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MPC8347EVRAGDB MPC8347EVRAGDB NXP USA Inc. MPC8347EEC.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MC68VZ328CVP MC68VZ328CVP NXP USA Inc. Description: IC MPU M683XX 33MHZ 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-MAPBGA (13x13)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
Produkt ist nicht verfügbar
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LPC11U68JBD64K LPC11U68JBD64K NXP USA Inc. LPC11U1X.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
auf Bestellung 949 Stücke:
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2+9.87 EUR
10+5.49 EUR
25+5.48 EUR
100+5.46 EUR
Mindestbestellmenge: 2
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LFINTPM3QA NXP USA Inc. Description: 176 PIN 0.5MM EQFP TO 208 1.0MM
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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LFK46RINTPM3QA NXP USA Inc. Description: QORIVVA MPC5746R ON A 176 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746R
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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PM823UK/A0CZ PM823UK/A0CZ NXP USA Inc. PM823.pdf Description: POWER MANAGEMENT IC, DUAL SYNCHR
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 3MHz
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Supplier Device Package: 12-WLCSP (1.55x1.18)
Voltage/Current - Output 1: 1.1V, 1.5A
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 3: 1.8V, 525mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 3
Produkt ist nicht verfügbar
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PM823UK/A0CZ PM823UK/A0CZ NXP USA Inc. PM823.pdf Description: POWER MANAGEMENT IC, DUAL SYNCHR
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 3MHz
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Supplier Device Package: 12-WLCSP (1.55x1.18)
Voltage/Current - Output 1: 1.1V, 1.5A
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 3: 1.8V, 525mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 3
auf Bestellung 728 Stücke:
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7+2.78 EUR
10+2.04 EUR
25+1.86 EUR
100+1.65 EUR
250+1.55 EUR
500+1.49 EUR
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PTN3222EUKZ PTN3222EUKZ NXP USA Inc. PTN3222EUK.pdf Description: USB INTERFACE IC PTN3222EUK
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
auf Bestellung 7719 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.76 EUR
10+2.03 EUR
25+1.85 EUR
100+1.65 EUR
250+1.55 EUR
500+1.53 EUR
Mindestbestellmenge: 7
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PTN3222DUKZ PTN3222DUKZ NXP USA Inc. PTN3222DUK.pdf Description: PTN3222DUKZ
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 11mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
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PTN3222DUKZ PTN3222DUKZ NXP USA Inc. PTN3222DUK.pdf Description: PTN3222DUKZ
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 11mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
auf Bestellung 7990 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.78 EUR
10+2.04 EUR
25+1.86 EUR
100+1.65 EUR
250+1.56 EUR
500+1.54 EUR
Mindestbestellmenge: 7
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PCMF1USB30Z PCMF1USB30Z NXP USA Inc. PCMFXUSB30_SER.pdf Description: CMC 2LN SMD ESD
Features: TVS Diode ESD Protection
Packaging: Bulk
Package / Case: 5-UFBGA, WLCSP
Filter Type: Signal Line
Size / Dimension: 0.046" L x 0.030" W (1.17mm x 0.77mm)
Mounting Type: Surface Mount
Number of Lines: 2
Operating Temperature: -40°C ~ 85°C
Height (Max): 0.024" (0.60mm)
DC Resistance (DCR) (Max): 3Ohm (Typ)
auf Bestellung 53203 Stücke:
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1998+0.25 EUR
Mindestbestellmenge: 1998
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MPC8358EVVAGDGA MPC8358EVVAGDGA NXP USA Inc. MPC8360E%2C8358E.pdf Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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LPC54101J256BD64QL LPC54101J256BD64QL NXP USA Inc. LPC5410X.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
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2+11.99 EUR
10+9.31 EUR
25+8.65 EUR
Mindestbestellmenge: 2
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LPC54101J512BD64QL LPC54101J512BD64QL NXP USA Inc. LPC5410X.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
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MIMXRT533SFAWCR MIMXRT533SFAWCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 3M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
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6000+19.53 EUR
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MIMXRT533SFAWCR MIMXRT533SFAWCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Cut Tape (CT)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 3M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
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1+33.16 EUR
10+26.45 EUR
25+24.77 EUR
100+22.93 EUR
250+22.05 EUR
500+21.52 EUR
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MRF8S9100HSR3 MRF8S9100HSR3 NXP USA Inc. MRF8S9100HR3H%28S%29R3.pdf Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 920MHz
Power - Output: 72W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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74HCT173D,652 74HCT173D,652 NXP USA Inc. PHGL-S-A0002525035-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 4BIT 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 80 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 40ns @ 6V, 50pF
Number of Bits per Element: 4
auf Bestellung 5648 Stücke:
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1135+0.41 EUR
Mindestbestellmenge: 1135
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PCA9646PW,118 PCA9646PW,118 NXP USA Inc. PCA9646.pdf Description: IC BUS SWITCH BUFF 4CH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
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PCA9646PW,118 PCA9646PW,118 NXP USA Inc. PCA9646.pdf Description: IC BUS SWITCH BUFF 4CH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
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S912ZVL64AMLF NXP USA Inc. MC9S12ZVLRM.pdf Description: S12Z CPU, 64K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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A5M36SG239T2 NXP USA Inc. A5M36SG239.pdf Description: A5M36SG239T2
Packaging: Bulk
Package / Case: 34-LLGA Exposed Pad Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.7dB
Current - Supply: 35mA ~ 38mA
Test Frequency: 3.8GHz
Supplier Device Package: 30-PLGA (12x8)
Produkt ist nicht verfügbar
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LPC5514JEV59E LPC5514JEV59E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLASH 59BGA
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 490 Stücke:
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4+5.72 EUR
10+5.34 EUR
25+4.98 EUR
100+4.77 EUR
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MPF5030BMBA0ES MPF5030BMBA0ES NXP USA Inc. PF5030_SDS.pdf Description: PMIC 3 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 243 Stücke:
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2+9.7 EUR
10+8.62 EUR
25+8.22 EUR
40+8.03 EUR
80+7.74 EUR
230+7.33 EUR
Mindestbestellmenge: 2
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MRF8S18120HSR3 MRF8S18120HSR3 NXP USA Inc. MRF8S18120H.pdf Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Power - Output: 72W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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S32K388CVB-Q289 NXP USA Inc. S32K3xx.pdf Description: S32K388CVB-Q289
Packaging: Box
Produkt ist nicht verfügbar
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T1023NSE7PQA T1023NSE7PQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Bulk
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
auf Bestellung 89 Stücke:
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3+179.66 EUR
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SAF7772EL/200Z10AY NXP USA Inc. Description: AUDIO DSPS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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T1024NXN7MQA T1024NXN7MQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1023NSN7PQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1013NSE7PQA T1013NSE7PQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1014NXN7PQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1024NXN7PQA T1024NXN7PQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1014NXN7KQA T1014NXN7KQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1020NSE7PQB T1020NSE7PQB NXP USA Inc. T1FAMILYFS.pdf Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (12)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1022NXE7PQB T1022NXE7PQB NXP USA Inc. T1FAMILYFS.pdf Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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KMI86/WHP NXP USA Inc. Description: KMI86
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMI86/PHP NXP USA Inc. Description: KMI86
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMI86/P NXP USA Inc. Description: MAG SWITCH ANGULAR SENS SOT1291
Packaging: Tape & Reel (TR)
Mounting Type: Through Hole
Produkt ist nicht verfügbar
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S912ZVCA19AMLF S912ZVCA19AMLF NXP USA Inc. Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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S912ZVC96AMLF S912ZVC96AMLF NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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TEA8918BAT/2Y NXP USA Inc. Description: POWER MANAGEMENT SPECIALIZED
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FB32K144UAT0VLHR NXP USA Inc. Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FB32K144UAT0VLHT NXP USA Inc. Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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MKL02Z32VFK4R MKL02Z32VFK4R NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL02Z32VFK4R MKL02Z32VFK4R NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 3636 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.77 EUR
10+3.59 EUR
25+3.29 EUR
100+2.96 EUR
250+2.8 EUR
500+2.71 EUR
1000+2.63 EUR
2500+2.55 EUR
Mindestbestellmenge: 4
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LS1043AXN7MQB LS1043AXN7MQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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BSC9132NXN7KNKB NXP USA Inc. BSC9132.pdf Description: BSC9132 - QORIQ QONVERGE SOC, 2X
Packaging: Bulk
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
3+236.01 EUR
Mindestbestellmenge: 3
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MC68340CAG16E MC68340CAG16E NXP USA Inc. MC68340UM.pdf Description: IC MPU M683XX 16MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: USART
Produkt ist nicht verfügbar
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MC33215BE MC33215BE NXP USA Inc. MC33215.pdf Description: IC TELECOM INTERFACE 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Function: Voice-Switched Speakerphone
Operating Temperature: -20°C ~ 70°C
Supplier Device Package: 42-PDIP
Number of Circuits: 1
Produkt ist nicht verfügbar
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T1024NSE7KNA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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MC33774ASP1AE MC33774ASP1AE NXP USA Inc. PB_MC33774A.pdf Description: MC33774ASP1AE
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 4 ~ 18
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 155 Stücke:
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1+22.19 EUR
10+15.75 EUR
25+14.09 EUR
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MC33771CTP1AE MC33771CTP1AE NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 313 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.89 EUR
10+17.28 EUR
25+16.14 EUR
160+14.55 EUR
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S9S12G96J0MLFR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S9S12G96J0MLF NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MC56F81748MLH MC56F81748MLH NXP USA Inc. MC56F81XXX.pdf Description: 32-BIT DSC, 56800EX CORE, 64KB F
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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LPC1114JBD48/303QL LPC1114JBD48/303QL NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IW611UK/A1CAZ NXP USA Inc. Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW611UK/A1IAZ NXP USA Inc. Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW612UK/A1CAZ NXP USA Inc. Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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MPC8347EVRAGDB MPC8347EEC.pdf
MPC8347EVRAGDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MC68VZ328CVP
MC68VZ328CVP
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-MAPBGA (13x13)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
Produkt ist nicht verfügbar
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LPC11U68JBD64K LPC11U1X.pdf
LPC11U68JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
auf Bestellung 949 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.87 EUR
10+5.49 EUR
25+5.48 EUR
100+5.46 EUR
Mindestbestellmenge: 2
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LFINTPM3QA
Hersteller: NXP USA Inc.
Description: 176 PIN 0.5MM EQFP TO 208 1.0MM
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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LFK46RINTPM3QA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5746R ON A 176 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746R
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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PM823UK/A0CZ PM823.pdf
PM823UK/A0CZ
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, DUAL SYNCHR
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 3MHz
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Supplier Device Package: 12-WLCSP (1.55x1.18)
Voltage/Current - Output 1: 1.1V, 1.5A
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 3: 1.8V, 525mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 3
Produkt ist nicht verfügbar
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PM823UK/A0CZ PM823.pdf
PM823UK/A0CZ
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, DUAL SYNCHR
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 3MHz
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Supplier Device Package: 12-WLCSP (1.55x1.18)
Voltage/Current - Output 1: 1.1V, 1.5A
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 3: 1.8V, 525mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 3
auf Bestellung 728 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.78 EUR
10+2.04 EUR
25+1.86 EUR
100+1.65 EUR
250+1.55 EUR
500+1.49 EUR
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PTN3222EUKZ PTN3222EUK.pdf
PTN3222EUKZ
Hersteller: NXP USA Inc.
Description: USB INTERFACE IC PTN3222EUK
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
auf Bestellung 7719 Stücke:
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7+2.76 EUR
10+2.03 EUR
25+1.85 EUR
100+1.65 EUR
250+1.55 EUR
500+1.53 EUR
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PTN3222DUKZ PTN3222DUK.pdf
PTN3222DUKZ
Hersteller: NXP USA Inc.
Description: PTN3222DUKZ
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 11mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
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PTN3222DUKZ PTN3222DUK.pdf
PTN3222DUKZ
Hersteller: NXP USA Inc.
Description: PTN3222DUKZ
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 11mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
auf Bestellung 7990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.78 EUR
10+2.04 EUR
25+1.86 EUR
100+1.65 EUR
250+1.56 EUR
500+1.54 EUR
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PCMF1USB30Z PCMFXUSB30_SER.pdf
PCMF1USB30Z
Hersteller: NXP USA Inc.
Description: CMC 2LN SMD ESD
Features: TVS Diode ESD Protection
Packaging: Bulk
Package / Case: 5-UFBGA, WLCSP
Filter Type: Signal Line
Size / Dimension: 0.046" L x 0.030" W (1.17mm x 0.77mm)
Mounting Type: Surface Mount
Number of Lines: 2
Operating Temperature: -40°C ~ 85°C
Height (Max): 0.024" (0.60mm)
DC Resistance (DCR) (Max): 3Ohm (Typ)
auf Bestellung 53203 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1998+0.25 EUR
Mindestbestellmenge: 1998
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MPC8358EVVAGDGA MPC8360E%2C8358E.pdf
MPC8358EVVAGDGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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LPC54101J256BD64QL LPC5410X.pdf
LPC54101J256BD64QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 111 Stücke:
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Anzahl Preis
2+11.99 EUR
10+9.31 EUR
25+8.65 EUR
Mindestbestellmenge: 2
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LPC54101J512BD64QL LPC5410X.pdf
LPC54101J512BD64QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 1 Stücke:
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MIMXRT533SFAWCR IMXRT500EC.pdf
MIMXRT533SFAWCR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 3M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+19.53 EUR
Mindestbestellmenge: 6000
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MIMXRT533SFAWCR IMXRT500EC.pdf
MIMXRT533SFAWCR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Cut Tape (CT)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 3M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+33.16 EUR
10+26.45 EUR
25+24.77 EUR
100+22.93 EUR
250+22.05 EUR
500+21.52 EUR
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MRF8S9100HSR3 MRF8S9100HR3H%28S%29R3.pdf
MRF8S9100HSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 920MHz
Power - Output: 72W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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74HCT173D,652 PHGL-S-A0002525035-1.pdf?t.download=true&u=5oefqw
74HCT173D,652
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 4BIT 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 80 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 40ns @ 6V, 50pF
Number of Bits per Element: 4
auf Bestellung 5648 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1135+0.41 EUR
Mindestbestellmenge: 1135
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PCA9646PW,118 PCA9646.pdf
PCA9646PW,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH BUFF 4CH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
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PCA9646PW,118 PCA9646.pdf
PCA9646PW,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH BUFF 4CH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
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S912ZVL64AMLF MC9S12ZVLRM.pdf
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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A5M36SG239T2 A5M36SG239.pdf
Hersteller: NXP USA Inc.
Description: A5M36SG239T2
Packaging: Bulk
Package / Case: 34-LLGA Exposed Pad Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.7dB
Current - Supply: 35mA ~ 38mA
Test Frequency: 3.8GHz
Supplier Device Package: 30-PLGA (12x8)
Produkt ist nicht verfügbar
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LPC5514JEV59E LPC55S1x_LPC551x_DS.pdf
LPC5514JEV59E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 59BGA
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.72 EUR
10+5.34 EUR
25+4.98 EUR
100+4.77 EUR
Mindestbestellmenge: 4
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MPF5030BMBA0ES PF5030_SDS.pdf
MPF5030BMBA0ES
Hersteller: NXP USA Inc.
Description: PMIC 3 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 243 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.7 EUR
10+8.62 EUR
25+8.22 EUR
40+8.03 EUR
80+7.74 EUR
230+7.33 EUR
Mindestbestellmenge: 2
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MRF8S18120HSR3 MRF8S18120H.pdf
MRF8S18120HSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Power - Output: 72W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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S32K388CVB-Q289 S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: S32K388CVB-Q289
Packaging: Box
Produkt ist nicht verfügbar
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T1023NSE7PQA T1024FS.pdf
T1023NSE7PQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Bulk
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+179.66 EUR
Mindestbestellmenge: 3
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SAF7772EL/200Z10AY
Hersteller: NXP USA Inc.
Description: AUDIO DSPS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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T1024NXN7MQA T1024FS.pdf
T1024NXN7MQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1023NSN7PQA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1013NSE7PQA T1024FS.pdf
T1013NSE7PQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1014NXN7PQA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1024NXN7PQA T1024FS.pdf
T1024NXN7PQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1014NXN7KQA T1024FS.pdf
T1014NXN7KQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1020NSE7PQB T1FAMILYFS.pdf
T1020NSE7PQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (12)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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T1022NXE7PQB T1FAMILYFS.pdf
T1022NXE7PQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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KMI86/WHP
Hersteller: NXP USA Inc.
Description: KMI86
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMI86/PHP
Hersteller: NXP USA Inc.
Description: KMI86
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMI86/P
Hersteller: NXP USA Inc.
Description: MAG SWITCH ANGULAR SENS SOT1291
Packaging: Tape & Reel (TR)
Mounting Type: Through Hole
Produkt ist nicht verfügbar
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S912ZVCA19AMLF
S912ZVCA19AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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S912ZVC96AMLF
S912ZVC96AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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TEA8918BAT/2Y
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT SPECIALIZED
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FB32K144UAT0VLHR
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FB32K144UAT0VLHT
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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MKL02Z32VFK4R KL0xPB.pdf
MKL02Z32VFK4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL02Z32VFK4R KL0xPB.pdf
MKL02Z32VFK4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 3636 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.77 EUR
10+3.59 EUR
25+3.29 EUR
100+2.96 EUR
250+2.8 EUR
500+2.71 EUR
1000+2.63 EUR
2500+2.55 EUR
Mindestbestellmenge: 4
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LS1043AXN7MQB LS1043AFS.pdf
LS1043AXN7MQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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BSC9132NXN7KNKB BSC9132.pdf
Hersteller: NXP USA Inc.
Description: BSC9132 - QORIQ QONVERGE SOC, 2X
Packaging: Bulk
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+236.01 EUR
Mindestbestellmenge: 3
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MC68340CAG16E MC68340UM.pdf
MC68340CAG16E
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: USART
Produkt ist nicht verfügbar
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MC33215BE MC33215.pdf
MC33215BE
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Function: Voice-Switched Speakerphone
Operating Temperature: -20°C ~ 70°C
Supplier Device Package: 42-PDIP
Number of Circuits: 1
Produkt ist nicht verfügbar
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T1024NSE7KNA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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MC33774ASP1AE PB_MC33774A.pdf
MC33774ASP1AE
Hersteller: NXP USA Inc.
Description: MC33774ASP1AE
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 4 ~ 18
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 155 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+22.19 EUR
10+15.75 EUR
25+14.09 EUR
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MC33771CTP1AE MC33771C.pdf
MC33771CTP1AE
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 313 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.89 EUR
10+17.28 EUR
25+16.14 EUR
160+14.55 EUR
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S9S12G96J0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S9S12G96J0MLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MC56F81748MLH MC56F81XXX.pdf
MC56F81748MLH
Hersteller: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 64KB F
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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LPC1114JBD48/303QL LPC111X.pdf
LPC1114JBD48/303QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IW611UK/A1CAZ
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW611UK/A1IAZ
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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IW612UK/A1CAZ
Hersteller: NXP USA Inc.
Description: IC RF 140WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 140-XFBGA, WLCSP
Mounting Type: Surface Mount
Supplier Device Package: 140-WLCSP (4.96x4.39)
Produkt ist nicht verfügbar
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