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SCBGARBW1AO NXP USA Inc. Description: SOCKET SUPPORTING VERTICAL AUTOM
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
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N74F51D,602 N74F51D,602 NXP USA Inc. 74F51.pdf Description: IC GATE AND/OR/INVERT 2IN 14SOIC
Number of Circuits: 2
Supplier Device Package: 14-SO
Schmitt Trigger Input: No
Number of Inputs: 10 Input (3, 3, 2, 2)
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: AND/OR/INVERT Gate
Mounting Type: Surface Mount
Output Type: Differential
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
auf Bestellung 3420 Stücke:
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1902+0.27 EUR
Mindestbestellmenge: 1902 Stücke
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MFS2400AVMA0ESR2 MFS2400AVMA0ESR2 NXP USA Inc. FS2400.pdf Description: MFS2400AVMA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVMA1ESR2 MFS2400AVMA1ESR2 NXP USA Inc. FS2400.pdf Description: Safety Mini CAN FD SBC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVMA0ES MFS2400AVMA0ES NXP USA Inc. FS2400.pdf Description: MFS2400AVMA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVBA0ESR2 MFS2400AVBA0ESR2 NXP USA Inc. FS2400.pdf Description: MFS2400AVBA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVBA0ES MFS2400AVBA0ES NXP USA Inc. FS2400.pdf Description: MFS2400AVBA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC44BS374T1EFR2 MC44BS374T1EFR2 NXP USA Inc. MC44BS374T1.pdf Description: IC NTSC/PAL MODULATOR 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: NTSC/PAL Modulator
Applications: Audio/Video, VCR's, Set-Top Boxes
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC20XS4200DFKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKE02Z32VLD2 MKE02Z32VLD2 NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 788 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.86 EUR
10+4.42 EUR
25+4.06 EUR
160+3.56 EUR
320+3.43 EUR
640+3.32 EUR
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MCXA146VPJ NXP USA Inc. MCXAP100M96FS6.pdf Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
auf Bestellung 260 Stücke:
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2+10.7 EUR
10+8.23 EUR
25+7.61 EUR
100+6.94 EUR
260+6.6 EUR
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MCF51AG128CLK MCF51AG128CLK NXP USA Inc. MCF51AG128.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
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SC16C852LIBS,151 SC16C852LIBS,151 NXP USA Inc. SC16C852L.pdf Description: IC UART DUAL W/FIFO 32-HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 1.8V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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MIMX8UD3DVP08SC MIMX8UD3DVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 610 Stücke:
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1+44.46 EUR
10+35.87 EUR
25+33.72 EUR
100+31.36 EUR
250+30.24 EUR
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MCXA154VPJ MCXA154VPJ NXP USA Inc. MCXAP100M96FS6.pdf Description: IC MCU
Packaging: Tray
Package / Case: 112-VFBGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
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3+8.38 EUR
10+6.39 EUR
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100+5.35 EUR
260+5.08 EUR
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MCXA155VPJ NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
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3+8.24 EUR
10+5.67 EUR
25+5.29 EUR
100+4.72 EUR
260+4.58 EUR
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MFS2633AMDAHAD MFS2633AMDAHAD NXP USA Inc. MFS2633AMDAJAD.pdf Description: MFS2633AMDAHAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
auf Bestellung 249 Stücke:
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2+13.48 EUR
10+10.48 EUR
25+9.73 EUR
100+8.91 EUR
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MBMI7014TA1AER2 NXP USA Inc. BMI7014.pdf Description: MBMI7014TA1AER2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MBMI7014TA1AE NXP USA Inc. BMI7014.pdf Description: MBMI7014TA1AE
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4000EL/103Q200Y NXP USA Inc. Description: SAF4000EL/103Q200Y
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/103Q200K NXP USA Inc. Description: SAF4000EL/103Q200K
Packaging: Tray
Produkt ist nicht verfügbar
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LFDBGVCALS50R NXP USA Inc. Description: 156 PIN VERTICAL RING TO ROTATED
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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FRWY-LS1012A-PB FRWY-LS1012A-PB NXP USA Inc. FRWY-LS1012A-PB_Web.pdf Description: LAYERSCAPE LS1012A FREEWAY BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1012A
Platform: Layerscape LS1012A Freeway
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LD6806CX4/33P,315 LD6806CX4/33P,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 3.3V 200MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 3.3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
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3328+0.15 EUR
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MPX2053DP MPX2053DP NXP USA Inc. MPX2053.pdf Description: SENSOR 7.25PSID 0.19" .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube, Dual
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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S908AB32AH3VFUE S908AB32AH3VFUE NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-QFP (14x14)
Peripherals: POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Bulk
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S32K348GHT1MJBST S32K348GHT1MJBST NXP USA Inc. S32K3xx.pdf Description: S32K348GHT1MJBST
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
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PCA9430HKZ NXP USA Inc. Description: IC BATT CHG 16XQFN
Supplier Device Package: 16-XQFN (2.2x2.8)
Mounting Type: Surface Mount
Package / Case: 16-XFQFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7755HV/N208WK NXP USA Inc. Description: MULTI-TUNER CAR RADIO & AUDIO ON
Packaging: Tray
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SAF775CHN/N208W/AK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
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MC33FS6508NAE MC33FS6508NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.85 EUR
10+12.29 EUR
25+11.72 EUR
40+11.44 EUR
80+11.03 EUR
250+10.4 EUR
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MKE04Z64VLH4R NXP USA Inc. MKE04P80M48SF0.pdf Description: KINETIS KE04: 48MHZ CORTEX-M0+ 5
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 1500 Stücke:
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3+6.86 EUR
10+6.09 EUR
25+5.81 EUR
50+5.6 EUR
100+5.41 EUR
250+5.16 EUR
500+4.97 EUR
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MKE04Z64VLK4R MKE04Z64VLK4R NXP USA Inc. MKE04P80M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 71
Supplier Device Package: 80-LQFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
auf Bestellung 1000 Stücke:
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1000+4.42 EUR
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MKE04Z64VLK4R MKE04Z64VLK4R NXP USA Inc. MKE04P80M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 71
Supplier Device Package: 80-LQFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 1000 Stücke:
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3+8.61 EUR
10+6.57 EUR
25+6.06 EUR
100+5.5 EUR
250+5.23 EUR
500+5.07 EUR
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FXLS90220AESR2 FXLS90220AESR2 NXP USA Inc. FXLS9xxx0.pdf Description: X SINGLE-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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SPC5602BACLH4R NXP USA Inc. Description: IC MCU 32BIT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PHP18NQ11T,127 PHP18NQ11T,127 NXP USA Inc. PHP18NQ11T.pdf Description: MOSFET N-CH 110V 18A TO220AB
Packaging: Bulk
auf Bestellung 663 Stücke:
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454+1.11 EUR
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PDTA144TMB,315 PDTA144TMB,315 NXP USA Inc. PHGLS24961-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Resistor - Base (R1): 47 kOhms
Frequency - Transition: 180 MHz
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: DFN1006B-3
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: PNP - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-101, SOT-883
Packaging: Bulk
Resistors Included: R1 Only
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PDTA144WMB,315 PDTA144WMB,315 NXP USA Inc. PHGLS25680-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 22 kOhms
Resistors Included: R1 and R2
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74LVC139PW,112 74LVC139PW,112 NXP USA Inc. 74LVC139.pdf Description: IC DUAL 2-4 DECOD/DEMUX 16TSSOP
Packaging: Bulk
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MIMX8QM6AVUFEAB MIMX8QM6AVUFEAB NXP USA Inc. IMX8QM1P3AEC.pdf Description: MIMX8QM6AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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FRDM-STBI-A8974 NXP USA Inc. Description: EVB KIT FRDM-K22F/FRDM-STBCAGM01
Packaging: Bulk
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8974CF
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Sensing Range: ±2g, 4g, 8g, 16g
Produkt ist nicht verfügbar
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MC908AZ60ACFU MC908AZ60ACFU NXP USA Inc. MC68HC908AZ60A.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 52
DigiKey Programmable: Not Verified
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LCD-PAR-S035 NXP USA Inc. Description: GRAPHIC DISPLAY TFT - 3.5"
Packaging: Bulk
Display Type: TFT - Color, IPS (In-Plane Switching)
Display Mode: Transmissive
Interface: I2C, Parallel, 8/16-Bit, SPI
Dot Pixels: 480 x 320 (HVGA)
Diagonal Screen Size: 3.5" (88.90mm)
Touchscreen: Capacitive
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MC40XS6500DEK MC40XS6500DEK NXP USA Inc. MC07XS6517.pdf Description: LIGHTING ESWITCH PENTA 40MOHM
Features: Internal PWM, Slew Rate Controlled, Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: PWM, SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 40mOhm
Input Type: Non-Inverting
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3.9A
Ratio - Input:Output: 1:6
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, UVLO
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MKW21D256VHA5 MKW21D256VHA5 NXP USA Inc. MKW2xDxxx.pdf Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Packaging: Tray
Package / Case: 63-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 32kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Protocol: Zigbee®
Current - Receiving: 15mA
Data Rate (Max): 250kbps
Current - Transmitting: 19mA
Supplier Device Package: 63-MAPLGA (8x8)
GPIO: 2
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC13237CHTR MC13237CHTR NXP USA Inc. MC1323XFS.pdf Description: IC RF TXRX+MCU 802.15.4 48MAPLGA
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -93dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 2dBm
Protocol: Zigbee®
Current - Receiving: 26.8mA ~ 35mA
Data Rate (Max): 250kbps
Current - Transmitting: 21.3mA ~ 28.2mA
Supplier Device Package: 48-MAPLGA (7x7)
GPIO: 28
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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C9KEAZ128AVLH C9KEAZ128AVLH NXP USA Inc. Description: C9KEAZ128AVLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 71
Produkt ist nicht verfügbar
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MIMXRT1189CVM8B MIMXRT1189CVM8B NXP USA Inc. IMXRT1180FAMFS.pdf Description: MIMXRT1189CVM8B
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33, ARM® Cortex®-M7
Data Converters: D/A 1x12b
Core Size: 32-Bit Dual-Core
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
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A5M36TG140TC-EVB A5M36TG140TC-EVB NXP USA Inc. TSCEVBFS.pdf Description: 3400-3800 MHZ RF TOP-SIDE COOLIN
Packaging: Bulk
Frequency: 3.4GHz ~ 3.8GHz
Type: Antenna
Contents: Board(s)
Utilized IC / Part: A5M36TG140-TC
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A5M35TG140TC-EVB NXP USA Inc. TSCEVBFS.pdf Description: A5M35TG140TC RF REFERENCE CIRCUI
Packaging: Bulk
Frequency: 3.4GHz ~ 3.6GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: A5M35TG140-TC
Produkt ist nicht verfügbar
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MC33FS4505CAE MC33FS4505CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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2+11.16 EUR
10+9.91 EUR
25+9.45 EUR
40+9.22 EUR
80+8.9 EUR
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MC33FS4505CAER2 MC33FS4505CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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FS32K144HFT0VLFT FS32K144HFT0VLFT NXP USA Inc. S32K1xx.pdf Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 89
Produkt ist nicht verfügbar
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FS32K144HAT0VLLT FS32K144HAT0VLLT NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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FS32K144UAT0VLHT FS32K144UAT0VLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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FS32K144HFT0VLFR NXP USA Inc. S32K1xx.pdf Description: S32K144 32-BIT MCU, ARM CORTEX-M
Number of I/O: 89
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K144UST0VLHT FS32K144UST0VLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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FS32K144HFT0MLFR NXP USA Inc. S32K1xx.pdf Description: S32K144 32-BIT MCU, ARM CORTEX-M
Number of I/O: 89
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K144HAT0VLFR NXP USA Inc. S32K1xx.pdf Description: S32K144, 512K FLASH, 64K RAM
Number of I/O: 89
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SCBGARBW1AO
Hersteller: NXP USA Inc.
Description: SOCKET SUPPORTING VERTICAL AUTOM
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
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N74F51D,602 74F51.pdf
N74F51D,602
Hersteller: NXP USA Inc.
Description: IC GATE AND/OR/INVERT 2IN 14SOIC
Number of Circuits: 2
Supplier Device Package: 14-SO
Schmitt Trigger Input: No
Number of Inputs: 10 Input (3, 3, 2, 2)
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: AND/OR/INVERT Gate
Mounting Type: Surface Mount
Output Type: Differential
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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1902+0.27 EUR
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MFS2400AVMA0ESR2 FS2400.pdf
MFS2400AVMA0ESR2
Hersteller: NXP USA Inc.
Description: MFS2400AVMA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVMA1ESR2 FS2400.pdf
MFS2400AVMA1ESR2
Hersteller: NXP USA Inc.
Description: Safety Mini CAN FD SBC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVMA0ES FS2400.pdf
MFS2400AVMA0ES
Hersteller: NXP USA Inc.
Description: MFS2400AVMA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVBA0ESR2 FS2400.pdf
MFS2400AVBA0ESR2
Hersteller: NXP USA Inc.
Description: MFS2400AVBA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2400AVBA0ES FS2400.pdf
MFS2400AVBA0ES
Hersteller: NXP USA Inc.
Description: MFS2400AVBA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC44BS374T1EFR2 MC44BS374T1.pdf
MC44BS374T1EFR2
Hersteller: NXP USA Inc.
Description: IC NTSC/PAL MODULATOR 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: NTSC/PAL Modulator
Applications: Audio/Video, VCR's, Set-Top Boxes
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC20XS4200DFKR2 MC22XS4200.pdf
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKE02Z32VLD2 MKE02P64M20SF0.pdf
MKE02Z32VLD2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
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4+5.86 EUR
10+4.42 EUR
25+4.06 EUR
160+3.56 EUR
320+3.43 EUR
640+3.32 EUR
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MCXA146VPJ MCXAP100M96FS6.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
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2+10.7 EUR
10+8.23 EUR
25+7.61 EUR
100+6.94 EUR
260+6.6 EUR
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MCF51AG128CLK MCF51AG128.pdf
MCF51AG128CLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC16C852LIBS,151 SC16C852L.pdf
SC16C852LIBS,151
Hersteller: NXP USA Inc.
Description: IC UART DUAL W/FIFO 32-HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 1.8V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Produkt ist nicht verfügbar
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MIMX8UD3DVP08SC IMX8ULPIEC.pdf
MIMX8UD3DVP08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 610 Stücke:
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1+44.46 EUR
10+35.87 EUR
25+33.72 EUR
100+31.36 EUR
250+30.24 EUR
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MCXA154VPJ MCXAP100M96FS6.pdf
MCXA154VPJ
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 112-VFBGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
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AnzahlPreis
3+8.38 EUR
10+6.39 EUR
25+5.89 EUR
100+5.35 EUR
260+5.08 EUR
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MCXA155VPJ MCXAP64M96FS3.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
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3+8.24 EUR
10+5.67 EUR
25+5.29 EUR
100+4.72 EUR
260+4.58 EUR
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MFS2633AMDAHAD MFS2633AMDAJAD.pdf
MFS2633AMDAHAD
Hersteller: NXP USA Inc.
Description: MFS2633AMDAHAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
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AnzahlPreis
2+13.48 EUR
10+10.48 EUR
25+9.73 EUR
100+8.91 EUR
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MBMI7014TA1AER2 BMI7014.pdf
Hersteller: NXP USA Inc.
Description: MBMI7014TA1AER2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MBMI7014TA1AE BMI7014.pdf
Hersteller: NXP USA Inc.
Description: MBMI7014TA1AE
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4000EL/103Q200Y
Hersteller: NXP USA Inc.
Description: SAF4000EL/103Q200Y
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/103Q200K
Hersteller: NXP USA Inc.
Description: SAF4000EL/103Q200K
Packaging: Tray
Produkt ist nicht verfügbar
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LFDBGVCALS50R
Hersteller: NXP USA Inc.
Description: 156 PIN VERTICAL RING TO ROTATED
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
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FRWY-LS1012A-PB FRWY-LS1012A-PB_Web.pdf
FRWY-LS1012A-PB
Hersteller: NXP USA Inc.
Description: LAYERSCAPE LS1012A FREEWAY BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1012A
Platform: Layerscape LS1012A Freeway
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1+622.55 EUR
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LD6806CX4/33P,315 LD6806_Series.pdf
LD6806CX4/33P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 200MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 3.3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
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3328+0.15 EUR
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MPX2053DP MPX2053.pdf
MPX2053DP
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSID 0.19" .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube, Dual
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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S908AB32AH3VFUE
S908AB32AH3VFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-QFP (14x14)
Peripherals: POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Bulk
Produkt ist nicht verfügbar
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S32K348GHT1MJBST S32K3xx.pdf
S32K348GHT1MJBST
Hersteller: NXP USA Inc.
Description: S32K348GHT1MJBST
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCA9430HKZ
Hersteller: NXP USA Inc.
Description: IC BATT CHG 16XQFN
Supplier Device Package: 16-XQFN (2.2x2.8)
Mounting Type: Surface Mount
Package / Case: 16-XFQFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7755HV/N208WK
Hersteller: NXP USA Inc.
Description: MULTI-TUNER CAR RADIO & AUDIO ON
Packaging: Tray
Produkt ist nicht verfügbar
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SAF775CHN/N208W/AK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
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MC33FS6508NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6508NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
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AnzahlPreis
2+13.85 EUR
10+12.29 EUR
25+11.72 EUR
40+11.44 EUR
80+11.03 EUR
250+10.4 EUR
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MKE04Z64VLH4R MKE04P80M48SF0.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KE04: 48MHZ CORTEX-M0+ 5
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 1500 Stücke:
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AnzahlPreis
3+6.86 EUR
10+6.09 EUR
25+5.81 EUR
50+5.6 EUR
100+5.41 EUR
250+5.16 EUR
500+4.97 EUR
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MKE04Z64VLK4R MKE04P80M48SF0.pdf
MKE04Z64VLK4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 71
Supplier Device Package: 80-LQFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
auf Bestellung 1000 Stücke:
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AnzahlPreis
1000+4.42 EUR
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MKE04Z64VLK4R MKE04P80M48SF0.pdf
MKE04Z64VLK4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 71
Supplier Device Package: 80-LQFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 1000 Stücke:
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AnzahlPreis
3+8.61 EUR
10+6.57 EUR
25+6.06 EUR
100+5.5 EUR
250+5.23 EUR
500+5.07 EUR
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FXLS90220AESR2 FXLS9xxx0.pdf
FXLS90220AESR2
Hersteller: NXP USA Inc.
Description: X SINGLE-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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SPC5602BACLH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PHP18NQ11T,127 PHP18NQ11T.pdf
PHP18NQ11T,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 110V 18A TO220AB
Packaging: Bulk
auf Bestellung 663 Stücke:
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AnzahlPreis
454+1.11 EUR
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PDTA144TMB,315 PHGLS24961-1.pdf?t.download=true&u=5oefqw
PDTA144TMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Resistor - Base (R1): 47 kOhms
Frequency - Transition: 180 MHz
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: DFN1006B-3
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: PNP - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-101, SOT-883
Packaging: Bulk
Resistors Included: R1 Only
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AnzahlPreis
11225+0.051 EUR
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PDTA144WMB,315 PHGLS25680-1.pdf?t.download=true&u=5oefqw
PDTA144WMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 22 kOhms
Resistors Included: R1 and R2
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AnzahlPreis
11225+0.051 EUR
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74LVC139PW,112 74LVC139.pdf
74LVC139PW,112
Hersteller: NXP USA Inc.
Description: IC DUAL 2-4 DECOD/DEMUX 16TSSOP
Packaging: Bulk
auf Bestellung 7064 Stücke:
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AnzahlPreis
1755+0.29 EUR
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MIMX8QM6AVUFEAB IMX8QM1P3AEC.pdf
MIMX8QM6AVUFEAB
Hersteller: NXP USA Inc.
Description: MIMX8QM6AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
Produkt ist nicht verfügbar
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FRDM-STBI-A8974
Hersteller: NXP USA Inc.
Description: EVB KIT FRDM-K22F/FRDM-STBCAGM01
Packaging: Bulk
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8974CF
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Sensing Range: ±2g, 4g, 8g, 16g
Produkt ist nicht verfügbar
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MC908AZ60ACFU MC68HC908AZ60A.pdf
MC908AZ60ACFU
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LCD-PAR-S035
Hersteller: NXP USA Inc.
Description: GRAPHIC DISPLAY TFT - 3.5"
Packaging: Bulk
Display Type: TFT - Color, IPS (In-Plane Switching)
Display Mode: Transmissive
Interface: I2C, Parallel, 8/16-Bit, SPI
Dot Pixels: 480 x 320 (HVGA)
Diagonal Screen Size: 3.5" (88.90mm)
Touchscreen: Capacitive
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1+73.88 EUR
10+60.87 EUR
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MC40XS6500DEK MC07XS6517.pdf
MC40XS6500DEK
Hersteller: NXP USA Inc.
Description: LIGHTING ESWITCH PENTA 40MOHM
Features: Internal PWM, Slew Rate Controlled, Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: PWM, SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 40mOhm
Input Type: Non-Inverting
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3.9A
Ratio - Input:Output: 1:6
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, UVLO
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+10.21 EUR
10+7.84 EUR
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MKW21D256VHA5 MKW2xDxxx.pdf
MKW21D256VHA5
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Packaging: Tray
Package / Case: 63-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 32kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Protocol: Zigbee®
Current - Receiving: 15mA
Data Rate (Max): 250kbps
Current - Transmitting: 19mA
Supplier Device Package: 63-MAPLGA (8x8)
GPIO: 2
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC13237CHTR MC1323XFS.pdf
MC13237CHTR
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 48MAPLGA
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -93dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 2dBm
Protocol: Zigbee®
Current - Receiving: 26.8mA ~ 35mA
Data Rate (Max): 250kbps
Current - Transmitting: 21.3mA ~ 28.2mA
Supplier Device Package: 48-MAPLGA (7x7)
GPIO: 28
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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C9KEAZ128AVLH
C9KEAZ128AVLH
Hersteller: NXP USA Inc.
Description: C9KEAZ128AVLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 71
Produkt ist nicht verfügbar
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MIMXRT1189CVM8B IMXRT1180FAMFS.pdf
MIMXRT1189CVM8B
Hersteller: NXP USA Inc.
Description: MIMXRT1189CVM8B
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33, ARM® Cortex®-M7
Data Converters: D/A 1x12b
Core Size: 32-Bit Dual-Core
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
Produkt ist nicht verfügbar
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A5M36TG140TC-EVB TSCEVBFS.pdf
A5M36TG140TC-EVB
Hersteller: NXP USA Inc.
Description: 3400-3800 MHZ RF TOP-SIDE COOLIN
Packaging: Bulk
Frequency: 3.4GHz ~ 3.8GHz
Type: Antenna
Contents: Board(s)
Utilized IC / Part: A5M36TG140-TC
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AnzahlPreis
1+1041.09 EUR
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A5M35TG140TC-EVB TSCEVBFS.pdf
Hersteller: NXP USA Inc.
Description: A5M35TG140TC RF REFERENCE CIRCUI
Packaging: Bulk
Frequency: 3.4GHz ~ 3.6GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: A5M35TG140-TC
Produkt ist nicht verfügbar
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MC33FS4505CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS4505CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+11.16 EUR
10+9.91 EUR
25+9.45 EUR
40+9.22 EUR
80+8.9 EUR
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MC33FS4505CAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS4505CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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FS32K144HFT0VLFT S32K1xx.pdf
FS32K144HFT0VLFT
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 89
Produkt ist nicht verfügbar
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FS32K144HAT0VLLT
FS32K144HAT0VLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144UAT0VLHT S32K1xx.pdf
FS32K144UAT0VLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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FS32K144HFT0VLFR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Number of I/O: 89
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K144UST0VLHT S32K1xx.pdf
FS32K144UST0VLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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FS32K144HFT0MLFR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Number of I/O: 89
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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FS32K144HAT0VLFR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K144, 512K FLASH, 64K RAM
Number of I/O: 89
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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