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MPC17529EVEL MPC17529EVEL NXP USA Inc. MPC17529.pdf Description: IC MTR DRV BIPLR 2.7-5.6V 20VMFP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
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MPC17529EVEL MPC17529EVEL NXP USA Inc. MPC17529.pdf Description: IC MTR DRV BIPLR 2.7-5.6V 20VMFP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
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PDTB143EUF PDTB143EUF NXP USA Inc. NEXP-S-A0003101095-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS NPN 50V SOT323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 50mA, 5V
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 300 mW
Frequency - Transition: 140 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Resistors Included: R1 and R2
auf Bestellung 29187 Stücke:
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6601+0.077 EUR
Mindestbestellmenge: 6601
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N74F10N,602 N74F10N,602 NXP USA Inc. 74F10%2C11.pdf Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Number of Circuits: 3
Produkt ist nicht verfügbar
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BSC9131NJN1HHHB BSC9131NJN1HHHB NXP USA Inc. BSC9131.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Bulk
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
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6+88.15 EUR
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BSC9131NJN1HHHB BSC9131NJN1HHHB NXP USA Inc. BSC9131.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Box
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Produkt ist nicht verfügbar
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PTN36043ABXY PTN36043ABXY NXP USA Inc. PTN36043A.pdf Description: IC SWITCH SPDT X 2 18X2QFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 18-X2QFN (2.4x2)
Voltage - Supply, Single (V+): 1.7V ~ 1.9V
Crosstalk: -50dB @ 2.5GHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Current - Leakage (IS(off)) (Max): 6µA
Number of Circuits: 2
auf Bestellung 28577 Stücke:
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6+3.36 EUR
10+2.58 EUR
25+2.57 EUR
100+2.33 EUR
250+2.22 EUR
500+2 EUR
1000+1.78 EUR
2500+1.66 EUR
5000+1.59 EUR
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MCF51AC128CCFGE MCF51AC128CCFGE NXP USA Inc. MCF51AC256.pdf Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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M2-NAND-FLASH NXP USA Inc. Description: IC
Packaging: Bulk
Function: FLASH
Type: Memory
Contents: Board(s)
Utilized IC / Part: GD5F2GM7, W25N02KW
Produkt ist nicht verfügbar
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UJA1078ATW/5W/2Z UJA1078ATW/5W/2Z NXP USA Inc. UJA1078A.pdf Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 84µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+4.64 EUR
Mindestbestellmenge: 2000
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UJA1078ATW/5W/2Z UJA1078ATW/5W/2Z NXP USA Inc. UJA1078A.pdf Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 84µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
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3+8.25 EUR
10+6.3 EUR
25+5.81 EUR
100+5.28 EUR
250+5.02 EUR
500+4.87 EUR
1000+4.74 EUR
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PCA9554PW/DG,118 PCA9554PW/DG,118 NXP USA Inc. PCA9554%28A%29.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9554PW/DG,118 PCA9554PW/DG,118 NXP USA Inc. PCA9554%28A%29.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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N74F245N,602 N74F245N,602 NXP USA Inc. 74F245.pdf Description: IC TXRX NON-INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
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FXLS8961AFR1 FXLS8961AFR1 NXP USA Inc. FXLS8961AF.pdf Description: FXLS8961AFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1250 Stücke:
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1250+3.14 EUR
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FXLS8961AFR1 FXLS8961AFR1 NXP USA Inc. FXLS8961AF.pdf Description: FXLS8961AFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Cut Tape (CT)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1583 Stücke:
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4+4.8 EUR
5+4.28 EUR
10+4.09 EUR
25+3.86 EUR
50+3.71 EUR
100+3.57 EUR
500+3.28 EUR
Mindestbestellmenge: 4
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MC33662JEFR2 MC33662JEFR2 NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 10kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
auf Bestellung 2500 Stücke:
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2500+1.39 EUR
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MC33662JEFR2 MC33662JEFR2 NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 10kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
auf Bestellung 2500 Stücke:
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7+2.76 EUR
10+2.03 EUR
25+1.85 EUR
100+1.65 EUR
250+1.55 EUR
500+1.49 EUR
1000+1.44 EUR
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MC68HC908JL8CDW MC68HC908JL8CDW NXP USA Inc. MC68HC908JL8.pdf Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC908JL8CFAE MC68HC908JL8CFAE NXP USA Inc. MC68HC908JL8.pdf Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC68HC908JL8MFAE MC68HC908JL8MFAE NXP USA Inc. MC68HC908JL8.pdf Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MIMX9352DVVXMABR NXP USA Inc. IMX93RM.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9351CVVXMABR NXP USA Inc. IMX93RM.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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S9S12G96J0MLL S9S12G96J0MLL NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Produkt ist nicht verfügbar
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SPC5747CBK0AVMJ6 SPC5747CBK0AVMJ6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6V2CVM08AB MCIMX6V2CVM08AB NXP USA Inc. IMX6SLLCEC.pdf Description: IC MPU I.MX6SLL 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 400-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Produkt ist nicht verfügbar
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MCXA156VLL NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCU 32BIT 1MB FLASH
Packaging: Tray
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
auf Bestellung 325 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.11 EUR
10+7.04 EUR
90+5.91 EUR
180+5.86 EUR
270+5.79 EUR
Mindestbestellmenge: 3
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MRF6S18100NBR1 MRF6S18100NBR1 NXP USA Inc. MRF6S18100N.pdf Description: RF MOSFET LDMOS 28V TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 1.99GHz
Power - Output: 100W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 900 mA
Produkt ist nicht verfügbar
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SPC5645BF0MMJ1 SPC5645BF0MMJ1 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LFTAS32K3QM4A NXP USA Inc. Description: LFTAS32K3QM4A
Packaging: Box
Module/Board Type: Adapter Board
Utilized IC / Part: S32K3
Produkt ist nicht verfügbar
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AFIC901NT1 AFIC901NT1 NXP USA Inc. AFIC901N.pdf Description: IC RF AMP 1.8MHZ-1GHZ 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 1GHz
Voltage - Supply: 7.5V
Gain: 30dB
Supplier Device Package: 24-QFN (4x4)
Produkt ist nicht verfügbar
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AFIC901NT1 AFIC901NT1 NXP USA Inc. AFIC901N.pdf Description: IC RF AMP 1.8MHZ-1GHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 1GHz
Voltage - Supply: 7.5V
Gain: 30dB
Supplier Device Package: 24-QFN (4x4)
Produkt ist nicht verfügbar
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MC9S12DG128CFUER MC9S12DG128CFUER NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
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MC9S12DG128CFUER MC9S12DG128CFUER NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Cut Tape (CT)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
1+55.6 EUR
10+45.22 EUR
25+42.63 EUR
100+39.79 EUR
250+38.43 EUR
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MC33596FJAER2 MC33596FJAER2 NXP USA Inc. mc33596.pdf Description: RF RX FSK/OOK 304/315/426 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)
Produkt ist nicht verfügbar
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MC33FS4502NAER2 MC33FS4502NAER2 NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC33FS4502NAE MC33FS4502NAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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TEF8232EN1/N1ZZ NXP USA Inc. Description: FULLY INTEGRATED 77 GHZ RFCMOS A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX3P1108UKZ NX3P1108UKZ NXP USA Inc. NX3P1108.pdf Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Voltage - Load: 0.9V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.96x0.96)
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NX3P1108UKZ NX3P1108UKZ NXP USA Inc. NX3P1108.pdf Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Voltage - Load: 0.9V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.96x0.96)
auf Bestellung 1967 Stücke:
Lieferzeit 10-14 Tag (e)
33+0.55 EUR
47+0.38 EUR
52+0.34 EUR
100+0.29 EUR
250+0.27 EUR
500+0.26 EUR
1000+0.25 EUR
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74LV125D,112 74LV125D,112 NXP USA Inc. 74LV125.pdf Description: IC BUFFER NON-INVERT 5.5V 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 16mA, 16mA
Supplier Device Package: 14-SO
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MC9S08SH8CTGR MC9S08SH8CTGR NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 8046 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.93 EUR
10+5.26 EUR
25+4.84 EUR
100+4.39 EUR
250+4.17 EUR
500+4.04 EUR
1000+3.93 EUR
2500+3.81 EUR
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SAF4000EL/103Q233Y NXP USA Inc. Description: SAF4000EL/103Q233Y
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH4231DUD/00Z NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MIMX9111CVXXJBB NXP USA Inc. Description: I.MX91 BGA9
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9131CVVXJBB NXP USA Inc. Description: I.MX91 BGA11
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9311DVXXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9301DVVXDACR NXP USA Inc. Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9311CVXXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9312DVXXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9301CVVXDACR NXP USA Inc. Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9301DVVXDAC NXP USA Inc. Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9321DVXXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9302DVVXDACR NXP USA Inc. Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9311XVXXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9331DVVXMACR NXP USA Inc. Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX9312CVXXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9322DVXXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9301CVVXDAC NXP USA Inc. Description: I.MX93 BGA11
Packaging: Tray
Produkt ist nicht verfügbar
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P87C51X2BN,112 P87C51X2BN,112 NXP USA Inc. P80C3XX2_8XC5XX2.pdf Description: IC MCU 8BIT 4KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 33MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 40-DIP
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC17529EVEL MPC17529.pdf
MPC17529EVEL
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.6V 20VMFP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MPC17529EVEL MPC17529.pdf
MPC17529EVEL
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.6V 20VMFP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
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PDTB143EUF NEXP-S-A0003101095-1.pdf?t.download=true&u=5oefqw
PDTB143EUF
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V SOT323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 50mA, 5V
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 300 mW
Frequency - Transition: 140 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Resistors Included: R1 and R2
auf Bestellung 29187 Stücke:
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Anzahl Preis
6601+0.077 EUR
Mindestbestellmenge: 6601
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N74F10N,602 74F10%2C11.pdf
N74F10N,602
Hersteller: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Number of Circuits: 3
Produkt ist nicht verfügbar
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BSC9131NJN1HHHB BSC9131.pdf
BSC9131NJN1HHHB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Bulk
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
auf Bestellung 120 Stücke:
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Anzahl Preis
6+88.15 EUR
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BSC9131NJN1HHHB BSC9131.pdf
BSC9131NJN1HHHB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Box
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Produkt ist nicht verfügbar
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PTN36043ABXY PTN36043A.pdf
PTN36043ABXY
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 2 18X2QFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 18-X2QFN (2.4x2)
Voltage - Supply, Single (V+): 1.7V ~ 1.9V
Crosstalk: -50dB @ 2.5GHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Current - Leakage (IS(off)) (Max): 6µA
Number of Circuits: 2
auf Bestellung 28577 Stücke:
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Anzahl Preis
6+3.36 EUR
10+2.58 EUR
25+2.57 EUR
100+2.33 EUR
250+2.22 EUR
500+2 EUR
1000+1.78 EUR
2500+1.66 EUR
5000+1.59 EUR
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MCF51AC128CCFGE MCF51AC256.pdf
MCF51AC128CCFGE
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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M2-NAND-FLASH
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Function: FLASH
Type: Memory
Contents: Board(s)
Utilized IC / Part: GD5F2GM7, W25N02KW
Produkt ist nicht verfügbar
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UJA1078ATW/5W/2Z UJA1078A.pdf
UJA1078ATW/5W/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 84µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+4.64 EUR
Mindestbestellmenge: 2000
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UJA1078ATW/5W/2Z UJA1078A.pdf
UJA1078ATW/5W/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 84µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.25 EUR
10+6.3 EUR
25+5.81 EUR
100+5.28 EUR
250+5.02 EUR
500+4.87 EUR
1000+4.74 EUR
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PCA9554PW/DG,118 PCA9554%28A%29.pdf
PCA9554PW/DG,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9554PW/DG,118 PCA9554%28A%29.pdf
PCA9554PW/DG,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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N74F245N,602 74F245.pdf
N74F245N,602
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
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FXLS8961AFR1 FXLS8961AF.pdf
FXLS8961AFR1
Hersteller: NXP USA Inc.
Description: FXLS8961AFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1250 Stücke:
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Anzahl Preis
1250+3.14 EUR
Mindestbestellmenge: 1250
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FXLS8961AFR1 FXLS8961AF.pdf
FXLS8961AFR1
Hersteller: NXP USA Inc.
Description: FXLS8961AFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Cut Tape (CT)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1583 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.8 EUR
5+4.28 EUR
10+4.09 EUR
25+3.86 EUR
50+3.71 EUR
100+3.57 EUR
500+3.28 EUR
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MC33662JEFR2 MC33662.pdf
MC33662JEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 10kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.39 EUR
Mindestbestellmenge: 2500
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MC33662JEFR2 MC33662.pdf
MC33662JEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 10kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.76 EUR
10+2.03 EUR
25+1.85 EUR
100+1.65 EUR
250+1.55 EUR
500+1.49 EUR
1000+1.44 EUR
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MC68HC908JL8CDW MC68HC908JL8.pdf
MC68HC908JL8CDW
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC908JL8CFAE MC68HC908JL8.pdf
MC68HC908JL8CFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC68HC908JL8MFAE MC68HC908JL8.pdf
MC68HC908JL8MFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MIMX9352DVVXMABR IMX93RM.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9351CVVXMABR IMX93RM.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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S9S12G96J0MLL
S9S12G96J0MLL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Produkt ist nicht verfügbar
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SPC5747CBK0AVMJ6 MPC5748G.pdf
SPC5747CBK0AVMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6V2CVM08AB IMX6SLLCEC.pdf
MCIMX6V2CVM08AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SLL 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 400-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Produkt ist nicht verfügbar
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MCXA156VLL MCXAP64M96FS3.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH
Packaging: Tray
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
auf Bestellung 325 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.11 EUR
10+7.04 EUR
90+5.91 EUR
180+5.86 EUR
270+5.79 EUR
Mindestbestellmenge: 3
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MRF6S18100NBR1 MRF6S18100N.pdf
MRF6S18100NBR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 1.99GHz
Power - Output: 100W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 900 mA
Produkt ist nicht verfügbar
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SPC5645BF0MMJ1
SPC5645BF0MMJ1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LFTAS32K3QM4A
Hersteller: NXP USA Inc.
Description: LFTAS32K3QM4A
Packaging: Box
Module/Board Type: Adapter Board
Utilized IC / Part: S32K3
Produkt ist nicht verfügbar
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AFIC901NT1 AFIC901N.pdf
AFIC901NT1
Hersteller: NXP USA Inc.
Description: IC RF AMP 1.8MHZ-1GHZ 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 1GHz
Voltage - Supply: 7.5V
Gain: 30dB
Supplier Device Package: 24-QFN (4x4)
Produkt ist nicht verfügbar
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AFIC901NT1 AFIC901N.pdf
AFIC901NT1
Hersteller: NXP USA Inc.
Description: IC RF AMP 1.8MHZ-1GHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 1GHz
Voltage - Supply: 7.5V
Gain: 30dB
Supplier Device Package: 24-QFN (4x4)
Produkt ist nicht verfügbar
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MC9S12DG128CFUER 9S12DT128DGV2.pdf
MC9S12DG128CFUER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 5250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
750+34.64 EUR
Mindestbestellmenge: 750
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MC9S12DG128CFUER 9S12DT128DGV2.pdf
MC9S12DG128CFUER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Cut Tape (CT)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 5867 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+55.6 EUR
10+45.22 EUR
25+42.63 EUR
100+39.79 EUR
250+38.43 EUR
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MC33596FJAER2 mc33596.pdf
MC33596FJAER2
Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 304/315/426 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)
Produkt ist nicht verfügbar
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MC33FS4502NAER2 35FS4500-35FS6500-ASILD.pdf
MC33FS4502NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC33FS4502NAE FS6500-FS4500-ASILD.pdf
MC33FS4502NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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TEF8232EN1/N1ZZ
Hersteller: NXP USA Inc.
Description: FULLY INTEGRATED 77 GHZ RFCMOS A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX3P1108UKZ NX3P1108.pdf
NX3P1108UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Voltage - Load: 0.9V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.96x0.96)
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NX3P1108UKZ NX3P1108.pdf
NX3P1108UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Voltage - Load: 0.9V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.96x0.96)
auf Bestellung 1967 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
33+0.55 EUR
47+0.38 EUR
52+0.34 EUR
100+0.29 EUR
250+0.27 EUR
500+0.26 EUR
1000+0.25 EUR
Mindestbestellmenge: 33
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74LV125D,112 74LV125.pdf
74LV125D,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 16mA, 16mA
Supplier Device Package: 14-SO
Produkt ist nicht verfügbar
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MC9S08SH8CTGR MC9S08SH32.pdf
MC9S08SH8CTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 8046 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.93 EUR
10+5.26 EUR
25+4.84 EUR
100+4.39 EUR
250+4.17 EUR
500+4.04 EUR
1000+3.93 EUR
2500+3.81 EUR
Mindestbestellmenge: 3
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SAF4000EL/103Q233Y
Hersteller: NXP USA Inc.
Description: SAF4000EL/103Q233Y
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH4231DUD/00Z MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MIMX9111CVXXJBB
Hersteller: NXP USA Inc.
Description: I.MX91 BGA9
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9131CVVXJBB
Hersteller: NXP USA Inc.
Description: I.MX91 BGA11
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9311DVXXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9301DVVXDACR
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9311CVXXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9312DVXXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9301CVVXDACR
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9301DVVXDAC
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9321DVXXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9302DVVXDACR
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9311XVXXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9331DVVXMACR
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX9312CVXXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9322DVXXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9301CVVXDAC
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Produkt ist nicht verfügbar
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P87C51X2BN,112 P80C3XX2_8XC5XX2.pdf
P87C51X2BN,112
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 33MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 40-DIP
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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