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TFA9881UK/N1,023 TFA9881UK/N1,023 NXP USA Inc. TFA9881.pdf Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Features: Depop, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Packaging: Tape & Reel (TR)
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.3x1.3)
Produkt ist nicht verfügbar
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TFA9881UK/N1,023 TFA9881UK/N1,023 NXP USA Inc. TFA9881.pdf Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Features: Depop, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Packaging: Cut Tape (CT)
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.3x1.3)
Produkt ist nicht verfügbar
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MC33771CTA2AER2 MC33771CTA2AER2 NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTA2AE MC33771CTA2AE NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTP2AER2 MC33771CTP2AER2 NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTP2AE MC33771CTP2AE NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTA1AER2 MC33771CTA1AER2 NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTP1AER2 MC33771CTP1AER2 NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BATT-14EXTENDER NXP USA Inc. BATT-14EXTENDER.pdf Description: BATT-14EXTENDER
Packaging: Bulk
For Use With/Related Products: MC33771B, MC33771C
Accessory Type: Extender
Utilized IC / Part: MC33771B, MC33771C
Produkt ist nicht verfügbar
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BATT-14CEMULATOR NXP USA Inc. BATT-14CEMULATOR.pdf Description: BATT-14CEMULATOR
Packaging: Bulk
For Use With/Related Products: MC33771C
Accessory Type: Battery Pack Emulator
Utilized IC / Part: MC33771C
Produkt ist nicht verfügbar
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RD33771CNTREVM NXP USA Inc. get-started-with-the-rd33771cntrevm:GS-RD33771CNTREVM Description: EVAL BOARD FOR MC33771C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: MC33771C
Primary Attributes: Li-Ion (14 Cells)
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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S912ZVLA96AVFMR NXP USA Inc. Description: IC MCU 16BIT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PDTA144TM,315 PDTA144TM,315 NXP USA Inc. PDTA144T_SERIES.pdf Description: TRANS PREBIAS PNP 250MW SOT883
Packaging: Bulk
auf Bestellung 158100 Stücke:
Lieferzeit 10-14 Tag (e)
11871+0.049 EUR
Mindestbestellmenge: 11871
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MC33FS6525CAE MC33FS6525CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.56 EUR
10+8.48 EUR
25+8.09 EUR
40+7.89 EUR
80+7.62 EUR
250+7.36 EUR
Mindestbestellmenge: 2
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MC33FS6525NAE MC33FS6525NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525NAER2 MC33FS6525NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525KAER2 MC33FS6525KAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525CAER2 MC33FS6525CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525LAER2 MC33FS6525LAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525KAE MC33FS6525KAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MKE15Z256VLH7R NXP USA Inc. KE1xZP100M72SF0.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.8 EUR
10+8.7 EUR
25+8.3 EUR
50+8 EUR
100+7.72 EUR
250+7.36 EUR
500+7.1 EUR
Mindestbestellmenge: 2
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S912XEG128BCAAR S912XEG128BCAAR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74CBTLV16211DGG,11 74CBTLV16211DGG,11 NXP USA Inc. 74CBTLV16211.pdf Description: IC BUS SWITCH 24BIT LV 56-TSSOP
Packaging: Bulk
auf Bestellung 19943 Stücke:
Lieferzeit 10-14 Tag (e)
386+1.28 EUR
Mindestbestellmenge: 386
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74AUP1G17GX,125 74AUP1G17GX,125 NXP USA Inc. PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
auf Bestellung 125986 Stücke:
Lieferzeit 10-14 Tag (e)
4784+0.098 EUR
Mindestbestellmenge: 4784
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74AUP1G17GN,132 74AUP1G17GN,132 NXP USA Inc. PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
auf Bestellung 145000 Stücke:
Lieferzeit 10-14 Tag (e)
1920+0.26 EUR
Mindestbestellmenge: 1920
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S9S08DZ128F2MLLR S9S08DZ128F2MLLR NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5603BAMLL4 SPC5603BAMLL4 NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11E14FBD64/401, LPC11E14FBD64/401, NXP USA Inc. LPC11E6X.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 254 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.6 EUR
10+4.45 EUR
25+4.28 EUR
160+3.76 EUR
Mindestbestellmenge: 3
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FS32K148HFT0MLQT FS32K148HFT0MLQT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A5G26H605W19NR3 NXP USA Inc. A5G26H605W19N.pdf Description: A5G26H605W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 85W
Gain: 14.2dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
Produkt ist nicht verfügbar
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A7002CGHN1/T1AG502 A7002CGHN1/T1AG502 NXP USA Inc. 568_A700x.pdf Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
RAM Size: 3.2K x 8
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 1.62V ~ 5.5V
Controller Series: A700x
Program Memory Type: EEPROM (76.4kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9552D,118 PCA9552D,118 NXP USA Inc. PCA9552.pdf Description: IC LED DRIVER PS 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+2.75 EUR
Mindestbestellmenge: 1000
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PCA9552D,118 PCA9552D,118 NXP USA Inc. PCA9552.pdf Description: IC LED DRIVER PS 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
auf Bestellung 2070 Stücke:
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4+5 EUR
10+3.75 EUR
25+3.44 EUR
100+3.09 EUR
250+2.93 EUR
500+2.83 EUR
Mindestbestellmenge: 4
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PCA9532D,118 PCA9532D,118 NXP USA Inc. PCA9532.pdf Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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PCA9532D,118 PCA9532D,118 NXP USA Inc. PCA9532.pdf Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
auf Bestellung 424 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.03 EUR
10+3.78 EUR
25+3.46 EUR
100+3.11 EUR
250+2.95 EUR
Mindestbestellmenge: 4
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LD6836CX4/33H,315 LD6836CX4/33H,315 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 3.3V 300MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
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TDA8035HN/C1/S1EL TDA8035HN/C1/S1EL NXP USA Inc. TDA8035.pdf Description: HIGH INTEGRATED AND LOW POWER SM
Packaging: Bulk
auf Bestellung 2449 Stücke:
Lieferzeit 10-14 Tag (e)
491+1 EUR
Mindestbestellmenge: 491
Im Einkaufswagen  Stück im Wert von  UAH
MPC565CZP56 MPC565CZP56 NXP USA Inc. MPC565PB.pdf Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MGD3160AM515EKR2 MGD3160AM515EKR2 NXP USA Inc. PB_GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MGD3160AM515EKR2 MGD3160AM515EKR2 NXP USA Inc. PB_GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
auf Bestellung 698 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.58 EUR
10+12.13 EUR
25+11.27 EUR
100+10.32 EUR
250+9.87 EUR
500+9.6 EUR
Mindestbestellmenge: 2
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NAFE13388B40BSMP NAFE13388B40BSMP NXP USA Inc. NAFE13388.pdf Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
NAFE13388B40BSMP NAFE13388B40BSMP NXP USA Inc. NAFE13388.pdf Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)
1+36.96 EUR
10+29.58 EUR
25+27.74 EUR
100+25.71 EUR
250+24.75 EUR
500+24.17 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SAF775DHN/N208WCMP NXP USA Inc. Description: SAF775DHN/N208WCMP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775DHN/N208W/CK NXP USA Inc. Description: SAF775DHN/N208W/CK
Packaging: Tray
Produkt ist nicht verfügbar
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SAF7754HV/N208WY NXP USA Inc. Description: CAR DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7754HV/N208WK NXP USA Inc. Description: CAR DSP
Packaging: Tray
Produkt ist nicht verfügbar
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SAF7755HN/N208WMP NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775DHV/N208W/FY NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7755HN/N208WK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
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SAF775DHV/N208W/BK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
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SAF7755HV/N208WY NXP USA Inc. Description: MULTI-TUNER CAR RADIO & AUDIO ON
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775CHN/N208WBMP NXP USA Inc. Description: CAR DISP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775DHV/N208W/FK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
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SAF775CHN/N208WAMP NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775CHN/N208W/SK NXP USA Inc. Description: CAR DISP
Packaging: Tray
Produkt ist nicht verfügbar
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KMI85HP NXP USA Inc. Description: KMI85
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMI85/WHP NXP USA Inc. Description: KMI85
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
KMI85/PHP NXP USA Inc. Description: KMI85
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMA321/AZ NXP USA Inc. KMA321_A.pdf Description: PROGRAMMABLE ANGLE SENSOR
Packaging: Tape & Reel (TR)
Package / Case: 4-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 180°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 4-SIL
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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KMA310/AZ NXP USA Inc. KMA310_A.pdf Description: KMA310
Packaging: Tape & Reel (TR)
Package / Case: 3-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 180°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 3-SIL
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TFA9881UK/N1,023 TFA9881.pdf
TFA9881UK/N1,023
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Features: Depop, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Packaging: Tape & Reel (TR)
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.3x1.3)
Produkt ist nicht verfügbar
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TFA9881UK/N1,023 TFA9881.pdf
TFA9881UK/N1,023
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Features: Depop, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Packaging: Cut Tape (CT)
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.3x1.3)
Produkt ist nicht verfügbar
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MC33771CTA2AER2 MC33771C.pdf
MC33771CTA2AER2
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTA2AE MC33771C.pdf
MC33771CTA2AE
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTP2AER2 MC33771C.pdf
MC33771CTP2AER2
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTP2AE MC33771C.pdf
MC33771CTP2AE
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTA1AER2 MC33771C.pdf
MC33771CTA1AER2
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33771CTP1AER2 MC33771C.pdf
MC33771CTP1AER2
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BATT-14EXTENDER BATT-14EXTENDER.pdf
Hersteller: NXP USA Inc.
Description: BATT-14EXTENDER
Packaging: Bulk
For Use With/Related Products: MC33771B, MC33771C
Accessory Type: Extender
Utilized IC / Part: MC33771B, MC33771C
Produkt ist nicht verfügbar
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BATT-14CEMULATOR BATT-14CEMULATOR.pdf
Hersteller: NXP USA Inc.
Description: BATT-14CEMULATOR
Packaging: Bulk
For Use With/Related Products: MC33771C
Accessory Type: Battery Pack Emulator
Utilized IC / Part: MC33771C
Produkt ist nicht verfügbar
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RD33771CNTREVM get-started-with-the-rd33771cntrevm:GS-RD33771CNTREVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33771C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: MC33771C
Primary Attributes: Li-Ion (14 Cells)
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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S912ZVLA96AVFMR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PDTA144TM,315 PDTA144T_SERIES.pdf
PDTA144TM,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 250MW SOT883
Packaging: Bulk
auf Bestellung 158100 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11871+0.049 EUR
Mindestbestellmenge: 11871
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MC33FS6525CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6525CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.56 EUR
10+8.48 EUR
25+8.09 EUR
40+7.89 EUR
80+7.62 EUR
250+7.36 EUR
Mindestbestellmenge: 2
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MC33FS6525NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6525NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525NAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6525NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525KAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6525KAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525CAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6525CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525LAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6525LAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525KAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6525KAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MKE15Z256VLH7R KE1xZP100M72SF0.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.8 EUR
10+8.7 EUR
25+8.3 EUR
50+8 EUR
100+7.72 EUR
250+7.36 EUR
500+7.1 EUR
Mindestbestellmenge: 2
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S912XEG128BCAAR MC9S12XEP100RMV1.pdf
S912XEG128BCAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74CBTLV16211DGG,11 74CBTLV16211.pdf
74CBTLV16211DGG,11
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 24BIT LV 56-TSSOP
Packaging: Bulk
auf Bestellung 19943 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
386+1.28 EUR
Mindestbestellmenge: 386
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74AUP1G17GX,125 PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw
74AUP1G17GX,125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
auf Bestellung 125986 Stücke:
Lieferzeit 10-14 Tag (e)
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4784+0.098 EUR
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74AUP1G17GN,132 PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw
74AUP1G17GN,132
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
auf Bestellung 145000 Stücke:
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Anzahl Preis
1920+0.26 EUR
Mindestbestellmenge: 1920
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S9S08DZ128F2MLLR MC9S08DZ128.pdf
S9S08DZ128F2MLLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5603BAMLL4
SPC5603BAMLL4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11E14FBD64/401, LPC11E6X.pdf
LPC11E14FBD64/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 254 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.6 EUR
10+4.45 EUR
25+4.28 EUR
160+3.76 EUR
Mindestbestellmenge: 3
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FS32K148HFT0MLQT S32K1xx.pdf
FS32K148HFT0MLQT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A5G26H605W19NR3 A5G26H605W19N.pdf
Hersteller: NXP USA Inc.
Description: A5G26H605W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 85W
Gain: 14.2dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
Produkt ist nicht verfügbar
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A7002CGHN1/T1AG502 568_A700x.pdf
A7002CGHN1/T1AG502
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
RAM Size: 3.2K x 8
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 1.62V ~ 5.5V
Controller Series: A700x
Program Memory Type: EEPROM (76.4kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9552D,118 PCA9552.pdf
PCA9552D,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER PS 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
auf Bestellung 1000 Stücke:
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Anzahl Preis
1000+2.75 EUR
Mindestbestellmenge: 1000
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PCA9552D,118 PCA9552.pdf
PCA9552D,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER PS 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
auf Bestellung 2070 Stücke:
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Anzahl Preis
4+5 EUR
10+3.75 EUR
25+3.44 EUR
100+3.09 EUR
250+2.93 EUR
500+2.83 EUR
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PCA9532D,118 PCA9532.pdf
PCA9532D,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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PCA9532D,118 PCA9532.pdf
PCA9532D,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
auf Bestellung 424 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.03 EUR
10+3.78 EUR
25+3.46 EUR
100+3.11 EUR
250+2.95 EUR
Mindestbestellmenge: 4
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LD6836CX4/33H,315 LD6836.pdf
LD6836CX4/33H,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 300MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
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TDA8035HN/C1/S1EL TDA8035.pdf
TDA8035HN/C1/S1EL
Hersteller: NXP USA Inc.
Description: HIGH INTEGRATED AND LOW POWER SM
Packaging: Bulk
auf Bestellung 2449 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
491+1 EUR
Mindestbestellmenge: 491
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MPC565CZP56 MPC565PB.pdf
MPC565CZP56
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MGD3160AM515EKR2 PB_GD3160.pdf
MGD3160AM515EKR2
Hersteller: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MGD3160AM515EKR2 PB_GD3160.pdf
MGD3160AM515EKR2
Hersteller: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
auf Bestellung 698 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.58 EUR
10+12.13 EUR
25+11.27 EUR
100+10.32 EUR
250+9.87 EUR
500+9.6 EUR
Mindestbestellmenge: 2
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NAFE13388B40BSMP NAFE13388.pdf
NAFE13388B40BSMP
Hersteller: NXP USA Inc.
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
Produkt ist nicht verfügbar
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NAFE13388B40BSMP NAFE13388.pdf
NAFE13388B40BSMP
Hersteller: NXP USA Inc.
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+36.96 EUR
10+29.58 EUR
25+27.74 EUR
100+25.71 EUR
250+24.75 EUR
500+24.17 EUR
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SAF775DHN/N208WCMP
Hersteller: NXP USA Inc.
Description: SAF775DHN/N208WCMP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775DHN/N208W/CK
Hersteller: NXP USA Inc.
Description: SAF775DHN/N208W/CK
Packaging: Tray
Produkt ist nicht verfügbar
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SAF7754HV/N208WY
Hersteller: NXP USA Inc.
Description: CAR DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7754HV/N208WK
Hersteller: NXP USA Inc.
Description: CAR DSP
Packaging: Tray
Produkt ist nicht verfügbar
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SAF7755HN/N208WMP
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775DHV/N208W/FY
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7755HN/N208WK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
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SAF775DHV/N208W/BK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
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SAF7755HV/N208WY
Hersteller: NXP USA Inc.
Description: MULTI-TUNER CAR RADIO & AUDIO ON
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775CHN/N208WBMP
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775DHV/N208W/FK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
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SAF775CHN/N208WAMP
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF775CHN/N208W/SK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Tray
Produkt ist nicht verfügbar
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KMI85HP
Hersteller: NXP USA Inc.
Description: KMI85
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMI85/WHP
Hersteller: NXP USA Inc.
Description: KMI85
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMI85/PHP
Hersteller: NXP USA Inc.
Description: KMI85
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMA321/AZ KMA321_A.pdf
Hersteller: NXP USA Inc.
Description: PROGRAMMABLE ANGLE SENSOR
Packaging: Tape & Reel (TR)
Package / Case: 4-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 180°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 4-SIL
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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KMA310/AZ KMA310_A.pdf
Hersteller: NXP USA Inc.
Description: KMA310
Packaging: Tape & Reel (TR)
Package / Case: 3-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 180°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 3-SIL
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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