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LFDAA13C NXP USA Inc. Description: 32 PIN 0.5MM PITCH QFN ZIF SOCKE
Packaging: Bulk
Module/Board Type: Socket Module - QFN
Produkt ist nicht verfügbar
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S9KEAZ64ACLHR S9KEAZ64ACLHR NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVML31F1WKHR S912ZVML31F1WKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33PF8100EPESR2 MC33PF8100EPESR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MC33FS6600M1ESR2 MC33FS6600M1ESR2 NXP USA Inc. Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
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FS32K146UIT0VLLR FS32K146UIT0VLLR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FX32K142HAT0MLHT NXP USA Inc. S32K1xx.pdf Description: S32K142 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX27MJP4AR2 MCIMX27MJP4AR2 NXP USA Inc. MCIMX27EC.pdf Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
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MCIMX27MJP4A MCIMX27MJP4A NXP USA Inc. MCIMX27EC.pdf Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Produkt ist nicht verfügbar
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MMA6827BKCWR2 MMA6827BKCWR2 NXP USA Inc. MMA68xx.pdf Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4.096
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCF52233CAL60 MCF52233CAL60 NXP USA Inc. MCF52235.pdf Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 73
DigiKey Programmable: Not Verified
auf Bestellung 292 Stücke:
Lieferzeit 10-14 Tag (e)
1+42.7 EUR
10+31.67 EUR
25+28.84 EUR
80+26.12 EUR
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MPC8315CVRADDA MPC8315CVRADDA NXP USA Inc. MPC8315EEC.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
Produkt ist nicht verfügbar
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MC908QB8VDWE MC908QB8VDWE NXP USA Inc. MC68HC908QB8.pdf Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NX3P2902BUK012 NX3P2902BUK012 NXP USA Inc. PHGL-S-A0004564278-1.pdf?t.download=true&u=5oefqw Description: LOGIC CONTROLLED HIGH-SIDE POWER
Packaging: Bulk
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
702+0.69 EUR
Mindestbestellmenge: 702
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LS1046AXE8T1A LS1046AXE8T1A NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 27 Stücke:
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1+274.56 EUR
10+233.66 EUR
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MFS2302BMMA0EPR2 NXP USA Inc. 568_FS23.pdf Description: MFS2302BMMA0EPR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2302BMBA0EPR2 NXP USA Inc. 568_FS23.pdf Description: MFS2302BMBA0EPR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2302BMMA0EP NXP USA Inc. 568_FS23.pdf Description: MFS2302BMMA0EP
Packaging: Tray
Produkt ist nicht verfügbar
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MFS2302BMBA0EP NXP USA Inc. 568_FS23.pdf Description: MFS2302BMBA0EP
Packaging: Tray
Produkt ist nicht verfügbar
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MKS20FN128VLL12 MKS20FN128VLL12 NXP USA Inc. KS22P100M120SF0.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKS20FN256VLL12 MKS20FN256VLL12 NXP USA Inc. KS22P100M120SF0.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCHC908QY2MDWE MCHC908QY2MDWE NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC3141FET180/CP32 NXP USA Inc. Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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TDA8035HN/C2/S1J TDA8035HN/C2/S1J NXP USA Inc. TDA8035.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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TDA8035HN/C2/S1J TDA8035HN/C2/S1J NXP USA Inc. TDA8035.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 5902 Stücke:
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9+2.01 EUR
13+1.45 EUR
25+1.32 EUR
100+1.16 EUR
250+1.09 EUR
500+1.05 EUR
1000+1.01 EUR
2500+0.97 EUR
Mindestbestellmenge: 9
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TDA8035HN/C1/S1J TDA8035HN/C1/S1J NXP USA Inc. TDA8035.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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TDA8035HN/C1/S1J TDA8035HN/C1/S1J NXP USA Inc. TDA8035.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 5685 Stücke:
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10+1.9 EUR
13+1.37 EUR
25+1.24 EUR
100+1.1 EUR
250+1.03 EUR
500+0.99 EUR
1000+0.95 EUR
2500+0.92 EUR
Mindestbestellmenge: 10
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HEC4027BT-Q100J NXP USA Inc. Description: IC FF JK TYPE DUAL 16SOIC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MM912J637AM2EPR2 MM912J637AM2EPR2 NXP USA Inc. MM912_637D1.pdf Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MM912J637AM2EP MM912J637AM2EP NXP USA Inc. MM912_637D1.pdf Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCT2075GVX PCT2075GVX NXP USA Inc. PCT2075.pdf Description: SENSOR DIGITAL -55C-125C 6TSOP
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Produkt ist nicht verfügbar
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PCT2075GVX PCT2075GVX NXP USA Inc. PCT2075.pdf Description: SENSOR DIGITAL -55C-125C 6TSOP
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Produkt ist nicht verfügbar
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MC9S08JS16LCWJ MC9S08JS16LCWJ NXP USA Inc. MC9S08JS16.pdf Description: IC MCU 8BIT 16KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8245LZU266D MPC8245LZU266D NXP USA Inc. MPC8245.pdf Description: IC MPU MPC82XX 266MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
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LPC1111FDH20/002,5 LPC1111FDH20/002,5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
Produkt ist nicht verfügbar
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LPC1111FDH20/002,5 LPC1111FDH20/002,5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
auf Bestellung 575 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.82 EUR
10+2.3 EUR
25+2.24 EUR
100+2.18 EUR
250+2.16 EUR
500+2.14 EUR
Mindestbestellmenge: 5
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MC68HC705C8AB MC68HC705C8AB NXP USA Inc. MC68HC705C8A.pdf Description: IC MCU 8BIT 8KB OTP 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 42-PDIP
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC705C8AFNE MC68HC705C8AFNE NXP USA Inc. MC68HC705C8A.pdf Description: IC MCU 8BIT 8KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MIMX8SL1CVNFZBAR NXP USA Inc. Description: I.MX8SOLOLXLITE 15SQ
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX8SL1CVNFZBA NXP USA Inc. Description: I.MX8SOLOLXLITE 15SQ
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4000EL/101S470K NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4000EL/101S275Y NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVC2G241DP-Q100125 74LVC2G241DP-Q100125 NXP USA Inc. 74LVC2G241_Q100.pdf Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-TSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 81040 Stücke:
Lieferzeit 10-14 Tag (e)
1354+0.35 EUR
Mindestbestellmenge: 1354
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A5M34TG140-TCT1 A5M34TG140-TCT1 NXP USA Inc. A5M34TG140-TC.pdf Description: RF AMPLIFIER AIRFAST POWER AMPLI
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.67GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.5dB
P1dB: 49.7dBm
Test Frequency: 3.67GHz
Supplier Device Package: 30-PLGA (14x10)
Produkt ist nicht verfügbar
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A5M34TG140-TCT1 A5M34TG140-TCT1 NXP USA Inc. A5M34TG140-TC.pdf Description: RF AMPLIFIER AIRFAST POWER AMPLI
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.67GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.5dB
P1dB: 49.7dBm
Test Frequency: 3.67GHz
Supplier Device Package: 30-PLGA (14x10)
auf Bestellung 1035 Stücke:
Lieferzeit 10-14 Tag (e)
1+128.3 EUR
10+112.78 EUR
25+108.71 EUR
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MAC7121MAG40 MAC7121MAG40 NXP USA Inc. MAC7100.pdf Description: IC MCU 32BIT 544KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM7®
Data Converters: A/D 16x8/10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 85
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1114LVFHN24/103 LPC1114LVFHN24/103 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
Produkt ist nicht verfügbar
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LFTHNBT NXP USA Inc. Description: 44 PIN 0.8 MM QFP SURFACE MOUNT
Packaging: Bulk
Module/Board Type: Socket Module - QFP
Produkt ist nicht verfügbar
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LFTHNYLT NXP USA Inc. Description: 144 PIN 0.5MM QFP TARGET INTERFA
Packaging: Bulk
Module/Board Type: Socket Module - QFP
Produkt ist nicht verfügbar
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LFTHNYBT NXP USA Inc. Description: 44PIN .8MM QFP TARGET INTERFACE
Packaging: Bulk
Module/Board Type: Socket Module - QFP
Produkt ist nicht verfügbar
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MMPF0100F3AEPR2 MMPF0100F3AEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MMPF0100F6AEPR2 MMPF0100F6AEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MMPF0100FCAEPR2 MMPF0100FCAEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MMPF0100F6ANESR2 MMPF0100F6ANESR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MMPF0100FAANESR2 MMPF0100FAANESR2 NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MMPF0100FCANESR2 MMPF0100FCANESR2 NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MMPF0100F0AZESR2 MMPF0100F0AZESR2 NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MMPF0100F6AZESR2 MMPF0100F6AZESR2 NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MMPF0100F8AZESR2 MMPF0100F8AZESR2 NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MMPF0100FAAZESR2 MMPF0100FAAZESR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LFDAA13C
Hersteller: NXP USA Inc.
Description: 32 PIN 0.5MM PITCH QFN ZIF SOCKE
Packaging: Bulk
Module/Board Type: Socket Module - QFN
Produkt ist nicht verfügbar
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S9KEAZ64ACLHR S9KEA128P80M48SF0.pdf
S9KEAZ64ACLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVML31F1WKHR S12ZVMFS.pdf
S912ZVML31F1WKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33PF8100EPESR2 PF8100_PF8200.pdf
MC33PF8100EPESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MC33FS6600M1ESR2
MC33FS6600M1ESR2
Hersteller: NXP USA Inc.
Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
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FS32K146UIT0VLLR S32K1xx.pdf
FS32K146UIT0VLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FX32K142HAT0MLHT S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K142 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX27MJP4AR2 MCIMX27EC.pdf
MCIMX27MJP4AR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX27MJP4A MCIMX27EC.pdf
MCIMX27MJP4A
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Produkt ist nicht verfügbar
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MMA6827BKCWR2 MMA68xx.pdf
MMA6827BKCWR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4.096
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCF52233CAL60 MCF52235.pdf
MCF52233CAL60
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 73
DigiKey Programmable: Not Verified
auf Bestellung 292 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+42.7 EUR
10+31.67 EUR
25+28.84 EUR
80+26.12 EUR
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MPC8315CVRADDA MPC8315EEC.pdf
MPC8315CVRADDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
Produkt ist nicht verfügbar
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MC908QB8VDWE MC68HC908QB8.pdf
MC908QB8VDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NX3P2902BUK012 PHGL-S-A0004564278-1.pdf?t.download=true&u=5oefqw
NX3P2902BUK012
Hersteller: NXP USA Inc.
Description: LOGIC CONTROLLED HIGH-SIDE POWER
Packaging: Bulk
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
702+0.69 EUR
Mindestbestellmenge: 702
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LS1046AXE8T1A LS1046A.pdf
LS1046AXE8T1A
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+274.56 EUR
10+233.66 EUR
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MFS2302BMMA0EPR2 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2302BMMA0EPR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2302BMBA0EPR2 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2302BMBA0EPR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2302BMMA0EP 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2302BMMA0EP
Packaging: Tray
Produkt ist nicht verfügbar
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MFS2302BMBA0EP 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2302BMBA0EP
Packaging: Tray
Produkt ist nicht verfügbar
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MKS20FN128VLL12 KS22P100M120SF0.pdf
MKS20FN128VLL12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKS20FN256VLL12 KS22P100M120SF0.pdf
MKS20FN256VLL12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCHC908QY2MDWE MC68HC908QY4.pdf
MCHC908QY2MDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC3141FET180/CP32
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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TDA8035HN/C2/S1J TDA8035.pdf
TDA8035HN/C2/S1J
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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TDA8035HN/C2/S1J TDA8035.pdf
TDA8035HN/C2/S1J
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 5902 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.01 EUR
13+1.45 EUR
25+1.32 EUR
100+1.16 EUR
250+1.09 EUR
500+1.05 EUR
1000+1.01 EUR
2500+0.97 EUR
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TDA8035HN/C1/S1J TDA8035.pdf
TDA8035HN/C1/S1J
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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TDA8035HN/C1/S1J TDA8035.pdf
TDA8035HN/C1/S1J
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 5685 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.9 EUR
13+1.37 EUR
25+1.24 EUR
100+1.1 EUR
250+1.03 EUR
500+0.99 EUR
1000+0.95 EUR
2500+0.92 EUR
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HEC4027BT-Q100J
Hersteller: NXP USA Inc.
Description: IC FF JK TYPE DUAL 16SOIC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MM912J637AM2EPR2 MM912_637D1.pdf
MM912J637AM2EPR2
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MM912J637AM2EP MM912_637D1.pdf
MM912J637AM2EP
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCT2075GVX PCT2075.pdf
PCT2075GVX
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 6TSOP
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Produkt ist nicht verfügbar
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PCT2075GVX PCT2075.pdf
PCT2075GVX
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 6TSOP
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Produkt ist nicht verfügbar
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MC9S08JS16LCWJ MC9S08JS16.pdf
MC9S08JS16LCWJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8245LZU266D MPC8245.pdf
MPC8245LZU266D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
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LPC1111FDH20/002,5 LPC111X.pdf
LPC1111FDH20/002,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
Produkt ist nicht verfügbar
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LPC1111FDH20/002,5 LPC111X.pdf
LPC1111FDH20/002,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
auf Bestellung 575 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.82 EUR
10+2.3 EUR
25+2.24 EUR
100+2.18 EUR
250+2.16 EUR
500+2.14 EUR
Mindestbestellmenge: 5
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MC68HC705C8AB MC68HC705C8A.pdf
MC68HC705C8AB
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 42-PDIP
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC705C8AFNE MC68HC705C8A.pdf
MC68HC705C8AFNE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MIMX8SL1CVNFZBAR
Hersteller: NXP USA Inc.
Description: I.MX8SOLOLXLITE 15SQ
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX8SL1CVNFZBA
Hersteller: NXP USA Inc.
Description: I.MX8SOLOLXLITE 15SQ
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4000EL/101S470K
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4000EL/101S275Y
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVC2G241DP-Q100125 74LVC2G241_Q100.pdf
74LVC2G241DP-Q100125
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-TSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 81040 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1354+0.35 EUR
Mindestbestellmenge: 1354
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A5M34TG140-TCT1 A5M34TG140-TC.pdf
A5M34TG140-TCT1
Hersteller: NXP USA Inc.
Description: RF AMPLIFIER AIRFAST POWER AMPLI
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.67GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.5dB
P1dB: 49.7dBm
Test Frequency: 3.67GHz
Supplier Device Package: 30-PLGA (14x10)
Produkt ist nicht verfügbar
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A5M34TG140-TCT1 A5M34TG140-TC.pdf
A5M34TG140-TCT1
Hersteller: NXP USA Inc.
Description: RF AMPLIFIER AIRFAST POWER AMPLI
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.67GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.5dB
P1dB: 49.7dBm
Test Frequency: 3.67GHz
Supplier Device Package: 30-PLGA (14x10)
auf Bestellung 1035 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+128.3 EUR
10+112.78 EUR
25+108.71 EUR
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MAC7121MAG40 MAC7100.pdf
MAC7121MAG40
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 544KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM7®
Data Converters: A/D 16x8/10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 85
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1114LVFHN24/103 LPC111XLV_LPC11XXLVUK.pdf
LPC1114LVFHN24/103
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
Produkt ist nicht verfügbar
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LFTHNBT
Hersteller: NXP USA Inc.
Description: 44 PIN 0.8 MM QFP SURFACE MOUNT
Packaging: Bulk
Module/Board Type: Socket Module - QFP
Produkt ist nicht verfügbar
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LFTHNYLT
Hersteller: NXP USA Inc.
Description: 144 PIN 0.5MM QFP TARGET INTERFA
Packaging: Bulk
Module/Board Type: Socket Module - QFP
Produkt ist nicht verfügbar
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LFTHNYBT
Hersteller: NXP USA Inc.
Description: 44PIN .8MM QFP TARGET INTERFACE
Packaging: Bulk
Module/Board Type: Socket Module - QFP
Produkt ist nicht verfügbar
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MMPF0100F3AEPR2 MMPF0100.pdf
MMPF0100F3AEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MMPF0100F6AEPR2 MMPF0100.pdf
MMPF0100F6AEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MMPF0100FCAEPR2 MMPF0100.pdf
MMPF0100FCAEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MMPF0100F6ANESR2 MMPF0100.pdf
MMPF0100F6ANESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MMPF0100FAANESR2
MMPF0100FAANESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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MMPF0100FCANESR2
MMPF0100FCANESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MMPF0100F0AZESR2
MMPF0100F0AZESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MMPF0100F6AZESR2
MMPF0100F6AZESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MMPF0100F8AZESR2
MMPF0100F8AZESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MMPF0100FAAZESR2 MMPF0100.pdf
MMPF0100FAAZESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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