Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36783) > Seite 580 nach 614
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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| MRF150 | NXP USA Inc. |
 Description: MOSFET N-CHAN 150W 221-11/2Current - Test: 250 mA Voltage - Test: 50 V Voltage - Rated: 125 V Supplier Device Package: 211-11, Style 2 Technology: MOSFET (Metal Oxide) Gain: 17dB Power - Output: 150W Configuration: N-Channel Frequency: 30MHz Current Rating (Amps): 16A Package / Case: 211-11, Style 2 Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 20 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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PBSS5350X,115 | NXP USA Inc. |
Description: TRANS PNP 50V 3A SOT89 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PBSS5350SS,115 | NXP USA Inc. |
Description: TRANS 2PNP 50V 2.7A 8SO Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| BLC6G10LS-160 | NXP USA Inc. |
Description: TRANS LDMOS W-CDMA SOT896 Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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74HCT245D,652 | NXP USA Inc. |
Description: IC TXRX 4.5V/5.5V 20-SO Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 20-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HCT27DB,112 | NXP USA Inc. |
Description: IC GATE NOR 3CH 3-INP 14-SSOP Logic Type: NOR Gate Mounting Type: Surface Mount Package / Case: 14-SSOP (0.209", 5.30mm Width) Packaging: Tube Current - Quiescent (Max): 2 µA Number of Circuits: 3 Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF Input Logic Level - Low: 0.8V Input Logic Level - High: 2V Supplier Device Package: 14-SSOP Number of Inputs: 3 Current - Output High, Low: 4mA, 4mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1092 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HC04D,652 | NXP USA Inc. |
Description: IC INVERTER HEX 6CH 1-INP 14SOIC Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 1 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 14ns @ 6V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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HEF4001BT,652 | NXP USA Inc. |
Description: IC GATE NOR 4CH 2-INP 14-SO Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| BCW61C,235 | NXP USA Inc. |
Description: TRANSISTOR PNP 32V 100MA SOT23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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74HC14PW,112 | NXP USA Inc. |
Description: IC INV 6-CIR 1-IN 14-TSSOP Packaging: Tube Features: Schmitt Trigger Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 1 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.3V ~ 1.2V Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MCHC705JP7CDWE | NXP USA Inc. |
Description: IC MCU 8BIT 6KB OTP 28SOIC Packaging: Tube Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 6KB (6K x 8) RAM Size: 224 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Data Converters: A/D 4x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SIO Peripherals: POR, Temp Sensor, WDT Supplier Device Package: 28-SOIC Number of I/O: 22 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC705P6ECPE | NXP USA Inc. |
Description: IC MCU 8BIT 4.5KB OTP 28DIP Packaging: Tube Package / Case: 28-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 2.1MHz Program Memory Size: 4.5KB (4.5K x 8) RAM Size: 176 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SIO Peripherals: POR, WDT Supplier Device Package: 28-PDIP Number of I/O: 21 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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HEF4093BT,652 | NXP USA Inc. |
Description: IC NAND 4-CIR 2-IN 14-SO Packaging: Bulk Features: Schmitt Trigger Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 15V Current - Output High, Low: 3.4mA, 3.4mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 3.5V ~ 11V Input Logic Level - Low: 1.5V ~ 4V Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 1 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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HEF4541BT,512 | NXP USA Inc. |
Description: IC OSC PROG TIMER 36MHZ 14SOIC Supplier Device Package: 14-SO Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1140 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BZX384-C5V1,115 | NXP USA Inc. |
Description: DIODE ZENER 5.1V 300MW SOD323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| BZX384-C12,115 | NXP USA Inc. |
Description: DIODE ZENER 12V 300MW SOD323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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PZT4403,115 | NXP USA Inc. |
Description: TRANS PNP SW 40V 600MA SOT-223 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| BCX51-16,115 | NXP USA Inc. |
Description: TRANSISTOR PNP 45V 1A SOT89 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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1N4732A,113 | NXP USA Inc. |
Description: DIODE ZENER 4.7V 1W DO41 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HC4052DB,118 | NXP USA Inc. |
Description: IC MUX/DEMUX DUAL 4X1 16SSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BZX384-C5V6,115 | NXP USA Inc. |
Description: DIODE ZENER 5.6V 300MW SOD323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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ACT108W-600E,135 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 800MA SC73 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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ACT108W-600D,135 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V SOT223 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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1N4743A,113 | NXP USA Inc. |
Description: DIODE ZENER 13V 1W DO41 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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HEF4020BT,652 | NXP USA Inc. |
Description: IC 14STG BINARY COUNTER 16-SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC34912BAC | NXP USA Inc. |
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP Supplier Device Package: 32-LQFP (7x7) Current - Supply: 4.5mA Applications: System Basis Chip Voltage - Supply: 5.5V ~ 18V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33PF8100EQTSR2 | NXP USA Inc. |
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS Supplier Device Package: 56-HVQFN (8x8) Current - Supply: 240µA Applications: Processor Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| SC33PF8200JGESR2 | NXP USA Inc. |
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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74HCT244D,652 | NXP USA Inc. |
Description: IC BUFF 4.5V/5.5V 20-SO Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 20-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BZV85-C18,113 | NXP USA Inc. |
Description: DIODE ZENER 18V 1.3W DO-41 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HC20N,652 | NXP USA Inc. |
Description: IC NAND 2-CIR 4-IN 14-DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 4 Supplier Device Package: 14-DIP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HCT20N,652 | NXP USA Inc. |
Description: IC NAND 2-CIR 4-IN 14-DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 4 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MF2DL1001DUD/02V | NXP USA Inc. |
Description: MIFARE DESFIRE LIGHT CONTACTLESS Packaging: Bulk |
auf Bestellung 208250 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S12HZ256VAL | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 12K x 8 Program Memory Size: 256KB (256K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 85 Supplier Device Package: 112-LQFP (20x20) Peripherals: LCD, Motor control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x10b Core Processor: HCS12 |
Produkt ist nicht verfügbar |
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PBSS4140V,115 | NXP USA Inc. |
Description: TRANS NPN 40V 1A SOT-666 Supplier Device Package: SOT-666 Frequency - Transition: 150MHz DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 500mA, 5V Current - Collector Cutoff (Max): 100nA Vce Saturation (Max) @ Ib, Ic: 440mV @ 200mA, 2A Operating Temperature: 150°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: SOT-563, SOT-666 Packaging: Tape & Reel (TR) Power - Max: 500 mW Voltage - Collector Emitter Breakdown (Max): 40 V Current - Collector (Ic) (Max): 1 A |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| BCP51-16,135 | NXP USA Inc. |
Description: TRANSISTOR PNP 45V 1A SOT223 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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PCF8551BTT/AY | NXP USA Inc. |
Description: LCD DRIVER Packaging: Cut Tape (CT) Package / Case: 48-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: SPI Configuration: 36 Segment Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 9 Characters, 18 Characters, 144 Elements Supplier Device Package: 48-TSSOP Grade: Automotive Current - Supply: 1.2 µA Qualification: AEC-Q100 |
auf Bestellung 886 Stücke: Lieferzeit 10-14 Tag (e) |
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| FXLS90620AESR2 | NXP USA Inc. |
Description: Y SINGLE-AXIS MEDIUM-G INERTIAL Supplier Device Package: 16-HLQFNR (4x4) Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount, Wettable Flank Output Type: I2C, SPI Package / Case: 16-LQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| FXLS93620AESR2 | NXP USA Inc. |
Description: PSI5 Y SINGLE-AXIS MEDIUM-G INE Supplier Device Package: 16-HLQFNR (4x4) Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount, Wettable Flank Output Type: I2C, SPI Package / Case: 16-LQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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FXLS93120AESR2 | NXP USA Inc. |
Description: PSI5 Z SINGLE-AXIS MEDIUM-G INE Supplier Device Package: 16-HLQFNR (4x4) Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount, Wettable Flank Output Type: I2C, SPI Package / Case: 16-LQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC9S08DZ96CLL | NXP USA Inc. |
Description: IC MCU 8BIT 96KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 87 Supplier Device Package: 100-LQFP (14x14) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 24x12b Core Processor: S08 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 6K x 8 Program Memory Size: 96KB (96K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| BT149G,412 | NXP USA Inc. |
Description: THYRISTOR .8A 600V TO-92 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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BZT52H-C8V2,115 | NXP USA Inc. |
Description: DIODE ZENER 8.2V 375MW SOD123F Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| PESD5V0X1BA,115 | NXP USA Inc. |
Description: DIODE ESD PROT BI-DIR 5V SOD32-2 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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74HC574PW,112 | NXP USA Inc. |
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 7.8mA, 7.8mA Trigger Type: Positive Edge Clock Frequency: 133 MHz Input Capacitance: 3.5 pF Supplier Device Package: 20-TSSOP Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| LS1088AXE7PTA | NXP USA Inc. |
Description: LS1088 - QORIQ LAYERSCAPE 1088A Packaging: Bulk |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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PZTA42,115 | NXP USA Inc. |
Description: TRANS NPN 300V 100MA SOT223 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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HEF4050BT,652 | NXP USA Inc. |
Description: IC BUFFER HEX NON-INV 16SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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ACT102H-600D,118 | NXP USA Inc. |
Description: IC AC THYRIST PWR SWITCH 8SO Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC4245APW,112 | NXP USA Inc. |
Description: IC TRANSCVR TRI-ST DL 24TSSOP Packaging: Tube Package / Case: 24-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Supplier Device Package: 24-TSSOP |
Produkt ist nicht verfügbar |
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MC33596FCE | NXP USA Inc. |
Description: RF RX FSK/OOK 304/315/426 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Sensitivity: -104dBm Mounting Type: Surface Mount Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V Applications: General Data Transfer Current - Receiving: 10.3mA Data Rate (Max): 22.4kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 32-QFN-EP (5x5) |
Produkt ist nicht verfügbar |
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CLRC66303EVY | NXP USA Inc. |
Description: NFC/RFID TAGS & TRANSPONDERS Supplier Device Package: 36-VFBGA (3.5x3.5) Standards: ISO 14443, ISO 15693, 18000-3, ISO 18092, Mifare, NFC Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -25°C ~ 85°C (TA) Type: RFID Reader/Transponder Interface: I2C, SPI, UART Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 36-VFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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RW610ET/A2IY | NXP USA Inc. |
Description: RW610ET/A2IY Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PMEG3010BEA,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 30V 1A SOD323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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CBT3257APW,112 | NXP USA Inc. |
Description: IC QUAD1:2 FET MUX/DEMUX 16TSSOP Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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CBT3257ADB,118 | NXP USA Inc. |
Description: IC 4BIT 1OF2 MUX/DEMUX 16SSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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CBT3257ADB,112 | NXP USA Inc. |
Description: IC QUAD 1:2 FET MUX/DEMUX 16SSOP Packaging: Tube |
Produkt ist nicht verfügbar |
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CBT3257AD,112 | NXP USA Inc. |
Description: IC QUAD 1:2 FET MUX/DEMUX 16SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
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CBT3257ADS,118 | NXP USA Inc. |
Description: IC 4BIT 1OF2 MUX/DEMUX 16QSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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CBT3257ABQ,115 | NXP USA Inc. |
Description: IC QUAD 1:2 MUX/DEMUX 16-DHVQFN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MRF150 |
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Hersteller: NXP USA Inc.
Description: MOSFET N-CHAN 150W 221-11/2
Current - Test: 250 mA
Voltage - Test: 50 V
Voltage - Rated: 125 V
Supplier Device Package: 211-11, Style 2
Technology: MOSFET (Metal Oxide)
Gain: 17dB
Power - Output: 150W
Configuration: N-Channel
Frequency: 30MHz
Current Rating (Amps): 16A
Package / Case: 211-11, Style 2
Packaging: Bulk
Description: MOSFET N-CHAN 150W 221-11/2
Current - Test: 250 mA
Voltage - Test: 50 V
Voltage - Rated: 125 V
Supplier Device Package: 211-11, Style 2
Technology: MOSFET (Metal Oxide)
Gain: 17dB
Power - Output: 150W
Configuration: N-Channel
Frequency: 30MHz
Current Rating (Amps): 16A
Package / Case: 211-11, Style 2
Packaging: Bulk
Produkt ist nicht verfügbar
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| BLC6G10LS-160 |
Produkt ist nicht verfügbar
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| 74HCT245D,652 |
|
Hersteller: NXP USA Inc.
Description: IC TXRX 4.5V/5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Description: IC TXRX 4.5V/5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
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| 74HCT27DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14-SSOP
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Current - Quiescent (Max): 2 µA
Number of Circuits: 3
Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SSOP
Number of Inputs: 3
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Description: IC GATE NOR 3CH 3-INP 14-SSOP
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Current - Quiescent (Max): 2 µA
Number of Circuits: 3
Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SSOP
Number of Inputs: 3
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
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| 74HC04D,652 |
|
Hersteller: NXP USA Inc.
Description: IC INVERTER HEX 6CH 1-INP 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 14ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
Description: IC INVERTER HEX 6CH 1-INP 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 14ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
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| 74HC14PW,112 |
|
Hersteller: NXP USA Inc.
Description: IC INV 6-CIR 1-IN 14-TSSOP
Packaging: Tube
Features: Schmitt Trigger
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
Description: IC INV 6-CIR 1-IN 14-TSSOP
Packaging: Tube
Features: Schmitt Trigger
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
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| MCHC705JP7CDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 6KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 6KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 22
DigiKey Programmable: Not Verified
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| MC705P6ECPE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4.5KB OTP 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 4.5KB (4.5K x 8)
RAM Size: 176 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SIO
Peripherals: POR, WDT
Supplier Device Package: 28-PDIP
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4.5KB OTP 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 4.5KB (4.5K x 8)
RAM Size: 176 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SIO
Peripherals: POR, WDT
Supplier Device Package: 28-PDIP
Number of I/O: 21
DigiKey Programmable: Not Verified
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| HEF4093BT,652 |
|
Hersteller: NXP USA Inc.
Description: IC NAND 4-CIR 2-IN 14-SO
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 1 µA
Description: IC NAND 4-CIR 2-IN 14-SO
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 1 µA
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| HEF4541BT,512 |
|
Hersteller: NXP USA Inc.
Description: IC OSC PROG TIMER 36MHZ 14SOIC
Supplier Device Package: 14-SO
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Description: IC OSC PROG TIMER 36MHZ 14SOIC
Supplier Device Package: 14-SO
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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| BZX384-C5V6,115 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
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| MC34912BAC |
|
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Supplier Device Package: 32-LQFP (7x7)
Current - Supply: 4.5mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 18V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Supplier Device Package: 32-LQFP (7x7)
Current - Supply: 4.5mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 18V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| MC33PF8100EQTSR2 |
|
Hersteller: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 240µA
Applications: Processor
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 240µA
Applications: Processor
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| SC33PF8200JGESR2 |
|
Produkt ist nicht verfügbar
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| 74HCT244D,652 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Description: IC BUFF 4.5V/5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
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| 74HC20N,652 |
|
Hersteller: NXP USA Inc.
Description: IC NAND 2-CIR 4-IN 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
Description: IC NAND 2-CIR 4-IN 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
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| 74HCT20N,652 |
|
Hersteller: NXP USA Inc.
Description: IC NAND 2-CIR 4-IN 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 4
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
Description: IC NAND 2-CIR 4-IN 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 4
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
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| MF2DL1001DUD/02V |
|
auf Bestellung 208250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 413+ | 1.32 EUR |
| MC9S12HZ256VAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 85
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: HCS12
Description: IC MCU 16BIT 256KB FLASH 112LQFP
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 85
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: HCS12
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| PBSS4140V,115 |
Hersteller: NXP USA Inc.
Description: TRANS NPN 40V 1A SOT-666
Supplier Device Package: SOT-666
Frequency - Transition: 150MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 500mA, 5V
Current - Collector Cutoff (Max): 100nA
Vce Saturation (Max) @ Ib, Ic: 440mV @ 200mA, 2A
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-563, SOT-666
Packaging: Tape & Reel (TR)
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 40 V
Current - Collector (Ic) (Max): 1 A
Description: TRANS NPN 40V 1A SOT-666
Supplier Device Package: SOT-666
Frequency - Transition: 150MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 500mA, 5V
Current - Collector Cutoff (Max): 100nA
Vce Saturation (Max) @ Ib, Ic: 440mV @ 200mA, 2A
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-563, SOT-666
Packaging: Tape & Reel (TR)
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 40 V
Current - Collector (Ic) (Max): 1 A
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| PCF8551BTT/AY |
|
Hersteller: NXP USA Inc.
Description: LCD DRIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 36 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Grade: Automotive
Current - Supply: 1.2 µA
Qualification: AEC-Q100
Description: LCD DRIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 36 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Grade: Automotive
Current - Supply: 1.2 µA
Qualification: AEC-Q100
auf Bestellung 886 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 7+ | 3.45 EUR |
| 10+ | 2.55 EUR |
| 25+ | 2.31 EUR |
| 100+ | 2.06 EUR |
| 250+ | 1.94 EUR |
| 500+ | 1.87 EUR |
| FXLS90620AESR2 |
|
Hersteller: NXP USA Inc.
Description: Y SINGLE-AXIS MEDIUM-G INERTIAL
Supplier Device Package: 16-HLQFNR (4x4)
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount, Wettable Flank
Output Type: I2C, SPI
Package / Case: 16-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: Y SINGLE-AXIS MEDIUM-G INERTIAL
Supplier Device Package: 16-HLQFNR (4x4)
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount, Wettable Flank
Output Type: I2C, SPI
Package / Case: 16-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| FXLS93620AESR2 |
|
Hersteller: NXP USA Inc.
Description: PSI5 Y SINGLE-AXIS MEDIUM-G INE
Supplier Device Package: 16-HLQFNR (4x4)
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount, Wettable Flank
Output Type: I2C, SPI
Package / Case: 16-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: PSI5 Y SINGLE-AXIS MEDIUM-G INE
Supplier Device Package: 16-HLQFNR (4x4)
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount, Wettable Flank
Output Type: I2C, SPI
Package / Case: 16-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| FXLS93120AESR2 |
|
Hersteller: NXP USA Inc.
Description: PSI5 Z SINGLE-AXIS MEDIUM-G INE
Supplier Device Package: 16-HLQFNR (4x4)
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount, Wettable Flank
Output Type: I2C, SPI
Package / Case: 16-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: PSI5 Z SINGLE-AXIS MEDIUM-G INE
Supplier Device Package: 16-HLQFNR (4x4)
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount, Wettable Flank
Output Type: I2C, SPI
Package / Case: 16-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MC9S08DZ96CLL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 6K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 8BIT 96KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 6K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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| BZT52H-C8V2,115 |
|
Produkt ist nicht verfügbar
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| 74HC574PW,112 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 133 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 133 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF
Number of Bits per Element: 8
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| LS1088AXE7PTA |
|
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 373.66 EUR |
| HEF4050BT,652 |
|
Produkt ist nicht verfügbar
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| ACT102H-600D,118 |
|
Produkt ist nicht verfügbar
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| 74LVC4245APW,112 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST DL 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 24-TSSOP
Description: IC TRANSCVR TRI-ST DL 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 24-TSSOP
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| MC33596FCE |
|
Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 304/315/426 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN-EP (5x5)
Description: RF RX FSK/OOK 304/315/426 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN-EP (5x5)
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| CLRC66303EVY |
|
Hersteller: NXP USA Inc.
Description: NFC/RFID TAGS & TRANSPONDERS
Supplier Device Package: 36-VFBGA (3.5x3.5)
Standards: ISO 14443, ISO 15693, 18000-3, ISO 18092, Mifare, NFC
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 36-VFBGA
Packaging: Tape & Reel (TR)
Description: NFC/RFID TAGS & TRANSPONDERS
Supplier Device Package: 36-VFBGA (3.5x3.5)
Standards: ISO 14443, ISO 15693, 18000-3, ISO 18092, Mifare, NFC
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 36-VFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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| RW610ET/A2IY |
|
Produkt ist nicht verfügbar
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