Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34506) > Seite 517 nach 576
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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BZB784-C4V3,115 | NXP USA Inc. |
Description: DIODE ZENER DUAL 4.3V SOT323 Packaging: Bulk |
auf Bestellung 113500 Stücke: Lieferzeit 10-14 Tag (e) |
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BZB784-C2V4,115 | NXP USA Inc. |
Description: DIODE ZENER DUAL 2.4V SOT323 Packaging: Bulk |
auf Bestellung 23500 Stücke: Lieferzeit 10-14 Tag (e) |
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MBC13917EPR2 | NXP USA Inc. |
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD Packaging: Tape & Reel (TR) Package / Case: 6-UFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 100MHz ~ 2.5GHz RF Type: General Purpose Voltage - Supply: 2.1V ~ 3.3V Gain: 14.9dB Current - Supply: 20mA Noise Figure: 1.8dB P1dB: -1.1dB Test Frequency: 1.9GHz Supplier Device Package: 6-MLPD-EP (1.5x2) |
Produkt ist nicht verfügbar |
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MBC13917EPR2 | NXP USA Inc. |
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD Packaging: Cut Tape (CT) Package / Case: 6-UFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 100MHz ~ 2.5GHz RF Type: General Purpose Voltage - Supply: 2.1V ~ 3.3V Gain: 14.9dB Current - Supply: 20mA Noise Figure: 1.8dB P1dB: -1.1dB Test Frequency: 1.9GHz Supplier Device Package: 6-MLPD-EP (1.5x2) |
Produkt ist nicht verfügbar |
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S9S12VR48AACLCR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 2x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 16 |
Produkt ist nicht verfügbar |
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S9S12VR48AACLC | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 2x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 16 |
Produkt ist nicht verfügbar |
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S9S12VR48AACLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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S9S12VR48AACLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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S9S12VR48AAVLCR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 2x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 16 |
Produkt ist nicht verfügbar |
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S9S12VR48AAMLCR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 2x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 16 |
Produkt ist nicht verfügbar |
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S9S12VR48AAMLC | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 2x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 16 |
Produkt ist nicht verfügbar |
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S9S12VR48AAMLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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S9S12VR48AAVLC | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 2x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 16 |
Produkt ist nicht verfügbar |
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S9S12VR48AAVLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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S9S12VR48AAMLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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S9S12VR48AAVLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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PCA9450B-EVK | NXP USA Inc. |
Description: PCA9450B-EVK Packaging: Bulk Function: Power Supply Type: Power Management Utilized IC / Part: PCA9450 Supplied Contents: Board(s), Cable(s), Accessories Embedded: Yes |
Produkt ist nicht verfügbar |
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PCA9450C-EVK | NXP USA Inc. |
Description: PCA9450C-EVK Packaging: Bulk Function: Power Supply Type: Power Management Utilized IC / Part: PCA9450 Supplied Contents: Board(s), Cable(s), Accessories Embedded: Yes |
Produkt ist nicht verfügbar |
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PCA9450AA-EVK | NXP USA Inc. |
Description: PCA9450AA-EVK Packaging: Bulk |
Produkt ist nicht verfügbar |
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AFLP5G25641T6 | NXP USA Inc. |
Description: AIRFAST PRE-DRIVER MODULE, 2300- Packaging: Tape & Reel (TR) Package / Case: 17-LFLGA Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.7GHz RF Type: General Purpose Voltage - Supply: 3.3V, 5V Gain: 32dB Current - Supply: 2.2mA P1dB: 29dBm Test Frequency: 2.5GHz Supplier Device Package: 17-HLFLGA (4x3) |
Produkt ist nicht verfügbar |
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A3M40PD012T7 | NXP USA Inc. |
Description: AIRFAST PRE-DRIVER MODULE, 2300- Packaging: Tape & Reel (TR) Package / Case: 12-WFLGA Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 4.2GHz RF Type: Cellular Voltage - Supply: 3.3V Gain: 34dB Current - Supply: 90mA P1dB: 25dBm Test Frequency: 3.5GHz Supplier Device Package: 12-PLGA (2.2x2.2) |
Produkt ist nicht verfügbar |
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AFLP5G35645T6 | NXP USA Inc. |
Description: AIRFAST PRE-DRIVER MODULE, 3400- Packaging: Tape & Reel (TR) Package / Case: 17-LFLGA Exposed Pad Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.8GHz RF Type: General Purpose Voltage - Supply: 3.3V, 5V Gain: 31.5dB Current - Supply: 2.2mA P1dB: 29dBm Test Frequency: 3.5GHz Supplier Device Package: 17-HLFLGA (4x3) |
Produkt ist nicht verfügbar |
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AFSC5G23E37T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.4GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 35dB Test Frequency: 2.3GHz, 2.4GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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AFSC5G26E38T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.496GHz ~ 2.69GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 31V Gain: 32dB Current - Supply: 48mA Test Frequency: 2.69GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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AFSC5G26F38T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.496GHz ~ 2.69GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 36.7dB Test Frequency: 2.69GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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AFSC5G35E38T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.7GHz RF Type: General Purpose Voltage - Supply: 24V ~ 31V Gain: 30.5dB Test Frequency: 3.6GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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AFSC5G40E38T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.7GHz ~ 4GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 28.8dB Test Frequency: 4GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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AFSC5G23E39T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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AFSC5G26E39T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.496GHz ~ 2.69GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 28dB Current - Supply: 65mA Test Frequency: 2.69GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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A3M35TL039T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.3GHz ~ 3.7GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 28.8dBm Test Frequency: 3.4GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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A3M39TL039T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.7GHz ~ 3.98GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 27.6dB Test Frequency: 3.98GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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A3M37TL039T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.6GHz ~ 3.8GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 27.1dB Test Frequency: 3.6GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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A3M34TL139T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.3GHz ~ 3.58GHz RF Type: LTE Voltage - Supply: 24V ~ 30V Gain: 27.3dB Test Frequency: 3.3GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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A3M36SL039SAAT2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE W Packaging: Tape & Reel (TR) Package / Case: 38-PowerLFLGA Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.8GHz RF Type: Wireless LAN Voltage - Supply: 29V Gain: 29.8dB Test Frequency: 3.4GHz ~ 3.8GHz Supplier Device Package: 38-PLGA (10x8) |
Produkt ist nicht verfügbar |
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A3M36SL039IAAT2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE W Packaging: Tape & Reel (TR) Package / Case: 38-PowerLFLGA Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.8GHz RF Type: LTE Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V Gain: 28.2dB Test Frequency: 3.4GHz Supplier Device Package: 38-PLGA (10x8) |
Produkt ist nicht verfügbar |
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A3M34SL039IAAT2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE W Packaging: Tape & Reel (TR) Package / Case: 38-PowerLFLGA Mounting Type: Surface Mount Frequency: 3.3GHz ~ 3.7GHz RF Type: General Purpose Voltage - Supply: 4.75V ~ 5.25V Gain: 29.6dB Current - Supply: 11mA Test Frequency: 3.3GHz ~ 3.7GHz Supplier Device Package: 38-PLGA (10x8) |
Produkt ist nicht verfügbar |
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A3M38SL039IAAT2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE W Packaging: Tape & Reel (TR) Package / Case: 38-PowerLFLGA Mounting Type: Surface Mount Frequency: 3.3GHz ~ 3.7GHz RF Type: General Purpose Voltage - Supply: 4.75V ~ 5.25V Gain: 29.6dB Current - Supply: 11mA Test Frequency: 3.3GHz ~ 3.7GHz Supplier Device Package: 38-PLGA (10x8) |
Produkt ist nicht verfügbar |
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A3M39SL039IAAT2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE W Packaging: Tape & Reel (TR) Package / Case: 38-PowerLFLGA Mounting Type: Surface Mount Frequency: 3.7GHz ~ 3.98GHz RF Type: 5G, LTE, TDD Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V Gain: 28.3dB Test Frequency: 3.7GHz ~ 3.98GHz Supplier Device Package: 38-PLGA (10x8) |
Produkt ist nicht verfügbar |
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A5M39TG140T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.7GHz ~ 3.98GHz RF Type: 5G, LTE, TDD Voltage - Supply: 4.75V ~ 5.25V Gain: 32.7dB Current - Supply: 40mA Test Frequency: 3.7GHz ~ 3.98GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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A5M36TG140T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.3GHz ~ 3.8GHz RF Type: General Purpose Voltage - Supply: 4.75V ~ 5.25V Gain: 31.8dB Test Frequency: 3.3GHz ~ 3.8GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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74AUP1G885GN115 | NXP USA Inc. |
Description: NOW NEXPERIA 74AUP1G885GN - XOR Packaging: Bulk Package / Case: 8-XFDFN Output Type: Single-Ended Mounting Type: Surface Mount Logic Type: Configurable Multiple Function Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Schmitt Trigger Input: No Supplier Device Package: 8-XSON (1.2x1) Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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PCF85103C-2T/00:11 | NXP USA Inc. |
Description: IC EEPROM 2KBIT I2C 100KHZ 8SO Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 2Kbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 6.0V Technology: EEPROM Clock Frequency: 100 kHz Memory Format: EEPROM Supplier Device Package: 8-SO Memory Interface: I²C Memory Organization: 256 x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68030CRC25C | NXP USA Inc. |
Description: IC MPU M680X0 25MHZ 128PGA Packaging: Tray Package / Case: 128-BPGA Mounting Type: Through Hole Speed: 25MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: 68030 Voltage - I/O: 5.0V Supplier Device Package: 128-PGA (34.55x34.55) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MC68030CRC33C | NXP USA Inc. |
Description: IC MPU M680X0 33MHZ 128PGA Packaging: Tray Package / Case: 128-BPGA Mounting Type: Through Hole Speed: 33MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: 68030 Voltage - I/O: 5.0V Supplier Device Package: 128-PGA (34.55x34.55) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MC68030FE16C | NXP USA Inc. |
Description: IC MPU M680X0 166MHZ 132CQFP Packaging: Tray Package / Case: 132-BCQFP Mounting Type: Surface Mount Speed: 166MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68030 Voltage - I/O: 5.0V Supplier Device Package: 132-CQFP (24x24) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MC68030FE20C | NXP USA Inc. |
Description: IC MPU M680X0 20MHZ 132CQFP Packaging: Tray Package / Case: 132-BCQFP Mounting Type: Surface Mount Speed: 20MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68030 Voltage - I/O: 5.0V Supplier Device Package: 132-CQFP (24x24) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MC68030RC16C | NXP USA Inc. |
Description: IC MPU M680X0 166MHZ 128PGA Packaging: Tray Package / Case: 128-BPGA Mounting Type: Through Hole Speed: 166MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68030 Voltage - I/O: 5.0V Supplier Device Package: 128-PGA (34.55x34.55) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MC68030RC25C | NXP USA Inc. |
Description: IC MPU M680X0 25MHZ 128PGA Packaging: Tray Package / Case: 128-BPGA Mounting Type: Through Hole Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68030 Voltage - I/O: 5.0V Supplier Device Package: 128-PGA (34.55x34.55) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MC68030RC50C | NXP USA Inc. |
Description: IC MPU M680X0 50MHZ 128PGA Packaging: Tray Package / Case: 128-BPGA Mounting Type: Through Hole Speed: 50MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68030 Voltage - I/O: 5.0V Supplier Device Package: 128-PGA (34.55x34.55) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MC68040RC25V | NXP USA Inc. |
Description: IC MPU M680X0 25MHZ 182PGA Packaging: Tray Package / Case: 182-BEPGA Mounting Type: Through Hole Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68040 Voltage - I/O: 5.0V Supplier Device Package: 182-PGA (47.24x47.24) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MC33FS8500A0KSR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC33FS8500A0ESR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) |
Produkt ist nicht verfügbar |
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BUK7230-55A,118 | NXP USA Inc. |
Description: PFET, 38A I(D), 55V, 0.03OHM, 1- Packaging: Bulk Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 38A (Tc) Rds On (Max) @ Id, Vgs: 30mOhm @ 25A, 10V Power Dissipation (Max): 88W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: DPAK Grade: Automotive Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 55 V Input Capacitance (Ciss) (Max) @ Vds: 1152 pF @ 25 V Qualification: AEC-Q101 |
auf Bestellung 6270 Stücke: Lieferzeit 10-14 Tag (e) |
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MFS8600BMBA0ESR2 | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP FOR DOM Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Camera Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MFS8600BMDA0ESR2 | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP FOR DOM Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Camera Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MFS8600BMBA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 60V Applications: Camera Supplier Device Package: 48-QFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MFS8600BMDA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 60V Applications: Camera Supplier Device Package: 48-QFN (7x7) |
Produkt ist nicht verfügbar |
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PTN3393BS/F1Y | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: DisplayPort Supplier Device Package: 40-HVQFN (6x6) |
Produkt ist nicht verfügbar |
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PTN3393BS/F1Y | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 40HVQFN Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: DisplayPort Supplier Device Package: 40-HVQFN (6x6) |
auf Bestellung 3895 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33FS6511CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
BZB784-C4V3,115 |
auf Bestellung 113500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10452+ | 0.053 EUR |
BZB784-C2V4,115 |
auf Bestellung 23500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10452+ | 0.053 EUR |
MBC13917EPR2 |
Hersteller: NXP USA Inc.
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Tape & Reel (TR)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Tape & Reel (TR)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
Produkt ist nicht verfügbar
MBC13917EPR2 |
Hersteller: NXP USA Inc.
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
Produkt ist nicht verfügbar
S9S12VR48AACLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
S9S12VR48AACLC |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
S9S12VR48AACLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
S9S12VR48AACLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
S9S12VR48AAVLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
S9S12VR48AAMLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
S9S12VR48AAMLC |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
S9S12VR48AAMLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
S9S12VR48AAVLC |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
S9S12VR48AAVLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
S9S12VR48AAMLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
S9S12VR48AAVLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
PCA9450B-EVK |
Hersteller: NXP USA Inc.
Description: PCA9450B-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
Description: PCA9450B-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
Produkt ist nicht verfügbar
PCA9450C-EVK |
Hersteller: NXP USA Inc.
Description: PCA9450C-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
Description: PCA9450C-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
Produkt ist nicht verfügbar
PCA9450AA-EVK |
Produkt ist nicht verfügbar
AFLP5G25641T6 |
Hersteller: NXP USA Inc.
Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 32dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 2.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 32dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 2.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
Produkt ist nicht verfügbar
A3M40PD012T7 |
Hersteller: NXP USA Inc.
Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 12-WFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: Cellular
Voltage - Supply: 3.3V
Gain: 34dB
Current - Supply: 90mA
P1dB: 25dBm
Test Frequency: 3.5GHz
Supplier Device Package: 12-PLGA (2.2x2.2)
Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 12-WFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: Cellular
Voltage - Supply: 3.3V
Gain: 34dB
Current - Supply: 90mA
P1dB: 25dBm
Test Frequency: 3.5GHz
Supplier Device Package: 12-PLGA (2.2x2.2)
Produkt ist nicht verfügbar
AFLP5G35645T6 |
Hersteller: NXP USA Inc.
Description: AIRFAST PRE-DRIVER MODULE, 3400-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 31.5dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 3.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
Description: AIRFAST PRE-DRIVER MODULE, 3400-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 31.5dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 3.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
Produkt ist nicht verfügbar
AFSC5G23E37T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 35dB
Test Frequency: 2.3GHz, 2.4GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 35dB
Test Frequency: 2.3GHz, 2.4GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
AFSC5G26E38T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 31V
Gain: 32dB
Current - Supply: 48mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 31V
Gain: 32dB
Current - Supply: 48mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
AFSC5G26F38T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 36.7dB
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 36.7dB
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
AFSC5G35E38T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 24V ~ 31V
Gain: 30.5dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 24V ~ 31V
Gain: 30.5dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
AFSC5G40E38T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dB
Test Frequency: 4GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dB
Test Frequency: 4GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
AFSC5G23E39T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
AFSC5G26E39T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28dB
Current - Supply: 65mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28dB
Current - Supply: 65mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
A3M35TL039T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dBm
Test Frequency: 3.4GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dBm
Test Frequency: 3.4GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
A3M39TL039T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.6dB
Test Frequency: 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.6dB
Test Frequency: 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
A3M37TL039T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.1dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.1dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
A3M34TL139T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.58GHz
RF Type: LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.3GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.58GHz
RF Type: LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.3GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
A3M36SL039SAAT2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: Wireless LAN
Voltage - Supply: 29V
Gain: 29.8dB
Test Frequency: 3.4GHz ~ 3.8GHz
Supplier Device Package: 38-PLGA (10x8)
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: Wireless LAN
Voltage - Supply: 29V
Gain: 29.8dB
Test Frequency: 3.4GHz ~ 3.8GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
A3M36SL039IAAT2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: LTE
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.2dB
Test Frequency: 3.4GHz
Supplier Device Package: 38-PLGA (10x8)
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: LTE
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.2dB
Test Frequency: 3.4GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
A3M34SL039IAAT2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
A3M38SL039IAAT2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
A3M39SL039IAAT2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.3dB
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 38-PLGA (10x8)
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.3dB
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 38-PLGA (10x8)
Produkt ist nicht verfügbar
A5M39TG140T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 32.7dB
Current - Supply: 40mA
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 32.7dB
Current - Supply: 40mA
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
A5M36TG140T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.8dB
Test Frequency: 3.3GHz ~ 3.8GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.8dB
Test Frequency: 3.3GHz ~ 3.8GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
74AUP1G885GN115 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AUP1G885GN - XOR
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (1.2x1)
Number of Circuits: 1
Description: NOW NEXPERIA 74AUP1G885GN - XOR
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (1.2x1)
Number of Circuits: 1
Produkt ist nicht verfügbar
PCF85103C-2T/00:11 |
Hersteller: NXP USA Inc.
Description: IC EEPROM 2KBIT I2C 100KHZ 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6.0V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I²C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Description: IC EEPROM 2KBIT I2C 100KHZ 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6.0V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I²C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68030CRC25C |
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC68030CRC33C |
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 33MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 33MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC68030FE16C |
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 166MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 166MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC68030FE20C |
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 20MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC68030RC16C |
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 166MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 166MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC68030RC25C |
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC68030RC50C |
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 50MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 50MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 50MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 50MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC68040RC25V |
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 182PGA
Packaging: Tray
Package / Case: 182-BEPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 182-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 25MHZ 182PGA
Packaging: Tray
Package / Case: 182-BEPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 182-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC33FS8500A0KSR2 |
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC33FS8500A0ESR2 |
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
BUK7230-55A,118 |
Hersteller: NXP USA Inc.
Description: PFET, 38A I(D), 55V, 0.03OHM, 1-
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 38A (Tc)
Rds On (Max) @ Id, Vgs: 30mOhm @ 25A, 10V
Power Dissipation (Max): 88W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1152 pF @ 25 V
Qualification: AEC-Q101
Description: PFET, 38A I(D), 55V, 0.03OHM, 1-
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 38A (Tc)
Rds On (Max) @ Id, Vgs: 30mOhm @ 25A, 10V
Power Dissipation (Max): 88W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1152 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 6270 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
673+ | 0.74 EUR |
MFS8600BMBA0ESR2 |
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MFS8600BMDA0ESR2 |
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MFS8600BMBA0ES |
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MFS8600BMDA0ES |
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Produkt ist nicht verfügbar
PTN3393BS/F1Y |
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
PTN3393BS/F1Y |
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 3895 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.32 EUR |
10+ | 4.77 EUR |
25+ | 4.51 EUR |
100+ | 3.91 EUR |
250+ | 3.71 EUR |
500+ | 3.33 EUR |
1000+ | 2.81 EUR |
MC33FS6511CAER2 |
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar