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MC908GT16CBE MC908GT16CBE NXP USA Inc. MC68HC908GT16.pdf Description: IC MCU 8BIT 16KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908GT8CBE MC908GT8CBE NXP USA Inc. MC68HC908GT16.pdf Description: IC MCU 8BIT 8KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HET0MLQR FS32K148HET0MLQR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX8DXL-WEVK NXP USA Inc. Description: MCIMX8DXL-WEVK
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-A35, Cortex®-M4F
Utilized IC / Part: i.MX 8XLite
Produkt ist nicht verfügbar
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S9S08AW32E5MFUE S9S08AW32E5MFUE NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FXLS93433AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: PSI5 XZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS93333AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: PSI5 XY DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS90433AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: XZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS90733AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: YZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS90333AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: XY DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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MC07XS6517DEKR2 MC07XS6517DEKR2 NXP USA Inc. MC07XS6517.pdf Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Features: Internal PWM
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
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MC07XS6517DEK MC07XS6517DEK NXP USA Inc. MC07XS6517.pdf Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Features: Internal PWM
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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AFT26HW050SR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S4
Mounting Type: Chassis Mount
Frequency: 2.69GHz
Configuration: Dual
Power - Output: 9W
Gain: 14.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4S4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MCIMX6S4AVM08ADR MCIMX6S4AVM08ADR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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OL2385AHN/001A2Y OL2385AHN/001A2Y NXP USA Inc. OL2385.pdf Description: IC RF TXRX+MCU 802.15.4 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -123dBm
Mounting Type: Surface Mount
Frequency: 158MHz ~ 960MHz
Memory Size: 7kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Protocol: Sigfox, Wireless M-Bus, Zigbee®
Current - Receiving: 600nA ~ 11mA
Data Rate (Max): 400kbps
Current - Transmitting: 500µA ~ 33mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: 2-FSK, 4-FSK, ASK, FSK, GFSK, OOK
RF Family/Standard: 802.15.4
Serial Interfaces: GPIO, SPI, UART, USART
Produkt ist nicht verfügbar
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PCA9634PW,112 PCA9634PW,112 NXP USA Inc. PCA9634.pdf Description: IC LED DRVR PS I2C 25MA 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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SSL5251T/1118 NXP USA Inc. PHGL-S-A0001022918-1.pdf?t.download=true&u=5oefqw Description: MAINS DIMMABLE BUCK
Packaging: Bulk
auf Bestellung 6754 Stücke:
Lieferzeit 10-14 Tag (e)
683+0.71 EUR
Mindestbestellmenge: 683
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SSL5237TE/1518 SSL5237TE/1518 NXP USA Inc. Description: 10 OHM/700 VOLT MAINS DIMMABLE B
Packaging: Bulk
auf Bestellung 2429 Stücke:
Lieferzeit 10-14 Tag (e)
579+0.83 EUR
Mindestbestellmenge: 579
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MC33PT2001HAER2 MC33PT2001HAER2 NXP USA Inc. MC33PT2001_SDS.pdf Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001HMAER2 MC33PT2001HMAER2 NXP USA Inc. MC33PT2001_SDS.pdf Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001AER2 MC33PT2001AER2 NXP USA Inc. MC33PT2001_SDS.pdf Description: SOLENOID CONTROLLER 6 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001HAE MC33PT2001HAE NXP USA Inc. MC33PT2001_SDS.pdf Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001HMAE MC33PT2001HMAE NXP USA Inc. MC33PT2001_SDS.pdf Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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IP4365CX11/P135 IP4365CX11/P135 NXP USA Inc. IP4365CX11.pdf Description: DATA LINE FILTER
Packaging: Bulk
auf Bestellung 122437 Stücke:
Lieferzeit 10-14 Tag (e)
2219+0.22 EUR
Mindestbestellmenge: 2219
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MF4SAM3HN/9BA6AUZ NXP USA Inc. Description: MF4SAM3HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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MF4SAM3HN/9BA6AUZ NXP USA Inc. Description: MF4SAM3HN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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TEA19363T/1J TEA19363T/1J NXP USA Inc. TEA19363T.pdf Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Produkt ist nicht verfügbar
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TEA19363T/1J TEA19363T/1J NXP USA Inc. TEA19363T.pdf Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Produkt ist nicht verfügbar
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TDA8034HN/C2J NXP USA Inc. TDA8034HN.pdf Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8034HN/C2EL NXP USA Inc. TDA8034HN.pdf Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8034HN/C2QL NXP USA Inc. TDA8034HN.pdf Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8026ET/C3K NXP USA Inc. TDA8026.pdf Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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TDA8026ET/C3Y NXP USA Inc. TDA8026.pdf Description: IC INTFACE SPECIALIZED 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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TDA8026ET/C3E NXP USA Inc. TDA8026.pdf Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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LPC3131FET180,551 LPC3131FET180,551 NXP USA Inc. LPC3130_31.pdf Description: IC MCU 16/32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
DigiKey Programmable: Not Verified
auf Bestellung 189 Stücke:
Lieferzeit 10-14 Tag (e)
189+17.77 EUR
Mindestbestellmenge: 189
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74ALVC32PW,112 74ALVC32PW,112 NXP USA Inc. 74ALVC32.pdf Description: IC GATE OR 4CH 2-INP 14-TSSOP
Packaging: Tube
auf Bestellung 4800 Stücke:
Lieferzeit 10-14 Tag (e)
2664+0.18 EUR
Mindestbestellmenge: 2664
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PCA9421BSZ PCA9421BSZ NXP USA Inc. PCA9421.pdf Description: IC PMIC HVQFN24
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
Produkt ist nicht verfügbar
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PCA9421BSZ PCA9421BSZ NXP USA Inc. PCA9421.pdf Description: IC PMIC HVQFN24
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
auf Bestellung 1390 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.38 EUR
10+3.27 EUR
25+3 EUR
100+2.69 EUR
250+2.55 EUR
500+2.46 EUR
Mindestbestellmenge: 5
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SAF7772EL/200Z13AY NXP USA Inc. Description: SAF7772EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7771EL/200Z13AY NXP USA Inc. Description: SAF7771EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7772EL/200Z13AK NXP USA Inc. Description: SAF7772EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7771EL/200Z13AK NXP USA Inc. Description: SAF7771EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13AY NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/101Z13AY NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13AK NXP USA Inc. Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/101Z13AK NXP USA Inc. Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/203Z13AY NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7770EL/203Z13AK NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4000EL/101Z13AY NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/101Z13AK NXP USA Inc. Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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MC34VR500V4ESR2 MC34VR500V4ESR2 NXP USA Inc. MC34VR500.pdf Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC34VR500V7ESR2 MC34VR500V7ESR2 NXP USA Inc. MC34VR500.pdf Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MCZ33905CD3EK MCZ33905CD3EK NXP USA Inc. FSCLS11649-1.pdf?t.download=true&u=5oefqw Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3
Packaging: Bulk
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NTP53321G0JTTZ NTP53321G0JTTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
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NTP53321G0JTTZ NTP53321G0JTTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
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NTP53121G0JTTZ NTP53121G0JTTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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NTP53121G0JTTZ NTP53121G0JTTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
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NTP53321G0JTZ NTP53321G0JTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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NTP53321G0JTZ NTP53321G0JTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
auf Bestellung 3300 Stücke:
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8+2.46 EUR
10+2.12 EUR
25+2 EUR
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250+1.73 EUR
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NTP53121G0JTZ NTP53121G0JTZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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MC908GT16CBE MC68HC908GT16.pdf
MC908GT16CBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908GT8CBE MC68HC908GT16.pdf
MC908GT8CBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HET0MLQR S32K1xx.pdf
FS32K148HET0MLQR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX8DXL-WEVK
Hersteller: NXP USA Inc.
Description: MCIMX8DXL-WEVK
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-A35, Cortex®-M4F
Utilized IC / Part: i.MX 8XLite
Produkt ist nicht verfügbar
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S9S08AW32E5MFUE MC9S08AW60.pdf
S9S08AW32E5MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FXLS93433AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: PSI5 XZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS93333AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: PSI5 XY DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS90433AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: XZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS90733AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: YZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS90333AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: XY DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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MC07XS6517DEKR2 MC07XS6517.pdf
MC07XS6517DEKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Features: Internal PWM
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
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MC07XS6517DEK MC07XS6517.pdf
MC07XS6517DEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Features: Internal PWM
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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AFT26HW050SR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S4
Mounting Type: Chassis Mount
Frequency: 2.69GHz
Configuration: Dual
Power - Output: 9W
Gain: 14.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4S4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MCIMX6S4AVM08ADR IMX6SDLAEC.pdf
MCIMX6S4AVM08ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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OL2385AHN/001A2Y OL2385.pdf
OL2385AHN/001A2Y
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -123dBm
Mounting Type: Surface Mount
Frequency: 158MHz ~ 960MHz
Memory Size: 7kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Protocol: Sigfox, Wireless M-Bus, Zigbee®
Current - Receiving: 600nA ~ 11mA
Data Rate (Max): 400kbps
Current - Transmitting: 500µA ~ 33mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: 2-FSK, 4-FSK, ASK, FSK, GFSK, OOK
RF Family/Standard: 802.15.4
Serial Interfaces: GPIO, SPI, UART, USART
Produkt ist nicht verfügbar
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PCA9634PW,112 PCA9634.pdf
PCA9634PW,112
Hersteller: NXP USA Inc.
Description: IC LED DRVR PS I2C 25MA 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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SSL5251T/1118 PHGL-S-A0001022918-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: MAINS DIMMABLE BUCK
Packaging: Bulk
auf Bestellung 6754 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
683+0.71 EUR
Mindestbestellmenge: 683
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SSL5237TE/1518
SSL5237TE/1518
Hersteller: NXP USA Inc.
Description: 10 OHM/700 VOLT MAINS DIMMABLE B
Packaging: Bulk
auf Bestellung 2429 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
579+0.83 EUR
Mindestbestellmenge: 579
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MC33PT2001HAER2 MC33PT2001_SDS.pdf
MC33PT2001HAER2
Hersteller: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001HMAER2 MC33PT2001_SDS.pdf
MC33PT2001HMAER2
Hersteller: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001AER2 MC33PT2001_SDS.pdf
MC33PT2001AER2
Hersteller: NXP USA Inc.
Description: SOLENOID CONTROLLER 6 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001HAE MC33PT2001_SDS.pdf
MC33PT2001HAE
Hersteller: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001HMAE MC33PT2001_SDS.pdf
MC33PT2001HMAE
Hersteller: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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IP4365CX11/P135 IP4365CX11.pdf
IP4365CX11/P135
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
auf Bestellung 122437 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2219+0.22 EUR
Mindestbestellmenge: 2219
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MF4SAM3HN/9BA6AUZ
Hersteller: NXP USA Inc.
Description: MF4SAM3HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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MF4SAM3HN/9BA6AUZ
Hersteller: NXP USA Inc.
Description: MF4SAM3HN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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TEA19363T/1J TEA19363T.pdf
TEA19363T/1J
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Produkt ist nicht verfügbar
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TEA19363T/1J TEA19363T.pdf
TEA19363T/1J
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Produkt ist nicht verfügbar
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TDA8034HN/C2J TDA8034HN.pdf
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8034HN/C2EL TDA8034HN.pdf
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8034HN/C2QL TDA8034HN.pdf
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8026ET/C3K TDA8026.pdf
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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TDA8026ET/C3Y TDA8026.pdf
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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TDA8026ET/C3E TDA8026.pdf
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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LPC3131FET180,551 LPC3130_31.pdf
LPC3131FET180,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
DigiKey Programmable: Not Verified
auf Bestellung 189 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
189+17.77 EUR
Mindestbestellmenge: 189
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74ALVC32PW,112 74ALVC32.pdf
74ALVC32PW,112
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14-TSSOP
Packaging: Tube
auf Bestellung 4800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2664+0.18 EUR
Mindestbestellmenge: 2664
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PCA9421BSZ PCA9421.pdf
PCA9421BSZ
Hersteller: NXP USA Inc.
Description: IC PMIC HVQFN24
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
Produkt ist nicht verfügbar
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PCA9421BSZ PCA9421.pdf
PCA9421BSZ
Hersteller: NXP USA Inc.
Description: IC PMIC HVQFN24
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
auf Bestellung 1390 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.38 EUR
10+3.27 EUR
25+3 EUR
100+2.69 EUR
250+2.55 EUR
500+2.46 EUR
Mindestbestellmenge: 5
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SAF7772EL/200Z13AY
Hersteller: NXP USA Inc.
Description: SAF7772EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7771EL/200Z13AY
Hersteller: NXP USA Inc.
Description: SAF7771EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7772EL/200Z13AK
Hersteller: NXP USA Inc.
Description: SAF7772EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7771EL/200Z13AK
Hersteller: NXP USA Inc.
Description: SAF7771EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13AY
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/101Z13AY
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13AK
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/101Z13AK
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/203Z13AY
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7770EL/203Z13AK
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4000EL/101Z13AY
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/101Z13AK
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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MC34VR500V4ESR2 MC34VR500.pdf
MC34VR500V4ESR2
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC34VR500V7ESR2 MC34VR500.pdf
MC34VR500V7ESR2
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MCZ33905CD3EK FSCLS11649-1.pdf?t.download=true&u=5oefqw
MCZ33905CD3EK
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3
Packaging: Bulk
auf Bestellung 676 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
53+9.28 EUR
Mindestbestellmenge: 53
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NTP53321G0JTTZ NTP53x2.pdf
NTP53321G0JTTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.51 EUR
5000+1.45 EUR
Mindestbestellmenge: 2500
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NTP53321G0JTTZ NTP53x2.pdf
NTP53321G0JTTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
auf Bestellung 7376 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.45 EUR
10+2.1 EUR
25+1.99 EUR
100+1.82 EUR
250+1.72 EUR
500+1.65 EUR
1000+1.59 EUR
Mindestbestellmenge: 8
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NTP53121G0JTTZ NTP53x2.pdf
NTP53121G0JTTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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NTP53121G0JTTZ NTP53x2.pdf
NTP53121G0JTTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Writable Memory: 16kb (User)
auf Bestellung 3390 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.25 EUR
10+1.94 EUR
25+1.83 EUR
100+1.68 EUR
250+1.59 EUR
500+1.53 EUR
1000+1.47 EUR
Mindestbestellmenge: 8
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NTP53321G0JTZ NTP53x2.pdf
NTP53321G0JTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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NTP53321G0JTZ NTP53x2.pdf
NTP53321G0JTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
auf Bestellung 3300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.46 EUR
10+2.12 EUR
25+2 EUR
100+1.83 EUR
250+1.73 EUR
500+1.67 EUR
1000+1.6 EUR
Mindestbestellmenge: 8
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NTP53121G0JTZ NTP53x2.pdf
NTP53121G0JTZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Size / Dimension: 0.154" L x 0.193" W (3.90mm x 4.90mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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