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PDTC144VM,315 PDTC144VM,315 NXP USA Inc. PDTC144V_SER.pdf Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Bulk
auf Bestellung 80000 Stücke:
Lieferzeit 10-14 Tag (e)
11871+0.051 EUR
Mindestbestellmenge: 11871
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MCIMX6X3EVN10AB MCIMX6X3EVN10AB NXP USA Inc. DWF13_AMF_CON_T0060.pdf Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
auf Bestellung 69 Stücke:
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1+63.2 EUR
10+51.44 EUR
25+48.5 EUR
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MCIMX6X1CVO08AC NXP USA Inc. IMX6SXIEC.pdf Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6X3CVO08AB MCIMX6X3CVO08AB NXP USA Inc. DWF13_AMF_CON_T0060.pdf Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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MMA2201KEGR2 NXP USA Inc. MMA2201KEG.pdf Description: ACCELEROMETER 40G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X
Acceleration Range: ±40g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 50
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MMA2204KEGR2 NXP USA Inc. MMA2204KEG.pdf Description: ACCEL 112.5G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X
Acceleration Range: ±112.5g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 20
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74LVC2G126GD,125 74LVC2G126GD,125 NXP USA Inc. 74LVC2G126.pdf Description: IC BUS BUFF DVR TRI-ST DL 8XSON
Packaging: Bulk
auf Bestellung 201000 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.25 EUR
Mindestbestellmenge: 2049
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74LVC2G02GD,125 74LVC2G02GD,125 NXP USA Inc. 74LVC2G02.pdf Description: IC GATE NOR 2CH 2-INP 8-XSON
Packaging: Bulk
auf Bestellung 130528 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.25 EUR
Mindestbestellmenge: 2049
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74AUP2G02GD,125 74AUP2G02GD,125 NXP USA Inc. 74AUP2G02.pdf Description: IC GATE NOR 2CH 2-INP 8-XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
auf Bestellung 98275 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.25 EUR
Mindestbestellmenge: 2049
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NVT4557UKAZ NVT4557UKAZ NXP USA Inc. Description: IC TRANSLTR BIDIRECTIONAL 9WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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NVT4557UKAZ NVT4557UKAZ NXP USA Inc. Description: IC TRANSLTR BIDIRECTIONAL 9WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
auf Bestellung 17490 Stücke:
Lieferzeit 10-14 Tag (e)
12+1.51 EUR
17+1.08 EUR
25+0.98 EUR
100+0.86 EUR
250+0.8 EUR
500+0.77 EUR
1000+0.74 EUR
2500+0.71 EUR
5000+0.69 EUR
Mindestbestellmenge: 12
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S908QB4E0CDTE S908QB4E0CDTE NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF4000EL/102Z52AK NXP USA Inc. Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4001EL/101Z305Y NXP USA Inc. Description: SAF4001EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4001EL/101Z305K NXP USA Inc. Description: SAF4001EL
Packaging: Tray
Produkt ist nicht verfügbar
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MPF5302AMMA0ES NXP USA Inc. PF5300_SDS.pdf Description: IC REG BUCK ADJ 15A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 15A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
Produkt ist nicht verfügbar
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MC35FS6513NAE MC35FS6513NAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.87 EUR
10+14.78 EUR
25+13.76 EUR
80+12.78 EUR
250+12.1 EUR
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J3R150P1U15/0ZA2AV NXP USA Inc. Description: J3R150P1U15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R150P1U15/0ZA2BV NXP USA Inc. Description: J3R150P1U15
Packaging: Tray
Produkt ist nicht verfügbar
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SCBGARBW1AO NXP USA Inc. Description: SOCKET SUPPORTING VERTICAL AUTOM
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
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N74F51D,602 N74F51D,602 NXP USA Inc. 74F51.pdf Description: IC GATE AND/OR/INVERT 2IN 14SOIC
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Logic Type: AND/OR/INVERT Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 10 Input (3, 3, 2, 2)
Schmitt Trigger Input: No
Supplier Device Package: 14-SO
Number of Circuits: 2
auf Bestellung 3420 Stücke:
Lieferzeit 10-14 Tag (e)
1902+0.27 EUR
Mindestbestellmenge: 1902
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MFS2400AVMA0ESR2 MFS2400AVMA0ESR2 NXP USA Inc. FS2400_SDS.pdf Description: MFS2400AVMA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVMA1ESR2 MFS2400AVMA1ESR2 NXP USA Inc. FS2400_SDS.pdf Description: Safety Mini CAN FD SBC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVMA0ES MFS2400AVMA0ES NXP USA Inc. FS2400_SDS.pdf Description: MFS2400AVMA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVBA0ESR2 MFS2400AVBA0ESR2 NXP USA Inc. FS2400.pdf Description: MFS2400AVBA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVBA0ES MFS2400AVBA0ES NXP USA Inc. FS2400_SDS.pdf Description: MFS2400AVBA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC44BS374T1EFR2 MC44BS374T1EFR2 NXP USA Inc. MC44BS374T1.pdf Description: IC NTSC/PAL MODULATOR 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: NTSC/PAL Modulator
Applications: Audio/Video, VCR's, Set-Top Boxes
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC20XS4200DFKR2 NXP USA Inc. MC20XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.4A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Produkt ist nicht verfügbar
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MKE02Z32VLD2 MKE02Z32VLD2 NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.21 EUR
10+4.7 EUR
25+4.32 EUR
160+3.69 EUR
320+3.5 EUR
480+3.3 EUR
Mindestbestellmenge: 3
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MCXA146VPJ NXP USA Inc. MCXAP100M96FS6.pdf Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA
Number of I/O: 82
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.26 EUR
10+8.67 EUR
25+8.02 EUR
80+7.4 EUR
260+6.95 EUR
Mindestbestellmenge: 2
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MCF51AG128CLK MCF51AG128CLK NXP USA Inc. MCF51AG128.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC16C852LIBS,151 SC16C852LIBS,151 NXP USA Inc. SC16C852L.pdf Description: IC UART DUAL W/FIFO 32-HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 1.8V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Produkt ist nicht verfügbar
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MIMX8UD3DVP08SC MIMX8UD3DVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 610 Stücke:
Lieferzeit 10-14 Tag (e)
1+43.86 EUR
10+38.91 EUR
25+37.1 EUR
40+36.21 EUR
80+34.92 EUR
230+33.05 EUR
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MCXA154VPJ MCXA154VPJ NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCU
Packaging: Tray
Package / Case: 112-VFBGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.88 EUR
10+5.52 EUR
25+5.15 EUR
100+4.53 EUR
260+4.29 EUR
Mindestbestellmenge: 3
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MCXA155VPJ NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.24 EUR
10+5.67 EUR
25+5.29 EUR
100+4.72 EUR
260+4.58 EUR
Mindestbestellmenge: 3
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MFS2633AMDAHAD MFS2633AMDAHAD NXP USA Inc. MFS2633AMDAJAD.pdf Description: MFS2633AMDAHAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
auf Bestellung 249 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.48 EUR
10+10.48 EUR
25+9.73 EUR
100+8.91 EUR
Mindestbestellmenge: 2
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MBMI7014TA1AER2 NXP USA Inc. BMI7014.pdf Description: MBMI7014TA1AER2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MBMI7014TA1AE NXP USA Inc. BMI7014.pdf Description: MBMI7014TA1AE
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4000EL/103Q200Y NXP USA Inc. Description: SAF4000EL/103Q200Y
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/103Q200K NXP USA Inc. Description: SAF4000EL/103Q200K
Packaging: Tray
Produkt ist nicht verfügbar
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LFDBGVCALS50R NXP USA Inc. Description: 156 PIN VERTICAL RING TO ROTATED
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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FRWY-LS1012A-PB NXP USA Inc. FRWY-LS1012A-PB_Web.pdf Description: LAYERSCAPE LS1012A FREEWAY BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1012A
Platform: Layerscape LS1012A Freeway
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LD6806CX4/33P,315 LD6806CX4/33P,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 3.3V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 9000 Stücke:
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3328+0.15 EUR
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MPX2053DP MPX2053DP NXP USA Inc. MPX2053.pdf Description: SENSOR 7.25PSID 0.19" .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube, Dual
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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S908AB32AH3VFUE S908AB32AH3VFUE NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S32K348GHT1MJBST S32K348GHT1MJBST NXP USA Inc. S32K3xx.pdf Description: S32K348GHT1MJBST
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCA9430HKZ NXP USA Inc. Description: IC BATT CHG 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Supplier Device Package: 16-XQFN (2.2x2.8)
Produkt ist nicht verfügbar
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SAF7755HV/N208WK NXP USA Inc. Description: MULTI-TUNER CAR RADIO & AUDIO ON
Packaging: Tray
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SAF775CHN/N208W/AK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
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MC33FS6508NAE MC33FS6508NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.85 EUR
10+12.29 EUR
25+11.72 EUR
40+11.44 EUR
80+11.03 EUR
250+10.4 EUR
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MKE04Z64VLH4R NXP USA Inc. MKE04P80M48SF0.pdf Description: KINETIS KE04: 48MHZ CORTEX-M0+ 5
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.86 EUR
10+6.09 EUR
25+5.81 EUR
50+5.6 EUR
100+5.41 EUR
250+5.16 EUR
500+4.97 EUR
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MKE04Z64VLK4R MKE04Z64VLK4R NXP USA Inc. MKE04P80M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 71
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+4.42 EUR
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MKE04Z64VLK4R MKE04Z64VLK4R NXP USA Inc. MKE04P80M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 71
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.61 EUR
10+6.57 EUR
25+6.06 EUR
100+5.5 EUR
250+5.23 EUR
500+5.07 EUR
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FXLS90220AESR2 NXP USA Inc. FXLS9xxx0.pdf Description: X SINGLE-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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SPC5602BACLH4R NXP USA Inc. Description: IC MCU 32BIT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PHP18NQ11T,127 PHP18NQ11T,127 NXP USA Inc. PHP18NQ11T.pdf Description: MOSFET N-CH 110V 18A TO220AB
Packaging: Bulk
auf Bestellung 663 Stücke:
Lieferzeit 10-14 Tag (e)
454+1.11 EUR
Mindestbestellmenge: 454
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PDTA144TMB,315 PDTA144TMB,315 NXP USA Inc. PHGLS24961-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistors Included: R1 Only
auf Bestellung 169326 Stücke:
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11225+0.051 EUR
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PDTA144WMB,315 PDTA144WMB,315 NXP USA Inc. PHGLS25680-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 22 kOhms
Resistors Included: R1 and R2
auf Bestellung 149782 Stücke:
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11225+0.051 EUR
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74LVC139PW,112 74LVC139PW,112 NXP USA Inc. 74LVC139.pdf Description: IC DUAL 2-4 DECOD/DEMUX 16TSSOP
Packaging: Bulk
auf Bestellung 7064 Stücke:
Lieferzeit 10-14 Tag (e)
1755+0.29 EUR
Mindestbestellmenge: 1755
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SPC5602DF1MLH3 SPC5602DF1MLH3 NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PDTC144VM,315 PDTC144V_SER.pdf
PDTC144VM,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Bulk
auf Bestellung 80000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11871+0.051 EUR
Mindestbestellmenge: 11871
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MCIMX6X3EVN10AB DWF13_AMF_CON_T0060.pdf
MCIMX6X3EVN10AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
auf Bestellung 69 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+63.2 EUR
10+51.44 EUR
25+48.5 EUR
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MCIMX6X1CVO08AC IMX6SXIEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6X3CVO08AB DWF13_AMF_CON_T0060.pdf
MCIMX6X3CVO08AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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MMA2201KEGR2 MMA2201KEG.pdf
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 40G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X
Acceleration Range: ±40g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 50
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MMA2204KEGR2 MMA2204KEG.pdf
Hersteller: NXP USA Inc.
Description: ACCEL 112.5G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X
Acceleration Range: ±112.5g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 20
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74LVC2G126GD,125 74LVC2G126.pdf
74LVC2G126GD,125
Hersteller: NXP USA Inc.
Description: IC BUS BUFF DVR TRI-ST DL 8XSON
Packaging: Bulk
auf Bestellung 201000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.25 EUR
Mindestbestellmenge: 2049
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74LVC2G02GD,125 74LVC2G02.pdf
74LVC2G02GD,125
Hersteller: NXP USA Inc.
Description: IC GATE NOR 2CH 2-INP 8-XSON
Packaging: Bulk
auf Bestellung 130528 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.25 EUR
Mindestbestellmenge: 2049
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74AUP2G02GD,125 74AUP2G02.pdf
74AUP2G02GD,125
Hersteller: NXP USA Inc.
Description: IC GATE NOR 2CH 2-INP 8-XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
auf Bestellung 98275 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.25 EUR
Mindestbestellmenge: 2049
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NVT4557UKAZ
NVT4557UKAZ
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 9WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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NVT4557UKAZ
NVT4557UKAZ
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 9WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
auf Bestellung 17490 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+1.51 EUR
17+1.08 EUR
25+0.98 EUR
100+0.86 EUR
250+0.8 EUR
500+0.77 EUR
1000+0.74 EUR
2500+0.71 EUR
5000+0.69 EUR
Mindestbestellmenge: 12
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S908QB4E0CDTE
S908QB4E0CDTE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF4000EL/102Z52AK
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4001EL/101Z305Y
Hersteller: NXP USA Inc.
Description: SAF4001EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4001EL/101Z305K
Hersteller: NXP USA Inc.
Description: SAF4001EL
Packaging: Tray
Produkt ist nicht verfügbar
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MPF5302AMMA0ES PF5300_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC REG BUCK ADJ 15A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 15A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
Produkt ist nicht verfügbar
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MC35FS6513NAE 35FS4500-35FS6500SDS.pdf
MC35FS6513NAE
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.87 EUR
10+14.78 EUR
25+13.76 EUR
80+12.78 EUR
250+12.1 EUR
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J3R150P1U15/0ZA2AV
Hersteller: NXP USA Inc.
Description: J3R150P1U15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R150P1U15/0ZA2BV
Hersteller: NXP USA Inc.
Description: J3R150P1U15
Packaging: Tray
Produkt ist nicht verfügbar
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SCBGARBW1AO
Hersteller: NXP USA Inc.
Description: SOCKET SUPPORTING VERTICAL AUTOM
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
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N74F51D,602 74F51.pdf
N74F51D,602
Hersteller: NXP USA Inc.
Description: IC GATE AND/OR/INVERT 2IN 14SOIC
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Logic Type: AND/OR/INVERT Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 10 Input (3, 3, 2, 2)
Schmitt Trigger Input: No
Supplier Device Package: 14-SO
Number of Circuits: 2
auf Bestellung 3420 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1902+0.27 EUR
Mindestbestellmenge: 1902
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MFS2400AVMA0ESR2 FS2400_SDS.pdf
MFS2400AVMA0ESR2
Hersteller: NXP USA Inc.
Description: MFS2400AVMA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVMA1ESR2 FS2400_SDS.pdf
MFS2400AVMA1ESR2
Hersteller: NXP USA Inc.
Description: Safety Mini CAN FD SBC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVMA0ES FS2400_SDS.pdf
MFS2400AVMA0ES
Hersteller: NXP USA Inc.
Description: MFS2400AVMA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVBA0ESR2 FS2400.pdf
MFS2400AVBA0ESR2
Hersteller: NXP USA Inc.
Description: MFS2400AVBA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVBA0ES FS2400_SDS.pdf
MFS2400AVBA0ES
Hersteller: NXP USA Inc.
Description: MFS2400AVBA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC44BS374T1EFR2 MC44BS374T1.pdf
MC44BS374T1EFR2
Hersteller: NXP USA Inc.
Description: IC NTSC/PAL MODULATOR 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: NTSC/PAL Modulator
Applications: Audio/Video, VCR's, Set-Top Boxes
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC20XS4200DFKR2 MC20XS4200.pdf
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.4A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Produkt ist nicht verfügbar
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MKE02Z32VLD2 MKE02P64M20SF0.pdf
MKE02Z32VLD2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.21 EUR
10+4.7 EUR
25+4.32 EUR
160+3.69 EUR
320+3.5 EUR
480+3.3 EUR
Mindestbestellmenge: 3
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MCXA146VPJ MCXAP100M96FS6.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA
Number of I/O: 82
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.26 EUR
10+8.67 EUR
25+8.02 EUR
80+7.4 EUR
260+6.95 EUR
Mindestbestellmenge: 2
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MCF51AG128CLK MCF51AG128.pdf
MCF51AG128CLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC16C852LIBS,151 SC16C852L.pdf
SC16C852LIBS,151
Hersteller: NXP USA Inc.
Description: IC UART DUAL W/FIFO 32-HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 1.8V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Produkt ist nicht verfügbar
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MIMX8UD3DVP08SC IMX8ULPIEC.pdf
MIMX8UD3DVP08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 610 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+43.86 EUR
10+38.91 EUR
25+37.1 EUR
40+36.21 EUR
80+34.92 EUR
230+33.05 EUR
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MCXA154VPJ MCXAP64M96FS3.pdf
MCXA154VPJ
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 112-VFBGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.88 EUR
10+5.52 EUR
25+5.15 EUR
100+4.53 EUR
260+4.29 EUR
Mindestbestellmenge: 3
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MCXA155VPJ MCXAP64M96FS3.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.24 EUR
10+5.67 EUR
25+5.29 EUR
100+4.72 EUR
260+4.58 EUR
Mindestbestellmenge: 3
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MFS2633AMDAHAD MFS2633AMDAJAD.pdf
MFS2633AMDAHAD
Hersteller: NXP USA Inc.
Description: MFS2633AMDAHAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
auf Bestellung 249 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.48 EUR
10+10.48 EUR
25+9.73 EUR
100+8.91 EUR
Mindestbestellmenge: 2
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MBMI7014TA1AER2 BMI7014.pdf
Hersteller: NXP USA Inc.
Description: MBMI7014TA1AER2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MBMI7014TA1AE BMI7014.pdf
Hersteller: NXP USA Inc.
Description: MBMI7014TA1AE
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4000EL/103Q200Y
Hersteller: NXP USA Inc.
Description: SAF4000EL/103Q200Y
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/103Q200K
Hersteller: NXP USA Inc.
Description: SAF4000EL/103Q200K
Packaging: Tray
Produkt ist nicht verfügbar
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LFDBGVCALS50R
Hersteller: NXP USA Inc.
Description: 156 PIN VERTICAL RING TO ROTATED
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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FRWY-LS1012A-PB FRWY-LS1012A-PB_Web.pdf
Hersteller: NXP USA Inc.
Description: LAYERSCAPE LS1012A FREEWAY BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1012A
Platform: Layerscape LS1012A Freeway
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+579.39 EUR
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LD6806CX4/33P,315 LD6806_Series.pdf
LD6806CX4/33P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3328+0.15 EUR
Mindestbestellmenge: 3328
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MPX2053DP MPX2053.pdf
MPX2053DP
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSID 0.19" .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube, Dual
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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S908AB32AH3VFUE
S908AB32AH3VFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S32K348GHT1MJBST S32K3xx.pdf
S32K348GHT1MJBST
Hersteller: NXP USA Inc.
Description: S32K348GHT1MJBST
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCA9430HKZ
Hersteller: NXP USA Inc.
Description: IC BATT CHG 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Supplier Device Package: 16-XQFN (2.2x2.8)
Produkt ist nicht verfügbar
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SAF7755HV/N208WK
Hersteller: NXP USA Inc.
Description: MULTI-TUNER CAR RADIO & AUDIO ON
Packaging: Tray
Produkt ist nicht verfügbar
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SAF775CHN/N208W/AK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
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MC33FS6508NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6508NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.85 EUR
10+12.29 EUR
25+11.72 EUR
40+11.44 EUR
80+11.03 EUR
250+10.4 EUR
Mindestbestellmenge: 2
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MKE04Z64VLH4R MKE04P80M48SF0.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KE04: 48MHZ CORTEX-M0+ 5
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.86 EUR
10+6.09 EUR
25+5.81 EUR
50+5.6 EUR
100+5.41 EUR
250+5.16 EUR
500+4.97 EUR
Mindestbestellmenge: 3
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MKE04Z64VLK4R MKE04P80M48SF0.pdf
MKE04Z64VLK4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 71
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+4.42 EUR
Mindestbestellmenge: 1000
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MKE04Z64VLK4R MKE04P80M48SF0.pdf
MKE04Z64VLK4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 71
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.61 EUR
10+6.57 EUR
25+6.06 EUR
100+5.5 EUR
250+5.23 EUR
500+5.07 EUR
Mindestbestellmenge: 3
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FXLS90220AESR2 FXLS9xxx0.pdf
Hersteller: NXP USA Inc.
Description: X SINGLE-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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SPC5602BACLH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PHP18NQ11T,127 PHP18NQ11T.pdf
PHP18NQ11T,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 110V 18A TO220AB
Packaging: Bulk
auf Bestellung 663 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
454+1.11 EUR
Mindestbestellmenge: 454
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PDTA144TMB,315 PHGLS24961-1.pdf?t.download=true&u=5oefqw
PDTA144TMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistors Included: R1 Only
auf Bestellung 169326 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11225+0.051 EUR
Mindestbestellmenge: 11225
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PDTA144WMB,315 PHGLS25680-1.pdf?t.download=true&u=5oefqw
PDTA144WMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 22 kOhms
Resistors Included: R1 and R2
auf Bestellung 149782 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11225+0.051 EUR
Mindestbestellmenge: 11225
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74LVC139PW,112 74LVC139.pdf
74LVC139PW,112
Hersteller: NXP USA Inc.
Description: IC DUAL 2-4 DECOD/DEMUX 16TSSOP
Packaging: Bulk
auf Bestellung 7064 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1755+0.29 EUR
Mindestbestellmenge: 1755
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SPC5602DF1MLH3 MPC5602D.pdf
SPC5602DF1MLH3
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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