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PMXB65UPE147 PMXB65UPE147 NXP USA Inc. PMXB65UPE.pdf Description: P-CHANNEL MOSFET
Input Capacitance (Ciss) (Max) @ Vds: 634 pF @ 6 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Drain to Source Voltage (Vdss): 12 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Supplier Device Package: DFN1010D-3
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Rds On (Max) @ Id, Vgs: 72mOhm @ 3.2A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
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MC9S12B256MFUE MC9S12B256MFUE NXP USA Inc. MC9S12B.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MWCT1016SFVMHN MWCT1016SFVMHN NXP USA Inc. Description: WCT1016 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
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MC8641DTHX1333JE MC8641DTHX1333JE NXP USA Inc. MCP8641%28D%29.pdf Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 2 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 1023-FCCBGA (33x33)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e600
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 1023-BBGA, FCBGA
Packaging: Tray
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FD32K116LFT0MFMT NXP USA Inc. PdfFile_890942.pdf Description: IC MCU
Packaging: Tray
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S9S12G64F1MLC S9S12G64F1MLC NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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500+7.57 EUR
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BFU530XRVL BFU530XRVL NXP USA Inc. BFU530XR.pdf Description: RF TRANS NPN 12V 11GHZ SOT143R
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Frequency - Transition: 11GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 40mA
Power - Max: 450mW
Gain: 16.5dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
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BFU530XRVL BFU530XRVL NXP USA Inc. BFU530XR.pdf Description: RF TRANS NPN 12V 11GHZ SOT143R
Packaging: Cut Tape (CT)
Current - Collector (Ic) (Max): 40mA
Power - Max: 450mW
Gain: 16.5dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Frequency - Transition: 11GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
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MC33CD1020AESR2 MC33CD1020AESR2 NXP USA Inc. CD1020.pdf Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
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MC33CD1020AES MC33CD1020AES NXP USA Inc. CD1020.pdf Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
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TJA1124BHG/1Z TJA1124BHG/1Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1124BHG/1Z TJA1124BHG/1Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1124CHG/1Z TJA1124CHG/1Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Duplex: Half
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
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TJA1124CHG/1Z TJA1124CHG/1Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Qualification: AEC-Q100
Grade: Automotive
Duplex: Half
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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SJA1124BHG/1Z SJA1124BHG/1Z NXP USA Inc. SJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Duplex: Full
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
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SJA1124BHG/1Z SJA1124BHG/1Z NXP USA Inc. SJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Protocol: LIN
Qualification: AEC-Q100
Grade: Automotive
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Duplex: Full
Supplier Device Package: 24-DHVQFN (5.5x3.5)
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SJA1124AHG/1Z SJA1124AHG/1Z NXP USA Inc. SJA1110AUTESFS.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Qualification: AEC-Q100
Grade: Automotive
Duplex: Full
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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SJA1124AHG/1Z SJA1124AHG/1Z NXP USA Inc. SJA1110AUTESFS.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
Duplex: Full
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
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IW416UK/A1CZ IW416UK/A1CZ NXP USA Inc. IW416.pdf Description: IC RF TXRX 802.15.4 76WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 76-UFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth
Current - Receiving: 5µA ~ 72mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 76-WLCSP (3.95x3.565)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, 64-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
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MPC8347CZUAJDB MPC8347CZUAJDB NXP USA Inc. MPC8347EEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
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P1015NSE5DFB P1015NSE5DFB NXP USA Inc. QP1024FS.pdf Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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SAF7751HV/N208W/UK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC855TZQ66D4 MPC855TZQ66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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S9S08AW16AE0VLD S9S08AW16AE0VLD NXP USA Inc. PHGL-S-A0002794566-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
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PTN36043BBXY PTN36043BBXY NXP USA Inc. PTN36043B.pdf Description: PTN36043BBXY
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Delay Time: 500ps (Max)
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
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LFTHNLT NXP USA Inc. Description: 144 PIN 0.5MM SURFACE MOUNT SOCK
Packaging: Bulk
Module/Board Type: Socket Module
Produkt ist nicht verfügbar
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LFDAA13C NXP USA Inc. Description: 32 PIN 0.5MM PITCH QFN ZIF SOCKE
Packaging: Bulk
Module/Board Type: Socket Module - QFN
Produkt ist nicht verfügbar
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S9KEAZ64ACLHR S9KEAZ64ACLHR NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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MC33PF8100EPESR2 MC33PF8100EPESR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
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MC33FS6600M1ESR2 MC33FS6600M1ESR2 NXP USA Inc. Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
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FS32K146UIT0VLLR FS32K146UIT0VLLR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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FX32K142HAT0MLHT NXP USA Inc. S32K1xx.pdf Description: S32K142 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tray
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MCIMX27MJP4AR2 MCIMX27MJP4AR2 NXP USA Inc. MCIMX27EC.pdf Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
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MCIMX27MJP4A MCIMX27MJP4A NXP USA Inc. MCIMX27EC.pdf Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
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MMA6827BKCWR2 MMA6827BKCWR2 NXP USA Inc. MMA68xx.pdf Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4.096
Grade: Automotive
Qualification: AEC-Q100
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MCF52233CAL60 MCF52233CAL60 NXP USA Inc. MCF52235.pdf Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 73
DigiKey Programmable: Not Verified
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MPC8315CVRADDA MPC8315CVRADDA NXP USA Inc. MPC8315EEC.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
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NX3P2902BUK012 NX3P2902BUK012 NXP USA Inc. PHGL-S-A0004564278-1.pdf?t.download=true&u=5oefqw Description: LOGIC CONTROLLED HIGH-SIDE POWER
Packaging: Bulk
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LS1046AXE8T1A LS1046AXE8T1A NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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MFS2302BMMA0EPR2 NXP USA Inc. 568_FS23.pdf Description: MFS2302BMMA0EPR2
Packaging: Tape & Reel (TR)
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MFS2302BMBA0EPR2 NXP USA Inc. 568_FS23.pdf Description: MFS2302BMBA0EPR2
Packaging: Tape & Reel (TR)
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MFS2302BMMA0EP NXP USA Inc. 568_FS23.pdf Description: MFS2302BMMA0EP
Packaging: Tray
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MFS2302BMBA0EP NXP USA Inc. 568_FS23.pdf Description: MFS2302BMBA0EP
Packaging: Tray
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MKS20FN128VLL12 MKS20FN128VLL12 NXP USA Inc. KS22P100M120SF0.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
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MKS20FN256VLL12 MKS20FN256VLL12 NXP USA Inc. KS22P100M120SF0.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
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MCHC908QY2MDWE MCHC908QY2MDWE NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
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LPC3141FET180/CP32 NXP USA Inc. Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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TDA8035HN/C2/S1J TDA8035HN/C2/S1J NXP USA Inc. TDA8035.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
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TDA8035HN/C2/S1J TDA8035HN/C2/S1J NXP USA Inc. TDA8035.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
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TDA8035HN/C1/S1J TDA8035HN/C1/S1J NXP USA Inc. TDA8035.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
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TDA8035HN/C1/S1J TDA8035HN/C1/S1J NXP USA Inc. TDA8035.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
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1000+1.31 EUR
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HEC4027BT-Q100J NXP USA Inc. Description: IC FF JK TYPE DUAL 16SOIC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MM912J637AM2EPR2 MM912J637AM2EPR2 NXP USA Inc. MM912_637D1.pdf Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MM912J637AM2EP MM912J637AM2EP NXP USA Inc. MM912_637D1.pdf Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
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PCT2075GVX PCT2075GVX NXP USA Inc. PCT2075.pdf Description: SENSOR DIGITAL -55C-125C 6TSOP
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
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PCT2075GVX PCT2075GVX NXP USA Inc. PCT2075.pdf Description: SENSOR DIGITAL -55C-125C 6TSOP
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Produkt ist nicht verfügbar
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MC9S08JS16LCWJ MC9S08JS16LCWJ NXP USA Inc. MC9S08JS16.pdf Description: IC MCU 8BIT 16KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
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MPC8245LZU266D MPC8245LZU266D NXP USA Inc. MPC8245.pdf Description: IC MPU MPC82XX 266MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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LPC1111FDH20/002,5 LPC1111FDH20/002,5 NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
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LPC1111FDH20/002,5 LPC1111FDH20/002,5 NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
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4+5.76 EUR
10+4.32 EUR
25+3.95 EUR
100+3.56 EUR
250+3.37 EUR
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PMXB65UPE147 PMXB65UPE.pdf
PMXB65UPE147
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Input Capacitance (Ciss) (Max) @ Vds: 634 pF @ 6 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Drain to Source Voltage (Vdss): 12 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Supplier Device Package: DFN1010D-3
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Rds On (Max) @ Id, Vgs: 72mOhm @ 3.2A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
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5495+0.096 EUR
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MC9S12B256MFUE MC9S12B.pdf
MC9S12B256MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MWCT1016SFVMHN
MWCT1016SFVMHN
Hersteller: NXP USA Inc.
Description: WCT1016 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
Produkt ist nicht verfügbar
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MC8641DTHX1333JE MCP8641%28D%29.pdf
MC8641DTHX1333JE
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 2 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 1023-FCCBGA (33x33)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e600
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 1023-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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FD32K116LFT0MFMT PdfFile_890942.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12G64F1MLC MC9S12GRMV1.pdf
S9S12G64F1MLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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2+12.61 EUR
10+9.71 EUR
25+8.98 EUR
100+8.18 EUR
250+7.79 EUR
500+7.57 EUR
1250+7.33 EUR
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BFU530XRVL BFU530XR.pdf
BFU530XRVL
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SOT143R
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Frequency - Transition: 11GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 40mA
Power - Max: 450mW
Gain: 16.5dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BFU530XRVL BFU530XR.pdf
BFU530XRVL
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SOT143R
Packaging: Cut Tape (CT)
Current - Collector (Ic) (Max): 40mA
Power - Max: 450mW
Gain: 16.5dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Frequency - Transition: 11GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
auf Bestellung 6815 Stücke:
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30+0.71 EUR
45+0.48 EUR
51+0.42 EUR
100+0.36 EUR
250+0.32 EUR
500+0.3 EUR
1000+0.29 EUR
2500+0.27 EUR
5000+0.26 EUR
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MC33CD1020AESR2 CD1020.pdf
MC33CD1020AESR2
Hersteller: NXP USA Inc.
Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Produkt ist nicht verfügbar
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MC33CD1020AES CD1020.pdf
MC33CD1020AES
Hersteller: NXP USA Inc.
Description: 22-CH MULTIPLE SWITCH DETECT INT
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V, 6V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1124BHG/1Z TJA1124.pdf
TJA1124BHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1124BHG/1Z TJA1124.pdf
TJA1124BHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2850 Stücke:
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4+5.81 EUR
10+4.34 EUR
25+3.97 EUR
100+3.58 EUR
250+3.39 EUR
500+3.33 EUR
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TJA1124CHG/1Z TJA1124.pdf
TJA1124CHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Duplex: Half
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1124CHG/1Z TJA1124.pdf
TJA1124CHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Qualification: AEC-Q100
Grade: Automotive
Duplex: Half
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 247 Stücke:
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4+5.95 EUR
10+4.46 EUR
25+4.08 EUR
100+3.68 EUR
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SJA1124BHG/1Z SJA1124.pdf
SJA1124BHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Duplex: Full
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
auf Bestellung 3000 Stücke:
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3000+4.41 EUR
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SJA1124BHG/1Z SJA1124.pdf
SJA1124BHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Protocol: LIN
Qualification: AEC-Q100
Grade: Automotive
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Duplex: Full
Supplier Device Package: 24-DHVQFN (5.5x3.5)
auf Bestellung 3088 Stücke:
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3+7.96 EUR
10+6.03 EUR
25+5.56 EUR
100+5.02 EUR
250+4.77 EUR
500+4.76 EUR
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SJA1124AHG/1Z SJA1110AUTESFS.pdf
SJA1124AHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Qualification: AEC-Q100
Grade: Automotive
Duplex: Full
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SJA1124AHG/1Z SJA1110AUTESFS.pdf
SJA1124AHG/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
Duplex: Full
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Protocol: LIN
Data Rate: 20kBaud
Number of Drivers/Receivers: 4/4
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
auf Bestellung 2635 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+6.47 EUR
10+4.8 EUR
25+4.64 EUR
100+4.5 EUR
250+4.33 EUR
500+4.22 EUR
1000+4.18 EUR
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IW416UK/A1CZ IW416.pdf
IW416UK/A1CZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 76WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 76-UFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth
Current - Receiving: 5µA ~ 72mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 76-WLCSP (3.95x3.565)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, 64-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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MPC8347CZUAJDB MPC8347EEC.pdf
MPC8347CZUAJDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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P1015NSE5DFB QP1024FS.pdf
P1015NSE5DFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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SAF7751HV/N208W/UK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC855TZQ66D4 MPC860EC.pdf
MPC855TZQ66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
auf Bestellung 500 Stücke:
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100+275.82 EUR
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S9S08AW16AE0VLD PHGL-S-A0002794566-1.pdf?t.download=true&u=5oefqw
S9S08AW16AE0VLD
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
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AnzahlPrivatkunde
74+7.18 EUR
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PTN36043BBXY PTN36043B.pdf
PTN36043BBXY
Hersteller: NXP USA Inc.
Description: PTN36043BBXY
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Delay Time: 500ps (Max)
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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LFTHNLT
Hersteller: NXP USA Inc.
Description: 144 PIN 0.5MM SURFACE MOUNT SOCK
Packaging: Bulk
Module/Board Type: Socket Module
Produkt ist nicht verfügbar
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LFDAA13C
Hersteller: NXP USA Inc.
Description: 32 PIN 0.5MM PITCH QFN ZIF SOCKE
Packaging: Bulk
Module/Board Type: Socket Module - QFN
Produkt ist nicht verfügbar
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S9KEAZ64ACLHR S9KEA128P80M48SF0.pdf
S9KEAZ64ACLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
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1500+3.51 EUR
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MC33PF8100EPESR2 PF8100_PF8200.pdf
MC33PF8100EPESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MC33FS6600M1ESR2
MC33FS6600M1ESR2
Hersteller: NXP USA Inc.
Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
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FS32K146UIT0VLLR S32K1xx.pdf
FS32K146UIT0VLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FX32K142HAT0MLHT S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K142 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX27MJP4AR2 MCIMX27EC.pdf
MCIMX27MJP4AR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX27MJP4A MCIMX27EC.pdf
MCIMX27MJP4A
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 473LFBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Produkt ist nicht verfügbar
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MMA6827BKCWR2 MMA68xx.pdf
MMA6827BKCWR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4.096
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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MCF52233CAL60 MCF52235.pdf
MCF52233CAL60
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 73
DigiKey Programmable: Not Verified
auf Bestellung 380 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+61.57 EUR
10+49.92 EUR
25+47 EUR
100+43.8 EUR
300+42.02 EUR
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MPC8315CVRADDA MPC8315EEC.pdf
MPC8315CVRADDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
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NX3P2902BUK012 PHGL-S-A0004564278-1.pdf?t.download=true&u=5oefqw
NX3P2902BUK012
Hersteller: NXP USA Inc.
Description: LOGIC CONTROLLED HIGH-SIDE POWER
Packaging: Bulk
auf Bestellung 4000 Stücke:
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702+0.82 EUR
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LS1046AXE8T1A LS1046A.pdf
LS1046AXE8T1A
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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10+349.46 EUR
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MFS2302BMMA0EPR2 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2302BMMA0EPR2
Packaging: Tape & Reel (TR)
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MFS2302BMBA0EPR2 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2302BMBA0EPR2
Packaging: Tape & Reel (TR)
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MFS2302BMMA0EP 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2302BMMA0EP
Packaging: Tray
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MFS2302BMBA0EP 568_FS23.pdf
Hersteller: NXP USA Inc.
Description: MFS2302BMBA0EP
Packaging: Tray
Produkt ist nicht verfügbar
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MKS20FN128VLL12 KS22P100M120SF0.pdf
MKS20FN128VLL12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKS20FN256VLL12 KS22P100M120SF0.pdf
MKS20FN256VLL12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCHC908QY2MDWE MC68HC908QY4.pdf
MCHC908QY2MDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC3141FET180/CP32
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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TDA8035HN/C2/S1J TDA8035.pdf
TDA8035HN/C2/S1J
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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TDA8035HN/C2/S1J TDA8035.pdf
TDA8035HN/C2/S1J
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 5565 Stücke:
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AnzahlPrivatkunde
9+2.45 EUR
12+1.8 EUR
25+1.62 EUR
100+1.44 EUR
250+1.34 EUR
500+1.3 EUR
1000+1.27 EUR
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TDA8035HN/C1/S1J TDA8035.pdf
TDA8035HN/C1/S1J
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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TDA8035HN/C1/S1J TDA8035.pdf
TDA8035HN/C1/S1J
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 5680 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
9+2.51 EUR
12+1.83 EUR
25+1.67 EUR
100+1.48 EUR
250+1.38 EUR
500+1.32 EUR
1000+1.31 EUR
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HEC4027BT-Q100J
Hersteller: NXP USA Inc.
Description: IC FF JK TYPE DUAL 16SOIC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MM912J637AM2EPR2 MM912_637D1.pdf
MM912J637AM2EPR2
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MM912J637AM2EP MM912_637D1.pdf
MM912J637AM2EP
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCT2075GVX PCT2075.pdf
PCT2075GVX
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 6TSOP
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Produkt ist nicht verfügbar
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PCT2075GVX PCT2075.pdf
PCT2075GVX
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 6TSOP
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Produkt ist nicht verfügbar
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MC9S08JS16LCWJ MC9S08JS16.pdf
MC9S08JS16LCWJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8245LZU266D MPC8245.pdf
MPC8245LZU266D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
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LPC1111FDH20/002,5 LPC1102_1104.pdf
LPC1111FDH20/002,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1111FDH20/002,5 LPC1102_1104.pdf
LPC1111FDH20/002,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 375 Stücke:
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4+5.76 EUR
10+4.32 EUR
25+3.95 EUR
100+3.56 EUR
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