Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36936) > Seite 576 nach 616

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 85
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: TRANS NPN 40V 1A SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 440mV @ 200mA, 2A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 500mA, 5V
Frequency - Transition: 150MHz
Supplier Device Package: SOT-666
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 500 mW

Hersteller: NXP USA Inc.
Description: TRANSISTOR PNP 45V 1A SOT223
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: LCD DRIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 36 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Grade: Automotive
Current - Supply: 1.2 µA
Qualification: AEC-Q100

Hersteller: NXP USA Inc.
Description: Y SINGLE-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)

Hersteller: NXP USA Inc.
Description: PSI5 Y SINGLE-AXIS MEDIUM-G INE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)

Hersteller: NXP USA Inc.
Description: PSI5 Z SINGLE-AXIS MEDIUM-G INE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: THYRISTOR .8A 600V TO-92
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: DIODE ESD PROT BI-DIR 5V SOD32-2
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 133 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF
Number of Bits per Element: 8

Hersteller: NXP USA Inc.
Description: LS1088 - QORIQ LAYERSCAPE 1088A
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: TRANS NPN 300V 100MA SOT223
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC BUFFER HEX NON-INV 16SOIC
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC AC THYRIST PWR SWITCH 8SO
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST DL 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 24-TSSOP

Hersteller: NXP USA Inc.
Description: NFC/RFID TAGS & TRANSPONDERS
Packaging: Tape & Reel (TR)
Package / Case: 36-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, ISO 18092, Mifare, NFC
Supplier Device Package: 36-VFBGA (3.5x3.5)

Hersteller: NXP USA Inc.
Description: RW610ET/A2IY
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 30V 1A SOD323
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC QUAD1:2 FET MUX/DEMUX 16TSSOP
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC 4BIT 1OF2 MUX/DEMUX 16SSOP
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC QUAD 1:2 FET MUX/DEMUX 16SSOP
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC QUAD 1:2 FET MUX/DEMUX 16SOIC
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC QUAD 1:2 MUX/DEMUX 16-DHVQFN
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)

Hersteller: NXP USA Inc.
Description: TRANS PNP 50V 3A SOT223
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC BCD COUNTER DUAL 16SOIC
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX 8X1 16SSOP
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14-SO
Packaging: Tube

Hersteller: NXP USA Inc.
Description: TRANSISTOR PWR LDMOS SOT1121
Packaging: Tape & Reel (TR)
Package / Case: SOT-1121A
Mounting Type: Chassis Mount
Frequency: 1.81GHz ~ 1.88GHz
Power - Output: 125W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 850 mA

Hersteller: NXP USA Inc.
Description: TRANSISTOR PWR LDMOS SOT1121A
Packaging: Tube
Package / Case: SOT-1121A
Mounting Type: Chassis Mount
Frequency: 1.81GHz ~ 1.88GHz
Power - Output: 125W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 850 mA

Hersteller: NXP USA Inc.
Description: TRANS LDMOS SOT502B
Packaging: Tape & Reel (TR)
Package / Case: SOT-502B
Current Rating (Amps): 56A
Mounting Type: Chassis Mount
Frequency: 1.47GHz ~ 1.51GHz
Power - Output: 50W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.6 A

Hersteller: NXP USA Inc.
Description: TRANS LDMOS SOT502B
Packaging: Tube
Package / Case: SOT-502B
Current Rating (Amps): 56A
Mounting Type: Chassis Mount
Frequency: 1.47GHz ~ 1.51GHz
Power - Output: 50W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.6 A

Hersteller: NXP USA Inc.
Description: TRANSISTOR PWR LDMOS SOT1121
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRANSISTOR PWR LDMOS SOT121
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRANSISTOR PWR LDMOS SOT1121
Packaging: Tube

Hersteller: NXP USA Inc.
Description: TRANSISTOR PWR LDMOS SOT121
Packaging: Tube

Hersteller: NXP USA Inc.
Description: TRANS LDMOS SOT1120A
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRANS LDMOS SOT1120B
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRANS LDMOS SOT1120A
Packaging: Tube

Hersteller: NXP USA Inc.
Description: TRANS LDMOS SOT1120B
Packaging: Tube

Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 1.88GHZ ACC-4L
Packaging: Tube

Hersteller: NXP USA Inc.
Description: FET RF 65V 2.17GHZ SOT502B
Packaging: Tray

Hersteller: NXP USA Inc.
Description: FET RF 65V 2.17GHZ SOT502B
Packaging: Tube

Hersteller: NXP USA Inc.
Description: TRANSISTOR PWR LDMOS SOT502
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRANS LDMOS SOT539B
Packaging: Tape & Reel (TR)
Package / Case: SOT539B
Current Rating (Amps): 45A
Mounting Type: Chassis Mount
Frequency: 1.47GHz ~ 1.51GHz
Configuration: Dual
Power - Output: 85W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: SOT539B
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 2.6 A

Hersteller: NXP USA Inc.
Description: TRANS LDMOS SOT539B
Packaging: Tube
Package / Case: SOT539B
Current Rating (Amps): 45A
Mounting Type: Chassis Mount
Frequency: 1.47GHz ~ 1.51GHz
Configuration: Dual
Power - Output: 85W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: SOT539B
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 2.6 A

Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM 20VC SOT23
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 8BIT 20SSOP
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 8BIT 20TSSOP
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 8BIT 20SOIC
Packaging: Tube

Hersteller: NXP USA Inc.
Description: TRANS NPN 160V 300MA SOT23
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 22 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2

Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 250MW SOT883
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC CONTROLLER SPI INTERFACE 16-T
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: MOSFET N/P-CH 30V SOT96-1
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC D-TYPE POS TRG DUAL 14SOIC
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 42
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC SHIFT/STORE REGISTER 16SSOP
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC MEDIA PROC 240MHZ 456-BGA
Packaging: Tray
Package / Case: 456-BGA
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.14V ~ 1.26V
Controller Series: Nexperia
Applications: Multimedia
Core Processor: TM3260
Supplier Device Package: 456-BGA (27x27)
Number of I/O: 61
DigiKey Programmable: Not Verified