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MC7457RX1000LC MC7457RX1000LC NXP USA Inc. MPC7457.pdf Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7457TRX1000NC MC7457TRX1000NC NXP USA Inc. MPC7457.pdf Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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SPC5644AF0MMG3 SPC5644AF0MMG3 NXP USA Inc. MPC5644A.pdf Description: IC MCU 32BIT 4MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMG3007NT1 MMG3007NT1 NXP USA Inc. MMG3007NT1.pdf Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 19dB
Current - Supply: 47mA
Noise Figure: 3.8dBm
P1dB: 16dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Produkt ist nicht verfügbar
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MMG3007NT1 MMG3007NT1 NXP USA Inc. MMG3007NT1.pdf Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 19dB
Current - Supply: 47mA
Noise Figure: 3.8dBm
P1dB: 16dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Produkt ist nicht verfügbar
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MPC870ZT66 MPC870ZT66 NXP USA Inc. MPC875%2C870.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Produkt ist nicht verfügbar
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MMZ09332BT3 NXP USA Inc. MMZ09332B.pdf Description: IC RF AMP LTE 130MHZ-1GHZ 12QFN
Packaging: Bulk
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 130MHz ~ 1GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 30.5dB
Current - Supply: 108mA
P1dB: 32.8dBm
Test Frequency: 760MHz
Supplier Device Package: 12-QFN (3x3)
Produkt ist nicht verfügbar
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S912XHY128F0CLL S912XHY128F0CLL NXP USA Inc. MC9S12XHY256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 76
DigiKey Programmable: Not Verified
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TJA1044VTK/3/S3J TJA1044VTK/3/S3J NXP USA Inc. TJA1044V.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
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M68DIP8DFN NXP USA Inc. Description: ADAPTER 8-PIN DIP - DFN
Packaging: Bulk
For Use With/Related Products: Target Cable
Module/Board Type: Socket Module - DFN
Utilized IC / Part: Target Cable
Produkt ist nicht verfügbar
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MFS8620BMDA0ES MFS8620BMDA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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RD33774CNC3EVB NXP USA Inc. Description: EVALUATION BOARD
Packaging: Bulk
Produkt ist nicht verfügbar
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MCF53014CMJ240J MCF53014CMJ240J NXP USA Inc. MCF53010-17.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PDTC144WMB,315 PDTC144WMB,315 NXP USA Inc. PHGLS24966-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS NPN 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 22 kOhms
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OM14500/TJA1102JP NXP USA Inc. TR1329.pdf Description: EVAL BOARD FOR TJA1102
Packaging: Bulk
Function: Ethernet
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1102
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MP3H6115A6T1 MP3H6115A6T1 NXP USA Inc. MP3H6115A.pdf Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Produkt ist nicht verfügbar
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PN5190B0EV/C107E PN5190B0EV/C107E NXP USA Inc. PdfFile641173.pdf Description: PN5190B0EV
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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MRF5S9101NR1 MRF5S9101NR1 NXP USA Inc. MRF5S9101.pdf Description: RF MOSFET LDMOS 26V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 100W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 700 mA
Produkt ist nicht verfügbar
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BTS6303UJ BTS6303UJ NXP USA Inc. BTS6303U.pdf Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 41.2dB
Current - Supply: 94mA
Noise Figure: 3.4dB
P1dB: 27.6dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
Produkt ist nicht verfügbar
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BTS6306UJ BTS6306UJ NXP USA Inc. BTS6306U.pdf Description: BTS6306UJ
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 39dB
Current - Supply: 115mA
Noise Figure: 4dB
P1dB: 28dBm
Test Frequency: 3.3GHz
Supplier Device Package: 16-HVQFN (3x3)
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BTS6302UJ NXP USA Inc. BTS6302U.pdf Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 5GHz
RF Type: 5G
Voltage - Supply: 4.75V ~ 5.25V
Gain: 38.6dB
Current - Supply: 98mA
P1dB: 28.1dBm
Test Frequency: 2.6GHz
Supplier Device Package: 16-HVQFN (3x3)
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74LVT74DB,112 74LVT74DB,112 NXP USA Inc. 74LVT74.pdf Description: IC FF D-TYPE DUAL 1BIT 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 1 mA
Current - Output High, Low: 20mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 345 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-SSOP
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Number of Bits per Element: 1
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mpc8275vrmiba mpc8275vrmiba NXP USA Inc. MPC8280EC.pdf Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8271VRMIBA MPC8271VRMIBA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8271VRMIBA MPC8271VRMIBA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8271ZQMIBA MPC8271ZQMIBA NXP USA Inc. FSCLS05947-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
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MPC8271ZQTIEA MPC8271ZQTIEA NXP USA Inc. FSCLS05947-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
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MFS8632BMDA0ES MFS8632BMDA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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BUK953R2-40B,127 NXP USA Inc. BUK953R2-40B.pdf Description: MOSFET N-CH 40V 100A TO220AB
Packaging: Tube
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74LV244PW,112 74LV244PW,112 NXP USA Inc. 74LV244.pdf Description: IC BUFF/DVR TRI-ST DUAL 20TSSOP
Packaging: Bulk
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74LV244N,112 74LV244N,112 NXP USA Inc. 74LV244.pdf Description: IC BUFFER NON-INVERT 5.5V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 16mA, 16mA
Supplier Device Package: 20-DIP
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S912ZVCA64F0MLFR S912ZVCA64F0MLFR NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC859PVR133A MPC859PVR133A NXP USA Inc. MPC866EC.pdf Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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PDTA114TE,115 PDTA114TE,115 NXP USA Inc. PDTA114T_SER.pdf Description: TRANS PREBIAS PNP 50V 0.1A SC75
Resistor - Base (R1): 10 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: PNP - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PTN3380BBS,518 PTN3380BBS,518 NXP USA Inc. PTN3380B.pdf Description: IC VIDEO LEVEL SHIFTER 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: Consumer Video
Standards: DVI v1.0, HDMI v1.3a
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
Produkt ist nicht verfügbar
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TDA18250BHN/C1K TDA18250BHN/C1K NXP USA Inc. TDA18250BHN_SDS.pdf Description: IC VIDEO TUNER 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
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7+3.01 EUR
10+2.21 EUR
25+2.01 EUR
100+1.78 EUR
250+1.68 EUR
500+1.62 EUR
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SPC5748CBK0AMMJ6 NXP USA Inc. Description: IC MCU 32BIT 6MB FLASH 256LBGA
Qualification: AEC-Q100
Number of I/O: 178
Grade: Automotive
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, FlexRay, I2S, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 64x10b, 80x12b SAR
Core Processor: e200z2, e200z4
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz, 160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
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SPC5748CK0AMKU6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLASH 176LQFP
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 48x10b, 16x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz, 160MHz
DigiKey Programmable: Not Verified
Number of I/O: 129
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
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SPC5748CBK0AVKU2 SPC5748CBK0AVKU2 NXP USA Inc. Description: IC MCU 32BIT 6MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
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MFS8603BMBA0ES MFS8603BMBA0ES NXP USA Inc. FS8600_SDS.pdf?pspll=1 Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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S9S12G64AMLH S9S12G64AMLH NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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PEMB17,115 PEMB17,115 NXP USA Inc. PEMB17_PUMB17.pdf Description: TRANS 2PNP PREBIAS 0.3W SOT666
Packaging: Bulk
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LD6815TD/36H,125 LD6815TD/36H,125 NXP USA Inc. LD6815_Series.pdf Description: IC REG LINEAR 3.6V 150MA 5-TSOP
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
PSRR: 75dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 3.6V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
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LD6816CX4/22P,315 LD6816CX4/22P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 2.2V 150MA 4-WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVC1G79GF,132 74LVC1G79GF,132 NXP USA Inc. NEXP-S-A0003511411-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
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S912ZVLA64ACLCR NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
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S912ZVLA64ACLC NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
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S912ZVLA64ACLFR NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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S912ZVLA64ACLF NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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S912ZVLA64AMLFR NXP USA Inc. Description: IC MCU 16BIT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912ZVLA64AVFMR NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 34
Produkt ist nicht verfügbar
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MC908QT1ACDWE MC908QT1ACDWE NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908QY1AMDWE MC908QY1AMDWE NXP USA Inc. MC68HLC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6L3DVN10AC MCIMX6L3DVN10AC NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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MWCT2D16SHT1VPB NXP USA Inc. RMMWCT2xxxS.pdf Description: MWCT2D16S, MAXQFP172
Packaging: Tray
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MWCT2D17SHT1VPBR NXP USA Inc. RMMWCT2xxxS.pdf Description: MWCT2D17S,MAXQFP172
Packaging: Tape & Reel (TR)
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MWCT2D17SHT1VPB NXP USA Inc. RMMWCT2xxxS.pdf Description: MWCT2D17S,MAXQFP172
Packaging: Tray
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MC9S12XD256CAA MC9S12XD256CAA NXP USA Inc. 9S12XDFAMPP.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC9S12XD256VAA MC9S12XD256VAA NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC9S12XD256VAG MC9S12XD256VAG NXP USA Inc. MC9S12XDP512RMV2.pdf Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC7457RX1000LC MPC7457.pdf
MC7457RX1000LC
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7457TRX1000NC MPC7457.pdf
MC7457TRX1000NC
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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SPC5644AF0MMG3 MPC5644A.pdf
SPC5644AF0MMG3
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMG3007NT1 MMG3007NT1.pdf
MMG3007NT1
Hersteller: NXP USA Inc.
Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 19dB
Current - Supply: 47mA
Noise Figure: 3.8dBm
P1dB: 16dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Produkt ist nicht verfügbar
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MMG3007NT1 MMG3007NT1.pdf
MMG3007NT1
Hersteller: NXP USA Inc.
Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 19dB
Current - Supply: 47mA
Noise Figure: 3.8dBm
P1dB: 16dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Produkt ist nicht verfügbar
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MPC870ZT66 MPC875%2C870.pdf
MPC870ZT66
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Produkt ist nicht verfügbar
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MMZ09332BT3 MMZ09332B.pdf
Hersteller: NXP USA Inc.
Description: IC RF AMP LTE 130MHZ-1GHZ 12QFN
Packaging: Bulk
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 130MHz ~ 1GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 30.5dB
Current - Supply: 108mA
P1dB: 32.8dBm
Test Frequency: 760MHz
Supplier Device Package: 12-QFN (3x3)
Produkt ist nicht verfügbar
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S912XHY128F0CLL MC9S12XHY256RMV1.pdf
S912XHY128F0CLL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 76
DigiKey Programmable: Not Verified
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30+18.47 EUR
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TJA1044VTK/3/S3J TJA1044V.pdf
TJA1044VTK/3/S3J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Produkt ist nicht verfügbar
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M68DIP8DFN
Hersteller: NXP USA Inc.
Description: ADAPTER 8-PIN DIP - DFN
Packaging: Bulk
For Use With/Related Products: Target Cable
Module/Board Type: Socket Module - DFN
Utilized IC / Part: Target Cable
Produkt ist nicht verfügbar
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MFS8620BMDA0ES
MFS8620BMDA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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RD33774CNC3EVB
Hersteller: NXP USA Inc.
Description: EVALUATION BOARD
Packaging: Bulk
Produkt ist nicht verfügbar
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MCF53014CMJ240J MCF53010-17.pdf
MCF53014CMJ240J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PDTC144WMB,315 PHGLS24966-1.pdf?t.download=true&u=5oefqw
PDTC144WMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 22 kOhms
auf Bestellung 140000 Stücke:
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AnzahlPrivatkunde
11225+0.061 EUR
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OM14500/TJA1102JP TR1329.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TJA1102
Packaging: Bulk
Function: Ethernet
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1102
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MP3H6115A6T1 MP3H6115A.pdf
MP3H6115A6T1
Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Produkt ist nicht verfügbar
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PN5190B0EV/C107E PdfFile641173.pdf
PN5190B0EV/C107E
Hersteller: NXP USA Inc.
Description: PN5190B0EV
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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MRF5S9101NR1 MRF5S9101.pdf
MRF5S9101NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 100W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 700 mA
Produkt ist nicht verfügbar
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BTS6303UJ BTS6303U.pdf
BTS6303UJ
Hersteller: NXP USA Inc.
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 41.2dB
Current - Supply: 94mA
Noise Figure: 3.4dB
P1dB: 27.6dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
Produkt ist nicht verfügbar
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BTS6306UJ BTS6306U.pdf
BTS6306UJ
Hersteller: NXP USA Inc.
Description: BTS6306UJ
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 39dB
Current - Supply: 115mA
Noise Figure: 4dB
P1dB: 28dBm
Test Frequency: 3.3GHz
Supplier Device Package: 16-HVQFN (3x3)
Produkt ist nicht verfügbar
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BTS6302UJ BTS6302U.pdf
Hersteller: NXP USA Inc.
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 5GHz
RF Type: 5G
Voltage - Supply: 4.75V ~ 5.25V
Gain: 38.6dB
Current - Supply: 98mA
P1dB: 28.1dBm
Test Frequency: 2.6GHz
Supplier Device Package: 16-HVQFN (3x3)
Produkt ist nicht verfügbar
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74LVT74DB,112 74LVT74.pdf
74LVT74DB,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 1 mA
Current - Output High, Low: 20mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 345 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-SSOP
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Number of Bits per Element: 1
auf Bestellung 1072 Stücke:
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1072+0.7 EUR
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mpc8275vrmiba MPC8280EC.pdf
mpc8275vrmiba
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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1+321.87 EUR
10+278.44 EUR
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MPC8271VRMIBA MPC8272EC.pdf
MPC8271VRMIBA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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4+132.47 EUR
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MPC8271VRMIBA MPC8272EC.pdf
MPC8271VRMIBA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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MPC8271ZQMIBA FSCLS05947-1.pdf?t.download=true&u=5oefqw
MPC8271ZQMIBA
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
auf Bestellung 27 Stücke:
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5+105.52 EUR
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MPC8271ZQTIEA FSCLS05947-1.pdf?t.download=true&u=5oefqw
MPC8271ZQTIEA
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
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4+143.1 EUR
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MFS8632BMDA0ES
MFS8632BMDA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BUK953R2-40B,127 BUK953R2-40B.pdf
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 100A TO220AB
Packaging: Tube
auf Bestellung 1158 Stücke:
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AnzahlPrivatkunde
321+1.8 EUR
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74LV244PW,112 74LV244.pdf
74LV244PW,112
Hersteller: NXP USA Inc.
Description: IC BUFF/DVR TRI-ST DUAL 20TSSOP
Packaging: Bulk
auf Bestellung 1900 Stücke:
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AnzahlPrivatkunde
1014+0.58 EUR
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74LV244N,112 74LV244.pdf
74LV244N,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 16mA, 16mA
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
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S912ZVCA64F0MLFR
S912ZVCA64F0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC859PVR133A MPC866EC.pdf
MPC859PVR133A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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PDTA114TE,115 PDTA114T_SER.pdf
PDTA114TE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Resistor - Base (R1): 10 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: PNP - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PTN3380BBS,518 PTN3380B.pdf
PTN3380BBS,518
Hersteller: NXP USA Inc.
Description: IC VIDEO LEVEL SHIFTER 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: Consumer Video
Standards: DVI v1.0, HDMI v1.3a
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
Produkt ist nicht verfügbar
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TDA18250BHN/C1K TDA18250BHN_SDS.pdf
TDA18250BHN/C1K
Hersteller: NXP USA Inc.
Description: IC VIDEO TUNER 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
auf Bestellung 524 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7+3.01 EUR
10+2.21 EUR
25+2.01 EUR
100+1.78 EUR
250+1.68 EUR
500+1.62 EUR
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SPC5748CBK0AMMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 256LBGA
Qualification: AEC-Q100
Number of I/O: 178
Grade: Automotive
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, FlexRay, I2S, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 64x10b, 80x12b SAR
Core Processor: e200z2, e200z4
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz, 160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5748CK0AMKU6 MPC5748G.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 48x10b, 16x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz, 160MHz
DigiKey Programmable: Not Verified
Number of I/O: 129
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5748CBK0AVKU2
SPC5748CBK0AVKU2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MFS8603BMBA0ES FS8600_SDS.pdf?pspll=1
MFS8603BMBA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+15.14 EUR
10+11.73 EUR
25+10.88 EUR
100+9.95 EUR
260+9.48 EUR
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S9S12G64AMLH
S9S12G64AMLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMB17,115 PEMB17_PUMB17.pdf
PEMB17,115
Hersteller: NXP USA Inc.
Description: TRANS 2PNP PREBIAS 0.3W SOT666
Packaging: Bulk
auf Bestellung 266999 Stücke:
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AnzahlPrivatkunde
6772+0.076 EUR
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LD6815TD/36H,125 LD6815_Series.pdf
LD6815TD/36H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.6V 150MA 5-TSOP
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
PSRR: 75dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 3.6V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
auf Bestellung 78000 Stücke:
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AnzahlPrivatkunde
3328+0.18 EUR
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LD6816CX4/22P,315 LD6816.pdf
LD6816CX4/22P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 150MA 4-WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVC1G79GF,132 NEXP-S-A0003511411-1.pdf?t.download=true&u=5oefqw
74LVC1G79GF,132
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
auf Bestellung 10000 Stücke:
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AnzahlPrivatkunde
3129+0.2 EUR
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S912ZVLA64ACLCR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
Produkt ist nicht verfügbar
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S912ZVLA64ACLC
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
Produkt ist nicht verfügbar
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S912ZVLA64ACLFR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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S912ZVLA64ACLF
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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S912ZVLA64AMLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912ZVLA64AVFMR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 34
Produkt ist nicht verfügbar
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MC908QT1ACDWE MC68HC908QY4A.pdf
MC908QT1ACDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908QY1AMDWE MC68HLC908QY4.pdf
MC908QY1AMDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6L3DVN10AC IMX6SLCEC.pdf
MCIMX6L3DVN10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 9086 Stücke:
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AnzahlPrivatkunde
16+37.94 EUR
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MWCT2D16SHT1VPB RMMWCT2xxxS.pdf
Hersteller: NXP USA Inc.
Description: MWCT2D16S, MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
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MWCT2D17SHT1VPBR RMMWCT2xxxS.pdf
Hersteller: NXP USA Inc.
Description: MWCT2D17S,MAXQFP172
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWCT2D17SHT1VPB RMMWCT2xxxS.pdf
Hersteller: NXP USA Inc.
Description: MWCT2D17S,MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12XD256CAA 9S12XDFAMPP.pdf
MC9S12XD256CAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12XD256VAA
MC9S12XD256VAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12XD256VAG MC9S12XDP512RMV2.pdf
MC9S12XD256VAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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