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NTS0104GU12115 NXP USA Inc. NTS0104.pdf Description: DUAL SUPPLY TRANSLATING TRANSCEI
Produkt ist nicht verfügbar
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MC68306EH16B MC68306EH16B NXP USA Inc. MC68306.pdf Description: EC000 MICROPROCESSOR IC M683XX 1
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MC68306CEH16B MC68306CEH16B NXP USA Inc. MC68306.pdf Description: MICROPROCESSOR, 32-BIT, 16.67MHZ
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NTP53321G0JHKZ NTP53321G0JHKZ NXP USA Inc. NTP53x2.pdf Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-XQFN (1.8x2.6)
Writable Memory: 16kb (User)
Part Status: Active
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10+2 EUR
25+1.89 EUR
100+1.74 EUR
250+1.64 EUR
500+1.58 EUR
1000+1.51 EUR
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TEF6901AH/V5S TEF6901AH/V5S NXP USA Inc. Description: TEF6901AH - INTEGRATED CAR RADIO
Packaging: Bulk
Part Status: Active
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TWR-KV58F220M TWR-KV58F220M NXP USA Inc. TWR-KV58F220M.pdf Description: TOWER SYSTEM KV5X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: KV5x
Platform: Tower System
Part Status: Active
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S9KEAZN8AVTGR S9KEAZN8AVTGR NXP USA Inc. Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
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FRDM-KEAZN32Q64 FRDM-KEAZN32Q64 NXP USA Inc. FRDM-KEAQSG.pdf Description: FREEDOM KEA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KEA
Platform: Freedom
Part Status: Active
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LPC54016JET100E LPC54016JET100E NXP USA Inc. LPC540xx.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
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SLN-LOCAL2-IOT SLN-LOCAL2-IOT NXP USA Inc. getting-started-with-the-nxp-edgeready-mcu-based-solution-for-local-voice-control:GS-SLN-LOCAL2-IOT Description: EVAL BOARD FOR RT106S
Packaging: Bulk
Function: Voice Recognition
Type: Audio
Utilized IC / Part: RT106S
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s), Cable(s)
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MIMXRT106ADVL6B MIMXRT106ADVL6B NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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MIMXRT106ACVL5B MIMXRT106ACVL5B NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 128KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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LS1084AXE7PTA NXP USA Inc. Description: IC MPU QORLQ LS1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
Produkt ist nicht verfügbar
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TDA18204HN/C1 NXP USA Inc. PHGLS28428-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D Description: MICROPROCESSOR CIRCUIT, CMOS, PQ
auf Bestellung 2085 Stücke:
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74AVC1T45GW-Q100125 74AVC1T45GW-Q100125 NXP USA Inc. 74AVC1T45_Q100.pdf Description: BUS TRANSCEIVER, AVC SERIES
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74AVCH1T45GW-Q100125 74AVCH1T45GW-Q100125 NXP USA Inc. 74AVCH1T45_Q100.pdf Description: BUS TRANSCEIVER, AVC SERIES
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LPC1115FET48/303151 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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98+5.4 EUR
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MCIMX6Y1CVK05AB MCIMX6Y1CVK05AB NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, I2C, SPI, UART
auf Bestellung 520 Stücke:
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10+18.93 EUR
25+17.68 EUR
100+16.3 EUR
260+15.62 EUR
520+15.22 EUR
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PTN5110THQZ PTN5110THQZ NXP USA Inc. Description: IC INTFACE SPECIALIZED 16HX2QFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Applications: USB
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Part Status: Obsolete
Produkt ist nicht verfügbar
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PTN5110DHQ NXP USA Inc. PHGL-S-A0004665836-1.pdf?t.download=true&u=5oefqw Description: USB TYPE-C REV 3.0 PD PHY, DONGL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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OM13585UL NXP USA Inc. Description: EVAL BOARD FOR PTN5110
Packaging: Bulk
Function: USB Type-C®
Type: Power Management
Contents: Board(s)
Utilized IC / Part: PTN5110
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM13586UL NXP USA Inc. PTN5110_DS.pdf Description: PTN5110 DOCK DEMO BOARD
Packaging: Bulk
Function: USB Type-C®
Type: Power Management
Utilized IC / Part: PTN5110
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM13587-PTN5110K NXP USA Inc. Description: H AND D BD OM13587
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM13587JP NXP USA Inc. PTN5110_DS.pdf Description: PTN5110 TYPE-C DEMO KIT
Packaging: Bulk
Function: USB Type-C®
Type: Power Management
Utilized IC / Part: PTN5110
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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MIMX8UX5CVLDZAC NXP USA Inc. Description: I.MX8 QXP 21X21
Produkt ist nicht verfügbar
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GC33661PEFR2518 NXP USA Inc. Description: GC33661PEFR2518
Produkt ist nicht verfügbar
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PC33661PEF NXP USA Inc. Description: IC INTERFACE SPECIALIZED 8SOIC
Produkt ist nicht verfügbar
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PC33661PEFR2 NXP USA Inc. Description: IC INTERFACE SPECIALIZED 8SOIC
Produkt ist nicht verfügbar
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74LVC1G11GV132 74LVC1G11GV132 NXP USA Inc. PHGL-S-A0001284340-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND
Packaging: Bulk
Package / Case: SOT-23-6 Thin, TSOT-23-6
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
Produkt ist nicht verfügbar
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S912ZVML32F1WKHR S912ZVML32F1WKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Produkt ist nicht verfügbar
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AFSC5G37D37-EVB AFSC5G37D37-EVB NXP USA Inc. AFSC5G37D37.pdf Description: AFSC5G37D37 REF BOARD 3600-3800
Packaging: Bulk
For Use With/Related Products: AFSC5G37D37
Frequency: 3.6GHz ~ 3.8GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G37D37
Supplied Contents: Board(s)
auf Bestellung 2 Stücke:
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1+374.48 EUR
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AFSC5G35D35-EVB AFSC5G35D35-EVB NXP USA Inc. AFSC5G35D35.pdf Description: AFSC5G35D35 REF BOARD 3400-3600
Packaging: Bulk
Frequency: 3.4GHz ~ 3.6GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G35D35
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AFSC5G23D37-EVB NXP USA Inc. AFSC5G23D37.pdf Description: AFSC5G23D37 REF BOARD 2300-2400
Packaging: Bulk
For Use With/Related Products: AFSC5G23D37
Frequency: 3.4GHz ~ 3.6GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G23D37
Supplied Contents: Board(s)
Part Status: Active
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ADC1213D125HN/C1,1 ADC1213D125HN/C1,1 NXP USA Inc. DS_568_ADC1213D.pdf Description: IC ADC 12BIT PIPELINED 56HVQFN
Features: Simultaneous Sampling
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: JESD204A
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 1.65V ~ 1.95V
Sampling Rate (Per Second): 125M
Input Type: Differential, Single Ended
Number of Inputs: 2
Supplier Device Package: 56-HVQFN (8x8)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Part Status: Obsolete
Number of A/D Converters: 2
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9+63.4 EUR
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BUK7E2R3-40C,127 NXP USA Inc. BUK7E2R3-40C.pdf Description: MOSFET N-CH 40V 100A I2PAK
Packaging: Tube
auf Bestellung 4893 Stücke:
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310+1.71 EUR
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74LVTH32245EC,551 74LVTH32245EC,551 NXP USA Inc. PHGLS15320-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 96LFBGA
auf Bestellung 10680 Stücke:
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74LVTH32245EC,518 74LVTH32245EC,518 NXP USA Inc. PHGLS15320-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 96LFBGA
auf Bestellung 10500 Stücke:
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74LVTH322245EC,551 74LVTH322245EC,551 NXP USA Inc. 74LVTH322245.pdf Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
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74+6.59 EUR
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SC16C850LIET,115 SC16C850LIET,115 NXP USA Inc. PHGLS22259-1.pdf?t.download=true&u=5oefqw Description: IC UART SINGLE W/FIFO 36TFBGA
auf Bestellung 83000 Stücke:
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150+3.3 EUR
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SC16C852SVIET151 NXP USA Inc. PHGLS22260-1.pdf?t.download=true&u=5oefqw Description: SERIAL I/O CONTROLLER
Packaging: Bulk
Package / Case: 36-TFBGA
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 1.8V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 20Mbps
Supplier Device Package: 36-TFBGA (3.5x3.5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
auf Bestellung 393 Stücke:
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122+4.33 EUR
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MK70FN1M0VMJ12R MK70FN1M0VMJ12R NXP USA Inc. Description: IC MCU 32BIT 1MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 71x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HC4060PW-Q100118 74HC4060PW-Q100118 NXP USA Inc. 74HC_HCT4060_Q100.pdf Description: IC BINARY COUNTER 14BIT 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-TSSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Count Rate: 95 MHz
Number of Bits per Element: 14
Produkt ist nicht verfügbar
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74AUP1G126GM/S500115 74AUP1G126GM/S500115 NXP USA Inc. PHGLS24874-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
auf Bestellung 1395400 Stücke:
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3620+0.14 EUR
Mindestbestellmenge: 3620
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74AUP1T97GM/S500115 74AUP1T97GM/S500115 NXP USA Inc. PHGL-S-A0001284678-1.pdf?t.download=true&u=5oefqw Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Features: Configurable Gate Logic Functions
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 6-XSON (1.45x1)
Channel Type: Unidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.8 V ~ 2.7 V
Voltage - VCCB: 2.3 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
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NTS0101GW125 NTS0101GW125 NXP USA Inc. NTS0101.pdf Description: DUAL SUPPLY TRANSLATING TRANSCEI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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NTS0102GF/S500115 NTS0102GF/S500115 NXP USA Inc. PHGLS25975-1.pdf?t.download=true&u=5oefqw Description: TXRX TRANSLATING DUAL 8XSON
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE04Z128VLD4R MKE04Z128VLD4R NXP USA Inc. MKE04P80M48SF0.pdf Description: KINETIS KE04 48MHZ CORTEX-M0+ 5V
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
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PDTA123YMB315 PDTA123YMB315 NXP USA Inc. PDTA123YMB.pdf Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 35 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
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MCIMX6D4AVT10AC-NXP NXP USA Inc. PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw Description: I.MX 6 SERIES 32 BIT MPU, DUAL A
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LPC4310FBD144,551 LPC4310FBD144,551 NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
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LPC43S30FBD144551 LPC43S30FBD144551 NXP USA Inc. PHGL-S-A0001691624-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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LPC4313JBD144551 LPC4313JBD144551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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LPC4333JET256 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 256LBGA
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LPC43S57JBD208 NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 208LQFP
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LPC43S37JBD144551 LPC43S37JBD144551 NXP USA Inc. LPC43S5X_S3X.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T4161NSN7TTB NXP USA Inc. T4240T4160FS.pdf Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
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74AXP1G02GMH 74AXP1G02GMH NXP USA Inc. 74AXP1G02.pdf Description: 74AXP1G02 - LOW-POWER 2-INPUT NO
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.6V
Input Logic Level - Low: 0.7V
Max Propagation Delay @ V, Max CL: 2.8ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
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LPC1115FET48/303EL LPC1115FET48/303EL NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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GTL2008PW,118 GTL2008PW,118 NXP USA Inc. GTL2008.pdf Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL, GTL
Translator Type: Mixed Signal
Channels per Circuit: 12
Input Signal: GTL, LVTTL
Part Status: Obsolete
Number of Circuits: 1
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NX3L2G384GM,125 NX3L2G384GM,125 NXP USA Inc. NX3L2G384.pdf Description: IC SW SPST-NCX2 750MOHM 8XQFNU
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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NTS0104GU12115 NTS0104.pdf
Hersteller: NXP USA Inc.
Description: DUAL SUPPLY TRANSLATING TRANSCEI
Produkt ist nicht verfügbar
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MC68306EH16B MC68306.pdf
MC68306EH16B
Hersteller: NXP USA Inc.
Description: EC000 MICROPROCESSOR IC M683XX 1
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MC68306CEH16B MC68306.pdf
MC68306CEH16B
Hersteller: NXP USA Inc.
Description: MICROPROCESSOR, 32-BIT, 16.67MHZ
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NTP53321G0JHKZ NTP53x2.pdf
NTP53321G0JHKZ
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-XQFN (1.8x2.6)
Writable Memory: 16kb (User)
Part Status: Active
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8+2.34 EUR
10+2 EUR
25+1.89 EUR
100+1.74 EUR
250+1.64 EUR
500+1.58 EUR
1000+1.51 EUR
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TEF6901AH/V5S
TEF6901AH/V5S
Hersteller: NXP USA Inc.
Description: TEF6901AH - INTEGRATED CAR RADIO
Packaging: Bulk
Part Status: Active
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TWR-KV58F220M TWR-KV58F220M.pdf
TWR-KV58F220M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KV5X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: KV5x
Platform: Tower System
Part Status: Active
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S9KEAZN8AVTGR
S9KEAZN8AVTGR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM-KEAZN32Q64 FRDM-KEAQSG.pdf
FRDM-KEAZN32Q64
Hersteller: NXP USA Inc.
Description: FREEDOM KEA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KEA
Platform: Freedom
Part Status: Active
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LPC54016JET100E LPC540xx.pdf
LPC54016JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SLN-LOCAL2-IOT getting-started-with-the-nxp-edgeready-mcu-based-solution-for-local-voice-control:GS-SLN-LOCAL2-IOT
SLN-LOCAL2-IOT
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR RT106S
Packaging: Bulk
Function: Voice Recognition
Type: Audio
Utilized IC / Part: RT106S
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s), Cable(s)
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MIMXRT106ADVL6B IMXRT1060CEC.pdf
MIMXRT106ADVL6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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1+25.56 EUR
10+18.33 EUR
25+16.48 EUR
80+14.68 EUR
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MIMXRT106ACVL5B IMXRT1060IEC.pdf
MIMXRT106ACVL5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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1+24.99 EUR
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25+18.49 EUR
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LS1084AXE7PTA
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ LS1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
Produkt ist nicht verfügbar
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TDA18204HN/C1 PHGLS28428-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D
Hersteller: NXP USA Inc.
Description: MICROPROCESSOR CIRCUIT, CMOS, PQ
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74AVC1T45GW-Q100125 74AVC1T45_Q100.pdf
74AVC1T45GW-Q100125
Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER, AVC SERIES
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74AVCH1T45GW-Q100125 74AVCH1T45_Q100.pdf
74AVCH1T45GW-Q100125
Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER, AVC SERIES
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LPC1115FET48/303151 PHGLS29859-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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98+5.4 EUR
Mindestbestellmenge: 98
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MCIMX6Y1CVK05AB IMX6ULLIEC.pdf
MCIMX6Y1CVK05AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, I2C, SPI, UART
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+23.95 EUR
10+18.93 EUR
25+17.68 EUR
100+16.3 EUR
260+15.62 EUR
520+15.22 EUR
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PTN5110THQZ
PTN5110THQZ
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 16HX2QFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Applications: USB
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Part Status: Obsolete
Produkt ist nicht verfügbar
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PTN5110DHQ PHGL-S-A0004665836-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: USB TYPE-C REV 3.0 PD PHY, DONGL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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OM13585UL
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PTN5110
Packaging: Bulk
Function: USB Type-C®
Type: Power Management
Contents: Board(s)
Utilized IC / Part: PTN5110
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM13586UL PTN5110_DS.pdf
Hersteller: NXP USA Inc.
Description: PTN5110 DOCK DEMO BOARD
Packaging: Bulk
Function: USB Type-C®
Type: Power Management
Utilized IC / Part: PTN5110
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM13587-PTN5110K
Hersteller: NXP USA Inc.
Description: H AND D BD OM13587
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM13587JP PTN5110_DS.pdf
Hersteller: NXP USA Inc.
Description: PTN5110 TYPE-C DEMO KIT
Packaging: Bulk
Function: USB Type-C®
Type: Power Management
Utilized IC / Part: PTN5110
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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MIMX8UX5CVLDZAC
Hersteller: NXP USA Inc.
Description: I.MX8 QXP 21X21
Produkt ist nicht verfügbar
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GC33661PEFR2518
Hersteller: NXP USA Inc.
Description: GC33661PEFR2518
Produkt ist nicht verfügbar
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PC33661PEF
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Produkt ist nicht verfügbar
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PC33661PEFR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Produkt ist nicht verfügbar
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74LVC1G11GV132 PHGL-S-A0001284340-1.pdf?t.download=true&u=5oefqw
74LVC1G11GV132
Hersteller: NXP USA Inc.
Description: IC GATE AND
Packaging: Bulk
Package / Case: SOT-23-6 Thin, TSOT-23-6
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
Produkt ist nicht verfügbar
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S912ZVML32F1WKHR S12ZVMFS.pdf
S912ZVML32F1WKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Produkt ist nicht verfügbar
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AFSC5G37D37-EVB AFSC5G37D37.pdf
AFSC5G37D37-EVB
Hersteller: NXP USA Inc.
Description: AFSC5G37D37 REF BOARD 3600-3800
Packaging: Bulk
For Use With/Related Products: AFSC5G37D37
Frequency: 3.6GHz ~ 3.8GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G37D37
Supplied Contents: Board(s)
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+374.48 EUR
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AFSC5G35D35-EVB AFSC5G35D35.pdf
AFSC5G35D35-EVB
Hersteller: NXP USA Inc.
Description: AFSC5G35D35 REF BOARD 3400-3600
Packaging: Bulk
Frequency: 3.4GHz ~ 3.6GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G35D35
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+591.71 EUR
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AFSC5G23D37-EVB AFSC5G23D37.pdf
Hersteller: NXP USA Inc.
Description: AFSC5G23D37 REF BOARD 2300-2400
Packaging: Bulk
For Use With/Related Products: AFSC5G23D37
Frequency: 3.4GHz ~ 3.6GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G23D37
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+374.48 EUR
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ADC1213D125HN/C1,1 DS_568_ADC1213D.pdf
ADC1213D125HN/C1,1
Hersteller: NXP USA Inc.
Description: IC ADC 12BIT PIPELINED 56HVQFN
Features: Simultaneous Sampling
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: JESD204A
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 1.65V ~ 1.95V
Sampling Rate (Per Second): 125M
Input Type: Differential, Single Ended
Number of Inputs: 2
Supplier Device Package: 56-HVQFN (8x8)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Part Status: Obsolete
Number of A/D Converters: 2
auf Bestellung 44 Stücke:
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Anzahl Preis
9+63.4 EUR
Mindestbestellmenge: 9
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BUK7E2R3-40C,127 BUK7E2R3-40C.pdf
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 100A I2PAK
Packaging: Tube
auf Bestellung 4893 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
310+1.71 EUR
Mindestbestellmenge: 310
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74LVTH32245EC,551 PHGLS15320-1.pdf?t.download=true&u=5oefqw
74LVTH32245EC,551
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
auf Bestellung 10680 Stücke:
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74LVTH32245EC,518 PHGLS15320-1.pdf?t.download=true&u=5oefqw
74LVTH32245EC,518
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
auf Bestellung 10500 Stücke:
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74LVTH322245EC,551 74LVTH322245.pdf
74LVTH322245EC,551
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
auf Bestellung 570 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
74+6.59 EUR
Mindestbestellmenge: 74
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SC16C850LIET,115 PHGLS22259-1.pdf?t.download=true&u=5oefqw
SC16C850LIET,115
Hersteller: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 36TFBGA
auf Bestellung 83000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
150+3.3 EUR
Mindestbestellmenge: 150
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SC16C852SVIET151 PHGLS22260-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: SERIAL I/O CONTROLLER
Packaging: Bulk
Package / Case: 36-TFBGA
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 1.8V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 20Mbps
Supplier Device Package: 36-TFBGA (3.5x3.5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
auf Bestellung 393 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
122+4.33 EUR
Mindestbestellmenge: 122
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MK70FN1M0VMJ12R
MK70FN1M0VMJ12R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 71x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HC4060PW-Q100118 74HC_HCT4060_Q100.pdf
74HC4060PW-Q100118
Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 14BIT 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-TSSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Count Rate: 95 MHz
Number of Bits per Element: 14
Produkt ist nicht verfügbar
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74AUP1G126GM/S500115 PHGLS24874-1.pdf?t.download=true&u=5oefqw
74AUP1G126GM/S500115
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
auf Bestellung 1395400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3620+0.14 EUR
Mindestbestellmenge: 3620
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74AUP1T97GM/S500115 PHGL-S-A0001284678-1.pdf?t.download=true&u=5oefqw
74AUP1T97GM/S500115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Features: Configurable Gate Logic Functions
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 6-XSON (1.45x1)
Channel Type: Unidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.8 V ~ 2.7 V
Voltage - VCCB: 2.3 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 591589 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2686+0.19 EUR
Mindestbestellmenge: 2686
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NTS0101GW125 NTS0101.pdf
NTS0101GW125
Hersteller: NXP USA Inc.
Description: DUAL SUPPLY TRANSLATING TRANSCEI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 10918 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1013+0.53 EUR
Mindestbestellmenge: 1013
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NTS0102GF/S500115 PHGLS25975-1.pdf?t.download=true&u=5oefqw
NTS0102GF/S500115
Hersteller: NXP USA Inc.
Description: TXRX TRANSLATING DUAL 8XSON
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE04Z128VLD4R MKE04P80M48SF0.pdf
MKE04Z128VLD4R
Hersteller: NXP USA Inc.
Description: KINETIS KE04 48MHZ CORTEX-M0+ 5V
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1500+4.69 EUR
Mindestbestellmenge: 1500
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PDTA123YMB315 PDTA123YMB.pdf
PDTA123YMB315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 35 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
auf Bestellung 97600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11225+0.048 EUR
Mindestbestellmenge: 11225
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MCIMX6D4AVT10AC-NXP PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32 BIT MPU, DUAL A
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)
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LPC4310FBD144,551 LPC4350_30_20_10.pdf
LPC4310FBD144,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
39+14.41 EUR
Mindestbestellmenge: 39
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LPC43S30FBD144551 PHGL-S-A0001691624-1.pdf?t.download=true&u=5oefqw
LPC43S30FBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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LPC4313JBD144551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
LPC4313JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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LPC4333JET256
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 256LBGA
auf Bestellung 2674 Stücke:
Lieferzeit 10-14 Tag (e)
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LPC43S57JBD208
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208LQFP
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
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LPC43S37JBD144551 LPC43S5X_S3X.pdf
LPC43S37JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T4161NSN7TTB T4240T4160FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
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74AXP1G02GMH 74AXP1G02.pdf
74AXP1G02GMH
Hersteller: NXP USA Inc.
Description: 74AXP1G02 - LOW-POWER 2-INPUT NO
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.6V
Input Logic Level - Low: 0.7V
Max Propagation Delay @ V, Max CL: 2.8ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
auf Bestellung 175639 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3699+0.13 EUR
Mindestbestellmenge: 3699
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LPC1115FET48/303EL LPC1102_1104.pdf
LPC1115FET48/303EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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GTL2008PW,118 GTL2008.pdf
GTL2008PW,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL, GTL
Translator Type: Mixed Signal
Channels per Circuit: 12
Input Signal: GTL, LVTTL
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 12114 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
245+2.06 EUR
Mindestbestellmenge: 245
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NX3L2G384GM,125 NX3L2G384.pdf
NX3L2G384GM,125
Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX2 750MOHM 8XQFNU
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
auf Bestellung 1818 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
14+1.3 EUR
19+0.93 EUR
25+0.83 EUR
100+0.73 EUR
250+0.68 EUR
500+0.65 EUR
1000+0.63 EUR
Mindestbestellmenge: 14
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