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74LVC245AD,112 74LVC245AD,112 NXP USA Inc. 74LVC_LVCH245A.pdf Description: IC TRANSCVR TRI-ST 8BIT 20SOIC
Packaging: Tube
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74LVC245ADB,112 74LVC245ADB,112 NXP USA Inc. 74LVC_LVCH245A.pdf Description: IC 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 20-SSOP
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74HCT540D,653 74HCT540D,653 NXP USA Inc. 74HC_HCT540.pdf Description: IC BUFFER INVERTING 5.5V 20-SO
Supplier Device Package: 20-SO
Current - Output High, Low: 6mA, 6mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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74HCT540D,652 74HCT540D,652 NXP USA Inc. 74HC_HCT540.pdf Description: IC BUFFER INVERTING 5.5V 20-SO
Supplier Device Package: 20-SO
Current - Output High, Low: 6mA, 6mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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74HCT540DB,112 74HCT540DB,112 NXP USA Inc. 74HC_HCT540.pdf Description: IC BUFFER INVERTING 5.5V 20-SSOP
Supplier Device Package: 20-SSOP
Current - Output High, Low: 6mA, 6mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Tube
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P5021NXE7TMC P5021NXE7TMC NXP USA Inc. P5021.pdf Description: IC MPU QORIQ P5 1.8GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Voltage - I/O: 1.0V, 1.1V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (10), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
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MPXS3010VMM150 NXP USA Inc. FSCLS06059-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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BYC10-600,127 NXP USA Inc. BYC10-600.pdf Description: DIODE FAST REC 500V 10A TO220AC
Packaging: Tube
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PMEG4010BEA,115 PMEG4010BEA,115 NXP USA Inc. PMEGXX10BEA_PMEGXX10BEV%20(Working%20Copy).pdf Description: DIODE SCHOTTKY 40V 1A SOD323
Packaging: Tape & Reel (TR)
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74HC573D,652 74HC573D,652 NXP USA Inc. 74HC_HCT573.pdf Description: IC D-TYPE TRANSP 1:8 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SO
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74HC573DB,118 74HC573DB,118 NXP USA Inc. 74HC_HCT573.pdf Description: IC D-TYPE TRANSP 1:8 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SSOP
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74HC573DB,112 74HC573DB,112 NXP USA Inc. 74HC_HCT573.pdf Description: IC D-TYPE TRANSP 1:8 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SSOP
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MAC97A6,412 NXP USA Inc. MAC97A6.pdf Description: TRIAC SENS GATE 400V 0.6A TO92-3
Packaging: Bulk
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MC17XSG500BEK MC17XSG500BEK NXP USA Inc. MC32XSG.pdf Description: IC SWITCH HIGH-SIDE PENTA 32SOIC
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM
Packaging: Tube
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 32-SOIC-EP
Ratio - Input:Output: 1:1
Current - Output (Max): 5.5A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 30V
Rds On (Typ): 17mOhm
Output Configuration: High Side
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PCA9544AD,112 PCA9544AD,112 NXP USA Inc. DS_568_PCA9544A.pdf Description: DIGITAL MOS STAND LOGIC CIRCUIT
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Translating Switch
Supplier Device Package: 20-SO
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HEF4052BT,652 HEF4052BT,652 NXP USA Inc. HEF4052B.pdf Description: IC MUX/DEMUX DUAL 4X1 16SOIC
Packaging: Tube
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PEMB3,115 PEMB3,115 NXP USA Inc. PEMB3_PUMB3.pdf Description: TRANS 2PNP PREBIAS 0.3W SOT666
Packaging: Tape & Reel (TR)
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FG32K142HRT0VLHT NXP USA Inc. Description: S32K142 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
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FC32K142HRT0VLHT NXP USA Inc. Description: S32K142 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
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FC32K142HFT0MLHT NXP USA Inc. Description: S32K142 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
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S32K324EHT1VPBSR S32K324EHT1VPBSR NXP USA Inc. S32K3xx.pdf Description: IC
Qualification: AEC-Q100
Number of I/O: 142
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Tape & Reel (TR)
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FC32K144HFT0MLFR NXP USA Inc. Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
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FG32K142HRT0VLHR NXP USA Inc. Description: S32K142 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
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MC33FS6504LAER2 MC33FS6504LAER2 NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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PEMI8QFN/RM,132 PEMI8QFN/RM,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHMS ESD SMD
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of Channels: 8
ESD Protection: Yes
Resistance - Channel (Ohms): 100
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 100Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
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NCF29A4VHN/0500EJ NXP USA Inc. Description: TOKEN
Packaging: Tape & Reel (TR)
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KIT33777A-EVB NXP USA Inc. Description: KIT33777A-EVB
Packaging: Box
Contents: Board(s)
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PESD3V3L5UV,115 PESD3V3L5UV,115 NXP USA Inc. PESDXL5UF_V_Y.pdf Description: TVS DIODE 3.3VWM 12VC SOT666
Packaging: Tape & Reel (TR)
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74HC4053PW,112 74HC4053PW,112 NXP USA Inc. NEXP-S-A0003512977-1.pdf?t.download=true&u=5oefqw Description: IC MUX/DEMUX TRIPLE 2X1 16TSSOP
Packaging: Tube
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BLF8G09LS-400PGWQ NXP USA Inc. PHGLS29773-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 28V CDFM8
Current - Test: 3.4 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: CDFM8
Technology: LDMOS
Gain: 20.6dB
Power - Output: 95W
Configuration: Dual, Common Source
Frequency: 718.5MHz ~ 725.5MHz
Mounting Type: Chassis Mount
Package / Case: SOT-1242C
Packaging: Bulk
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SPC5602BF2MLL4R SPC5602BF2MLL4R NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
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SPC5604BF2MLL4R SPC5604BF2MLL4R NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
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74HCT02PW,112 74HCT02PW,112 NXP USA Inc. 74HC_HCT02.pdf Description: IC GATE NOR 4CH 2-INP 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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1N4745A,113 1N4745A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 16V 1W DO41
Packaging: Tape & Reel (TR)
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74HC14D,652 74HC14D,652 NXP USA Inc. 74HC_HCT14.pdf Description: IC HEX INVERTER SCHM TRIG 14SOIC
Packaging: Tube
Features: Schmitt Trigger
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
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74HC4050PW,118 74HC4050PW,118 NXP USA Inc. 74HC4050.pdf Description: IC BUFF 2V/6V 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 6
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-TSSOP
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74HC4050PW,112 74HC4050PW,112 NXP USA Inc. 74HC4050.pdf Description: IC BUFF 2V/6V 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 6
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-TSSOP
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BAS45AL,115 BAS45AL,115 NXP USA Inc. BAS45AL.pdf Description: DIODE GEN PURP 125V 0.25A LLDS
Packaging: Tape & Reel (TR)
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LPC54101J256UK49Z LPC54101J256UK49Z NXP USA Inc. LPC5410X.pdf Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 49-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 49-WLCSP (3.29x3.29)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b
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TDA8563Q/N2C,112 NXP USA Inc. Description: IC AMP AUDIO PWR 55W STER 13SIL
Packaging: Tube
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PCA9539PW/Q900,118 PCA9539PW/Q900,118 NXP USA Inc. PCA9539_PCA9539R.pdf Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PCA9539PW/Q900,118 PCA9539PW/Q900,118 NXP USA Inc. PCA9539_PCA9539R.pdf Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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74AHCT02PW,112 74AHCT02PW,112 NXP USA Inc. 74AHC_AHCT02.pdf Description: IC GATE NOR 4CH 2-INP 14-TSSOP
Packaging: Tube
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74HCT30D,653 74HCT30D,653 NXP USA Inc. 74HC_HCT30.pdf Description: IC GATE NAND 1CH 8-INP 14-SO
Current - Quiescent (Max): 2 µA
Number of Circuits: 1
Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 8
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT30D,652 74HCT30D,652 NXP USA Inc. 74HC_HCT30.pdf Description: IC GATE NAND 1CH 8-INP 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 8
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74AHCT32D,112 74AHCT32D,112 NXP USA Inc. 74AHC_AHCT32.pdf Description: IC GATE OR 4CH 2-INP 14-SO
Packaging: Tube
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74AHCT32PW,118 74AHCT32PW,118 NXP USA Inc. 74AHC_AHCT32.pdf Description: IC GATE OR 4CH 2-INP 14-TSSOP
Packaging: Tape & Reel (TR)
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74AHCT32PW,112 74AHCT32PW,112 NXP USA Inc. 74AHC_AHCT32.pdf Description: IC GATE OR 4CH 2-INP 14-TSSOP
Packaging: Tube
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74AHCT125PW,112 74AHCT125PW,112 NXP USA Inc. 74AHC_AHCT125.pdf Description: IC BUFF/DVR 3-ST QUAD 14-TSSOP
Packaging: Tube
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74AHCT138BQ,115 74AHCT138BQ,115 NXP USA Inc. 74AHC_AHCT138.pdf Description: IC 3-8 LINE DECOD/DEMUX 16DHVQFN
Packaging: Tape & Reel (TR)
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74HCT153D,653 74HCT153D,653 NXP USA Inc. 74HC_HCT153.pdf Description: IC MULTIPLEXER 2 X 4:1 16-SO
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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74HCT153D,652 74HCT153D,652 NXP USA Inc. 74HC_HCT153.pdf Description: IC MULTIPLEXER 2 X 4:1 16-SO
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
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74HCT153PW,112 74HCT153PW,112 NXP USA Inc. 74HC_HCT153.pdf Description: IC MULTIPLEXER 2 X 4:1 16-TSSOP
Supplier Device Package: 16-TSSOP
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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74HCT153DB,112 74HCT153DB,112 NXP USA Inc. 74HC_HCT153.pdf Description: IC MULTIPLEXER 2 X 4:1 16-SSOP
Supplier Device Package: 16-SSOP
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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74HCT175D,653 74HCT175D,653 NXP USA Inc. 74HC_HCT175.pdf Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Input Capacitance: 3.5 pF
Clock Frequency: 49 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 4mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Number of Bits per Element: 4
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Supplier Device Package: 16-SO
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74HCT175D,652 74HCT175D,652 NXP USA Inc. 74HC_HCT175.pdf Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Supplier Device Package: 16-SO
Input Capacitance: 3.5 pF
Clock Frequency: 49 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 4mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Number of Bits per Element: 4
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74HCT175PW,118 74HCT175PW,118 NXP USA Inc. 74HC_HCT175.pdf Description: IC FF D-TYPE SGL 4-BIT 16-TSSOP
Number of Bits per Element: 4
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Supplier Device Package: 16-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 49 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 4mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT273D,653 74HCT273D,653 NXP USA Inc. 74HC_HCT273.pdf Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 30ns @ 4.5V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 3.5 pF
Clock Frequency: 36 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 5.2mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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74HCT273PW,112 74HCT273PW,112 NXP USA Inc. 74HC_HCT273.pdf Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 30ns @ 4.5V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 36 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 5.2mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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74HCT273D,652 74HCT273D,652 NXP USA Inc. 74HC_HCT273.pdf Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 30ns @ 4.5V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 3.5 pF
Clock Frequency: 36 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 5.2mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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74LVC245AD,112 74LVC_LVCH245A.pdf
74LVC245AD,112
Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 8BIT 20SOIC
Packaging: Tube
Produkt ist nicht verfügbar
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74LVC245ADB,112 74LVC_LVCH245A.pdf
74LVC245ADB,112
Hersteller: NXP USA Inc.
Description: IC 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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74HCT540D,653 74HC_HCT540.pdf
74HCT540D,653
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERTING 5.5V 20-SO
Supplier Device Package: 20-SO
Current - Output High, Low: 6mA, 6mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT540D,652 74HC_HCT540.pdf
74HCT540D,652
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERTING 5.5V 20-SO
Supplier Device Package: 20-SO
Current - Output High, Low: 6mA, 6mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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74HCT540DB,112 74HC_HCT540.pdf
74HCT540DB,112
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERTING 5.5V 20-SSOP
Supplier Device Package: 20-SSOP
Current - Output High, Low: 6mA, 6mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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P5021NXE7TMC P5021.pdf
P5021NXE7TMC
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P5 1.8GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Voltage - I/O: 1.0V, 1.1V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (10), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
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MPXS3010VMM150 FSCLS06059-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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BYC10-600,127 BYC10-600.pdf
Hersteller: NXP USA Inc.
Description: DIODE FAST REC 500V 10A TO220AC
Packaging: Tube
Produkt ist nicht verfügbar
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PMEG4010BEA,115 PMEGXX10BEA_PMEGXX10BEV%20(Working%20Copy).pdf
PMEG4010BEA,115
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 1A SOD323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC573D,652 74HC_HCT573.pdf
74HC573D,652
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP 1:8 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SO
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74HC573DB,118 74HC_HCT573.pdf
74HC573DB,118
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP 1:8 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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74HC573DB,112 74HC_HCT573.pdf
74HC573DB,112
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP 1:8 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SSOP
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MAC97A6,412 MAC97A6.pdf
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 400V 0.6A TO92-3
Packaging: Bulk
Produkt ist nicht verfügbar
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MC17XSG500BEK MC32XSG.pdf
MC17XSG500BEK
Hersteller: NXP USA Inc.
Description: IC SWITCH HIGH-SIDE PENTA 32SOIC
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM
Packaging: Tube
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 32-SOIC-EP
Ratio - Input:Output: 1:1
Current - Output (Max): 5.5A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 30V
Rds On (Typ): 17mOhm
Output Configuration: High Side
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PCA9544AD,112 DS_568_PCA9544A.pdf
PCA9544AD,112
Hersteller: NXP USA Inc.
Description: DIGITAL MOS STAND LOGIC CIRCUIT
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Translating Switch
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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HEF4052BT,652 HEF4052B.pdf
HEF4052BT,652
Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX DUAL 4X1 16SOIC
Packaging: Tube
Produkt ist nicht verfügbar
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PEMB3,115 PEMB3_PUMB3.pdf
PEMB3,115
Hersteller: NXP USA Inc.
Description: TRANS 2PNP PREBIAS 0.3W SOT666
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FG32K142HRT0VLHT
Hersteller: NXP USA Inc.
Description: S32K142 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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FC32K142HRT0VLHT
Hersteller: NXP USA Inc.
Description: S32K142 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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FC32K142HFT0MLHT
Hersteller: NXP USA Inc.
Description: S32K142 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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S32K324EHT1VPBSR S32K3xx.pdf
S32K324EHT1VPBSR
Hersteller: NXP USA Inc.
Description: IC
Qualification: AEC-Q100
Number of I/O: 142
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FC32K144HFT0MLFR
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FG32K142HRT0VLHR
Hersteller: NXP USA Inc.
Description: S32K142 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33FS6504LAER2 FS6500-FS4500-ASILD.pdf
MC33FS6504LAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PEMI8QFN/RM,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/RM,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of Channels: 8
ESD Protection: Yes
Resistance - Channel (Ohms): 100
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 100Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Produkt ist nicht verfügbar
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NCF29A4VHN/0500EJ
Hersteller: NXP USA Inc.
Description: TOKEN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KIT33777A-EVB
Hersteller: NXP USA Inc.
Description: KIT33777A-EVB
Packaging: Box
Contents: Board(s)
Produkt ist nicht verfügbar
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PESD3V3L5UV,115 PESDXL5UF_V_Y.pdf
PESD3V3L5UV,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 3.3VWM 12VC SOT666
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC4053PW,112 NEXP-S-A0003512977-1.pdf?t.download=true&u=5oefqw
74HC4053PW,112
Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX TRIPLE 2X1 16TSSOP
Packaging: Tube
Produkt ist nicht verfügbar
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BLF8G09LS-400PGWQ PHGLS29773-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V CDFM8
Current - Test: 3.4 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: CDFM8
Technology: LDMOS
Gain: 20.6dB
Power - Output: 95W
Configuration: Dual, Common Source
Frequency: 718.5MHz ~ 725.5MHz
Mounting Type: Chassis Mount
Package / Case: SOT-1242C
Packaging: Bulk
auf Bestellung 29 Stücke:
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AnzahlPrivatkunde
3+164.67 EUR
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SPC5602BF2MLL4R MPC5602D.pdf
SPC5602BF2MLL4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5604BF2MLL4R MPC5602D.pdf
SPC5604BF2MLL4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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74HCT02PW,112 74HC_HCT02.pdf
74HCT02PW,112
Hersteller: NXP USA Inc.
Description: IC GATE NOR 4CH 2-INP 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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1N4745A,113 1N4728A_SER.pdf
1N4745A,113
Hersteller: NXP USA Inc.
Description: DIODE ZENER 16V 1W DO41
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC14D,652 74HC_HCT14.pdf
74HC14D,652
Hersteller: NXP USA Inc.
Description: IC HEX INVERTER SCHM TRIG 14SOIC
Packaging: Tube
Features: Schmitt Trigger
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74HC4050PW,118 74HC4050.pdf
74HC4050PW,118
Hersteller: NXP USA Inc.
Description: IC BUFF 2V/6V 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 6
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-TSSOP
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74HC4050PW,112 74HC4050.pdf
74HC4050PW,112
Hersteller: NXP USA Inc.
Description: IC BUFF 2V/6V 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 6
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
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BAS45AL,115 BAS45AL.pdf
BAS45AL,115
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 125V 0.25A LLDS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC54101J256UK49Z LPC5410X.pdf
LPC54101J256UK49Z
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 49-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 49-WLCSP (3.29x3.29)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Produkt ist nicht verfügbar
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TDA8563Q/N2C,112
Hersteller: NXP USA Inc.
Description: IC AMP AUDIO PWR 55W STER 13SIL
Packaging: Tube
Produkt ist nicht verfügbar
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PCA9539PW/Q900,118 PCA9539_PCA9539R.pdf
PCA9539PW/Q900,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PCA9539PW/Q900,118 PCA9539_PCA9539R.pdf
PCA9539PW/Q900,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 2017 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5+4.21 EUR
10+3.12 EUR
25+2.84 EUR
100+2.55 EUR
250+2.4 EUR
500+2.33 EUR
Mindestbestellmenge: 5 Stücke
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74AHCT02PW,112 74AHC_AHCT02.pdf
74AHCT02PW,112
Hersteller: NXP USA Inc.
Description: IC GATE NOR 4CH 2-INP 14-TSSOP
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 2400 Stücke
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74HCT30D,653 74HC_HCT30.pdf
74HCT30D,653
Hersteller: NXP USA Inc.
Description: IC GATE NAND 1CH 8-INP 14-SO
Current - Quiescent (Max): 2 µA
Number of Circuits: 1
Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 8
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT30D,652 74HC_HCT30.pdf
74HCT30D,652
Hersteller: NXP USA Inc.
Description: IC GATE NAND 1CH 8-INP 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 8
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 2 µA
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74AHCT32D,112 74AHC_AHCT32.pdf
74AHCT32D,112
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14-SO
Packaging: Tube
Produkt ist nicht verfügbar
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74AHCT32PW,118 74AHC_AHCT32.pdf
74AHCT32PW,118
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14-TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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74AHCT32PW,112 74AHC_AHCT32.pdf
74AHCT32PW,112
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14-TSSOP
Packaging: Tube
Produkt ist nicht verfügbar
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74AHCT125PW,112 74AHC_AHCT125.pdf
74AHCT125PW,112
Hersteller: NXP USA Inc.
Description: IC BUFF/DVR 3-ST QUAD 14-TSSOP
Packaging: Tube
Produkt ist nicht verfügbar
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74AHCT138BQ,115 74AHC_AHCT138.pdf
74AHCT138BQ,115
Hersteller: NXP USA Inc.
Description: IC 3-8 LINE DECOD/DEMUX 16DHVQFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT153D,653 74HC_HCT153.pdf
74HCT153D,653
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16-SO
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT153D,652 74HC_HCT153.pdf
74HCT153D,652
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16-SO
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
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74HCT153PW,112 74HC_HCT153.pdf
74HCT153PW,112
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16-TSSOP
Supplier Device Package: 16-TSSOP
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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74HCT153DB,112 74HC_HCT153.pdf
74HCT153DB,112
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16-SSOP
Supplier Device Package: 16-SSOP
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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74HCT175D,653 74HC_HCT175.pdf
74HCT175D,653
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Input Capacitance: 3.5 pF
Clock Frequency: 49 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 4mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Number of Bits per Element: 4
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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74HCT175D,652 74HC_HCT175.pdf
74HCT175D,652
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Supplier Device Package: 16-SO
Input Capacitance: 3.5 pF
Clock Frequency: 49 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 4mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Number of Bits per Element: 4
Produkt ist nicht verfügbar
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74HCT175PW,118 74HC_HCT175.pdf
74HCT175PW,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SGL 4-BIT 16-TSSOP
Number of Bits per Element: 4
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Supplier Device Package: 16-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 49 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 4mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT273D,653 74HC_HCT273.pdf
74HCT273D,653
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 30ns @ 4.5V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 3.5 pF
Clock Frequency: 36 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 5.2mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT273PW,112 74HC_HCT273.pdf
74HCT273PW,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 30ns @ 4.5V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 36 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 5.2mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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74HCT273D,652 74HC_HCT273.pdf
74HCT273D,652
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 30ns @ 4.5V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 3.5 pF
Clock Frequency: 36 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 5.2mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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