: DIODE ZENER
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: TO-236AB
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
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8876+0.05 EUR
Mindestbestellmenge: 8876
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BZX84-B33/LF1R BZX84-B33/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 33V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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74LVC162244ADGG,112 74LVC162244ADGG,112 NXP USA Inc. NEXP-S-A0003105656-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74LVC162244ADGG - B
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Produkt ist nicht verfügbar
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74ALVCH16374DGG112 74ALVCH16374DGG112 NXP USA Inc. 74ALVCH16374.pdf Description: IC FF D-TYPE DBL 8-BIT 48-TSSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 48-TSSOP
Max Propagation Delay @ V, Max CL: 3.4ns @ 3.3V, 50pF
Number of Bits per Element: 8
auf Bestellung 6795 Stücke:
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456+1.02 EUR
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MK80FN256VDC15 MK80FN256VDC15 NXP USA Inc. K80P121M150SF5.pdf Description: IC MCU 32BIT 256KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 2x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 87
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFT05MS004-200M NXP USA Inc. AFT05MS004N.pdf Description: RF MOSFET
Packaging: Bulk
Produkt ist nicht verfügbar
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BAP64-05W,135 BAP64-05W,135 NXP USA Inc. BAP64-04W.pdf Description: RF DIODE PIN 100V 240MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 100V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
Produkt ist nicht verfügbar
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BAP64-05W,135 BAP64-05W,135 NXP USA Inc. BAP64-04W.pdf Description: RF DIODE PIN 100V 240MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 100V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
auf Bestellung 4940 Stücke:
Lieferzeit 10-14 Tag (e)
46+0.39 EUR
67+0.26 EUR
76+0.23 EUR
100+0.2 EUR
250+0.18 EUR
500+0.17 EUR
2500+0.16 EUR
Mindestbestellmenge: 46
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MC68HCP11E0FN MC68HCP11E0FN NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFSC5G40E38-EVB NXP USA Inc. AFSC5G40E38.pdf Description: AFSC5G40E38 3700-4000 MHZ REFERE
Packaging: Bulk
For Use With/Related Products: AFSC5G40E38
Frequency: 3.7GHz ~ 4GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G40E38
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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SAF7755HN/N207WK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC802UKZ NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-WLCSP (1.84x1.84)
Number of I/O: 13
DigiKey Programmable: Not Verified
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4000+1.16 EUR
Mindestbestellmenge: 4000
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LPC802M011JDH20J LPC802M011JDH20J NXP USA Inc. LPC802.pdf Description: LPC802M011JDH20
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
auf Bestellung 2500 Stücke:
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2500+1.32 EUR
Mindestbestellmenge: 2500
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MK22FN1M0AVMD12 MK22FN1M0AVMD12 NXP USA Inc. K22P64M120SF8.pdf Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8MM6CVTKZAAR MIMX8MM6CVTKZAAR NXP USA Inc. IMX8MMCEC.pdf Description: I.MX 8M MINI QUAD
Packaging: Tape & Reel (TR)
Package / Case: 486-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Produkt ist nicht verfügbar
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MIMX8MM2DVTLZAA MIMX8MM2DVTLZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
1+47.98 EUR
10+38.99 EUR
25+37.28 EUR
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MIMX8MM5DVTLZDA MIMX8MM5DVTLZDA NXP USA Inc. IMX8MMCEC.pdf Description: MICROPROCESSORS - MPU MSCALE 845
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 152 Stücke:
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1+57.22 EUR
10+52.77 EUR
25+50.4 EUR
152+45.06 EUR
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MIMX8MM3CVTKZAA MIMX8MM3CVTKZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 137 Stücke:
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1+57.57 EUR
10+46.87 EUR
25+44.2 EUR
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MC9S08GB32ACFUE MC9S08GB32ACFUE NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 24 Stücke:
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1+20.2 EUR
10+15.91 EUR
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MC9S08QA4CDNE MC9S08QA4CDNE NXP USA Inc. MC9S08QA4.pdf Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
auf Bestellung 639 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.65 EUR
10+4.27 EUR
98+3.54 EUR
196+3.4 EUR
294+3.33 EUR
588+3.22 EUR
Mindestbestellmenge: 4
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MC9S08SH4CTJ MC9S08SH4CTJ NXP USA Inc. MC9S08SH8.pdf Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 2133 Stücke:
Lieferzeit 10-14 Tag (e)
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10+5.13 EUR
75+4.34 EUR
150+4.16 EUR
300+4.01 EUR
525+3.91 EUR
1050+3.8 EUR
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MMA6827BKCW MMA6827BKCW NXP USA Inc. PHGL-S-A0002885344-1.pdf?t.download=true&u=5oefqw Description: MMA6827 - DUAL-AXIS SPI INERTIAL
Packaging: Bulk
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MMA6255AKEG MMA6255AKEG NXP USA Inc. Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±50g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Produkt ist nicht verfügbar
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MMA9550LR1 MMA9550LR1 NXP USA Inc. MMA955xL.pdf Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
Produkt ist nicht verfügbar
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A5000R2HQ1/Z016UZ A5000R2HQ1/Z016UZ NXP USA Inc. Description: IC EDGE LOCK SEC AUTH 20HX2QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Edge Lock Secure Authenticator
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A5000R2HQ1/Z016UZ A5000R2HQ1/Z016UZ NXP USA Inc. Description: IC EDGE LOCK SEC AUTH 20HX2QFN
Packaging: Cut Tape (CT)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Edge Lock Secure Authenticator
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
auf Bestellung 2679 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.54 EUR
10+3.39 EUR
25+3.1 EUR
100+2.79 EUR
250+2.64 EUR
500+2.54 EUR
1000+2.47 EUR
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NX3DV42GU33Z NXP USA Inc. NX3DV42.pdf Description: NX3DV42GU33
Packaging: Tape & Reel (TR)
Features: Break-Before-Make, USB 2.0
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MIMXRT1015CAF4BR MIMXRT1015CAF4BR NXP USA Inc. IMXRT1015IEC.pdf Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
Produkt ist nicht verfügbar
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MIMXRT1015CAF4AR MIMXRT1015CAF4AR NXP USA Inc. IMXRT1015IEC.pdf Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
Produkt ist nicht verfügbar
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MIMXRT1015DAF5B MIMXRT1015DAF5B NXP USA Inc. IMXRT1015IEC.pdf Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 68 Stücke:
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2+9.49 EUR
10+7.29 EUR
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MIMXRT1015CAF4B MIMXRT1015CAF4B NXP USA Inc. IMXRT1015IEC.pdf Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
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2+11.32 EUR
10+8.74 EUR
25+8.1 EUR
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MPF5024AMMA0ES MPF5024AMMA0ES NXP USA Inc. Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 210 Stücke:
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BFU610F,115 BFU610F,115 NXP USA Inc. BFU610F.pdf Description: RF TRANS NPN 5.5V 15GHZ 4-DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
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BFU610F,115 BFU610F,115 NXP USA Inc. BFU610F.pdf Description: RF TRANS NPN 5.5V 15GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
auf Bestellung 5753 Stücke:
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500+0.47 EUR
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MCF54454CVP200 MCF54454CVP200 NXP USA Inc. MCF54455.pdf Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF2DL1001DUD/02V NXP USA Inc. MF2DLHX0.pdf Description: MIFARE DESFIRE LIGHT CONTACTLESS
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MF3D2201DUD/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D2201DUF/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D2200DA6/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D2200DA4/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2201DUD/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2201DUF/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2200DA6/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2200DA4/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4201DUD/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4201DUF/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4200DA6/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4200DA4/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH4201DUD/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH4201DUF/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH4200DA6/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1110FD20Y LPC111X.pdf
Hersteller: NXP USA Inc.
Description: SCALABLE ENTRY LEVEL 32-BIT MICR
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-SO
Number of I/O: 16
Produkt ist nicht verfügbar
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LPC1112FD20/102Y LPC111X.pdf
Hersteller: NXP USA Inc.
Description: SCALABLE ENTRY LEVEL 32-BIT MICR
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-SO
Number of I/O: 16
Produkt ist nicht verfügbar
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LPC11U68JBD64Y LPC11U6X.pdf
Hersteller: NXP USA Inc.
Description: SCALABLE ENTRY LEVEL 32-BIT MICR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 48
Produkt ist nicht verfügbar
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MC9S08QE4CTGR MC9S08QE8.pdf
MC9S08QE4CTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1021CAG4AR IMXRT1020IEC.pdf
MIMXRT1021CAG4AR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
Produkt ist nicht verfügbar
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LS1088AXN7MQA LS1088AFS.pdf
LS1088AXN7MQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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NX3L4053HR-Q100115 PHGLS28082-1.pdf?t.download=true&u=5oefqw
NX3L4053HR-Q100115
Hersteller: NXP USA Inc.
Description: MULTIPLEXERS/SWITCHES, 3 FUNC, C
Packaging: Bulk
auf Bestellung 1350 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
567+0.88 EUR
Mindestbestellmenge: 567
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74ABT373AD,112 74ABT373A.pdf
74ABT373AD,112
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.6ns
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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MCIMX-MF0810
Hersteller: NXP USA Inc.
Description: MCIMX-MF0810
Packaging: Bulk
Produkt ist nicht verfügbar
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BZX84-B33/DG/B2215 BZX84_SER.pdf
BZX84-B33/DG/B2215
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: TO-236AB
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
auf Bestellung 21000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8876+0.05 EUR
Mindestbestellmenge: 8876
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BZX84-B33/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-B33/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 33V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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74LVC162244ADGG,112 NEXP-S-A0003105656-1.pdf?t.download=true&u=5oefqw
74LVC162244ADGG,112
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC162244ADGG - B
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Produkt ist nicht verfügbar
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74ALVCH16374DGG112 74ALVCH16374.pdf
74ALVCH16374DGG112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DBL 8-BIT 48-TSSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 48-TSSOP
Max Propagation Delay @ V, Max CL: 3.4ns @ 3.3V, 50pF
Number of Bits per Element: 8
auf Bestellung 6795 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
456+1.02 EUR
Mindestbestellmenge: 456
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MK80FN256VDC15 K80P121M150SF5.pdf
MK80FN256VDC15
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 2x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 87
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFT05MS004-200M AFT05MS004N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET
Packaging: Bulk
Produkt ist nicht verfügbar
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BAP64-05W,135 BAP64-04W.pdf
BAP64-05W,135
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 100V 240MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 100V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
Produkt ist nicht verfügbar
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BAP64-05W,135 BAP64-04W.pdf
BAP64-05W,135
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 100V 240MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 100V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
auf Bestellung 4940 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
46+0.39 EUR
67+0.26 EUR
76+0.23 EUR
100+0.2 EUR
250+0.18 EUR
500+0.17 EUR
2500+0.16 EUR
Mindestbestellmenge: 46
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MC68HCP11E0FN M68HC11E.pdf
MC68HCP11E0FN
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFSC5G40E38-EVB AFSC5G40E38.pdf
Hersteller: NXP USA Inc.
Description: AFSC5G40E38 3700-4000 MHZ REFERE
Packaging: Bulk
For Use With/Related Products: AFSC5G40E38
Frequency: 3.7GHz ~ 4GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G40E38
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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SAF7755HN/N207WK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC802UKZ LPC802.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-WLCSP (1.84x1.84)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+1.16 EUR
Mindestbestellmenge: 4000
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LPC802M011JDH20J LPC802.pdf
LPC802M011JDH20J
Hersteller: NXP USA Inc.
Description: LPC802M011JDH20
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.32 EUR
Mindestbestellmenge: 2500
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MK22FN1M0AVMD12 K22P64M120SF8.pdf
MK22FN1M0AVMD12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8MM6CVTKZAAR IMX8MMCEC.pdf
MIMX8MM6CVTKZAAR
Hersteller: NXP USA Inc.
Description: I.MX 8M MINI QUAD
Packaging: Tape & Reel (TR)
Package / Case: 486-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Produkt ist nicht verfügbar
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MIMX8MM2DVTLZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM2DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+47.98 EUR
10+38.99 EUR
25+37.28 EUR
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MIMX8MM5DVTLZDA IMX8MMCEC.pdf
MIMX8MM5DVTLZDA
Hersteller: NXP USA Inc.
Description: MICROPROCESSORS - MPU MSCALE 845
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+57.22 EUR
10+52.77 EUR
25+50.4 EUR
152+45.06 EUR
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MIMX8MM3CVTKZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM3CVTKZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 137 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+57.57 EUR
10+46.87 EUR
25+44.2 EUR
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MC9S08GB32ACFUE MC9S08GB60A.pdf
MC9S08GB32ACFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.2 EUR
10+15.91 EUR
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MC9S08QA4CDNE MC9S08QA4.pdf
MC9S08QA4CDNE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
auf Bestellung 639 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.65 EUR
10+4.27 EUR
98+3.54 EUR
196+3.4 EUR
294+3.33 EUR
588+3.22 EUR
Mindestbestellmenge: 4
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MC9S08SH4CTJ MC9S08SH8.pdf
MC9S08SH4CTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 2133 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.79 EUR
10+5.13 EUR
75+4.34 EUR
150+4.16 EUR
300+4.01 EUR
525+3.91 EUR
1050+3.8 EUR
Mindestbestellmenge: 3
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MMA6827BKCW PHGL-S-A0002885344-1.pdf?t.download=true&u=5oefqw
MMA6827BKCW
Hersteller: NXP USA Inc.
Description: MMA6827 - DUAL-AXIS SPI INERTIAL
Packaging: Bulk
auf Bestellung 65 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
65+9.95 EUR
Mindestbestellmenge: 65
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MMA6255AKEG
MMA6255AKEG
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±50g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Produkt ist nicht verfügbar
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MMA9550LR1 MMA955xL.pdf
MMA9550LR1
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
Produkt ist nicht verfügbar
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A5000R2HQ1/Z016UZ
A5000R2HQ1/Z016UZ
Hersteller: NXP USA Inc.
Description: IC EDGE LOCK SEC AUTH 20HX2QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Edge Lock Secure Authenticator
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A5000R2HQ1/Z016UZ
A5000R2HQ1/Z016UZ
Hersteller: NXP USA Inc.
Description: IC EDGE LOCK SEC AUTH 20HX2QFN
Packaging: Cut Tape (CT)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Edge Lock Secure Authenticator
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
auf Bestellung 2679 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.54 EUR
10+3.39 EUR
25+3.1 EUR
100+2.79 EUR
250+2.64 EUR
500+2.54 EUR
1000+2.47 EUR
Mindestbestellmenge: 4
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NX3DV42GU33Z NX3DV42.pdf
Hersteller: NXP USA Inc.
Description: NX3DV42GU33
Packaging: Tape & Reel (TR)
Features: Break-Before-Make, USB 2.0
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MIMXRT1015CAF4BR IMXRT1015IEC.pdf
MIMXRT1015CAF4BR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
Produkt ist nicht verfügbar
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MIMXRT1015CAF4AR IMXRT1015IEC.pdf
MIMXRT1015CAF4AR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
Produkt ist nicht verfügbar
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MIMXRT1015DAF5B IMXRT1015IEC.pdf
MIMXRT1015DAF5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 68 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.49 EUR
10+7.29 EUR
25+6.74 EUR
Mindestbestellmenge: 2
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MIMXRT1015CAF4B IMXRT1015IEC.pdf
MIMXRT1015CAF4B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.32 EUR
10+8.74 EUR
25+8.1 EUR
Mindestbestellmenge: 2
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MPF5024AMMA0ES
MPF5024AMMA0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 210 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.23 EUR
10+7.87 EUR
25+7.28 EUR
100+6.64 EUR
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BFU610F,115 BFU610F.pdf
BFU610F,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 5.5V 15GHZ 4-DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
auf Bestellung 3000 Stücke:
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Anzahl Preis
3000+0.37 EUR
Mindestbestellmenge: 3000
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BFU610F,115 BFU610F.pdf
BFU610F,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 5.5V 15GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
auf Bestellung 5753 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+1.51 EUR
19+0.94 EUR
100+0.62 EUR
500+0.47 EUR
1000+0.43 EUR
Mindestbestellmenge: 12
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MCF54454CVP200 MCF54455.pdf
MCF54454CVP200
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF2DL1001DUD/02V MF2DLHX0.pdf
Hersteller: NXP USA Inc.
Description: MIFARE DESFIRE LIGHT CONTACTLESS
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MF3D2201DUD/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D2201DUF/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D2200DA6/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D2200DA4/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2201DUD/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2201DUF/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2200DA6/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2200DA4/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4201DUD/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4201DUF/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4200DA6/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4200DA4/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH4201DUD/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH4201DUF/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH4200DA6/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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