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LS1012AXN7HKA LS1012AXN7HKA NXP USA Inc. LS1012AFS.pdf Description: IC MPU QORIQ 800MHZ 211FCLGA
Packaging: Tray
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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SAC57D53MCVLT NXP USA Inc. SAC57D54H.pdf Description: IC MCU 32BIT 3MB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SCF5234F4CVM150 SCF5234F4CVM150 NXP USA Inc. Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 97
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PMP5201Y/DG/B2115 PMP5201Y/DG/B2115 NXP USA Inc. PMP5201V_G_Y.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 PNP (Dual)
Operating Temperature: 150°C (TJ)
Power - Max: 200mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: 6-TSSOP
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PMP5201Y135 NXP USA Inc. PMP5201V_G_Y.pdf Description: NOW NEXPERIA PMP5201Y - SMALL SI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA3674AT/N1118 TDA3674AT/N1118 NXP USA Inc. _TDA3674.pdf?t.download=true&u=ovmfp3 Description: IC REG LINEAR 5V 100MA 8SO
Packaging: Bulk
Part Status: Active
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MKE02Z16VLD4557 NXP USA Inc. MKE02P64M40SF0.pdf Description: KINETIS KE02: MICROCONTROLLER CO
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MKE02Z32VFM4557 MKE02Z32VFM4557 NXP USA Inc. MKE02P64M40SF0.pdf Description: KINETIS KE02: MICROCONTROLLER CO
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MKE02Z32VLC4557 MKE02Z32VLC4557 NXP USA Inc. MKE02P64M40SF0.pdf Description: KINETIS KE02: MICROCONTROLLER CO
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LPC824M201JDH20118 LPC824M201JDH20118 NXP USA Inc. PHGL-S-A0004673414-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC08APW/AU118 74LVC08APW/AU118 NXP USA Inc. 74LVC08A_Q100.pdf Description: AND GATE, LVC/LCX/Z SERIES
Produkt ist nicht verfügbar
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74LVC08APW/S999118 74LVC08APW/S999118 NXP USA Inc. 74LVC08A.pdf Description: IC GATE AND
Packaging: Bulk
Part Status: Obsolete
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.8ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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74LVC08APW/S505118 74LVC08APW/S505118 NXP USA Inc. 74LVC08A.pdf Description: IC GATE AND
Packaging: Bulk
Part Status: Obsolete
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.8ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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74LVC08APW/C2118 74LVC08APW/C2118 NXP USA Inc. 74LVC08A_Q100.pdf Description: AND GATE, LVC/LCX/Z SERIES
Produkt ist nicht verfügbar
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74LVC162373ADGG/AU118 74LVC162373ADGG/AU118 NXP USA Inc. 74LVC_LVCH162373A.pdf Description: BUS DRIVER, LVC/LCX/Z SERIES
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2PC4617R,115 2PC4617R,115 NXP USA Inc. 2PC4617_DS_Rev5.pdf Description: TRANS NPN 50V 150MA SC75
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MIMXRT1061DVJ6B MIMXRT1061DVJ6B NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
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MIMXRT106ADVL6BR MIMXRT106ADVL6BR NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT106CDVL6B MIMXRT106CDVL6B NXP USA Inc. Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
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MIMXRT1061CVJ5AR MIMXRT1061CVJ5AR NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1061CVJ5BR MIMXRT1061CVJ5BR NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1064DVJ6A MIMXRT1064DVJ6A NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1064DVL6BR MIMXRT1064DVL6BR NXP USA Inc. IMXRT1064CEC.pdf Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT106LDVL6B MIMXRT106LDVL6B NXP USA Inc. Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1064DVJ6B MIMXRT1064DVJ6B NXP USA Inc. IMXRT1064CEC.pdf Description: IC MCU 32BIT 4MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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1+24.06 EUR
10+19.03 EUR
25+17.78 EUR
189+15.92 EUR
378+15.49 EUR
567+15.28 EUR
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PIMXRT1064DVJ6B PIMXRT1064DVJ6B NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
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PIMXRT1064DVL6B PIMXRT1064DVL6B NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
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PIMXRT1064CVJ5B PIMXRT1064CVJ5B NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
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PIMXRT1064CVL5B PIMXRT1064CVL5B NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
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LPC1112FHN33/102K LPC1112FHN33/102K NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
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LPC1112FHN33/202K LPC1112FHN33/202K NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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4+5.07 EUR
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520+2.85 EUR
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LPC1113FBD48/302EL LPC1113FBD48/302EL NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 202 Stücke:
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3+6.39 EUR
10+4.84 EUR
25+4.45 EUR
100+4.02 EUR
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LPC1115FBD48/303EL LPC1115FBD48/303EL NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 2737 Stücke:
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3+8.01 EUR
10+5.17 EUR
25+5.01 EUR
80+4.85 EUR
250+4.67 EUR
500+4.49 EUR
1000+4.48 EUR
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A3T18H360W23SR6 NXP USA Inc. A3T18H360W23S.pdf Description: 1.8GHZ 360W ACP1230S-4L2
Produkt ist nicht verfügbar
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NX3L1G3157GW125 NXP USA Inc. Description: SPDT 1 FUNC 1 CHANNEL
Packaging: Bulk
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NX3L1G3157GW NXP USA Inc. Description: SPDT 1 FUNC 1 CHANNEL
Packaging: Bulk
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NX3L1G3157GW,125 NX3L1G3157GW,125 NXP USA Inc. NX3L1G3157.pdf Description: SPDT, 1 FUNC, 1 CHANNEL, CMOS, P
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LD6806TD/13H,125 LD6806TD/13H,125 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 1.3V 200MA 5TSOP
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MC9S12NE64CPVE557 NXP USA Inc. Description: MCU 16-BIT FLASH, 25MHZ
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MC33772BTA2AE MC33772BTA2AE NXP USA Inc. MC33772B_SDS.pdf Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
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PZU6.2B2L/NO315 PZU6.2B2L/NO315 NXP USA Inc. PZUXBL_SER.pdf Description: DIODE ZENER
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PZU6.2B3115 PZU6.2B3115 NXP USA Inc. PZUXB_SER.pdf Description: NOW NEXPERIA PZU6.2B3 ZENER DIOD
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PZU6.2B3A115 NXP USA Inc. Description: DIODE ZENER SINGLE
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PZU6.2B1A115 PZU6.2B1A115 NXP USA Inc. PZUXBA_SER.pdf Description: NOW NEXPERIA PZU6.2B1A - ZENER D
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74LVCH245APW-Q100118 74LVCH245APW-Q100118 NXP USA Inc. 74LVC_LVCH245A_Q100.pdf Description: BUS TRANSCVR, LVC/LCX/Z SERIES
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74LVCH245APW/AU118 74LVCH245APW/AU118 NXP USA Inc. 74LVC_LVCH245A.pdf Description: BUS TRANSCVR, LVC/LCX/Z SERIES
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74LVT245PW/AU118 74LVT245PW/AU118 NXP USA Inc. PHGLS29090-1.pdf?t.download=true&u=5oefqw Description: BUS TRANSCVR, LVT SERIES, 8-BIT
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74LVCH16245ADGG-Q100118 74LVCH16245ADGG-Q100118 NXP USA Inc. 74LVC_LVCH16245A_Q100.pdf Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
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LD6805K/23P,115 LD6805K/23P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 2.3V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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LD6805K/23H,115 LD6805K/23H,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 2.3V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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TJA1102AHN/S/0Z TJA1102AHN/S/0Z NXP USA Inc. TJA1102_SDS.pdf Description: IC TXRX FULL/HALF 1/1 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
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TJA1102AHN/S/0Z TJA1102AHN/S/0Z NXP USA Inc. TJA1102_SDS.pdf Description: IC TXRX FULL/HALF 1/1 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
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TJA1102AHN/0Z TJA1102AHN/0Z NXP USA Inc. TJA1102_SDS.pdf Description: IC TRANSCEIVER FULL 2/2 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Duplex: Full
Part Status: Active
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TJA1102AHN/0Z TJA1102AHN/0Z NXP USA Inc. TJA1102_SDS.pdf Description: IC TRANSCEIVER FULL 2/2 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Duplex: Full
Part Status: Active
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TJA1124BHG/0Z TJA1124BHG/0Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 4735 Stücke:
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SPC5644CAVLU1 SPC5644CAVLU1 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5644CAVLU8 SPC5644CAVLU8 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSPB56371AF180 DSPB56371AF180 NXP USA Inc. DSP56371.pdf Description: IC DSP 24BIT 180MHZ 80-LQFP
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74LV164DB112 74LV164DB112 NXP USA Inc. 74LV164.pdf Description: NOW NEXPERIA 74LV164DB - SERIAL
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74AXP2G07GS125 74AXP2G07GS125 NXP USA Inc. 74AXP2G07.pdf Description: 74AXP2G07GS - BUFFER, AXP SERIES
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)
2862+0.18 EUR
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LS1012AXN7HKA LS1012AFS.pdf
LS1012AXN7HKA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 211FCLGA
Packaging: Tray
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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SAC57D53MCVLT SAC57D54H.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SCF5234F4CVM150
SCF5234F4CVM150
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 97
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PMP5201Y/DG/B2115 PMP5201V_G_Y.pdf
PMP5201Y/DG/B2115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 PNP (Dual)
Operating Temperature: 150°C (TJ)
Power - Max: 200mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: 6-TSSOP
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PMP5201Y135 PMP5201V_G_Y.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMP5201Y - SMALL SI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA3674AT/N1118 _TDA3674.pdf?t.download=true&u=ovmfp3
TDA3674AT/N1118
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 5V 100MA 8SO
Packaging: Bulk
Part Status: Active
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
83+5.86 EUR
Mindestbestellmenge: 83
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MKE02Z16VLD4557 MKE02P64M40SF0.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KE02: MICROCONTROLLER CO
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MKE02Z32VFM4557 MKE02P64M40SF0.pdf
MKE02Z32VFM4557
Hersteller: NXP USA Inc.
Description: KINETIS KE02: MICROCONTROLLER CO
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MKE02Z32VLC4557 MKE02P64M40SF0.pdf
MKE02Z32VLC4557
Hersteller: NXP USA Inc.
Description: KINETIS KE02: MICROCONTROLLER CO
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LPC824M201JDH20118 PHGL-S-A0004673414-1.pdf?t.download=true&u=5oefqw
LPC824M201JDH20118
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC08APW/AU118 74LVC08A_Q100.pdf
74LVC08APW/AU118
Hersteller: NXP USA Inc.
Description: AND GATE, LVC/LCX/Z SERIES
Produkt ist nicht verfügbar
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74LVC08APW/S999118 74LVC08A.pdf
74LVC08APW/S999118
Hersteller: NXP USA Inc.
Description: IC GATE AND
Packaging: Bulk
Part Status: Obsolete
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.8ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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Lieferzeit 10-14 Tag (e)
Anzahl Preis
3328+0.15 EUR
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74LVC08APW/S505118 74LVC08A.pdf
74LVC08APW/S505118
Hersteller: NXP USA Inc.
Description: IC GATE AND
Packaging: Bulk
Part Status: Obsolete
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.8ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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Anzahl Preis
3328+0.15 EUR
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74LVC08APW/C2118 74LVC08A_Q100.pdf
74LVC08APW/C2118
Hersteller: NXP USA Inc.
Description: AND GATE, LVC/LCX/Z SERIES
Produkt ist nicht verfügbar
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74LVC162373ADGG/AU118 74LVC_LVCH162373A.pdf
74LVC162373ADGG/AU118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
auf Bestellung 10000 Stücke:
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Anzahl Preis
687+0.79 EUR
Mindestbestellmenge: 687
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2PC4617R,115 2PC4617_DS_Rev5.pdf
2PC4617R,115
Hersteller: NXP USA Inc.
Description: TRANS NPN 50V 150MA SC75
auf Bestellung 511099 Stücke:
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MIMXRT1061DVJ6B IMXRT1060CEC.pdf
MIMXRT1061DVJ6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 144 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.56 EUR
10+13.76 EUR
25+12.81 EUR
Mindestbestellmenge: 2
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MIMXRT106ADVL6BR
MIMXRT106ADVL6BR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMXRT106CDVL6B
MIMXRT106CDVL6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 480 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+26.56 EUR
10+19.1 EUR
25+17.18 EUR
80+15.33 EUR
240+14.04 EUR
480+13.4 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MIMXRT1061CVJ5AR
MIMXRT1061CVJ5AR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMXRT1061CVJ5BR IMXRT1060CEC.pdf
MIMXRT1061CVJ5BR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMXRT1064DVJ6A
MIMXRT1064DVJ6A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMXRT1064DVL6BR IMXRT1064CEC.pdf
MIMXRT1064DVL6BR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMXRT106LDVL6B
MIMXRT106LDVL6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMXRT1064DVJ6B IMXRT1064CEC.pdf
MIMXRT1064DVJ6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 946 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.06 EUR
10+19.03 EUR
25+17.78 EUR
189+15.92 EUR
378+15.49 EUR
567+15.28 EUR
Im Einkaufswagen  Stück im Wert von  UAH
PIMXRT1064DVJ6B
PIMXRT1064DVJ6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PIMXRT1064DVL6B
PIMXRT1064DVL6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PIMXRT1064CVJ5B
PIMXRT1064CVJ5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PIMXRT1064CVL5B
PIMXRT1064CVL5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1112FHN33/102K LPC111X.pdf
LPC1112FHN33/102K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.82 EUR
10+3.6 EUR
25+3.29 EUR
80+3 EUR
260+2.79 EUR
520+2.7 EUR
Mindestbestellmenge: 4
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LPC1112FHN33/202K LPC111X.pdf
LPC1112FHN33/202K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1290 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.07 EUR
10+3.79 EUR
25+3.47 EUR
80+3.17 EUR
260+2.95 EUR
520+2.85 EUR
1040+2.77 EUR
Mindestbestellmenge: 4
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LPC1113FBD48/302EL LPC1102_1104.pdf
LPC1113FBD48/302EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 202 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.39 EUR
10+4.84 EUR
25+4.45 EUR
100+4.02 EUR
Mindestbestellmenge: 3
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LPC1115FBD48/303EL LPC111X.pdf
LPC1115FBD48/303EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 2737 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.01 EUR
10+5.17 EUR
25+5.01 EUR
80+4.85 EUR
250+4.67 EUR
500+4.49 EUR
1000+4.48 EUR
Mindestbestellmenge: 3
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A3T18H360W23SR6 A3T18H360W23S.pdf
Hersteller: NXP USA Inc.
Description: 1.8GHZ 360W ACP1230S-4L2
Produkt ist nicht verfügbar
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NX3L1G3157GW125
Hersteller: NXP USA Inc.
Description: SPDT 1 FUNC 1 CHANNEL
Packaging: Bulk
Produkt ist nicht verfügbar
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NX3L1G3157GW
Hersteller: NXP USA Inc.
Description: SPDT 1 FUNC 1 CHANNEL
Packaging: Bulk
Produkt ist nicht verfügbar
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NX3L1G3157GW,125 NX3L1G3157.pdf
NX3L1G3157GW,125
Hersteller: NXP USA Inc.
Description: SPDT, 1 FUNC, 1 CHANNEL, CMOS, P
Produkt ist nicht verfügbar
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LD6806TD/13H,125 LD6806_Series.pdf
LD6806TD/13H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.3V 200MA 5TSOP
auf Bestellung 21000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3206+0.17 EUR
Mindestbestellmenge: 3206
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MC9S12NE64CPVE557
Hersteller: NXP USA Inc.
Description: MCU 16-BIT FLASH, 25MHZ
Produkt ist nicht verfügbar
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MC33772BTA2AE MC33772B_SDS.pdf
MC33772BTA2AE
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
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PZU6.2B2L/NO315 PZUXBL_SER.pdf
PZU6.2B2L/NO315
Hersteller: NXP USA Inc.
Description: DIODE ZENER
auf Bestellung 2200000 Stücke:
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PZU6.2B3115 PZUXB_SER.pdf
PZU6.2B3115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU6.2B3 ZENER DIOD
auf Bestellung 52450 Stücke:
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PZU6.2B3A115
Hersteller: NXP USA Inc.
Description: DIODE ZENER SINGLE
Produkt ist nicht verfügbar
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PZU6.2B1A115 PZUXBA_SER.pdf
PZU6.2B1A115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU6.2B1A - ZENER D
Produkt ist nicht verfügbar
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74LVCH245APW-Q100118 74LVC_LVCH245A_Q100.pdf
74LVCH245APW-Q100118
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
auf Bestellung 29650 Stücke:
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74LVCH245APW/AU118 74LVC_LVCH245A.pdf
74LVCH245APW/AU118
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
auf Bestellung 3450 Stücke:
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74LVT245PW/AU118 PHGLS29090-1.pdf?t.download=true&u=5oefqw
74LVT245PW/AU118
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVT SERIES, 8-BIT
auf Bestellung 47070 Stücke:
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74LVCH16245ADGG-Q100118 74LVC_LVCH16245A_Q100.pdf
74LVCH16245ADGG-Q100118
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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LD6805K/23P,115 LD6805.pdf
LD6805K/23P,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.3V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 70000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3206+0.16 EUR
Mindestbestellmenge: 3206
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LD6805K/23H,115 LD6805.pdf
LD6805K/23H,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.3V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 50000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2959+0.17 EUR
Mindestbestellmenge: 2959
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TJA1102AHN/S/0Z TJA1102_SDS.pdf
TJA1102AHN/S/0Z
Hersteller: NXP USA Inc.
Description: IC TXRX FULL/HALF 1/1 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+4.44 EUR
Mindestbestellmenge: 2000
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TJA1102AHN/S/0Z TJA1102_SDS.pdf
TJA1102AHN/S/0Z
Hersteller: NXP USA Inc.
Description: IC TXRX FULL/HALF 1/1 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 7824 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.67 EUR
10+6 EUR
25+5.67 EUR
100+4.92 EUR
250+4.66 EUR
500+4.44 EUR
Mindestbestellmenge: 3
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TJA1102AHN/0Z TJA1102_SDS.pdf
TJA1102AHN/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 2/2 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Duplex: Full
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+4.68 EUR
Mindestbestellmenge: 2000
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TJA1102AHN/0Z TJA1102_SDS.pdf
TJA1102AHN/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 2/2 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Duplex: Full
Part Status: Active
auf Bestellung 3550 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.69 EUR
10+6.05 EUR
25+5.81 EUR
100+5.62 EUR
250+5.41 EUR
500+5.24 EUR
1000+5.1 EUR
Mindestbestellmenge: 3
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TJA1124BHG/0Z TJA1124.pdf
TJA1124BHG/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 4735 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.86 EUR
10+3.63 EUR
25+3.33 EUR
100+2.99 EUR
250+2.83 EUR
500+2.74 EUR
Mindestbestellmenge: 4
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SPC5644CAVLU1
SPC5644CAVLU1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644CAVLU8
SPC5644CAVLU8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSPB56371AF180 DSP56371.pdf
DSPB56371AF180
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 180MHZ 80-LQFP
Produkt ist nicht verfügbar
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74LV164DB112 74LV164.pdf
74LV164DB112
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LV164DB - SERIAL
Produkt ist nicht verfügbar
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74AXP2G07GS125 74AXP2G07.pdf
74AXP2G07GS125
Hersteller: NXP USA Inc.
Description: 74AXP2G07GS - BUFFER, AXP SERIES
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2862+0.18 EUR
Mindestbestellmenge: 2862
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