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MC9S08SH4CTJ MC9S08SH4CTJ NXP USA Inc. MC9S08SH8.pdf Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 2133 Stücke:
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3+6.79 EUR
10+5.13 EUR
75+4.34 EUR
150+4.16 EUR
300+4.01 EUR
525+3.91 EUR
1050+3.8 EUR
Mindestbestellmenge: 3
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MMA6827BKCW MMA6827BKCW NXP USA Inc. PHGL-S-A0002885344-1.pdf?t.download=true&u=5oefqw Description: MMA6827 - DUAL-AXIS SPI INERTIAL
Packaging: Bulk
auf Bestellung 65 Stücke:
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45+9.97 EUR
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MMA6255AKEG MMA6255AKEG NXP USA Inc. MMA6222AKEG.pdf Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±50g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Produkt ist nicht verfügbar
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MMA9550LR1 MMA9550LR1 NXP USA Inc. MMA955xL.pdf Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
Produkt ist nicht verfügbar
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A5000R2HQ1/Z016UZ NXP USA Inc. Description: IC EDGE LOCK SEC AUTH 20HX2QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Edge Lock Secure Authenticator
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
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3000+2.28 EUR
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A5000R2HQ1/Z016UZ NXP USA Inc. Description: IC EDGE LOCK SEC AUTH 20HX2QFN
Packaging: Cut Tape (CT)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Edge Lock Secure Authenticator
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
auf Bestellung 4364 Stücke:
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5+4.36 EUR
10+3.26 EUR
25+2.98 EUR
100+2.67 EUR
250+2.53 EUR
500+2.44 EUR
1000+2.43 EUR
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NX3DV42GU33Z NXP USA Inc. NX3DV42.pdf Description: NX3DV42GU33
Features: Break-Before-Make, USB 2.0
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Grade: Automotive
Number of Channels: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MIMXRT1015CAF4BR MIMXRT1015CAF4BR NXP USA Inc. IMXRT1015IEC.pdf Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
Produkt ist nicht verfügbar
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MIMXRT1015CAF4AR MIMXRT1015CAF4AR NXP USA Inc. IMXRT1015IEC.pdf Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
Produkt ist nicht verfügbar
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MIMXRT1015DAF5B MIMXRT1015DAF5B NXP USA Inc. IMXRT1015IEC.pdf Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 68 Stücke:
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2+9.49 EUR
10+7.29 EUR
25+6.74 EUR
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MIMXRT1015CAF4B MIMXRT1015CAF4B NXP USA Inc. IMXRT1015IEC.pdf Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 80 Stücke:
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2+11.32 EUR
10+8.74 EUR
25+8.1 EUR
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MPF5024AMMA0ES MPF5024AMMA0ES NXP USA Inc. Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 210 Stücke:
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2+10.23 EUR
10+7.87 EUR
25+7.28 EUR
100+6.64 EUR
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BFU610F,115 BFU610F,115 NXP USA Inc. BFU610F.pdf Description: RF TRANS NPN 5.5V 15GHZ 4-DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
auf Bestellung 3000 Stücke:
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3000+0.37 EUR
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BFU610F,115 BFU610F,115 NXP USA Inc. BFU610F.pdf Description: RF TRANS NPN 5.5V 15GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
auf Bestellung 5753 Stücke:
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12+1.51 EUR
19+0.94 EUR
100+0.62 EUR
500+0.47 EUR
1000+0.43 EUR
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MCF54454CVP200 MCF54454CVP200 NXP USA Inc. MCF54455.pdf Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D2201DUD/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D2201DUF/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D2200DA6/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D2200DA4/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2201DUD/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2201DUF/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2200DA6/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2200DA4/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4201DUD/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4201DUF/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4200DA6/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4200DA4/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH4201DUD/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH4201DUF/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH4200DA6/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH4200DA4/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D8201DUD/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D8201DUF/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D8200DA6/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D8200DA4/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH8201DUD/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH8201DUF/01V NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH8200DA6/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH8200DA4/01J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC2G00GF115 74LVC2G00GF115 NXP USA Inc. 74LVC2G00.pdf Description: IC GATE NAND 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (1.35x1)
Input Logic Level - High: 1.07V ~ 3.85V
Input Logic Level - Low: 0.58V ~ 1.65V
Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
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74AHC2G00GD,125 74AHC2G00GD,125 NXP USA Inc. PHGLS27058-1.pdf?t.download=true&u=5oefqw Description: IC GATE NAND 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 10 µA
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2049+0.24 EUR
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NTB0101AGWH NTB0101AGWH NXP USA Inc. NTB0101A.pdf Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTB0101AGWH NTB0101AGWH NXP USA Inc. NTB0101A.pdf Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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MRF8S9102NR3 MRF8S9102NR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 920MHz
Power - Output: 28W
Gain: 23.1dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 750 mA
Produkt ist nicht verfügbar
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TYN16-600RT127 TYN16-600RT127 NXP USA Inc. WEEN-S-A0001810749-1.pdf?t.download=true&u=5oefqw Description: SILICON CONTROLLED RECTIFIER - T
Packaging: Bulk
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
888+0.57 EUR
Mindestbestellmenge: 888
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MPC8343VRAGDB MPC8343VRAGDB NXP USA Inc. Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MC56F8002VWL MC56F8002VWL NXP USA Inc. MC56F8006.pdf Description: IC MCU 16BIT 12KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 12KB (6K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F8002VWLR MC56F8002VWLR NXP USA Inc. MC56F8006.pdf Description: IC MCU 16BIT 12KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 12KB (6K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA8547TSN1/02,118 NXP USA Inc. TDA8547TS.pdf Description: IC AMP CLASS AB STER 1.2W 20SSOP
Features: Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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LFK73KINTPT3A NXP USA Inc. Description: QORIVVA PS32R274K ON A 257 PIN 0
Packaging: Bulk
For Use With/Related Products: PS32R274K
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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MC908AP64CFAE MC908AP64CFAE NXP USA Inc. FSCLS03875-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 3714 Stücke:
Lieferzeit 10-14 Tag (e)
24+20.54 EUR
Mindestbestellmenge: 24
Im Einkaufswagen  Stück im Wert von  UAH
MC908AP64CFAER MC908AP64CFAER NXP USA Inc. MC68HC908AP64.pdf Description: IC MCU 8BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AP64CFAE MC908AP64CFAE NXP USA Inc. MC68HC908AP64.pdf Description: IC MCU 8BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC908AP64ACFAE MC908AP64ACFAE NXP USA Inc. MC68HC908AP64A.pdf Description: IC MCU 8BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AP64ACFBE MC908AP64ACFBE NXP USA Inc. MC68HC908AP64A.pdf Description: IC MCU 8BIT 64KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3ICD8101DUD/05,0 NXP USA Inc. MF3ICDX21_41_81_SDS.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Produkt ist nicht verfügbar
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BRKTSTBAPA7250S NXP USA Inc. UM11863.pdf Description: PRESSURE EVAL BREAKOUT BOARD
Packaging: Box
Interface: I2C, Serial, SPI
Sensor Type: Pressure
Utilized IC / Part: FXPS7250X
Supplied Contents: Board(s)
Embedded: No
Produkt ist nicht verfügbar
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S9S12DG25F0VPVE S9S12DG25F0VPVE NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12DG25F0CPVE S9S12DG25F0CPVE NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12DG25F0MPVE S9S12DG25F0MPVE NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08SH4CTJ MC9S08SH8.pdf
MC9S08SH4CTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 2133 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.79 EUR
10+5.13 EUR
75+4.34 EUR
150+4.16 EUR
300+4.01 EUR
525+3.91 EUR
1050+3.8 EUR
Mindestbestellmenge: 3
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MMA6827BKCW PHGL-S-A0002885344-1.pdf?t.download=true&u=5oefqw
MMA6827BKCW
Hersteller: NXP USA Inc.
Description: MMA6827 - DUAL-AXIS SPI INERTIAL
Packaging: Bulk
auf Bestellung 65 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
45+9.97 EUR
Mindestbestellmenge: 45
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MMA6255AKEG MMA6222AKEG.pdf
MMA6255AKEG
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±50g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Produkt ist nicht verfügbar
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MMA9550LR1 MMA955xL.pdf
MMA9550LR1
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
Produkt ist nicht verfügbar
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A5000R2HQ1/Z016UZ
Hersteller: NXP USA Inc.
Description: IC EDGE LOCK SEC AUTH 20HX2QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Edge Lock Secure Authenticator
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+2.28 EUR
Mindestbestellmenge: 3000
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A5000R2HQ1/Z016UZ
Hersteller: NXP USA Inc.
Description: IC EDGE LOCK SEC AUTH 20HX2QFN
Packaging: Cut Tape (CT)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Edge Lock Secure Authenticator
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
auf Bestellung 4364 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.36 EUR
10+3.26 EUR
25+2.98 EUR
100+2.67 EUR
250+2.53 EUR
500+2.44 EUR
1000+2.43 EUR
Mindestbestellmenge: 5
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NX3DV42GU33Z NX3DV42.pdf
Hersteller: NXP USA Inc.
Description: NX3DV42GU33
Features: Break-Before-Make, USB 2.0
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Grade: Automotive
Number of Channels: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MIMXRT1015CAF4BR IMXRT1015IEC.pdf
MIMXRT1015CAF4BR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
Produkt ist nicht verfügbar
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MIMXRT1015CAF4AR IMXRT1015IEC.pdf
MIMXRT1015CAF4AR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
Produkt ist nicht verfügbar
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MIMXRT1015DAF5B IMXRT1015IEC.pdf
MIMXRT1015DAF5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 68 Stücke:
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Anzahl Preis
2+9.49 EUR
10+7.29 EUR
25+6.74 EUR
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MIMXRT1015CAF4B IMXRT1015IEC.pdf
MIMXRT1015CAF4B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
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2+11.32 EUR
10+8.74 EUR
25+8.1 EUR
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MPF5024AMMA0ES
MPF5024AMMA0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 210 Stücke:
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Anzahl Preis
2+10.23 EUR
10+7.87 EUR
25+7.28 EUR
100+6.64 EUR
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BFU610F,115 BFU610F.pdf
BFU610F,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 5.5V 15GHZ 4-DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
auf Bestellung 3000 Stücke:
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Anzahl Preis
3000+0.37 EUR
Mindestbestellmenge: 3000
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BFU610F,115 BFU610F.pdf
BFU610F,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 5.5V 15GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
auf Bestellung 5753 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+1.51 EUR
19+0.94 EUR
100+0.62 EUR
500+0.47 EUR
1000+0.43 EUR
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MCF54454CVP200 MCF54455.pdf
MCF54454CVP200
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D2201DUD/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D2201DUF/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D2200DA6/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D2200DA4/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2201DUD/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2201DUF/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2200DA6/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2200DA4/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4201DUD/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4201DUF/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4200DA6/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D4200DA4/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH4201DUD/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH4201DUF/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH4200DA6/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH4200DA4/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D8201DUD/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D8201DUF/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D8200DA6/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3D8200DA4/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH8201DUD/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH8201DUF/01V MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH8200DA6/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH8200DA4/01J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC2G00GF115 74LVC2G00.pdf
74LVC2G00GF115
Hersteller: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (1.35x1)
Input Logic Level - High: 1.07V ~ 3.85V
Input Logic Level - Low: 0.58V ~ 1.65V
Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
auf Bestellung 570000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1612+0.31 EUR
Mindestbestellmenge: 1612
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74AHC2G00GD,125 PHGLS27058-1.pdf?t.download=true&u=5oefqw
74AHC2G00GD,125
Hersteller: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 10 µA
auf Bestellung 125658 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.24 EUR
Mindestbestellmenge: 2049
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NTB0101AGWH NTB0101A.pdf
NTB0101AGWH
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTB0101AGWH NTB0101A.pdf
NTB0101AGWH
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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MRF8S9102NR3
MRF8S9102NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 920MHz
Power - Output: 28W
Gain: 23.1dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 750 mA
Produkt ist nicht verfügbar
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TYN16-600RT127 WEEN-S-A0001810749-1.pdf?t.download=true&u=5oefqw
TYN16-600RT127
Hersteller: NXP USA Inc.
Description: SILICON CONTROLLED RECTIFIER - T
Packaging: Bulk
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
888+0.57 EUR
Mindestbestellmenge: 888
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MPC8343VRAGDB
MPC8343VRAGDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MC56F8002VWL MC56F8006.pdf
MC56F8002VWL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 12KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 12KB (6K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F8002VWLR MC56F8006.pdf
MC56F8002VWLR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 12KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 12KB (6K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA8547TSN1/02,118 TDA8547TS.pdf
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 1.2W 20SSOP
Features: Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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LFK73KINTPT3A
Hersteller: NXP USA Inc.
Description: QORIVVA PS32R274K ON A 257 PIN 0
Packaging: Bulk
For Use With/Related Products: PS32R274K
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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MC908AP64CFAE FSCLS03875-1.pdf?t.download=true&u=5oefqw
MC908AP64CFAE
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 3714 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
24+20.54 EUR
Mindestbestellmenge: 24
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MC908AP64CFAER MC68HC908AP64.pdf
MC908AP64CFAER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AP64CFAE MC68HC908AP64.pdf
MC908AP64CFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC908AP64ACFAE MC68HC908AP64A.pdf
MC908AP64ACFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AP64ACFBE MC68HC908AP64A.pdf
MC908AP64ACFBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3ICD8101DUD/05,0 MF3ICDX21_41_81_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Produkt ist nicht verfügbar
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BRKTSTBAPA7250S UM11863.pdf
Hersteller: NXP USA Inc.
Description: PRESSURE EVAL BREAKOUT BOARD
Packaging: Box
Interface: I2C, Serial, SPI
Sensor Type: Pressure
Utilized IC / Part: FXPS7250X
Supplied Contents: Board(s)
Embedded: No
Produkt ist nicht verfügbar
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S9S12DG25F0VPVE
S9S12DG25F0VPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12DG25F0CPVE 9S12DT128DGV2.pdf
S9S12DG25F0CPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12DG25F0MPVE
S9S12DG25F0MPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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