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MC9RS08KB4CTG MC9RS08KB4CTG NXP USA Inc. MC9RS08KB12.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9RS08KB12CFK MC9RS08KB12CFK NXP USA Inc. MC9RS08KB12.pdf Description: IC MCU 8BIT 12KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN-EP (4x4)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9RS08KB8CTG MC9RS08KB8CTG NXP USA Inc. MC9RS08KB12.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC852TZT50A MPC852TZT50A NXP USA Inc. MPC852T.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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BZX884-C22,315 BZX884-C22,315 NXP USA Inc. BZX884_BC_SER.pdf Description: DIODE ZENER 22V 250MW SOD882
Packaging: Bulk
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PEMI2QFN/LM,115 PEMI2QFN/LM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/16PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
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MKE04Z128VLH4R MKE04Z128VLH4R NXP USA Inc. MKE04P80M48SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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MKE04Z128VLH4R MKE04Z128VLH4R NXP USA Inc. MKE04P80M48SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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MCIMX6U1AVM10AD MCIMX6U1AVM10AD NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6DL 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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PDTA115TMB,315 PDTA115TMB,315 NXP USA Inc. PHGLS24957-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 100 kOhms
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MKE02Z32VFM4R MKE02Z32VFM4R NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
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MKE02Z32VFM4R MKE02Z32VFM4R NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
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MWCT20D2VLH NXP USA Inc. WCT2xx2ADS.pdf Description: MWCT20D2VLH
Packaging: Tray
Produkt ist nicht verfügbar
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MC56F81746LMLF MC56F81746LMLF NXP USA Inc. MC56F81XXXL.pdf Description: MC56F81746LMLF
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
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74ABT16373BDL,112 74ABT16373BDL,112 NXP USA Inc. 74ABT16373B.pdf Description: IC D-TYPE TRANSP 8:8 48-SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 2ns
Supplier Device Package: 48-SSOP
Produkt ist nicht verfügbar
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MPC567XKIT516-PT NXP USA Inc. Description: MPC567X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC567x
Produkt ist nicht verfügbar
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MPC860TCZQ50D4 MPC860TCZQ50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860DECZQ50D4 MPC860DECZQ50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860ENZQ50D4R2 MPC860ENZQ50D4R2 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MCIMX515DJM8CR2 MCIMX515DJM8CR2 NXP USA Inc. IMX51CEC.pdf Description: IC MPU I.MX51 800MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tape & Reel (TR)
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MCIMX515DJM8CR2 MCIMX515DJM8CR2 NXP USA Inc. IMX51CEC.pdf Description: IC MPU I.MX51 800MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Bulk
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MCIMX31LDVKN5D MCIMX31LDVKN5D NXP USA Inc. FSCLS05432-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX31 532MHZ 457LFBGA
Packaging: Bulk
Package / Case: 457-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 457-LFBGA (14x14)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
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FC32K146UAT0VLLR NXP USA Inc. Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FC32K146UAT0VLLT NXP USA Inc. Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
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MRF9060NR1 MRF9060NR1 NXP USA Inc. MRF9060NR1.pdf Description: RF MOSFET LDMOS 26V TO270-2
Current - Test: 450 mA
Voltage - Test: 26 V
Voltage - Rated: 65 V
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 18dB
Power - Output: 60W
Frequency: 945MHz
Mounting Type: Surface Mount
Package / Case: TO-270AA
Packaging: Tape & Reel (TR)
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MKE02Z16VLC2R MKE02Z16VLC2R NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tape & Reel (TR)
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MKE02Z16VLC2R MKE02Z16VLC2R NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Cut Tape (CT)
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MKE02Z16VLC4R MKE02Z16VLC4R NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 16KB FLASH 32LQFP
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Cut Tape (CT)
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MKL02Z8VFG4R NXP USA Inc. KL02P32M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 16QFN
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-QFN (3x3)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MKL02Z8VFG4R NXP USA Inc. KL02P32M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 16QFN
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-QFN (3x3)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-UFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.38 EUR
10+4.01 EUR
25+3.67 EUR
100+3.28 EUR
250+3.11 EUR
500+3 EUR
1000+2.92 EUR
2500+2.82 EUR
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MKL02Z32VFG4R MKL02Z32VFG4R NXP USA Inc. KL02P32M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
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MKL02Z32VFG4R MKL02Z32VFG4R NXP USA Inc. KL02P32M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
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4+6.06 EUR
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250+3.55 EUR
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MKL02Z32VFM4R MKL02Z32VFM4R NXP USA Inc. KL02P32M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MKL02Z32VFM4R MKL02Z32VFM4R NXP USA Inc. KL02P32M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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Lieferzeit 10-14 Tag (e)
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100+3.68 EUR
250+3.49 EUR
500+3.37 EUR
1000+3.27 EUR
2500+3.17 EUR
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MKE02Z32VLD2R MKE02Z32VLD2R NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
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MKE02Z32VLD2R MKE02Z32VLD2R NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.47 EUR
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250+4.43 EUR
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MKE02Z32VLD4R MKE02Z32VLD4R NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
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MKE02Z32VLD4R MKE02Z32VLD4R NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Cut Tape (CT)
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MKE15Z64VFP4R NXP USA Inc. KE1xZP48M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 40VFQFN
Number of I/O: 36
Supplier Device Package: 40-HVQFN (5x5)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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Lieferzeit 10-14 Tag (e)
3+7.56 EUR
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25+5.25 EUR
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MKE04Z128VQH4R MKE04Z128VQH4R NXP USA Inc. MKE04P80M48SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKE04Z128VQH4R MKE04Z128VQH4R NXP USA Inc. MKE04P80M48SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Cut Tape (CT)
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MRF1K50H-27MHZ NXP USA Inc. MRF1K50H.pdf Description: MRF1K50H-27MHZ
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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MRF1K50H-230MHZ NXP USA Inc. MRF1K50H.pdf Description: MRF1K50H-230MHZ
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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MRF8HP21130HSR3 MRF8HP21130HSR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: Dual
Power - Output: 28W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 360 mA
Produkt ist nicht verfügbar
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P5020NSE7TNB P5020NSE7TNB NXP USA Inc. P2P3P5APPBRF.pdf Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Additional Interfaces: DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 2.0GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MC33FS6504LAE MC33FS6504LAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 249 Stücke:
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S9S12GN16J1MLC S9S12GN16J1MLC NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 32LQFP
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: S12
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MCF5274LVF166 MCF5274LVF166 NXP USA Inc. MCF5275EC.pdf Description: IC MCU 32BIT ROMLESS 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 61
Supplier Device Package: 196-LBGA (15x15)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C
RAM Size: 64K x 8
Speed: 166MHz
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Packaging: Tray
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SPC5744BSK1AVKU2 SPC5744BSK1AVKU2 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
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S912XEG128BVAAR S912XEG128BVAAR NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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S912XEG128BVAA S912XEG128BVAA NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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FRDM-RW612 FRDM-RW612 NXP USA Inc. UM12160.pdf Description: EVAL BOARD FOR RW612
Packaging: Box
Frequency: 2.4GHz, 5GHz
Type: Transceiver; 802.11 a/b/g/n/ac/ax (Wi-Fi, WiFi, WLAN), 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Contents: Board(s), Cable(s)
Antenna Type: PCB Trace Antenna(s) On-Board
Utilized IC / Part: RW612
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74AUP2G34GF,132 74AUP2G34GF,132 NXP USA Inc. 74AUP2G34.pdf Description: IC BUFF DL LOW PWR N-INV 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
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MMA9550LR1 MMA9550LR1 NXP USA Inc. MMA955xL.pdf Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Bulk
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
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MMA6255AKEG MMA6255AKEG NXP USA Inc. MMA6222AKEG.pdf Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±50g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
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MC9328MX21SCVK MC9328MX21SCVK NXP USA Inc. MC9328MX21S.pdf Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
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MCZ33897TEF MCZ33897TEF NXP USA Inc. MC33897.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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PVR100AZ-B12V,115 PVR100AZ-B12V,115 NXP USA Inc. PVR100AZ-B_Series.pdf Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
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3000+0.23 EUR
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PVR100AZ-B2V5,115 PVR100AZ-B2V5,115 NXP USA Inc. PVR100AZ-B_Series.pdf Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
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PVR100AZ-B3V3,115 PVR100AZ-B3V3,115 NXP USA Inc. PVR100AZ-B_Series.pdf Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
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3000+0.23 EUR
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MC9RS08KB4CTG MC9RS08KB12.pdf
MC9RS08KB4CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9RS08KB12CFK MC9RS08KB12.pdf
MC9RS08KB12CFK
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 12KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN-EP (4x4)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9RS08KB8CTG MC9RS08KB12.pdf
MC9RS08KB8CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC852TZT50A MPC852T.pdf
MPC852TZT50A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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BZX884-C22,315 BZX884_BC_SER.pdf
BZX884-C22,315
Hersteller: NXP USA Inc.
Description: DIODE ZENER 22V 250MW SOD882
Packaging: Bulk
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PEMI2QFN/LM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/LM,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/16PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
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3806+0.15 EUR
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MKE04Z128VLH4R MKE04P80M48SF0.pdf
MKE04Z128VLH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE04Z128VLH4R MKE04P80M48SF0.pdf
MKE04Z128VLH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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3+9.4 EUR
10+6.12 EUR
25+6.08 EUR
100+6.05 EUR
250+5.75 EUR
500+5.3 EUR
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MCIMX6U1AVM10AD IMX6SDLAEC.pdf
MCIMX6U1AVM10AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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PDTA115TMB,315 PHGLS24957-1.pdf?t.download=true&u=5oefqw
PDTA115TMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 100 kOhms
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11225+0.06 EUR
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MKE02Z32VFM4R MKE02P64M40SF0.pdf
MKE02Z32VFM4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
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5000+3.28 EUR
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MKE02Z32VFM4R MKE02P64M40SF0.pdf
MKE02Z32VFM4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
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4+6.7 EUR
10+5.05 EUR
25+4.63 EUR
100+4.16 EUR
250+3.95 EUR
500+3.82 EUR
1000+3.71 EUR
2500+3.59 EUR
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MWCT20D2VLH WCT2xx2ADS.pdf
Hersteller: NXP USA Inc.
Description: MWCT20D2VLH
Packaging: Tray
Produkt ist nicht verfügbar
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MC56F81746LMLF MC56F81XXXL.pdf
MC56F81746LMLF
Hersteller: NXP USA Inc.
Description: MC56F81746LMLF
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
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74ABT16373BDL,112 74ABT16373B.pdf
74ABT16373BDL,112
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP 8:8 48-SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 2ns
Supplier Device Package: 48-SSOP
Produkt ist nicht verfügbar
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MPC567XKIT516-PT
Hersteller: NXP USA Inc.
Description: MPC567X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC567x
Produkt ist nicht verfügbar
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MPC860TCZQ50D4 MPC860EC.pdf
MPC860TCZQ50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860DECZQ50D4 MPC860EC.pdf
MPC860DECZQ50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860ENZQ50D4R2 MPC860EC.pdf
MPC860ENZQ50D4R2
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MCIMX515DJM8CR2 IMX51CEC.pdf
MCIMX515DJM8CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 800MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX515DJM8CR2 IMX51CEC.pdf
MCIMX515DJM8CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 800MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Bulk
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5+120.88 EUR
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MCIMX31LDVKN5D FSCLS05432-1.pdf?t.download=true&u=5oefqw
MCIMX31LDVKN5D
Hersteller: NXP USA Inc.
Description: IC MPU I.MX31 532MHZ 457LFBGA
Packaging: Bulk
Package / Case: 457-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 457-LFBGA (14x14)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
auf Bestellung 2019 Stücke:
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6+98.04 EUR
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FC32K146UAT0VLLR
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FC32K146UAT0VLLT
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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MRF9060NR1 MRF9060NR1.pdf
MRF9060NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V TO270-2
Current - Test: 450 mA
Voltage - Test: 26 V
Voltage - Rated: 65 V
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 18dB
Power - Output: 60W
Frequency: 945MHz
Mounting Type: Surface Mount
Package / Case: TO-270AA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKE02Z16VLC2R MKE02P64M20SF0.pdf
MKE02Z16VLC2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tape & Reel (TR)
auf Bestellung 2000 Stücke:
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2000+2.81 EUR
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MKE02Z16VLC2R MKE02P64M20SF0.pdf
MKE02Z16VLC2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Cut Tape (CT)
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4+5.34 EUR
10+3.97 EUR
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100+3.26 EUR
250+3.08 EUR
500+2.98 EUR
1000+2.88 EUR
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MKE02Z16VLC4R MKE02P64M40SF0.pdf
MKE02Z16VLC4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Cut Tape (CT)
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4+5.28 EUR
10+3.94 EUR
25+3.59 EUR
100+3.24 EUR
250+3.06 EUR
500+2.95 EUR
1000+2.87 EUR
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MKL02Z8VFG4R KL02P32M48SF0.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16QFN
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-QFN (3x3)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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5000+2.76 EUR
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MKL02Z8VFG4R KL02P32M48SF0.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16QFN
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-QFN (3x3)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-UFQFN Exposed Pad
Packaging: Cut Tape (CT)
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4+5.38 EUR
10+4.01 EUR
25+3.67 EUR
100+3.28 EUR
250+3.11 EUR
500+3 EUR
1000+2.92 EUR
2500+2.82 EUR
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MKL02Z32VFG4R KL02P32M48SF0.pdf
MKL02Z32VFG4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
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5000+3.19 EUR
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MKL02Z32VFG4R KL02P32M48SF0.pdf
MKL02Z32VFG4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
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4+6.06 EUR
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500+3.45 EUR
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MKL02Z32VFM4R KL02P32M48SF0.pdf
MKL02Z32VFM4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
auf Bestellung 5000 Stücke:
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5000+3.11 EUR
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MKL02Z32VFM4R KL02P32M48SF0.pdf
MKL02Z32VFM4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 5000 Stücke:
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4+5.93 EUR
10+4.46 EUR
25+4.08 EUR
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500+3.37 EUR
1000+3.27 EUR
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MKE02Z32VLD2R MKE02P64M20SF0.pdf
MKE02Z32VLD2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
auf Bestellung 1500 Stücke:
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1500+4.11 EUR
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MKE02Z32VLD2R MKE02P64M20SF0.pdf
MKE02Z32VLD2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 1500 Stücke:
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3+7.47 EUR
10+5.64 EUR
25+5.18 EUR
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250+4.43 EUR
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MKE02Z32VLD4R MKE02P64M40SF0.pdf
MKE02Z32VLD4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKE02Z32VLD4R MKE02P64M40SF0.pdf
MKE02Z32VLD4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 1498 Stücke:
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3+8.38 EUR
10+6.33 EUR
50+5.52 EUR
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MKE15Z64VFP4R KE1xZP48M48SF0.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 40VFQFN
Number of I/O: 36
Supplier Device Package: 40-HVQFN (5x5)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 5000 Stücke:
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3+7.56 EUR
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25+5.25 EUR
100+4.74 EUR
250+4.49 EUR
500+4.34 EUR
1000+4.22 EUR
2500+4.09 EUR
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MKE04Z128VQH4R MKE04P80M48SF0.pdf
MKE04Z128VQH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKE04Z128VQH4R MKE04P80M48SF0.pdf
MKE04Z128VQH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Cut Tape (CT)
auf Bestellung 456 Stücke:
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AnzahlPrivatkunde
3+9.34 EUR
10+6.08 EUR
25+6.05 EUR
100+6.01 EUR
250+5.71 EUR
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MRF1K50H-27MHZ MRF1K50H.pdf
Hersteller: NXP USA Inc.
Description: MRF1K50H-27MHZ
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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MRF1K50H-230MHZ MRF1K50H.pdf
Hersteller: NXP USA Inc.
Description: MRF1K50H-230MHZ
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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MRF8HP21130HSR3
MRF8HP21130HSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: Dual
Power - Output: 28W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 360 mA
Produkt ist nicht verfügbar
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P5020NSE7TNB P2P3P5APPBRF.pdf
P5020NSE7TNB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Additional Interfaces: DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 2.0GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MC33FS6504LAE FS6500-FS4500-ASILD.pdf
MC33FS6504LAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 249 Stücke:
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2+19.35 EUR
10+15.14 EUR
25+14.08 EUR
100+12.92 EUR
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S9S12GN16J1MLC
S9S12GN16J1MLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: S12
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MCF5274LVF166 MCF5275EC.pdf
MCF5274LVF166
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 61
Supplier Device Package: 196-LBGA (15x15)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C
RAM Size: 64K x 8
Speed: 166MHz
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5744BSK1AVKU2
SPC5744BSK1AVKU2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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S912XEG128BVAAR
S912XEG128BVAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG128BVAA
S912XEG128BVAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM-RW612 UM12160.pdf
FRDM-RW612
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR RW612
Packaging: Box
Frequency: 2.4GHz, 5GHz
Type: Transceiver; 802.11 a/b/g/n/ac/ax (Wi-Fi, WiFi, WLAN), 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Contents: Board(s), Cable(s)
Antenna Type: PCB Trace Antenna(s) On-Board
Utilized IC / Part: RW612
auf Bestellung 280 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+58.98 EUR
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74AUP2G34GF,132 74AUP2G34.pdf
74AUP2G34GF,132
Hersteller: NXP USA Inc.
Description: IC BUFF DL LOW PWR N-INV 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
auf Bestellung 73750 Stücke:
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AnzahlPrivatkunde
1845+0.32 EUR
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MMA9550LR1 MMA955xL.pdf
MMA9550LR1
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Bulk
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
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AnzahlPrivatkunde
94+5.75 EUR
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MMA6255AKEG MMA6222AKEG.pdf
MMA6255AKEG
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±50g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
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24+22.53 EUR
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MC9328MX21SCVK MC9328MX21S.pdf
MC9328MX21SCVK
Hersteller: NXP USA Inc.
Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
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MCZ33897TEF MC33897.pdf
MCZ33897TEF
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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PVR100AZ-B12V,115 PVR100AZ-B_Series.pdf
PVR100AZ-B12V,115
Hersteller: NXP USA Inc.
Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
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AnzahlPrivatkunde
3000+0.23 EUR
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PVR100AZ-B2V5,115 PVR100AZ-B_Series.pdf
PVR100AZ-B2V5,115
Hersteller: NXP USA Inc.
Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3000+0.23 EUR
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PVR100AZ-B3V3,115 PVR100AZ-B_Series.pdf
PVR100AZ-B3V3,115
Hersteller: NXP USA Inc.
Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3000+0.23 EUR
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