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74LV244N,112 74LV244N,112 NXP USA Inc. 74LV244.pdf Description: IC BUFFER NON-INVERT 5.5V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 16mA, 16mA
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
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S912ZVCA64F0MLFR S912ZVCA64F0MLFR NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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MPC859PVR133A MPC859PVR133A NXP USA Inc. MPC866EC.pdf Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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PDTA114TE,115 PDTA114TE,115 NXP USA Inc. PDTA114T_SER.pdf Description: TRANS PREBIAS PNP 50V 0.1A SC75
Resistor - Base (R1): 10 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: PNP - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PTN3380BBS,518 PTN3380BBS,518 NXP USA Inc. PTN3380B.pdf Description: IC VIDEO LEVEL SHIFTER 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: Consumer Video
Standards: DVI v1.0, HDMI v1.3a
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
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TDA18250BHN/C1K TDA18250BHN/C1K NXP USA Inc. TDA18250BHN_SDS.pdf Description: IC VIDEO TUNER 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
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100+1.78 EUR
250+1.68 EUR
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SPC5748CBK0AMMJ6 NXP USA Inc. Description: IC MCU 32BIT 6MB FLASH 256LBGA
Qualification: AEC-Q100
Number of I/O: 178
Grade: Automotive
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, FlexRay, I2S, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 64x10b, 80x12b SAR
Core Processor: e200z2, e200z4
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz, 160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
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SPC5748CK0AMKU6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLASH 176LQFP
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 48x10b, 16x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz, 160MHz
DigiKey Programmable: Not Verified
Number of I/O: 129
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
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SPC5748CBK0AVKU2 SPC5748CBK0AVKU2 NXP USA Inc. Description: IC MCU 32BIT 6MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
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MFS8603BMBA0ES MFS8603BMBA0ES NXP USA Inc. FS8600_SDS.pdf?pspll=1 Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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S9S12G64AMLH S9S12G64AMLH NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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PEMB17,115 PEMB17,115 NXP USA Inc. PEMB17_PUMB17.pdf Description: TRANS 2PNP PREBIAS 0.3W SOT666
Packaging: Bulk
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LD6815TD/36H,125 LD6815TD/36H,125 NXP USA Inc. LD6815_Series.pdf Description: IC REG LINEAR 3.6V 150MA 5-TSOP
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
PSRR: 75dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 3.6V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
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LD6816CX4/22P,315 LD6816CX4/22P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 2.2V 150MA 4-WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
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74LVC1G79GF,132 74LVC1G79GF,132 NXP USA Inc. NEXP-S-A0003511411-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
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S912ZVLA64ACLCR S912ZVLA64ACLCR NXP USA Inc. 568_MC9S12ZVLRM.pdf Description: S12Z CPU, 64K FLASH
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
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S912ZVLA64ACLC S912ZVLA64ACLC NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
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S912ZVLA64ACLFR NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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S912ZVLA64ACLF NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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S912ZVLA64AMLFR NXP USA Inc. Description: IC MCU 16BIT
Packaging: Tape & Reel (TR)
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S912ZVLA64AVFMR NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 34
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MC908QT1ACDWE MC908QT1ACDWE NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC908QY1AMDWE MC908QY1AMDWE NXP USA Inc. MC68HLC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
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MCIMX6L3DVN10AC MCIMX6L3DVN10AC NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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MWCT2D16SHT1VPB NXP USA Inc. RMMWCT2xxxS.pdf Description: MWCT2D16S, MAXQFP172
Packaging: Tray
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MWCT2D17SHT1VPBR NXP USA Inc. RMMWCT2xxxS.pdf Description: MWCT2D17S,MAXQFP172
Packaging: Tape & Reel (TR)
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MWCT2D17SHT1VPB NXP USA Inc. RMMWCT2xxxS.pdf Description: MWCT2D17S,MAXQFP172
Packaging: Tray
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MC9S12XD256CAA MC9S12XD256CAA NXP USA Inc. 9S12XDFAMPP.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC9S12XD256VAA MC9S12XD256VAA NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC9S12XD256VAG MC9S12XD256VAG NXP USA Inc. MC9S12XDP512RMV2.pdf Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
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MC12311CHNR MC12311CHNR NXP USA Inc. Description: IC RF TXRX+MCU ISM<1GHZ 60VFLGA
Packaging: Tape & Reel (TR)
Package / Case: 60-VFLGA Exposed Pad
Sensitivity: -120dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 433MHz, 470MHz, 868MHz, 915MHz, 928MHz, 955MHz
Memory Size: 32kB Flash, 2kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 17dBm
Current - Receiving: 16mA
Data Rate (Max): 300kbps
Current - Transmitting: 16mA ~ 95mA
Supplier Device Package: 60-VFLGA (8x8)
GPIO: 34
Modulation: FSK, GFSK, GMSK, MSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
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MMRF5017HSR5 MMRF5017HSR5 NXP USA Inc. MMRF5017HS.pdf Description: RF MOSFET HEMT 50V NI400
Current - Test: 200 mA
Voltage - Test: 50 V
Voltage - Rated: 150 V
Supplier Device Package: NI-400S-2S
Technology: HEMT
Gain: 18.4dB
Power - Output: 125W
Frequency: 30MHz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: NI-400S-2S
Packaging: Bulk
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MCF51AG96CLH MCF51AG96CLH NXP USA Inc. MCF51AG128.pdf Description: IC MCU 32BIT 96KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 19x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LH79524N0F100A1 NXP USA Inc. PHGLS28978-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D Description: IC MCU 32BIT ROMLESS 208LFBGA
DigiKey Programmable: Not Verified
Number of I/O: 108
Supplier Device Package: 208-LFBGA (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x10b
Core Processor: ARM720T™ RISC
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Speed: 76.205MHz
Mounting Type: Surface Mount
Package / Case: 208-LFBGA
Packaging: Tray
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PDTA144TU,115 PDTA144TU,115 NXP USA Inc. Description: TRANS PNP W/RES 50V SOT323
Packaging: Bulk
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PDTA144EMB,315 PDTA144EMB,315 NXP USA Inc. PHGLS24726-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
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MCIMX6DP7CVT8AA MCIMX6DP7CVT8AA NXP USA Inc. IMX6DQPCEC.pdf Description: IC MPU I.MX6DP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
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MFS8632BMBA0ES MFS8632BMBA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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74LV08N,112 74LV08N,112 NXP USA Inc. 74LV08.pdf Description: IC GATE AND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 9ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
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MK12DX128VLH5 MK12DX128VLH5 NXP USA Inc. K12P64M50SF4.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
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N74F194D,602 N74F194D,602 NXP USA Inc. DS_568_74F194.pdf Description: IC SHIFT REGISTER 4BIT 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Universal
Logic Type: Register, Bidirectional
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 4
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PZU3.3B2,115 PZU3.3B2,115 NXP USA Inc. PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 3.3V 310MW SOD323F
Packaging: Bulk
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HEF40373BP,652 HEF40373BP,652 NXP USA Inc. HEF40373B.pdf Description: IC D-TYPE TRANSP SGL 8:8 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Independent Circuits: 1
Delay Time - Propagation: 40ns
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
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MKL81Z128VLK7 MKL81Z128VLK7 NXP USA Inc. KNTSKL8XFS.pdf Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
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FS32K146HAT0VLHR FS32K146HAT0VLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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FS32K146HAT0VLHT FS32K146HAT0VLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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FS32K148HET0VLQT FS32K148HET0VLQT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
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TEF8102EN/N1Y NXP USA Inc. Description: RADAR
Packaging: Tape & Reel (TR)
Package / Case: 155-WFBGA
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 135°C (TJ)
Voltage - Supply: 1.045V ~ 1.21V, 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 12dBm
Data Rate (Max): 40Mbps
Supplier Device Package: 155-WFBGA (7.5x7.5)
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
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TEF8102EN/N1E NXP USA Inc. Description: RADAR
Packaging: Tray
Package / Case: 155-WFBGA
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 135°C (TJ)
Voltage - Supply: 1.045V ~ 1.21V, 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 12dBm
Data Rate (Max): 40Mbps
Supplier Device Package: 155-WFBGA (7.5x7.5)
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
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AFT20S015NR1 AFT20S015NR1 NXP USA Inc. AFT20S015N.pdf Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.5W
Gain: 17.6dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 132 mA
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AFT20S015NR1 AFT20S015NR1 NXP USA Inc. AFT20S015N.pdf Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.5W
Gain: 17.6dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 132 mA
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MWCT1001AVLH MWCT1001AVLH NXP USA Inc. MWCT1001AVLH_Web.pdf Description: IC DSP MULTI COIL 5W 5V 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
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A5M35TG140-TCT1 A5M35TG140-TCT1 NXP USA Inc. A5M35TG140-TC.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.4dB
P1dB: 49.9dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
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A5M35TG140-TCT1 A5M35TG140-TCT1 NXP USA Inc. A5M35TG140-TC.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.4dB
P1dB: 49.9dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
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A5M36TG140-TCT1 A5M36TG140-TCT1 NXP USA Inc. A5M36TG140-TC.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.9dB
P1dB: 49.3dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
Produkt ist nicht verfügbar
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A5M36TG140-TCT1 A5M36TG140-TCT1 NXP USA Inc. A5M36TG140-TC.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.9dB
P1dB: 49.3dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
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MPC8309VMAGDCA NXP USA Inc. FSCL-S-A0000128317-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC POWER ARCH SOC, 400MH
Packaging: Bulk
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NAFE11388-EVB NXP USA Inc. Description: EVAL BOARD FOR NAFE11388
Packaging: Box
Function: Analog Front End (AFE)
Type: Power Management
Contents: Board(s)
Utilized IC / Part: NAFE11388
Supplied Contents: Board(s)
Embedded: No
Produkt ist nicht verfügbar
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NAFE13388-EVB NXP USA Inc. Description: IC
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE13388
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 8-Channel (Octal)
Embedded: No
Produkt ist nicht verfügbar
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KITNAFE13388-EVB NXP USA Inc. Description: IC
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE13388
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: No
Produkt ist nicht verfügbar
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74LV244N,112 74LV244.pdf
74LV244N,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 16mA, 16mA
Supplier Device Package: 20-DIP
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S912ZVCA64F0MLFR
S912ZVCA64F0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC859PVR133A MPC866EC.pdf
MPC859PVR133A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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PDTA114TE,115 PDTA114T_SER.pdf
PDTA114TE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Resistor - Base (R1): 10 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: PNP - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Tape & Reel (TR)
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PTN3380BBS,518 PTN3380B.pdf
PTN3380BBS,518
Hersteller: NXP USA Inc.
Description: IC VIDEO LEVEL SHIFTER 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: Consumer Video
Standards: DVI v1.0, HDMI v1.3a
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
Produkt ist nicht verfügbar
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TDA18250BHN/C1K TDA18250BHN_SDS.pdf
TDA18250BHN/C1K
Hersteller: NXP USA Inc.
Description: IC VIDEO TUNER 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
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7+3.01 EUR
10+2.21 EUR
25+2.01 EUR
100+1.78 EUR
250+1.68 EUR
500+1.62 EUR
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SPC5748CBK0AMMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 256LBGA
Qualification: AEC-Q100
Number of I/O: 178
Grade: Automotive
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, FlexRay, I2S, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 64x10b, 80x12b SAR
Core Processor: e200z2, e200z4
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz, 160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5748CK0AMKU6 MPC5748G.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 48x10b, 16x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz, 160MHz
DigiKey Programmable: Not Verified
Number of I/O: 129
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5748CBK0AVKU2
SPC5748CBK0AVKU2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MFS8603BMBA0ES FS8600_SDS.pdf?pspll=1
MFS8603BMBA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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2+15.14 EUR
10+11.73 EUR
25+10.88 EUR
100+9.95 EUR
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S9S12G64AMLH
S9S12G64AMLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMB17,115 PEMB17_PUMB17.pdf
PEMB17,115
Hersteller: NXP USA Inc.
Description: TRANS 2PNP PREBIAS 0.3W SOT666
Packaging: Bulk
auf Bestellung 266999 Stücke:
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LD6815TD/36H,125 LD6815_Series.pdf
LD6815TD/36H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.6V 150MA 5-TSOP
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
PSRR: 75dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 3.6V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
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LD6816CX4/22P,315 LD6816.pdf
LD6816CX4/22P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 150MA 4-WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVC1G79GF,132 NEXP-S-A0003511411-1.pdf?t.download=true&u=5oefqw
74LVC1G79GF,132
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
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S912ZVLA64ACLCR 568_MC9S12ZVLRM.pdf
S912ZVLA64ACLCR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
Produkt ist nicht verfügbar
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S912ZVLA64ACLC
S912ZVLA64ACLC
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
Produkt ist nicht verfügbar
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S912ZVLA64ACLFR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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S912ZVLA64ACLF
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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S912ZVLA64AMLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912ZVLA64AVFMR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 34
Produkt ist nicht verfügbar
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MC908QT1ACDWE MC68HC908QY4A.pdf
MC908QT1ACDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC908QY1AMDWE MC68HLC908QY4.pdf
MC908QY1AMDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6L3DVN10AC IMX6SLCEC.pdf
MCIMX6L3DVN10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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10+55.6 EUR
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MWCT2D16SHT1VPB RMMWCT2xxxS.pdf
Hersteller: NXP USA Inc.
Description: MWCT2D16S, MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
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MWCT2D17SHT1VPBR RMMWCT2xxxS.pdf
Hersteller: NXP USA Inc.
Description: MWCT2D17S,MAXQFP172
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWCT2D17SHT1VPB RMMWCT2xxxS.pdf
Hersteller: NXP USA Inc.
Description: MWCT2D17S,MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12XD256CAA 9S12XDFAMPP.pdf
MC9S12XD256CAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12XD256VAA
MC9S12XD256VAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12XD256VAG MC9S12XDP512RMV2.pdf
MC9S12XD256VAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC12311CHNR
MC12311CHNR
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU ISM<1GHZ 60VFLGA
Packaging: Tape & Reel (TR)
Package / Case: 60-VFLGA Exposed Pad
Sensitivity: -120dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 433MHz, 470MHz, 868MHz, 915MHz, 928MHz, 955MHz
Memory Size: 32kB Flash, 2kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 17dBm
Current - Receiving: 16mA
Data Rate (Max): 300kbps
Current - Transmitting: 16mA ~ 95mA
Supplier Device Package: 60-VFLGA (8x8)
GPIO: 34
Modulation: FSK, GFSK, GMSK, MSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMRF5017HSR5 MMRF5017HS.pdf
MMRF5017HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET HEMT 50V NI400
Current - Test: 200 mA
Voltage - Test: 50 V
Voltage - Rated: 150 V
Supplier Device Package: NI-400S-2S
Technology: HEMT
Gain: 18.4dB
Power - Output: 125W
Frequency: 30MHz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: NI-400S-2S
Packaging: Bulk
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2+440.74 EUR
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MCF51AG96CLH MCF51AG128.pdf
MCF51AG96CLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 19x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LH79524N0F100A1 PHGLS28978-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208LFBGA
DigiKey Programmable: Not Verified
Number of I/O: 108
Supplier Device Package: 208-LFBGA (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x10b
Core Processor: ARM720T™ RISC
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Speed: 76.205MHz
Mounting Type: Surface Mount
Package / Case: 208-LFBGA
Packaging: Tray
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PDTA144TU,115
PDTA144TU,115
Hersteller: NXP USA Inc.
Description: TRANS PNP W/RES 50V SOT323
Packaging: Bulk
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PDTA144EMB,315 PHGLS24726-1.pdf?t.download=true&u=5oefqw
PDTA144EMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
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MCIMX6DP7CVT8AA IMX6DQPCEC.pdf
MCIMX6DP7CVT8AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MFS8632BMBA0ES
MFS8632BMBA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74LV08N,112 74LV08.pdf
74LV08N,112
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 9ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
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MK12DX128VLH5 K12P64M50SF4.pdf
MK12DX128VLH5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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N74F194D,602 DS_568_74F194.pdf
N74F194D,602
Hersteller: NXP USA Inc.
Description: IC SHIFT REGISTER 4BIT 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Universal
Logic Type: Register, Bidirectional
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 4
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975+0.62 EUR
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PZU3.3B2,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU3.3B2,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 310MW SOD323F
Packaging: Bulk
auf Bestellung 16382 Stücke:
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HEF40373BP,652 HEF40373B.pdf
HEF40373BP,652
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Independent Circuits: 1
Delay Time - Propagation: 40ns
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
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MKL81Z128VLK7 KNTSKL8XFS.pdf
MKL81Z128VLK7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K146HAT0VLHR S32K1xx.pdf
FS32K146HAT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K146HAT0VLHT S32K1xx.pdf
FS32K146HAT0VLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HET0VLQT S32K1xx.pdf
FS32K148HET0VLQT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEF8102EN/N1Y
Hersteller: NXP USA Inc.
Description: RADAR
Packaging: Tape & Reel (TR)
Package / Case: 155-WFBGA
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 135°C (TJ)
Voltage - Supply: 1.045V ~ 1.21V, 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 12dBm
Data Rate (Max): 40Mbps
Supplier Device Package: 155-WFBGA (7.5x7.5)
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEF8102EN/N1E
Hersteller: NXP USA Inc.
Description: RADAR
Packaging: Tray
Package / Case: 155-WFBGA
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 135°C (TJ)
Voltage - Supply: 1.045V ~ 1.21V, 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 12dBm
Data Rate (Max): 40Mbps
Supplier Device Package: 155-WFBGA (7.5x7.5)
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFT20S015NR1 AFT20S015N.pdf
AFT20S015NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.5W
Gain: 17.6dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 132 mA
Produkt ist nicht verfügbar
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AFT20S015NR1 AFT20S015N.pdf
AFT20S015NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.5W
Gain: 17.6dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 132 mA
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1+55.12 EUR
10+44.55 EUR
25+41.91 EUR
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MWCT1001AVLH MWCT1001AVLH_Web.pdf
MWCT1001AVLH
Hersteller: NXP USA Inc.
Description: IC DSP MULTI COIL 5W 5V 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
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A5M35TG140-TCT1 A5M35TG140-TC.pdf
A5M35TG140-TCT1
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.4dB
P1dB: 49.9dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
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1000+94.08 EUR
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A5M35TG140-TCT1 A5M35TG140-TC.pdf
A5M35TG140-TCT1
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.4dB
P1dB: 49.9dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
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A5M36TG140-TCT1 A5M36TG140-TC.pdf
A5M36TG140-TCT1
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.9dB
P1dB: 49.3dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
Produkt ist nicht verfügbar
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A5M36TG140-TCT1 A5M36TG140-TC.pdf
A5M36TG140-TCT1
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.9dB
P1dB: 49.3dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
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1+227.05 EUR
10+199.96 EUR
25+190.59 EUR
100+180.13 EUR
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MPC8309VMAGDCA FSCL-S-A0000128317-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: POWERQUICC POWER ARCH SOC, 400MH
Packaging: Bulk
auf Bestellung 3371 Stücke:
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9+68.42 EUR
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NAFE11388-EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR NAFE11388
Packaging: Box
Function: Analog Front End (AFE)
Type: Power Management
Contents: Board(s)
Utilized IC / Part: NAFE11388
Supplied Contents: Board(s)
Embedded: No
Produkt ist nicht verfügbar
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NAFE13388-EVB
Hersteller: NXP USA Inc.
Description: IC
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE13388
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 8-Channel (Octal)
Embedded: No
Produkt ist nicht verfügbar
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KITNAFE13388-EVB
Hersteller: NXP USA Inc.
Description: IC
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE13388
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: No
Produkt ist nicht verfügbar
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