Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35464) > Seite 521 nach 592
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MC33MR2001V2VKR2 | NXP USA Inc. |
Description: IC INTERFACE TRANSCEIVER 3.135V Packaging: Bulk |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33MR2001T2VKR2 | NXP USA Inc. |
Description: IC INTERFACE TRANSCEIVER 3.135V Packaging: Bulk |
auf Bestellung 5071 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08MM32AVLH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 6x16b; D/A 1x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 33 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SA676DK/01,118 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 20-LSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Frequency: 100MHz RF Type: Cordless Phones Voltage - Supply: 2.7V ~ 7V Gain: 17dB Current - Supply: 5mA Secondary Attributes: Up Converter Noise Figure: 7dB Number of Mixers: 2 Supplier Device Package: 20-SSOP |
Produkt ist nicht verfügbar |
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S9S08RNA16W2MLCR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08RNA16W2MLCR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S08PA8AVLDR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 37 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08RNA16W2MLC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908AP32CFAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, IRSCI, SCI, SPI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908AP32ACFBER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: I2C, IRSCI, SCI, SPI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 44-QFP (10x10) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74LVT574PW/AU118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Current - Quiescent (Iq): 190 µA Current - Output High, Low: 32mA, 64mA Trigger Type: Positive Edge Clock Frequency: 150 MHz Input Capacitance: 4 pF Supplier Device Package: 20-TSSOP Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF Number of Bits per Element: 8 |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6X3EVN10AC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 227MHz, 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (17x17) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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S912XET256J2MAAR | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XEQ512J3CAAR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SAF775CHN/N208WCMP | NXP USA Inc. |
Description: CAR DISP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
MC10XS4200BDFKR2 | NXP USA Inc. |
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO Packaging: Tape & Reel (TR) Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Package / Case: 23-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm (Max) Input Type: CMOS Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 6A Ratio - Input:Output: 1:1 Supplier Device Package: 23-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO |
Produkt ist nicht verfügbar |
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MC10XS4200DFKR2 | NXP USA Inc. |
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO Packaging: Tape & Reel (TR) Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Package / Case: 23-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm (Max) Input Type: CMOS Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 6A Ratio - Input:Output: 1:1 Supplier Device Package: 23-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO |
Produkt ist nicht verfügbar |
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MC10XS4200CFKR2 | NXP USA Inc. |
![]() Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: 23-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm (Max) Input Type: CMOS Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 6A Ratio - Input:Output: 1:1 Supplier Device Package: 23-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO |
Produkt ist nicht verfügbar |
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MC10XS4200CFK | NXP USA Inc. |
![]() Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Packaging: Tray Package / Case: 23-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm (Max) Input Type: CMOS Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 6A Ratio - Input:Output: 1:1 Supplier Device Package: 23-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO |
Produkt ist nicht verfügbar |
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MC10XS4200DFK | NXP USA Inc. |
![]() Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Packaging: Tray Package / Case: 23-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm (Max) Input Type: CMOS Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 6A Ratio - Input:Output: 1:1 Supplier Device Package: 23-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO |
Produkt ist nicht verfügbar |
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MC10XS4200BDFK | NXP USA Inc. |
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Packaging: Tray Package / Case: 23-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm (Max) Input Type: CMOS Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 6A Ratio - Input:Output: 1:1 Supplier Device Package: 23-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO |
Produkt ist nicht verfügbar |
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MC912DT128AVPVE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I²C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 67 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912DT12PE2VPVER | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I²C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 67 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MIMX9352XVVXMAB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 306-LFBGA Supplier Device Package: 306-LFBGA (11x11) |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX9352DVVXMAB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 306-LFBGA Supplier Device Package: 306-LFBGA (11x11) |
Produkt ist nicht verfügbar |
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MIMX9312XVXXMAB | NXP USA Inc. |
![]() Packaging: Tray |
Produkt ist nicht verfügbar |
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MIMX9331XVVXMAB | NXP USA Inc. |
![]() Packaging: Tray |
auf Bestellung 61 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX9321DVXXMAB | NXP USA Inc. |
![]() Packaging: Tray |
Produkt ist nicht verfügbar |
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MIMX9331AVTXMAB | NXP USA Inc. |
Description: MIMX9331AVTXMAB Packaging: Tray |
Produkt ist nicht verfügbar |
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MIMX9331DVVXMAB | NXP USA Inc. |
![]() Packaging: Tray |
auf Bestellung 139 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX9351XVVXMAB | NXP USA Inc. |
![]() Packaging: Tray |
auf Bestellung 176 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX9332DVVXMAB | NXP USA Inc. |
![]() Packaging: Tray |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX9351AVTXMAB | NXP USA Inc. |
Description: IC Packaging: Tray |
Produkt ist nicht verfügbar |
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MIMX9311XVXXMAB | NXP USA Inc. |
![]() Packaging: Tray |
Produkt ist nicht verfügbar |
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MIMX9301DVVXDAB | NXP USA Inc. |
![]() Packaging: Tray |
auf Bestellung 166 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX9352AVTXMAB | NXP USA Inc. |
Description: IC Packaging: Tray |
Produkt ist nicht verfügbar |
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MIMX9312DVXXMAB | NXP USA Inc. |
![]() Packaging: Tray |
Produkt ist nicht verfügbar |
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MIMX9302DVVXDAB | NXP USA Inc. |
![]() Packaging: Tray |
auf Bestellung 165 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX93-SOM | NXP USA Inc. |
![]() Packaging: Box |
Produkt ist nicht verfügbar |
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MIMX9311DVXXMAB | NXP USA Inc. |
![]() Packaging: Tray |
Produkt ist nicht verfügbar |
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MIMX9332AVTXMAB | NXP USA Inc. |
Description: IC Packaging: Tray |
Produkt ist nicht verfügbar |
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MIMX9322XVXXMAB | NXP USA Inc. |
![]() Packaging: Tray |
Produkt ist nicht verfügbar |
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MIMX9351DVVXMAB | NXP USA Inc. |
![]() Packaging: Tray |
auf Bestellung 175 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX9322DVXXMAB | NXP USA Inc. |
![]() Packaging: Tray |
Produkt ist nicht verfügbar |
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MIMX9332XVVXMAB | NXP USA Inc. |
![]() Packaging: Tray |
Produkt ist nicht verfügbar |
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MIMX9321XVXXMAB | NXP USA Inc. |
![]() Packaging: Tray |
Produkt ist nicht verfügbar |
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BC847QAPN147 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: NPN, PNP Operating Temperature: 150°C (TJ) Power - Max: 350mW Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: DFN1010B-6 Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 1915643 Stücke: Lieferzeit 10-14 Tag (e) |
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NTP52101G0JTTZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Frequency: 13.56MHz Interface: PWM Type: RFID Reader Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 5.5V Standards: NFC, ISO 15693 Supplier Device Package: 16-TSSOP |
Produkt ist nicht verfügbar |
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NTP52101G0JTTZ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Frequency: 13.56MHz Interface: PWM Type: RFID Reader Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 5.5V Standards: NFC, ISO 15693 Supplier Device Package: 16-TSSOP |
auf Bestellung 1044 Stücke: Lieferzeit 10-14 Tag (e) |
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NTP52101G0JTZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 13.56MHz Interface: PWM Type: RFID Reader Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 5.5V Standards: NFC, ISO 15693 Supplier Device Package: 8-SO |
Produkt ist nicht verfügbar |
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NTP52101G0JTZ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 13.56MHz Interface: PWM Type: RFID Reader Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 5.5V Standards: NFC, ISO 15693 Supplier Device Package: 8-SO |
auf Bestellung 1324 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC3G14GD,125 | NXP USA Inc. |
![]() Packaging: Bulk |
auf Bestellung 99000 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX31LCVMN4C | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V Supplier Device Package: 473-LFBGA (19x19) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, Keypad, LCD Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MC68SEC000AA20 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 20MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: EC000 Voltage - I/O: 3.3V, 5.0V Supplier Device Package: 64-QFP (14x14) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
KITFS86TRKFRDMEM | NXP USA Inc. |
Description: EVAL BOARD FS86 24V Packaging: Tray Function: System Basis Chip (SBC) Type: Interface Utilized IC / Part: FS86 Supplied Contents: Board(s), Cable(s), Power Supply, Accessories Embedded: Yes, MCU, 32-Bit Contents: Board(s), Cable(s), Power Supply, Accessories Secondary Attributes: USB Interface(s) |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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MPXD1010VLQ64 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z0h Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 105 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
BTS6305CJ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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BTS6305UJ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 4.2GHz RF Type: 5G, TDD Voltage - Supply: 4.75V ~ 5.25V Gain: 42dB Current - Supply: 122mA Noise Figure: 3.5dB ~ 4dB P1dB: 28.5dBm Test Frequency: 3.6GHz Supplier Device Package: 16-HVQFN (3x3) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NX3P191UK,012 | NXP USA Inc. |
![]() Packaging: Bulk |
auf Bestellung 14492 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC55S36-EVK | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M33 Utilized IC / Part: LPC55S36 Platform: LPCXpresso™ |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33MR2001V2VKR2 |
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
12+ | 40.77 EUR |
MC33MR2001T2VKR2 |
auf Bestellung 5071 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
12+ | 40.77 EUR |
MC9S08MM32AVLH |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x16b; D/A 1x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x16b; D/A 1x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SA676DK/01,118 |
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Hersteller: NXP USA Inc.
Description: IC MIXER 100MHZ UP CONVRT 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 100MHz
RF Type: Cordless Phones
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 5mA
Secondary Attributes: Up Converter
Noise Figure: 7dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Description: IC MIXER 100MHZ UP CONVRT 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 100MHz
RF Type: Cordless Phones
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 5mA
Secondary Attributes: Up Converter
Noise Figure: 7dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08RNA16W2MLCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08RNA16W2MLCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC9S08PA8AVLDR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08RNA16W2MLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC908AP32CFAE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC908AP32ACFBER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74LVT574PW/AU118 |
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Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Number of Bits per Element: 8
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1902+ | 0.26 EUR |
MCIMX6X3EVN10AC |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S912XET256J2MAAR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S912XEQ512J3CAAR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC10XS4200BDFKR2 |
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Packaging: Tape & Reel (TR)
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Packaging: Tape & Reel (TR)
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC10XS4200DFKR2 |
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Packaging: Tape & Reel (TR)
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Packaging: Tape & Reel (TR)
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC10XS4200CFKR2 |
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Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC10XS4200CFK |
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Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC10XS4200DFK |
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Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC10XS4200BDFK |
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Description: HIGH-SIDE SWITCH, 24V, DUAL 10MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC912DT128AVPVE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 67
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 67
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S912DT12PE2VPVER |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 67
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 67
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MIMX9352XVVXMAB |
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Hersteller: NXP USA Inc.
Description: MIMX9352XVVXMAB
Packaging: Tray
Package / Case: 306-LFBGA
Supplier Device Package: 306-LFBGA (11x11)
Description: MIMX9352XVVXMAB
Packaging: Tray
Package / Case: 306-LFBGA
Supplier Device Package: 306-LFBGA (11x11)
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 35.73 EUR |
10+ | 28.68 EUR |
MIMX9352DVVXMAB |
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Hersteller: NXP USA Inc.
Description: MIMX9352DVVXMAB
Packaging: Tray
Package / Case: 306-LFBGA
Supplier Device Package: 306-LFBGA (11x11)
Description: MIMX9352DVVXMAB
Packaging: Tray
Package / Case: 306-LFBGA
Supplier Device Package: 306-LFBGA (11x11)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MIMX9331XVVXMAB |
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auf Bestellung 61 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 30.47 EUR |
10+ | 24.32 EUR |
25+ | 22.79 EUR |
MIMX9331DVVXMAB |
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auf Bestellung 139 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 28.99 EUR |
10+ | 23.11 EUR |
25+ | 21.64 EUR |
MIMX9351XVVXMAB |
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auf Bestellung 176 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 27.76 EUR |
10+ | 22.26 EUR |
25+ | 20.88 EUR |
176+ | 20.76 EUR |
MIMX9332DVVXMAB |
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auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 28.49 EUR |
10+ | 22.71 EUR |
MIMX9301DVVXDAB |
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auf Bestellung 166 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 26.1 EUR |
10+ | 20.73 EUR |
25+ | 19.4 EUR |
MIMX9302DVVXDAB |
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auf Bestellung 165 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 28.07 EUR |
10+ | 22.36 EUR |
25+ | 20.93 EUR |
MIMX9351DVVXMAB |
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auf Bestellung 175 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 31.7 EUR |
10+ | 25.35 EUR |
25+ | 23.76 EUR |
BC847QAPN147 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN, PNP
Operating Temperature: 150°C (TJ)
Power - Max: 350mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1010B-6
Grade: Automotive
Qualification: AEC-Q101
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN, PNP
Operating Temperature: 150°C (TJ)
Power - Max: 350mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1010B-6
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 1915643 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
9812+ | 0.048 EUR |
NTP52101G0JTTZ |
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Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-TSSOP
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
NTP52101G0JTTZ |
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Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-TSSOP
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-TSSOP
auf Bestellung 1044 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
10+ | 1.94 EUR |
11+ | 1.66 EUR |
25+ | 1.57 EUR |
100+ | 1.44 EUR |
250+ | 1.36 EUR |
500+ | 1.31 EUR |
1000+ | 1.25 EUR |
NTP52101G0JTZ |
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Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 8-SO
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
NTP52101G0JTZ |
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Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 8-SO
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 8-SO
auf Bestellung 1324 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
10+ | 1.94 EUR |
11+ | 1.66 EUR |
25+ | 1.57 EUR |
100+ | 1.44 EUR |
250+ | 1.36 EUR |
500+ | 1.31 EUR |
1000+ | 1.25 EUR |
74LVC3G14GD,125 |
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auf Bestellung 99000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2049+ | 0.25 EUR |
MCIMX31LCVMN4C |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX31 400MHZ 473LFBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
Description: IC MPU I.MX31 400MHZ 473LFBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC68SEC000AA20 |
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Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 20MHZ 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
KITFS86TRKFRDMEM |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FS86 24V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Embedded: Yes, MCU, 32-Bit
Contents: Board(s), Cable(s), Power Supply, Accessories
Secondary Attributes: USB Interface(s)
Description: EVAL BOARD FS86 24V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Embedded: Yes, MCU, 32-Bit
Contents: Board(s), Cable(s), Power Supply, Accessories
Secondary Attributes: USB Interface(s)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 975.27 EUR |
MPXD1010VLQ64 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 105
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 105
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BTS6305UJ |
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Hersteller: NXP USA Inc.
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 42dB
Current - Supply: 122mA
Noise Figure: 3.5dB ~ 4dB
P1dB: 28.5dBm
Test Frequency: 3.6GHz
Supplier Device Package: 16-HVQFN (3x3)
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 42dB
Current - Supply: 122mA
Noise Figure: 3.5dB ~ 4dB
P1dB: 28.5dBm
Test Frequency: 3.6GHz
Supplier Device Package: 16-HVQFN (3x3)
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Im Einkaufswagen
Stück im Wert von UAH
NX3P191UK,012 |
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auf Bestellung 14492 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1092+ | 0.42 EUR |
LPC55S36-EVK |
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Hersteller: NXP USA Inc.
Description: LPC55S36 EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: LPC55S36
Platform: LPCXpresso™
Description: LPC55S36 EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: LPC55S36
Platform: LPCXpresso™
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 118.31 EUR |