Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35717) > Seite 514 nach 596
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| BTS6305CJ | NXP USA Inc. |
Description: RF AMPLIFIER BTS6305CPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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BTS6305UJ | NXP USA Inc. |
Description: 5G MASSIVE MIMO PRE-DRIVERPackaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 4.2GHz RF Type: 5G, TDD Voltage - Supply: 4.75V ~ 5.25V Gain: 42dB Current - Supply: 122mA Noise Figure: 3.5dB ~ 4dB P1dB: 28.5dBm Test Frequency: 3.6GHz Supplier Device Package: 16-HVQFN (3x3) |
Produkt ist nicht verfügbar |
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NX3P191UK,012 | NXP USA Inc. |
Description: IC PWR SWITCH HI SIDE LOG 4WLCSPPackaging: Bulk |
auf Bestellung 14492 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC55S36-EVK | NXP USA Inc. |
Description: LPC55S36 EVAL KITPackaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M33 Utilized IC / Part: LPC55S36 Platform: LPCXpresso™ |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5502JHI48J | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48VFQFNPackaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 7x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 48-HVQFN (7x7) Number of I/O: 30 |
Produkt ist nicht verfügbar |
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LPC5502JHI48EL | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48VFQFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 7x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 48-HVQFN (7x7) Number of I/O: 30 |
auf Bestellung 1209 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33905CS3EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOICPackaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
auf Bestellung 175 Stücke: Lieferzeit 10-14 Tag (e) |
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KMI25/2Z | NXP USA Inc. |
Description: KMI25 - HIGH PERFORMANCE ROTATIOPackaging: Bulk |
auf Bestellung 2489 Stücke: Lieferzeit 10-14 Tag (e) |
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| KMI23/4Z | NXP USA Inc. |
Description: HIGH PERFORMANCE ROTATIONAL SPEE Packaging: Bulk |
auf Bestellung 11156 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908GT16CBE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 42DIPPackaging: Tube Package / Case: 42-SDIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 42-PDIP Number of I/O: 36 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908GT8CBE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 42DIPPackaging: Tube Package / Case: 42-SDIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 42-PDIP Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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FS32K148HET0MLQR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 144LQFPPackaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 128 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MCIMX8DXL-WEVK | NXP USA Inc. |
Description: MCIMX8DXL-WEVK Packaging: Bulk Mounting Type: Fixed Type: MCU Contents: Board(s) Core Processor: ARM® Cortex®-A35, Cortex®-M4F Utilized IC / Part: i.MX 8XLite |
Produkt ist nicht verfügbar |
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S9S08AW32E5MFUE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFPPackaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| FXLS93433AESR2 | NXP USA Inc. |
Description: PSI5 XZ DUAL-AXIS HIGH-G INERTIPackaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) |
Produkt ist nicht verfügbar |
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| FXLS93333AESR2 | NXP USA Inc. |
Description: PSI5 XY DUAL-AXIS HIGH-G INERTIPackaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) |
Produkt ist nicht verfügbar |
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| FXLS90433AESR2 | NXP USA Inc. |
Description: XZ DUAL-AXIS HIGH-G INERTIAL SEPackaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) |
Produkt ist nicht verfügbar |
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| FXLS90733AESR2 | NXP USA Inc. |
Description: YZ DUAL-AXIS HIGH-G INERTIAL SEPackaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) |
Produkt ist nicht verfügbar |
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| FXLS90333AESR2 | NXP USA Inc. |
Description: XY DUAL-AXIS HIGH-G INERTIAL SEPackaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) |
Produkt ist nicht verfügbar |
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MC07XS6517DEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 54HSOPPackaging: Tape & Reel (TR) Features: Internal PWM Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 7mOhm, 17mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A, 11A Ratio - Input:Output: 2:3 Supplier Device Package: 54-HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature |
Produkt ist nicht verfügbar |
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MC07XS6517DEK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 54HSOPPackaging: Tube Features: Internal PWM Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 7mOhm, 17mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A, 11A Ratio - Input:Output: 2:3 Supplier Device Package: 54-HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature |
Produkt ist nicht verfügbar |
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| AFT26HW050SR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780-4S4 Mounting Type: Chassis Mount Frequency: 2.69GHz Configuration: Dual Power - Output: 9W Gain: 14.2dB Technology: LDMOS Supplier Device Package: NI-780-4S4 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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MCIMX6S4AVM08ADR | NXP USA Inc. |
Description: IC MPU I.MX6S 800MHZ 624MAPBGAPackaging: Tape & Reel (TR) Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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OL2385AHN/001A2Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 48HVQFNPackaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -123dBm Mounting Type: Surface Mount Frequency: 158MHz ~ 960MHz Memory Size: 7kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 5.5V Power - Output: 14dBm Protocol: Sigfox, Wireless M-Bus, Zigbee® Current - Receiving: 600nA ~ 11mA Data Rate (Max): 400kbps Current - Transmitting: 500µA ~ 33mA Supplier Device Package: 48-HVQFN (7x7) GPIO: 12 Modulation: 2-FSK, 4-FSK, ASK, FSK, GFSK, OOK RF Family/Standard: 802.15.4 Serial Interfaces: GPIO, SPI, UART, USART |
Produkt ist nicht verfügbar |
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PCA9634PW,112 | NXP USA Inc. |
Description: IC LED DRVR PS I2C 25MA 20TSSOPPackaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Voltage - Output: 5.5V Mounting Type: Surface Mount Number of Outputs: 8 Frequency: 25MHz Type: Power Switch Operating Temperature: -40°C ~ 85°C (TA) Applications: Backlight Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 20-TSSOP Dimming: I2C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V |
Produkt ist nicht verfügbar |
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| SSL5251T/1118 | NXP USA Inc. |
Description: MAINS DIMMABLE BUCKPackaging: Bulk |
auf Bestellung 6754 Stücke: Lieferzeit 10-14 Tag (e) |
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SSL5237TE/1518 | NXP USA Inc. |
Description: 10 OHM/700 VOLT MAINS DIMMABLE B Packaging: Bulk |
auf Bestellung 2429 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC33PT2001HAER2 | NXP USA Inc. |
Description: PROGRAMMABLE SOLENOID CONTROLLERPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0V ~ 72V Applications: Solenoid Controller Supplier Device Package: 64-HLQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC33PT2001HMAER2 | NXP USA Inc. |
Description: PROGRAMMABLE SOLENOID CONTROLLERPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0V ~ 72V Applications: Solenoid Controller Supplier Device Package: 64-HLQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC33PT2001AER2 | NXP USA Inc. |
Description: SOLENOID CONTROLLER 6 64LQFPPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0V ~ 72V Applications: Solenoid Controller Supplier Device Package: 64-HLQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| MC33PT2001HAE | NXP USA Inc. |
Description: PROGRAMMABLE SOLENOID CONTROLLERPackaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0V ~ 72V Applications: Solenoid Controller Supplier Device Package: 64-HLQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC33PT2001HMAE | NXP USA Inc. |
Description: PROGRAMMABLE SOLENOID CONTROLLERPackaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0V ~ 72V Applications: Solenoid Controller Supplier Device Package: 64-HLQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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IP4365CX11/P135 | NXP USA Inc. |
Description: DATA LINE FILTERPackaging: Bulk |
auf Bestellung 122437 Stücke: Lieferzeit 10-14 Tag (e) |
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| MF4SAM3HN/9BA6AUZ | NXP USA Inc. |
Description: MF4SAM3HN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 850kHz ~ 11.5MHz Interface: I2C, UART Type: RFID Reader Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V Standards: Mifare, ISO 14443, ISO 7816-4 Supplier Device Package: 32-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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| MF4SAM3HN/9BA6AUZ | NXP USA Inc. |
Description: MF4SAM3HN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 850kHz ~ 11.5MHz Interface: I2C, UART Type: RFID Reader Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V Standards: Mifare, ISO 14443, ISO 7816-4 Supplier Device Package: 32-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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TEA19363T/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 10SOPackaging: Tape & Reel (TR) Package / Case: 10-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -25°C ~ 125°C (TJ) Frequency - Switching: 25.5kHz ~ 128kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 0V ~ 120V Supplier Device Package: 10-SO Fault Protection: Over Power, Over Temperature, Over Voltage Voltage - Start Up: 14.9 V |
Produkt ist nicht verfügbar |
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TEA19363T/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 10SOPackaging: Cut Tape (CT) Package / Case: 10-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -25°C ~ 125°C (TJ) Frequency - Switching: 25.5kHz ~ 128kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 0V ~ 120V Supplier Device Package: 10-SO Fault Protection: Over Power, Over Temperature, Over Voltage Voltage - Start Up: 14.9 V |
auf Bestellung 2499 Stücke: Lieferzeit 10-14 Tag (e) |
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| TDA8034HN/C2J | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 24HVQFNPackaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: Analog Voltage - Supply: 1.8V, 3V, 5V Supplier Device Package: 24-HVQFN (4x4) |
Produkt ist nicht verfügbar |
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| TDA8034HN/C2EL | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 24HVQFNPackaging: Tray Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: Analog Voltage - Supply: 1.8V, 3V, 5V Supplier Device Package: 24-HVQFN (4x4) |
Produkt ist nicht verfügbar |
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| TDA8034HN/C2QL | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 24HVQFNPackaging: Tray Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: Analog Voltage - Supply: 1.8V, 3V, 5V Supplier Device Package: 24-HVQFN (4x4) |
Produkt ist nicht verfügbar |
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| TDA8026ET/C3K | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 64TFBGAPackaging: Tray Package / Case: 64-TFBGA Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 2.7V ~ 5.5V Supplier Device Package: 64-TFBGA (7x7) |
Produkt ist nicht verfügbar |
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| TDA8026ET/C3Y | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 64TFBGAPackaging: Tape & Reel (TR) Package / Case: 64-TFBGA Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 2.7V ~ 5.5V Supplier Device Package: 64-TFBGA (7x7) |
Produkt ist nicht verfügbar |
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| TDA8026ET/C3E | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 64TFBGAPackaging: Tray Package / Case: 64-TFBGA Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 2.7V ~ 5.5V Supplier Device Package: 64-TFBGA (7x7) |
Produkt ist nicht verfügbar |
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LPC3131FET180,551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 180TFBGAPackaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 192K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM926EJ-S Data Converters: A/D 4x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) DigiKey Programmable: Not Verified |
auf Bestellung 189 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVC32PW,112 | NXP USA Inc. |
Description: IC GATE OR 4CH 2-INP 14-TSSOPPackaging: Tube |
auf Bestellung 4800 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9421BSZ | NXP USA Inc. |
Description: IC PMIC HVQFN24Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.3V ~ 5.5V Applications: Microcontroller, MCU Current - Supply: 5.5µA Supplier Device Package: 24-HVQFN (3x3) |
Produkt ist nicht verfügbar |
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PCA9421BSZ | NXP USA Inc. |
Description: IC PMIC HVQFN24Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.3V ~ 5.5V Applications: Microcontroller, MCU Current - Supply: 5.5µA Supplier Device Package: 24-HVQFN (3x3) |
auf Bestellung 1390 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF7772EL/200Z13AY | NXP USA Inc. |
Description: SAF7772EL Packaging: Tape & Reel (TR) Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
Produkt ist nicht verfügbar |
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| SAF7771EL/200Z13AY | NXP USA Inc. |
Description: SAF7771EL Packaging: Tape & Reel (TR) Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF7772EL/200Z13AK | NXP USA Inc. |
Description: SAF7772EL Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF7771EL/200Z13AK | NXP USA Inc. |
Description: SAF7771EL Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF7770EL/200Z13AY | NXP USA Inc. |
Description: SAF7770EL Packaging: Tape & Reel (TR) Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF7770EL/101Z13AY | NXP USA Inc. |
Description: SAF7770EL Packaging: Tape & Reel (TR) Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF7770EL/200Z13AK | NXP USA Inc. |
Description: SAF7770EL Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF7770EL/101Z13AK | NXP USA Inc. |
Description: SAF7770EL Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF7770EL/203Z13AY | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF7770EL/203Z13AK | NXP USA Inc. |
Description: IC Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF4000EL/101Z13AY | NXP USA Inc. |
Description: SAF4000EL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF4000EL/101Z13AK | NXP USA Inc. |
Description: SAF4000EL Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
|
MC34VR500V4ESR2 | NXP USA Inc. |
Description: REGULATOR BUCK QUAD WITH UP TOPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 250µA Supplier Device Package: 56-QFN-EP (8x8) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| BTS6305UJ |
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Hersteller: NXP USA Inc.
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 42dB
Current - Supply: 122mA
Noise Figure: 3.5dB ~ 4dB
P1dB: 28.5dBm
Test Frequency: 3.6GHz
Supplier Device Package: 16-HVQFN (3x3)
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 42dB
Current - Supply: 122mA
Noise Figure: 3.5dB ~ 4dB
P1dB: 28.5dBm
Test Frequency: 3.6GHz
Supplier Device Package: 16-HVQFN (3x3)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NX3P191UK,012 |
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auf Bestellung 14492 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 908+ | 0.5 EUR |
| LPC55S36-EVK |
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Hersteller: NXP USA Inc.
Description: LPC55S36 EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: LPC55S36
Platform: LPCXpresso™
Description: LPC55S36 EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: LPC55S36
Platform: LPCXpresso™
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 113.89 EUR |
| LPC5502JHI48J |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC5502JHI48EL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 1209 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 5+ | 4.31 EUR |
| 10+ | 4.08 EUR |
| 25+ | 3.81 EUR |
| 100+ | 3.51 EUR |
| 250+ | 3.36 EUR |
| 500+ | 3.21 EUR |
| MCZ33905CS3EK |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
auf Bestellung 175 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 17.42 EUR |
| 10+ | 13.61 EUR |
| 42+ | 12.22 EUR |
| 126+ | 11.47 EUR |
| KMI25/2Z |
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auf Bestellung 2489 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 179+ | 2.7 EUR |
| KMI23/4Z |
auf Bestellung 11156 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 177+ | 2.73 EUR |
| MC908GT16CBE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC908GT8CBE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32K148HET0MLQR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX8DXL-WEVK |
Hersteller: NXP USA Inc.
Description: MCIMX8DXL-WEVK
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-A35, Cortex®-M4F
Utilized IC / Part: i.MX 8XLite
Description: MCIMX8DXL-WEVK
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-A35, Cortex®-M4F
Utilized IC / Part: i.MX 8XLite
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S08AW32E5MFUE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FXLS93433AESR2 |
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Hersteller: NXP USA Inc.
Description: PSI5 XZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Description: PSI5 XZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FXLS93333AESR2 |
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Hersteller: NXP USA Inc.
Description: PSI5 XY DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Description: PSI5 XY DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FXLS90433AESR2 |
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Hersteller: NXP USA Inc.
Description: XZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Description: XZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FXLS90733AESR2 |
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Hersteller: NXP USA Inc.
Description: YZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Description: YZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FXLS90333AESR2 |
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Hersteller: NXP USA Inc.
Description: XY DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Description: XY DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC07XS6517DEKR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tape & Reel (TR)
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tape & Reel (TR)
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC07XS6517DEK |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tube
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tube
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| AFT26HW050SR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S4
Mounting Type: Chassis Mount
Frequency: 2.69GHz
Configuration: Dual
Power - Output: 9W
Gain: 14.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4S4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S4
Mounting Type: Chassis Mount
Frequency: 2.69GHz
Configuration: Dual
Power - Output: 9W
Gain: 14.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4S4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCIMX6S4AVM08ADR |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
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| OL2385AHN/001A2Y |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -123dBm
Mounting Type: Surface Mount
Frequency: 158MHz ~ 960MHz
Memory Size: 7kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Protocol: Sigfox, Wireless M-Bus, Zigbee®
Current - Receiving: 600nA ~ 11mA
Data Rate (Max): 400kbps
Current - Transmitting: 500µA ~ 33mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: 2-FSK, 4-FSK, ASK, FSK, GFSK, OOK
RF Family/Standard: 802.15.4
Serial Interfaces: GPIO, SPI, UART, USART
Description: IC RF TXRX+MCU 802.15.4 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -123dBm
Mounting Type: Surface Mount
Frequency: 158MHz ~ 960MHz
Memory Size: 7kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Protocol: Sigfox, Wireless M-Bus, Zigbee®
Current - Receiving: 600nA ~ 11mA
Data Rate (Max): 400kbps
Current - Transmitting: 500µA ~ 33mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: 2-FSK, 4-FSK, ASK, FSK, GFSK, OOK
RF Family/Standard: 802.15.4
Serial Interfaces: GPIO, SPI, UART, USART
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PCA9634PW,112 |
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Hersteller: NXP USA Inc.
Description: IC LED DRVR PS I2C 25MA 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Description: IC LED DRVR PS I2C 25MA 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SSL5251T/1118 |
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auf Bestellung 6754 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 683+ | 0.71 EUR |
| SSL5237TE/1518 |
auf Bestellung 2429 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 579+ | 0.83 EUR |
| MC33PT2001HAER2 |
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Hersteller: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC33PT2001HMAER2 |
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Hersteller: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC33PT2001AER2 |
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Hersteller: NXP USA Inc.
Description: SOLENOID CONTROLLER 6 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: SOLENOID CONTROLLER 6 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC33PT2001HAE |
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Hersteller: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33PT2001HMAE |
![]() |
Hersteller: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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| IP4365CX11/P135 |
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auf Bestellung 122437 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2219+ | 0.22 EUR |
| MF4SAM3HN/9BA6AUZ |
Hersteller: NXP USA Inc.
Description: MF4SAM3HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
Description: MF4SAM3HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MF4SAM3HN/9BA6AUZ |
Hersteller: NXP USA Inc.
Description: MF4SAM3HN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
Description: MF4SAM3HN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TEA19363T/1J |
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Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA19363T/1J |
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Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
auf Bestellung 2499 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8+ | 2.27 EUR |
| 11+ | 1.65 EUR |
| 25+ | 1.49 EUR |
| 100+ | 1.32 EUR |
| 250+ | 1.24 EUR |
| 500+ | 1.19 EUR |
| 1000+ | 1.15 EUR |
| TDA8034HN/C2J |
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Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TDA8034HN/C2EL |
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Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA8034HN/C2QL |
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Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TDA8026ET/C3K |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TDA8026ET/C3Y |
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Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Description: IC INTFACE SPECIALIZED 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TDA8026ET/C3E |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| LPC3131FET180,551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
DigiKey Programmable: Not Verified
auf Bestellung 189 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 189+ | 17.77 EUR |
| 74ALVC32PW,112 |
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auf Bestellung 4800 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2664+ | 0.18 EUR |
| PCA9421BSZ |
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Hersteller: NXP USA Inc.
Description: IC PMIC HVQFN24
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
Description: IC PMIC HVQFN24
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9421BSZ |
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Hersteller: NXP USA Inc.
Description: IC PMIC HVQFN24
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
Description: IC PMIC HVQFN24
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
auf Bestellung 1390 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 5+ | 4.38 EUR |
| 10+ | 3.27 EUR |
| 25+ | 3 EUR |
| 100+ | 2.69 EUR |
| 250+ | 2.55 EUR |
| 500+ | 2.46 EUR |
| SAF7772EL/200Z13AY |
Hersteller: NXP USA Inc.
Description: SAF7772EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7772EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF7771EL/200Z13AY |
Hersteller: NXP USA Inc.
Description: SAF7771EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7771EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF7772EL/200Z13AK |
Hersteller: NXP USA Inc.
Description: SAF7772EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7772EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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| SAF7771EL/200Z13AK |
Hersteller: NXP USA Inc.
Description: SAF7771EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7771EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF7770EL/200Z13AY |
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF7770EL/101Z13AY |
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF7770EL/200Z13AK |
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF7770EL/101Z13AK |
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC34VR500V4ESR2 |
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Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
Im Einkaufswagen
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