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MKL02Z32VFG4R MKL02Z32VFG4R NXP USA Inc. KL02P32M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 258 Stücke:
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5+5.18 EUR
10+3.87 EUR
25+3.55 EUR
100+3.18 EUR
250+3.01 EUR
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MKL02Z32VFM4R MKL02Z32VFM4R NXP USA Inc. KL02P32M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
auf Bestellung 5000 Stücke:
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5000+3.11 EUR
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MKL02Z32VFM4R MKL02Z32VFM4R NXP USA Inc. KL02P32M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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4+5.93 EUR
10+4.46 EUR
25+4.08 EUR
100+3.68 EUR
250+3.49 EUR
500+3.37 EUR
1000+3.27 EUR
2500+3.17 EUR
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MKE02Z32VLD2R MKE02Z32VLD2R NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
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1500+4.11 EUR
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MKE02Z32VLD2R MKE02Z32VLD2R NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Cut Tape (CT)
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3+7.47 EUR
10+5.64 EUR
25+5.18 EUR
100+4.68 EUR
250+4.43 EUR
500+4.28 EUR
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MKE02Z32VLD4R MKE02Z32VLD4R NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
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1500+3.68 EUR
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MKE02Z32VLD4R MKE02Z32VLD4R NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Cut Tape (CT)
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3+7.44 EUR
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100+4.65 EUR
250+4.4 EUR
500+4.26 EUR
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MKE15Z64VFP4R NXP USA Inc. KE1xZP48M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 40VFQFN
Number of I/O: 36
Supplier Device Package: 40-HVQFN (5x5)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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3+7.56 EUR
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25+5.25 EUR
100+4.74 EUR
250+4.49 EUR
500+4.34 EUR
1000+4.22 EUR
2500+4.09 EUR
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MKE04Z128VQH4R MKE04Z128VQH4R NXP USA Inc. MKE04P80M48SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKE04Z128VQH4R MKE04Z128VQH4R NXP USA Inc. MKE04P80M48SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Cut Tape (CT)
auf Bestellung 456 Stücke:
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3+9.34 EUR
10+6.08 EUR
25+6.05 EUR
100+6.01 EUR
250+5.71 EUR
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MRF1K50H-27MHZ NXP USA Inc. MRF1K50H.pdf Description: MRF1K50H-27MHZ
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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MRF1K50H-230MHZ NXP USA Inc. MRF1K50H.pdf Description: MRF1K50H-230MHZ
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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MRF8HP21130HSR3 MRF8HP21130HSR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: Dual
Power - Output: 28W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 360 mA
Produkt ist nicht verfügbar
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P5020NSE7TNB P5020NSE7TNB NXP USA Inc. P2P3P5APPBRF.pdf Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Additional Interfaces: DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 2.0GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MC33FS6504LAE MC33FS6504LAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 249 Stücke:
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2+19.35 EUR
10+15.14 EUR
25+14.08 EUR
100+12.92 EUR
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S9S12GN16J1MLC S9S12GN16J1MLC NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 32LQFP
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: S12
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MCF5274LVF166 MCF5274LVF166 NXP USA Inc. MCF5275EC.pdf Description: IC MCU 32BIT ROMLESS 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 61
Supplier Device Package: 196-LBGA (15x15)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C
RAM Size: 64K x 8
Speed: 166MHz
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Packaging: Tray
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SPC5744BSK1AVKU2 SPC5744BSK1AVKU2 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
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S912XEG128BVAAR S912XEG128BVAAR NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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S912XEG128BVAA S912XEG128BVAA NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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FRDM-RW612 FRDM-RW612 NXP USA Inc. UM12160.pdf Description: EVAL BOARD FOR RW612
Packaging: Box
Frequency: 2.4GHz, 5GHz
Type: Transceiver; 802.11 a/b/g/n/ac/ax (Wi-Fi, WiFi, WLAN), 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Contents: Board(s), Cable(s)
Antenna Type: PCB Trace Antenna(s) On-Board
Utilized IC / Part: RW612
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74AUP2G34GF,132 74AUP2G34GF,132 NXP USA Inc. 74AUP2G34.pdf Description: IC BUFF DL LOW PWR N-INV 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
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MMA9550LR1 MMA9550LR1 NXP USA Inc. MMA955xL.pdf Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Bulk
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
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MMA6255AKEG MMA6255AKEG NXP USA Inc. MMA6222AKEG.pdf Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±50g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
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MC9328MX21SCVK MC9328MX21SCVK NXP USA Inc. MC9328MX21S.pdf Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
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MCZ33897TEF MCZ33897TEF NXP USA Inc. MC33897.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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PVR100AZ-B12V,115 PVR100AZ-B12V,115 NXP USA Inc. PVR100AZ-B_Series.pdf Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
auf Bestellung 3000 Stücke:
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3000+0.23 EUR
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PVR100AZ-B2V5,115 PVR100AZ-B2V5,115 NXP USA Inc. PVR100AZ-B_Series.pdf Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
auf Bestellung 3000 Stücke:
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3000+0.23 EUR
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PVR100AZ-B3V3,115 PVR100AZ-B3V3,115 NXP USA Inc. PVR100AZ-B_Series.pdf Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
auf Bestellung 3000 Stücke:
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3000+0.23 EUR
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NZX6V8C,133 NXP USA Inc. NZX_SER.pdf Description: DIODE ZENER 6.8V 500MW ALF2
Packaging: Bulk
auf Bestellung 48290 Stücke:
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MC68302CAG16VC MC68302CAG16VC NXP USA Inc. MC68302TIMING.pdf Description: IC MPU M683XX 16MHZ 144LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 3.3V
Core Processor: M68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC68302CEH20C MC68302CEH20C NXP USA Inc. MC68302FACT.pdf Description: IC MPU M683XX 20MHZ 132PQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 132-PQFP (46x46)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200PAU15/0ZB86V NXP USA Inc. Description: IC MCU
Packaging: Bulk
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J3R200PMU15/0ZB42V NXP USA Inc. Description: J3R200PMU15/0ZB42V
Packaging: Bulk
Produkt ist nicht verfügbar
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J3R200PIU15/0ZA3FV NXP USA Inc. Description: J3R200PIU15
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 24109 Stücke
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J3R200PAU15/0ZA3FV NXP USA Inc. Description: J3R200PAU15
Packaging: Tray
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J3R200P1U15/0ZA45V NXP USA Inc. Description: J3R200P1U15
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 24109 Stücke
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J3R200PBU15/0ZA3FV NXP USA Inc. Description: J3R200PBU15
Packaging: Tray
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J3R200BDU15/0ZB40V NXP USA Inc. Description: J3R200BDU15/0ZB40V
Packaging: Bulk
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J3R200PPU15/0ZA7CV NXP USA Inc. Description: J3R200PPU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R150PPU15/0ZA7CV NXP USA Inc. Description: J3R150PPU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R150PTU15/0ZA96V NXP USA Inc. Description: J3R150PTU15
Packaging: Tray
Produkt ist nicht verfügbar
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MMA2612KW NXP USA Inc. Description: IC SENSOR ACCELEROMETER 16QFN
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Axis: X
Acceleration Range: ±125g
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-QFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 75 Stücke
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MC68F375BGMVR33 NXP USA Inc. MC68F375RM.pdf Description: IC MCU 32BIT 256KB FLASH 217PBGA
Packaging: Tray
Package / Case: 217-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: CANbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 217-PBGA (23x23)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908KX2CDWE MC908KX2CDWE NXP USA Inc. MC68HC908KX8.pdf Description: IC MCU 8BIT 2KB FLASH 16SOIC
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MC908KX2CDWER MC908KX2CDWER NXP USA Inc. MC68HC908KX8.pdf Description: IC MCU 8BIT 2KB FLASH 16SOIC
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74ALVC244D,118 74ALVC244D,118 NXP USA Inc. PHGLS11912-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-SO
auf Bestellung 2010 Stücke:
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1116+0.54 EUR
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MIMX8ML2DVNLZAB MIMX8ML2DVNLZAB NXP USA Inc. MIMX8ML2DVNLZAB.pdf Description: MIMX8ML2DVNLZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 630 Stücke:
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1+81.93 EUR
10+66.93 EUR
25+63.18 EUR
126+58.52 EUR
252+57.08 EUR
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MIMX8ML5DVNLZAB MIMX8ML5DVNLZAB NXP USA Inc. MIMX8ML2CVNKZAB.pdf Description: MIMX8ML5DVNLZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 630 Stücke:
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1+75.26 EUR
10+61.73 EUR
25+60 EUR
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MIMX8ML5CVNKZAB MIMX8ML5CVNKZAB NXP USA Inc. MIMX8ML2CVNKZAB.pdf Description: MIMX8ML5CVNKZAB
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 548-LFBGA
Packaging: Bulk
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Security Features: ARM TZ, CAAM, RDC
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Ethernet: GbE (2)
Supplier Device Package: 548-LFBGA (15x15)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TJ)
auf Bestellung 620 Stücke:
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1+81.66 EUR
10+67.15 EUR
25+65.56 EUR
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MIMX8ML2CVNKZAB MIMX8ML2CVNKZAB NXP USA Inc. MIMX8ML2CVNKZAB.pdf Description: MIMX8ML2CVNKZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 298 Stücke:
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1+77.08 EUR
10+62.93 EUR
25+59.39 EUR
126+55 EUR
252+53.65 EUR
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MC34PF8100CHEPR2 MC34PF8100CHEPR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 4000 Stücke
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MC34PF8100CHEP MC34PF8100CHEP NXP USA Inc. PF8100_PF8200.pdf Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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PN7642EV/C101Y PN7642EV/C101Y NXP USA Inc. PN7642.pdf Description: PN7642EV/C101Y
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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MC9S08SH8MTGR MC9S08SH8MTGR NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC55S16JBD64K LPC55S16JBD64K NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Number of I/O: 36
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.03 EUR
10+8 EUR
25+7.63 EUR
40+7.45 EUR
80+7.19 EUR
230+6.83 EUR
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SPC5746RK1MMT5R SPC5746RK1MMT5R NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 252MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 252-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 252-MAPBGA (17x17)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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MC56F8255MLD MC56F8255MLD NXP USA Inc. FSCLS11848-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 16-BIT, FLASH,
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
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34+15.83 EUR
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MFS8412AMBP7ES MFS8412AMBP7ES NXP USA Inc. FS84QFN48EP.pdf Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 260 Stücke
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LFVBBOJ76Z1A NXP USA Inc. Description: QORIVVA MPC5676R 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5676R
Accessory Type: Base Board
Produkt ist nicht verfügbar
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MKL02Z32VFG4R KL02P32M48SF0.pdf
MKL02Z32VFG4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 258 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5+5.18 EUR
10+3.87 EUR
25+3.55 EUR
100+3.18 EUR
250+3.01 EUR
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MKL02Z32VFM4R KL02P32M48SF0.pdf
MKL02Z32VFM4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
auf Bestellung 5000 Stücke:
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AnzahlPrivatkunde
5000+3.11 EUR
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MKL02Z32VFM4R KL02P32M48SF0.pdf
MKL02Z32VFM4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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10+4.46 EUR
25+4.08 EUR
100+3.68 EUR
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500+3.37 EUR
1000+3.27 EUR
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MKE02Z32VLD2R MKE02P64M20SF0.pdf
MKE02Z32VLD2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
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1500+4.11 EUR
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MKE02Z32VLD2R MKE02P64M20SF0.pdf
MKE02Z32VLD2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Cut Tape (CT)
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3+7.47 EUR
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MKE02Z32VLD4R MKE02P64M40SF0.pdf
MKE02Z32VLD4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
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1500+3.68 EUR
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MKE02Z32VLD4R MKE02P64M40SF0.pdf
MKE02Z32VLD4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Cut Tape (CT)
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3+7.44 EUR
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25+5.15 EUR
100+4.65 EUR
250+4.4 EUR
500+4.26 EUR
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MKE15Z64VFP4R KE1xZP48M48SF0.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 40VFQFN
Number of I/O: 36
Supplier Device Package: 40-HVQFN (5x5)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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3+7.56 EUR
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500+4.34 EUR
1000+4.22 EUR
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MKE04Z128VQH4R MKE04P80M48SF0.pdf
MKE04Z128VQH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKE04Z128VQH4R MKE04P80M48SF0.pdf
MKE04Z128VQH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Cut Tape (CT)
auf Bestellung 456 Stücke:
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3+9.34 EUR
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MRF1K50H-27MHZ MRF1K50H.pdf
Hersteller: NXP USA Inc.
Description: MRF1K50H-27MHZ
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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MRF1K50H-230MHZ MRF1K50H.pdf
Hersteller: NXP USA Inc.
Description: MRF1K50H-230MHZ
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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MRF8HP21130HSR3
MRF8HP21130HSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: Dual
Power - Output: 28W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 360 mA
Produkt ist nicht verfügbar
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P5020NSE7TNB P2P3P5APPBRF.pdf
P5020NSE7TNB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Additional Interfaces: DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 2.0GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MC33FS6504LAE FS6500-FS4500-ASILD.pdf
MC33FS6504LAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 249 Stücke:
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2+19.35 EUR
10+15.14 EUR
25+14.08 EUR
100+12.92 EUR
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S9S12GN16J1MLC
S9S12GN16J1MLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: S12
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MCF5274LVF166 MCF5275EC.pdf
MCF5274LVF166
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 61
Supplier Device Package: 196-LBGA (15x15)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C
RAM Size: 64K x 8
Speed: 166MHz
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5744BSK1AVKU2
SPC5744BSK1AVKU2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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S912XEG128BVAAR
S912XEG128BVAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG128BVAA
S912XEG128BVAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM-RW612 UM12160.pdf
FRDM-RW612
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR RW612
Packaging: Box
Frequency: 2.4GHz, 5GHz
Type: Transceiver; 802.11 a/b/g/n/ac/ax (Wi-Fi, WiFi, WLAN), 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Contents: Board(s), Cable(s)
Antenna Type: PCB Trace Antenna(s) On-Board
Utilized IC / Part: RW612
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74AUP2G34GF,132 74AUP2G34.pdf
74AUP2G34GF,132
Hersteller: NXP USA Inc.
Description: IC BUFF DL LOW PWR N-INV 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
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1845+0.32 EUR
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MMA9550LR1 MMA955xL.pdf
MMA9550LR1
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Bulk
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
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94+5.75 EUR
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MMA6255AKEG MMA6222AKEG.pdf
MMA6255AKEG
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±50g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
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MC9328MX21SCVK MC9328MX21S.pdf
MC9328MX21SCVK
Hersteller: NXP USA Inc.
Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
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MCZ33897TEF MC33897.pdf
MCZ33897TEF
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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PVR100AZ-B12V,115 PVR100AZ-B_Series.pdf
PVR100AZ-B12V,115
Hersteller: NXP USA Inc.
Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
auf Bestellung 3000 Stücke:
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3000+0.23 EUR
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PVR100AZ-B2V5,115 PVR100AZ-B_Series.pdf
PVR100AZ-B2V5,115
Hersteller: NXP USA Inc.
Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
auf Bestellung 3000 Stücke:
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3000+0.23 EUR
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PVR100AZ-B3V3,115 PVR100AZ-B_Series.pdf
PVR100AZ-B3V3,115
Hersteller: NXP USA Inc.
Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
auf Bestellung 3000 Stücke:
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AnzahlPrivatkunde
3000+0.23 EUR
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NZX6V8C,133 NZX_SER.pdf
Hersteller: NXP USA Inc.
Description: DIODE ZENER 6.8V 500MW ALF2
Packaging: Bulk
auf Bestellung 48290 Stücke:
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13172+0.04 EUR
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MC68302CAG16VC MC68302TIMING.pdf
MC68302CAG16VC
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 144LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 3.3V
Core Processor: M68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC68302CEH20C MC68302FACT.pdf
MC68302CEH20C
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 132PQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 132-PQFP (46x46)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200PAU15/0ZB86V
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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J3R200PMU15/0ZB42V
Hersteller: NXP USA Inc.
Description: J3R200PMU15/0ZB42V
Packaging: Bulk
Produkt ist nicht verfügbar
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J3R200PIU15/0ZA3FV
Hersteller: NXP USA Inc.
Description: J3R200PIU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200PAU15/0ZA3FV
Hersteller: NXP USA Inc.
Description: J3R200PAU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200P1U15/0ZA45V
Hersteller: NXP USA Inc.
Description: J3R200P1U15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200PBU15/0ZA3FV
Hersteller: NXP USA Inc.
Description: J3R200PBU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200BDU15/0ZB40V
Hersteller: NXP USA Inc.
Description: J3R200BDU15/0ZB40V
Packaging: Bulk
Produkt ist nicht verfügbar
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J3R200PPU15/0ZA7CV
Hersteller: NXP USA Inc.
Description: J3R200PPU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R150PPU15/0ZA7CV
Hersteller: NXP USA Inc.
Description: J3R150PPU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R150PTU15/0ZA96V
Hersteller: NXP USA Inc.
Description: J3R150PTU15
Packaging: Tray
Produkt ist nicht verfügbar
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MMA2612KW
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCELEROMETER 16QFN
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Axis: X
Acceleration Range: ±125g
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-QFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC68F375BGMVR33 MC68F375RM.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 217PBGA
Packaging: Tray
Package / Case: 217-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: CANbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 217-PBGA (23x23)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908KX2CDWE MC68HC908KX8.pdf
MC908KX2CDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16SOIC
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MC908KX2CDWER MC68HC908KX8.pdf
MC908KX2CDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16SOIC
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74ALVC244D,118 PHGLS11912-1.pdf?t.download=true&u=5oefqw
74ALVC244D,118
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-SO
auf Bestellung 2010 Stücke:
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AnzahlPrivatkunde
1116+0.54 EUR
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MIMX8ML2DVNLZAB MIMX8ML2DVNLZAB.pdf
MIMX8ML2DVNLZAB
Hersteller: NXP USA Inc.
Description: MIMX8ML2DVNLZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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1+81.93 EUR
10+66.93 EUR
25+63.18 EUR
126+58.52 EUR
252+57.08 EUR
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MIMX8ML5DVNLZAB MIMX8ML2CVNKZAB.pdf
MIMX8ML5DVNLZAB
Hersteller: NXP USA Inc.
Description: MIMX8ML5DVNLZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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1+75.26 EUR
10+61.73 EUR
25+60 EUR
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MIMX8ML5CVNKZAB MIMX8ML2CVNKZAB.pdf
MIMX8ML5CVNKZAB
Hersteller: NXP USA Inc.
Description: MIMX8ML5CVNKZAB
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 548-LFBGA
Packaging: Bulk
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Security Features: ARM TZ, CAAM, RDC
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Ethernet: GbE (2)
Supplier Device Package: 548-LFBGA (15x15)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TJ)
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AnzahlPrivatkunde
1+81.66 EUR
10+67.15 EUR
25+65.56 EUR
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MIMX8ML2CVNKZAB MIMX8ML2CVNKZAB.pdf
MIMX8ML2CVNKZAB
Hersteller: NXP USA Inc.
Description: MIMX8ML2CVNKZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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AnzahlPrivatkunde
1+77.08 EUR
10+62.93 EUR
25+59.39 EUR
126+55 EUR
252+53.65 EUR
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MC34PF8100CHEPR2 PF8100_PF8200.pdf
MC34PF8100CHEPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MC34PF8100CHEP PF8100_PF8200.pdf
MC34PF8100CHEP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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PN7642EV/C101Y PN7642.pdf
PN7642EV/C101Y
Hersteller: NXP USA Inc.
Description: PN7642EV/C101Y
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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MC9S08SH8MTGR MC9S08SH32.pdf
MC9S08SH8MTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC55S16JBD64K LPC55S1x_LPC551x_DS.pdf
LPC55S16JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Number of I/O: 36
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.03 EUR
10+8 EUR
25+7.63 EUR
40+7.45 EUR
80+7.19 EUR
230+6.83 EUR
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SPC5746RK1MMT5R
SPC5746RK1MMT5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 252MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 252-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 252-MAPBGA (17x17)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC56F8255MLD FSCLS11848-1.pdf?t.download=true&u=5oefqw
MC56F8255MLD
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, FLASH,
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
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AnzahlPrivatkunde
34+15.83 EUR
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MFS8412AMBP7ES FS84QFN48EP.pdf
MFS8412AMBP7ES
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LFVBBOJ76Z1A
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5676R 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5676R
Accessory Type: Base Board
Produkt ist nicht verfügbar
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