Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36265) > Seite 594 nach 605
| Foto | Bezeichnung | Hersteller | Beschreibung |
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BAS40-05,215 | NXP USA Inc. |
 Description: DIODE SCHOTTKY 40V 120MA TO236ABPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BTA201-600E,112 | NXP USA Inc. |
Description: TRIAC 600V 1A TO-92 Packaging: Bulk |
Produkt ist nicht verfügbar |
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NVT4556BUKZ | NXP USA Inc. |
Description: SIM CARD INTERFACE LEVEL TRANSLA Packaging: Bulk |
auf Bestellung 3957 Stücke: Lieferzeit 10-14 Tag (e) |
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BAS85,135 | NXP USA Inc. |
Description: DIODE SCHOTTKY 30V 200MA SOD80C Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PHE13007,127 | NXP USA Inc. |
Description: TRANS NPN 400V 8A TO-220AB Packaging: Tube |
Produkt ist nicht verfügbar |
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MWPR1516CFM | NXP USA Inc. |
Description: IC RECEIVER 16KB FLASH 32QFN Packaging: Tray Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.5V ~ 20V Applications: Wireless Power Receiver Current - Supply: 120mA Supplier Device Package: 32-QFN (5x5) |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| S32K358NHT1VPCST | NXP USA Inc. |
Description: 8MB,1152KB RAM,ASIL-D,+125C,172H Packaging: Tray Package / Case: 172-QFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 8MB (8M x 8) RAM Size: 1.125M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7F Data Converters: A/D 24x12b SAR Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP-EP Grade: Automotive Number of I/O: 142 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC13213 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 71LGA Packaging: Tray Package / Case: 71-VFLGA Exposed Pad Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 60kB Flash, 4kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 3.4V Power - Output: 3dBm Protocol: Zigbee® Current - Receiving: 37mA Data Rate (Max): 250kbps Current - Transmitting: 30mA Supplier Device Package: 71-LGA (9x9) GPIO: 32 Modulation: DSSS, O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MSC8152TAG1000B | NXP USA Inc. |
Description: IC DSP 2X 1GHZ SC3850 783FCBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Type: SC3850 Dual Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (96KB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Clock Rate: 1GHz Supplier Device Package: 783-FCPBGA (29x29) |
Produkt ist nicht verfügbar |
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MC705JJ7CDWE | NXP USA Inc. |
Description: IC MCU 8BIT 6KB OTP 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 6KB (6K x 8) RAM Size: 224 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Data Converters: A/D 4x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SIO Peripherals: POR, Temp Sensor, WDT Supplier Device Package: 20-SOIC Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCHSC705C8ACPE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB OTP 40DIP Packaging: Tube Package / Case: 40-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 8KB (8K x 8) RAM Size: 304 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 40-PDIP Number of I/O: 24 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC705K1CP | NXP USA Inc. |
Description: IC MCU 8BIT 512B OTP 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 512B (512 x 8) RAM Size: 32 x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: LVD, POR, WDT Supplier Device Package: 16-PDIP Number of I/O: 10 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HRC705J1ACPE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 4.2MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 20-PDIP Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P89LPC904FD,529 | NXP USA Inc. |
Description: IC MCU 8BIT 1KB FLASH 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 12MHz Program Memory Size: 1KB (1K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, WDT Supplier Device Package: 8-SO Number of I/O: 6 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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N74F244D,602 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 20-SO Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 20-SO |
Produkt ist nicht verfügbar |
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N74F244DB,112 | NXP USA Inc. |
Description: IC BUFF NON-INVERT 5.5V 20-SSOP Packaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 20-SSOP |
Produkt ist nicht verfügbar |
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N74F244D,623 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 20-SO Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 20-SO |
Produkt ist nicht verfügbar |
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N74F245D,602 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 5.5V 20-SO Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 3mA, 24mA; 15mA, 64mA Supplier Device Package: 20-SO |
Produkt ist nicht verfügbar |
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N74F245N,602 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 5.5V 20-DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 3mA, 24mA; 15mA, 64mA Supplier Device Package: 20-DIP |
Produkt ist nicht verfügbar |
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74ABT74DB,112 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14SSOP Packaging: Tube |
Produkt ist nicht verfügbar |
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74ABT74PW,112 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14TSSOP Packaging: Tube |
Produkt ist nicht verfügbar |
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74ABT74D,112 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14SO Packaging: Tube |
Produkt ist nicht verfügbar |
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74ABT74D,118 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14SO Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BCX52,115 | NXP USA Inc. |
Description: TRANSISTOR PNP 60V 1A SOT89 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74HCT4051PW,112 | NXP USA Inc. |
Description: IC MUX/DEMUX 8X1 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 120Ohm -3db Bandwidth: 180MHz Supplier Device Package: 16-TSSOP Voltage - Supply, Single (V+): 4.5V ~ 5.5V Voltage - Supply, Dual (V±): ±1V ~ 5V Switch Time (Ton, Toff) (Max): 39ns, 32ns Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 400nA Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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74HCT4051DB,112 | NXP USA Inc. |
Description: IC MUX/DEMUX 8X1 16SSOP Packaging: Tube |
Produkt ist nicht verfügbar |
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| BZX79-C3V3,133 | NXP USA Inc. |
Description: DIODE ZENER 3.3V 400MW ALF2 Packaging: Tape & Box (TB) |
Produkt ist nicht verfügbar |
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| NAFE33352B40BSMP | NXP USA Inc. |
Description: IC Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 2.97V ~ 3.63V Voltage - Supply, Digital: 2.97V ~ 3.63V Supplier Device Package: 40-HVQFN (6x6) Number of Channels: 2 |
Produkt ist nicht verfügbar |
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MPC8260ACZUMIBB | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
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MC9S08QE32CFM | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 26 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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| BTA208S-600D,118 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 8A DPAK Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BTA208S-600F,118 | NXP USA Inc. |
Description: TRIAC 600V 8A DPAK Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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BTA208S-800B,118 | NXP USA Inc. |
Description: TRIAC 800V 8A DPAK Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BTA208S-600E,118 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 8A DPAK Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BTA208X-800B,127 | NXP USA Inc. |
Description: TRIAC 800V 8A TO220F Packaging: Tube |
Produkt ist nicht verfügbar |
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| BTA208X-600F,127 | NXP USA Inc. |
Description: TRIAC 600V 8A TO220-3 Packaging: Tube |
Produkt ist nicht verfügbar |
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| BTA208-600B,127 | NXP USA Inc. |
Description: TRIAC 600V 8A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
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JN5139-XK006 | NXP USA Inc. |
 Description: ROUTER 6LOWPAN ETHERNETFrequency: 2.4GHz Type: Transceiver; 802.15.4 (ZigBee®) Contents: Board(s), Cable(s) Utilized IC / Part: JN5139 |
Produkt ist nicht verfügbar |
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| BZV85-C27,113 | NXP USA Inc. |
Description: DIODE ZENER 27V 1.3W DO41 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74HC14DB,118 | NXP USA Inc. |
Description: IC HEX INV SCHMITT TRIG 14SSOP Features: Schmitt Trigger Packaging: Tape & Reel (TR) Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 1 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.3V ~ 1.2V Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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MC68MH360AI33L | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 240FQFP Packaging: Tray Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 33MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: SCC, SMC, SPI |
Produkt ist nicht verfügbar |
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| BZV55-C43,115 | NXP USA Inc. |
Description: DIODE ZENER 43V 500MW LLDS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BT134-600G,127 | NXP USA Inc. |
Description: TRIAC 600V 4A SOT82-3 Packaging: Tube Package / Case: SOT-82 Mounting Type: Through Hole Triac Type: Standard Configuration: Single Operating Temperature: 125°C (TJ) Current - Hold (Ih) (Max): 30 mA Current - Gate Trigger (Igt) (Max): 50 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A Voltage - Gate Trigger (Vgt) (Max): 1.5 V Supplier Device Package: SOT-82-3 Current - On State (It (RMS)) (Max): 4 A Voltage - Off State: 600 V |
Produkt ist nicht verfügbar |
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Z0103MN,135 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 1A SC73 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MWCT1200CFM | NXP USA Inc. |
Description: IC MULTI COIL 5W 5V 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V Applications: Wireless Power Transmitter Current - Supply: 300µA Supplier Device Package: 32-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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MPF5300AMBA0ES | NXP USA Inc. |
Description: IC REG BUCK ADJ 12A 24HWQFN Packaging: Tray Package / Case: 24-PowerWFQFN Output Type: Adjustable Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 1 Function: Step-Down Current - Output: 12A Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Positive Frequency - Switching: 2MHz ~ 3MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 24-HWQFN (4.5x3.5) Synchronous Rectifier: No Voltage - Output (Max): 1.2V Voltage - Input (Min): 2.7V Voltage - Output (Min/Fixed): 0.5V |
Produkt ist nicht verfügbar |
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| MVR5510AVMALTS | NXP USA Inc. |
Description: PMIC, 3BUCK , 3 LDOS,BOOST Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 60V Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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S912XET256BVAG | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74LVC1G80GV,125 | NXP USA Inc. |
Description: IC D-TYPE POS TRG SNGL SC74A Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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UBA2024BT/N1,518 | NXP USA Inc. |
Description: IC CFL/TL DRIVER 42.68KHZ 14SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 14-SO Dimming: No Current - Output Source/Sink: 2.5A Current - Supply: 5 mA |
Produkt ist nicht verfügbar |
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HEF4011BT,653 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SO Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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HEF4011BT,652 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SO Packaging: Tube |
Produkt ist nicht verfügbar |
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HEF4081BT,653 | NXP USA Inc. |
Description: IC GATE AND 4CH 2-INP 14-SO Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74HCT173DB,112 | NXP USA Inc. |
Description: IC FF D-TYPE SINGLE 4BIT 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 6mA, 6mA Trigger Type: Positive Edge Clock Frequency: 80 MHz Input Capacitance: 3.5 pF Supplier Device Package: 16-SSOP Max Propagation Delay @ V, Max CL: 40ns @ 4.5V, 50pF Number of Bits per Element: 4 |
Produkt ist nicht verfügbar |
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74HCT173D,653 | NXP USA Inc. |
Description: IC FF D-TYPE SINGLE 4-BIT 16-SO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 6mA, 6mA Trigger Type: Positive Edge Clock Frequency: 80 MHz Input Capacitance: 3.5 pF Supplier Device Package: 16-SO Max Propagation Delay @ V, Max CL: 40ns @ 4.5V, 50pF Number of Bits per Element: 4 |
Produkt ist nicht verfügbar |
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74HC390DB,112 | NXP USA Inc. |
Description: IC DUAL DECADE RIPP COUNT 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Counter, Decade Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Negative Edge Supplier Device Package: 16-SSOP Voltage - Supply: 2 V ~ 6 V Count Rate: 71 MHz Number of Bits per Element: 4 |
Produkt ist nicht verfügbar |
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74HC390D,652 | NXP USA Inc. |
Description: IC DUAL DECADE RIPP COUNT 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Counter, Decade Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Negative Edge Supplier Device Package: 16-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 71 MHz Number of Bits per Element: 4 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
 |
74HC390PW,112 | NXP USA Inc. |
Description: IC DUAL DEC RIPPLE COUNT 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Counter, Decade Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Negative Edge Supplier Device Package: 16-TSSOP Voltage - Supply: 2 V ~ 6 V Count Rate: 71 MHz Number of Bits per Element: 4 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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|
74HC4017DB,112 | NXP USA Inc. |
Description: IC DECADE COUNTER 10BIT 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Counter, Decade Reset: Asynchronous Operating Temperature: -40°C ~ 125°C (TA) Direction: Up Trigger Type: Positive, Negative Timing: Synchronous Supplier Device Package: 16-SSOP Voltage - Supply: 2 V ~ 6 V Count Rate: 83 MHz Number of Bits per Element: 10 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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74HC4017D,652 | NXP USA Inc. |
Description: IC DECADE COUNTER 10BIT 16SO Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Counter, Decade Reset: Asynchronous Operating Temperature: -40°C ~ 125°C (TA) Direction: Up Trigger Type: Positive, Negative Timing: Synchronous Supplier Device Package: 16-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 83 MHz Number of Bits per Element: 10 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| NVT4556BUKZ |
|
auf Bestellung 3957 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 270+ | 1.65 EUR |
| MWPR1516CFM |
Hersteller: NXP USA Inc.
Description: IC RECEIVER 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.5V ~ 20V
Applications: Wireless Power Receiver
Current - Supply: 120mA
Supplier Device Package: 32-QFN (5x5)
Description: IC RECEIVER 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.5V ~ 20V
Applications: Wireless Power Receiver
Current - Supply: 120mA
Supplier Device Package: 32-QFN (5x5)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.71 EUR |
| S32K358NHT1VPCST |
|
Hersteller: NXP USA Inc.
Description: 8MB,1152KB RAM,ASIL-D,+125C,172H
Packaging: Tray
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Description: 8MB,1152KB RAM,ASIL-D,+125C,172H
Packaging: Tray
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC13213 |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 71LGA
Packaging: Tray
Package / Case: 71-VFLGA Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 60kB Flash, 4kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 3dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 71-LGA (9x9)
GPIO: 32
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 71LGA
Packaging: Tray
Package / Case: 71-VFLGA Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 60kB Flash, 4kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 3dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 71-LGA (9x9)
GPIO: 32
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI
DigiKey Programmable: Not Verified
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| MSC8152TAG1000B |
|
Hersteller: NXP USA Inc.
Description: IC DSP 2X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Dual Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Description: IC DSP 2X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Dual Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
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| MC705JJ7CDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 6KB OTP 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 6KB OTP 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
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| MCHSC705C8ACPE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 24
DigiKey Programmable: Not Verified
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| MC68HC705K1CP |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 512B OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 512B (512 x 8)
RAM Size: 32 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 10
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 512B OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 512B (512 x 8)
RAM Size: 32 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 10
DigiKey Programmable: Not Verified
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| MC68HRC705J1ACPE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4.2MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4.2MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 14
DigiKey Programmable: Not Verified
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| P89LPC904FD,529 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 8-SO
Number of I/O: 6
DigiKey Programmable: Verified
Description: IC MCU 8BIT 1KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 8-SO
Number of I/O: 6
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| N74F244D,602 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
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| N74F244DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SSOP
Description: IC BUFF NON-INVERT 5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SSOP
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| N74F244D,623 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
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| N74F245D,602 |
|
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-SO
Description: IC TXRX NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-SO
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| N74F245N,602 |
|
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-DIP
Description: IC TXRX NON-INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74HCT4051PW,112 |
|
Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX 8X1 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 180MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Switch Time (Ton, Toff) (Max): 39ns, 32ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 400nA
Number of Circuits: 1
Description: IC MUX/DEMUX 8X1 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 180MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Switch Time (Ton, Toff) (Max): 39ns, 32ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 400nA
Number of Circuits: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
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| NAFE33352B40BSMP |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.63V
Voltage - Supply, Digital: 2.97V ~ 3.63V
Supplier Device Package: 40-HVQFN (6x6)
Number of Channels: 2
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.63V
Voltage - Supply, Digital: 2.97V ~ 3.63V
Supplier Device Package: 40-HVQFN (6x6)
Number of Channels: 2
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC8260ACZUMIBB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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| MC9S08QE32CFM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 26
DigiKey Programmable: Verified
Description: IC MCU 8BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 26
DigiKey Programmable: Verified
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| JN5139-XK006 | |
|
Hersteller: NXP USA Inc.
Description: ROUTER 6LOWPAN ETHERNET
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Contents: Board(s), Cable(s)
Utilized IC / Part: JN5139
Description: ROUTER 6LOWPAN ETHERNET
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Contents: Board(s), Cable(s)
Utilized IC / Part: JN5139
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| 74HC14DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC HEX INV SCHMITT TRIG 14SSOP
Features: Schmitt Trigger
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
Description: IC HEX INV SCHMITT TRIG 14SSOP
Features: Schmitt Trigger
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
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| MC68MH360AI33L |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
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| BT134-600G,127 |
|
Hersteller: NXP USA Inc.
Description: TRIAC 600V 4A SOT82-3
Packaging: Tube
Package / Case: SOT-82
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 30 mA
Current - Gate Trigger (Igt) (Max): 50 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: SOT-82-3
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
Description: TRIAC 600V 4A SOT82-3
Packaging: Tube
Package / Case: SOT-82
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 30 mA
Current - Gate Trigger (Igt) (Max): 50 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: SOT-82-3
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
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| MWCT1200CFM |
|
Hersteller: NXP USA Inc.
Description: IC MULTI COIL 5W 5V 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Current - Supply: 300µA
Supplier Device Package: 32-HVQFN (5x5)
Description: IC MULTI COIL 5W 5V 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Current - Supply: 300µA
Supplier Device Package: 32-HVQFN (5x5)
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| MPF5300AMBA0ES |
|
Hersteller: NXP USA Inc.
Description: IC REG BUCK ADJ 12A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 12A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
Description: IC REG BUCK ADJ 12A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 12A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
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| MVR5510AVMALTS |
|
Hersteller: NXP USA Inc.
Description: PMIC, 3BUCK , 3 LDOS,BOOST
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: PMIC, 3BUCK , 3 LDOS,BOOST
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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| S912XET256BVAG |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
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| UBA2024BT/N1,518 |
|
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 2.5A
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 2.5A
Current - Supply: 5 mA
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| 74HCT173DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 4BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 80 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 40ns @ 4.5V, 50pF
Number of Bits per Element: 4
Description: IC FF D-TYPE SINGLE 4BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 80 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 40ns @ 4.5V, 50pF
Number of Bits per Element: 4
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| 74HCT173D,653 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 80 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 40ns @ 4.5V, 50pF
Number of Bits per Element: 4
Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 80 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 40ns @ 4.5V, 50pF
Number of Bits per Element: 4
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| 74HC390DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC DUAL DECADE RIPP COUNT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
Description: IC DUAL DECADE RIPP COUNT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
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| 74HC390D,652 |
|
Hersteller: NXP USA Inc.
Description: IC DUAL DECADE RIPP COUNT 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
Description: IC DUAL DECADE RIPP COUNT 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
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| 74HC390PW,112 |
|
Hersteller: NXP USA Inc.
Description: IC DUAL DEC RIPPLE COUNT 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
Description: IC DUAL DEC RIPPLE COUNT 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
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| 74HC4017DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC DECADE COUNTER 10BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
Description: IC DECADE COUNTER 10BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
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| 74HC4017D,652 |
|
Hersteller: NXP USA Inc.
Description: IC DECADE COUNTER 10BIT 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
Description: IC DECADE COUNTER 10BIT 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
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