MFS2320BMBB1EP NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
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Technische Details MFS2320BMBB1EP NXP USA Inc.
Description: IC, Packaging: Tray, Package / Case: 48-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 5.5V ~ 40V, Applications: System Basis Chip, Current - Supply: 30µA, Supplier Device Package: 48-HVQFN (7x7).
Weitere Produktangebote MFS2320BMBB1EP
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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MFS2320BMBB1EP | Hersteller : NXP Semiconductors |
 Power Management Specialised - PMIC Safety SBC with Power Management, CAN and LIN |
Produkt ist nicht verfügbar |