Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36819) > Seite 586 nach 614
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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MCXC141VFM | NXP USA Inc. |
 Description: 48MHZ, CORTEX-M0+ 32 KB QFN32Packaging: Tray Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 32-QFN (5x5) Number of I/O: 28 |
auf Bestellung 430 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1042ATK/3/0Z | NXP USA Inc. |
Description: IC TXRX 8-HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 120 mV Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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TJA1042AT/3/0Z | NXP USA Inc. |
Description: IC TXRX 8-SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 120 mV Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HC253D,653 | NXP USA Inc. |
Description: IC MULTIPLEXER 2 X 4:1 16-SO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 7.8mA, 7.8mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HC253D,652 | NXP USA Inc. |
Description: IC MULTIPLEXER 2 X 4:1 16-SO Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 7.8mA, 7.8mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| BUK7515-100A,127 | NXP USA Inc. |
Description: MOSFET N-CH 100V 75A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| BUK7513-75B,127 | NXP USA Inc. |
Description: MOSFET N-CH 75V 75A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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NX3L1G3157GW-Q100H | NXP USA Inc. |
Description: IC SWITCH SPDTX1 750MOHM 6TSSOP Packaging: Tape & Reel (TR) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 60MHz Supplier Device Package: 6-TSSOP Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 20mOhm Switch Time (Ton, Toff) (Max): 25ns, 10ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Grade: Automotive Number of Circuits: 1 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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FS32K146HRT0MLLR | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b SAR; D/A1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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2N7002F,215 | NXP USA Inc. |
Description: MOSFET N-CH 60V 475MA SOT23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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2N7002E,215 | NXP USA Inc. |
Description: MOSFET N-CH 60V 385MA SOT23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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2N7002CK,215 | NXP USA Inc. |
Description: MOSFET N-CH 60V 0.3A SOT-23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| 2N7002AK,215 | NXP USA Inc. |
Description: MOSFET N-CH SOT-23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MIMX9352DVVXMAC | NXP USA Inc. |
Description: I.MX93 BGA11 Packaging: Tray Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 306-LFBGA (11x11) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
auf Bestellung 821 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDM-IMX95 | NXP USA Inc. |
Description: I.MX95 DEV KIT Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A55, Cortex®-M7, Cortex®-M33 Utilized IC / Part: i.MX 95 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MIMX9331CVVXMAC | NXP USA Inc. |
Description: I.MX93 BGA11 Packaging: Tray Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 306-LFBGA (11x11) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 1, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
auf Bestellung 880 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDM-IMX91S | NXP USA Inc. |
Description: FRDM-IMX91S Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A55 Utilized IC / Part: i.MX 91 |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| MIMX9556CVTXNAC | NXP USA Inc. |
Description: I.MX95 HMI SEGMENT IC Packaging: Tray |
auf Bestellung 630 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX9536CVZXNAC | NXP USA Inc. |
Description: I.MX95 COMPUTE SEGMENT IC Packaging: Tray |
auf Bestellung 420 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX9556CVZXNAC | NXP USA Inc. |
Description: I.MX95 HMI SEGMENT IC Packaging: Tray |
auf Bestellung 420 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8533EVTANGA | NXP USA Inc. |
Description: IC MPU MPC85XX 800MHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 90°C (TA) Core Processor: PowerPC e500v2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HSSI, I2C, PCI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MPC8536EAVTANGA | NXP USA Inc. |
Description: IC MPU MPC85XX 800MHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 90°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC07APW,112 | NXP USA Inc. |
Description: IC BUFF HEX OPEN DRAIN 14TSSOP Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC07APW,118 | NXP USA Inc. |
Description: IC BUFF HEX OPEN DRAIN 14TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC07AD,112 | NXP USA Inc. |
Description: IC BUFF HEX OPEN DRAIN 14SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| 88Q9098-A2-NYKA/MP | NXP USA Inc. |
Description: 88Q9098-A2-NYKA/A Packaging: Tape & Reel (TR) Package / Case: 148-VFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Type: TxRx Only Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.8V ~ 3.3V Protocol: 802.11ac/ax, Bluetooth v5.3 Supplier Device Package: 148-HVQFN (11x11) Modulation: 1024QAM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: SDIO, PCle, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 88Q9098-A2-NYKA/AK | NXP USA Inc. |
Description: 88Q9098-A2-NYKA/A Packaging: Tray Package / Case: 148-VFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Type: TxRx Only Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.8V ~ 3.3V Protocol: 802.11ac/ax, Bluetooth v5.3 Supplier Device Package: 148-HVQFN (11x11) Modulation: 1024QAM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: SDIO, PCle, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 840 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MC9S12GC16CFUE | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 60 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MFS2612AMDA0ADR2 | NXP USA Inc. |
Description: AUTO SBC Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Current - Supply: 30µA Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MCIMX503CVM8B | NXP USA Inc. |
Description: IC MPU I.MX50 800MHZ 400LFBGA Packaging: Bulk Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Security Features: Boot Security, Cryptography, Secure JTAG Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART |
auf Bestellung 57 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33FS6507KAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| PCA9422BUKZ | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V ~ 5.5V Applications: Microcontroller, MCU Supplier Device Package: 49-WLCSP (3x2.9) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PCA9422BUKZ | NXP USA Inc. |
Description: IC Packaging: Cut Tape (CT) Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V ~ 5.5V Applications: Microcontroller, MCU Supplier Device Package: 49-WLCSP (3x2.9) |
auf Bestellung 1450 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF246B,112 | NXP USA Inc. |
Description: TRANSISTOR RF DMOS SOT161A Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MC33FS8430G0KS | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S32G274AABK1VUCR | NXP USA Inc. |
Description: S32G274A ARM CORTEX-M7 AND -A53, Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 1/2.5Gbps (4) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| BYV44-500,127 | NXP USA Inc. |
Description: DIODE RECT 500V 30A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MIMX8QX5CVLDZAC | NXP USA Inc. |
Description: I.MX 8QUADXPLUS 21X21 Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21x21) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MIMX8QX5CVLFZAC | NXP USA Inc. |
Description: MIMX8QX5CVLFZAC Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21x21) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| PBHV8550Z,115 | NXP USA Inc. |
Description: TRANS NPN 500V 0.4A SC-73 Packaging: Tape & Reel (TR) Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Transistor Type: NPN Supplier Device Package: SC-73 Current - Collector (Ic) (Max): 400 mA Voltage - Collector Emitter Breakdown (Max): 500 V Power - Max: 1.7 W |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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PDZ7.5B,115 | NXP USA Inc. |
Description: DIODE ZENER 7.5V 400MW SOD323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PUMX1,115 | NXP USA Inc. |
Description: TRANS 2NPN 40V 0.1A 6TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SFS2623HMDF5AD | NXP USA Inc. |
Description: AUTO SBC Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 36V Applications: System Basis Chip Current - Supply: 30µA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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P1014NSN5HFA | NXP USA Inc. |
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA Packaging: Tray Package / Case: 425-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 425-TEPBGA I (19x19) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| SPF5020CVNAQESR2 | NXP USA Inc. |
Description: PMIC 3 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5020CVNAQES | NXP USA Inc. |
Description: PMIC 3 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5020CMBAKESR2 | NXP USA Inc. |
Description: PMIC -4 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5020CMBAZESR2 | NXP USA Inc. |
Description: PMIC -3 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5020AMBADESR2 | NXP USA Inc. |
Description: PMIC -3 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5020CMBAKES | NXP USA Inc. |
Description: PMIC - 4 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5020AMBADES | NXP USA Inc. |
Description: PMIC - 3 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5020CMBAZES | NXP USA Inc. |
Description: PMIC - 3 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5020AMBACES | NXP USA Inc. |
Description: PMIC - 3 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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SPF5024AMMAMESR2 | NXP USA Inc. |
Description: PMIC -4 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Applications: Automotive Systems Supplier Device Package: 40-HVQFN (6x6) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| SPF5024AMMAWESR2 | NXP USA Inc. |
Description: PMIC -4 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5024AMMAWES | NXP USA Inc. |
Description: PMIC - 4 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5024AMMAMES | NXP USA Inc. |
Description: PMIC - 4 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5024CMBAYESR2 | NXP USA Inc. |
Description: PMIC -4 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5024CMBAYES | NXP USA Inc. |
Description: PMIC - 4 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
PCA9849PWJ | NXP USA Inc. |
Description: IC MULTIPLEXER 2 X 4:1 16-TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V Independent Circuits: 1 Voltage Supply Source: Dual Supply Supplier Device Package: 16-TSSOP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH |
| MCXC141VFM |
|
Hersteller: NXP USA Inc.
Description: 48MHZ, CORTEX-M0+ 32 KB QFN32
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 28
Description: 48MHZ, CORTEX-M0+ 32 KB QFN32
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 28
auf Bestellung 430 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.32 EUR |
| 10+ | 3.2 EUR |
| 50+ | 2.75 EUR |
| 100+ | 2.61 EUR |
| TJA1042ATK/3/0Z |
Hersteller: NXP USA Inc.
Description: IC TXRX 8-HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Grade: Automotive
Qualification: AEC-Q100
Description: IC TXRX 8-HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| TJA1042AT/3/0Z |
Hersteller: NXP USA Inc.
Description: IC TXRX 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Qualification: AEC-Q100
Description: IC TXRX 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74HC253D,653 |
|
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: IC MULTIPLEXER 2 X 4:1 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC253D,652 |
|
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: IC MULTIPLEXER 2 X 4:1 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NX3L1G3157GW-Q100H |
|
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX1 750MOHM 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
Description: IC SWITCH SPDTX1 750MOHM 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32K146HRT0MLLR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMX9352DVVXMAC |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
auf Bestellung 821 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 43.48 EUR |
| 10+ | 34.9 EUR |
| 25+ | 32.75 EUR |
| 176+ | 32.12 EUR |
| FRDM-IMX95 |
|
Hersteller: NXP USA Inc.
Description: I.MX95 DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55, Cortex®-M7, Cortex®-M33
Utilized IC / Part: i.MX 95
Description: I.MX95 DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55, Cortex®-M7, Cortex®-M33
Utilized IC / Part: i.MX 95
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX9331CVVXMAC |
|
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
auf Bestellung 880 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 37.4 EUR |
| 10+ | 29.83 EUR |
| 25+ | 27.94 EUR |
| 176+ | 25.22 EUR |
| 352+ | 24.55 EUR |
| 528+ | 24.23 EUR |
| FRDM-IMX91S |
|
Hersteller: NXP USA Inc.
Description: FRDM-IMX91S
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55
Utilized IC / Part: i.MX 91
Description: FRDM-IMX91S
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55
Utilized IC / Part: i.MX 91
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 93.45 EUR |
| MIMX9556CVTXNAC |
|
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 118.99 EUR |
| 10+ | 98.29 EUR |
| 25+ | 93.13 EUR |
| 100+ | 87.44 EUR |
| MIMX9536CVZXNAC |
|
auf Bestellung 420 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 129.56 EUR |
| 10+ | 107.29 EUR |
| 25+ | 101.73 EUR |
| 100+ | 95.62 EUR |
| MIMX9556CVZXNAC |
|
auf Bestellung 420 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 135.26 EUR |
| 10+ | 112.13 EUR |
| 25+ | 106.36 EUR |
| 100+ | 100.02 EUR |
| MPC8533EVTANGA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8536EAVTANGA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 88Q9098-A2-NYKA/MP |
|
Hersteller: NXP USA Inc.
Description: 88Q9098-A2-NYKA/A
Packaging: Tape & Reel (TR)
Package / Case: 148-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: 802.11ac/ax, Bluetooth v5.3
Supplier Device Package: 148-HVQFN (11x11)
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, PCle, UART
Grade: Automotive
Qualification: AEC-Q100
Description: 88Q9098-A2-NYKA/A
Packaging: Tape & Reel (TR)
Package / Case: 148-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: 802.11ac/ax, Bluetooth v5.3
Supplier Device Package: 148-HVQFN (11x11)
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, PCle, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 88Q9098-A2-NYKA/AK |
|
Hersteller: NXP USA Inc.
Description: 88Q9098-A2-NYKA/A
Packaging: Tray
Package / Case: 148-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: 802.11ac/ax, Bluetooth v5.3
Supplier Device Package: 148-HVQFN (11x11)
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, PCle, UART
Grade: Automotive
Qualification: AEC-Q100
Description: 88Q9098-A2-NYKA/A
Packaging: Tray
Package / Case: 148-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: 802.11ac/ax, Bluetooth v5.3
Supplier Device Package: 148-HVQFN (11x11)
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, PCle, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 840 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12GC16CFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MFS2612AMDA0ADR2 |
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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| MCIMX503CVM8B |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX50 800MHZ 400LFBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Description: IC MPU I.MX50 800MHZ 400LFBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 14+ | 39.67 EUR |
| MC33FS6507KAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| PCA9422BUKZ |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 49-WLCSP (3x2.9)
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 49-WLCSP (3x2.9)
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| PCA9422BUKZ |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 49-WLCSP (3x2.9)
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 49-WLCSP (3x2.9)
auf Bestellung 1450 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.01 EUR |
| 10+ | 7.65 EUR |
| 25+ | 7.06 EUR |
| 100+ | 6.4 EUR |
| 250+ | 6.09 EUR |
| 500+ | 6.02 EUR |
| MC33FS8430G0KS |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| S32G274AABK1VUCR |
|
Hersteller: NXP USA Inc.
Description: S32G274A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: S32G274A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MIMX8QX5CVLDZAC |
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Produkt ist nicht verfügbar
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| MIMX8QX5CVLFZAC |
|
Hersteller: NXP USA Inc.
Description: MIMX8QX5CVLFZAC
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Description: MIMX8QX5CVLFZAC
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Produkt ist nicht verfügbar
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| PBHV8550Z,115 |
Hersteller: NXP USA Inc.
Description: TRANS NPN 500V 0.4A SC-73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN
Supplier Device Package: SC-73
Current - Collector (Ic) (Max): 400 mA
Voltage - Collector Emitter Breakdown (Max): 500 V
Power - Max: 1.7 W
Description: TRANS NPN 500V 0.4A SC-73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN
Supplier Device Package: SC-73
Current - Collector (Ic) (Max): 400 mA
Voltage - Collector Emitter Breakdown (Max): 500 V
Power - Max: 1.7 W
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| SFS2623HMDF5AD |
|
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
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| P1014NSN5HFA |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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| SPF5020CVNAQESR2 |
Produkt ist nicht verfügbar
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| SPF5020CVNAQES |
Produkt ist nicht verfügbar
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| SPF5020CMBAKESR2 |
Produkt ist nicht verfügbar
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| SPF5020CMBAZESR2 |
Produkt ist nicht verfügbar
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| SPF5020AMBADESR2 |
Produkt ist nicht verfügbar
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| SPF5020CMBAKES |
Produkt ist nicht verfügbar
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| SPF5020AMBADES |
Produkt ist nicht verfügbar
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| SPF5020CMBAZES |
Produkt ist nicht verfügbar
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| SPF5020AMBACES |
Produkt ist nicht verfügbar
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| SPF5024AMMAMESR2 |
|
Hersteller: NXP USA Inc.
Description: PMIC -4 HIGH PERFORMANCE BUCKS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: Automotive Systems
Supplier Device Package: 40-HVQFN (6x6)
Description: PMIC -4 HIGH PERFORMANCE BUCKS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: Automotive Systems
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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| SPF5024AMMAWESR2 |
Produkt ist nicht verfügbar
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| SPF5024AMMAWES |
|
Produkt ist nicht verfügbar
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| SPF5024AMMAMES |
Produkt ist nicht verfügbar
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| SPF5024CMBAYESR2 |
Produkt ist nicht verfügbar
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| SPF5024CMBAYES |
Produkt ist nicht verfügbar
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| PCA9849PWJ |
|
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 16-TSSOP
Description: IC MULTIPLEXER 2 X 4:1 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
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