MPC855TCZQ50D4 Freescale Semiconductor
Hersteller: Freescale Semiconductor
Description: IC MPU MPC85XX 50MHZ 357BGA
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TJ)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
Part Status: Active
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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Technische Details MPC855TCZQ50D4 Freescale Semiconductor
Description: IC MPU MPC85XX 50MHZ 357BGA, Core Processor: MPC8xx, Operating Temperature: -40°C ~ 95°C (TJ), Speed: 50MHz, Mounting Type: Surface Mount, Package / Case: 357-BBGA, Packaging: Bulk, Part Status: Active, Graphics Acceleration: No, RAM Controllers: DRAM, Co-Processors/DSP: Communications; CPM, Number of Cores/Bus Width: 1 Core, 32-Bit, Ethernet: 10Mbps (1), 10/100Mbps (1), Supplier Device Package: 357-PBGA (25x25), Voltage - I/O: 3.3V, Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART.
Weitere Produktangebote MPC855TCZQ50D4
| Foto | Bezeichnung | Hersteller | Beschreibung |
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MPC855TCZQ50D4 | Hersteller : NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGAPackaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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| MPC855TCZQ50D4 | Hersteller : NXP Semiconductors |
Microprocessors - MPU POWER QUICC |
Produkt ist nicht verfügbar |
