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S32E288ABCAAMJGT S32E288ABCAAMJGT NXP USA Inc. S32Z27_DS.pdf Description: IC
Packaging: Tray
Mounting Type: Surface Mount
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)
1+201.34 EUR
10+169.89 EUR
40+158.74 EUR
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PCA9540BD,112 PCA9540BD,112 NXP USA Inc. PCA9540B.pdf Description: IC INTERFACE SPECIALIZED 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
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MPC8272VRPIEA MPC8272VRPIEA NXP USA Inc. FSCLS05947-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCH, 30
Packaging: Bulk
auf Bestellung 7 Stücke:
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4+126.95 EUR
Mindestbestellmenge: 4
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S32M24XEVB-C064 S32M24XEVB-C064 NXP USA Inc. S32M24xEVB-L064.pdf Description: S32M24XEVB-C064
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32M24X
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 32-Bit
auf Bestellung 3 Stücke:
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1+317.2 EUR
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88W8864-B0-NMMC/AZ NXP USA Inc. 88W8864-FACT-SHEET.pdf Description: 802.11 A/B/G/N/AC 4X4 SINGLE-CHI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S32K366EHT1MJBSR S32K366EHT1MJBSR NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K366EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 704K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCXW716CMFPAR NXP USA Inc. MCXW71.pdf Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMXRT1041DJM6B MIMXRT1041DJM6B NXP USA Inc. IMXRT1040CEC.pdf Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 169-MAPBGA (11x11)
Number of I/O: 114
auf Bestellung 880 Stücke:
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2+16.44 EUR
10+12.86 EUR
25+11.96 EUR
100+10.98 EUR
250+10.51 EUR
880+9.13 EUR
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MCXN236VDFR NXP USA Inc. MCXN23x.pdf Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FXTH870502DT1 FXTH870502DT1 NXP USA Inc. Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 1998 Stücke:
Lieferzeit 10-14 Tag (e)
73+6.28 EUR
Mindestbestellmenge: 73
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NCF29AEXHN4/0100IY NXP USA Inc. Description: NCF29AEXHN4
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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C9S12VR48AL0VLC NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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C9S12VR48AL0VLFR NXP USA Inc. Description: 16-BIT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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C9S12VR48AL0VLF NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08JE128CLK MC9S08JE128CLK NXP USA Inc. MC9S08JE128.pdf Description: IC MCU 8BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 46
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX9332DVVXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA11
Packaging: Tray
auf Bestellung 518 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.06 EUR
10+23.17 EUR
25+21.69 EUR
176+19.57 EUR
352+19.06 EUR
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MIMX9332CVVXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MIMX9352CVVXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA11
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9352XVVXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA11
Packaging: Tray
Produkt ist nicht verfügbar
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PDTB143EUF PDTB143EUF NXP USA Inc. NEXP-S-A0003101095-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS NPN 50V SOT323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 50mA, 5V
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 300 mW
Frequency - Transition: 140 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Resistors Included: R1 and R2
auf Bestellung 29187 Stücke:
Lieferzeit 10-14 Tag (e)
6601+0.077 EUR
Mindestbestellmenge: 6601
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N74F10N,602 N74F10N,602 NXP USA Inc. 74F10%2C11.pdf Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Number of Circuits: 3
Produkt ist nicht verfügbar
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PTN36043ABXY PTN36043ABXY NXP USA Inc. PTN36043A.pdf Description: IC SWITCH SPDT X 2 18X2QFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 18-X2QFN (2.4x2)
Voltage - Supply, Single (V+): 1.7V ~ 1.9V
Crosstalk: -50dB @ 2.5GHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Current - Leakage (IS(off)) (Max): 6µA
Number of Circuits: 2
auf Bestellung 28577 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.36 EUR
10+2.58 EUR
25+2.57 EUR
100+2.33 EUR
250+2.22 EUR
500+2 EUR
1000+1.78 EUR
2500+1.66 EUR
5000+1.59 EUR
Mindestbestellmenge: 6
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MCF51AC128CCFGE MCF51AC128CCFGE NXP USA Inc. MCF51AC256.pdf Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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M2-NAND-FLASH NXP USA Inc. Description: IC
Packaging: Bulk
Function: FLASH
Type: Memory
Contents: Board(s)
Utilized IC / Part: GD5F2GM7, W25N02KW
Produkt ist nicht verfügbar
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UJA1078ATW/5W/2Z UJA1078ATW/5W/2Z NXP USA Inc. UJA1078A.pdf Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 84µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+4.64 EUR
Mindestbestellmenge: 2000
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UJA1078ATW/5W/2Z UJA1078ATW/5W/2Z NXP USA Inc. UJA1078A.pdf Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 84µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.25 EUR
10+6.3 EUR
25+5.81 EUR
100+5.28 EUR
250+5.02 EUR
500+4.87 EUR
1000+4.74 EUR
Mindestbestellmenge: 3
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FXLS8961AFR1 FXLS8961AFR1 NXP USA Inc. FXLS8961AF.pdf Description: FXLS8961AFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1250 Stücke:
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1250+3.14 EUR
Mindestbestellmenge: 1250
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FXLS8961AFR1 FXLS8961AFR1 NXP USA Inc. FXLS8961AF.pdf Description: FXLS8961AFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Cut Tape (CT)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1583 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.8 EUR
5+4.28 EUR
10+4.09 EUR
25+3.86 EUR
50+3.71 EUR
100+3.57 EUR
500+3.28 EUR
Mindestbestellmenge: 4
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MC33662JEFR2 MC33662JEFR2 NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 10kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Produkt ist nicht verfügbar
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MC33662JEFR2 MC33662JEFR2 NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 10kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
auf Bestellung 2499 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.78 EUR
10+2.04 EUR
25+1.86 EUR
100+1.65 EUR
250+1.56 EUR
500+1.5 EUR
1000+1.45 EUR
Mindestbestellmenge: 7
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MC68HC908JL8CDW MC68HC908JL8CDW NXP USA Inc. MC68HC908JL8.pdf Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC908JL8CFAE MC68HC908JL8CFAE NXP USA Inc. MC68HC908JL8.pdf Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC68HC908JL8MFAE MC68HC908JL8MFAE NXP USA Inc. MC68HC908JL8.pdf Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MIMX9352DVVXMABR NXP USA Inc. IMX93RM.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9351CVVXMABR NXP USA Inc. IMX93RM.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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S9S12G96J0MLL S9S12G96J0MLL NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Produkt ist nicht verfügbar
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SPC5747CBK0AVMJ6 SPC5747CBK0AVMJ6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6V2CVM08AB MCIMX6V2CVM08AB NXP USA Inc. IMX6SLLCEC.pdf Description: IC MPU I.MX6SLL 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 400-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Produkt ist nicht verfügbar
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MCXA156VLL NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCU 32BIT 1MB FLASH
Packaging: Tray
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
auf Bestellung 325 Stücke:
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10+7.04 EUR
90+5.91 EUR
180+5.86 EUR
270+5.79 EUR
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MRF6S18100NBR1 MRF6S18100NBR1 NXP USA Inc. MRF6S18100N.pdf Description: RF MOSFET LDMOS 28V TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 1.99GHz
Power - Output: 100W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 900 mA
Produkt ist nicht verfügbar
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SPC5645BF0MMJ1 SPC5645BF0MMJ1 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LFTAS32K3QM4A NXP USA Inc. Description: LFTAS32K3QM4A
Packaging: Box
Module/Board Type: Adapter Board
Utilized IC / Part: S32K3
Produkt ist nicht verfügbar
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AFIC901NT1 AFIC901NT1 NXP USA Inc. AFIC901N.pdf Description: IC RF AMP 1.8MHZ-1GHZ 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 1GHz
Voltage - Supply: 7.5V
Gain: 30dB
Supplier Device Package: 24-QFN (4x4)
Produkt ist nicht verfügbar
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AFIC901NT1 AFIC901NT1 NXP USA Inc. AFIC901N.pdf Description: IC RF AMP 1.8MHZ-1GHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 1GHz
Voltage - Supply: 7.5V
Gain: 30dB
Supplier Device Package: 24-QFN (4x4)
Produkt ist nicht verfügbar
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MC9S12DG128CFUER MC9S12DG128CFUER NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC9S12DG128CFUER MC9S12DG128CFUER NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Cut Tape (CT)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC33596FJAER2 MC33596FJAER2 NXP USA Inc. mc33596.pdf Description: RF RX FSK/OOK 304/315/426 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)
Produkt ist nicht verfügbar
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MC33FS4502NAER2 MC33FS4502NAER2 NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC33FS4502NAE MC33FS4502NAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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TEF8232EN1/N1ZZ NXP USA Inc. Description: FULLY INTEGRATED 77 GHZ RFCMOS A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX3P1108UKZ NX3P1108UKZ NXP USA Inc. NX3P1108.pdf Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Voltage - Load: 0.9V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.96x0.96)
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NX3P1108UKZ NX3P1108UKZ NXP USA Inc. NX3P1108.pdf Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Voltage - Load: 0.9V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.96x0.96)
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MC9S08SH8CTGR MC9S08SH8CTGR NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 6646 Stücke:
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3+6.97 EUR
10+5.29 EUR
25+4.87 EUR
100+4.41 EUR
250+4.19 EUR
500+4.06 EUR
1000+3.95 EUR
2500+3.83 EUR
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SAF4000EL/103Q233Y NXP USA Inc. Description: SAF4000EL/103Q233Y
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH4231DUD/00Z NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MIMX9111CVXXJBB NXP USA Inc. IMX91CEC.pdf Description: I.MX91 BGA9
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9131CVVXJBB NXP USA Inc. IMX91CEC.pdf Description: I.MX91 BGA11
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9311DVXXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9301DVVXDACR NXP USA Inc. IMX91CEC.pdf Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9311CVXXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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S32E288ABCAAMJGT S32Z27_DS.pdf
S32E288ABCAAMJGT
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Mounting Type: Surface Mount
auf Bestellung 200 Stücke:
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1+201.34 EUR
10+169.89 EUR
40+158.74 EUR
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PCA9540BD,112 PCA9540B.pdf
PCA9540BD,112
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-SO
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MPC8272VRPIEA FSCLS05947-1.pdf?t.download=true&u=5oefqw
MPC8272VRPIEA
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCH, 30
Packaging: Bulk
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4+126.95 EUR
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S32M24XEVB-C064 S32M24xEVB-L064.pdf
S32M24XEVB-C064
Hersteller: NXP USA Inc.
Description: S32M24XEVB-C064
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32M24X
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 32-Bit
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1+317.2 EUR
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88W8864-B0-NMMC/AZ 88W8864-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: 802.11 A/B/G/N/AC 4X4 SINGLE-CHI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S32K366EHT1MJBSR S32K39-S32K37-DS.pdf
S32K366EHT1MJBSR
Hersteller: NXP USA Inc.
Description: S32K366EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 704K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
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MCXW716CMFPAR MCXW71.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMXRT1041DJM6B IMXRT1040CEC.pdf
MIMXRT1041DJM6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 169-MAPBGA (11x11)
Number of I/O: 114
auf Bestellung 880 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.44 EUR
10+12.86 EUR
25+11.96 EUR
100+10.98 EUR
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880+9.13 EUR
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MCXN236VDFR MCXN23x.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FXTH870502DT1
FXTH870502DT1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 1998 Stücke:
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Anzahl Preis
73+6.28 EUR
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NCF29AEXHN4/0100IY
Hersteller: NXP USA Inc.
Description: NCF29AEXHN4
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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C9S12VR48AL0VLC
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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C9S12VR48AL0VLFR
Hersteller: NXP USA Inc.
Description: 16-BIT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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C9S12VR48AL0VLF
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08JE128CLK MC9S08JE128.pdf
MC9S08JE128CLK
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 46
DigiKey Programmable: Not Verified
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MIMX9332DVVXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
auf Bestellung 518 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+29.06 EUR
10+23.17 EUR
25+21.69 EUR
176+19.57 EUR
352+19.06 EUR
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MIMX9332CVVXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MIMX9352CVVXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9352XVVXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Produkt ist nicht verfügbar
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PDTB143EUF NEXP-S-A0003101095-1.pdf?t.download=true&u=5oefqw
PDTB143EUF
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V SOT323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 50mA, 5V
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 300 mW
Frequency - Transition: 140 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Resistors Included: R1 and R2
auf Bestellung 29187 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6601+0.077 EUR
Mindestbestellmenge: 6601
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N74F10N,602 74F10%2C11.pdf
N74F10N,602
Hersteller: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Number of Circuits: 3
Produkt ist nicht verfügbar
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PTN36043ABXY PTN36043A.pdf
PTN36043ABXY
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 2 18X2QFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 18-X2QFN (2.4x2)
Voltage - Supply, Single (V+): 1.7V ~ 1.9V
Crosstalk: -50dB @ 2.5GHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Current - Leakage (IS(off)) (Max): 6µA
Number of Circuits: 2
auf Bestellung 28577 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.36 EUR
10+2.58 EUR
25+2.57 EUR
100+2.33 EUR
250+2.22 EUR
500+2 EUR
1000+1.78 EUR
2500+1.66 EUR
5000+1.59 EUR
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MCF51AC128CCFGE MCF51AC256.pdf
MCF51AC128CCFGE
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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M2-NAND-FLASH
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Function: FLASH
Type: Memory
Contents: Board(s)
Utilized IC / Part: GD5F2GM7, W25N02KW
Produkt ist nicht verfügbar
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UJA1078ATW/5W/2Z UJA1078A.pdf
UJA1078ATW/5W/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 84µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+4.64 EUR
Mindestbestellmenge: 2000
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UJA1078ATW/5W/2Z UJA1078A.pdf
UJA1078ATW/5W/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 84µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.25 EUR
10+6.3 EUR
25+5.81 EUR
100+5.28 EUR
250+5.02 EUR
500+4.87 EUR
1000+4.74 EUR
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FXLS8961AFR1 FXLS8961AF.pdf
FXLS8961AFR1
Hersteller: NXP USA Inc.
Description: FXLS8961AFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1250+3.14 EUR
Mindestbestellmenge: 1250
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FXLS8961AFR1 FXLS8961AF.pdf
FXLS8961AFR1
Hersteller: NXP USA Inc.
Description: FXLS8961AFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Cut Tape (CT)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1583 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.8 EUR
5+4.28 EUR
10+4.09 EUR
25+3.86 EUR
50+3.71 EUR
100+3.57 EUR
500+3.28 EUR
Mindestbestellmenge: 4
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MC33662JEFR2 MC33662.pdf
MC33662JEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 10kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Produkt ist nicht verfügbar
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MC33662JEFR2 MC33662.pdf
MC33662JEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 10kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
auf Bestellung 2499 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.78 EUR
10+2.04 EUR
25+1.86 EUR
100+1.65 EUR
250+1.56 EUR
500+1.5 EUR
1000+1.45 EUR
Mindestbestellmenge: 7
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MC68HC908JL8CDW MC68HC908JL8.pdf
MC68HC908JL8CDW
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC908JL8CFAE MC68HC908JL8.pdf
MC68HC908JL8CFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC68HC908JL8MFAE MC68HC908JL8.pdf
MC68HC908JL8MFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MIMX9352DVVXMABR IMX93RM.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9351CVVXMABR IMX93RM.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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S9S12G96J0MLL
S9S12G96J0MLL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Produkt ist nicht verfügbar
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SPC5747CBK0AVMJ6 MPC5748G.pdf
SPC5747CBK0AVMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6V2CVM08AB IMX6SLLCEC.pdf
MCIMX6V2CVM08AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SLL 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 400-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Produkt ist nicht verfügbar
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MCXA156VLL MCXAP64M96FS3.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH
Packaging: Tray
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
auf Bestellung 325 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.11 EUR
10+7.04 EUR
90+5.91 EUR
180+5.86 EUR
270+5.79 EUR
Mindestbestellmenge: 3
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MRF6S18100NBR1 MRF6S18100N.pdf
MRF6S18100NBR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 1.99GHz
Power - Output: 100W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 900 mA
Produkt ist nicht verfügbar
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SPC5645BF0MMJ1
SPC5645BF0MMJ1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LFTAS32K3QM4A
Hersteller: NXP USA Inc.
Description: LFTAS32K3QM4A
Packaging: Box
Module/Board Type: Adapter Board
Utilized IC / Part: S32K3
Produkt ist nicht verfügbar
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AFIC901NT1 AFIC901N.pdf
AFIC901NT1
Hersteller: NXP USA Inc.
Description: IC RF AMP 1.8MHZ-1GHZ 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 1GHz
Voltage - Supply: 7.5V
Gain: 30dB
Supplier Device Package: 24-QFN (4x4)
Produkt ist nicht verfügbar
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AFIC901NT1 AFIC901N.pdf
AFIC901NT1
Hersteller: NXP USA Inc.
Description: IC RF AMP 1.8MHZ-1GHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 1GHz
Voltage - Supply: 7.5V
Gain: 30dB
Supplier Device Package: 24-QFN (4x4)
Produkt ist nicht verfügbar
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MC9S12DG128CFUER 9S12DT128DGV2.pdf
MC9S12DG128CFUER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 5250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
750+38.44 EUR
Mindestbestellmenge: 750
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MC9S12DG128CFUER 9S12DT128DGV2.pdf
MC9S12DG128CFUER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Cut Tape (CT)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 5841 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+57.45 EUR
10+46.73 EUR
25+44.05 EUR
100+41.73 EUR
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MC33596FJAER2 mc33596.pdf
MC33596FJAER2
Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 304/315/426 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)
Produkt ist nicht verfügbar
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MC33FS4502NAER2 35FS4500-35FS6500-ASILD.pdf
MC33FS4502NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC33FS4502NAE FS6500-FS4500-ASILD.pdf
MC33FS4502NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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TEF8232EN1/N1ZZ
Hersteller: NXP USA Inc.
Description: FULLY INTEGRATED 77 GHZ RFCMOS A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX3P1108UKZ NX3P1108.pdf
NX3P1108UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Voltage - Load: 0.9V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.96x0.96)
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+0.24 EUR
Mindestbestellmenge: 4000
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NX3P1108UKZ NX3P1108.pdf
NX3P1108UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Voltage - Load: 0.9V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.96x0.96)
auf Bestellung 5081 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
32+0.56 EUR
45+0.39 EUR
51+0.35 EUR
100+0.3 EUR
250+0.28 EUR
500+0.27 EUR
1000+0.25 EUR
Mindestbestellmenge: 32
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MC9S08SH8CTGR MC9S08SH32.pdf
MC9S08SH8CTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 6646 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.97 EUR
10+5.29 EUR
25+4.87 EUR
100+4.41 EUR
250+4.19 EUR
500+4.06 EUR
1000+3.95 EUR
2500+3.83 EUR
Mindestbestellmenge: 3
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SAF4000EL/103Q233Y
Hersteller: NXP USA Inc.
Description: SAF4000EL/103Q233Y
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH4231DUD/00Z MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MIMX9111CVXXJBB IMX91CEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX91 BGA9
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9131CVVXJBB IMX91CEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX91 BGA11
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9311DVXXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9301DVVXDACR IMX91CEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9311CVXXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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