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IW612UK/A1IAZ NXP USA Inc. Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW611UK/A1IZ NXP USA Inc. IW611_PB.pdf Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW611UK/A1CZ NXP USA Inc. IW611_PB.pdf Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW611HN/A1CMP NXP USA Inc. IW611_PB.pdf Description: IW611HN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IW611HN/A1IMP NXP USA Inc. IW611_PB.pdf Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW611HN/A1CK NXP USA Inc. IW611_PB.pdf Description: IC RF BLE
Packaging: Tray
Frequency: 2.4GHz, 5GHz
RF Family/Standard: Bluetooth, WiFi
Produkt ist nicht verfügbar
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IW611HN/A1IK NXP USA Inc. IW611_PB.pdf Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW612UK/A1CZ NXP USA Inc. IW612_PB.pdf Description: 2.4/5 GHZ DUAL-BAND 1X1 WI-FI6 (
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IW612UK/A1IZ NXP USA Inc. IW612_PB.pdf Description: 2.4/5 GHZ DUAL-BAND 1X1 WI-FI6 (
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IW612HN/A1CMP NXP USA Inc. IW612_PB.pdf Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW612HN/A1IMP NXP USA Inc. IW612_PB.pdf Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW612HN/A1IK NXP USA Inc. IW612_PB.pdf Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW612HN/A1CK NXP USA Inc. IW612_PB.pdf Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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AW611HN/A1BMP NXP USA Inc. Description: AW611HN/A1BMP
Packaging: Bulk
Produkt ist nicht verfügbar
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AW611HN/A1BK NXP USA Inc. Description: AW611HN/A1BK
Packaging: Bulk
Produkt ist nicht verfügbar
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BATT-14CTCABLE25 NXP USA Inc. BATT-14CEMULATOR.pdf Description: CELL TERMINAL (CT) CABLE, 14 CEL
Packaging: Bulk
Accessory Type: Cable
Produkt ist nicht verfügbar
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MKE02Z32VLH4R MKE02Z32VLH4R NXP USA Inc. MKE02P64M40SF0.pdf Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
Produkt ist nicht verfügbar
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MKL27Z256VFM4R MKL27Z256VFM4R NXP USA Inc. KL27P64M48SF6.pdf Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 23
DigiKey Programmable: Not Verified
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S9S12G64F0VLH S9S12G64F0VLH NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MFS2325BMMA0EPR2 NXP USA Inc. FS23DS.pdf Description: MFS2325BMMA0EPR2
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2325BMMA0EP NXP USA Inc. FS23DS.pdf Description: MFS2325BMMA0EP
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MCF51JE256VMB MCF51JE256VMB NXP USA Inc. MCF51JE256.pdf Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PDTC123TE,115 PDTC123TE,115 NXP USA Inc. PDTC123T_SER.pdf Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 2.2 kOhms
Produkt ist nicht verfügbar
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FB32K148HFT0VLQT NXP USA Inc. Description: S32K148 144 LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MPVZ5004G6T1 MPVZ5004G6T1 NXP USA Inc. MPVZ5004G.pdf Description: SENSOR 0.57PSIG 4.9V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 1 V ~ 4.9 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Accuracy: ±6.25%
Operating Temperature: 0°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 2.32PSI (16kPa)
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MPVZ4006G6T1 MPVZ4006G6T1 NXP USA Inc. MPVZ4006G.pdf Description: SENSOR 0.87PSIG 4.6V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
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MPVZ4006G6U MPVZ4006G6U NXP USA Inc. MPVZ4006G.pdf description Description: SENSOR 0.87PSIG 4.6V 8SOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
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MPVZ4006G7U MPVZ4006G7U NXP USA Inc. MPVZ4006G.pdf Description: SENSOR 0.87PSIG 4.6V 8DIP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-DIP Module
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: PC Pin
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
Produkt ist nicht verfügbar
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ASL5115SHNZ ASL5115SHNZ NXP USA Inc. PB_ASL5xxxyHz.pdf Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Produkt ist nicht verfügbar
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ASL5115SHNZ ASL5115SHNZ NXP USA Inc. PB_ASL5xxxyHz.pdf Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
auf Bestellung 404 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.84 EUR
10+12.35 EUR
25+11.48 EUR
100+10.52 EUR
250+10.06 EUR
Mindestbestellmenge: 2
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BC857T,115 BC857T,115 NXP USA Inc. BC856T_857T_Rev_Feb2017.pdf Description: TRANS PNP 45V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 150 mW
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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S912ZVL64AVFMR NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
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S912ZVL64AVFM NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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A5G35S008NT6 NXP USA Inc. A5G35S008N.pdf Description: RF MOSFET
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MSC8151TAG1000B MSC8151TAG1000B NXP USA Inc. MSC8151.pdf Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Single Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Produkt ist nicht verfügbar
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LPC2930FBD208,551 LPC2930FBD208,551 NXP USA Inc. LPC2930.pdf Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF1S7001XDUD2/V1A NXP USA Inc. MF1S70YYX_V1.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Produkt ist nicht verfügbar
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MF1S7031XDUD2/V1A NXP USA Inc. MF1S70YYX_V1.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Produkt ist nicht verfügbar
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MC33FS6520NAER2 MC33FS6520NAER2 NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MPF5024CMMA0ESR2 NXP USA Inc. PF5024.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCIMX93-QSB MCIMX93-QSB NXP USA Inc. Description: I.MX 93 QSB DEV BOARD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55, Cortex®-M33
Utilized IC / Part: i.MX 93
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
1+489.86 EUR
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MC33771CTA2AER2 MC33771CTA2AER2 NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTA2AE MC33771CTA2AE NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTP2AER2 MC33771CTP2AER2 NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTP2AE MC33771CTP2AE NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTA1AER2 MC33771CTA1AER2 NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTP1AER2 MC33771CTP1AER2 NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BATT-14EXTENDER NXP USA Inc. BATT-14EXTENDER.pdf Description: BATT-14EXTENDER
Packaging: Bulk
For Use With/Related Products: MC33771B, MC33771C
Accessory Type: Extender
Utilized IC / Part: MC33771B, MC33771C
Produkt ist nicht verfügbar
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BATT-14CEMULATOR BATT-14CEMULATOR NXP USA Inc. BATT-14CEMULATOR.pdf Description: BATT-14CEMULATOR
Packaging: Bulk
For Use With/Related Products: MC33771C
Accessory Type: Battery Pack Emulator
Utilized IC / Part: MC33771C
Produkt ist nicht verfügbar
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RD33771CNTREVM NXP USA Inc. get-started-with-the-rd33771cntrevm:GS-RD33771CNTREVM Description: EVAL BOARD FOR MC33771C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: MC33771C
Primary Attributes: Li-Ion (14 Cells)
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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S912ZVLA96AVFMR NXP USA Inc. Description: IC MCU 16BIT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33FS6525CAE MC33FS6525CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.56 EUR
10+8.48 EUR
25+8.09 EUR
40+7.89 EUR
80+7.62 EUR
250+7.36 EUR
Mindestbestellmenge: 2
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MC33FS6525NAE MC33FS6525NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525NAER2 MC33FS6525NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525KAER2 MC33FS6525KAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525CAER2 MC33FS6525CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525LAER2 MC33FS6525LAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525KAE MC33FS6525KAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MKE15Z256VLH7R MKE15Z256VLH7R NXP USA Inc. KE1xZP100M72SF0.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.89 EUR
10+7.6 EUR
25+7.03 EUR
100+6.41 EUR
250+6.11 EUR
500+5.93 EUR
Mindestbestellmenge: 2
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S912XEG128BCAAR S912XEG128BCAAR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IW612UK/A1IAZ
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW611UK/A1IZ IW611_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW611UK/A1CZ IW611_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW611HN/A1CMP IW611_PB.pdf
Hersteller: NXP USA Inc.
Description: IW611HN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IW611HN/A1IMP IW611_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW611HN/A1CK IW611_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF BLE
Packaging: Tray
Frequency: 2.4GHz, 5GHz
RF Family/Standard: Bluetooth, WiFi
Produkt ist nicht verfügbar
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IW611HN/A1IK IW611_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW612UK/A1CZ IW612_PB.pdf
Hersteller: NXP USA Inc.
Description: 2.4/5 GHZ DUAL-BAND 1X1 WI-FI6 (
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IW612UK/A1IZ IW612_PB.pdf
Hersteller: NXP USA Inc.
Description: 2.4/5 GHZ DUAL-BAND 1X1 WI-FI6 (
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IW612HN/A1CMP IW612_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW612HN/A1IMP IW612_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW612HN/A1IK IW612_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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IW612HN/A1CK IW612_PB.pdf
Hersteller: NXP USA Inc.
Description: IC RF 116HVQFN
Packaging: Tray
Package / Case: 116-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 116-HVQFN (9x9)
Produkt ist nicht verfügbar
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AW611HN/A1BMP
Hersteller: NXP USA Inc.
Description: AW611HN/A1BMP
Packaging: Bulk
Produkt ist nicht verfügbar
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AW611HN/A1BK
Hersteller: NXP USA Inc.
Description: AW611HN/A1BK
Packaging: Bulk
Produkt ist nicht verfügbar
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BATT-14CTCABLE25 BATT-14CEMULATOR.pdf
Hersteller: NXP USA Inc.
Description: CELL TERMINAL (CT) CABLE, 14 CEL
Packaging: Bulk
Accessory Type: Cable
Produkt ist nicht verfügbar
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MKE02Z32VLH4R MKE02P64M40SF0.pdf
MKE02Z32VLH4R
Hersteller: NXP USA Inc.
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
Produkt ist nicht verfügbar
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MKL27Z256VFM4R KL27P64M48SF6.pdf
MKL27Z256VFM4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12G64F0VLH MC9S12GRMV1.pdf
S9S12G64F0VLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MFS2325BMMA0EPR2 FS23DS.pdf
Hersteller: NXP USA Inc.
Description: MFS2325BMMA0EPR2
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2325BMMA0EP FS23DS.pdf
Hersteller: NXP USA Inc.
Description: MFS2325BMMA0EP
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MCF51JE256VMB MCF51JE256.pdf
MCF51JE256VMB
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PDTC123TE,115 PDTC123T_SER.pdf
PDTC123TE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 2.2 kOhms
Produkt ist nicht verfügbar
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FB32K148HFT0VLQT
Hersteller: NXP USA Inc.
Description: S32K148 144 LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MPVZ5004G6T1 MPVZ5004G.pdf
MPVZ5004G6T1
Hersteller: NXP USA Inc.
Description: SENSOR 0.57PSIG 4.9V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 1 V ~ 4.9 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Accuracy: ±6.25%
Operating Temperature: 0°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 2.32PSI (16kPa)
Produkt ist nicht verfügbar
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MPVZ4006G6T1 MPVZ4006G.pdf
MPVZ4006G6T1
Hersteller: NXP USA Inc.
Description: SENSOR 0.87PSIG 4.6V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
Produkt ist nicht verfügbar
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MPVZ4006G6U description MPVZ4006G.pdf
MPVZ4006G6U
Hersteller: NXP USA Inc.
Description: SENSOR 0.87PSIG 4.6V 8SOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
Produkt ist nicht verfügbar
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MPVZ4006G7U MPVZ4006G.pdf
MPVZ4006G7U
Hersteller: NXP USA Inc.
Description: SENSOR 0.87PSIG 4.6V 8DIP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-DIP Module
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: PC Pin
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
Produkt ist nicht verfügbar
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ASL5115SHNZ PB_ASL5xxxyHz.pdf
ASL5115SHNZ
Hersteller: NXP USA Inc.
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Produkt ist nicht verfügbar
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ASL5115SHNZ PB_ASL5xxxyHz.pdf
ASL5115SHNZ
Hersteller: NXP USA Inc.
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
auf Bestellung 404 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.84 EUR
10+12.35 EUR
25+11.48 EUR
100+10.52 EUR
250+10.06 EUR
Mindestbestellmenge: 2
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BC857T,115 BC856T_857T_Rev_Feb2017.pdf
BC857T,115
Hersteller: NXP USA Inc.
Description: TRANS PNP 45V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 150 mW
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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S912ZVL64AVFMR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
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S912ZVL64AVFM
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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A5G35S008NT6 A5G35S008N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MSC8151TAG1000B MSC8151.pdf
MSC8151TAG1000B
Hersteller: NXP USA Inc.
Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Single Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Produkt ist nicht verfügbar
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LPC2930FBD208,551 LPC2930.pdf
LPC2930FBD208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF1S7001XDUD2/V1A MF1S70YYX_V1.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Produkt ist nicht verfügbar
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MF1S7031XDUD2/V1A MF1S70YYX_V1.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Produkt ist nicht verfügbar
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MC33FS6520NAER2 F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6520NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MPF5024CMMA0ESR2 PF5024.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCIMX93-QSB
MCIMX93-QSB
Hersteller: NXP USA Inc.
Description: I.MX 93 QSB DEV BOARD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55, Cortex®-M33
Utilized IC / Part: i.MX 93
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+489.86 EUR
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MC33771CTA2AER2 MC33771C.pdf
MC33771CTA2AER2
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTA2AE MC33771C.pdf
MC33771CTA2AE
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTP2AER2 MC33771C.pdf
MC33771CTP2AER2
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTP2AE MC33771C.pdf
MC33771CTP2AE
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTA1AER2 MC33771C.pdf
MC33771CTA1AER2
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33771CTP1AER2 MC33771C.pdf
MC33771CTP1AER2
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BATT-14EXTENDER BATT-14EXTENDER.pdf
Hersteller: NXP USA Inc.
Description: BATT-14EXTENDER
Packaging: Bulk
For Use With/Related Products: MC33771B, MC33771C
Accessory Type: Extender
Utilized IC / Part: MC33771B, MC33771C
Produkt ist nicht verfügbar
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BATT-14CEMULATOR BATT-14CEMULATOR.pdf
BATT-14CEMULATOR
Hersteller: NXP USA Inc.
Description: BATT-14CEMULATOR
Packaging: Bulk
For Use With/Related Products: MC33771C
Accessory Type: Battery Pack Emulator
Utilized IC / Part: MC33771C
Produkt ist nicht verfügbar
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RD33771CNTREVM get-started-with-the-rd33771cntrevm:GS-RD33771CNTREVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33771C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: MC33771C
Primary Attributes: Li-Ion (14 Cells)
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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S912ZVLA96AVFMR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33FS6525CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6525CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.56 EUR
10+8.48 EUR
25+8.09 EUR
40+7.89 EUR
80+7.62 EUR
250+7.36 EUR
Mindestbestellmenge: 2
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MC33FS6525NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6525NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525NAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6525NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525KAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6525KAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525CAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6525CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525LAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6525LAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6525KAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6525KAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MKE15Z256VLH7R KE1xZP100M72SF0.pdf
MKE15Z256VLH7R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.89 EUR
10+7.6 EUR
25+7.03 EUR
100+6.41 EUR
250+6.11 EUR
500+5.93 EUR
Mindestbestellmenge: 2
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S912XEG128BCAAR MC9S12XEP100RMV1.pdf
S912XEG128BCAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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