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PCA9535HF,118 PCA9535HF,118 NXP USA Inc. PCA9535_PCA9535C.pdf Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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FRDM-STBI-A8971 FRDM-STBI-A8971 NXP USA Inc. FRDM-STBI-A8971.pdf Description: FRDM-STBI-A8971
Packaging: Bulk
auf Bestellung 4 Stücke:
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1+44.86 EUR
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MCXE245VLFR MCXE245VLFR NXP USA Inc. MCXEP144M112F70.pdf Description: MCXE245 LQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
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MC9S12DJ64MFUE MC9S12DJ64MFUE NXP USA Inc. 9S12DT256_ZIP.zip Description: IC MCU 16BIT 64KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
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SAF7770EL/202Z13CY NXP USA Inc. Description: AUDIO DSPS
Packaging: Tape & Reel (TR)
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SAF7770EL/202Z13CK NXP USA Inc. Description: IC
Packaging: Tray
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SC32PF8121EKEP NXP USA Inc. Description: PMIC, 7 BUCK REG, 4 LDOS
Packaging: Tray
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SC33PF8200KKESR2 NXP USA Inc. Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
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PMCM6501UNEZ PMCM6501UNEZ NXP USA Inc. PMCM6501UNE.pdf Description: PMCM6501UNE - 20V, N-CHANNEL TRE
Packaging: Bulk
auf Bestellung 4464 Stücke:
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1254+0.43 EUR
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SL2S2602FUD/BGZ NXP USA Inc. SL2S2602.pdf Description: IC RFID TRANSP 13.56MHZ WAFER
Supplier Device Package: Wafer
Standards: ISO 15693
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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BGU8063J BGU8063J NXP USA Inc. BGU8063.pdf Description: IC AMP GPS 2.5GHZ-4GHZ 10HVSON
Supplier Device Package: 10-HVSON (3x3)
P1dB: 19dBm
Noise Figure: 1.4dB
Current - Supply: 75mA
Gain: 20dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: General Purpose
Frequency: 2.5GHz ~ 4GHz
Mounting Type: Surface Mount
Package / Case: 10-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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ASL2507SHNY ASL2507SHNY NXP USA Inc. ASL2500SHN.pdf Description: BOOST CONVERTER + FSO
Packaging: Tape & Reel (TR)
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KIT-TJA1121-SDBR NXP USA Inc. KIT-TJA1121-UG.pdf Description: KIT-TJA1121-SDBR
Packaging: Bulk
Produkt ist nicht verfügbar
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P3A1604UKAZ P3A1604UKAZ NXP USA Inc. P3A1604UK.pdf Description: IC XLTR VL BIDIR 12-WLCSP
Output Type: Tri-State
Package / Case: 12-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Voltage - VCCB: 1.62 V ~ 3.63 V
Voltage - VCCA: 0.72 V ~ 1.98 V
Channels per Circuit: 4
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 12-WLCSP (1.06x1.41)
Data Rate: 40Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
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P3A1604UKAZ P3A1604UKAZ NXP USA Inc. P3A1604UK.pdf Description: IC XLTR VL BIDIR 12-WLCSP
Number of Circuits: 1
Voltage - VCCB: 1.62 V ~ 3.63 V
Voltage - VCCA: 0.72 V ~ 1.98 V
Channels per Circuit: 4
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 12-WLCSP (1.06x1.41)
Data Rate: 40Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 12-UFBGA, WLCSP
Packaging: Cut Tape (CT)
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9+2.48 EUR
12+1.8 EUR
25+1.63 EUR
100+1.44 EUR
250+1.36 EUR
500+1.32 EUR
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MFS2401AVMAFESR2 MFS2401AVMAFESR2 NXP USA Inc. FS2400.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MFS2401AVMAFES MFS2401AVMAFES NXP USA Inc. FS2400.pdf Description: IC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MBMI7014TA2AER2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
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SFS2633AMDDZADR2 NXP USA Inc. Description: AUTO SBC
Packaging: Tape & Reel (TR)
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SFS2633AMDDZAD NXP USA Inc. Description: AUTO SBC
Packaging: Tray
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MBMI7014TA2AE MBMI7014TA2AE NXP USA Inc. BMI7014-MIM-PSP-TEST.pdf Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
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MCXN235VDFR NXP USA Inc. MCXN23x.pdf Description: IC
Packaging: Tape & Reel (TR)
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SC33FS8520DVKSR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: FS8500
Packaging: Tape & Reel (TR)
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MIMX9101DVXXCAB MIMX9101DVXXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9101CVXXCAB MIMX9101CVXXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9121DVVXCAB MIMX9121DVVXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9121CVVXCAB MIMX9121CVVXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111DVXXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111CVXXJAB MIMX9111CVXXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131DVVXJAB MIMX9131DVVXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131CVVXJAB MIMX9131CVVXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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1+25.35 EUR
10+19.96 EUR
25+18.6 EUR
100+17.12 EUR
250+16.42 EUR
500+15.99 EUR
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MFS2300BMBA0EPR2 MFS2300BMBA0EPR2 NXP USA Inc. FS23DS.pdf Description: MFS2300BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
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MC9S12E256VPVE MC9S12E256VPVE NXP USA Inc. MC9S12E256V1.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 2x8b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX8UD7DVP08SC MIMX8UD7DVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
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1+37.4 EUR
10+29.86 EUR
25+27.96 EUR
100+25.89 EUR
250+24.91 EUR
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MIMX8MN2DVTJZAA MIMX8MN2DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
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10+41.84 EUR
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PCA9460AUKZ PCA9460AUKZ NXP USA Inc. PCA9460.pdf Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
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PCA9460AUKZ PCA9460AUKZ NXP USA Inc. PCA9460.pdf Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Cut Tape (CT)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
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3+8.44 EUR
10+6.41 EUR
25+5.9 EUR
100+5.34 EUR
250+5.08 EUR
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MC32PF4210A4ESR2 MC32PF4210A4ESR2 NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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MC32PF4210A4ES MC32PF4210A4ES NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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PCAL9539AHF,128 PCAL9539AHF,128 NXP USA Inc. PCAL9539A.pdf Description: IC XPNDR 400KHZ I2C 24HWQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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BTS6201UJ BTS6201UJ NXP USA Inc. BTS6201U.pdf Description: BTS6201U
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.5dB
Current - Supply: 95mA
Noise Figure: 3.4dB
P1dB: 27dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
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CWA-VSPA--FL NXP USA Inc. Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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ZK-HC08AX-A NXP USA Inc. Description: MC68HC908AB/AS/AZ EVAL BRD
Utilized IC / Part: MC68HC908AB/AS/AZ
Core Processor: HC08
Contents: Board(s), Cable(s), Power Supply
Type: MCU 8-Bit
Mounting Type: Socket
Packaging: Box
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MRFE6S9160HSR3 MRFE6S9160HSR3 NXP USA Inc. MRFE6S9160HR3H%28S%29R3.pdf Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.2 A
Voltage - Test: 28 V
Voltage - Rated: 66 V
Supplier Device Package: NI-780S
Technology: LDMOS
Gain: 21dB
Power - Output: 35W
Frequency: 880MHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
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SE050D2HQ1/Z01PAZ NXP USA Inc. Description: SE050D2HQ1/Z01PAZ
DigiKey Programmable: Not Verified
Packaging: Bulk
Produkt ist nicht verfügbar
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MC35FS4505NAER2 MC35FS4505NAER2 NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS4505NAE MC35FS4505NAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC50XS4200DEKR2 MC50XS4200DEKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 1.65A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 41mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
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MC22XS4200DEKR2 MC22XS4200DEKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 4.2A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 18.7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
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MC50XS4200DEK MC50XS4200DEK NXP USA Inc. MC20XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Current - Output (Max): 1.65A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 41mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tube
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
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MC17XS6400DEKR2 MC17XS6400DEKR2 NXP USA Inc. MC07XS6517.pdf Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:6
Current - Output (Max): 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Input Type: Non-Inverting
Rds On (Typ): 15mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
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MC20XS4200BDFKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
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MC20XS4200DFK MC20XS4200DFK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
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MC22XS4200DEK MC22XS4200DEK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Packaging: Tube
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 4.2A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 18.7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled
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MC17XS6400DEK MC17XS6400DEK NXP USA Inc. MC12XS6D3.pdf Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:6
Current - Output (Max): 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Input Type: Non-Inverting
Rds On (Typ): 15mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tube
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MC20XS4200BDFK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
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MC06XS4200DFKR2 MC06XS4200DFKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 6MOH
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 12A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: CMOS
Rds On (Typ): 12mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
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MGD3162AM551EKT MGD3162AM551EKT NXP USA Inc. SDS_GD3162.pdf Description: MGD3162AM551EKT
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
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NAFE11348B40BSK NXP USA Inc. NAFE11388.pdf Description: NAFE11348B40BSK
Packaging: Tray
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NAFE11348B40BSE NXP USA Inc. NAFE11388.pdf Description: NAFE11348B40BSE
Packaging: Tray
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PCA9535HF,118 PCA9535_PCA9535C.pdf
PCA9535HF,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM-STBI-A8971 FRDM-STBI-A8971.pdf
FRDM-STBI-A8971
Hersteller: NXP USA Inc.
Description: FRDM-STBI-A8971
Packaging: Bulk
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AnzahlPrivatkunde
1+44.86 EUR
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MCXE245VLFR MCXEP144M112F70.pdf
MCXE245VLFR
Hersteller: NXP USA Inc.
Description: MCXE245 LQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
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MC9S12DJ64MFUE 9S12DT256_ZIP.zip
MC9S12DJ64MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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SAF7770EL/202Z13CY
Hersteller: NXP USA Inc.
Description: AUDIO DSPS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7770EL/202Z13CK
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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SC32PF8121EKEP
Hersteller: NXP USA Inc.
Description: PMIC, 7 BUCK REG, 4 LDOS
Packaging: Tray
Produkt ist nicht verfügbar
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SC33PF8200KKESR2
Hersteller: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PMCM6501UNEZ PMCM6501UNE.pdf
PMCM6501UNEZ
Hersteller: NXP USA Inc.
Description: PMCM6501UNE - 20V, N-CHANNEL TRE
Packaging: Bulk
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SL2S2602FUD/BGZ SL2S2602.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Supplier Device Package: Wafer
Standards: ISO 15693
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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BGU8063J BGU8063.pdf
BGU8063J
Hersteller: NXP USA Inc.
Description: IC AMP GPS 2.5GHZ-4GHZ 10HVSON
Supplier Device Package: 10-HVSON (3x3)
P1dB: 19dBm
Noise Figure: 1.4dB
Current - Supply: 75mA
Gain: 20dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: General Purpose
Frequency: 2.5GHz ~ 4GHz
Mounting Type: Surface Mount
Package / Case: 10-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ASL2507SHNY ASL2500SHN.pdf
ASL2507SHNY
Hersteller: NXP USA Inc.
Description: BOOST CONVERTER + FSO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KIT-TJA1121-SDBR KIT-TJA1121-UG.pdf
Hersteller: NXP USA Inc.
Description: KIT-TJA1121-SDBR
Packaging: Bulk
Produkt ist nicht verfügbar
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P3A1604UKAZ P3A1604UK.pdf
P3A1604UKAZ
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-WLCSP
Output Type: Tri-State
Package / Case: 12-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Voltage - VCCB: 1.62 V ~ 3.63 V
Voltage - VCCA: 0.72 V ~ 1.98 V
Channels per Circuit: 4
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 12-WLCSP (1.06x1.41)
Data Rate: 40Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
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P3A1604UKAZ P3A1604UK.pdf
P3A1604UKAZ
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-WLCSP
Number of Circuits: 1
Voltage - VCCB: 1.62 V ~ 3.63 V
Voltage - VCCA: 0.72 V ~ 1.98 V
Channels per Circuit: 4
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 12-WLCSP (1.06x1.41)
Data Rate: 40Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 12-UFBGA, WLCSP
Packaging: Cut Tape (CT)
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9+2.48 EUR
12+1.8 EUR
25+1.63 EUR
100+1.44 EUR
250+1.36 EUR
500+1.32 EUR
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MFS2401AVMAFESR2 FS2400.pdf
MFS2401AVMAFESR2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2401AVMAFES FS2400.pdf
MFS2401AVMAFES
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MBMI7014TA2AER2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SFS2633AMDDZADR2
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SFS2633AMDDZAD
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
Produkt ist nicht verfügbar
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MBMI7014TA2AE BMI7014-MIM-PSP-TEST.pdf
MBMI7014TA2AE
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
Produkt ist nicht verfügbar
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MCXN235VDFR MCXN23x.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SC33FS8520DVKSR2 FS84_FS85C_DS.pdf
Hersteller: NXP USA Inc.
Description: FS8500
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX9101DVXXCAB IMX91FAMFS.pdf
MIMX9101DVXXCAB
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9101CVXXCAB IMX91FAMFS.pdf
MIMX9101CVXXCAB
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9121DVVXCAB IMX91FAMFS.pdf
MIMX9121DVVXCAB
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9121CVVXCAB IMX91FAMFS.pdf
MIMX9121CVVXCAB
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9111DVXXJAB IMX91FAMFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9111CVXXJAB IMX91FAMFS.pdf
MIMX9111CVXXJAB
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131DVVXJAB IMX91FAMFS.pdf
MIMX9131DVVXJAB
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9131CVVXJAB IMX91FAMFS.pdf
MIMX9131CVVXJAB
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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1+25.35 EUR
10+19.96 EUR
25+18.6 EUR
100+17.12 EUR
250+16.42 EUR
500+15.99 EUR
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MFS2300BMBA0EPR2 FS23DS.pdf
MFS2300BMBA0EPR2
Hersteller: NXP USA Inc.
Description: MFS2300BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC9S12E256VPVE MC9S12E256V1.pdf
MC9S12E256VPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 2x8b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX8UD7DVP08SC IMX8ULPIEC.pdf
MIMX8UD7DVP08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
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1+37.4 EUR
10+29.86 EUR
25+27.96 EUR
100+25.89 EUR
250+24.91 EUR
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MIMX8MN2DVTJZAA IMX8MNCEC.pdf
MIMX8MN2DVTJZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
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1+51.92 EUR
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PCA9460AUKZ PCA9460.pdf
PCA9460AUKZ
Hersteller: NXP USA Inc.
Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
Produkt ist nicht verfügbar
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PCA9460AUKZ PCA9460.pdf
PCA9460AUKZ
Hersteller: NXP USA Inc.
Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Cut Tape (CT)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
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3+8.44 EUR
10+6.41 EUR
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100+5.34 EUR
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MC32PF4210A4ESR2 PF4210.pdf
MC32PF4210A4ESR2
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC32PF4210A4ES PF4210.pdf
MC32PF4210A4ES
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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PCAL9539AHF,128 PCAL9539A.pdf
PCAL9539AHF,128
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24HWQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BTS6201UJ BTS6201U.pdf
BTS6201UJ
Hersteller: NXP USA Inc.
Description: BTS6201U
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.5dB
Current - Supply: 95mA
Noise Figure: 3.4dB
P1dB: 27dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
auf Bestellung 5817 Stücke:
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3+7.66 EUR
10+6.62 EUR
25+6.25 EUR
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500+5.25 EUR
1000+5.05 EUR
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CWA-VSPA--FL
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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ZK-HC08AX-A
Hersteller: NXP USA Inc.
Description: MC68HC908AB/AS/AZ EVAL BRD
Utilized IC / Part: MC68HC908AB/AS/AZ
Core Processor: HC08
Contents: Board(s), Cable(s), Power Supply
Type: MCU 8-Bit
Mounting Type: Socket
Packaging: Box
Produkt ist nicht verfügbar
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MRFE6S9160HSR3 MRFE6S9160HR3H%28S%29R3.pdf
MRFE6S9160HSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.2 A
Voltage - Test: 28 V
Voltage - Rated: 66 V
Supplier Device Package: NI-780S
Technology: LDMOS
Gain: 21dB
Power - Output: 35W
Frequency: 880MHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SE050D2HQ1/Z01PAZ
Hersteller: NXP USA Inc.
Description: SE050D2HQ1/Z01PAZ
DigiKey Programmable: Not Verified
Packaging: Bulk
Produkt ist nicht verfügbar
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MC35FS4505NAER2 FS6500-FS4500-ASILD.pdf
MC35FS4505NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS4505NAE FS6500-FS4500-ASILD.pdf
MC35FS4505NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC50XS4200DEKR2 MC22XS4200.pdf
MC50XS4200DEKR2
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 1.65A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 41mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC22XS4200DEKR2 MC22XS4200.pdf
MC22XS4200DEKR2
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 4.2A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 18.7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC50XS4200DEK MC20XS4200.pdf
MC50XS4200DEK
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Current - Output (Max): 1.65A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 41mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tube
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Produkt ist nicht verfügbar
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MC17XS6400DEKR2 MC07XS6517.pdf
MC17XS6400DEKR2
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:6
Current - Output (Max): 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Input Type: Non-Inverting
Rds On (Typ): 15mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Produkt ist nicht verfügbar
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MC20XS4200BDFKR2 MC22XS4200.pdf
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC20XS4200DFK MC22XS4200.pdf
MC20XS4200DFK
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
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MC22XS4200DEK MC22XS4200.pdf
MC22XS4200DEK
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Packaging: Tube
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 4.2A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 18.7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled
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MC17XS6400DEK MC12XS6D3.pdf
MC17XS6400DEK
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:6
Current - Output (Max): 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Input Type: Non-Inverting
Rds On (Typ): 15mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tube
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MC20XS4200BDFK MC22XS4200.pdf
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
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MC06XS4200DFKR2 MC22XS4200.pdf
MC06XS4200DFKR2
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 6MOH
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 12A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: CMOS
Rds On (Typ): 12mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
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MGD3162AM551EKT SDS_GD3162.pdf
MGD3162AM551EKT
Hersteller: NXP USA Inc.
Description: MGD3162AM551EKT
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
auf Bestellung 836 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+19.96 EUR
10+15.62 EUR
25+14.54 EUR
176+12.99 EUR
352+12.61 EUR
528+12.42 EUR
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NAFE11348B40BSK NAFE11388.pdf
Hersteller: NXP USA Inc.
Description: NAFE11348B40BSK
Packaging: Tray
Produkt ist nicht verfügbar
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NAFE11348B40BSE NAFE11388.pdf
Hersteller: NXP USA Inc.
Description: NAFE11348B40BSE
Packaging: Tray
Produkt ist nicht verfügbar
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