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TDA8034HN/C2EL NXP USA Inc. TDA8034HN.pdf Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8034HN/C2QL NXP USA Inc. TDA8034HN.pdf Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8026ET/C3K NXP USA Inc. TDA8026.pdf Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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TDA8026ET/C3Y NXP USA Inc. TDA8026.pdf Description: IC INTFACE SPECIALIZED 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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TDA8026ET/C3E NXP USA Inc. TDA8026.pdf Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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LPC3131FET180,551 LPC3131FET180,551 NXP USA Inc. LPC3130_31.pdf Description: IC MCU 16/32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
DigiKey Programmable: Not Verified
auf Bestellung 189 Stücke:
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189+17.77 EUR
Mindestbestellmenge: 189
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74ALVC32PW,112 74ALVC32PW,112 NXP USA Inc. 74ALVC32.pdf Description: IC GATE OR 4CH 2-INP 14-TSSOP
Packaging: Tube
auf Bestellung 4800 Stücke:
Lieferzeit 10-14 Tag (e)
2664+0.18 EUR
Mindestbestellmenge: 2664
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PCA9421BSZ PCA9421BSZ NXP USA Inc. PCA9421.pdf Description: IC PMIC HVQFN24
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
Produkt ist nicht verfügbar
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PCA9421BSZ PCA9421BSZ NXP USA Inc. PCA9421.pdf Description: IC PMIC HVQFN24
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
auf Bestellung 1390 Stücke:
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5+4.35 EUR
10+3.25 EUR
25+2.98 EUR
100+2.67 EUR
250+2.53 EUR
500+2.44 EUR
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SAF7772EL/200Z13AY NXP USA Inc. Description: SAF7772EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7771EL/200Z13AY NXP USA Inc. Description: SAF7771EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7772EL/200Z13AK NXP USA Inc. Description: SAF7772EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7771EL/200Z13AK NXP USA Inc. Description: SAF7771EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13AY NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/101Z13AY NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13AK NXP USA Inc. Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/101Z13AK NXP USA Inc. Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/203Z13AY NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7770EL/203Z13AK NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4000EL/101Z13AY NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/101Z13AK NXP USA Inc. Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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MC34VR500V4ESR2 MC34VR500V4ESR2 NXP USA Inc. MC34VR500.pdf Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC34VR500V7ESR2 MC34VR500V7ESR2 NXP USA Inc. MC34VR500.pdf Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MCZ33905CD3EK MCZ33905CD3EK NXP USA Inc. FSCLS11649-1.pdf?t.download=true&u=5oefqw Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3
Packaging: Bulk
auf Bestellung 676 Stücke:
Lieferzeit 10-14 Tag (e)
53+9.28 EUR
Mindestbestellmenge: 53
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NTP53321G0JTTZ NTP53321G0JTTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
auf Bestellung 5000 Stücke:
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2500+1.51 EUR
5000+1.45 EUR
Mindestbestellmenge: 2500
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NTP53321G0JTTZ NTP53321G0JTTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
auf Bestellung 7376 Stücke:
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8+2.45 EUR
10+2.1 EUR
25+1.99 EUR
100+1.82 EUR
250+1.72 EUR
500+1.65 EUR
1000+1.59 EUR
Mindestbestellmenge: 8
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NTP53121G0JTTZ NTP53121G0JTTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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NTP53121G0JTTZ NTP53121G0JTTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
auf Bestellung 3390 Stücke:
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8+2.25 EUR
10+1.94 EUR
25+1.83 EUR
100+1.68 EUR
250+1.59 EUR
500+1.53 EUR
1000+1.47 EUR
Mindestbestellmenge: 8
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NTP53321G0JTZ NTP53321G0JTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
auf Bestellung 2500 Stücke:
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2500+1.28 EUR
Mindestbestellmenge: 2500
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NTP53321G0JTZ NTP53321G0JTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
auf Bestellung 7069 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.45 EUR
10+2.1 EUR
25+1.99 EUR
100+1.82 EUR
250+1.72 EUR
500+1.65 EUR
1000+1.59 EUR
Mindestbestellmenge: 8
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NTP53121G0JTZ NTP53121G0JTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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NTP53121G0JTZ NTP53121G0JTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
auf Bestellung 4021 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.25 EUR
10+1.94 EUR
25+1.83 EUR
100+1.68 EUR
250+1.59 EUR
500+1.53 EUR
1000+1.47 EUR
Mindestbestellmenge: 8
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PMXB65UPE147 PMXB65UPE147 NXP USA Inc. PMXB65UPE.pdf Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 72mOhm @ 3.2A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 634 pF @ 6 V
auf Bestellung 8951063 Stücke:
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5495+0.081 EUR
Mindestbestellmenge: 5495
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MC9S12B256MFUE MC9S12B256MFUE NXP USA Inc. MC9S12B.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MWCT1016SFVMHN MWCT1016SFVMHN NXP USA Inc. Description: WCT1016 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
Produkt ist nicht verfügbar
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MC8641DTHX1333JE MC8641DTHX1333JE NXP USA Inc. MCP8641%28D%29.pdf Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Produkt ist nicht verfügbar
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FD32K116LFT0MFMT NXP USA Inc. Description: IC MCU
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12G64F1MLC S9S12G64F1MLC NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 2349 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.7 EUR
10+9.2 EUR
80+7.61 EUR
1250+6.64 EUR
Mindestbestellmenge: 2
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BFU530XRVL BFU530XRVL NXP USA Inc. BFU530XR.pdf Description: RF TRANS NPN 12V 11GHZ SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 16.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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BFU530XRVL BFU530XRVL NXP USA Inc. BFU530XR.pdf Description: RF TRANS NPN 12V 11GHZ SOT143R
Packaging: Cut Tape (CT)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 16.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-143R
auf Bestellung 6815 Stücke:
Lieferzeit 10-14 Tag (e)
30+0.6 EUR
45+0.4 EUR
51+0.35 EUR
100+0.3 EUR
250+0.27 EUR
500+0.25 EUR
1000+0.24 EUR
2500+0.23 EUR
5000+0.22 EUR
Mindestbestellmenge: 30
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MC33CD1020AESR2 MC33CD1020AESR2 NXP USA Inc. CD1020.pdf Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Produkt ist nicht verfügbar
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MC33CD1020AES NXP USA Inc. CD1020.pdf Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1124BHG/1Z TJA1124BHG/1Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+2.53 EUR
Mindestbestellmenge: 3000
Im Einkaufswagen  Stück im Wert von  UAH
TJA1124BHG/1Z TJA1124BHG/1Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.05 EUR
10+4.52 EUR
25+4.28 EUR
100+3.7 EUR
250+3.52 EUR
500+3.15 EUR
1000+2.66 EUR
Mindestbestellmenge: 4
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TJA1124CHG/1Z TJA1124CHG/1Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+2.58 EUR
Mindestbestellmenge: 3000
Im Einkaufswagen  Stück im Wert von  UAH
TJA1124CHG/1Z TJA1124CHG/1Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.88 EUR
10+3.66 EUR
25+3.35 EUR
100+3.02 EUR
250+2.86 EUR
500+2.76 EUR
1000+2.68 EUR
Mindestbestellmenge: 4
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SJA1124BHG/1Z SJA1124BHG/1Z NXP USA Inc. Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SJA1124BHG/1Z SJA1124BHG/1Z NXP USA Inc. Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2996 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.9 EUR
10+5.23 EUR
25+4.81 EUR
100+4.35 EUR
250+4.13 EUR
500+4 EUR
1000+3.89 EUR
Mindestbestellmenge: 3
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SJA1124AHG/1Z SJA1124AHG/1Z NXP USA Inc. SJA1110AUTESFS.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SJA1124AHG/1Z SJA1124AHG/1Z NXP USA Inc. SJA1110AUTESFS.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2935 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.08 EUR
10+5.36 EUR
25+4.93 EUR
100+4.46 EUR
250+4.24 EUR
500+4.1 EUR
1000+3.99 EUR
Mindestbestellmenge: 3
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IW416UK/A1CZ IW416UK/A1CZ NXP USA Inc. IW416.pdf Description: IC RF TXRX 802.15.4 76WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 76-UFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth
Current - Receiving: 5µA ~ 72mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 76-WLCSP (3.95x3.565)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, 64-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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MPC8347CZUAJDB MPC8347CZUAJDB NXP USA Inc. MPC8347EEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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P1015NSE5DFB P1015NSE5DFB NXP USA Inc. QP1024FS.pdf Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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SAF7751HV/N208W/UK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC855TZQ66D4 MPC855TZQ66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
100+231.78 EUR
Mindestbestellmenge: 100
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BUK7528-55A,127 BUK7528-55A,127 NXP USA Inc. PHGLS22706-1.pdf?t.download=true&u=5oefqw Description: PFET, 42A I(D), 55V, 0.028OHM, 1
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 28mOhm @ 25A, 10V
Power Dissipation (Max): 99W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1165 pF @ 25 V
auf Bestellung 4260 Stücke:
Lieferzeit 10-14 Tag (e)
987+0.51 EUR
Mindestbestellmenge: 987
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S9S08AW16AE0VLD S9S08AW16AE0VLD NXP USA Inc. PHGL-S-A0002794566-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
85+6.03 EUR
Mindestbestellmenge: 85
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74LVC240APW,112 74LVC240APW,112 NXP USA Inc. PHGLS23711-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER INVERT 3.6V 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-TSSOP
auf Bestellung 28939 Stücke:
Lieferzeit 10-14 Tag (e)
1603+0.31 EUR
Mindestbestellmenge: 1603
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PTN36043BBXY PTN36043BBXY NXP USA Inc. PTN36043B.pdf Description: PTN36043BBXY
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Delay Time: 500ps (Max)
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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LFTHNLT NXP USA Inc. Description: 144 PIN 0.5MM SURFACE MOUNT SOCK
Packaging: Bulk
Module/Board Type: Socket Module
Produkt ist nicht verfügbar
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TDA8034HN/C2EL TDA8034HN.pdf
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8034HN/C2QL TDA8034HN.pdf
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8026ET/C3K TDA8026.pdf
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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TDA8026ET/C3Y TDA8026.pdf
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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TDA8026ET/C3E TDA8026.pdf
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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LPC3131FET180,551 LPC3130_31.pdf
LPC3131FET180,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
DigiKey Programmable: Not Verified
auf Bestellung 189 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
189+17.77 EUR
Mindestbestellmenge: 189
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74ALVC32PW,112 74ALVC32.pdf
74ALVC32PW,112
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14-TSSOP
Packaging: Tube
auf Bestellung 4800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2664+0.18 EUR
Mindestbestellmenge: 2664
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PCA9421BSZ PCA9421.pdf
PCA9421BSZ
Hersteller: NXP USA Inc.
Description: IC PMIC HVQFN24
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
Produkt ist nicht verfügbar
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PCA9421BSZ PCA9421.pdf
PCA9421BSZ
Hersteller: NXP USA Inc.
Description: IC PMIC HVQFN24
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
auf Bestellung 1390 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.35 EUR
10+3.25 EUR
25+2.98 EUR
100+2.67 EUR
250+2.53 EUR
500+2.44 EUR
Mindestbestellmenge: 5
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SAF7772EL/200Z13AY
Hersteller: NXP USA Inc.
Description: SAF7772EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7771EL/200Z13AY
Hersteller: NXP USA Inc.
Description: SAF7771EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7772EL/200Z13AK
Hersteller: NXP USA Inc.
Description: SAF7772EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7771EL/200Z13AK
Hersteller: NXP USA Inc.
Description: SAF7771EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13AY
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/101Z13AY
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13AK
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7770EL/101Z13AK
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/203Z13AY
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7770EL/203Z13AK
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4000EL/101Z13AY
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/101Z13AK
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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MC34VR500V4ESR2 MC34VR500.pdf
MC34VR500V4ESR2
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC34VR500V7ESR2 MC34VR500.pdf
MC34VR500V7ESR2
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MCZ33905CD3EK FSCLS11649-1.pdf?t.download=true&u=5oefqw
MCZ33905CD3EK
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3
Packaging: Bulk
auf Bestellung 676 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
53+9.28 EUR
Mindestbestellmenge: 53
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NTP53321G0JTTZ NTP53x2.pdf
NTP53321G0JTTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.51 EUR
5000+1.45 EUR
Mindestbestellmenge: 2500
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NTP53321G0JTTZ NTP53x2.pdf
NTP53321G0JTTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
auf Bestellung 7376 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.45 EUR
10+2.1 EUR
25+1.99 EUR
100+1.82 EUR
250+1.72 EUR
500+1.65 EUR
1000+1.59 EUR
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NTP53121G0JTTZ NTP53x2.pdf
NTP53121G0JTTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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NTP53121G0JTTZ NTP53x2.pdf
NTP53121G0JTTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
auf Bestellung 3390 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.25 EUR
10+1.94 EUR
25+1.83 EUR
100+1.68 EUR
250+1.59 EUR
500+1.53 EUR
1000+1.47 EUR
Mindestbestellmenge: 8
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NTP53321G0JTZ NTP53x2.pdf
NTP53321G0JTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.28 EUR
Mindestbestellmenge: 2500
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NTP53321G0JTZ NTP53x2.pdf
NTP53321G0JTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
auf Bestellung 7069 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.45 EUR
10+2.1 EUR
25+1.99 EUR
100+1.82 EUR
250+1.72 EUR
500+1.65 EUR
1000+1.59 EUR
Mindestbestellmenge: 8
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NTP53121G0JTZ NTP53x2.pdf
NTP53121G0JTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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NTP53121G0JTZ NTP53x2.pdf
NTP53121G0JTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
auf Bestellung 4021 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.25 EUR
10+1.94 EUR
25+1.83 EUR
100+1.68 EUR
250+1.59 EUR
500+1.53 EUR
1000+1.47 EUR
Mindestbestellmenge: 8
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PMXB65UPE147 PMXB65UPE.pdf
PMXB65UPE147
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 72mOhm @ 3.2A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 634 pF @ 6 V
auf Bestellung 8951063 Stücke:
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Anzahl Preis
5495+0.081 EUR
Mindestbestellmenge: 5495
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MC9S12B256MFUE MC9S12B.pdf
MC9S12B256MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MWCT1016SFVMHN
MWCT1016SFVMHN
Hersteller: NXP USA Inc.
Description: WCT1016 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
Produkt ist nicht verfügbar
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MC8641DTHX1333JE MCP8641%28D%29.pdf
MC8641DTHX1333JE
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Produkt ist nicht verfügbar
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FD32K116LFT0MFMT
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12G64F1MLC MC9S12GRMV1.pdf
S9S12G64F1MLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 2349 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.7 EUR
10+9.2 EUR
80+7.61 EUR
1250+6.64 EUR
Mindestbestellmenge: 2
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BFU530XRVL BFU530XR.pdf
BFU530XRVL
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 16.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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BFU530XRVL BFU530XR.pdf
BFU530XRVL
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SOT143R
Packaging: Cut Tape (CT)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 16.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-143R
auf Bestellung 6815 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
30+0.6 EUR
45+0.4 EUR
51+0.35 EUR
100+0.3 EUR
250+0.27 EUR
500+0.25 EUR
1000+0.24 EUR
2500+0.23 EUR
5000+0.22 EUR
Mindestbestellmenge: 30
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MC33CD1020AESR2 CD1020.pdf
MC33CD1020AESR2
Hersteller: NXP USA Inc.
Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Produkt ist nicht verfügbar
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MC33CD1020AES CD1020.pdf
Hersteller: NXP USA Inc.
Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1124BHG/1Z TJA1124.pdf
TJA1124BHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+2.53 EUR
Mindestbestellmenge: 3000
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TJA1124BHG/1Z TJA1124.pdf
TJA1124BHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.05 EUR
10+4.52 EUR
25+4.28 EUR
100+3.7 EUR
250+3.52 EUR
500+3.15 EUR
1000+2.66 EUR
Mindestbestellmenge: 4
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TJA1124CHG/1Z TJA1124.pdf
TJA1124CHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+2.58 EUR
Mindestbestellmenge: 3000
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TJA1124CHG/1Z TJA1124.pdf
TJA1124CHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.88 EUR
10+3.66 EUR
25+3.35 EUR
100+3.02 EUR
250+2.86 EUR
500+2.76 EUR
1000+2.68 EUR
Mindestbestellmenge: 4
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SJA1124BHG/1Z
SJA1124BHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SJA1124BHG/1Z
SJA1124BHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2996 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.9 EUR
10+5.23 EUR
25+4.81 EUR
100+4.35 EUR
250+4.13 EUR
500+4 EUR
1000+3.89 EUR
Mindestbestellmenge: 3
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SJA1124AHG/1Z SJA1110AUTESFS.pdf
SJA1124AHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SJA1124AHG/1Z SJA1110AUTESFS.pdf
SJA1124AHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2935 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.08 EUR
10+5.36 EUR
25+4.93 EUR
100+4.46 EUR
250+4.24 EUR
500+4.1 EUR
1000+3.99 EUR
Mindestbestellmenge: 3
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IW416UK/A1CZ IW416.pdf
IW416UK/A1CZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 76WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 76-UFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth
Current - Receiving: 5µA ~ 72mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 76-WLCSP (3.95x3.565)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, 64-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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MPC8347CZUAJDB MPC8347EEC.pdf
MPC8347CZUAJDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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P1015NSE5DFB QP1024FS.pdf
P1015NSE5DFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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SAF7751HV/N208W/UK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC855TZQ66D4 MPC860EC.pdf
MPC855TZQ66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
100+231.78 EUR
Mindestbestellmenge: 100
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BUK7528-55A,127 PHGLS22706-1.pdf?t.download=true&u=5oefqw
BUK7528-55A,127
Hersteller: NXP USA Inc.
Description: PFET, 42A I(D), 55V, 0.028OHM, 1
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 28mOhm @ 25A, 10V
Power Dissipation (Max): 99W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1165 pF @ 25 V
auf Bestellung 4260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
987+0.51 EUR
Mindestbestellmenge: 987
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S9S08AW16AE0VLD PHGL-S-A0002794566-1.pdf?t.download=true&u=5oefqw
S9S08AW16AE0VLD
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
85+6.03 EUR
Mindestbestellmenge: 85
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74LVC240APW,112 PHGLS23711-1.pdf?t.download=true&u=5oefqw
74LVC240APW,112
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 3.6V 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-TSSOP
auf Bestellung 28939 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1603+0.31 EUR
Mindestbestellmenge: 1603
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PTN36043BBXY PTN36043B.pdf
PTN36043BBXY
Hersteller: NXP USA Inc.
Description: PTN36043BBXY
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Delay Time: 500ps (Max)
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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LFTHNLT
Hersteller: NXP USA Inc.
Description: 144 PIN 0.5MM SURFACE MOUNT SOCK
Packaging: Bulk
Module/Board Type: Socket Module
Produkt ist nicht verfügbar
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