Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35486) > Seite 580 nach 592
Foto | Bezeichnung | Hersteller | Beschreibung |
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MFS2323BMBB7EP | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC68332GCPV16 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 16MHz RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 15 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TJA1462ATK/S3J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 8Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 100 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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74HCT4040DB,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Negative Edge Supplier Device Package: 16-SSOP Voltage - Supply: 4.5 V ~ 5.5 V Count Rate: 79 MHz Number of Bits per Element: 12 |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCAL9722HN/Q900MP | NXP USA Inc. |
![]() Features: POR Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: SPI Number of I/O: 22 Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V Clock Frequency: 5 MHz Interrupt Output: Yes Supplier Device Package: 32-HVQFN (5x5) Current - Output Source/Sink: 10mA, 25mA |
Produkt ist nicht verfügbar |
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PCAL9722HN/Q900MP | NXP USA Inc. |
![]() Features: POR Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: SPI Number of I/O: 22 Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V Clock Frequency: 5 MHz Interrupt Output: Yes Supplier Device Package: 32-HVQFN (5x5) Current - Output Source/Sink: 10mA, 25mA |
auf Bestellung 5129 Stücke: Lieferzeit 10-14 Tag (e) |
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PCAL9722HNMP | NXP USA Inc. |
![]() Features: POR Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: SPI Number of I/O: 22 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V Clock Frequency: 5 MHz Interrupt Output: Yes Supplier Device Package: 32-HVQFN (5x5) Current - Output Source/Sink: 10mA, 25mA |
Produkt ist nicht verfügbar |
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PCAL9722HNMP | NXP USA Inc. |
![]() Features: POR Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: SPI Number of I/O: 22 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V Clock Frequency: 5 MHz Interrupt Output: Yes Supplier Device Package: 32-HVQFN (5x5) Current - Output Source/Sink: 10mA, 25mA |
auf Bestellung 4947 Stücke: Lieferzeit 10-14 Tag (e) |
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S32K344EHT1VPBSR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP (16x16) Grade: Automotive Number of I/O: 142 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MPC8245ARVV400D | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 352-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 85°C (TA) Core Processor: PowerPC 603e Voltage - I/O: 3.3V Supplier Device Package: 352-TBGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Additional Interfaces: I2C, I²O, PCI, UART |
Produkt ist nicht verfügbar |
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74AUP1G157GN,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Circuit: 1 x 2:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Supplier Device Package: 6-XSON (0.9x1) |
auf Bestellung 75000 Stücke: Lieferzeit 10-14 Tag (e) |
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88W8897PB0-NMJC/AK | NXP USA Inc. |
Description: 88W8897PB0-NMJC/AK Packaging: Bulk |
Produkt ist nicht verfügbar |
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MC34119D | NXP USA Inc. |
![]() Packaging: Tube Features: Shutdown Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -20°C ~ 70°C (TA) Voltage - Supply: 2V ~ 16V, ±1V ~ 8V Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm Supplier Device Package: 8-SOIC |
Produkt ist nicht verfügbar |
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74LVC1G80GM,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Output Type: Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Current - Quiescent (Iq): 200 µA Current - Output High, Low: 32mA, 32mA Trigger Type: Positive Edge Clock Frequency: 400 MHz Input Capacitance: 5 pF Supplier Device Package: 6-XSON (1.45x1) Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF Number of Bits per Element: 1 |
auf Bestellung 190339 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F81766MLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: I2C, LINbus, QSCI, QSPI Type: Digital Signal Controllers Operating Temperature: -40°C ~ 125°C (TA) Non-Volatile Memory: FLASH (128kB) On-Chip RAM: 20kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 48-LQFP (7x7) |
Produkt ist nicht verfügbar |
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SAF776DEL/200Z100Y | NXP USA Inc. |
Description: AUDIO DSPS SAF776DEL/200Z1005 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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SAF776DEL/200Z110Y | NXP USA Inc. |
Description: AUDIO DSPS SAF776DEL/200Z1105 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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SAF776DEL/200Z110K | NXP USA Inc. |
Description: AUDIO DSPS SAF776DEL/200Z1105 Packaging: Tray |
Produkt ist nicht verfügbar |
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SAF776DEL/200Z100K | NXP USA Inc. |
Description: AUDIO DSPS SAF776DEL/200Z1005 Packaging: Tray |
Produkt ist nicht verfügbar |
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SAF776DEL/200ZK | NXP USA Inc. |
Description: SAF776DEL Packaging: Tray |
Produkt ist nicht verfügbar |
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PESD5V0L5UK,132 | NXP USA Inc. |
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auf Bestellung 3581037 Stücke: Lieferzeit 10-14 Tag (e) |
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IP4352CX24/LF,135 | NXP USA Inc. |
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auf Bestellung 841500 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8541EVTAJD | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI |
Produkt ist nicht verfügbar |
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BB152,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz Capacitance Ratio Condition: C1/C28 Supplier Device Package: SOD-323 Voltage - Peak Reverse (Max): 32 V Capacitance Ratio: 22.0 |
Produkt ist nicht verfügbar |
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PSMN057-200P,127 | NXP USA Inc. |
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auf Bestellung 1992 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC852TZT100A | NXP USA Inc. |
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auf Bestellung 57 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC852TZT100A | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
Produkt ist nicht verfügbar |
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LS1088AXE7PTA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 780-FBGA (23x23) Ethernet: 10GbE (2), 1GbE (8) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
Produkt ist nicht verfügbar |
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K32L2A31VLL1A | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 86 |
Produkt ist nicht verfügbar |
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NX5P1000UKZ | NXP USA Inc. |
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auf Bestellung 14500 Stücke: Lieferzeit 10-14 Tag (e) |
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S9KEAZN8ACFKR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Number of I/O: 22 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SE052F2HN2/Z019HJ | NXP USA Inc. |
Description: SE052F2HN2/Z019HJ Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MCF51JE128CMB | NXP USA Inc. |
![]() Packaging: Box Package / Case: 81-LBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 12x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 81-MAPBGA (10x10) Number of I/O: 48 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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RW610BUK/A2IZ | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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RW610BHN/A2IMP | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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RW610BHN/A2IK | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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RW610BET/A2IY | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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RW610BET/A2IK | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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RW612CHN/A2IMP | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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RW612CHN/A2IK | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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RW612CET/A2IY | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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RW612CET/A2IK | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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74LVC1G384GXH | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 4-XFDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 10Ohm -3db Bandwidth: 500MHz Supplier Device Package: 5-X2SON (0.80x0.80) Voltage - Supply, Single (V+): 1.65V ~ 5.5V Charge Injection: 7.5pC Switch Circuit: SPST - NC Multiplexer/Demultiplexer Circuit: 1:1 Switch Time (Ton, Toff) (Max): 4.2ns, 5ns Channel Capacitance (CS(off), CD(off)): 5pF Current - Leakage (IS(off)) (Max): 5µA Number of Circuits: 1 |
auf Bestellung 833262 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF52110CEP66 | NXP USA Inc. |
![]() Packaging: Box Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 64-QFN-EP (9x9) Number of I/O: 43 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SE051C2HQ1/Z01XDZ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) |
auf Bestellung 2953 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8019X | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 1.559GHz ~ 1.61GHz RF Type: Galileo, GLONASS, GPS Voltage - Supply: 1.5V ~ 3.1V Gain: 18.5dB Current - Supply: 4.6mA Noise Figure: 0.55dB P1dB: -7dBm Test Frequency: 1.575GHz Supplier Device Package: 6-XSON (1.1x0.7) |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8019X | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 1.559GHz ~ 1.61GHz RF Type: Galileo, GLONASS, GPS Voltage - Supply: 1.5V ~ 3.1V Gain: 18.5dB Current - Supply: 4.6mA Noise Figure: 0.55dB P1dB: -7dBm Test Frequency: 1.575GHz Supplier Device Package: 6-XSON (1.1x0.7) |
auf Bestellung 20453 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-B5V1,235 | NXP USA Inc. |
![]() Tolerance: ±2% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 5.1 V Impedance (Max) (Zzt): 60 Ohms Supplier Device Package: SOT-23 Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 2 µA @ 2 V Qualification: AEC-Q101 |
auf Bestellung 637900 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU8.2B,115 | NXP USA Inc. |
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auf Bestellung 25464 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08QD2J1MSC | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 2KB (2K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Number of I/O: 4 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BFG21W,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: SC-82A, SOT-343 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Power - Max: 600mW Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 4.5V DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 200mA, 2V Frequency - Transition: 18GHz Supplier Device Package: CMPAK-4 |
Produkt ist nicht verfügbar |
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MC68020CRC25E | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 114-BPGA Mounting Type: Through Hole Speed: 25MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: 68020 Voltage - I/O: 5.0V Supplier Device Package: 114-PGA (34.55x34.55) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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S912ZVC64ACLFR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 10x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Grade: Automotive Number of I/O: 28 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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S912ZVC64ACLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 10x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Grade: Automotive Number of I/O: 28 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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74LVC1G19GS,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Circuit: 1 x 1:2 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 32mA, 32mA Voltage Supply Source: Single Supply Supplier Device Package: 6-XSON, SOT1202 (1x1) |
auf Bestellung 60000 Stücke: Lieferzeit 10-14 Tag (e) |
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FH32K144HAT0MLFT | NXP USA Inc. |
Description: S32K144, 512K FLASH, 64K RAM Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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LPC11U37HFBD64/4QL | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC7448HX1250ND | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.25GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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P3A9606JK-EVB | NXP USA Inc. |
![]() Packaging: Bulk Function: Level Shifter Type: Interface Contents: Board(s) Utilized IC / Part: P3A9606 Primary Attributes: 2-Channel (Dual) Embedded: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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74AUP1G07GX,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 4-XFDFN Exposed Pad Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA Supplier Device Package: 5-X2SON (0.80x0.80) |
auf Bestellung 9500 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68332GCPV16 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
TJA1462ATK/S3J |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74HCT4040DB,118 |
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Hersteller: NXP USA Inc.
Description: IC 12STAGE BIANRY RIPPLE 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 79 MHz
Number of Bits per Element: 12
Description: IC 12STAGE BIANRY RIPPLE 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 79 MHz
Number of Bits per Element: 12
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1121+ | 0.45 EUR |
PCAL9722HN/Q900MP |
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Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
PCAL9722HN/Q900MP |
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Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
auf Bestellung 5129 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 2.94 EUR |
10+ | 2.16 EUR |
25+ | 1.97 EUR |
100+ | 1.75 EUR |
250+ | 1.65 EUR |
500+ | 1.59 EUR |
1000+ | 1.54 EUR |
2500+ | 1.49 EUR |
PCAL9722HNMP |
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Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
PCAL9722HNMP |
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Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
auf Bestellung 4947 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
7+ | 2.73 EUR |
10+ | 2.01 EUR |
25+ | 1.82 EUR |
100+ | 1.62 EUR |
250+ | 1.52 EUR |
500+ | 1.47 EUR |
1000+ | 1.42 EUR |
2500+ | 1.37 EUR |
S32K344EHT1VPBSR |
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Hersteller: NXP USA Inc.
Description: S32K344EHT1VPBSR
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Description: S32K344EHT1VPBSR
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MPC8245ARVV400D |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 85°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Description: IC MPU MPC82XX 400MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 85°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74AUP1G157GN,132 |
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Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 1 X 2:1 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON (0.9x1)
Description: IC MULTIPLEXER 1 X 2:1 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON (0.9x1)
auf Bestellung 75000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1413+ | 0.35 EUR |
MC34119D |
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Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB MONO 400MW 8SOIC
Packaging: Tube
Features: Shutdown
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 2V ~ 16V, ±1V ~ 8V
Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm
Supplier Device Package: 8-SOIC
Description: IC AMP CLASS AB MONO 400MW 8SOIC
Packaging: Tube
Features: Shutdown
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 2V ~ 16V, ±1V ~ 8V
Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm
Supplier Device Package: 8-SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74LVC1G80GM,132 |
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Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 200 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 400 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON (1.45x1)
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Number of Bits per Element: 1
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 200 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 400 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON (1.45x1)
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Number of Bits per Element: 1
auf Bestellung 190339 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
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4661+ | 0.1 EUR |
MC56F81766MLF |
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Hersteller: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 128KB
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Description: 32-BIT DSC, 56800EX CORE, 128KB
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
PESD5V0L5UK,132 |
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auf Bestellung 3581037 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
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2959+ | 0.17 EUR |
IP4352CX24/LF,135 |
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auf Bestellung 841500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
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606+ | 0.84 EUR |
MPC8541EVTAJD |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BB152,115 |
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Hersteller: NXP USA Inc.
Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 22.0
Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 22.0
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
PSMN057-200P,127 |
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auf Bestellung 1992 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
198+ | 2.56 EUR |
MPC852TZT100A |
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auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
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12+ | 44.6 EUR |
MPC852TZT100A |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LS1088AXE7PTA |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
Im Einkaufswagen
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K32L2A31VLL1A |
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Hersteller: NXP USA Inc.
Description: K32 L2A 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Description: K32 L2A 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Produkt ist nicht verfügbar
Im Einkaufswagen
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NX5P1000UKZ |
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auf Bestellung 14500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
557+ | 0.91 EUR |
S9KEAZN8ACFKR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF51JE128CMB |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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74LVC1G384GXH |
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Hersteller: NXP USA Inc.
Description: IC SWITCH SPST-NCX1 10OHM 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 500MHz
Supplier Device Package: 5-X2SON (0.80x0.80)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 4.2ns, 5ns
Channel Capacitance (CS(off), CD(off)): 5pF
Current - Leakage (IS(off)) (Max): 5µA
Number of Circuits: 1
Description: IC SWITCH SPST-NCX1 10OHM 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 500MHz
Supplier Device Package: 5-X2SON (0.80x0.80)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 4.2ns, 5ns
Channel Capacitance (CS(off), CD(off)): 5pF
Current - Leakage (IS(off)) (Max): 5µA
Number of Circuits: 1
auf Bestellung 833262 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2953+ | 0.16 EUR |
MCF52110CEP66 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFN
Packaging: Box
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-QFN-EP (9x9)
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64QFN
Packaging: Box
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-QFN-EP (9x9)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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SE051C2HQ1/Z01XDZ |
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auf Bestellung 2953 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 7.52 EUR |
10+ | 5.72 EUR |
25+ | 5.27 EUR |
100+ | 4.78 EUR |
250+ | 4.55 EUR |
500+ | 4.41 EUR |
1000+ | 4.29 EUR |
BGU8019X |
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Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5000+ | 0.3 EUR |
10000+ | 0.28 EUR |
BGU8019X |
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Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 20453 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
35+ | 0.51 EUR |
41+ | 0.44 EUR |
43+ | 0.41 EUR |
100+ | 0.38 EUR |
250+ | 0.36 EUR |
500+ | 0.34 EUR |
1000+ | 0.33 EUR |
BZX84-B5V1,235 |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 5.1V 250MW SOT23
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
Qualification: AEC-Q101
Description: DIODE ZENER 5.1V 250MW SOT23
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
Qualification: AEC-Q101
auf Bestellung 637900 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
13172+ | 0.034 EUR |
PZU8.2B,115 |
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auf Bestellung 25464 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
10804+ | 0.051 EUR |
S9S08QD2J1MSC |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BFG21W,115 |
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Hersteller: NXP USA Inc.
Description: RF TRANS NPN 4.5V 18GHZ CMPAK-4
Packaging: Cut Tape (CT)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 600mW
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 4.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 200mA, 2V
Frequency - Transition: 18GHz
Supplier Device Package: CMPAK-4
Description: RF TRANS NPN 4.5V 18GHZ CMPAK-4
Packaging: Cut Tape (CT)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 600mW
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 4.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 200mA, 2V
Frequency - Transition: 18GHz
Supplier Device Package: CMPAK-4
Produkt ist nicht verfügbar
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MC68020CRC25E |
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Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 114PGA
Packaging: Tray
Package / Case: 114-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 114-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 25MHZ 114PGA
Packaging: Tray
Package / Case: 114-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 114-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
Im Einkaufswagen
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S912ZVC64ACLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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S912ZVC64ACLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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74LVC1G19GS,132 |
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Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 1:2 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 32mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Description: IC DECODER/DEMUX 1 X 1:2 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 32mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT1202 (1x1)
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3443+ | 0.15 EUR |
LPC11U37HFBD64/4QL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC7448HX1250ND |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
P3A9606JK-EVB |
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Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR P3A9606
Packaging: Bulk
Function: Level Shifter
Type: Interface
Contents: Board(s)
Utilized IC / Part: P3A9606
Primary Attributes: 2-Channel (Dual)
Embedded: No
Description: EVAL BOARD FOR P3A9606
Packaging: Bulk
Function: Level Shifter
Type: Interface
Contents: Board(s)
Utilized IC / Part: P3A9606
Primary Attributes: 2-Channel (Dual)
Embedded: No
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74AUP1G07GX,125 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
auf Bestellung 9500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4661+ | 0.1 EUR |