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SPC5744BK1AVMH6 SPC5744BK1AVMH6 NXP USA Inc. Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN32W1VLC S9S08RN32W1VLC NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCXA146VLL NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCU 32BIT 1MB FLASH
Packaging: Tray
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
auf Bestellung 85 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.86 EUR
10+8.34 EUR
25+7.71 EUR
Mindestbestellmenge: 2
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MCIMX6U1AVM08AC MCIMX6U1AVM08AC NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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1+63.87 EUR
10+52.35 EUR
60+50.83 EUR
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S912XEQ384BMAA S912XEQ384BMAA NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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N74F10D,623 N74F10D,623 NXP USA Inc. 74F10%2C11.pdf Description: IC GATE NAND 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Number of Circuits: 3
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+0.2 EUR
Mindestbestellmenge: 2500
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S9S08DN16F2CLF S9S08DN16F2CLF NXP USA Inc. BRS08DFAMILY.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BYM359X-1500,127 BYM359X-1500,127 NXP USA Inc. BYM359X.pdf Description: DIODE ARRAY GP 800V 8A TO-220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 300 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 8A
Supplier Device Package: TO-220F
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 800 V
Voltage - Forward (Vf) (Max) @ If: 1.55 V @ 6.5 A
Current - Reverse Leakage @ Vr: 100 µA @ 800 V
Produkt ist nicht verfügbar
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MCXC244VFM NXP USA Inc. MCXCFS.pdf Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 23
auf Bestellung 435 Stücke:
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4+5.19 EUR
10+4.36 EUR
25+4.1 EUR
80+3.58 EUR
230+3.3 EUR
Mindestbestellmenge: 4
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MC35FS6518NAE MC35FS6518NAE NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.59 EUR
10+13.84 EUR
25+13.2 EUR
40+12.88 EUR
80+12.42 EUR
250+11.71 EUR
Mindestbestellmenge: 2
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MPC880CVR66 MPC880CVR66 NXP USA Inc. MPC885EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC8245LVV333D MPC8245LVV333D NXP USA Inc. MPC8245.pdf Description: IC MPU MPC82XX 333MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
auf Bestellung 7 Stücke:
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1+199.48 EUR
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FS32K142HFT0MLLT FS32K142HFT0MLLT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN32J1CLC NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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S9S12GN48J0VLF NXP USA Inc. Description: S12 CORE,48K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MFS2323BMBB7EP NXP USA Inc. FS23_SBC.pdf Description: MFS2323BMBB7EP
Packaging: Tray
Produkt ist nicht verfügbar
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MC68332GCPV16 MC68332GCPV16 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1462ATK/S3J TJA1462ATK/S3J NXP USA Inc. TJA1462.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PMBT4403YSX PMBT4403YSX NXP USA Inc. PMBT4403YS.pdf Description: TRANS PNP 40V 0.6A SOT-363
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 750mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Frequency - Transition: 200MHz
Supplier Device Package: SOT-363
Grade: Automotive
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 308423 Stücke:
Lieferzeit 10-14 Tag (e)
10724+0.049 EUR
Mindestbestellmenge: 10724
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74HCT4040DB,118 74HCT4040DB,118 NXP USA Inc. 74HC_HCT4040.pdf Description: IC 12STAGE BIANRY RIPPLE 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 79 MHz
Number of Bits per Element: 12
auf Bestellung 4000 Stücke:
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1121+0.45 EUR
Mindestbestellmenge: 1121
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PCAL9722HN/Q900MP PCAL9722HN/Q900MP NXP USA Inc. PCAL9722.pdf Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
Produkt ist nicht verfügbar
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PCAL9722HN/Q900MP PCAL9722HN/Q900MP NXP USA Inc. PCAL9722.pdf Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
auf Bestellung 5129 Stücke:
Lieferzeit 10-14 Tag (e)
6+2.94 EUR
10+2.16 EUR
25+1.97 EUR
100+1.75 EUR
250+1.65 EUR
500+1.59 EUR
1000+1.54 EUR
2500+1.49 EUR
Mindestbestellmenge: 6
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PCAL9722HNMP PCAL9722HNMP NXP USA Inc. PCAL9722.pdf Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
Produkt ist nicht verfügbar
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PCAL9722HNMP PCAL9722HNMP NXP USA Inc. PCAL9722.pdf Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
auf Bestellung 4947 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.73 EUR
10+2.01 EUR
25+1.82 EUR
100+1.62 EUR
250+1.52 EUR
500+1.47 EUR
1000+1.42 EUR
2500+1.37 EUR
Mindestbestellmenge: 7
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S32K344EHT1VPBSR S32K344EHT1VPBSR NXP USA Inc. S32K3xx.pdf Description: S32K344EHT1VPBSR
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPC8245ARVV400D MPC8245ARVV400D NXP USA Inc. MPC8245.pdf Description: IC MPU MPC82XX 400MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 85°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
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74AUP1G157GXZ 74AUP1G157GXZ NXP USA Inc. 74AUP1G157.pdf Description: IC MULTIPLEXER 1 X 2:1 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-X2SON (1.0x0.8)
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)
2903+0.17 EUR
Mindestbestellmenge: 2903
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74AUP1G157GN,132 74AUP1G157GN,132 NXP USA Inc. PHGLS24877-1.pdf?t.download=true&u=5oefqw Description: IC MULTIPLEXER 1 X 2:1 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON (0.9x1)
auf Bestellung 75000 Stücke:
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1413+0.35 EUR
Mindestbestellmenge: 1413
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74LVC1G157GF,132 74LVC1G157GF,132 NXP USA Inc. PHGLS25911-1.pdf?t.download=true&u=5oefqw Description: IC MULTIPLEXER 1 X 2:1 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 32mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON (1x1)
Produkt ist nicht verfügbar
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88W8897PB0-NMJC/AK NXP USA Inc. Description: 88W8897PB0-NMJC/AK
Packaging: Bulk
Produkt ist nicht verfügbar
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MC34119D MC34119D NXP USA Inc. MC34119.pdf Description: IC AMP CLASS AB MONO 400MW 8SOIC
Packaging: Tube
Features: Shutdown
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 2V ~ 16V, ±1V ~ 8V
Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm
Supplier Device Package: 8-SOIC
Produkt ist nicht verfügbar
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74LVC1G80GM,132 74LVC1G80GM,132 NXP USA Inc. PHGLS25117-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 200 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 400 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON (1.45x1)
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Number of Bits per Element: 1
auf Bestellung 190339 Stücke:
Lieferzeit 10-14 Tag (e)
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MC56F81766MLF NXP USA Inc. MC56F81XXXL.pdf Description: 32-BIT DSC, 56800EX CORE, 128KB
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
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SAF776DEL/200Z100Y NXP USA Inc. Description: AUDIO DSPS SAF776DEL/200Z1005
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF776DEL/200Z110Y NXP USA Inc. Description: AUDIO DSPS SAF776DEL/200Z1105
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF776DEL/200Z110K NXP USA Inc. Description: AUDIO DSPS SAF776DEL/200Z1105
Packaging: Tray
Produkt ist nicht verfügbar
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SAF776DEL/200Z100K NXP USA Inc. Description: AUDIO DSPS SAF776DEL/200Z1005
Packaging: Tray
Produkt ist nicht verfügbar
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SAF776DEL/200ZK NXP USA Inc. Description: SAF776DEL
Packaging: Tray
Produkt ist nicht verfügbar
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74HCT4016D,112 74HCT4016D,112 NXP USA Inc. PHGLS06527-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74HCT4016D - SPST, 4 FU
Packaging: Bulk
auf Bestellung 1194 Stücke:
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PESD5V0L5UK,132 PESD5V0L5UK,132 NXP USA Inc. PESD3V3L5UK_PESD5V0L5UK.pdf Description: TVS DIODE 5VWM 9.9VC SOT891
Packaging: Bulk
auf Bestellung 3581037 Stücke:
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IP4352CX24/LF,135 IP4352CX24/LF,135 NXP USA Inc. IP4352CX24.pdf Description: TVS DIODE 24WLCSP
Packaging: Bulk
auf Bestellung 841500 Stücke:
Lieferzeit 10-14 Tag (e)
606+0.84 EUR
Mindestbestellmenge: 606
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MPC8541EVTAJD MPC8541EVTAJD NXP USA Inc. MPC8541EEC.pdf Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
Produkt ist nicht verfügbar
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BB152,115 BB152,115 NXP USA Inc. BB152_Rev4.pdf Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 22.0
Produkt ist nicht verfügbar
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PSMN057-200P,127 PSMN057-200P,127 NXP USA Inc. PSMN057-200P.pdf Description: MOSFET N-CH 200V 39A TO220AB
Packaging: Bulk
auf Bestellung 1992 Stücke:
Lieferzeit 10-14 Tag (e)
198+2.56 EUR
Mindestbestellmenge: 198
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MPC852TZT100A MPC852TZT100A NXP USA Inc. FSCLS03858-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC RISC MICROPROCESSOR,
Packaging: Bulk
auf Bestellung 57 Stücke:
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12+44.6 EUR
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MPC852TZT100A MPC852TZT100A NXP USA Inc. MPC852T.pdf Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Produkt ist nicht verfügbar
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LS1088AXE7PTA LS1088AXE7PTA NXP USA Inc. LS1088AFS.pdf Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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K32L2A31VLL1A K32L2A31VLL1A NXP USA Inc. K32L2Ax.pdf Description: K32 L2A 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Produkt ist nicht verfügbar
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NX5P1000UKZ NX5P1000UKZ NXP USA Inc. NX5P1000.pdf Description: NX5P1000 - LOGIC CONTROLLED HIGH
Packaging: Bulk
auf Bestellung 14500 Stücke:
Lieferzeit 10-14 Tag (e)
557+0.91 EUR
Mindestbestellmenge: 557
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S9KEAZN8ACFKR NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SE052F2HN2/Z019HJ NXP USA Inc. Description: SE052F2HN2/Z019HJ
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCF51JE128CMB MCF51JE128CMB NXP USA Inc. MCF51JE256.pdf Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RW610BUK/A2IZ RW610BUK/A2IZ NXP USA Inc. RW61XFS.pdf Description: RW610BUK/A2IZ
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BHN/A2IMP RW610BHN/A2IMP NXP USA Inc. RW61XFS.pdf Description: RW610BHN/A2IMP
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BHN/A2IK RW610BHN/A2IK NXP USA Inc. RW61XFS.pdf Description: RW610BHN/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BET/A2IY RW610BET/A2IY NXP USA Inc. RW61XFS.pdf Description: RW610BET/A2IY
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BET/A2IK RW610BET/A2IK NXP USA Inc. RW61XFS.pdf Description: RW610BET/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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RW612CHN/A2IMP RW612CHN/A2IMP NXP USA Inc. RW61XFS.pdf Description: RW612CHN/A2IMP
Packaging: Bulk
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RW612CHN/A2IK RW612CHN/A2IK NXP USA Inc. RW61XFS.pdf Description: RW612CHN/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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RW612CET/A2IY RW612CET/A2IY NXP USA Inc. RW61XFS.pdf Description: RW612CET/A2IY
Packaging: Bulk
Produkt ist nicht verfügbar
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SPC5744BK1AVMH6
SPC5744BK1AVMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN32W1VLC S9S08RN60DS.pdf
S9S08RN32W1VLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCXA146VLL MCXAP64M96FS3.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH
Packaging: Tray
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
auf Bestellung 85 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.86 EUR
10+8.34 EUR
25+7.71 EUR
Mindestbestellmenge: 2
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MCIMX6U1AVM08AC IMX6SDLAEC.pdf
MCIMX6U1AVM08AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 919 Stücke:
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Anzahl Preis
1+63.87 EUR
10+52.35 EUR
60+50.83 EUR
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S912XEQ384BMAA
S912XEQ384BMAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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N74F10D,623 74F10%2C11.pdf
N74F10D,623
Hersteller: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Number of Circuits: 3
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+0.2 EUR
Mindestbestellmenge: 2500
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S9S08DN16F2CLF BRS08DFAMILY.pdf
S9S08DN16F2CLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BYM359X-1500,127 BYM359X.pdf
BYM359X-1500,127
Hersteller: NXP USA Inc.
Description: DIODE ARRAY GP 800V 8A TO-220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 300 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 8A
Supplier Device Package: TO-220F
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 800 V
Voltage - Forward (Vf) (Max) @ If: 1.55 V @ 6.5 A
Current - Reverse Leakage @ Vr: 100 µA @ 800 V
Produkt ist nicht verfügbar
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MCXC244VFM MCXCFS.pdf
Hersteller: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 23
auf Bestellung 435 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.19 EUR
10+4.36 EUR
25+4.1 EUR
80+3.58 EUR
230+3.3 EUR
Mindestbestellmenge: 4
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MC35FS6518NAE 35FS4500-35FS6500-ASILD.pdf
MC35FS6518NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.59 EUR
10+13.84 EUR
25+13.2 EUR
40+12.88 EUR
80+12.42 EUR
250+11.71 EUR
Mindestbestellmenge: 2
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MPC880CVR66 MPC885EC.pdf
MPC880CVR66
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC8245LVV333D MPC8245.pdf
MPC8245LVV333D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
auf Bestellung 7 Stücke:
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Anzahl Preis
1+199.48 EUR
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FS32K142HFT0MLLT S32K1xx.pdf
FS32K142HFT0MLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN32J1CLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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S9S12GN48J0VLF
Hersteller: NXP USA Inc.
Description: S12 CORE,48K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MFS2323BMBB7EP FS23_SBC.pdf
Hersteller: NXP USA Inc.
Description: MFS2323BMBB7EP
Packaging: Tray
Produkt ist nicht verfügbar
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MC68332GCPV16 MC68332TS.pdf
MC68332GCPV16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1462ATK/S3J TJA1462.pdf
TJA1462ATK/S3J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PMBT4403YSX PMBT4403YS.pdf
PMBT4403YSX
Hersteller: NXP USA Inc.
Description: TRANS PNP 40V 0.6A SOT-363
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 750mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Frequency - Transition: 200MHz
Supplier Device Package: SOT-363
Grade: Automotive
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 308423 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10724+0.049 EUR
Mindestbestellmenge: 10724
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74HCT4040DB,118 74HC_HCT4040.pdf
74HCT4040DB,118
Hersteller: NXP USA Inc.
Description: IC 12STAGE BIANRY RIPPLE 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 79 MHz
Number of Bits per Element: 12
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1121+0.45 EUR
Mindestbestellmenge: 1121
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PCAL9722HN/Q900MP PCAL9722.pdf
PCAL9722HN/Q900MP
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
Produkt ist nicht verfügbar
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PCAL9722HN/Q900MP PCAL9722.pdf
PCAL9722HN/Q900MP
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
auf Bestellung 5129 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+2.94 EUR
10+2.16 EUR
25+1.97 EUR
100+1.75 EUR
250+1.65 EUR
500+1.59 EUR
1000+1.54 EUR
2500+1.49 EUR
Mindestbestellmenge: 6
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PCAL9722HNMP PCAL9722.pdf
PCAL9722HNMP
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
Produkt ist nicht verfügbar
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PCAL9722HNMP PCAL9722.pdf
PCAL9722HNMP
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 22-BIT S
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 22
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 32-HVQFN (5x5)
Current - Output Source/Sink: 10mA, 25mA
auf Bestellung 4947 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.73 EUR
10+2.01 EUR
25+1.82 EUR
100+1.62 EUR
250+1.52 EUR
500+1.47 EUR
1000+1.42 EUR
2500+1.37 EUR
Mindestbestellmenge: 7
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S32K344EHT1VPBSR S32K3xx.pdf
S32K344EHT1VPBSR
Hersteller: NXP USA Inc.
Description: S32K344EHT1VPBSR
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPC8245ARVV400D MPC8245.pdf
MPC8245ARVV400D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 85°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
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74AUP1G157GXZ 74AUP1G157.pdf
74AUP1G157GXZ
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 1 X 2:1 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-X2SON (1.0x0.8)
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2903+0.17 EUR
Mindestbestellmenge: 2903
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74AUP1G157GN,132 PHGLS24877-1.pdf?t.download=true&u=5oefqw
74AUP1G157GN,132
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 1 X 2:1 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON (0.9x1)
auf Bestellung 75000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1413+0.35 EUR
Mindestbestellmenge: 1413
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74LVC1G157GF,132 PHGLS25911-1.pdf?t.download=true&u=5oefqw
74LVC1G157GF,132
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 1 X 2:1 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 32mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON (1x1)
Produkt ist nicht verfügbar
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88W8897PB0-NMJC/AK
Hersteller: NXP USA Inc.
Description: 88W8897PB0-NMJC/AK
Packaging: Bulk
Produkt ist nicht verfügbar
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MC34119D MC34119.pdf
MC34119D
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB MONO 400MW 8SOIC
Packaging: Tube
Features: Shutdown
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 2V ~ 16V, ±1V ~ 8V
Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm
Supplier Device Package: 8-SOIC
Produkt ist nicht verfügbar
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74LVC1G80GM,132 PHGLS25117-1.pdf?t.download=true&u=5oefqw
74LVC1G80GM,132
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 200 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 400 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON (1.45x1)
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Number of Bits per Element: 1
auf Bestellung 190339 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4661+0.1 EUR
Mindestbestellmenge: 4661
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MC56F81766MLF MC56F81XXXL.pdf
Hersteller: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 128KB
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
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SAF776DEL/200Z100Y
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF776DEL/200Z1005
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF776DEL/200Z110Y
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF776DEL/200Z1105
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF776DEL/200Z110K
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF776DEL/200Z1105
Packaging: Tray
Produkt ist nicht verfügbar
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SAF776DEL/200Z100K
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF776DEL/200Z1005
Packaging: Tray
Produkt ist nicht verfügbar
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SAF776DEL/200ZK
Hersteller: NXP USA Inc.
Description: SAF776DEL
Packaging: Tray
Produkt ist nicht verfügbar
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74HCT4016D,112 PHGLS06527-1.pdf?t.download=true&u=5oefqw
74HCT4016D,112
Hersteller: NXP USA Inc.
Description: NEXPERIA 74HCT4016D - SPST, 4 FU
Packaging: Bulk
auf Bestellung 1194 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1194+0.42 EUR
Mindestbestellmenge: 1194
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PESD5V0L5UK,132 PESD3V3L5UK_PESD5V0L5UK.pdf
PESD5V0L5UK,132
Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM 9.9VC SOT891
Packaging: Bulk
auf Bestellung 3581037 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2959+0.17 EUR
Mindestbestellmenge: 2959
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IP4352CX24/LF,135 IP4352CX24.pdf
IP4352CX24/LF,135
Hersteller: NXP USA Inc.
Description: TVS DIODE 24WLCSP
Packaging: Bulk
auf Bestellung 841500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
606+0.84 EUR
Mindestbestellmenge: 606
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MPC8541EVTAJD MPC8541EEC.pdf
MPC8541EVTAJD
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
Produkt ist nicht verfügbar
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BB152,115 BB152_Rev4.pdf
BB152,115
Hersteller: NXP USA Inc.
Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 22.0
Produkt ist nicht verfügbar
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PSMN057-200P,127 PSMN057-200P.pdf
PSMN057-200P,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 200V 39A TO220AB
Packaging: Bulk
auf Bestellung 1992 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
198+2.56 EUR
Mindestbestellmenge: 198
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MPC852TZT100A FSCLS03858-1.pdf?t.download=true&u=5oefqw
MPC852TZT100A
Hersteller: NXP USA Inc.
Description: POWERQUICC RISC MICROPROCESSOR,
Packaging: Bulk
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+44.6 EUR
Mindestbestellmenge: 12
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MPC852TZT100A MPC852T.pdf
MPC852TZT100A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Produkt ist nicht verfügbar
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LS1088AXE7PTA LS1088AFS.pdf
LS1088AXE7PTA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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K32L2A31VLL1A K32L2Ax.pdf
K32L2A31VLL1A
Hersteller: NXP USA Inc.
Description: K32 L2A 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Produkt ist nicht verfügbar
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NX5P1000UKZ NX5P1000.pdf
NX5P1000UKZ
Hersteller: NXP USA Inc.
Description: NX5P1000 - LOGIC CONTROLLED HIGH
Packaging: Bulk
auf Bestellung 14500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
557+0.91 EUR
Mindestbestellmenge: 557
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S9KEAZN8ACFKR S9KEA128P80M48SF0.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SE052F2HN2/Z019HJ
Hersteller: NXP USA Inc.
Description: SE052F2HN2/Z019HJ
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCF51JE128CMB MCF51JE256.pdf
MCF51JE128CMB
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RW610BUK/A2IZ RW61XFS.pdf
RW610BUK/A2IZ
Hersteller: NXP USA Inc.
Description: RW610BUK/A2IZ
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BHN/A2IMP RW61XFS.pdf
RW610BHN/A2IMP
Hersteller: NXP USA Inc.
Description: RW610BHN/A2IMP
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BHN/A2IK RW61XFS.pdf
RW610BHN/A2IK
Hersteller: NXP USA Inc.
Description: RW610BHN/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BET/A2IY RW61XFS.pdf
RW610BET/A2IY
Hersteller: NXP USA Inc.
Description: RW610BET/A2IY
Packaging: Bulk
Produkt ist nicht verfügbar
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RW610BET/A2IK RW61XFS.pdf
RW610BET/A2IK
Hersteller: NXP USA Inc.
Description: RW610BET/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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RW612CHN/A2IMP RW61XFS.pdf
RW612CHN/A2IMP
Hersteller: NXP USA Inc.
Description: RW612CHN/A2IMP
Packaging: Bulk
Produkt ist nicht verfügbar
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RW612CHN/A2IK RW61XFS.pdf
RW612CHN/A2IK
Hersteller: NXP USA Inc.
Description: RW612CHN/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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RW612CET/A2IY RW61XFS.pdf
RW612CET/A2IY
Hersteller: NXP USA Inc.
Description: RW612CET/A2IY
Packaging: Bulk
Produkt ist nicht verfügbar
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