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SPC5743PFK1AMLQ9 SPC5743PFK1AMLQ9 NXP USA Inc. MPC574xPFS.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
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SPC5745BBK1AMMH2 SPC5745BBK1AMMH2 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
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FRDM-17510EVB NXP USA Inc. KTFRDM17510EVBUG.pdf Description: EVAL BOARD FOR MPC17510
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MPC17510
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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FRDM-17531AEPEVB NXP USA Inc. Description: EVAL BOARD FOR MPC17531A
Packaging: Bulk
Function: Motor Controller/Driver, Stepper
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MPC17531A
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MKW20Z160VHT4 MKW20Z160VHT4 NXP USA Inc. MKW40Z160.pdf Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: ZigbeePRO®
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 250kbps
Current - Transmitting: 8.4mA ~ 18.5mA
Supplier Device Package: 64-VFLGA (7x7)
GPIO: 28
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
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88W8997-A1-CBQE/AZ 88W8997-A1-CBQE/AZ NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: IC RF TXRX BLE 161WLCSP
Packaging: Cut Tape (CT)
Package / Case: 161-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 161-WLCSP
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
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1+36.34 EUR
10+31.64 EUR
25+30.01 EUR
100+27.77 EUR
250+26.43 EUR
500+25.49 EUR
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88W8777-A0-CBK/BZ NXP USA Inc. Description: IC RF TXRX BLE
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz
Type: TxRx Only
Protocol: 802.11b/g/n, Bluetooth v4.0
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2S, PCM, SDIO, UART
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88W8977-A1-EADE/AZ 88W8977-A1-EADE/AZ NXP USA Inc. 88W8977_SDS.pdf Description: IC RF TXRX+MCU 802.15.4 74EWLP
Packaging: Tape & Reel (TR)
Package / Case: 74-WFBGA, WLBGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee®
Data Rate (Max): 150Mbps
Supplier Device Package: 74-eWLP (3.46x4.68)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8787-A1-BKBE/CZ NXP USA Inc. Description: 11N 1X1 DUAL-BAND + BT + FM + SD
Packaging: Tape & Reel (TR)
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88W8787-A16CBJ/AZ NXP USA Inc. Description: 11N 1X1 + BT + FM + SDIO + GSPI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8787-A16CBJ/BZ NXP USA Inc. Description: 11N 1X1 DUAL-BAND + BT + FM + SD
Packaging: Tape & Reel (TR)
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88W8787-A1-BKBE/AZ NXP USA Inc. Description: 11N 1X1 + BT + FM + SDIO + GSPI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8977-A1-NMVE/AZ 88W8977-A1-NMVE/AZ NXP USA Inc. 88W8977_SDS.pdf Description: IC RF TXRX+MCU 802.15.4 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee®
Data Rate (Max): 150Mbps
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
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88W8987-A2-EAHE/AZ 88W8987-A2-EAHE/AZ NXP USA Inc. 88W8987_SDS.pdf Description: IC RF TXRX BLE 83WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 83-WFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 83-WLCSP (4.6x4.2)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
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88W8987-A2-NYEE/AZ 88W8987-A2-NYEE/AZ NXP USA Inc. 88W8987_SDS.pdf Description: IC RF TXRX BLE 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
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88W8787-A1-BRDA/AZ NXP USA Inc. Description: 11N 1X1 SINGLE-BAND + BT + FM +
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8987-A2-NYEE/AK NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
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88W8987-A2-NYEA/BZ NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8987-A2-NYEI/AK NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
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88W8987-A1-NYEI/AZ NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8987-A2-NYEI/AZ NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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MCF51JE128CLK MCF51JE128CLK NXP USA Inc. MCF51JE256.pdf Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Box
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 47
DigiKey Programmable: Not Verified
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MC9S12E32VFUE16R MC9S12E32VFUE16R NXP USA Inc. READ-ME_HCS12.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
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HVP-KE18F HVP-KE18F NXP USA Inc. KE1xFP100M168SF0.pdf Description: EVAL BOARD FOR KE1XF
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: KE1xF
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
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MC9S08GT60ACFBER MC9S08GT60ACFBER NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
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MC9S08GT60ACFBER MC9S08GT60ACFBER NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68302AG16VC MC68302AG16VC NXP USA Inc. M68302FADS.pdf Description: IC MPU M683XX 16MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 3.3V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
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PCA9451AHNY PCA9451AHNY NXP USA Inc. PCA9451A.pdf Description: PMIC SUPPORTING I.MX 93
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 56-HVQFN (7x7)
Produkt ist nicht verfügbar
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PCA9451AHNY PCA9451AHNY NXP USA Inc. PCA9451A.pdf Description: PMIC SUPPORTING I.MX 93
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 56-HVQFN (7x7)
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2+12.59 EUR
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MMRF1050HR6 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Current Rating (Amps): 1µA
Mounting Type: Chassis Mount
Frequency: 850MHz ~ 950MHz
Configuration: 2 N-Channel
Power - Output: 1050W
Gain: 21.3dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-1230-4H
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
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LPC1225FBD48/321,1 LPC1225FBD48/321,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 80KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 80KB (80K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 263 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.96 EUR
10+5.93 EUR
25+5.84 EUR
100+5.76 EUR
250+5.68 EUR
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MMRF1317HR5 MMRF1317HR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1300W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MCIMX351AVM4B MCIMX351AVM4B NXP USA Inc. FSCLS07025-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX35 400MHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
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MCIMX353CVM5B MCIMX353CVM5B NXP USA Inc. MCIMX35SR2CEC.pdf Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
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MCIMX351AVM4B MCIMX351AVM4B NXP USA Inc. MCIMX35SR2AEC.pdf Description: IC MPU I.MX35 400MHZ 400LFBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
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88W8801-B0-NMDC/AK NXP USA Inc. 88W8801_SDS.pdf?pspll=1 Description: IC RF TXRX WIFI 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 26dBm
Protocol: 802.11n/g/b
Current - Receiving: 68mA ~ 82mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 285mA ~ 359mA
Supplier Device Package: 48-HVQFN (6x6)
Modulation: DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, SDIO, UART, USB
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88W8801-B0-NMDE/AK NXP USA Inc. 88W8801_SDS.pdf?pspll=1 Description: IC RF TXRX WIFI 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 26dBm
Protocol: 802.11n/g/b
Current - Receiving: 68mA ~ 82mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 285mA ~ 359mA
Supplier Device Package: 48-HVQFN (6x6)
Modulation: DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, SDIO, UART, USB
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88W8801-B0-NMDE/AZ NXP USA Inc. 88W8801_SDS.pdf?pspll=1 Description: IC RF TXRX WIFI 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 26dBm
Protocol: 802.11n/g/b
Current - Receiving: 68mA ~ 82mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 285mA ~ 359mA
Supplier Device Package: 48-HVQFN (6x6)
Modulation: DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, SDIO, UART, USB
Produkt ist nicht verfügbar
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88MW320-A0-NAPC/AK 88MW320-A0-NAPC/AK NXP USA Inc. 88MW320-88W322.pdf Description: IC RF TXRX+MCU BLE 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
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88MW320-A0-NAPC/AZ NXP USA Inc. 88MW320-88W322.pdf Description: IC RF TXRX+MCU BLE 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88MW320-A0-NAPE/AZ NXP USA Inc. 88MW320-88W322.pdf Description: LOW-POWER WLAN MICROCONTROLLER S
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88MW320-A0-NAPE/AK NXP USA Inc. 88MW320-88W322.pdf Description: IC RF TXRX+MCU BLE 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88MW322-A0-NXUC/AZ NXP USA Inc. 88MW320-88W322.pdf Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 88-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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PCA9955TW/Q900,118 PCA9955TW/Q900,118 NXP USA Inc. PCA9952_PCA9955.pdf Description: IC LED DRV LIN PWM 57MA 28HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): Yes
Supplier Device Package: 28-HTSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Qualification: AEC-Q100
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PCA9955TW/Q900,118 PCA9955TW/Q900,118 NXP USA Inc. PCA9952_PCA9955.pdf Description: IC LED DRV LIN PWM 57MA 28HTSSOP
Qualification: AEC-Q100
Grade: Automotive
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 3V
Dimming: PWM
Supplier Device Package: 28-HTSSOP
Internal Switch(s): Yes
Current - Output / Channel: 57mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Linear
Number of Outputs: 16
Mounting Type: Surface Mount
Voltage - Output: 40V
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Packaging: Cut Tape (CT)
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LD6806TD/25H,125 LD6806TD/25H,125 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.5V 200MA 5-TSOP
Package / Case: SC-74A, SOT-753
Packaging: Bulk
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
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LD6806F/23H,115 LD6806F/23H,115 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.3V 200MA 6XSON
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.3V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFDFN
Packaging: Bulk
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MC908GR60ACFAE MC908GR60ACFAE NXP USA Inc. MC68HC08GR32A.pdf Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC908GR60ACFAE MC908GR60ACFAE NXP USA Inc. MC68HC08GR32A.pdf Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC908AZ60AMFUE MC908AZ60AMFUE NXP USA Inc. MC68HC08AS32.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 52
DigiKey Programmable: Not Verified
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MPC860DPVR80D4 MPC860DPVR80D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU 80MHZ 357BGA
Supplier Device Package: 357-PBGA (25x25)
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8245TZU350D MPC8245TZU350D NXP USA Inc. MPC8245T_Series.pdf Description: IC MPU MPC82XX 350MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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TDA8037TT/C1J TDA8037TT/C1J NXP USA Inc. TDA8037.pdf Description: IC INTERFACE SPECIALIZED 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: Smart Card
Supplier Device Package: 16-TSSOP
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MC7457RX1000LC MC7457RX1000LC NXP USA Inc. MPC7457.pdf Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7457TRX1000NC MC7457TRX1000NC NXP USA Inc. MPC7457.pdf Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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SPC5644AF0MMG3 SPC5644AF0MMG3 NXP USA Inc. MPC5644A.pdf Description: IC MCU 32BIT 4MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 120
DigiKey Programmable: Not Verified
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MMG3007NT1 MMG3007NT1 NXP USA Inc. MMG3007NT1.pdf Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 19dB
Current - Supply: 47mA
Noise Figure: 3.8dBm
P1dB: 16dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Produkt ist nicht verfügbar
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MMG3007NT1 MMG3007NT1 NXP USA Inc. MMG3007NT1.pdf Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 19dB
Current - Supply: 47mA
Noise Figure: 3.8dBm
P1dB: 16dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Produkt ist nicht verfügbar
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MPC870ZT66 MPC870ZT66 NXP USA Inc. MPC875%2C870.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Produkt ist nicht verfügbar
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MMZ09332BT3 NXP USA Inc. MMZ09332B.pdf Description: IC RF AMP LTE 130MHZ-1GHZ 12QFN
Packaging: Bulk
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 130MHz ~ 1GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 30.5dB
Current - Supply: 108mA
P1dB: 32.8dBm
Test Frequency: 760MHz
Supplier Device Package: 12-QFN (3x3)
Produkt ist nicht verfügbar
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SPC5743PFK1AMLQ9 MPC574xPFS.pdf
SPC5743PFK1AMLQ9
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5745BBK1AMMH2 MPC5746C.pdf
SPC5745BBK1AMMH2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM-17510EVB KTFRDM17510EVBUG.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MPC17510
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MPC17510
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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FRDM-17531AEPEVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MPC17531A
Packaging: Bulk
Function: Motor Controller/Driver, Stepper
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MPC17531A
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MKW20Z160VHT4 MKW40Z160.pdf
MKW20Z160VHT4
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: ZigbeePRO®
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 250kbps
Current - Transmitting: 8.4mA ~ 18.5mA
Supplier Device Package: 64-VFLGA (7x7)
GPIO: 28
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8997-A1-CBQE/AZ 88W8997-FACT-SHEET.pdf
88W8997-A1-CBQE/AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 161WLCSP
Packaging: Cut Tape (CT)
Package / Case: 161-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 161-WLCSP
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
auf Bestellung 1043 Stücke:
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AnzahlPrivatkunde
1+36.34 EUR
10+31.64 EUR
25+30.01 EUR
100+27.77 EUR
250+26.43 EUR
500+25.49 EUR
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88W8777-A0-CBK/BZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz
Type: TxRx Only
Protocol: 802.11b/g/n, Bluetooth v4.0
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8977-A1-EADE/AZ 88W8977_SDS.pdf
88W8977-A1-EADE/AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 74EWLP
Packaging: Tape & Reel (TR)
Package / Case: 74-WFBGA, WLBGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee®
Data Rate (Max): 150Mbps
Supplier Device Package: 74-eWLP (3.46x4.68)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8787-A1-BKBE/CZ
Hersteller: NXP USA Inc.
Description: 11N 1X1 DUAL-BAND + BT + FM + SD
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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88W8787-A16CBJ/AZ
Hersteller: NXP USA Inc.
Description: 11N 1X1 + BT + FM + SDIO + GSPI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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88W8787-A16CBJ/BZ
Hersteller: NXP USA Inc.
Description: 11N 1X1 DUAL-BAND + BT + FM + SD
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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88W8787-A1-BKBE/AZ
Hersteller: NXP USA Inc.
Description: 11N 1X1 + BT + FM + SDIO + GSPI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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88W8977-A1-NMVE/AZ 88W8977_SDS.pdf
88W8977-A1-NMVE/AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee®
Data Rate (Max): 150Mbps
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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88W8987-A2-EAHE/AZ 88W8987_SDS.pdf
88W8987-A2-EAHE/AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 83WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 83-WFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 83-WLCSP (4.6x4.2)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8987-A2-NYEE/AZ 88W8987_SDS.pdf
88W8987-A2-NYEE/AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8787-A1-BRDA/AZ
Hersteller: NXP USA Inc.
Description: 11N 1X1 SINGLE-BAND + BT + FM +
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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88W8987-A2-NYEE/AK 88W8987_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8987-A2-NYEA/BZ 88W8987_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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88W8987-A2-NYEI/AK 88W8987_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8987-A1-NYEI/AZ 88W8987_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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88W8987-A2-NYEI/AZ 88W8987_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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MCF51JE128CLK MCF51JE256.pdf
MCF51JE128CLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Box
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12E32VFUE16R READ-ME_HCS12.pdf
MC9S12E32VFUE16R
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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HVP-KE18F KE1xFP100M168SF0.pdf
HVP-KE18F
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR KE1XF
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: KE1xF
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
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1+226.09 EUR
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MC9S08GT60ACFBER MC9S08AC60.pdf
MC9S08GT60ACFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08GT60ACFBER MC9S08AC60.pdf
MC9S08GT60ACFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68302AG16VC M68302FADS.pdf
MC68302AG16VC
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 3.3V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
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PCA9451AHNY PCA9451A.pdf
PCA9451AHNY
Hersteller: NXP USA Inc.
Description: PMIC SUPPORTING I.MX 93
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 56-HVQFN (7x7)
Produkt ist nicht verfügbar
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PCA9451AHNY PCA9451A.pdf
PCA9451AHNY
Hersteller: NXP USA Inc.
Description: PMIC SUPPORTING I.MX 93
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 56-HVQFN (7x7)
auf Bestellung 3 Stücke:
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AnzahlPrivatkunde
2+12.59 EUR
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MMRF1050HR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Current Rating (Amps): 1µA
Mounting Type: Chassis Mount
Frequency: 850MHz ~ 950MHz
Configuration: 2 N-Channel
Power - Output: 1050W
Gain: 21.3dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-1230-4H
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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LPC1225FBD48/321,1 LPC122X.pdf
LPC1225FBD48/321,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 80KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 80KB (80K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 263 Stücke:
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AnzahlPrivatkunde
3+7.96 EUR
10+5.93 EUR
25+5.84 EUR
100+5.76 EUR
250+5.68 EUR
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MMRF1317HR5
MMRF1317HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1300W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MCIMX351AVM4B FSCLS07025-1.pdf?t.download=true&u=5oefqw
MCIMX351AVM4B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 400MHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
auf Bestellung 90 Stücke:
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AnzahlPrivatkunde
9+57.39 EUR
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MCIMX353CVM5B MCIMX35SR2CEC.pdf
MCIMX353CVM5B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
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MCIMX351AVM4B MCIMX35SR2AEC.pdf
MCIMX351AVM4B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 400MHZ 400LFBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
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88W8801-B0-NMDC/AK 88W8801_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: IC RF TXRX WIFI 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 26dBm
Protocol: 802.11n/g/b
Current - Receiving: 68mA ~ 82mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 285mA ~ 359mA
Supplier Device Package: 48-HVQFN (6x6)
Modulation: DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, SDIO, UART, USB
Produkt ist nicht verfügbar
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88W8801-B0-NMDE/AK 88W8801_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: IC RF TXRX WIFI 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 26dBm
Protocol: 802.11n/g/b
Current - Receiving: 68mA ~ 82mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 285mA ~ 359mA
Supplier Device Package: 48-HVQFN (6x6)
Modulation: DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, SDIO, UART, USB
Produkt ist nicht verfügbar
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88W8801-B0-NMDE/AZ 88W8801_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: IC RF TXRX WIFI 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 26dBm
Protocol: 802.11n/g/b
Current - Receiving: 68mA ~ 82mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 285mA ~ 359mA
Supplier Device Package: 48-HVQFN (6x6)
Modulation: DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, SDIO, UART, USB
Produkt ist nicht verfügbar
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88MW320-A0-NAPC/AK 88MW320-88W322.pdf
88MW320-A0-NAPC/AK
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88MW320-A0-NAPC/AZ 88MW320-88W322.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88MW320-A0-NAPE/AZ 88MW320-88W322.pdf
Hersteller: NXP USA Inc.
Description: LOW-POWER WLAN MICROCONTROLLER S
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88MW320-A0-NAPE/AK 88MW320-88W322.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88MW322-A0-NXUC/AZ 88MW320-88W322.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 88-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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PCA9955TW/Q900,118 PCA9952_PCA9955.pdf
PCA9955TW/Q900,118
Hersteller: NXP USA Inc.
Description: IC LED DRV LIN PWM 57MA 28HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): Yes
Supplier Device Package: 28-HTSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Qualification: AEC-Q100
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PCA9955TW/Q900,118 PCA9952_PCA9955.pdf
PCA9955TW/Q900,118
Hersteller: NXP USA Inc.
Description: IC LED DRV LIN PWM 57MA 28HTSSOP
Qualification: AEC-Q100
Grade: Automotive
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 3V
Dimming: PWM
Supplier Device Package: 28-HTSSOP
Internal Switch(s): Yes
Current - Output / Channel: 57mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Linear
Number of Outputs: 16
Mounting Type: Surface Mount
Voltage - Output: 40V
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Packaging: Cut Tape (CT)
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3+7.69 EUR
10+5.82 EUR
25+5.36 EUR
100+4.84 EUR
250+4.59 EUR
500+4.45 EUR
1000+4.32 EUR
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LD6806TD/25H,125 LD6806_Series.pdf
LD6806TD/25H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 200MA 5-TSOP
Package / Case: SC-74A, SOT-753
Packaging: Bulk
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
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LD6806F/23H,115 LD6806_Series.pdf
LD6806F/23H,115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.3V 200MA 6XSON
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.3V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFDFN
Packaging: Bulk
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MC908GR60ACFAE MC68HC08GR32A.pdf
MC908GR60ACFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC908GR60ACFAE MC68HC08GR32A.pdf
MC908GR60ACFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AZ60AMFUE MC68HC08AS32.pdf
MC908AZ60AMFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC860DPVR80D4 MPC860EC.pdf
MPC860DPVR80D4
Hersteller: NXP USA Inc.
Description: IC MPU 80MHZ 357BGA
Supplier Device Package: 357-PBGA (25x25)
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8245TZU350D MPC8245T_Series.pdf
MPC8245TZU350D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 350MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
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TDA8037TT/C1J TDA8037.pdf
TDA8037TT/C1J
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: Smart Card
Supplier Device Package: 16-TSSOP
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542+0.99 EUR
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MC7457RX1000LC MPC7457.pdf
MC7457RX1000LC
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7457TRX1000NC MPC7457.pdf
MC7457TRX1000NC
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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SPC5644AF0MMG3 MPC5644A.pdf
SPC5644AF0MMG3
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMG3007NT1 MMG3007NT1.pdf
MMG3007NT1
Hersteller: NXP USA Inc.
Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 19dB
Current - Supply: 47mA
Noise Figure: 3.8dBm
P1dB: 16dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Produkt ist nicht verfügbar
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MMG3007NT1 MMG3007NT1.pdf
MMG3007NT1
Hersteller: NXP USA Inc.
Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 19dB
Current - Supply: 47mA
Noise Figure: 3.8dBm
P1dB: 16dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Produkt ist nicht verfügbar
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MPC870ZT66 MPC875%2C870.pdf
MPC870ZT66
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Produkt ist nicht verfügbar
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MMZ09332BT3 MMZ09332B.pdf
Hersteller: NXP USA Inc.
Description: IC RF AMP LTE 130MHZ-1GHZ 12QFN
Packaging: Bulk
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 130MHz ~ 1GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 30.5dB
Current - Supply: 108mA
P1dB: 32.8dBm
Test Frequency: 760MHz
Supplier Device Package: 12-QFN (3x3)
Produkt ist nicht verfügbar
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