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MC34VR500V7ESR2 MC34VR500V7ESR2 NXP USA Inc. MC34VR500.pdf Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MCZ33905CD3EK MCZ33905CD3EK NXP USA Inc. FSCLS11649-1.pdf?t.download=true&u=5oefqw Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3
Packaging: Bulk
auf Bestellung 676 Stücke:
Lieferzeit 10-14 Tag (e)
53+9.28 EUR
Mindestbestellmenge: 53
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NTP53321G0JTTZ NTP53321G0JTTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
2500+1.51 EUR
5000+1.45 EUR
Mindestbestellmenge: 2500
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NTP53321G0JTTZ NTP53321G0JTTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
auf Bestellung 7376 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.45 EUR
10+2.1 EUR
25+1.99 EUR
100+1.82 EUR
250+1.72 EUR
500+1.65 EUR
1000+1.59 EUR
Mindestbestellmenge: 8
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NTP53121G0JTTZ NTP53121G0JTTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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NTP53121G0JTTZ NTP53121G0JTTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
auf Bestellung 3390 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.25 EUR
10+1.94 EUR
25+1.83 EUR
100+1.68 EUR
250+1.59 EUR
500+1.53 EUR
1000+1.47 EUR
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NTP53321G0JTZ NTP53321G0JTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+1.28 EUR
Mindestbestellmenge: 2500
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NTP53321G0JTZ NTP53321G0JTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
auf Bestellung 7069 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.45 EUR
10+2.1 EUR
25+1.99 EUR
100+1.82 EUR
250+1.72 EUR
500+1.65 EUR
1000+1.59 EUR
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NTP53121G0JTZ NTP53121G0JTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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NTP53121G0JTZ NTP53121G0JTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
auf Bestellung 4021 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.25 EUR
10+1.94 EUR
25+1.83 EUR
100+1.68 EUR
250+1.59 EUR
500+1.53 EUR
1000+1.47 EUR
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PMXB65UPE147 PMXB65UPE147 NXP USA Inc. PMXB65UPE.pdf Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 72mOhm @ 3.2A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 634 pF @ 6 V
auf Bestellung 8951063 Stücke:
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5495+0.081 EUR
Mindestbestellmenge: 5495
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MC9S12B256MFUE MC9S12B256MFUE NXP USA Inc. MC9S12B.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MWCT1016SFVMHN MWCT1016SFVMHN NXP USA Inc. Description: WCT1016 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
Produkt ist nicht verfügbar
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MC8641DTHX1333JE MC8641DTHX1333JE NXP USA Inc. MCP8641%28D%29.pdf Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Produkt ist nicht verfügbar
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FD32K116LFT0MFMT NXP USA Inc. Description: IC MCU
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12G64F1MLC S9S12G64F1MLC NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 2249 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.26 EUR
10+7.1 EUR
25+6.57 EUR
100+5.97 EUR
250+5.69 EUR
500+5.52 EUR
1250+5.34 EUR
Mindestbestellmenge: 2
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BFU530XRVL BFU530XRVL NXP USA Inc. BFU530XR.pdf Description: RF TRANS NPN 12V 11GHZ SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 16.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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BFU530XRVL BFU530XRVL NXP USA Inc. BFU530XR.pdf Description: RF TRANS NPN 12V 11GHZ SOT143R
Packaging: Cut Tape (CT)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 16.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-143R
auf Bestellung 6815 Stücke:
Lieferzeit 10-14 Tag (e)
30+0.6 EUR
45+0.4 EUR
51+0.35 EUR
100+0.3 EUR
250+0.27 EUR
500+0.25 EUR
1000+0.24 EUR
2500+0.23 EUR
5000+0.22 EUR
Mindestbestellmenge: 30
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MC33CD1020AESR2 MC33CD1020AESR2 NXP USA Inc. CD1020.pdf Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Produkt ist nicht verfügbar
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MC33CD1020AES NXP USA Inc. CD1020.pdf Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1124BHG/1Z TJA1124BHG/1Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+2.26 EUR
Mindestbestellmenge: 3000
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TJA1124BHG/1Z TJA1124BHG/1Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.66 EUR
10+3.5 EUR
25+3.21 EUR
100+2.88 EUR
250+2.73 EUR
500+2.64 EUR
1000+2.56 EUR
Mindestbestellmenge: 4
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TJA1124CHG/1Z TJA1124CHG/1Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+2.54 EUR
Mindestbestellmenge: 3000
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TJA1124CHG/1Z TJA1124CHG/1Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5300 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.79 EUR
10+3.59 EUR
25+3.29 EUR
100+2.96 EUR
250+2.8 EUR
500+2.71 EUR
1000+2.63 EUR
Mindestbestellmenge: 4
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SJA1124BHG/1Z SJA1124BHG/1Z NXP USA Inc. SJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SJA1124BHG/1Z SJA1124BHG/1Z NXP USA Inc. SJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1274 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.16 EUR
10+3.88 EUR
25+3.75 EUR
100+3.63 EUR
250+3.52 EUR
500+3.46 EUR
1000+3.37 EUR
Mindestbestellmenge: 4
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SJA1124AHG/1Z SJA1124AHG/1Z NXP USA Inc. SJA1110AUTESFS.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SJA1124AHG/1Z SJA1124AHG/1Z NXP USA Inc. SJA1110AUTESFS.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2635 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.44 EUR
10+4.03 EUR
25+3.9 EUR
100+3.78 EUR
250+3.64 EUR
500+3.55 EUR
1000+3.51 EUR
Mindestbestellmenge: 4
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IW416UK/A1CZ IW416UK/A1CZ NXP USA Inc. IW416.pdf Description: IC RF TXRX 802.15.4 76WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 76-UFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth
Current - Receiving: 5µA ~ 72mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 76-WLCSP (3.95x3.565)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, 64-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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MPC8347CZUAJDB MPC8347CZUAJDB NXP USA Inc. MPC8347EEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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P1015NSE5DFB P1015NSE5DFB NXP USA Inc. QP1024FS.pdf Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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SAF7751HV/N208W/UK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC855TZQ66D4 MPC855TZQ66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
100+231.78 EUR
Mindestbestellmenge: 100
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S9S08AW16AE0VLD S9S08AW16AE0VLD NXP USA Inc. PHGL-S-A0002794566-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
85+6.03 EUR
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74LVC240APW,112 74LVC240APW,112 NXP USA Inc. PHGLS23711-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER INVERT 3.6V 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-TSSOP
auf Bestellung 28939 Stücke:
Lieferzeit 10-14 Tag (e)
1603+0.31 EUR
Mindestbestellmenge: 1603
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PTN36043BBXY PTN36043BBXY NXP USA Inc. PTN36043B.pdf Description: PTN36043BBXY
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Delay Time: 500ps (Max)
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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LFTHNLT NXP USA Inc. Description: 144 PIN 0.5MM SURFACE MOUNT SOCK
Packaging: Bulk
Module/Board Type: Socket Module
Produkt ist nicht verfügbar
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LFDAA13C NXP USA Inc. Description: 32 PIN 0.5MM PITCH QFN ZIF SOCKE
Packaging: Bulk
Module/Board Type: Socket Module - QFN
Produkt ist nicht verfügbar
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S9KEAZ64ACLHR S9KEAZ64ACLHR NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVML31F1WKHR S912ZVML31F1WKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33PF8100EPESR2 MC33PF8100EPESR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MC33FS6600M1ESR2 MC33FS6600M1ESR2 NXP USA Inc. Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
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FS32K146UIT0VLLR FS32K146UIT0VLLR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FX32K142HAT0MLHT NXP USA Inc. S32K1xx.pdf Description: S32K142 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX27MJP4AR2 MCIMX27MJP4AR2 NXP USA Inc. MCIMX27EC.pdf Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX27MJP4A MCIMX27MJP4A NXP USA Inc. MCIMX27EC.pdf Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Produkt ist nicht verfügbar
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MMA6827BKCWR2 MMA6827BKCWR2 NXP USA Inc. MMA68xx.pdf Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4.096
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCF52233CAL60 MCF52233CAL60 NXP USA Inc. MCF52235.pdf Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 73
DigiKey Programmable: Not Verified
auf Bestellung 292 Stücke:
Lieferzeit 10-14 Tag (e)
1+42.7 EUR
10+31.67 EUR
25+28.84 EUR
80+26.12 EUR
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MPC8315CVRADDA MPC8315CVRADDA NXP USA Inc. MPC8315EEC.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
Produkt ist nicht verfügbar
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MC908QB8VDWE MC908QB8VDWE NXP USA Inc. MC68HLC908QY4.pdf Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NX3P2902BUK012 NX3P2902BUK012 NXP USA Inc. PHGL-S-A0004564278-1.pdf?t.download=true&u=5oefqw Description: LOGIC CONTROLLED HIGH-SIDE POWER
Packaging: Bulk
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
702+0.69 EUR
Mindestbestellmenge: 702
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LS1046AXE8T1A LS1046AXE8T1A NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
1+278.22 EUR
10+236.78 EUR
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MFS2302BMMA0EPR2 NXP USA Inc. 568_FS23.pdf Description: MFS2302BMMA0EPR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2302BMBA0EPR2 NXP USA Inc. 568_FS23.pdf Description: MFS2302BMBA0EPR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2302BMMA0EP NXP USA Inc. 568_FS23.pdf Description: MFS2302BMMA0EP
Packaging: Tray
Produkt ist nicht verfügbar
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MFS2302BMBA0EP NXP USA Inc. 568_FS23.pdf Description: MFS2302BMBA0EP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MKS20FN128VLL12 MKS20FN128VLL12 NXP USA Inc. KS22P100M120SF0.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKS20FN256VLL12 MKS20FN256VLL12 NXP USA Inc. KS22P100M120SF0.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCHC908QY2MDWE MCHC908QY2MDWE NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC3141FET180/CP32 NXP USA Inc. Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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MC34VR500V7ESR2 MC34VR500.pdf
MC34VR500V7ESR2
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MCZ33905CD3EK FSCLS11649-1.pdf?t.download=true&u=5oefqw
MCZ33905CD3EK
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3
Packaging: Bulk
auf Bestellung 676 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
53+9.28 EUR
Mindestbestellmenge: 53
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NTP53321G0JTTZ NTP53x2.pdf
NTP53321G0JTTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.51 EUR
5000+1.45 EUR
Mindestbestellmenge: 2500
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NTP53321G0JTTZ NTP53x2.pdf
NTP53321G0JTTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
auf Bestellung 7376 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.45 EUR
10+2.1 EUR
25+1.99 EUR
100+1.82 EUR
250+1.72 EUR
500+1.65 EUR
1000+1.59 EUR
Mindestbestellmenge: 8
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NTP53121G0JTTZ NTP53x2.pdf
NTP53121G0JTTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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NTP53121G0JTTZ NTP53x2.pdf
NTP53121G0JTTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
auf Bestellung 3390 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.25 EUR
10+1.94 EUR
25+1.83 EUR
100+1.68 EUR
250+1.59 EUR
500+1.53 EUR
1000+1.47 EUR
Mindestbestellmenge: 8
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NTP53321G0JTZ NTP53x2.pdf
NTP53321G0JTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.28 EUR
Mindestbestellmenge: 2500
Im Einkaufswagen  Stück im Wert von  UAH
NTP53321G0JTZ NTP53x2.pdf
NTP53321G0JTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
auf Bestellung 7069 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.45 EUR
10+2.1 EUR
25+1.99 EUR
100+1.82 EUR
250+1.72 EUR
500+1.65 EUR
1000+1.59 EUR
Mindestbestellmenge: 8
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NTP53121G0JTZ NTP53x2.pdf
NTP53121G0JTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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NTP53121G0JTZ NTP53x2.pdf
NTP53121G0JTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
auf Bestellung 4021 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.25 EUR
10+1.94 EUR
25+1.83 EUR
100+1.68 EUR
250+1.59 EUR
500+1.53 EUR
1000+1.47 EUR
Mindestbestellmenge: 8
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PMXB65UPE147 PMXB65UPE.pdf
PMXB65UPE147
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 72mOhm @ 3.2A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 634 pF @ 6 V
auf Bestellung 8951063 Stücke:
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Anzahl Preis
5495+0.081 EUR
Mindestbestellmenge: 5495
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MC9S12B256MFUE MC9S12B.pdf
MC9S12B256MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MWCT1016SFVMHN
MWCT1016SFVMHN
Hersteller: NXP USA Inc.
Description: WCT1016 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
Produkt ist nicht verfügbar
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MC8641DTHX1333JE MCP8641%28D%29.pdf
MC8641DTHX1333JE
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Produkt ist nicht verfügbar
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FD32K116LFT0MFMT
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12G64F1MLC MC9S12GRMV1.pdf
S9S12G64F1MLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 2249 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.26 EUR
10+7.1 EUR
25+6.57 EUR
100+5.97 EUR
250+5.69 EUR
500+5.52 EUR
1250+5.34 EUR
Mindestbestellmenge: 2
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BFU530XRVL BFU530XR.pdf
BFU530XRVL
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 16.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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BFU530XRVL BFU530XR.pdf
BFU530XRVL
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SOT143R
Packaging: Cut Tape (CT)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 16.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-143R
auf Bestellung 6815 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
30+0.6 EUR
45+0.4 EUR
51+0.35 EUR
100+0.3 EUR
250+0.27 EUR
500+0.25 EUR
1000+0.24 EUR
2500+0.23 EUR
5000+0.22 EUR
Mindestbestellmenge: 30
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MC33CD1020AESR2 CD1020.pdf
MC33CD1020AESR2
Hersteller: NXP USA Inc.
Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Produkt ist nicht verfügbar
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MC33CD1020AES CD1020.pdf
Hersteller: NXP USA Inc.
Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1124BHG/1Z TJA1124.pdf
TJA1124BHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+2.26 EUR
Mindestbestellmenge: 3000
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TJA1124BHG/1Z TJA1124.pdf
TJA1124BHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.66 EUR
10+3.5 EUR
25+3.21 EUR
100+2.88 EUR
250+2.73 EUR
500+2.64 EUR
1000+2.56 EUR
Mindestbestellmenge: 4
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TJA1124CHG/1Z TJA1124.pdf
TJA1124CHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+2.54 EUR
Mindestbestellmenge: 3000
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TJA1124CHG/1Z TJA1124.pdf
TJA1124CHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.79 EUR
10+3.59 EUR
25+3.29 EUR
100+2.96 EUR
250+2.8 EUR
500+2.71 EUR
1000+2.63 EUR
Mindestbestellmenge: 4
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SJA1124BHG/1Z SJA1124.pdf
SJA1124BHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SJA1124BHG/1Z SJA1124.pdf
SJA1124BHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1274 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.16 EUR
10+3.88 EUR
25+3.75 EUR
100+3.63 EUR
250+3.52 EUR
500+3.46 EUR
1000+3.37 EUR
Mindestbestellmenge: 4
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SJA1124AHG/1Z SJA1110AUTESFS.pdf
SJA1124AHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SJA1124AHG/1Z SJA1110AUTESFS.pdf
SJA1124AHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2635 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.44 EUR
10+4.03 EUR
25+3.9 EUR
100+3.78 EUR
250+3.64 EUR
500+3.55 EUR
1000+3.51 EUR
Mindestbestellmenge: 4
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IW416UK/A1CZ IW416.pdf
IW416UK/A1CZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 76WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 76-UFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth
Current - Receiving: 5µA ~ 72mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 76-WLCSP (3.95x3.565)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, 64-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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MPC8347CZUAJDB MPC8347EEC.pdf
MPC8347CZUAJDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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P1015NSE5DFB QP1024FS.pdf
P1015NSE5DFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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SAF7751HV/N208W/UK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC855TZQ66D4 MPC860EC.pdf
MPC855TZQ66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
100+231.78 EUR
Mindestbestellmenge: 100
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S9S08AW16AE0VLD PHGL-S-A0002794566-1.pdf?t.download=true&u=5oefqw
S9S08AW16AE0VLD
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
85+6.03 EUR
Mindestbestellmenge: 85
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74LVC240APW,112 PHGLS23711-1.pdf?t.download=true&u=5oefqw
74LVC240APW,112
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 3.6V 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-TSSOP
auf Bestellung 28939 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1603+0.31 EUR
Mindestbestellmenge: 1603
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PTN36043BBXY PTN36043B.pdf
PTN36043BBXY
Hersteller: NXP USA Inc.
Description: PTN36043BBXY
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Delay Time: 500ps (Max)
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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LFTHNLT
Hersteller: NXP USA Inc.
Description: 144 PIN 0.5MM SURFACE MOUNT SOCK
Packaging: Bulk
Module/Board Type: Socket Module
Produkt ist nicht verfügbar
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LFDAA13C
Hersteller: NXP USA Inc.
Description: 32 PIN 0.5MM PITCH QFN ZIF SOCKE
Packaging: Bulk
Module/Board Type: Socket Module - QFN
Produkt ist nicht verfügbar
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S9KEAZ64ACLHR S9KEA128P80M48SF0.pdf
S9KEAZ64ACLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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S912ZVML31F1WKHR S12ZVMFS.pdf
S912ZVML31F1WKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33PF8100EPESR2 PF8100_PF8200.pdf
MC33PF8100EPESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MC33FS6600M1ESR2
MC33FS6600M1ESR2
Hersteller: NXP USA Inc.
Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
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FS32K146UIT0VLLR S32K1xx.pdf
FS32K146UIT0VLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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FX32K142HAT0MLHT S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K142 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX27MJP4AR2 MCIMX27EC.pdf
MCIMX27MJP4AR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX27MJP4A MCIMX27EC.pdf
MCIMX27MJP4A
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Produkt ist nicht verfügbar
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MMA6827BKCWR2 MMA68xx.pdf
MMA6827BKCWR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4.096
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCF52233CAL60 MCF52235.pdf
MCF52233CAL60
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 73
DigiKey Programmable: Not Verified
auf Bestellung 292 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+42.7 EUR
10+31.67 EUR
25+28.84 EUR
80+26.12 EUR
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MPC8315CVRADDA MPC8315EEC.pdf
MPC8315CVRADDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
Produkt ist nicht verfügbar
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MC908QB8VDWE MC68HLC908QY4.pdf
MC908QB8VDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NX3P2902BUK012 PHGL-S-A0004564278-1.pdf?t.download=true&u=5oefqw
NX3P2902BUK012
Hersteller: NXP USA Inc.
Description: LOGIC CONTROLLED HIGH-SIDE POWER
Packaging: Bulk
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
702+0.69 EUR
Mindestbestellmenge: 702
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LS1046AXE8T1A LS1046A.pdf
LS1046AXE8T1A
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+278.22 EUR
10+236.78 EUR
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MFS2302BMMA0EPR2 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2302BMMA0EPR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2302BMBA0EPR2 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2302BMBA0EPR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2302BMMA0EP 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2302BMMA0EP
Packaging: Tray
Produkt ist nicht verfügbar
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MFS2302BMBA0EP 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2302BMBA0EP
Packaging: Tray
Produkt ist nicht verfügbar
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MKS20FN128VLL12 KS22P100M120SF0.pdf
MKS20FN128VLL12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKS20FN256VLL12 KS22P100M120SF0.pdf
MKS20FN256VLL12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCHC908QY2MDWE MC68HC908QY4.pdf
MCHC908QY2MDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC3141FET180/CP32
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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