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S9KEAZN64BVLCR NXP USA Inc. Description: IC MCU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9KEAZN16BMLCR NXP USA Inc. Description: IC MCU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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C9S12ZVL32L0MLCR NXP USA Inc. Description: 16-BIT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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C9S12VR48AL0VLCR NXP USA Inc. Description: 16-BIT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A3T18H408W24SR3 NXP USA Inc. A3T18H408W24S.pdf Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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B4420NSE7QQMD NXP USA Inc. B4420.pdf Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Box
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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S32G254AABK0VUCT NXP USA Inc. Description: S32G254A ARM CORTEX-M7 AND -A53,
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC9S08DN32AVLF MC9S08DN32AVLF NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL26Z64VFM4 MKL26Z64VFM4 NXP USA Inc. KL26P64M48SF5.pdf Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 1710 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.07 EUR
10+6.8 EUR
25+5.96 EUR
80+5.14 EUR
230+4.59 EUR
490+4.28 EUR
980+4.05 EUR
Mindestbestellmenge: 2
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74LVCH162374ADGG:1 74LVCH162374ADGG:1 NXP USA Inc. 74LVCH162374A.pdf Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
Packaging: Bulk
auf Bestellung 15880 Stücke:
Lieferzeit 10-14 Tag (e)
786+0.6 EUR
Mindestbestellmenge: 786
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PCF7952LTT/M1CC15, PCF7952LTT/M1CC15, NXP USA Inc. 75017275.pdf?fsrch=1&sr=1&pageNum=1 Description: RF TRANSMITTER UHF 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512B RAM, 1kB EEPROM, 8kB ROM
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF4000EL/101Z23BK NXP USA Inc. Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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S32M244LCABWKHSR S32M244LCABWKHSR NXP USA Inc. S32M2xx_DS.pdf Description: S32M244LCABWKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SE050E2HQ1/Z01Z3Z SE050E2HQ1/Z01Z3Z NXP USA Inc. SE050-DATASHEET.pdf Description: IC PLUG/TRUST SEC ELEM 20HX2QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Plug and Trust Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+3.25 EUR
Mindestbestellmenge: 3000
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SE050E2HQ1/Z01Z3Z SE050E2HQ1/Z01Z3Z NXP USA Inc. SE050-DATASHEET.pdf Description: IC PLUG/TRUST SEC ELEM 20HX2QFN
Packaging: Cut Tape (CT)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Plug and Trust Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
auf Bestellung 3212 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.04 EUR
10+4.56 EUR
25+4.19 EUR
100+3.78 EUR
250+3.58 EUR
500+3.47 EUR
1000+3.37 EUR
Mindestbestellmenge: 3
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BZA962A,115 BZA962A,115 NXP USA Inc. BZA900A_SERIES.pdf Description: TVS DIODE 6.2VWM SOT665
Packaging: Bulk
auf Bestellung 60770 Stücke:
Lieferzeit 10-14 Tag (e)
4857+0.095 EUR
Mindestbestellmenge: 4857
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IP4035CX24/LF/P,13 IP4035CX24/LF/P,13 NXP USA Inc. IP4035CX24.pdf Description: IC EMI FILTER ESD PROTECT 24CSP
Packaging: Bulk
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
1332+0.39 EUR
Mindestbestellmenge: 1332
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MC33PF8100EPES MC33PF8100EPES NXP USA Inc. PF8100_PF8200.pdf Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.66 EUR
10+15.42 EUR
25+14.36 EUR
80+13.35 EUR
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MPC8358CVRAGDDA MPC8358CVRAGDDA NXP USA Inc. MPC8358EEC.pdf Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
auf Bestellung 35 Stücke:
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1+120 EUR
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MPC8541ECVTAJD MPC8541ECVTAJD NXP USA Inc. MPC8541EEC.pdf Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
Produkt ist nicht verfügbar
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S9S12ZVL32F0VLC S9S12ZVL32F0VLC NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPF5301AMDA0ES NXP USA Inc. PF5300_SDS.pdf Description: IC REG BUCK ADJ 8A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 8A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
Produkt ist nicht verfügbar
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FS32K146HRT0MLHT FS32K146HRT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPXY8500DK016T1 MPXY8500DK016T1 NXP USA Inc. PHGL-S-A0003023996-1.pdf?t.download=true&u=5oefqw Description: RF TX IC FSK 315/434MHZ 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-QFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Memory Size: 8kB Flash, 512B SRAM
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: TPM (Tire Pressure Monitor)
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN (9x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1015CAF4BR NXP USA Inc. IMXRT1015IEC.pdf Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.63 EUR
10+9.44 EUR
25+9 EUR
50+8.68 EUR
100+8.38 EUR
250+7.99 EUR
500+7.7 EUR
Mindestbestellmenge: 2
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BUK9607-30B,118 NXP USA Inc. BUK9607-30B.pdf Description: MOSFET N-CH 30V 75A D2PAK
Packaging: Bulk
auf Bestellung 1087 Stücke:
Lieferzeit 10-14 Tag (e)
720+0.71 EUR
Mindestbestellmenge: 720
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MGD3160AM315EKR2 MGD3160AM315EKR2 NXP USA Inc. GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: General Purpose
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: IGBT
Voltage - Load: 4.5V ~ 40V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive
Produkt ist nicht verfügbar
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MGD3160AM315EKR2 MGD3160AM315EKR2 NXP USA Inc. GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: General Purpose
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: IGBT
Voltage - Load: 4.5V ~ 40V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive
auf Bestellung 740 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.84 EUR
10+11.56 EUR
25+10.74 EUR
100+9.84 EUR
250+9.41 EUR
500+9.15 EUR
Mindestbestellmenge: 2
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MPC5200CBV400 MPC5200CBV400 NXP USA Inc. MPC5200.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
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MPC555LFCZP40 MPC555LFCZP40 NXP USA Inc. MPC555PB.pdf Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC562CZP40 MPC562CZP40 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8241LVR166D MPC8241LVR166D NXP USA Inc. MPC8241.pdf Description: IC MPU MPC82XX 166MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
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MC9S08PL8SCTJR MC9S08PL8SCTJR NXP USA Inc. MC9S08PL16S.pdf Description: PL16S, 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 12x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
Produkt ist nicht verfügbar
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LPC11E68JBD64K LPC11E68JBD64K NXP USA Inc. LPC11E6X.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.84 EUR
10+8.32 EUR
25+7.87 EUR
100+6.63 EUR
250+6.2 EUR
500+6.1 EUR
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MFS2613AMDH3AD MFS2613AMDH3AD NXP USA Inc. MFS2633AMDAJAD.pdf Description: MFS2613AMDH3AD
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
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MCF52221CVM80 MCF52221CVM80 NXP USA Inc. Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8782-B0-NAPC/DZ NXP USA Inc. Description: IC RF 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 68-HVQFN (8x8)
Produkt ist nicht verfügbar
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P3T2030DUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030DUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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Lieferzeit 10-14 Tag (e)
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P3T2030DUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030DUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)
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P3T2030EUKAZ P3T2030EUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030EUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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P3T2030EUKAZ P3T2030EUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030EUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)
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20+0.89 EUR
25+0.8 EUR
100+0.7 EUR
250+0.66 EUR
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1000+0.6 EUR
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P3T2030BUKAZ P3T2030BUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030BUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)
15+1.23 EUR
20+0.89 EUR
25+0.8 EUR
100+0.7 EUR
250+0.65 EUR
500+0.62 EUR
1000+0.6 EUR
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P3T2030FUKAZ P3T2030FUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030FUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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P3T2030FUKAZ P3T2030FUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030FUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3497 Stücke:
Lieferzeit 10-14 Tag (e)
15+1.25 EUR
20+0.89 EUR
25+0.8 EUR
100+0.7 EUR
250+0.66 EUR
500+0.63 EUR
1000+0.6 EUR
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P3T1035AUKAZ P3T1035AUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T1035AUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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P3T1035AUKAZ P3T1035AUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T1035AUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3418 Stücke:
Lieferzeit 10-14 Tag (e)
13+1.37 EUR
15+1.21 EUR
16+1.15 EUR
25+1.08 EUR
50+1.03 EUR
100+0.98 EUR
500+0.89 EUR
1000+0.85 EUR
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MC68360ZQ25VL MC68360ZQ25VL NXP USA Inc. MC68360.pdf Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Produkt ist nicht verfügbar
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P1017NSE5CFB NXP USA Inc. P1_Series_FS.pdf Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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SPC5606SF2CLU6 SPC5606SF2CLU6 NXP USA Inc. MPC5606S.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 136
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NT2H1511G0DUDZ NXP USA Inc. NTAG213_215_216.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 75°C
Standards: ISO 14443
Supplier Device Package: Die
Produkt ist nicht verfügbar
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NT2H1511G0DUDV NXP USA Inc. NTAG213_215_216.pdf Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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ON5088,115 ON5088,115 NXP USA Inc. ON5088.pdf Description: RF TRANS NPN 10V 55GHZ 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Frequency - Transition: 55GHz
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Supplier Device Package: 4-DFP
Produkt ist nicht verfügbar
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ON5088,115 ON5088,115 NXP USA Inc. ON5088.pdf Description: RF TRANS NPN 10V 55GHZ 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Frequency - Transition: 55GHz
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Supplier Device Package: 4-DFP
auf Bestellung 1704 Stücke:
Lieferzeit 10-14 Tag (e)
27+0.67 EUR
36+0.5 EUR
40+0.44 EUR
100+0.38 EUR
250+0.34 EUR
500+0.32 EUR
1000+0.3 EUR
Mindestbestellmenge: 27
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LPC11U14FET48/201, LPC11U14FET48/201, NXP USA Inc. LPC11U1X.pdf Description: IC MCU 32BIT 32KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32R294HFK0MJDT NXP USA Inc. S32R29XFS.pdf Description: IC MCU 32BIT 2.5MB CRAM 269LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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FS32R294HFK0MJDR NXP USA Inc. S32R29XFS.pdf Description: IC MCU 32BIT 2.5MB CRAM 269LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PR5331C3HN/C350,55 PR5331C3HN/C350,55 NXP USA Inc. PR533.pdf Description: IC RFID READER 13.56MHZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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MCF51EM128CLL MCF51EM128CLL NXP USA Inc. MCF51EM256.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 2324 Stücke:
Lieferzeit 10-14 Tag (e)
34+14.53 EUR
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MCF51EM128CLL MCF51EM128CLL NXP USA Inc. MCF51EM256.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FX32K118LAT0MLHT NXP USA Inc. S32K1xx.pdf Description: S32K118 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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S9KEAZN64BVLCR
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9KEAZN16BMLCR
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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C9S12ZVL32L0MLCR
Hersteller: NXP USA Inc.
Description: 16-BIT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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C9S12VR48AL0VLCR
Hersteller: NXP USA Inc.
Description: 16-BIT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A3T18H408W24SR3 A3T18H408W24S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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B4420NSE7QQMD B4420.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Box
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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S32G254AABK0VUCT
Hersteller: NXP USA Inc.
Description: S32G254A ARM CORTEX-M7 AND -A53,
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC9S08DN32AVLF MC9S08DN60.pdf
MC9S08DN32AVLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL26Z64VFM4 KL26P64M48SF5.pdf
MKL26Z64VFM4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 1710 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.07 EUR
10+6.8 EUR
25+5.96 EUR
80+5.14 EUR
230+4.59 EUR
490+4.28 EUR
980+4.05 EUR
Mindestbestellmenge: 2
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74LVCH162374ADGG:1 74LVCH162374A.pdf
74LVCH162374ADGG:1
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
Packaging: Bulk
auf Bestellung 15880 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
786+0.6 EUR
Mindestbestellmenge: 786
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PCF7952LTT/M1CC15, 75017275.pdf?fsrch=1&sr=1&pageNum=1
PCF7952LTT/M1CC15,
Hersteller: NXP USA Inc.
Description: RF TRANSMITTER UHF 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512B RAM, 1kB EEPROM, 8kB ROM
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF4000EL/101Z23BK
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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S32M244LCABWKHSR S32M2xx_DS.pdf
S32M244LCABWKHSR
Hersteller: NXP USA Inc.
Description: S32M244LCABWKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SE050E2HQ1/Z01Z3Z SE050-DATASHEET.pdf
SE050E2HQ1/Z01Z3Z
Hersteller: NXP USA Inc.
Description: IC PLUG/TRUST SEC ELEM 20HX2QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Plug and Trust Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+3.25 EUR
Mindestbestellmenge: 3000
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SE050E2HQ1/Z01Z3Z SE050-DATASHEET.pdf
SE050E2HQ1/Z01Z3Z
Hersteller: NXP USA Inc.
Description: IC PLUG/TRUST SEC ELEM 20HX2QFN
Packaging: Cut Tape (CT)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Plug and Trust Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
auf Bestellung 3212 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.04 EUR
10+4.56 EUR
25+4.19 EUR
100+3.78 EUR
250+3.58 EUR
500+3.47 EUR
1000+3.37 EUR
Mindestbestellmenge: 3
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BZA962A,115 BZA900A_SERIES.pdf
BZA962A,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.2VWM SOT665
Packaging: Bulk
auf Bestellung 60770 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4857+0.095 EUR
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IP4035CX24/LF/P,13 IP4035CX24.pdf
IP4035CX24/LF/P,13
Hersteller: NXP USA Inc.
Description: IC EMI FILTER ESD PROTECT 24CSP
Packaging: Bulk
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1332+0.39 EUR
Mindestbestellmenge: 1332
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MC33PF8100EPES PF8100_PF8200.pdf
MC33PF8100EPES
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+19.66 EUR
10+15.42 EUR
25+14.36 EUR
80+13.35 EUR
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MPC8358CVRAGDDA MPC8358EEC.pdf
MPC8358CVRAGDDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+120 EUR
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MPC8541ECVTAJD MPC8541EEC.pdf
MPC8541ECVTAJD
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
Produkt ist nicht verfügbar
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S9S12ZVL32F0VLC S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVL32F0VLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPF5301AMDA0ES PF5300_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC REG BUCK ADJ 8A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 8A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
Produkt ist nicht verfügbar
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FS32K146HRT0MLHT S32K1xx.pdf
FS32K146HRT0MLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPXY8500DK016T1 PHGL-S-A0003023996-1.pdf?t.download=true&u=5oefqw
MPXY8500DK016T1
Hersteller: NXP USA Inc.
Description: RF TX IC FSK 315/434MHZ 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-QFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Memory Size: 8kB Flash, 512B SRAM
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: TPM (Tire Pressure Monitor)
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN (9x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1015CAF4BR IMXRT1015IEC.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.63 EUR
10+9.44 EUR
25+9 EUR
50+8.68 EUR
100+8.38 EUR
250+7.99 EUR
500+7.7 EUR
Mindestbestellmenge: 2
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BUK9607-30B,118 BUK9607-30B.pdf
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 75A D2PAK
Packaging: Bulk
auf Bestellung 1087 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
720+0.71 EUR
Mindestbestellmenge: 720
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MGD3160AM315EKR2 GD3160.pdf
MGD3160AM315EKR2
Hersteller: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: General Purpose
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: IGBT
Voltage - Load: 4.5V ~ 40V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive
Produkt ist nicht verfügbar
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MGD3160AM315EKR2 GD3160.pdf
MGD3160AM315EKR2
Hersteller: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: General Purpose
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: IGBT
Voltage - Load: 4.5V ~ 40V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive
auf Bestellung 740 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.84 EUR
10+11.56 EUR
25+10.74 EUR
100+9.84 EUR
250+9.41 EUR
500+9.15 EUR
Mindestbestellmenge: 2
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MPC5200CBV400 MPC5200.pdf
MPC5200CBV400
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
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MPC555LFCZP40 MPC555PB.pdf
MPC555LFCZP40
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC562CZP40 MPC561RM.pdf
MPC562CZP40
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8241LVR166D MPC8241.pdf
MPC8241LVR166D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 166MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
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MC9S08PL8SCTJR MC9S08PL16S.pdf
MC9S08PL8SCTJR
Hersteller: NXP USA Inc.
Description: PL16S, 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 12x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
Produkt ist nicht verfügbar
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LPC11E68JBD64K LPC11E6X.pdf
LPC11E68JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.84 EUR
10+8.32 EUR
25+7.87 EUR
100+6.63 EUR
250+6.2 EUR
500+6.1 EUR
Mindestbestellmenge: 2
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MFS2613AMDH3AD MFS2633AMDAJAD.pdf
MFS2613AMDH3AD
Hersteller: NXP USA Inc.
Description: MFS2613AMDH3AD
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
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MCF52221CVM80
MCF52221CVM80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8782-B0-NAPC/DZ
Hersteller: NXP USA Inc.
Description: IC RF 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 68-HVQFN (8x8)
Produkt ist nicht verfügbar
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P3T2030DUKAZ P3T1035XUK_P3T2030XUK.pdf
Hersteller: NXP USA Inc.
Description: P3T2030DUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3500+0.58 EUR
Mindestbestellmenge: 3500
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P3T2030DUKAZ P3T1035XUK_P3T2030XUK.pdf
Hersteller: NXP USA Inc.
Description: P3T2030DUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.2 EUR
13+1.39 EUR
25+1.17 EUR
100+0.93 EUR
250+0.81 EUR
500+0.73 EUR
1000+0.67 EUR
Mindestbestellmenge: 8
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P3T2030EUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030EUKAZ
Hersteller: NXP USA Inc.
Description: P3T2030EUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3500+0.57 EUR
Mindestbestellmenge: 3500
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P3T2030EUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030EUKAZ
Hersteller: NXP USA Inc.
Description: P3T2030EUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15+1.25 EUR
20+0.89 EUR
25+0.8 EUR
100+0.7 EUR
250+0.66 EUR
500+0.63 EUR
1000+0.6 EUR
Mindestbestellmenge: 15
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P3T2030BUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030BUKAZ
Hersteller: NXP USA Inc.
Description: P3T2030BUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15+1.23 EUR
20+0.89 EUR
25+0.8 EUR
100+0.7 EUR
250+0.65 EUR
500+0.62 EUR
1000+0.6 EUR
Mindestbestellmenge: 15
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P3T2030FUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030FUKAZ
Hersteller: NXP USA Inc.
Description: P3T2030FUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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P3T2030FUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030FUKAZ
Hersteller: NXP USA Inc.
Description: P3T2030FUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3497 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15+1.25 EUR
20+0.89 EUR
25+0.8 EUR
100+0.7 EUR
250+0.66 EUR
500+0.63 EUR
1000+0.6 EUR
Mindestbestellmenge: 15
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P3T1035AUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T1035AUKAZ
Hersteller: NXP USA Inc.
Description: P3T1035AUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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P3T1035AUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T1035AUKAZ
Hersteller: NXP USA Inc.
Description: P3T1035AUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3418 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13+1.37 EUR
15+1.21 EUR
16+1.15 EUR
25+1.08 EUR
50+1.03 EUR
100+0.98 EUR
500+0.89 EUR
1000+0.85 EUR
Mindestbestellmenge: 13
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MC68360ZQ25VL MC68360.pdf
MC68360ZQ25VL
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Produkt ist nicht verfügbar
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P1017NSE5CFB P1_Series_FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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SPC5606SF2CLU6 MPC5606S.pdf
SPC5606SF2CLU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 136
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NT2H1511G0DUDZ NTAG213_215_216.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 75°C
Standards: ISO 14443
Supplier Device Package: Die
Produkt ist nicht verfügbar
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NT2H1511G0DUDV NTAG213_215_216.pdf
Hersteller: NXP USA Inc.
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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ON5088,115 ON5088.pdf
ON5088,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 10V 55GHZ 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Frequency - Transition: 55GHz
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Supplier Device Package: 4-DFP
Produkt ist nicht verfügbar
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ON5088,115 ON5088.pdf
ON5088,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 10V 55GHZ 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Frequency - Transition: 55GHz
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Supplier Device Package: 4-DFP
auf Bestellung 1704 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
27+0.67 EUR
36+0.5 EUR
40+0.44 EUR
100+0.38 EUR
250+0.34 EUR
500+0.32 EUR
1000+0.3 EUR
Mindestbestellmenge: 27
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LPC11U14FET48/201, LPC11U1X.pdf
LPC11U14FET48/201,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32R294HFK0MJDT S32R29XFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB CRAM 269LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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FS32R294HFK0MJDR S32R29XFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB CRAM 269LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PR5331C3HN/C350,55 PR533.pdf
PR5331C3HN/C350,55
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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MCF51EM128CLL MCF51EM256.pdf
MCF51EM128CLL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 2324 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
34+14.53 EUR
Mindestbestellmenge: 34
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MCF51EM128CLL MCF51EM256.pdf
MCF51EM128CLL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FX32K118LAT0MLHT S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K118 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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