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FS32K148HAT0VLLR FS32K148HAT0VLLR NXP USA Inc. S32K1xx.pdf Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
Produkt ist nicht verfügbar
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FS32K148HAT0MLLR FS32K148HAT0MLLR NXP USA Inc. S32K1xx.pdf Description: S32K148 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
Produkt ist nicht verfügbar
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FS32K148HAT0VLQR FS32K148HAT0VLQR NXP USA Inc. S32K1xx.pdf Description: S32K148 32-BIT MCU, ARM CORTEX-
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 156
Produkt ist nicht verfügbar
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FX32K148HAT0MLLT FX32K148HAT0MLLT NXP USA Inc. S32K1xx.pdf Description: S32K148 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
Produkt ist nicht verfügbar
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SAF7772EL/200Z10AK NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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A2T18H455W23NR6 NXP USA Inc. A2T18H455W23N.pdf Description: RF MOSFET LDMOS 31.5V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 56dBm
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2S
Voltage - Rated: 65 V
Voltage - Test: 31.5 V
Current - Test: 1.08 A
Produkt ist nicht verfügbar
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LD6836TD/28P,125 LD6836TD/28P,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 2.8V 300MA 5-TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 7067 Stücke:
Lieferzeit 10-14 Tag (e)
2664+0.18 EUR
Mindestbestellmenge: 2664
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TEA2376DT/1Y TEA2376DT/1Y NXP USA Inc. TEA2376DT.pdf Description: IC PFC CTRLR 25KHZ-300KHZ 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Frequency - Switching: 25kHz ~ 300kHz
Mode: Discontinuous (Transition)
Supplier Device Package: 14-SO
auf Bestellung 2486 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.38 EUR
10+3.27 EUR
25+2.99 EUR
100+2.68 EUR
250+2.53 EUR
500+2.44 EUR
1000+2.37 EUR
Mindestbestellmenge: 5
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SAF4000EL/101Z574Y NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/101Z574K NXP USA Inc. Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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NCJ29D5DHN/00201Y NXP USA Inc. NCJ29D5FS.pdf Description: NCJ29D5DHN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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NCJ29D5DHN/00201Y NXP USA Inc. NCJ29D5FS.pdf Description: NCJ29D5DHN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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SPC5601PEF0MLL6 SPC5601PEF0MLL6 NXP USA Inc. MPC5602P.pdf Description: IC MCU 32BIT 192KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12ZVLS3F0VFMR S9S12ZVLS3F0VFMR NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 32KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9514AD,118 PCA9514AD,118 NXP USA Inc. PCA9513A_PCA9514A.pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 3.5mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Capacitance - Input: 1.9 pF
Produkt ist nicht verfügbar
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PCA9514AD,118 PCA9514AD,118 NXP USA Inc. PCA9513A_PCA9514A.pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 3.5mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Capacitance - Input: 1.9 pF
Produkt ist nicht verfügbar
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CBTW28DD14AETJ CBTW28DD14AETJ NXP USA Inc. CBTW28DD14.pdf Description: 14-BIT BUS SWITCH/MULTIPLEXER FO
Packaging: Tape & Reel (TR)
Features: Bi-Directional
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Applications: Memory
On-State Resistance (Max): 10Ohm (Typ)
-3db Bandwidth: 2.5GHz
Supplier Device Package: 48-TFBGA (4.5x4.5)
Voltage - Supply, Single (V+): 1.4V ~ 2V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 1
Produkt ist nicht verfügbar
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FS32K148HET0MLQT FS32K148HET0MLQT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148URT0VLQR FS32K148URT0VLQR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148URT0VLQT FS32K148URT0VLQT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PN5321A3HN/C106,51 PN5321A3HN/C106,51 NXP USA Inc. PN532_C1.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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PN5321A3HN/C106,51 PN5321A3HN/C106,51 NXP USA Inc. PN532_C1.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 2772 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.56 EUR
10+22.23 EUR
25+21.08 EUR
100+19.49 EUR
250+18.54 EUR
500+17.87 EUR
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MC9S08SL8VTJ MC9S08SL8VTJ NXP USA Inc. Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2929FBD144,551 LPC2929FBD144,551 NXP USA Inc. LPC2926_27_29.pdf Description: IC MCU 16/32B 768KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH23C0DA8/00J NXP USA Inc. Description: MF3DH23C0DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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BUK7105-40AIE,118 BUK7105-40AIE,118 NXP USA Inc. BUK7105-40AIE_Feb9%2C2009_DS.pdf Description: MOSFET N-CH 40V 75A D2PAK
Packaging: Bulk
auf Bestellung 5620 Stücke:
Lieferzeit 10-14 Tag (e)
245+2 EUR
Mindestbestellmenge: 245
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MRF8S9170NR3 MRF8S9170NR3 NXP USA Inc. MRF8S9170NR3.pdf Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 920MHz
Power - Output: 50W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1 A
Produkt ist nicht verfügbar
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MRFX1K80NR5 MRFX1K80NR5 NXP USA Inc. MRFX1K80N.pdf Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V
Produkt ist nicht verfügbar
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MPL3115A2ST1 MPL3115A2ST1 NXP USA Inc. MPL3115A2.pdf Description: IC BAROMETRIC SENSOR I2C 8-TSON
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Mounting Type: Surface Mount
Supplier Device Package: 8-LGA (3x5)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+4.43 EUR
Mindestbestellmenge: 1000
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MPL3115A2ST1 MPL3115A2ST1 NXP USA Inc. MPL3115A2.pdf Description: IC BAROMETRIC SENSOR I2C 8-TSON
Packaging: Cut Tape (CT)
Package / Case: 8-TLGA
Mounting Type: Surface Mount
Supplier Device Package: 8-LGA (3x5)
auf Bestellung 1026 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.62 EUR
5+5.92 EUR
10+5.67 EUR
25+5.36 EUR
50+5.15 EUR
100+4.96 EUR
500+4.57 EUR
Mindestbestellmenge: 3
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MCXA142VLF MCXA142VLF NXP USA Inc. MCXAP64M96FS3.pdf Description: IC
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 38
Produkt ist nicht verfügbar
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PN7640EV/C101Y NXP USA Inc. Description: PN7640EV
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PN7640EV/C101E NXP USA Inc. Description: PN7640EV
Packaging: Tray
Produkt ist nicht verfügbar
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LFLAIBK77MZ3A NXP USA Inc. Description: MPC5777M 512 PIN 0.8 MM PGA LOGI
Packaging: Bulk
For Use With/Related Products: MPC5777M
Module/Board Type: Socket Module - PGA
Utilized IC / Part: MPC5777M
Produkt ist nicht verfügbar
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S9S08DZ128F2MLHR S9S08DZ128F2MLHR NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NT2H1611G0DUFZ NXP USA Inc. Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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LD6806F/33P,115 LD6806F/33P,115 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 3.3V 200MA 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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LPC54113J256UK49Z LPC54113J256UK49Z NXP USA Inc. LPC5411X.pdf Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.44x3.44)
Number of I/O: 39
DigiKey Programmable: Not Verified
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BF1203,115 BF1203,115 NXP USA Inc. BF1203_Rev_Oct2010.pdf Description: RF MOSFET 5V 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 27dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
Produkt ist nicht verfügbar
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BF1203,115 BF1203,115 NXP USA Inc. BF1203_Rev_Oct2010.pdf Description: RF MOSFET 5V 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 27dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
Produkt ist nicht verfügbar
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TEA88182T/1J NXP USA Inc. Description: PFC CONTROLLER
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA88182T/1J NXP USA Inc. Description: PFC CONTROLLER
Packaging: Bulk
DigiKey Programmable: Not Verified
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NXLS95230AESR2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMC2001HCAB33B MMC2001HCAB33B NXP USA Inc. MMC2001PB.pdf Description: IC MCU 32BIT 256KB ROM 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: M210
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OL2361AHN/002AAJ OL2361AHN/002AAJ NXP USA Inc. Description: IC RF 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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MPC8313ZQAGDC MPC8313ZQAGDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MC9S08SH8CTGR MC9S08SH8CTGR NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
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5000+3.76 EUR
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S32M244LCABWKHST S32M244LCABWKHST NXP USA Inc. S32M2xx_DS.pdf Description: S32M244LCABWKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 480 Stücke:
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10+21.51 EUR
25+20.85 EUR
160+17.77 EUR
320+16.61 EUR
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MCXA155VLL NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCU 32BIT 512KB FLASH
Packaging: Tray
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Produkt ist nicht verfügbar
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SAF4000EL/101Z201Y NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/101Z201K NXP USA Inc. Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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S912ZVC12F0VLF S912ZVC12F0VLF NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RDW8997-PCUS-R1 NXP USA Inc. Description: RDW8997-PCUS-R1
Packaging: Bulk
Produkt ist nicht verfügbar
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FX32K118LAT0MLFT NXP USA Inc. S32K1xx.pdf Description: S32K118 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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MKL82Z128VMC7 MKL82Z128VMC7 NXP USA Inc. KL82P121M72SF0.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 85
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BB202,135 BB202,135 NXP USA Inc. BB202_N.pdf Description: DIODE VAR CAP 6V 10MA SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 85°C (TJ)
Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
Capacitance Ratio Condition: C0.2/C2.3
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 6 V
Capacitance Ratio: 2.5
Produkt ist nicht verfügbar
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BB202,135 BB202,135 NXP USA Inc. BB202_N.pdf Description: DIODE VAR CAP 6V 10MA SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 85°C (TJ)
Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
Capacitance Ratio Condition: C0.2/C2.3
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 6 V
Capacitance Ratio: 2.5
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18+1.02 EUR
100+0.75 EUR
500+0.58 EUR
1000+0.49 EUR
2000+0.46 EUR
5000+0.42 EUR
Mindestbestellmenge: 14
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PN5190B1EV/C121E NXP USA Inc. PN5190B1.pdf Description: NFC FRONTEND SUPPORTING CHALLENG
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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PN5190B2HN/C130Y PN5190B2HN/C130Y NXP USA Inc. PN5190B2.pdf Description: PN5190B2HN/C130Y
Packaging: Tape & Reel (TR)
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
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PN5190B1HN/C121Y PN5190B1HN/C121Y NXP USA Inc. PN5190B1.pdf Description: NFC FRONTEND SUPPORTING CHALLENG
Packaging: Tape & Reel (TR)
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
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FS32K148HAT0VLLR S32K1xx.pdf
FS32K148HAT0VLLR
Hersteller: NXP USA Inc.
Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
Produkt ist nicht verfügbar
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FS32K148HAT0MLLR S32K1xx.pdf
FS32K148HAT0MLLR
Hersteller: NXP USA Inc.
Description: S32K148 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
Produkt ist nicht verfügbar
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FS32K148HAT0VLQR S32K1xx.pdf
FS32K148HAT0VLQR
Hersteller: NXP USA Inc.
Description: S32K148 32-BIT MCU, ARM CORTEX-
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 156
Produkt ist nicht verfügbar
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FX32K148HAT0MLLT S32K1xx.pdf
FX32K148HAT0MLLT
Hersteller: NXP USA Inc.
Description: S32K148 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
Produkt ist nicht verfügbar
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SAF7772EL/200Z10AK
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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A2T18H455W23NR6 A2T18H455W23N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 31.5V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 56dBm
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2S
Voltage - Rated: 65 V
Voltage - Test: 31.5 V
Current - Test: 1.08 A
Produkt ist nicht verfügbar
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LD6836TD/28P,125 LD6836.pdf
LD6836TD/28P,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.8V 300MA 5-TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 7067 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2664+0.18 EUR
Mindestbestellmenge: 2664
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TEA2376DT/1Y TEA2376DT.pdf
TEA2376DT/1Y
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR 25KHZ-300KHZ 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Frequency - Switching: 25kHz ~ 300kHz
Mode: Discontinuous (Transition)
Supplier Device Package: 14-SO
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5+4.38 EUR
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100+2.68 EUR
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SAF4000EL/101Z574Y
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/101Z574K
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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NCJ29D5DHN/00201Y NCJ29D5FS.pdf
Hersteller: NXP USA Inc.
Description: NCJ29D5DHN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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NCJ29D5DHN/00201Y NCJ29D5FS.pdf
Hersteller: NXP USA Inc.
Description: NCJ29D5DHN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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SPC5601PEF0MLL6 MPC5602P.pdf
SPC5601PEF0MLL6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12ZVLS3F0VFMR S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVLS3F0VFMR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9514AD,118 PCA9513A_PCA9514A.pdf
PCA9514AD,118
Hersteller: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 3.5mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Capacitance - Input: 1.9 pF
Produkt ist nicht verfügbar
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PCA9514AD,118 PCA9513A_PCA9514A.pdf
PCA9514AD,118
Hersteller: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 3.5mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Capacitance - Input: 1.9 pF
Produkt ist nicht verfügbar
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CBTW28DD14AETJ CBTW28DD14.pdf
CBTW28DD14AETJ
Hersteller: NXP USA Inc.
Description: 14-BIT BUS SWITCH/MULTIPLEXER FO
Packaging: Tape & Reel (TR)
Features: Bi-Directional
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Applications: Memory
On-State Resistance (Max): 10Ohm (Typ)
-3db Bandwidth: 2.5GHz
Supplier Device Package: 48-TFBGA (4.5x4.5)
Voltage - Supply, Single (V+): 1.4V ~ 2V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 1
Produkt ist nicht verfügbar
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FS32K148HET0MLQT S32K1xx.pdf
FS32K148HET0MLQT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148URT0VLQR S32K1xx.pdf
FS32K148URT0VLQR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148URT0VLQT S32K1xx.pdf
FS32K148URT0VLQT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PN5321A3HN/C106,51 PN532_C1.pdf
PN5321A3HN/C106,51
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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PN5321A3HN/C106,51 PN532_C1.pdf
PN5321A3HN/C106,51
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 2772 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.56 EUR
10+22.23 EUR
25+21.08 EUR
100+19.49 EUR
250+18.54 EUR
500+17.87 EUR
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MC9S08SL8VTJ
MC9S08SL8VTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2929FBD144,551 LPC2926_27_29.pdf
LPC2929FBD144,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 768KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH23C0DA8/00J
Hersteller: NXP USA Inc.
Description: MF3DH23C0DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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BUK7105-40AIE,118 BUK7105-40AIE_Feb9%2C2009_DS.pdf
BUK7105-40AIE,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 75A D2PAK
Packaging: Bulk
auf Bestellung 5620 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
245+2 EUR
Mindestbestellmenge: 245
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MRF8S9170NR3 MRF8S9170NR3.pdf
MRF8S9170NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 920MHz
Power - Output: 50W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1 A
Produkt ist nicht verfügbar
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MRFX1K80NR5 MRFX1K80N.pdf
MRFX1K80NR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V
Produkt ist nicht verfügbar
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MPL3115A2ST1 MPL3115A2.pdf
MPL3115A2ST1
Hersteller: NXP USA Inc.
Description: IC BAROMETRIC SENSOR I2C 8-TSON
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Mounting Type: Surface Mount
Supplier Device Package: 8-LGA (3x5)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+4.43 EUR
Mindestbestellmenge: 1000
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MPL3115A2ST1 MPL3115A2.pdf
MPL3115A2ST1
Hersteller: NXP USA Inc.
Description: IC BAROMETRIC SENSOR I2C 8-TSON
Packaging: Cut Tape (CT)
Package / Case: 8-TLGA
Mounting Type: Surface Mount
Supplier Device Package: 8-LGA (3x5)
auf Bestellung 1026 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.62 EUR
5+5.92 EUR
10+5.67 EUR
25+5.36 EUR
50+5.15 EUR
100+4.96 EUR
500+4.57 EUR
Mindestbestellmenge: 3
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MCXA142VLF MCXAP64M96FS3.pdf
MCXA142VLF
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 38
Produkt ist nicht verfügbar
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PN7640EV/C101Y
Hersteller: NXP USA Inc.
Description: PN7640EV
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PN7640EV/C101E
Hersteller: NXP USA Inc.
Description: PN7640EV
Packaging: Tray
Produkt ist nicht verfügbar
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LFLAIBK77MZ3A
Hersteller: NXP USA Inc.
Description: MPC5777M 512 PIN 0.8 MM PGA LOGI
Packaging: Bulk
For Use With/Related Products: MPC5777M
Module/Board Type: Socket Module - PGA
Utilized IC / Part: MPC5777M
Produkt ist nicht verfügbar
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S9S08DZ128F2MLHR MC9S08DZ128.pdf
S9S08DZ128F2MLHR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NT2H1611G0DUFZ
Hersteller: NXP USA Inc.
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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LD6806F/33P,115 LD6806_Series.pdf
LD6806F/33P,115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 200MA 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 23750 Stücke:
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Anzahl Preis
2219+0.24 EUR
Mindestbestellmenge: 2219
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LPC54113J256UK49Z LPC5411X.pdf
LPC54113J256UK49Z
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.44x3.44)
Number of I/O: 39
DigiKey Programmable: Not Verified
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Anzahl Preis
91+5.14 EUR
Mindestbestellmenge: 91
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BF1203,115 BF1203_Rev_Oct2010.pdf
BF1203,115
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 27dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
Produkt ist nicht verfügbar
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BF1203,115 BF1203_Rev_Oct2010.pdf
BF1203,115
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 27dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
Produkt ist nicht verfügbar
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TEA88182T/1J
Hersteller: NXP USA Inc.
Description: PFC CONTROLLER
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA88182T/1J
Hersteller: NXP USA Inc.
Description: PFC CONTROLLER
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 1794 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
489+1.03 EUR
Mindestbestellmenge: 489
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NXLS95230AESR2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMC2001HCAB33B MMC2001PB.pdf
MMC2001HCAB33B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB ROM 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: M210
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OL2361AHN/002AAJ
OL2361AHN/002AAJ
Hersteller: NXP USA Inc.
Description: IC RF 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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MPC8313ZQAGDC MPC8313E_Hrdw_Spec.pdf
MPC8313ZQAGDC
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MC9S08SH8CTGR MC9S08SH32.pdf
MC9S08SH8CTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5000+3.76 EUR
Mindestbestellmenge: 5000
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S32M244LCABWKHST S32M2xx_DS.pdf
S32M244LCABWKHST
Hersteller: NXP USA Inc.
Description: S32M244LCABWKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 480 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.48 EUR
10+21.51 EUR
25+20.85 EUR
160+17.77 EUR
320+16.61 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MCXA155VLL MCXAP64M96FS3.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH
Packaging: Tray
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Produkt ist nicht verfügbar
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SAF4000EL/101Z201Y
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/101Z201K
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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S912ZVC12F0VLF S12ZVCFS.pdf
S912ZVC12F0VLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RDW8997-PCUS-R1
Hersteller: NXP USA Inc.
Description: RDW8997-PCUS-R1
Packaging: Bulk
Produkt ist nicht verfügbar
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FX32K118LAT0MLFT S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K118 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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MKL82Z128VMC7 KL82P121M72SF0.pdf
MKL82Z128VMC7
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 85
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BB202,135 BB202_N.pdf
BB202,135
Hersteller: NXP USA Inc.
Description: DIODE VAR CAP 6V 10MA SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 85°C (TJ)
Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
Capacitance Ratio Condition: C0.2/C2.3
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 6 V
Capacitance Ratio: 2.5
Produkt ist nicht verfügbar
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BB202,135 BB202_N.pdf
BB202,135
Hersteller: NXP USA Inc.
Description: DIODE VAR CAP 6V 10MA SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 85°C (TJ)
Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
Capacitance Ratio Condition: C0.2/C2.3
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 6 V
Capacitance Ratio: 2.5
auf Bestellung 9970 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
14+1.3 EUR
18+1.02 EUR
100+0.75 EUR
500+0.58 EUR
1000+0.49 EUR
2000+0.46 EUR
5000+0.42 EUR
Mindestbestellmenge: 14
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PN5190B1EV/C121E PN5190B1.pdf
Hersteller: NXP USA Inc.
Description: NFC FRONTEND SUPPORTING CHALLENG
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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PN5190B2HN/C130Y PN5190B2.pdf
PN5190B2HN/C130Y
Hersteller: NXP USA Inc.
Description: PN5190B2HN/C130Y
Packaging: Tape & Reel (TR)
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
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PN5190B1HN/C121Y PN5190B1.pdf
PN5190B1HN/C121Y
Hersteller: NXP USA Inc.
Description: NFC FRONTEND SUPPORTING CHALLENG
Packaging: Tape & Reel (TR)
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
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