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PDTD143ET215 PDTD143ET215 NXP USA Inc. Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Produkt ist nicht verfügbar
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TEA2016AAT/1J TEA2016AAT/1J NXP USA Inc. TEA2016AAT.pdf Description: RESONANT POWER SUPPLY WITH PFC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCZ33903C3EKR2 MCZ33903C3EKR2 NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
auf Bestellung 1000 Stücke:
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68+7.22 EUR
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MCZ33905DS3EKR2,518 MCZ33905DS3EKR2,518 NXP USA Inc. MC33903-MC33904-MC33905.pdf Description: SYSTEM BASIS CHIP, LIN, 2X 3.3V
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2.8mA
Supplier Device Package: 32-HSOP
Grade: Automotive
Qualification: AEC-Q101
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56+8.68 EUR
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MCZ33905CD5EK MCZ33905CD5EK NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
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53+9.28 EUR
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MCZ33903D5EK MCZ33903D5EK NXP USA Inc. MC33903-MC33904-MC33905.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
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66+7.38 EUR
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SA58672UK027 NXP USA Inc. SA58672.pdf Description: AUDIO AMPLIFIER 3W
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SA58672UK,027 SA58672UK,027 NXP USA Inc. SA58672.pdf Description: IC AMP CLASS D MONO 3W 9WLCSP
Packaging: Cut Tape (CT)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 5.5V
Max Output Power x Channels @ Load: 3W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.66x1.71)
Part Status: Obsolete
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SA58637BS,118 SA58637BS,118 NXP USA Inc. SA58637.pdf Description: IC AMP CLSS AB STER 2.2W 20HVQFN
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LPC43S20FBD144551 LPC43S20FBD144551 NXP USA Inc. PHGL-S-A0001691624-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
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74HC4050PW118 NXP USA Inc. 74HC4050.pdf Description: IC BUFFER NON-INVERT 6V 16TSSOP
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MKS22FN256VLH12557 MKS22FN256VLH12557 NXP USA Inc. PHGL-S-A0002263409-1.pdf?t.download=true&u=5oefqw Description: KINETIS S 32-BIT MCU, ARM CORTEX
auf Bestellung 171 Stücke:
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MKS20FN256VLL12557 MKS20FN256VLL12557 NXP USA Inc. PHGL-S-A0002263409-1.pdf?t.download=true&u=5oefqw Description: KINETIS S 32-BIT MCU, ARM CORTEX
auf Bestellung 720 Stücke:
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PESD5V0C1USF315 NXP USA Inc. PESD5V0C1USF.pdf Description: TVS DIODE
Packaging: Bulk
auf Bestellung 45000 Stücke:
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8768+0.053 EUR
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PESD5V0V2BM315 PESD5V0V2BM315 NXP USA Inc. PESD5V0V2BM.pdf Description: TVS DIODE
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PESD5V0C1BSF315 PESD5V0C1BSF315 NXP USA Inc. PESD5V0C1BSF.pdf Description: TVS DIODE
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PESD5V0R1BSF315 PESD5V0R1BSF315 NXP USA Inc. PESD5V0R1BSF.pdf Description: TVS DIODE
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 0.1pF @ 2.5GHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 5V
Power Line Protection: No
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7693+0.064 EUR
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PESD5V0X2UMB315 PESD5V0X2UMB315 NXP USA Inc. PESD5V0X2UMB.pdf Description: TVS DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Capacitance @ Frequency: 0.5pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006B-3
Unidirectional Channels: 2
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 14V
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
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3566+0.13 EUR
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PESD5V0X2UAMB315 PESD5V0X2UAMB315 NXP USA Inc. PESD5V0X2UAMB.pdf Description: TVS DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: 150°C (TJ)
Applications: Telecom
Capacitance @ Frequency: 0.8pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006B-3
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 14V
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
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4046+0.11 EUR
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74HC2G02DP-Q100125 74HC2G02DP-Q100125 NXP USA Inc. 74HC_HCT2G02_Q100.pdf Description: IC GATE NOR 2CH 2-INP 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 8-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Grade: Automotive
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 20 µA
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
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1972+0.24 EUR
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74HC2G04GV-Q100125 74HC2G04GV-Q100125 NXP USA Inc. 74HC_HCT2G04_Q100.pdf Description: IC INVERT SCHMITT 2CH 2INP 6TSOP
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 13ns @ 6V, 50pF
Grade: Automotive
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Qualification: AEC-Q100
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74HC2G86DP-Q100125 74HC2G86DP-Q100125 NXP USA Inc. 74HC_HCT2G86_Q100.pdf Description: IC GATE XOR 2CH 2-INP 8TSSOP
auf Bestellung 62100 Stücke:
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2263+0.22 EUR
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74HC2G66DP-Q100125 74HC2G66DP-Q100125 NXP USA Inc. 74HC_HCT2G66_Q100.pdf Description: 74HC2G66DP-Q100 - SPST, 2 FUNC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74HC2G126GD,125 74HC2G126GD,125 NXP USA Inc. 74HC(T)2G126.pdf Description: IC BUFFER NON-INVERT 6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Part Status: Obsolete
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2049+0.25 EUR
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74HC2G125GD125 74HC2G125GD125 NXP USA Inc. 74HC_HCT2G125.pdf Description: IC BUFFER NON-INVERT 6V 8XSON
auf Bestellung 3000 Stücke:
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1697+0.31 EUR
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MPC860PCZQ50D4-NXP MPC860PCZQ50D4-NXP NXP USA Inc. FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Active
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MPC855TZQ50D4-NXP MPC855TZQ50D4-NXP NXP USA Inc. FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 1259 Stücke:
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3+229.98 EUR
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MPC860TZQ50D4 MPC860TZQ50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 154 Stücke:
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3+229.81 EUR
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MPC860DPZQ50D4557-NXP MPC860DPZQ50D4557-NXP NXP USA Inc. MPC860TS.pdf Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
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MPC850CZQ50BU MPC850CZQ50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
auf Bestellung 10 Stücke:
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8+66.03 EUR
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SVF521R3K2CMK4 SVF521R3K2CMK4 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
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T2080NSE8TTB NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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MCIMX537CVP8C2R2 MCIMX537CVP8C2R2 NXP USA Inc. Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
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74LVC573ABXX 74LVC573ABXX NXP USA Inc. NEXP-S-A0002881343-1.pdf?t.download=true&u=5oefqw Description: IC D-TYPE TRANSP SGL 8:8 20HXQFN
Packaging: Bulk
Package / Case: 20-XFQFN Exposed Pad
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 1.5ns
Supplier Device Package: 20-DHXQFN (4.5x2.5)
auf Bestellung 261900 Stücke:
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1567+0.31 EUR
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74HCT7540N112 NXP USA Inc. Description: IC BUFFER INVERT 5.5V 20DIP
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NX7002BKMB315 NX7002BKMB315 NXP USA Inc. NX7002BKMB.pdf Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Produkt ist nicht verfügbar
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NX7002BKXB147 NX7002BKXB147 NXP USA Inc. NX7002BKXB.pdf Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
auf Bestellung 1459345 Stücke:
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5495+0.081 EUR
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NX7002BKS115 NX7002BKS115 NXP USA Inc. NX7002BKS.pdf Description: MOSFET
Packaging: Bulk
auf Bestellung 18000 Stücke:
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8242+0.065 EUR
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74AVC4T245PW-Q100118 74AVC4T245PW-Q100118 NXP USA Inc. 74AVC4T245_Q100.pdf Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 2
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 16-TSSOP
Part Status: Active
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968+0.63 EUR
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TEA1998TS/1115 TEA1998TS/1115 NXP USA Inc. PHGL-S-A0003207591-1.pdf?t.download=true&u=5oefqw Description: GREENCHIP SYNCHRONOUS RECTIFIER
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TEA1993TS/1 TEA1993TS/1 NXP USA Inc. PHGL-S-A0002428271-1.pdf?t.download=true&u=5oefqw Description: GREENCHIP SYNCHRONOUS RECTIFIER
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TEA1993TS/1125 TEA1993TS/1125 NXP USA Inc. PHGL-S-A0002428271-1.pdf?t.download=true&u=5oefqw Description: GREENCHIP SYNCHRONOUS RECTIFIER
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TEA2208T/1J TEA2208T/1J NXP USA Inc. TEA2208T.pdf Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
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TEA2208T/1J TEA2208T/1J NXP USA Inc. TEA2208T.pdf Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
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250+6.09 EUR
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74AXP1G11GSH 74AXP1G11GSH NXP USA Inc. 74AXP1G11.pdf Description: IC GATE AND 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
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IP3348CX20,135 IP3348CX20,135 NXP USA Inc. IP3348CX5%2C10%2C15%2C20.pdf Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Bulk
Package / Case: 20-UFBGA, WLCSP
Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Current: 20 mA
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IP3088CX20,135 NXP USA Inc. PHGLS19967-1.pdf?t.download=true&u=5oefqw Description: FILTER LC(PI) 40NH/42PF ESD SMD
Packaging: Bulk
Package / Case: 20-WFBGA, WLCSP
Size / Dimension: 0.156" L x 0.050" W (3.96mm x 1.28mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 40nH (Total), C = 42pF (Total)
Height: 0.028" (0.70mm)
Attenuation Value: 40dB @ 800MHz ~ 1.5GHz
Filter Order: 5th
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Center / Cutoff Frequency: 175MHz (Cutoff)
Resistance - Channel (Ohms): 18
ESD Protection: Yes
Part Status: Active
Number of Channels: 8
Current: 30 mA
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LPC1225FBD48/301EL LPC1225FBD48/301EL NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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LPC1225FBD48/301151 LPC1225FBD48/301151 NXP USA Inc. PHGLS23259-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 64KB FLASH 48LQFP
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LPC1225FBD48/321151 LPC1225FBD48/321151 NXP USA Inc. PHGLS23259-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 80KB FLASH 48LQFP
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BLF7G10L-250,112 BLF7G10L-250,112 NXP USA Inc. PHGLS25424-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 30V LDMOST
Packaging: Tube
Package / Case: SOT-502A
Frequency: 920MHz ~ 960MHz
Power - Output: 60W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
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MC33FS4500LAER2 MC33FS4500LAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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BSC9131NXN7KHKB NXP USA Inc. BSC913xNW.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
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T1023NXE7PQA NXP USA Inc. T1024FS.pdf Description: QORIQ 2XCPU 64-BIT PWR ARCH 1.
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SPC5606BF1MLQ6R SPC5606BF1MLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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MC9S08QA4CFQER MC9S08QA4CFQER NXP USA Inc. MC9S08QA4.pdf Description: IC MCU 8BIT 4KB FLASH 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF24301HR5 MRF24301HR5 NXP USA Inc. Description: RF MOSFET LDMOS NI780
Packaging: Bulk
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
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A7102CHUK/T0BC2VAZ A7102CHUK/T0BC2VAZ NXP USA Inc. A71CH-LEAFLET.pdf Description: SECURITY IC EXT TEMP WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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A7102CHTK2/T0BC2CJ A7102CHTK2/T0BC2CJ NXP USA Inc. A71CH-LEAFLET.pdf Description: SECURITY IC EXT TEMP HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
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3+5.93 EUR
10+4.47 EUR
25+4.1 EUR
100+3.7 EUR
250+3.51 EUR
500+3.39 EUR
1000+3.3 EUR
2500+3.2 EUR
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MIMXRT685SFAWBR MIMXRT685SFAWBR NXP USA Inc. RT600.pdf Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
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PDTD143ET215
PDTD143ET215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Produkt ist nicht verfügbar
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TEA2016AAT/1J TEA2016AAT.pdf
TEA2016AAT/1J
Hersteller: NXP USA Inc.
Description: RESONANT POWER SUPPLY WITH PFC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCZ33903C3EKR2 MC33903%2C4%2C5.pdf
MCZ33903C3EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
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68+7.22 EUR
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MCZ33905DS3EKR2,518 MC33903-MC33904-MC33905.pdf
MCZ33905DS3EKR2,518
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LIN, 2X 3.3V
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2.8mA
Supplier Device Package: 32-HSOP
Grade: Automotive
Qualification: AEC-Q101
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56+8.68 EUR
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MCZ33905CD5EK MC33903%2C4%2C5.pdf
MCZ33905CD5EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
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53+9.28 EUR
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MCZ33903D5EK MC33903-MC33904-MC33905.pdf
MCZ33903D5EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
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66+7.38 EUR
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SA58672UK027 SA58672.pdf
Hersteller: NXP USA Inc.
Description: AUDIO AMPLIFIER 3W
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SA58672UK,027 SA58672.pdf
SA58672UK,027
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3W 9WLCSP
Packaging: Cut Tape (CT)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 5.5V
Max Output Power x Channels @ Load: 3W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.66x1.71)
Part Status: Obsolete
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SA58637BS,118 SA58637.pdf
SA58637BS,118
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB STER 2.2W 20HVQFN
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LPC43S20FBD144551 PHGL-S-A0001691624-1.pdf?t.download=true&u=5oefqw
LPC43S20FBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
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74HC4050PW118 74HC4050.pdf
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 16TSSOP
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MKS22FN256VLH12557 PHGL-S-A0002263409-1.pdf?t.download=true&u=5oefqw
MKS22FN256VLH12557
Hersteller: NXP USA Inc.
Description: KINETIS S 32-BIT MCU, ARM CORTEX
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MKS20FN256VLL12557 PHGL-S-A0002263409-1.pdf?t.download=true&u=5oefqw
MKS20FN256VLL12557
Hersteller: NXP USA Inc.
Description: KINETIS S 32-BIT MCU, ARM CORTEX
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PESD5V0C1USF315 PESD5V0C1USF.pdf
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
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Anzahl Preis
8768+0.053 EUR
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PESD5V0V2BM315 PESD5V0V2BM.pdf
PESD5V0V2BM315
Hersteller: NXP USA Inc.
Description: TVS DIODE
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PESD5V0C1BSF315 PESD5V0C1BSF.pdf
PESD5V0C1BSF315
Hersteller: NXP USA Inc.
Description: TVS DIODE
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PESD5V0R1BSF315 PESD5V0R1BSF.pdf
PESD5V0R1BSF315
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 0.1pF @ 2.5GHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 5V
Power Line Protection: No
auf Bestellung 3054553 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7693+0.064 EUR
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PESD5V0X2UMB315 PESD5V0X2UMB.pdf
PESD5V0X2UMB315
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Capacitance @ Frequency: 0.5pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006B-3
Unidirectional Channels: 2
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 14V
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
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Anzahl Preis
3566+0.13 EUR
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PESD5V0X2UAMB315 PESD5V0X2UAMB.pdf
PESD5V0X2UAMB315
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: 150°C (TJ)
Applications: Telecom
Capacitance @ Frequency: 0.8pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006B-3
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 14V
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 1401019 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4046+0.11 EUR
Mindestbestellmenge: 4046
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74HC2G02DP-Q100125 74HC_HCT2G02_Q100.pdf
74HC2G02DP-Q100125
Hersteller: NXP USA Inc.
Description: IC GATE NOR 2CH 2-INP 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 8-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Grade: Automotive
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 20 µA
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1972+0.24 EUR
Mindestbestellmenge: 1972
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74HC2G04GV-Q100125 74HC_HCT2G04_Q100.pdf
74HC2G04GV-Q100125
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 2CH 2INP 6TSOP
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 13ns @ 6V, 50pF
Grade: Automotive
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74HC2G86DP-Q100125 74HC_HCT2G86_Q100.pdf
74HC2G86DP-Q100125
Hersteller: NXP USA Inc.
Description: IC GATE XOR 2CH 2-INP 8TSSOP
auf Bestellung 62100 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2263+0.22 EUR
Mindestbestellmenge: 2263
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74HC2G66DP-Q100125 74HC_HCT2G66_Q100.pdf
74HC2G66DP-Q100125
Hersteller: NXP USA Inc.
Description: 74HC2G66DP-Q100 - SPST, 2 FUNC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74HC2G126GD,125 74HC(T)2G126.pdf
74HC2G126GD,125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Part Status: Obsolete
auf Bestellung 105210 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.25 EUR
Mindestbestellmenge: 2049
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74HC2G125GD125 74HC_HCT2G125.pdf
74HC2G125GD125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 8XSON
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1697+0.31 EUR
Mindestbestellmenge: 1697
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MPC860PCZQ50D4-NXP FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
MPC860PCZQ50D4-NXP
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Active
Produkt ist nicht verfügbar
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MPC855TZQ50D4-NXP FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
MPC855TZQ50D4-NXP
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 1259 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+229.98 EUR
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MPC860TZQ50D4 MPC860EC.pdf
MPC860TZQ50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 154 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+229.81 EUR
Mindestbestellmenge: 3
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MPC860DPZQ50D4557-NXP MPC860TS.pdf
MPC860DPZQ50D4557-NXP
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MPC850CZQ50BU MPC850%20PowerQUICC.pdf
MPC850CZQ50BU
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+66.03 EUR
Mindestbestellmenge: 8
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SVF521R3K2CMK4 VYBRIDRSERIESEC.pdf
SVF521R3K2CMK4
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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T2080NSE8TTB T2080FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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MCIMX537CVP8C2R2
MCIMX537CVP8C2R2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
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74LVC573ABXX NEXP-S-A0002881343-1.pdf?t.download=true&u=5oefqw
74LVC573ABXX
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20HXQFN
Packaging: Bulk
Package / Case: 20-XFQFN Exposed Pad
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 1.5ns
Supplier Device Package: 20-DHXQFN (4.5x2.5)
auf Bestellung 261900 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1567+0.31 EUR
Mindestbestellmenge: 1567
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74HCT7540N112
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20DIP
Produkt ist nicht verfügbar
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NX7002BKMB315 NX7002BKMB.pdf
NX7002BKMB315
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Produkt ist nicht verfügbar
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NX7002BKXB147 NX7002BKXB.pdf
NX7002BKXB147
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
auf Bestellung 1459345 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5495+0.081 EUR
Mindestbestellmenge: 5495
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NX7002BKS115 NX7002BKS.pdf
NX7002BKS115
Hersteller: NXP USA Inc.
Description: MOSFET
Packaging: Bulk
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8242+0.065 EUR
Mindestbestellmenge: 8242
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74AVC4T245PW-Q100118 74AVC4T245_Q100.pdf
74AVC4T245PW-Q100118
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 2
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 16-TSSOP
Part Status: Active
auf Bestellung 968 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
968+0.63 EUR
Mindestbestellmenge: 968
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TEA1998TS/1115 PHGL-S-A0003207591-1.pdf?t.download=true&u=5oefqw
TEA1998TS/1115
Hersteller: NXP USA Inc.
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Produkt ist nicht verfügbar
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TEA1993TS/1 PHGL-S-A0002428271-1.pdf?t.download=true&u=5oefqw
TEA1993TS/1
Hersteller: NXP USA Inc.
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Produkt ist nicht verfügbar
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TEA1993TS/1125 PHGL-S-A0002428271-1.pdf?t.download=true&u=5oefqw
TEA1993TS/1125
Hersteller: NXP USA Inc.
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Produkt ist nicht verfügbar
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TEA2208T/1J TEA2208T.pdf
TEA2208T/1J
Hersteller: NXP USA Inc.
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
Produkt ist nicht verfügbar
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TEA2208T/1J TEA2208T.pdf
TEA2208T/1J
Hersteller: NXP USA Inc.
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
auf Bestellung 2484 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.87 EUR
10+7.59 EUR
25+7.02 EUR
100+6.39 EUR
250+6.09 EUR
500+5.91 EUR
1000+5.76 EUR
Mindestbestellmenge: 2
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74AXP1G11GSH 74AXP1G11.pdf
74AXP1G11GSH
Hersteller: NXP USA Inc.
Description: IC GATE AND 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3249+0.15 EUR
Mindestbestellmenge: 3249
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IP3348CX20,135 IP3348CX5%2C10%2C15%2C20.pdf
IP3348CX20,135
Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Bulk
Package / Case: 20-UFBGA, WLCSP
Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Current: 20 mA
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.25 EUR
Mindestbestellmenge: 2049
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IP3088CX20,135 PHGLS19967-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 40NH/42PF ESD SMD
Packaging: Bulk
Package / Case: 20-WFBGA, WLCSP
Size / Dimension: 0.156" L x 0.050" W (3.96mm x 1.28mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 40nH (Total), C = 42pF (Total)
Height: 0.028" (0.70mm)
Attenuation Value: 40dB @ 800MHz ~ 1.5GHz
Filter Order: 5th
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Center / Cutoff Frequency: 175MHz (Cutoff)
Resistance - Channel (Ohms): 18
ESD Protection: Yes
Part Status: Active
Number of Channels: 8
Current: 30 mA
auf Bestellung 10902 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
807+0.62 EUR
Mindestbestellmenge: 807
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LPC1225FBD48/301EL LPC122X.pdf
LPC1225FBD48/301EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 1061 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.59 EUR
10+6.25 EUR
25+6.05 EUR
80+5.84 EUR
250+5.62 EUR
500+5.5 EUR
1000+5.25 EUR
Mindestbestellmenge: 2
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LPC1225FBD48/301151 PHGLS23259-1.pdf?t.download=true&u=5oefqw
LPC1225FBD48/301151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
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LPC1225FBD48/321151 PHGLS23259-1.pdf?t.download=true&u=5oefqw
LPC1225FBD48/321151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 80KB FLASH 48LQFP
Produkt ist nicht verfügbar
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BLF7G10L-250,112 PHGLS25424-1.pdf?t.download=true&u=5oefqw
BLF7G10L-250,112
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 30V LDMOST
Packaging: Tube
Package / Case: SOT-502A
Frequency: 920MHz ~ 960MHz
Power - Output: 60W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+181.78 EUR
Mindestbestellmenge: 3
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MC33FS4500LAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS4500LAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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BSC9131NXN7KHKB BSC913xNW.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Produkt ist nicht verfügbar
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T1023NXE7PQA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: QORIQ 2XCPU 64-BIT PWR ARCH 1.
Produkt ist nicht verfügbar
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SPC5606BF1MLQ6R MPC560XBFAMFS.pdf
SPC5606BF1MLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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MC9S08QA4CFQER MC9S08QA4.pdf
MC9S08QA4CFQER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF24301HR5
MRF24301HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS NI780
Packaging: Bulk
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
auf Bestellung 123 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+161.75 EUR
Mindestbestellmenge: 4
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A7102CHUK/T0BC2VAZ A71CH-LEAFLET.pdf
A7102CHUK/T0BC2VAZ
Hersteller: NXP USA Inc.
Description: SECURITY IC EXT TEMP WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 1721 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.79 EUR
10+4.36 EUR
25+4 EUR
100+3.61 EUR
250+3.42 EUR
500+3.31 EUR
1000+3.21 EUR
Mindestbestellmenge: 4
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A7102CHTK2/T0BC2CJ A71CH-LEAFLET.pdf
A7102CHTK2/T0BC2CJ
Hersteller: NXP USA Inc.
Description: SECURITY IC EXT TEMP HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
auf Bestellung 4822 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+5.93 EUR
10+4.47 EUR
25+4.1 EUR
100+3.7 EUR
250+3.51 EUR
500+3.39 EUR
1000+3.3 EUR
2500+3.2 EUR
Mindestbestellmenge: 3
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MIMXRT685SFAWBR RT600.pdf
MIMXRT685SFAWBR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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