MFS2320BMBB1EP NXP Semiconductors
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC Safety SBC with Power Management and CAN
| Anzahl | Privatkunde |
|---|---|
| 1+ | 13.45 EUR |
| 10+ | 10.2 EUR |
| 25+ | 9.51 EUR |
| 100+ | 8.35 EUR |
| 260+ | 6.24 EUR |
| 520+ | 6.22 EUR |
| 1040+ | 6.09 EUR |
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Technische Details MFS2320BMBB1EP NXP Semiconductors
Description: IC, Packaging: Tray, Package / Case: 48-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 5.5V ~ 40V, Applications: System Basis Chip, Current - Supply: 30µA, Supplier Device Package: 48-HVQFN (7x7).
Weitere Produktangebote MFS2320BMBB1EP
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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MFS2320BMBB1EP | NXP USA Inc. |
Description: IC Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Current - Supply: 30µA Supplier Device Package: 48-HVQFN (7x7) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH |
| MFS2320BMBB1EP |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH