Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34677) > Seite 520 nach 578
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SPC5674KAVMS2 | NXP USA Inc. |
 Description: IC MCU 32B 1.5MB FLASH 473MAPBGAPackaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5674KAVMS2R | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA Packaging: Tape & Reel (TR) Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| SPC5674FAMVV3R | NXP USA Inc. |
Description: NXP 32-BIT MCU, POWER ARCH CORE, Packaging: Tape & Reel (TR) Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 516-PBGA (27x27) Number of I/O: 32 |
Produkt ist nicht verfügbar |
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SPC5674FAMVR3 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 416-PBGA (27x27) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5674FAMVR3R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 416PBGA Packaging: Tape & Reel (TR) Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 416-PBGA (27x27) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5674FAMVY3R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 516FPBGA Packaging: Tape & Reel (TR) Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 516-PBGA (27x27) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| SPC5674FAMVV3 | NXP USA Inc. |
Description: NXP 32-BIT MCU, POWER ARCH CORE, Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 516-PBGA (27x27) Number of I/O: 32 |
Produkt ist nicht verfügbar |
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| LFJ74INTPZA | NXP USA Inc. |
Description: QORIVVA MPC5674F ON A 516 PIN 1. Packaging: Bulk For Use With/Related Products: MPC5674F Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
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| LFJ74INTPWA | NXP USA Inc. |
Description: QORIVVA MPC5674F ON A 416 PIN 1. Packaging: Bulk For Use With/Related Products: MPC5674F Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
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| LFVBBOJ74W1A | NXP USA Inc. |
Description: QORIVVA MPC5674F 422 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674F Accessory Type: Base Board |
Produkt ist nicht verfügbar |
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| LFVBBJ74WA | NXP USA Inc. |
Description: QORIVVA MPC5674A 416 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674A Accessory Type: Base Board |
Produkt ist nicht verfügbar |
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| LFJ74DBGZWA | NXP USA Inc. |
Description: QORIVVA MPC5674 416 PIN 1.0MM CA Packaging: Bulk For Use With/Related Products: MPC5674 Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
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| LFVBBOJ74Z1A | NXP USA Inc. |
Description: QORIVVA MPC5674F 522 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674F Accessory Type: Base Board |
Produkt ist nicht verfügbar |
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| LFVBBJ74ZA | NXP USA Inc. |
Description: QORIVVA MPC5674A 516 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674A Accessory Type: Base Board |
Produkt ist nicht verfügbar |
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| LFVCAL32SYNC4 | NXP USA Inc. |
Description: 32 BIT 4MB VERTICAL CALIBRATION Packaging: Bulk For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C Accessory Type: Daughter Board |
Produkt ist nicht verfügbar |
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| LFVCAL32SYNC8 | NXP USA Inc. |
Description: 32 BIT 8MB VERTICAL CALIBRATION Packaging: Bulk For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C Accessory Type: Daughter Board |
Produkt ist nicht verfügbar |
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| LFVBSJ74ZZ1A | NXP USA Inc. |
Description: QORIVVA MPC5674 522 PIN 1.0MM VE Packaging: Bulk For Use With/Related Products: MPC5674 Accessory Type: Base Board |
Produkt ist nicht verfügbar |
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| LFVBSJ74ZW1A | NXP USA Inc. |
Description: QORIVVA MPC5674 422 PIN 1.0MM VE Packaging: Bulk For Use With/Related Products: MPC5674 Accessory Type: Base Board |
Produkt ist nicht verfügbar |
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| LFVBSJ74ZWA | NXP USA Inc. |
Description: QORIVVA MPC5674 416 PIN 1.0MM VE Packaging: Bulk For Use With/Related Products: MPC5674 Accessory Type: Base Board |
Produkt ist nicht verfügbar |
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| LFVBSJ74ZZA | NXP USA Inc. |
Description: QORIVVA 522 PIN 1.0MM PRE-VERTIC Packaging: Bulk For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C Accessory Type: Base Board |
Produkt ist nicht verfügbar |
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| SPC5674KAVJM2R | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA Packaging: Tape & Reel (TR) Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| SPC5674KAVJM2 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCA8575DB,118 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C 24SSOP Packaging: Tape & Reel (TR) Features: POR Package / Case: 24-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-SSOP Current - Output Source/Sink: 100µA, 25mA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCA8575DB,118 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C 24SSOP Packaging: Cut Tape (CT) Features: POR Package / Case: 24-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-SSOP Current - Output Source/Sink: 100µA, 25mA DigiKey Programmable: Not Verified |
auf Bestellung 709 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF52232CAF50 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 56 DigiKey Programmable: Not Verified |
auf Bestellung 680 Stücke: Lieferzeit 10-14 Tag (e) |
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PMV450ENEA215 | NXP USA Inc. |
Description: NOW NEXPERIA SMALL SIGNAL FIELD- Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MPC8555EPXAPF | NXP USA Inc. |
Description: IC MPU MPC85XX 833MHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 833MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
Produkt ist nicht verfügbar |
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S912ZVHL32F1VLQ | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68332GMEH16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP Packaging: Bulk Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 16MHz RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Number of I/O: 15 DigiKey Programmable: Not Verified |
auf Bestellung 485 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCIMX6Y2DVM09AA557 | NXP USA Inc. |
Description: CORTEX A9 RISC MICROPROCESSOR 32 Packaging: Bulk |
Produkt ist nicht verfügbar |
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| MCIMX6DP5EYM1AA557 | NXP USA Inc. |
Description: CORTEX A9 RISC MICROPROCESSOR 32 Packaging: Bulk |
Produkt ist nicht verfügbar |
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| MCIMX6S1AVM08AC557 | NXP USA Inc. |
Description: CORTEX A9 RISC MICROPROCESSOR 32 Packaging: Bulk |
Produkt ist nicht verfügbar |
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| MCIMX6U7CVM08AC557 | NXP USA Inc. |
Description: CORTEX A9 RISC MICROPROCESSOR 32 Packaging: Bulk |
Produkt ist nicht verfügbar |
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MCIMX6V2CVM08AB557 | NXP USA Inc. |
Description: CORTEX A9 RISC MICROPROCESSOR 32 Packaging: Bulk |
Produkt ist nicht verfügbar |
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PDZ6.8B/ZL115 | NXP USA Inc. |
Description: DIODE ZENER Packaging: Bulk |
Produkt ist nicht verfügbar |
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MPC855TCZQ66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
auf Bestellung 500 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1462BTK/S1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 8Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 100 mV Duplex: Half |
Produkt ist nicht verfügbar |
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TJA1462ATK/S1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 8Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 100 mV Duplex: Half |
Produkt ist nicht verfügbar |
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PMEG2015EPK,315 | NXP USA Inc. |
Description: DIODE SCHOTT 20V 1.5A DFN1608D-2 Packaging: Bulk Package / Case: 2-XDFN Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 5 ns Technology: Schottky Capacitance @ Vr, F: 120pF @ 1V, 1MHz Current - Average Rectified (Io): 1.5A Supplier Device Package: DFN1608D-2 Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 20 V Voltage - Forward (Vf) (Max) @ If: 420 mV @ 1.5 A Current - Reverse Leakage @ Vr: 350 µA @ 10 V |
auf Bestellung 386689 Stücke: Lieferzeit 10-14 Tag (e) |
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MC34PF1510A5EP | NXP USA Inc. |
Description: PF1510 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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BB172115 | NXP USA Inc. |
Description: VARIABLE CAPACITANCE DIODE Packaging: Bulk Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz Capacitance Ratio Condition: C1/C28 Supplier Device Package: SOD-323 Voltage - Peak Reverse (Max): 32 V Capacitance Ratio: 15 |
Produkt ist nicht verfügbar |
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| MMA5212KWR2 | NXP USA Inc. |
Description: ACCELEROMETER 120G PCM/SPI 16QFN Packaging: Tape & Reel (TR) Features: Selectable Low Pass Filter Package / Case: 16-QFN Exposed Pad Output Type: PCM, SPI Mounting Type: Surface Mount Type: Digital Axis: X Acceleration Range: ±120g Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.2V ~ 17V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 4 |
Produkt ist nicht verfügbar |
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| RD772BJBCANFDEVB | NXP USA Inc. |
Description: RD772BJBCANFDEVB Packaging: Bulk Function: Battery Cell Controller Type: Power Management Utilized IC / Part: MC33772C Supplied Contents: Board(s), Cable(s) Primary Attributes: 9V ~ 13.5V Supply Embedded: No |
Produkt ist nicht verfügbar |
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| RD772BJBTPLEVB | NXP USA Inc. |
Description: RD772BJBTPLEVB Packaging: Bulk Function: Battery Cell Controller Type: Power Management Utilized IC / Part: MC33772C Supplied Contents: Board(s), Cable(s) Embedded: No |
Produkt ist nicht verfügbar |
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| RD772BJBTPL8EVB | NXP USA Inc. |
Description: 00 V BATTERY JUNCTION BOX USING Packaging: Bulk Function: Battery Monitor Type: Power Management Supplied Contents: Board(s) Embedded: No |
Produkt ist nicht verfügbar |
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QN9090-001-T10 | NXP USA Inc. |
Description: QN9090 BLE SOC DEV KIT Packaging: Bulk For Use With/Related Products: QN9090 Frequency: 2.4GHz Type: Transceiver; Bluetooth® 5 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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P3T1755DPZ | NXP USA Inc. |
Description: I3C, I2C-BUS INTERFACE, 0.5 C A Packaging: Tape & Reel (TR) Features: Shutdown Mode, One-Shot Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: 2-Wire Serial, I2C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 3.6V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 8-TSSOP Test Condition: -20°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±0.5°C (±1°C) Sensing Temperature - Local: -40°C ~ 125°C |
Produkt ist nicht verfügbar |
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P3T1755DPZ | NXP USA Inc. |
Description: I3C, I2C-BUS INTERFACE, 0.5 C A Packaging: Cut Tape (CT) Features: Shutdown Mode, One-Shot Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: 2-Wire Serial, I2C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 3.6V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 8-TSSOP Test Condition: -20°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±0.5°C (±1°C) Sensing Temperature - Local: -40°C ~ 125°C |
auf Bestellung 1701 Stücke: Lieferzeit 10-14 Tag (e) |
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| SL3S1206FUD2/HAPZ | NXP USA Inc. |
Description: SL3S1206FUD2 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| SL3S1206FUD2/HAPZ | NXP USA Inc. |
Description: SL3S1206FUD2 Packaging: Cut Tape (CT) |
auf Bestellung 388461 Stücke: Lieferzeit 10-14 Tag (e) |
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| P3T1750DPZ | NXP USA Inc. |
Description: IC TEMP SENSOR I3C/I2C-BUS Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: I²C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 3.6V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 8-TSSOP Test Condition: -20°C ~ 85°C Accuracy - Highest (Lowest): ±1°C Sensing Temperature - Local: -40°C ~ 125°C |
Produkt ist nicht verfügbar |
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| P3T1750DPZ | NXP USA Inc. |
Description: IC TEMP SENSOR I3C/I2C-BUS Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: I²C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 3.6V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 8-TSSOP Test Condition: -20°C ~ 85°C Accuracy - Highest (Lowest): ±1°C Sensing Temperature - Local: -40°C ~ 125°C |
Produkt ist nicht verfügbar |
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MCF51JF128VHS | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA Packaging: Bulk Package / Case: 44-VFLGA Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 9x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 44-MAPLGA (5x5) Number of I/O: 31 DigiKey Programmable: Not Verified |
auf Bestellung 2450 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33742PEP | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 48QFN Packaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Applications: Automotive Supplier Device Package: 48-QFN-EP (7x7) |
auf Bestellung 210 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33742PEG | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28SOIC Packaging: Tube Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Supplier Device Package: 28-SOIC Grade: Automotive |
Produkt ist nicht verfügbar |
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| NCF2961VHN2/0200EJ | NXP USA Inc. |
Description: COMBI KEY TX 014 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| NCF2961XHN2/0200EJ | NXP USA Inc. |
Description: COMBI KEY TX 014 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| NCF2961XHN3/0200EY | NXP USA Inc. |
Description: COMBI KEY TX 014 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| NCF2961EHN3/0200EY | NXP USA Inc. |
Description: COMBI KEY TX 014 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| LPC55S26JBD64Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64TQFP Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 36 |
Produkt ist nicht verfügbar |
| SPC5674KAVMS2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5674KAVMS2R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5674FAMVV3R |
Hersteller: NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
Produkt ist nicht verfügbar
| SPC5674FAMVR3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5674FAMVR3R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5674FAMVY3R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 516FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 516FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5674FAMVV3 |
Hersteller: NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
Produkt ist nicht verfügbar
| LFJ74INTPZA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674F ON A 516 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5674F ON A 516 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
| LFJ74INTPWA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674F ON A 416 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5674F ON A 416 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
| LFVBBOJ74W1A |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674F 422 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
Description: QORIVVA MPC5674F 422 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
Produkt ist nicht verfügbar
| LFVBBJ74WA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674A 416 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Description: QORIVVA MPC5674A 416 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Produkt ist nicht verfügbar
| LFJ74DBGZWA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674 416 PIN 1.0MM CA
Packaging: Bulk
For Use With/Related Products: MPC5674
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5674 416 PIN 1.0MM CA
Packaging: Bulk
For Use With/Related Products: MPC5674
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
| LFVBBOJ74Z1A |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674F 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
Description: QORIVVA MPC5674F 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
Produkt ist nicht verfügbar
| LFVBBJ74ZA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674A 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Description: QORIVVA MPC5674A 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Produkt ist nicht verfügbar
| LFVCAL32SYNC4 |
Hersteller: NXP USA Inc.
Description: 32 BIT 4MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Description: 32 BIT 4MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Produkt ist nicht verfügbar
| LFVCAL32SYNC8 |
Hersteller: NXP USA Inc.
Description: 32 BIT 8MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Description: 32 BIT 8MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Produkt ist nicht verfügbar
| LFVBSJ74ZZ1A |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674 522 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Description: QORIVVA MPC5674 522 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Produkt ist nicht verfügbar
| LFVBSJ74ZW1A |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674 422 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Description: QORIVVA MPC5674 422 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Produkt ist nicht verfügbar
| LFVBSJ74ZWA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5674 416 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Description: QORIVVA MPC5674 416 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5674
Accessory Type: Base Board
Produkt ist nicht verfügbar
| LFVBSJ74ZZA |
Hersteller: NXP USA Inc.
Description: QORIVVA 522 PIN 1.0MM PRE-VERTIC
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Base Board
Description: QORIVVA 522 PIN 1.0MM PRE-VERTIC
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Base Board
Produkt ist nicht verfügbar
| SPC5674KAVJM2R |
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5674KAVJM2 |
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PCA8575DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24SSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SSOP
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C 24SSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SSOP
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PCA8575DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24SSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SSOP
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C 24SSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SSOP
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 709 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 4.07 EUR |
| 10+ | 3.65 EUR |
| 25+ | 3.44 EUR |
| 100+ | 2.93 EUR |
| 250+ | 2.75 EUR |
| 500+ | 2.41 EUR |
| MCF52232CAF50 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 680 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 37.72 EUR |
| 10+ | 30.26 EUR |
| 80+ | 25.84 EUR |
| 450+ | 25.5 EUR |
| PMV450ENEA215 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL FIELD-
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: NOW NEXPERIA SMALL SIGNAL FIELD-
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MPC8555EPXAPF |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 833MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 833MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Produkt ist nicht verfügbar
| S912ZVHL32F1VLQ |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68332GMEH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Bulk
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Bulk
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
auf Bestellung 485 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 20+ | 51.73 EUR |
| MCIMX6Y2DVM09AA557 |
|
Produkt ist nicht verfügbar
| MCIMX6DP5EYM1AA557 |
|
Produkt ist nicht verfügbar
| MCIMX6S1AVM08AC557 |
|
Produkt ist nicht verfügbar
| MCIMX6U7CVM08AC557 |
|
Produkt ist nicht verfügbar
| MPC855TCZQ66D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 100+ | 240.63 EUR |
| TJA1462BTK/S1Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Produkt ist nicht verfügbar
| TJA1462ATK/S1Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Produkt ist nicht verfügbar
| PMEG2015EPK,315 |
|
Hersteller: NXP USA Inc.
Description: DIODE SCHOTT 20V 1.5A DFN1608D-2
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Capacitance @ Vr, F: 120pF @ 1V, 1MHz
Current - Average Rectified (Io): 1.5A
Supplier Device Package: DFN1608D-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 420 mV @ 1.5 A
Current - Reverse Leakage @ Vr: 350 µA @ 10 V
Description: DIODE SCHOTT 20V 1.5A DFN1608D-2
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Capacitance @ Vr, F: 120pF @ 1V, 1MHz
Current - Average Rectified (Io): 1.5A
Supplier Device Package: DFN1608D-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 420 mV @ 1.5 A
Current - Reverse Leakage @ Vr: 350 µA @ 10 V
auf Bestellung 386689 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2840+ | 0.19 EUR |
| MC34PF1510A5EP |
|
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
| BB172115 |
|
Hersteller: NXP USA Inc.
Description: VARIABLE CAPACITANCE DIODE
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15
Description: VARIABLE CAPACITANCE DIODE
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15
Produkt ist nicht verfügbar
| MMA5212KWR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 120G PCM/SPI 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4
Description: ACCELEROMETER 120G PCM/SPI 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4
Produkt ist nicht verfügbar
| RD772BJBCANFDEVB |
Hersteller: NXP USA Inc.
Description: RD772BJBCANFDEVB
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 9V ~ 13.5V Supply
Embedded: No
Description: RD772BJBCANFDEVB
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 9V ~ 13.5V Supply
Embedded: No
Produkt ist nicht verfügbar
| RD772BJBTPLEVB |
Hersteller: NXP USA Inc.
Description: RD772BJBTPLEVB
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Embedded: No
Description: RD772BJBTPLEVB
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Embedded: No
Produkt ist nicht verfügbar
| RD772BJBTPL8EVB |
Hersteller: NXP USA Inc.
Description: 00 V BATTERY JUNCTION BOX USING
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Supplied Contents: Board(s)
Embedded: No
Description: 00 V BATTERY JUNCTION BOX USING
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Supplied Contents: Board(s)
Embedded: No
Produkt ist nicht verfügbar
| QN9090-001-T10 |
|
Hersteller: NXP USA Inc.
Description: QN9090 BLE SOC DEV KIT
Packaging: Bulk
For Use With/Related Products: QN9090
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5
Supplied Contents: Board(s)
Description: QN9090 BLE SOC DEV KIT
Packaging: Bulk
For Use With/Related Products: QN9090
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| P3T1755DPZ |
|
Hersteller: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Tape & Reel (TR)
Features: Shutdown Mode, One-Shot
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Tape & Reel (TR)
Features: Shutdown Mode, One-Shot
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
| P3T1755DPZ |
|
Hersteller: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Cut Tape (CT)
Features: Shutdown Mode, One-Shot
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Cut Tape (CT)
Features: Shutdown Mode, One-Shot
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 1701 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 24+ | 0.75 EUR |
| 26+ | 0.69 EUR |
| 100+ | 0.61 EUR |
| 250+ | 0.6 EUR |
| 500+ | 0.59 EUR |
| 1000+ | 0.58 EUR |
| SL3S1206FUD2/HAPZ |
|
Produkt ist nicht verfügbar
| SL3S1206FUD2/HAPZ |
|
auf Bestellung 388461 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 112+ | 0.16 EUR |
| 278+ | 0.063 EUR |
| 298+ | 0.059 EUR |
| 336+ | 0.052 EUR |
| 500+ | 0.051 EUR |
| 1000+ | 0.05 EUR |
| 5000+ | 0.045 EUR |
| P3T1750DPZ |
Hersteller: NXP USA Inc.
Description: IC TEMP SENSOR I3C/I2C-BUS
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I²C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
Description: IC TEMP SENSOR I3C/I2C-BUS
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I²C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
| P3T1750DPZ |
Hersteller: NXP USA Inc.
Description: IC TEMP SENSOR I3C/I2C-BUS
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I²C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
Description: IC TEMP SENSOR I3C/I2C-BUS
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I²C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
| MCF51JF128VHS |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Bulk
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Bulk
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 58+ | 9.2 EUR |
| MC33742PEP |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 48-QFN-EP (7x7)
Description: IC INTERFACE SPECIALIZED 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 48-QFN-EP (7x7)
auf Bestellung 210 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 60+ | 8.2 EUR |
| MC33742PEG |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
| NCF2961VHN2/0200EJ |
Produkt ist nicht verfügbar
| NCF2961XHN2/0200EJ |
Produkt ist nicht verfügbar
| NCF2961XHN3/0200EY |
Produkt ist nicht verfügbar
| NCF2961EHN3/0200EY |
Produkt ist nicht verfügbar
| LPC55S26JBD64Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar