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SAF7755HV/N205W/CY NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Produkt ist nicht verfügbar
TEA2017DK1007 TEA2017DK1007 NXP USA Inc. TEA2017DK1007QSG.pdf Description: TEA2017AAT/3 PROGRAM BOARD
Packaging: Bulk
For Use With/Related Products: TEA2017
Type: Programmer
Contents: Board(s)
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
1+113.19 EUR
10+ 107.52 EUR
TEA2016DK1008 TEA2016DK1008 NXP USA Inc. UM11925.pdf Description: TEA20XX SOCKET DB1586 BOARD
Packaging: Bulk
For Use With/Related Products: TEA2016
Type: Programmer
Contents: Board(s), Accessories
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+113.19 EUR
10+ 107.52 EUR
SPC5775BSK3MME2R NXP USA Inc. Description: NXP 32-BIT MCU, 4MB FLASH FCACS
Packaging: Tape & Reel (TR)
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Supplier Device Package: 416-MAPBGA (27x27)
Produkt ist nicht verfügbar
SPC5775BSK3MME2 NXP USA Inc. Description: NXP 32-BIT MCU, 4MB FLASH FCACS
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Supplier Device Package: 416-MAPBGA (27x27)
Produkt ist nicht verfügbar
SPC5775EDK3MME3R SPC5775EDK3MME3R NXP USA Inc. MPC5775E_DS.pdf Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Number of I/O: 293
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SAF775DHN/N208WMP NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHN/N208WK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHV/N208WK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
SAF775DHV/N208W/KY NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF775DHV/N208W/KK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
SAF7751HN/N208WMP NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHN/N208W/MP NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHV/N208WY NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF7754HN/N208WMP NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF7751HN/N208WK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHV/N208W/DY NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF775DHN/N208WAMP NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHV/N208W/CY NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHN/N208W/KK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHV/N208W/DK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
SAF775DHV/N208W/AY NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF775DHV/N208W/CK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF7754HN/N208WK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHV/N208W/AK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
SAF775DHV/N208W/BY NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
MHW8188AN MHW8188AN NXP USA Inc. MHW8188AN.pdf Description: IC AMP CATV 7-CATV MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-CATV Module
Number of Circuits: 1
Current - Supply: 425 mA
Produkt ist nicht verfügbar
BSC9131NSE1KHKB NXP USA Inc. Description: QORIQ QONVERGE MULTICORE BASEBAN
Packaging: Bulk
Produkt ist nicht verfügbar
FS32R294KCK0MJDT NXP USA Inc. Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294KAK0MJDT NXP USA Inc. Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294KCK0MJDR NXP USA Inc. Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294KAK0MJDR NXP USA Inc. Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294JCK0MJDT NXP USA Inc. Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
RAM Size: 5.5M x 8
Program Memory Type: ROMless
Core Processor: e200z4, e200z7
Core Size: 32-Bit Dual-Core
Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI
Peripherals: Temp Sensor
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294JAK0MJDT NXP USA Inc. Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294JAK0MJDR NXP USA Inc. Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294JCK0MJDR NXP USA Inc. Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
FS32R294HBK0MJDT NXP USA Inc. S32R29XFS.pdf Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294HBK0MJDR NXP USA Inc. Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294LBK0MJDT NXP USA Inc. Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294LBK0MJDR NXP USA Inc. Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294LAK0MJDT NXP USA Inc. Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294LAK0MJDR NXP USA Inc. Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
74VHCT541D,118 74VHCT541D,118 NXP USA Inc. PHGLS22822-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74VHCT541D - BUS DR
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
auf Bestellung 5880 Stücke:
Lieferzeit 10-14 Tag (e)
1302+0.37 EUR
Mindestbestellmenge: 1302
OM5578/PN7150ARD NXP USA Inc. Description: DEV KIT PN7150 PLUG/PLAY NFC CTL
Packaging: Bulk
Produkt ist nicht verfügbar
MC9S08AC128CFUE MC9S08AC128CFUE NXP USA Inc. MC9S08AC128.pdf Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9RS08KA8CPJ MC9RS08KA8CPJ NXP USA Inc. MC9RS08KA(4,8).pdf Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Bulk
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 518 Stücke:
Lieferzeit 10-14 Tag (e)
518+1.71 EUR
Mindestbestellmenge: 518
S912XDG128F2CAL S912XDG128F2CAL NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MFS8623BMBA0ES MFS8623BMBA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Produkt ist nicht verfügbar
MCF5280CVF66 MCF5280CVF66 NXP USA Inc. MCF5282UM.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 142
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S32G378ASAK1VUCT NXP USA Inc. Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
S32G378ASAK1VUCR NXP USA Inc. Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
MC68en360ai33l MC68en360ai33l NXP USA Inc. MC68360.pdf Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
auf Bestellung 91 Stücke:
Lieferzeit 10-14 Tag (e)
2+254.52 EUR
Mindestbestellmenge: 2
BUK9535-100A,127 BUK9535-100A,127 NXP USA Inc. PHGLS22332-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 100V 41A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 41A (Tc)
Rds On (Max) @ Id, Vgs: 34mOhm @ 25A, 10V
Power Dissipation (Max): 149W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 3573 pF @ 25 V
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
666+0.72 EUR
Mindestbestellmenge: 666
MFS2613AMDA4AD NXP USA Inc. PB_FS26.pdf Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.94 EUR
10+ 11.9 EUR
Mindestbestellmenge: 2
MFS2613AMDA3AD NXP USA Inc. PB_FS26.pdf Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
auf Bestellung 243 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.62 EUR
10+ 12.54 EUR
25+ 12.28 EUR
40+ 12.24 EUR
80+ 10.98 EUR
Mindestbestellmenge: 2
MFS2633AMDA0AD NXP USA Inc. PB_FS26.pdf Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Applications: System Basis Chip
Current - Supply: 29µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.1 EUR
10+ 12.98 EUR
25+ 12.71 EUR
40+ 12.66 EUR
80+ 11.36 EUR
250+ 11.02 EUR
Mindestbestellmenge: 2
MF3D2300DA4/00J NXP USA Inc. Description: MF3D2300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MF3D2300DA4/00J NXP USA Inc. Description: MF3D2300DA4
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MF3D8300DA4/00J NXP USA Inc. Description: MF3D8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MFRC63103HNY MFRC63103HNY NXP USA Inc. MFRC631.pdf Description: CL READER IC'S
Packaging: Tape & Reel (TR)
For Use With/Related Products: MFRC631
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
SAF7755HV/N205W/CY
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Produkt ist nicht verfügbar
TEA2017DK1007 TEA2017DK1007QSG.pdf
TEA2017DK1007
Hersteller: NXP USA Inc.
Description: TEA2017AAT/3 PROGRAM BOARD
Packaging: Bulk
For Use With/Related Products: TEA2017
Type: Programmer
Contents: Board(s)
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+113.19 EUR
10+ 107.52 EUR
TEA2016DK1008 UM11925.pdf
TEA2016DK1008
Hersteller: NXP USA Inc.
Description: TEA20XX SOCKET DB1586 BOARD
Packaging: Bulk
For Use With/Related Products: TEA2016
Type: Programmer
Contents: Board(s), Accessories
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+113.19 EUR
10+ 107.52 EUR
SPC5775BSK3MME2R
Hersteller: NXP USA Inc.
Description: NXP 32-BIT MCU, 4MB FLASH FCACS
Packaging: Tape & Reel (TR)
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Supplier Device Package: 416-MAPBGA (27x27)
Produkt ist nicht verfügbar
SPC5775BSK3MME2
Hersteller: NXP USA Inc.
Description: NXP 32-BIT MCU, 4MB FLASH FCACS
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Supplier Device Package: 416-MAPBGA (27x27)
Produkt ist nicht verfügbar
SPC5775EDK3MME3R MPC5775E_DS.pdf
SPC5775EDK3MME3R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Number of I/O: 293
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SAF775DHN/N208WMP
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHN/N208WK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHV/N208WK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
SAF775DHV/N208W/KY
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF775DHV/N208W/KK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
SAF7751HN/N208WMP
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHN/N208W/MP
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHV/N208WY
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF7754HN/N208WMP
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF7751HN/N208WK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHV/N208W/DY
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF775DHN/N208WAMP
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHV/N208W/CY
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHN/N208W/KK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHV/N208W/DK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
SAF775DHV/N208W/AY
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF775DHV/N208W/CK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF7754HN/N208WK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775DHV/N208W/AK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
SAF775DHV/N208W/BY
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
MHW8188AN MHW8188AN.pdf
MHW8188AN
Hersteller: NXP USA Inc.
Description: IC AMP CATV 7-CATV MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-CATV Module
Number of Circuits: 1
Current - Supply: 425 mA
Produkt ist nicht verfügbar
BSC9131NSE1KHKB
Hersteller: NXP USA Inc.
Description: QORIQ QONVERGE MULTICORE BASEBAN
Packaging: Bulk
Produkt ist nicht verfügbar
FS32R294KCK0MJDT
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294KAK0MJDT
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294KCK0MJDR
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294KAK0MJDR
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294JCK0MJDT
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
RAM Size: 5.5M x 8
Program Memory Type: ROMless
Core Processor: e200z4, e200z7
Core Size: 32-Bit Dual-Core
Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI
Peripherals: Temp Sensor
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294JAK0MJDT
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294JAK0MJDR
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294JCK0MJDR
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
FS32R294HBK0MJDT S32R29XFS.pdf
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294HBK0MJDR
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294LBK0MJDT
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294LBK0MJDR
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294LAK0MJDT
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294LAK0MJDR
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
74VHCT541D,118 PHGLS22822-1.pdf?t.download=true&u=5oefqw
74VHCT541D,118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74VHCT541D - BUS DR
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
auf Bestellung 5880 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1302+0.37 EUR
Mindestbestellmenge: 1302
OM5578/PN7150ARD
Hersteller: NXP USA Inc.
Description: DEV KIT PN7150 PLUG/PLAY NFC CTL
Packaging: Bulk
Produkt ist nicht verfügbar
MC9S08AC128CFUE MC9S08AC128.pdf
MC9S08AC128CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9RS08KA8CPJ MC9RS08KA(4,8).pdf
MC9RS08KA8CPJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Bulk
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 518 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
518+1.71 EUR
Mindestbestellmenge: 518
S912XDG128F2CAL
S912XDG128F2CAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MFS8623BMBA0ES
MFS8623BMBA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Produkt ist nicht verfügbar
MCF5280CVF66 MCF5282UM.pdf
MCF5280CVF66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 142
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S32G378ASAK1VUCT
Hersteller: NXP USA Inc.
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
S32G378ASAK1VUCR
Hersteller: NXP USA Inc.
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
MC68en360ai33l MC68360.pdf
MC68en360ai33l
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
auf Bestellung 91 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+254.52 EUR
Mindestbestellmenge: 2
BUK9535-100A,127 PHGLS22332-1.pdf?t.download=true&u=5oefqw
BUK9535-100A,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 41A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 41A (Tc)
Rds On (Max) @ Id, Vgs: 34mOhm @ 25A, 10V
Power Dissipation (Max): 149W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 3573 pF @ 25 V
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
666+0.72 EUR
Mindestbestellmenge: 666
MFS2613AMDA4AD PB_FS26.pdf
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.94 EUR
10+ 11.9 EUR
Mindestbestellmenge: 2
MFS2613AMDA3AD PB_FS26.pdf
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
auf Bestellung 243 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.62 EUR
10+ 12.54 EUR
25+ 12.28 EUR
40+ 12.24 EUR
80+ 10.98 EUR
Mindestbestellmenge: 2
MFS2633AMDA0AD PB_FS26.pdf
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Applications: System Basis Chip
Current - Supply: 29µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.1 EUR
10+ 12.98 EUR
25+ 12.71 EUR
40+ 12.66 EUR
80+ 11.36 EUR
250+ 11.02 EUR
Mindestbestellmenge: 2
MF3D2300DA4/00J
Hersteller: NXP USA Inc.
Description: MF3D2300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MF3D2300DA4/00J
Hersteller: NXP USA Inc.
Description: MF3D2300DA4
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MF3D8300DA4/00J
Hersteller: NXP USA Inc.
Description: MF3D8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MFRC63103HNY MFRC631.pdf
MFRC63103HNY
Hersteller: NXP USA Inc.
Description: CL READER IC'S
Packaging: Tape & Reel (TR)
For Use With/Related Products: MFRC631
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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