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PTN36241GHXZ PTN36241GHXZ NXP USA Inc. PTN36241G.pdf Description: IC REDRIVER USB 3.0 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 500ps
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB 3.0
Current - Supply: 105mA
Data Rate (Max): 5Gbps
Supplier Device Package: 12-X2QFN (1.25x2.10)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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MCIMX7D7DVK10SD MCIMX7D7DVK10SD NXP USA Inc. IMX7DCEC.pdf Description: IC MPU I.MX7D 1.0GHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Produkt ist nicht verfügbar
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MCIMX7D2DVK12SD MCIMX7D2DVK12SD NXP USA Inc. IMX7DCEC.pdf Description: IC MPU I.MX7D 1.2GHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Produkt ist nicht verfügbar
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MCIMX7D2DVK12SC MCIMX7D2DVK12SC NXP USA Inc. IMX7DCEC.pdf Description: IC MPU I.MX7D 1.2GHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Produkt ist nicht verfügbar
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MCIMX7S3DVK08SC MCIMX7S3DVK08SC NXP USA Inc. PHGL-S-A0003204178-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX7S 800MHZ 488FBGA
Packaging: Bulk
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
auf Bestellung 73 Stücke:
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17+30.49 EUR
Mindestbestellmenge: 17
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S912ZVL64AMLFR NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX8SL1AVNFZBAR MIMX8SL1AVNFZBAR NXP USA Inc. IMX8XLB0AEC.pdf Description: I.MX 8SOLOXLITE A1 PRODUCTION PN
Packaging: Tape & Reel (TR)
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 388-LBGA (15x15)
Produkt ist nicht verfügbar
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MIMX8SL1AVNFZBA MIMX8SL1AVNFZBA NXP USA Inc. IMX8XLB0AEC.pdf Description: I.MX 8SOLOXLITE A1 PRODUCTION PN
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 388-LBGA (15x15)
Produkt ist nicht verfügbar
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MIMX8DL1AVNFZBA MIMX8DL1AVNFZBA NXP USA Inc. IMX8XLB0AEC.pdf Description: I.MX 8DUALXLITE A1 PRODUCTION PN
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 388-LBGA (15x15)
Produkt ist nicht verfügbar
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1N4741A,113 1N4741A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 11V 1W DO41
Packaging: Bulk
auf Bestellung 7031 Stücke:
Lieferzeit 10-14 Tag (e)
7031+0.05 EUR
Mindestbestellmenge: 7031
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74AUP3G17GTX 74AUP3G17GTX NXP USA Inc. 74AUP3G17.pdf Description: 74AUP3G17 - LOW-POWER TRIPLE SCH
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.95x1)
auf Bestellung 112900 Stücke:
Lieferzeit 10-14 Tag (e)
2565+0.19 EUR
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74AUP3G17GSX 74AUP3G17GSX NXP USA Inc. 74AUP3G17.pdf Description: 74AUP3G17 - LOW-POWER TRIPLE SCH
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.35x1)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
2268+0.21 EUR
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74AUP3G17GNX 74AUP3G17GNX NXP USA Inc. 74AUP3G17.pdf Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.95x1)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
1043+0.47 EUR
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SPC5633MF1MLQ40 SPC5633MF1MLQ40 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BFU530AVL BFU530AVL NXP USA Inc. BFU530A.pdf Description: RF TRANS NPN 12V 11GHZ SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 12dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-23 (TO-236AB)
Produkt ist nicht verfügbar
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BFU530AVL BFU530AVL NXP USA Inc. BFU530A.pdf Description: RF TRANS NPN 12V 11GHZ SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 12dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-23 (TO-236AB)
auf Bestellung 6830 Stücke:
Lieferzeit 10-14 Tag (e)
34+0.53 EUR
49+0.36 EUR
55+0.32 EUR
100+0.28 EUR
250+0.25 EUR
500+0.24 EUR
1000+0.23 EUR
2500+0.22 EUR
5000+0.21 EUR
Mindestbestellmenge: 34
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MC33186VW2R2 MC33186VW2R2 NXP USA Inc. MC33186.pdf Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Produkt ist nicht verfügbar
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MC33186VW1R2 MC33186VW1R2 NXP USA Inc. MC33186.pdf Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Produkt ist nicht verfügbar
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LPC1114FHN33/302,5 LPC1114FHN33/302,5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
4000+3.04 EUR
Mindestbestellmenge: 4000
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LPC1114FHN33/302,5 LPC1114FHN33/302,5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.71 EUR
10+5.20 EUR
25+4.92 EUR
100+4.40 EUR
250+4.23 EUR
500+3.80 EUR
1000+3.51 EUR
Mindestbestellmenge: 3
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74AUP2G97GUX 74AUP2G97GUX NXP USA Inc. PHGL-S-A0000029076-1.pdf?t.download=true&u=5oefqw Description: IC MF CFG 2-CIR 3-IN 10-XQFN
Packaging: Bulk
Package / Case: 10-XFQFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: Yes
Supplier Device Package: 10-XQFN (1.4x1.8)
Number of Circuits: 2
auf Bestellung 181808 Stücke:
Lieferzeit 10-14 Tag (e)
1162+0.42 EUR
Mindestbestellmenge: 1162
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S9S08RNA8W2CTJR S9S08RNA8W2CTJR NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1012ASN7EKA LS1012ASN7EKA NXP USA Inc. Description: IC MPU QORIQ 600MHZ 211FCLGA
Packaging: Tray
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1012ASN7HKA LS1012ASN7HKA NXP USA Inc. LS1012AFS.pdf Description: IC MPU QORIQ 800MHZ 211FCLGA
Packaging: Tray
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1012AXN7KKB LS1012AXN7KKB NXP USA Inc. LS1012AFS.pdf Description: IC MPU QORIQ 1.0GHZ 211FCLGA
Packaging: Tray
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1012A-SWSP-PLS NXP USA Inc. LS102PSPFS.pdf Description: LS1012A SOFTWARE MAINTENANCE AND
Packaging: Bulk
Type: Tech Support
Applications: Programming
Utilized IC / Part: LS1012A
Edition: Plus
Produkt ist nicht verfügbar
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LS1012A-SWSP-PRM NXP USA Inc. LS102PSPFS.pdf Description: LS1012A SOFTWARE MAINTENANCE AND
Packaging: Bulk
Type: Tech Support
Applications: Programming
Utilized IC / Part: LS1012A
Edition: Premium
Produkt ist nicht verfügbar
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BAP50-04,215 BAP50-04,215 NXP USA Inc. BAP50-04.pdf Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 50 mA
Power Dissipation (Max): 250 mW
Produkt ist nicht verfügbar
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CBTL05024BSHP CBTL05024BSHP NXP USA Inc. CBTL05024.pdf Description: IC MUX/DEMUX SWITCH CHIP 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C (TA)
Applications: Thunderbolt
-3db Bandwidth: 10GHz
Supplier Device Package: 24-HVQFN (3x3)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 3:1, 2:1
Number of Channels: 2
auf Bestellung 350 Stücke:
Lieferzeit 10-14 Tag (e)
3+5.95 EUR
10+4.47 EUR
25+4.11 EUR
100+3.70 EUR
250+3.51 EUR
Mindestbestellmenge: 3
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MFRC63003HNY MFRC63003HNY NXP USA Inc. MFRC630.pdf Description: IC RFID TRANSP 13.56MHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
6000+5.59 EUR
Mindestbestellmenge: 6000
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MFRC63003HNY MFRC63003HNY NXP USA Inc. MFRC630.pdf Description: IC RFID TRANSP 13.56MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 8798 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.60 EUR
10+8.15 EUR
25+7.54 EUR
100+6.87 EUR
250+6.84 EUR
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74LVCH16245ADL,112 74LVCH16245ADL,112 NXP USA Inc. PHGLS24196-1.pdf?t.download=true&u=5oefqw 74LVC_LVCH16245A.pdf Description: IC BUS TRCVR 3-ST 16BIT 48SSOP
Packaging: Tube
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74LVCH16245AEVY 74LVCH16245AEVY NXP USA Inc. 74LVC_LVCH16245A.pdf Description: IC TXRX NON-INVERT 3.6V 56VFBGA
Packaging: Bulk
Package / Case: 56-VFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-VFBGA (4.5x7)
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LS1026AXE8MQA LS1026AXE8MQA NXP USA Inc. LS1046AFS.pdf Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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LS1026AXN8MQA LS1026AXN8MQA NXP USA Inc. LS1046AFS.pdf Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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MC9S08SH4MPJ MC9S08SH4MPJ NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 17
DigiKey Programmable: Not Verified
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MCU-LINK-MR NXP USA Inc. UM11931.pdf Description: MCU-LINK-MR
Packaging: Bulk
Type: Debugger
Contents: Board(s)
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PEMI2QFN/HR,115 PEMI2QFN/HR,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 2
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PS-SUPPORT-050 NXP USA Inc. PROFSUPPFS.pdf Description: PREMIUM SUPPORT - 50 HOURS - PHY
Packaging: Bulk
Type: Tech Support
Applications: Programming
Edition: Premium
License - User Details: 50 Hours
Produkt ist nicht verfügbar
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FXAS21002CQR1 FXAS21002CQR1 NXP USA Inc. FXAS21002.pdf Description: GYROSCOPE 3-AXIS 24QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 24-TFQFN Exposed Pad
Output Type: I2C, SPI
Type: Digital
Axis: X (Pitch), Y (Roll), Z (Yaw)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 4Hz ~ 256Hz
Range °/s: ±250, 500, 1000, 2000
Sensitivity (LSB/(°/s)): 16 ~ 128
Current - Supply: 2.7 mA
Produkt ist nicht verfügbar
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MCF5235CVM100J MCF5235CVM100J NXP USA Inc. MCF523x.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 113
DigiKey Programmable: Not Verified
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MCF5235CVF150 MCF5235CVF150 NXP USA Inc. MCF523x.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 113
DigiKey Programmable: Not Verified
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MCF5235CVM150J MCF5235CVM150J NXP USA Inc. MCF523x.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 97
DigiKey Programmable: Not Verified
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MCF5233CVM100 MCF5233CVM100 NXP USA Inc. MCF523x.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 61
DigiKey Programmable: Not Verified
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MCXA156VLH MCXA156VLH NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
Produkt ist nicht verfügbar
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MPF9453AVMB1HNR2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPF9453ACMB1HNR2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPF9453ACMB1HN NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MPF9453AVMB1HN NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MPF9453ACMA1HNR2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPF9453ACMA1HN NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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A5G26H606W19NR3 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BC857AQAZ BC857AQAZ NXP USA Inc. NEXP-S-A0003107807-1.pdf?t.download=true&u=5oefqw Description: TRANS PNP 45V 0.1A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 280 mW
Qualification: AEC-Q101
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MC33879BPEKR2 MC33879BPEKR2 NXP USA Inc. MC33879.pdf Description: IC SW SERIAL OCTAL 32SOIC
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High/Low Side
Rds On (Typ): 750mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Battery, Short Circuit, UVLO
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BZX84-C62/LF1R BZX84-C62/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 62V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 62 V
Impedance (Max) (Zzt): 215 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 43.4 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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BTA201-800ER,112 NXP USA Inc. BTA201-800ER_112.pdf Description: TRIAC 800V 1A TO-92
Packaging: Bulk
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LPC11U36FBD64/401, LPC11U36FBD64/401, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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FXLS8971CFR1 FXLS8971CFR1 NXP USA Inc. FXLS8971CF.pdf Description: FXLS8971CFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
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FXLS8971CFR1 FXLS8971CFR1 NXP USA Inc. FXLS8971CF.pdf Description: FXLS8971CFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Cut Tape (CT)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
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KIT-STBI-A8971 KIT-STBI-A8971 NXP USA Inc. UM11910.pdf Description: Dev Kit FXLS8971
Packaging: Box
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8971CF
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
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PTN36241GHXZ PTN36241G.pdf
PTN36241GHXZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 500ps
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB 3.0
Current - Supply: 105mA
Data Rate (Max): 5Gbps
Supplier Device Package: 12-X2QFN (1.25x2.10)
Signal Conditioning: Input Equalization, Output De-Emphasis
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MCIMX7D7DVK10SD IMX7DCEC.pdf
MCIMX7D7DVK10SD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7D 1.0GHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
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MCIMX7D2DVK12SD IMX7DCEC.pdf
MCIMX7D2DVK12SD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7D 1.2GHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
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MCIMX7D2DVK12SC IMX7DCEC.pdf
MCIMX7D2DVK12SC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7D 1.2GHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
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MCIMX7S3DVK08SC PHGL-S-A0003204178-1.pdf?t.download=true&u=5oefqw
MCIMX7S3DVK08SC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7S 800MHZ 488FBGA
Packaging: Bulk
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
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Anzahl Preis
17+30.49 EUR
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S912ZVL64AMLFR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
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MIMX8SL1AVNFZBAR IMX8XLB0AEC.pdf
MIMX8SL1AVNFZBAR
Hersteller: NXP USA Inc.
Description: I.MX 8SOLOXLITE A1 PRODUCTION PN
Packaging: Tape & Reel (TR)
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 388-LBGA (15x15)
Produkt ist nicht verfügbar
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MIMX8SL1AVNFZBA IMX8XLB0AEC.pdf
MIMX8SL1AVNFZBA
Hersteller: NXP USA Inc.
Description: I.MX 8SOLOXLITE A1 PRODUCTION PN
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 388-LBGA (15x15)
Produkt ist nicht verfügbar
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MIMX8DL1AVNFZBA IMX8XLB0AEC.pdf
MIMX8DL1AVNFZBA
Hersteller: NXP USA Inc.
Description: I.MX 8DUALXLITE A1 PRODUCTION PN
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 388-LBGA (15x15)
Produkt ist nicht verfügbar
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1N4741A,113 1N4728A_SER.pdf
1N4741A,113
Hersteller: NXP USA Inc.
Description: DIODE ZENER 11V 1W DO41
Packaging: Bulk
auf Bestellung 7031 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7031+0.05 EUR
Mindestbestellmenge: 7031
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74AUP3G17GTX 74AUP3G17.pdf
74AUP3G17GTX
Hersteller: NXP USA Inc.
Description: 74AUP3G17 - LOW-POWER TRIPLE SCH
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.95x1)
auf Bestellung 112900 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2565+0.19 EUR
Mindestbestellmenge: 2565
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74AUP3G17GSX 74AUP3G17.pdf
74AUP3G17GSX
Hersteller: NXP USA Inc.
Description: 74AUP3G17 - LOW-POWER TRIPLE SCH
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.35x1)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2268+0.21 EUR
Mindestbestellmenge: 2268
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74AUP3G17GNX 74AUP3G17.pdf
74AUP3G17GNX
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.95x1)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1043+0.47 EUR
Mindestbestellmenge: 1043
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SPC5633MF1MLQ40 MPC5634M.pdf
SPC5633MF1MLQ40
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BFU530AVL BFU530A.pdf
BFU530AVL
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 12dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-23 (TO-236AB)
Produkt ist nicht verfügbar
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BFU530AVL BFU530A.pdf
BFU530AVL
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 12dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Supplier Device Package: SOT-23 (TO-236AB)
auf Bestellung 6830 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
34+0.53 EUR
49+0.36 EUR
55+0.32 EUR
100+0.28 EUR
250+0.25 EUR
500+0.24 EUR
1000+0.23 EUR
2500+0.22 EUR
5000+0.21 EUR
Mindestbestellmenge: 34
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MC33186VW2R2 MC33186.pdf
MC33186VW2R2
Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Produkt ist nicht verfügbar
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MC33186VW1R2 MC33186.pdf
MC33186VW1R2
Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Produkt ist nicht verfügbar
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LPC1114FHN33/302,5 LPC111X.pdf
LPC1114FHN33/302,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+3.04 EUR
Mindestbestellmenge: 4000
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LPC1114FHN33/302,5 LPC111X.pdf
LPC1114FHN33/302,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.71 EUR
10+5.20 EUR
25+4.92 EUR
100+4.40 EUR
250+4.23 EUR
500+3.80 EUR
1000+3.51 EUR
Mindestbestellmenge: 3
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74AUP2G97GUX PHGL-S-A0000029076-1.pdf?t.download=true&u=5oefqw
74AUP2G97GUX
Hersteller: NXP USA Inc.
Description: IC MF CFG 2-CIR 3-IN 10-XQFN
Packaging: Bulk
Package / Case: 10-XFQFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: Yes
Supplier Device Package: 10-XQFN (1.4x1.8)
Number of Circuits: 2
auf Bestellung 181808 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1162+0.42 EUR
Mindestbestellmenge: 1162
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S9S08RNA8W2CTJR S9S08RN60DS.pdf
S9S08RNA8W2CTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1012ASN7EKA
LS1012ASN7EKA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 600MHZ 211FCLGA
Packaging: Tray
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1012ASN7HKA LS1012AFS.pdf
LS1012ASN7HKA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 211FCLGA
Packaging: Tray
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1012AXN7KKB LS1012AFS.pdf
LS1012AXN7KKB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.0GHZ 211FCLGA
Packaging: Tray
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1012A-SWSP-PLS LS102PSPFS.pdf
Hersteller: NXP USA Inc.
Description: LS1012A SOFTWARE MAINTENANCE AND
Packaging: Bulk
Type: Tech Support
Applications: Programming
Utilized IC / Part: LS1012A
Edition: Plus
Produkt ist nicht verfügbar
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LS1012A-SWSP-PRM LS102PSPFS.pdf
Hersteller: NXP USA Inc.
Description: LS1012A SOFTWARE MAINTENANCE AND
Packaging: Bulk
Type: Tech Support
Applications: Programming
Utilized IC / Part: LS1012A
Edition: Premium
Produkt ist nicht verfügbar
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BAP50-04,215 BAP50-04.pdf
BAP50-04,215
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 50 mA
Power Dissipation (Max): 250 mW
Produkt ist nicht verfügbar
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CBTL05024BSHP CBTL05024.pdf
CBTL05024BSHP
Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX SWITCH CHIP 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C (TA)
Applications: Thunderbolt
-3db Bandwidth: 10GHz
Supplier Device Package: 24-HVQFN (3x3)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 3:1, 2:1
Number of Channels: 2
auf Bestellung 350 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+5.95 EUR
10+4.47 EUR
25+4.11 EUR
100+3.70 EUR
250+3.51 EUR
Mindestbestellmenge: 3
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MFRC63003HNY MFRC630.pdf
MFRC63003HNY
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+5.59 EUR
Mindestbestellmenge: 6000
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MFRC63003HNY MFRC630.pdf
MFRC63003HNY
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 8798 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.60 EUR
10+8.15 EUR
25+7.54 EUR
100+6.87 EUR
250+6.84 EUR
Mindestbestellmenge: 2
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74LVCH16245ADL,112 PHGLS24196-1.pdf?t.download=true&u=5oefqw 74LVC_LVCH16245A.pdf
74LVCH16245ADL,112
Hersteller: NXP USA Inc.
Description: IC BUS TRCVR 3-ST 16BIT 48SSOP
Packaging: Tube
auf Bestellung 1507 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
499+0.97 EUR
Mindestbestellmenge: 499
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74LVCH16245AEVY 74LVC_LVCH16245A.pdf
74LVCH16245AEVY
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 56VFBGA
Packaging: Bulk
Package / Case: 56-VFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-VFBGA (4.5x7)
auf Bestellung 4723 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
157+3.10 EUR
Mindestbestellmenge: 157
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LS1026AXE8MQA LS1046AFS.pdf
LS1026AXE8MQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1026AXN8MQA LS1046AFS.pdf
LS1026AXN8MQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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MC9S08SH4MPJ
MC9S08SH4MPJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 17
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCU-LINK-MR UM11931.pdf
Hersteller: NXP USA Inc.
Description: MCU-LINK-MR
Packaging: Bulk
Type: Debugger
Contents: Board(s)
Produkt ist nicht verfügbar
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PEMI2QFN/HR,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/HR,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 2
Produkt ist nicht verfügbar
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PS-SUPPORT-050 PROFSUPPFS.pdf
Hersteller: NXP USA Inc.
Description: PREMIUM SUPPORT - 50 HOURS - PHY
Packaging: Bulk
Type: Tech Support
Applications: Programming
Edition: Premium
License - User Details: 50 Hours
Produkt ist nicht verfügbar
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FXAS21002CQR1 FXAS21002.pdf
FXAS21002CQR1
Hersteller: NXP USA Inc.
Description: GYROSCOPE 3-AXIS 24QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 24-TFQFN Exposed Pad
Output Type: I2C, SPI
Type: Digital
Axis: X (Pitch), Y (Roll), Z (Yaw)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 4Hz ~ 256Hz
Range °/s: ±250, 500, 1000, 2000
Sensitivity (LSB/(°/s)): 16 ~ 128
Current - Supply: 2.7 mA
Produkt ist nicht verfügbar
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MCF5235CVM100J MCF523x.pdf
MCF5235CVM100J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 113
DigiKey Programmable: Not Verified
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MCF5235CVF150 MCF523x.pdf
MCF5235CVF150
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 113
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF5235CVM150J MCF523x.pdf
MCF5235CVM150J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 97
DigiKey Programmable: Not Verified
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MCF5233CVM100 MCF523x.pdf
MCF5233CVM100
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 61
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCXA156VLH
MCXA156VLH
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
Produkt ist nicht verfügbar
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MPF9453AVMB1HNR2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPF9453ACMB1HNR2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPF9453ACMB1HN
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MPF9453AVMB1HN
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MPF9453ACMA1HNR2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPF9453ACMA1HN
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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A5G26H606W19NR3
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BC857AQAZ NEXP-S-A0003107807-1.pdf?t.download=true&u=5oefqw
BC857AQAZ
Hersteller: NXP USA Inc.
Description: TRANS PNP 45V 0.1A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 280 mW
Qualification: AEC-Q101
auf Bestellung 162272 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10158+0.05 EUR
Mindestbestellmenge: 10158
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MC33879BPEKR2 MC33879.pdf
MC33879BPEKR2
Hersteller: NXP USA Inc.
Description: IC SW SERIAL OCTAL 32SOIC
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High/Low Side
Rds On (Typ): 750mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Battery, Short Circuit, UVLO
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.62 EUR
10+6.58 EUR
25+6.07 EUR
100+5.51 EUR
250+5.24 EUR
500+5.08 EUR
Mindestbestellmenge: 3
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BZX84-C62/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C62/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 62V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 62 V
Impedance (Max) (Zzt): 215 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 43.4 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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BTA201-800ER,112 BTA201-800ER_112.pdf
Hersteller: NXP USA Inc.
Description: TRIAC 800V 1A TO-92
Packaging: Bulk
auf Bestellung 10686 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+0.49 EUR
Mindestbestellmenge: 1000
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LPC11U36FBD64/401, LPC11U3X.pdf
LPC11U36FBD64/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.63 EUR
10+8.18 EUR
Mindestbestellmenge: 2
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FXLS8971CFR1 FXLS8971CF.pdf
FXLS8971CFR1
Hersteller: NXP USA Inc.
Description: FXLS8971CFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
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FXLS8971CFR1 FXLS8971CF.pdf
FXLS8971CFR1
Hersteller: NXP USA Inc.
Description: FXLS8971CFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Cut Tape (CT)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
auf Bestellung 971 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.91 EUR
6+3.48 EUR
10+3.32 EUR
25+3.13 EUR
50+3.00 EUR
100+2.88 EUR
500+2.64 EUR
Mindestbestellmenge: 5
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KIT-STBI-A8971 UM11910.pdf
KIT-STBI-A8971
Hersteller: NXP USA Inc.
Description: Dev Kit FXLS8971
Packaging: Box
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8971CF
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
auf Bestellung 5 Stücke:
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Anzahl Preis
1+142.05 EUR
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