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P1013NXE2HFB P1013NXE2HFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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P1022NSE2HFB P1022NSE2HFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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MIMXRT595SFFOC MIMXRT595SFFOC NXP USA Inc. IMXRTPORTBR.pdf Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tray
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
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10+26.57 EUR
25+24.94 EUR
80+24.86 EUR
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S908AB32AH3MFUE S908AB32AH3MFUE NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A5M36TG140-3400 NXP USA Inc. A5M36TG140-TC.pdf Description: A5M36TG140T2 REFERENCE CIRCUIT
Packaging: Box
For Use With/Related Products: A5M36TG140
Frequency: 3.3GHz ~ 3.8GHz
Type: Power Amplifier
Supplied Contents: Board(s)
Contents: Board(s)
Utilized IC / Part: A5M36TG140
auf Bestellung 4 Stücke:
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BUK968R3-40E,118 BUK968R3-40E,118 NXP USA Inc. Description: MOSFET N-CH 40V 75A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.4mOhm @ 20A, 10V
Power Dissipation (Max): 96W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: D2PAK
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 20.9 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 2600 pF @ 25 V
Produkt ist nicht verfügbar
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74HCT259DB,112 74HCT259DB,112 NXP USA Inc. 74HC_HCT259.pdf Description: IC 8BIT ADDRESSABLE LATCH 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Delay Time - Propagation: 20ns
Supplier Device Package: 16-SSOP
auf Bestellung 2169 Stücke:
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767+0.63 EUR
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MC9S08JM60CGT MC9S08JM60CGT NXP USA Inc. MC9S08JM60.pdf Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 37
DigiKey Programmable: Verified
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MK50DN512CLQ10 MK50DN512CLQ10 NXP USA Inc. K50PB.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
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10+22.95 EUR
60+20.36 EUR
120+19.66 EUR
240+19.08 EUR
480+18.61 EUR
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BZV55-B62,115 BZV55-B62,115 NXP USA Inc. PHGLS22257-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 62V 500MW LLDS
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 62 V
Impedance (Max) (Zzt): 215 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 43.4 V
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13172+0.034 EUR
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MC35FS6502NAE MC35FS6502NAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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S32G379AACK1VUCT S32G379AACK1VUCT NXP USA Inc. S32G2.pdf Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
auf Bestellung 109 Stücke:
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10+160.18 EUR
25+154.56 EUR
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LPC865M201JHI48/0E LPC865M201JHI48/0E NXP USA Inc. LPC86x.pdf Description: IC MCU CORTEX M0+ HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
auf Bestellung 549 Stücke:
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25+3.28 EUR
80+2.77 EUR
260+2.4 EUR
520+2.23 EUR
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SAC57D53MCVLTR NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 208LQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAC57D54HCVLT SAC57D54HCVLT NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAC57D54HCVMO SAC57D54HCVMO NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 516MAPBGA
Packaging: Tray
Package / Case: 516-BGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 516-MAPBGA (27x27)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5604BF2MLL4 SPC5604BF2MLL4 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5604CF2MLL6 SPC5604CF2MLL6 NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606BK0MLU6 SPC5606BK0MLU6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC566MVR56 MPC566MVR56 NXP USA Inc. MPC565PB.pdf Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN32F0VFT S9S12GN32F0VFT NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ISI-QMC-DGC02 NXP USA Inc. QUADMTRCNTRLGEN2FS.pdf Description: ISI-QMC-DGC02
Packaging: Bulk
Function: Motor Controller/Driver
Type: Interface
Contents: Board(s)
Utilized IC / Part: PF5020, RT1176, TJA115x
Produkt ist nicht verfügbar
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TEF7000HN/V3518 TEF7000HN/V3518 NXP USA Inc. PHGL-S-A0010592687-1.pdf?t.download=true&u=5oefqw Description: TEF7000HN - TUNER FRONT-END
Packaging: Bulk
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
66+7.35 EUR
Mindestbestellmenge: 66
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TEF7000HN/V3557 TEF7000HN/V3557 NXP USA Inc. PHGL-S-A0010592687-1.pdf?t.download=true&u=5oefqw Description: TEF7000HN - TUNER FRONT-END
Packaging: Bulk
auf Bestellung 1300 Stücke:
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MC33MR2001R2VKR2 NXP USA Inc. Description: IC INTERFACE TRANSCEIVER 3.135V
Packaging: Bulk
auf Bestellung 15815 Stücke:
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12+40.77 EUR
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MC33MR2001V2VKR2 NXP USA Inc. Description: IC INTERFACE TRANSCEIVER 3.135V
Packaging: Bulk
auf Bestellung 8000 Stücke:
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MC33MR2001T2VKR2 NXP USA Inc. Description: IC INTERFACE TRANSCEIVER 3.135V
Packaging: Bulk
auf Bestellung 5071 Stücke:
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MC9S08MM32AVLH MC9S08MM32AVLH NXP USA Inc. MC9S08MM128.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x16b; D/A 1x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SA676DK/01,118 SA676DK/01,118 NXP USA Inc. SA676.pdf Description: IC MIXER 100MHZ UP CONVRT 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 100MHz
RF Type: Cordless Phones
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 5mA
Secondary Attributes: Up Converter
Noise Figure: 7dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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S9S08RNA16W2MLCR S9S08RNA16W2MLCR NXP USA Inc. S9S08RN16DS.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RNA16W2MLCR S9S08RNA16W2MLCR NXP USA Inc. S9S08RN16DS.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PA8AVLDR MC9S08PA8AVLDR NXP USA Inc. MC9S08PA16_Rev.1.pdf Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RNA16W2MLC S9S08RNA16W2MLC NXP USA Inc. S9S08RN16DS.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AP32CFAE MC908AP32CFAE NXP USA Inc. MC68HC908AP64.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AP32ACFBER MC908AP32ACFBER NXP USA Inc. MC68HC908AP64A.pdf Description: IC MCU 8BIT 32KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVT574PW/AU118 NXP USA Inc. PHGLS23936-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Number of Bits per Element: 8
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
1902+0.26 EUR
Mindestbestellmenge: 1902
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MCIMX6X3EVN10AC MCIMX6X3EVN10AC NXP USA Inc. IMX6SXCEC.pdf Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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S912XET256J2MAAR S912XET256J2MAAR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512J3CAAR S912XEQ512J3CAAR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF775CHN/N208WCMP NXP USA Inc. Description: CAR DISP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC10XS4200BDFKR2 NXP USA Inc. Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Packaging: Tape & Reel (TR)
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
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MC10XS4200DFKR2 NXP USA Inc. Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Packaging: Tape & Reel (TR)
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
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MC10XS4200CFKR2 NXP USA Inc. MC10XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
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MC10XS4200CFK NXP USA Inc. MC10XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
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MC10XS4200DFK NXP USA Inc. MC10XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
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MC10XS4200BDFK NXP USA Inc. Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
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MC912DT128AVPVE MC912DT128AVPVE NXP USA Inc. MC912DT128A.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 67
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912DT12PE2VPVER S912DT12PE2VPVER NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 67
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX9352XVVXMAB MIMX9352XVVXMAB NXP USA Inc. IMX93XEC.pdf Description: MIMX9352XVVXMAB
Packaging: Tray
Package / Case: 306-LFBGA
Supplier Device Package: 306-LFBGA (11x11)
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Lieferzeit 10-14 Tag (e)
1+35.99 EUR
10+28.89 EUR
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MIMX9352DVVXMAB MIMX9352DVVXMAB NXP USA Inc. IMX93CEC.pdf Description: MIMX9352DVVXMAB
Packaging: Tray
Package / Case: 306-LFBGA
Supplier Device Package: 306-LFBGA (11x11)
Produkt ist nicht verfügbar
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MIMX9312XVXXMAB MIMX9312XVXXMAB NXP USA Inc. IMX93XEC.pdf Description: MIMX9312XVXXMAB
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9331XVVXMAB MIMX9331XVVXMAB NXP USA Inc. IMX93XEC.pdf Description: MIMX9331XVVXMAB
Packaging: Tray
auf Bestellung 61 Stücke:
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10+24.5 EUR
25+22.95 EUR
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MIMX9321DVXXMAB MIMX9321DVXXMAB NXP USA Inc. IMX93CEC.pdf Description: MIMX9321DVXXMAB
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9331AVTXMAB MIMX9331AVTXMAB NXP USA Inc. Description: MIMX9331AVTXMAB
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9331DVVXMAB MIMX9331DVVXMAB NXP USA Inc. IMX93CEC.pdf Description: MIMX9331DVVXMAB
Packaging: Tray
auf Bestellung 139 Stücke:
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10+23.27 EUR
25+21.79 EUR
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MIMX9351XVVXMAB MIMX9351XVVXMAB NXP USA Inc. IMX93XEC.pdf Description: MIMX9351XVVXMAB
Packaging: Tray
auf Bestellung 176 Stücke:
Lieferzeit 10-14 Tag (e)
1+34.94 EUR
10+28.02 EUR
25+26.29 EUR
176+23.8 EUR
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MIMX9332DVVXMAB MIMX9332DVVXMAB NXP USA Inc. IMX93CEC.pdf Description: MIMX9332DVVXMAB
Packaging: Tray
auf Bestellung 12 Stücke:
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10+22.87 EUR
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MIMX9351AVTXMAB NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9311XVXXMAB MIMX9311XVXXMAB NXP USA Inc. IMX93XEC.pdf Description: MIMX9311XVXXMAB
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9301DVVXDAB MIMX9301DVVXDAB NXP USA Inc. IMX93CEC.pdf Description: MIMX9301DVVXDAB
Packaging: Tray
auf Bestellung 36 Stücke:
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1+26.28 EUR
10+20.88 EUR
25+19.53 EUR
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P1013NXE2HFB QP1022FS.pdf
P1013NXE2HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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P1022NSE2HFB QP1022FS.pdf
P1022NSE2HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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MIMXRT595SFFOC IMXRTPORTBR.pdf
MIMXRT595SFFOC
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tray
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 670 Stücke:
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Anzahl Preis
1+33.07 EUR
10+26.57 EUR
25+24.94 EUR
80+24.86 EUR
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S908AB32AH3MFUE
S908AB32AH3MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A5M36TG140-3400 A5M36TG140-TC.pdf
Hersteller: NXP USA Inc.
Description: A5M36TG140T2 REFERENCE CIRCUIT
Packaging: Box
For Use With/Related Products: A5M36TG140
Frequency: 3.3GHz ~ 3.8GHz
Type: Power Amplifier
Supplied Contents: Board(s)
Contents: Board(s)
Utilized IC / Part: A5M36TG140
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BUK968R3-40E,118
BUK968R3-40E,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 75A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.4mOhm @ 20A, 10V
Power Dissipation (Max): 96W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: D2PAK
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 20.9 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 2600 pF @ 25 V
Produkt ist nicht verfügbar
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74HCT259DB,112 74HC_HCT259.pdf
74HCT259DB,112
Hersteller: NXP USA Inc.
Description: IC 8BIT ADDRESSABLE LATCH 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Delay Time - Propagation: 20ns
Supplier Device Package: 16-SSOP
auf Bestellung 2169 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
767+0.63 EUR
Mindestbestellmenge: 767
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MC9S08JM60CGT MC9S08JM60.pdf
MC9S08JM60CGT
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 37
DigiKey Programmable: Verified
auf Bestellung 1597 Stücke:
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Anzahl Preis
43+11.55 EUR
Mindestbestellmenge: 43
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MK50DN512CLQ10 K50PB.pdf
MK50DN512CLQ10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
auf Bestellung 900 Stücke:
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Anzahl Preis
1+28.88 EUR
10+22.95 EUR
60+20.36 EUR
120+19.66 EUR
240+19.08 EUR
480+18.61 EUR
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BZV55-B62,115 PHGLS22257-1.pdf?t.download=true&u=5oefqw
BZV55-B62,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 62V 500MW LLDS
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 62 V
Impedance (Max) (Zzt): 215 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 43.4 V
auf Bestellung 238435 Stücke:
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Anzahl Preis
13172+0.034 EUR
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MC35FS6502NAE 35FS4500-35FS6500SDS.pdf
MC35FS6502NAE
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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S32G379AACK1VUCT S32G2.pdf
S32G379AACK1VUCT
Hersteller: NXP USA Inc.
Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
auf Bestellung 109 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+189.25 EUR
10+160.18 EUR
25+154.56 EUR
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LPC865M201JHI48/0E LPC86x.pdf
LPC865M201JHI48/0E
Hersteller: NXP USA Inc.
Description: IC MCU CORTEX M0+ HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
auf Bestellung 549 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.79 EUR
10+3.8 EUR
25+3.28 EUR
80+2.77 EUR
260+2.4 EUR
520+2.23 EUR
Mindestbestellmenge: 4
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SAC57D53MCVLTR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 208LQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAC57D54HCVLT
SAC57D54HCVLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAC57D54HCVMO
SAC57D54HCVMO
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 516MAPBGA
Packaging: Tray
Package / Case: 516-BGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 516-MAPBGA (27x27)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5604BF2MLL4
SPC5604BF2MLL4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5604CF2MLL6 MPC5604BC.pdf
SPC5604CF2MLL6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5606BK0MLU6 MPC5606B.pdf
SPC5606BK0MLU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC566MVR56 MPC565PB.pdf
MPC566MVR56
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN32F0VFT
S9S12GN32F0VFT
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ISI-QMC-DGC02 QUADMTRCNTRLGEN2FS.pdf
Hersteller: NXP USA Inc.
Description: ISI-QMC-DGC02
Packaging: Bulk
Function: Motor Controller/Driver
Type: Interface
Contents: Board(s)
Utilized IC / Part: PF5020, RT1176, TJA115x
Produkt ist nicht verfügbar
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TEF7000HN/V3518 PHGL-S-A0010592687-1.pdf?t.download=true&u=5oefqw
TEF7000HN/V3518
Hersteller: NXP USA Inc.
Description: TEF7000HN - TUNER FRONT-END
Packaging: Bulk
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
66+7.35 EUR
Mindestbestellmenge: 66
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TEF7000HN/V3557 PHGL-S-A0010592687-1.pdf?t.download=true&u=5oefqw
TEF7000HN/V3557
Hersteller: NXP USA Inc.
Description: TEF7000HN - TUNER FRONT-END
Packaging: Bulk
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
66+7.35 EUR
Mindestbestellmenge: 66
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MC33MR2001R2VKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE TRANSCEIVER 3.135V
Packaging: Bulk
auf Bestellung 15815 Stücke:
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Anzahl Preis
12+40.77 EUR
Mindestbestellmenge: 12
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MC33MR2001V2VKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE TRANSCEIVER 3.135V
Packaging: Bulk
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+40.77 EUR
Mindestbestellmenge: 12
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MC33MR2001T2VKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE TRANSCEIVER 3.135V
Packaging: Bulk
auf Bestellung 5071 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+40.77 EUR
Mindestbestellmenge: 12
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MC9S08MM32AVLH MC9S08MM128.pdf
MC9S08MM32AVLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x16b; D/A 1x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SA676DK/01,118 SA676.pdf
SA676DK/01,118
Hersteller: NXP USA Inc.
Description: IC MIXER 100MHZ UP CONVRT 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 100MHz
RF Type: Cordless Phones
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 5mA
Secondary Attributes: Up Converter
Noise Figure: 7dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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S9S08RNA16W2MLCR S9S08RN16DS.pdf
S9S08RNA16W2MLCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RNA16W2MLCR S9S08RN16DS.pdf
S9S08RNA16W2MLCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PA8AVLDR MC9S08PA16_Rev.1.pdf
MC9S08PA8AVLDR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RNA16W2MLC S9S08RN16DS.pdf
S9S08RNA16W2MLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AP32CFAE MC68HC908AP64.pdf
MC908AP32CFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AP32ACFBER MC68HC908AP64A.pdf
MC908AP32ACFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVT574PW/AU118 PHGLS23936-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Number of Bits per Element: 8
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1902+0.26 EUR
Mindestbestellmenge: 1902
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MCIMX6X3EVN10AC IMX6SXCEC.pdf
MCIMX6X3EVN10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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S912XET256J2MAAR
S912XET256J2MAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512J3CAAR MC9S12XEPB.pdf
S912XEQ512J3CAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF775CHN/N208WCMP
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC10XS4200BDFKR2
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Packaging: Tape & Reel (TR)
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
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MC10XS4200DFKR2
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Packaging: Tape & Reel (TR)
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
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MC10XS4200CFKR2 MC10XS4200.pdf
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
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MC10XS4200CFK MC10XS4200.pdf
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
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MC10XS4200DFK MC10XS4200.pdf
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
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MC10XS4200BDFK
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
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MC912DT128AVPVE MC912DT128A.pdf
MC912DT128AVPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 67
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912DT12PE2VPVER
S912DT12PE2VPVER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 67
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX9352XVVXMAB IMX93XEC.pdf
MIMX9352XVVXMAB
Hersteller: NXP USA Inc.
Description: MIMX9352XVVXMAB
Packaging: Tray
Package / Case: 306-LFBGA
Supplier Device Package: 306-LFBGA (11x11)
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+35.99 EUR
10+28.89 EUR
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MIMX9352DVVXMAB IMX93CEC.pdf
MIMX9352DVVXMAB
Hersteller: NXP USA Inc.
Description: MIMX9352DVVXMAB
Packaging: Tray
Package / Case: 306-LFBGA
Supplier Device Package: 306-LFBGA (11x11)
Produkt ist nicht verfügbar
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MIMX9312XVXXMAB IMX93XEC.pdf
MIMX9312XVXXMAB
Hersteller: NXP USA Inc.
Description: MIMX9312XVXXMAB
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9331XVVXMAB IMX93XEC.pdf
MIMX9331XVVXMAB
Hersteller: NXP USA Inc.
Description: MIMX9331XVVXMAB
Packaging: Tray
auf Bestellung 61 Stücke:
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Anzahl Preis
1+30.68 EUR
10+24.5 EUR
25+22.95 EUR
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MIMX9321DVXXMAB IMX93CEC.pdf
MIMX9321DVXXMAB
Hersteller: NXP USA Inc.
Description: MIMX9321DVXXMAB
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9331AVTXMAB
MIMX9331AVTXMAB
Hersteller: NXP USA Inc.
Description: MIMX9331AVTXMAB
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9331DVVXMAB IMX93CEC.pdf
MIMX9331DVVXMAB
Hersteller: NXP USA Inc.
Description: MIMX9331DVVXMAB
Packaging: Tray
auf Bestellung 139 Stücke:
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Anzahl Preis
1+29.2 EUR
10+23.27 EUR
25+21.79 EUR
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MIMX9351XVVXMAB IMX93XEC.pdf
MIMX9351XVVXMAB
Hersteller: NXP USA Inc.
Description: MIMX9351XVVXMAB
Packaging: Tray
auf Bestellung 176 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+34.94 EUR
10+28.02 EUR
25+26.29 EUR
176+23.8 EUR
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MIMX9332DVVXMAB IMX93CEC.pdf
MIMX9332DVVXMAB
Hersteller: NXP USA Inc.
Description: MIMX9332DVVXMAB
Packaging: Tray
auf Bestellung 12 Stücke:
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Anzahl Preis
1+28.69 EUR
10+22.87 EUR
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MIMX9351AVTXMAB
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9311XVXXMAB IMX93XEC.pdf
MIMX9311XVXXMAB
Hersteller: NXP USA Inc.
Description: MIMX9311XVXXMAB
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9301DVVXDAB IMX93CEC.pdf
MIMX9301DVVXDAB
Hersteller: NXP USA Inc.
Description: MIMX9301DVVXDAB
Packaging: Tray
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+26.28 EUR
10+20.88 EUR
25+19.53 EUR
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