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MCF5235CVM100J MCF5235CVM100J NXP USA Inc. MCF523x.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Core Size: 32-Bit
Core Processor: Coldfire V2
Program Memory Type: ROMless
DigiKey Programmable: Not Verified
Number of I/O: 113
Supplier Device Package: 256-MAPBGA (17x17)
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MCF5235CVF150 MCF5235CVF150 NXP USA Inc. MCF523x.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Package / Case: 256-LBGA
Packaging: Tray
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Speed: 150MHz
Mounting Type: Surface Mount
Number of I/O: 113
Supplier Device Package: 256-MAPBGA (17x17)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
DigiKey Programmable: Not Verified
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MCF5235CVM150J MCF5235CVM150J NXP USA Inc. MCF523x.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
DigiKey Programmable: Not Verified
Number of I/O: 97
Supplier Device Package: 256-MAPBGA (17x17)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
RAM Size: 64K x 8
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
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MCXA156VLH MCXA156VLH NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
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MPF9453AVMB1HNR2 NXP USA Inc. PF9453_SDS.pdf Description: IC
Packaging: Tape & Reel (TR)
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MPF9453ACMB1HNR2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
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MPF9453ACMB1HN NXP USA Inc. PF9453.pdf Description: IC
Packaging: Tray
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MPF9453AVMB1HN NXP USA Inc. PF9453.pdf Description: IC
Packaging: Tray
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MPF9453ACMA1HNR2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
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MPF9453ACMA1HN NXP USA Inc. Description: IC
Packaging: Tray
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A5G26H606W19NR3 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
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MC33879BPEKR2 MC33879BPEKR2 NXP USA Inc. MC33879.pdf Description: IC SW SERIAL OCTAL 32SOIC
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High/Low Side
Rds On (Typ): 750mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Battery, Short Circuit, UVLO
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10+7.66 EUR
25+7.07 EUR
100+6.41 EUR
250+6.14 EUR
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BZX84-C62/LF1R BZX84-C62/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 62V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 62 V
Impedance (Max) (Zzt): 215 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 43.4 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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LPC11U36FBD64/401, LPC11U36FBD64/401, NXP USA Inc. LPC11U3x.pdf Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KIT-STBI-A8971 KIT-STBI-A8971 NXP USA Inc. UM11910.pdf Description: Dev Kit FXLS8971
Packaging: Box
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8971CF
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
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LPC55S66JEV59Y LPC55S66JEV59Y NXP USA Inc. LPC55S6x.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S66JEV59E LPC55S66JEV59E NXP USA Inc. LPC55S6x.pdf Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC5528JEV59Y LPC5528JEV59Y NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC5528JEV59E LPC5528JEV59E NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S28JEV59Y LPC55S28JEV59Y NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S28JEV59E LPC55S28JEV59E NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S69JEV59Y LPC55S69JEV59Y NXP USA Inc. LPC55S6x.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S69JEV59E LPC55S69JEV59E NXP USA Inc. LPC55S6x.pdf Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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P1023NXE5CFB NXP USA Inc. P1_Series_FS.pdf Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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MC33FS6518NAER2 MC33FS6518NAER2 NXP USA Inc. 35FS4500-35FS6500-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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NCX8200UKZ NCX8200UKZ NXP USA Inc. NCX8200.pdf Description: IC AUDIO SWITCH 1-CH 9-WLCSP
Packaging: Bulk
Package / Case: 9-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Audio Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 3.6V
Applications: Consumer Audio
Supplier Device Package: 9-WLCSP (1.22x1.22)
Number of Channels: 1
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MPC8541VTAJD MPC8541VTAJD NXP USA Inc. MPC8541EEC.pdf Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI
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TJA1465ATK/0J TJA1465ATK/0J NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
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TJA1465ATK/0J TJA1465ATK/0J NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
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7+3.36 EUR
10+2.48 EUR
25+2.25 EUR
100+2 EUR
250+1.88 EUR
500+1.81 EUR
1000+1.75 EUR
2500+1.69 EUR
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TJA1465AT/0Z TJA1465AT/0Z NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
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TJA1465AT/0Z TJA1465AT/0Z NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
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10+2.48 EUR
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100+2 EUR
250+1.88 EUR
500+1.81 EUR
1000+1.75 EUR
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TJA1465BHG/0J NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
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TJA1465BHG/0J NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
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TJA1466AHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466AHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1466CHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Package / Case: 18-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
Type: Transceiver
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Duplex: Half
Receiver Hysteresis: 50 mV
Supplier Device Package: 18-DHVQFN (3x4.5)
Protocol: CANbus
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1466CHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Package / Case: 18-VQFN Exposed Pad
Packaging: Cut Tape (CT)
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 18-DHVQFN (3x4.5)
Protocol: CANbus
Duplex: Half
Receiver Hysteresis: 50 mV
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Produkt ist nicht verfügbar
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TJA1466BHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Supplier Device Package: 18-DHVQFN (3x4.5)
Protocol: CANbus
Type: Transceiver
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 50 mV
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 18-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TJA1466BHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Package / Case: 18-VQFN Exposed Pad
Packaging: Cut Tape (CT)
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Duplex: Half
Receiver Hysteresis: 50 mV
Supplier Device Package: 18-DHVQFN (3x4.5)
Protocol: CANbus
Qualification: AEC-Q100
Grade: Automotive
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Produkt ist nicht verfügbar
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MC9S08DV48ACLH MC9S08DV48ACLH NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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MVR5510AMDALES MVR5510AMDALES NXP USA Inc. VR5510.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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PCA9554CBSHP PCA9554CBSHP NXP USA Inc. PCA9554B_PCA9554C.pdf Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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PCA9554CBSHP PCA9554CBSHP NXP USA Inc. PCA9554B_PCA9554C.pdf Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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PCA9554CPWJ PCA9554CPWJ NXP USA Inc. PCA9554B_PCA9554C.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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PCA9554BBSHP PCA9554BBSHP NXP USA Inc. PCA9554B_PCA9554C.pdf Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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MF1PH4230DA8/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
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LD6836TD/20H,125 LD6836TD/20H,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 2V 300MA 5-TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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MCF5470VR200 MCF5470VR200 NXP USA Inc. MCF5475EC.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
DigiKey Programmable: Not Verified
Number of I/O: 99
Supplier Device Package: 388-PBGA (27x27)
Peripherals: DMA, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V4E
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 32K x 8
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
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RDBESS774A1EVB NXP USA Inc. BESS10FS.pdf Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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RDBESS772BJBEVB NXP USA Inc. BESS10FS.pdf Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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RD33772C14VEVM NXP USA Inc. getting-started-with-the-rd33772c14vevm-reference-design:GS-RD33772C14VEVM Description: EVAL BOARD FOR FS26
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS26, MC33772C, S32K344
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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RD-BESS1500BUN NXP USA Inc. BESS10FS.pdf Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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RD-BESS1-PREM NXP USA Inc. BESS10FS.pdf Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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MPL115A2ST1 MPL115A2ST1 NXP USA Inc. MPL115A2.pdf Description: IC BAROMETRIC SENSOR I2C 8-TSON
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
Produkt ist nicht verfügbar
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MPL115A2ST1 MPL115A2ST1 NXP USA Inc. MPL115A2.pdf Description: IC BAROMETRIC SENSOR I2C 8-TSON
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
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5+7.91 EUR
10+7.58 EUR
25+7.18 EUR
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MFS2613AMBA0AD MFS2613AMBA0AD NXP USA Inc. FS26_PB.pdf Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MFS8620BMDA8ES MFS8620BMDA8ES NXP USA Inc. FS8600_SDS.pdf Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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2+12.7 EUR
10+9.78 EUR
25+9.06 EUR
100+8.25 EUR
260+7.85 EUR
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MFS2613AMDA0AD MFS2613AMDA0AD NXP USA Inc. FS26_PB.pdf Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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MFS2633AMDAJAD MFS2633AMDAJAD NXP USA Inc. MFS2633AMDAJAD.pdf Description: MFS2633AMDAJAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
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MFS2633AMDAKAD MFS2633AMDAKAD NXP USA Inc. MFS2633AMDAJAD.pdf Description: MFS2633AMDAKAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
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MCF5235CVM100J MCF523x.pdf
MCF5235CVM100J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Core Size: 32-Bit
Core Processor: Coldfire V2
Program Memory Type: ROMless
DigiKey Programmable: Not Verified
Number of I/O: 113
Supplier Device Package: 256-MAPBGA (17x17)
Produkt ist nicht verfügbar
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MCF5235CVF150 MCF523x.pdf
MCF5235CVF150
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Package / Case: 256-LBGA
Packaging: Tray
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Speed: 150MHz
Mounting Type: Surface Mount
Number of I/O: 113
Supplier Device Package: 256-MAPBGA (17x17)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF5235CVM150J MCF523x.pdf
MCF5235CVM150J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
DigiKey Programmable: Not Verified
Number of I/O: 97
Supplier Device Package: 256-MAPBGA (17x17)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
RAM Size: 64K x 8
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MCXA156VLH
MCXA156VLH
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
Produkt ist nicht verfügbar
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MPF9453AVMB1HNR2 PF9453_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPF9453ACMB1HNR2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPF9453ACMB1HN PF9453.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MPF9453AVMB1HN PF9453.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MPF9453ACMA1HNR2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPF9453ACMA1HN
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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A5G26H606W19NR3
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33879BPEKR2 MC33879.pdf
MC33879BPEKR2
Hersteller: NXP USA Inc.
Description: IC SW SERIAL OCTAL 32SOIC
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High/Low Side
Rds On (Typ): 750mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Battery, Short Circuit, UVLO
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3+10.03 EUR
10+7.66 EUR
25+7.07 EUR
100+6.41 EUR
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BZX84-C62/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C62/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 62V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 62 V
Impedance (Max) (Zzt): 215 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 43.4 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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LPC11U36FBD64/401, LPC11U3x.pdf
LPC11U36FBD64/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KIT-STBI-A8971 UM11910.pdf
KIT-STBI-A8971
Hersteller: NXP USA Inc.
Description: Dev Kit FXLS8971
Packaging: Box
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8971CF
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
auf Bestellung 5 Stücke:
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AnzahlPrivatkunde
1+169.04 EUR
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LPC55S66JEV59Y LPC55S6x.pdf
LPC55S66JEV59Y
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
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LPC55S66JEV59E LPC55S6x.pdf
LPC55S66JEV59E
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
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LPC5528JEV59Y LPC55S2x_LPC552x.pdf
LPC5528JEV59Y
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
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LPC5528JEV59E LPC55S2x_LPC552x.pdf
LPC5528JEV59E
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
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LPC55S28JEV59Y LPC55S2x_LPC552x.pdf
LPC55S28JEV59Y
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
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LPC55S28JEV59E LPC55S2x_LPC552x.pdf
LPC55S28JEV59E
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
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LPC55S69JEV59Y LPC55S6x.pdf
LPC55S69JEV59Y
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
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LPC55S69JEV59E LPC55S6x.pdf
LPC55S69JEV59E
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Produkt ist nicht verfügbar
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P1023NXE5CFB P1_Series_FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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MC33FS6518NAER2 35FS4500-35FS6500-ASILB.pdf
MC33FS6518NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NCX8200UKZ NCX8200.pdf
NCX8200UKZ
Hersteller: NXP USA Inc.
Description: IC AUDIO SWITCH 1-CH 9-WLCSP
Packaging: Bulk
Package / Case: 9-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Audio Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 3.6V
Applications: Consumer Audio
Supplier Device Package: 9-WLCSP (1.22x1.22)
Number of Channels: 1
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
662+0.8 EUR
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MPC8541VTAJD MPC8541EEC.pdf
MPC8541VTAJD
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI
Produkt ist nicht verfügbar
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TJA1465ATK/0J TJA1465.pdf
TJA1465ATK/0J
Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6000+1.64 EUR
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TJA1465ATK/0J TJA1465.pdf
TJA1465ATK/0J
Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7+3.36 EUR
10+2.48 EUR
25+2.25 EUR
100+2 EUR
250+1.88 EUR
500+1.81 EUR
1000+1.75 EUR
2500+1.69 EUR
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TJA1465AT/0Z TJA1465.pdf
TJA1465AT/0Z
Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+1.69 EUR
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TJA1465AT/0Z TJA1465.pdf
TJA1465AT/0Z
Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7+3.36 EUR
10+2.48 EUR
25+2.25 EUR
100+2 EUR
250+1.88 EUR
500+1.81 EUR
1000+1.75 EUR
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TJA1465BHG/0J TJA1465.pdf
Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Produkt ist nicht verfügbar
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TJA1465BHG/0J TJA1465.pdf
Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Produkt ist nicht verfügbar
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TJA1466AHG/0J TJA1466.pdf
Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1466AHG/0J TJA1466.pdf
Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1466CHG/0J TJA1466.pdf
Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Package / Case: 18-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
Type: Transceiver
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Duplex: Half
Receiver Hysteresis: 50 mV
Supplier Device Package: 18-DHVQFN (3x4.5)
Protocol: CANbus
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1466CHG/0J TJA1466.pdf
Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Package / Case: 18-VQFN Exposed Pad
Packaging: Cut Tape (CT)
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 18-DHVQFN (3x4.5)
Protocol: CANbus
Duplex: Half
Receiver Hysteresis: 50 mV
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Produkt ist nicht verfügbar
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TJA1466BHG/0J TJA1466.pdf
Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Supplier Device Package: 18-DHVQFN (3x4.5)
Protocol: CANbus
Type: Transceiver
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 50 mV
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 18-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TJA1466BHG/0J TJA1466.pdf
Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Package / Case: 18-VQFN Exposed Pad
Packaging: Cut Tape (CT)
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Duplex: Half
Receiver Hysteresis: 50 mV
Supplier Device Package: 18-DHVQFN (3x4.5)
Protocol: CANbus
Qualification: AEC-Q100
Grade: Automotive
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Produkt ist nicht verfügbar
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MC9S08DV48ACLH MC9S08DV60.pdf
MC9S08DV48ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MVR5510AMDALES VR5510.pdf
MVR5510AMDALES
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 239 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+24.74 EUR
10+19.46 EUR
25+18.14 EUR
100+16.68 EUR
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PCA9554CBSHP PCA9554B_PCA9554C.pdf
PCA9554CBSHP
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9554CBSHP PCA9554B_PCA9554C.pdf
PCA9554CBSHP
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 3837 Stücke:
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7+3.03 EUR
10+2.21 EUR
25+2.01 EUR
100+1.8 EUR
250+1.69 EUR
500+1.62 EUR
1000+1.61 EUR
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PCA9554CPWJ PCA9554B_PCA9554C.pdf
PCA9554CPWJ
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+1.39 EUR
Mindestbestellmenge: 2500 Stücke
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PCA9554BBSHP PCA9554B_PCA9554C.pdf
PCA9554BBSHP
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
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MF1PH4230DA8/00J MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 30000 Stücke
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LD6836TD/20H,125 LD6836.pdf
LD6836TD/20H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2V 300MA 5-TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 12000 Stücke:
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2184+0.27 EUR
Mindestbestellmenge: 2184 Stücke
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MCF5470VR200 MCF5475EC.pdf
MCF5470VR200
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
DigiKey Programmable: Not Verified
Number of I/O: 99
Supplier Device Package: 388-PBGA (27x27)
Peripherals: DMA, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V4E
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 32K x 8
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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RDBESS774A1EVB BESS10FS.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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RDBESS772BJBEVB BESS10FS.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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RD33772C14VEVM getting-started-with-the-rd33772c14vevm-reference-design:GS-RD33772C14VEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS26
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS26, MC33772C, S32K344
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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RD-BESS1500BUN BESS10FS.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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RD-BESS1-PREM BESS10FS.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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MPL115A2ST1 MPL115A2.pdf
MPL115A2ST1
Hersteller: NXP USA Inc.
Description: IC BAROMETRIC SENSOR I2C 8-TSON
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
Produkt ist nicht verfügbar
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MPL115A2ST1 MPL115A2.pdf
MPL115A2ST1
Hersteller: NXP USA Inc.
Description: IC BAROMETRIC SENSOR I2C 8-TSON
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
auf Bestellung 454 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+8.82 EUR
5+7.91 EUR
10+7.58 EUR
25+7.18 EUR
50+6.9 EUR
100+6.65 EUR
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MFS2613AMBA0AD FS26_PB.pdf
MFS2613AMBA0AD
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MFS8620BMDA8ES FS8600_SDS.pdf
MFS8620BMDA8ES
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+12.7 EUR
10+9.78 EUR
25+9.06 EUR
100+8.25 EUR
260+7.85 EUR
Mindestbestellmenge: 2 Stücke
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MFS2613AMDA0AD FS26_PB.pdf
MFS2613AMDA0AD
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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MFS2633AMDAJAD MFS2633AMDAJAD.pdf
MFS2633AMDAJAD
Hersteller: NXP USA Inc.
Description: MFS2633AMDAJAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
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MFS2633AMDAKAD MFS2633AMDAJAD.pdf
MFS2633AMDAKAD
Hersteller: NXP USA Inc.
Description: MFS2633AMDAKAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
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