Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36402) > Seite 553 nach 607
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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MPC5534EVBE | NXP USA Inc. |
Description: MPC5534 EVAL BRDUtilized IC / Part: MPC5534 Core Processor: e200 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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N74F374D,602 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SONumber of Bits per Element: 8 Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF Supplier Device Package: 20-SO Clock Frequency: 165 MHz Trigger Type: Positive Edge Current - Output High, Low: 3mA, 24mA Current - Quiescent (Iq): 86 mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Type: D-Type Function: Standard Number of Elements: 1 Mounting Type: Surface Mount Output Type: Tri-State, Non-Inverted Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Tube |
auf Bestellung 3894 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9328MX1VM20 | NXP USA Inc. |
Description: IC MPU I.MX1 200MHZ 256MAPBGAAdditional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART Display & Interface Controllers: LCD, Touch Panel Graphics Acceleration: No RAM Controllers: SDRAM Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 1.x (1) Voltage - I/O: 1.8V, 3.0V Core Processor: ARM920T Operating Temperature: 0°C ~ 70°C (TA) Speed: 200MHz Mounting Type: Surface Mount Package / Case: 256-MAPBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NCX2200GW,125 | NXP USA Inc. |
Description: IC COMPARATOR 1 GEN PUR 5TSSOPPackaging: Tape & Reel (TR) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 1 Type: Standard (General Purpose) Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 5-TSSOP Propagation Delay (Max): 800ns Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA @ 5.5V CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NCX2200GW,125 | NXP USA Inc. |
Description: IC COMPARATOR 1 GEN PUR 5TSSOPPackaging: Cut Tape (CT) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 1 Type: Standard (General Purpose) Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 5-TSSOP Propagation Delay (Max): 800ns Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA @ 5.5V CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PCA9957HN-ARD | NXP USA Inc. |
Description: PCA9957 LED DRIVER SHIELDPackaging: Bulk Function: LED Driver Type: Power Management Contents: Board(s), Cable(s) Utilized IC / Part: PCA9957 Platform: Arduino |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MSC8157SAG1000A | NXP USA Inc. |
Description: IC DSP 6X 1GHZ SC3850 783FCBGAPackaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Type: SC3850 Six Core Operating Temperature: 0°C ~ 105°C (TJ) Non-Volatile Memory: ROM (96KB) On-Chip RAM: 6.375MB Voltage - I/O: 1.0V, 1.5V, 2.5V Voltage - Core: 1.00V Clock Rate: 1GHz Supplier Device Package: 783-FCPBGA (29x29) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S9S08RN60W1MLC | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 32LQFPDigiKey Programmable: Not Verified Number of I/O: 26 Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x12b Core Processor: S08 EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 60KB (60K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MGD3162AM551EKR2 | NXP USA Inc. |
Description: MGD3162AM551EKR2Qualification: AEC-Q100 Voltage - Output Supply: 12V ~ 25V Number of Channels: 1 Grade: Automotive Common Mode Transient Immunity (Min): 100V/ns Supplier Device Package: 32-SOIC Approval Agency: UL, VDE Voltage - Isolation: 8000Vrms Technology: Magnetic Coupling Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MGD3162AM551EKR2 | NXP USA Inc. |
Description: MGD3162AM551EKR2Qualification: AEC-Q100 Voltage - Output Supply: 12V ~ 25V Number of Channels: 1 Grade: Automotive Common Mode Transient Immunity (Min): 100V/ns Supplier Device Package: 32-SOIC Approval Agency: UL, VDE Voltage - Isolation: 8000Vrms Technology: Magnetic Coupling Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Packaging: Cut Tape (CT) |
auf Bestellung 1598 Stücke: Lieferzeit 10-14 Tag (e) |
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| NCK2911AHN/10200Y | NXP USA Inc. |
Description: NCK2911AHN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFMAJ04QJM | NXP USA Inc. |
Description: QORIVVA MPC5604B 208 PIN 1.0MM P Contents: Board(s) Type: Debugger For Use With/Related Products: MPC5604B Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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P1010NSE5KHA | NXP USA Inc. |
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGAPackaging: Tray Package / Case: 425-FBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 425-TEPBGA I (19x19) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox SATA: SATA 3Gbps (2) Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| LFVCALSRAM2 | NXP USA Inc. |
Description: 16 BIT 2MB VERTICAL CALIBRATION Packaging: Bulk For Use With/Related Products: MPC55xx, MPC5634M Accessory Type: Calibration Unit |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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K32W041Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33FS6525LAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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MAC7116VAG50 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 1MB (1M x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 32K x 8 Core Processor: ARM7® Data Converters: A/D 16x8/10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR Supplier Device Package: 144-LQFP (20x20) Number of I/O: 112 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| LS2084ACE7TTB | NXP USA Inc. |
Description: LAYERSCAPE 64-BIT ARM CORTEX-A72Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, PCIe, SPI SATA: SATA 6Gbps (2) Security Features: Secure Boot, TrustZone® Graphics Acceleration: No RAM Controllers: DDR4, SDRAM Number of Cores/Bus Width: 8 Core, 64-Bit USB: USB 3.0 + PHY (2) Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16) Supplier Device Package: 1292-BGA (37.5x37.5) Core Processor: ARM® Cortex®-A72 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.8GHz Mounting Type: Surface Mount Package / Case: 1292-BBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 21 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MPC8555EVTAJD | NXP USA Inc. |
Description: IC MPU MPC85XX 533MHZ 783FCPBGAPackaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 36 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPC8347EVRAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGAPackaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 36 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC68VZ328CVP | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 144MAPBGA Additional Interfaces: SPI, UART Display & Interface Controllers: LCD, Touch Panel Graphics Acceleration: No RAM Controllers: DRAM Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 144-MAPBGA (13x13) Voltage - I/O: 3.0V Core Processor: FLX68000 Operating Temperature: -40°C ~ 85°C (TA) Speed: 33MHz Mounting Type: Surface Mount Package / Case: 144-LBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC11U68JBD64K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 36K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 10x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 48 DigiKey Programmable: Not Verified |
auf Bestellung 949 Stücke: Lieferzeit 10-14 Tag (e) |
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| LFINTPM3QA | NXP USA Inc. |
Description: 176 PIN 0.5MM EQFP TO 208 1.0MM Packaging: Bulk Module/Board Type: Socket Module - PGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFK46RINTPM3QA | NXP USA Inc. |
Description: QORIVVA MPC5746R ON A 176 PIN 0. Packaging: Bulk For Use With/Related Products: MPC5746R Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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PM823UK/A0CZ | NXP USA Inc. |
Description: POWER MANAGEMENT IC, DUAL SYNCHRNumber of Outputs: 3 w/Sequencer: No w/Supervisor: No w/LED Driver: No Voltage/Current - Output 3: 1.8V, 525mA Voltage/Current - Output 2: 2.2V, 1.5A Voltage/Current - Output 1: 1.1V, 1.5A Supplier Device Package: 12-WLCSP (1.55x1.18) Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1) Frequency - Switching: 3MHz Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 12-XFBGA, WLCSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PM823UK/A0CZ | NXP USA Inc. |
Description: POWER MANAGEMENT IC, DUAL SYNCHRPackaging: Cut Tape (CT) Package / Case: 12-XFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 5.5V Frequency - Switching: 3MHz Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1) Supplier Device Package: 12-WLCSP (1.55x1.18) Voltage/Current - Output 1: 1.1V, 1.5A Voltage/Current - Output 2: 2.2V, 1.5A Voltage/Current - Output 3: 1.8V, 525mA w/LED Driver: No w/Supervisor: No w/Sequencer: No Number of Outputs: 3 |
auf Bestellung 728 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN3222EUKZ | NXP USA Inc. |
Description: USB INTERFACE IC PTN3222EUKPackaging: Cut Tape (CT) Package / Case: 12-XFBGA, WLCSP Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 55mA (Max) Data Rate (Max): 480Mbps Supplier Device Package: 12-WLCSP (1.55x1.18) Signal Conditioning: Input Equalization, Output De-Emphasis Capacitance - Input: 10 pF |
auf Bestellung 7719 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN3222DUKZ | NXP USA Inc. |
Description: PTN3222DUKZPackaging: Tape & Reel (TR) Package / Case: 12-XFBGA, WLCSP Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 11mA (Max) Data Rate (Max): 480Mbps Supplier Device Package: 12-WLCSP (1.55x1.18) Signal Conditioning: Input Equalization, Output De-Emphasis Capacitance - Input: 10 pF |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 8000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PTN3222DUKZ | NXP USA Inc. |
Description: PTN3222DUKZPackaging: Cut Tape (CT) Package / Case: 12-XFBGA, WLCSP Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 11mA (Max) Data Rate (Max): 480Mbps Supplier Device Package: 12-WLCSP (1.55x1.18) Signal Conditioning: Input Equalization, Output De-Emphasis Capacitance - Input: 10 pF |
auf Bestellung 7990 Stücke: Lieferzeit 10-14 Tag (e) |
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PCMF1USB30Z | NXP USA Inc. |
Description: CMC 2LN SMD ESDFeatures: TVS Diode ESD Protection Packaging: Bulk Package / Case: 5-UFBGA, WLCSP Filter Type: Signal Line Size / Dimension: 0.046" L x 0.030" W (1.17mm x 0.77mm) Mounting Type: Surface Mount Number of Lines: 2 Operating Temperature: -40°C ~ 85°C Height (Max): 0.024" (0.60mm) DC Resistance (DCR) (Max): 3Ohm (Typ) |
auf Bestellung 53203 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8358EVVAGDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 740TBGAPackaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC54101J256BD64QL | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 111 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54101J512BD64QL | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMXRT533SFAWCR | NXP USA Inc. |
Description: IC MCU 32BIT 192KB ROM 141WLCSPPackaging: Tape & Reel (TR) Package / Case: 141-XFBGA, WLCSP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 192KB (192K x 8) RAM Size: 3M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 141-WLCSP (4.53x4.53) Number of I/O: 136 DigiKey Programmable: Not Verified |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT533SFAWCR | NXP USA Inc. |
Description: IC MCU 32BIT 192KB ROM 141WLCSPPackaging: Cut Tape (CT) Package / Case: 141-XFBGA, WLCSP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 192KB (192K x 8) RAM Size: 3M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 141-WLCSP (4.53x4.53) Number of I/O: 136 DigiKey Programmable: Not Verified |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF8S9100HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 920MHz Power - Output: 72W Gain: 19.3dB Technology: LDMOS Supplier Device Package: NI-780S Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 500 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PCA9646PW,118 | NXP USA Inc. |
Description: IC BUS SWITCH BUFF 4CH 16TSSOPPackaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Delay Time: 100ns Number of Channels: 4 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: I2C Current - Supply: 1µA Data Rate (Max): 1MHz Supplier Device Package: 16-TSSOP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PCA9646PW,118 | NXP USA Inc. |
Description: IC BUS SWITCH BUFF 4CH 16TSSOPPackaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Delay Time: 100ns Number of Channels: 4 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: I2C Current - Supply: 1µA Data Rate (Max): 1MHz Supplier Device Package: 16-TSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| S912ZVL64AMLF | NXP USA Inc. |
Description: S12Z CPU, 64K FLASHPackaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| A5M36SG239T2 | NXP USA Inc. |
Description: A5M36SG239T2Packaging: Bulk Package / Case: 34-LLGA Exposed Pad Module Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.8GHz RF Type: 5G, LTE, TDD Voltage - Supply: 4.75V ~ 5.25V Gain: 31.7dB Current - Supply: 35mA ~ 38mA Test Frequency: 3.8GHz Supplier Device Package: 30-PLGA (12x8) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
|
LPC5514JEV59E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 59BGAPackaging: Tray Package / Case: 59-VFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 59-VFBGA (4x4) Number of I/O: 37 |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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MPF5030BMBA0ES | NXP USA Inc. |
Description: PMIC 3 BUCKS 2 LDO A1 DIEPackaging: Tray Package / Case: 40-PowerVFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.3V ~ 5.25V Applications: System Basis Chip Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 243 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF8S18120HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.81GHz Power - Output: 72W Gain: 18.2dB Technology: LDMOS Supplier Device Package: NI-780S Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 800 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| S32K388CVB-Q289 | NXP USA Inc. |
Description: S32K388CVB-Q289Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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T1023NSE7PQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGAPackaging: Bulk Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 525-FCPBGA (19x19) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
auf Bestellung 89 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF7772EL/200Z10AY | NXP USA Inc. |
Description: AUDIO DSPS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
|
T1024NXN7MQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.2GHZ 780FBGAPackaging: Tray Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| T1023NSN7PQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGAPackaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 525-FCPBGA (19x19) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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T1013NSE7PQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGAPackaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 525-FCPBGA (19x19) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| T1014NXN7PQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.4GHZ 780FBGAPackaging: Tray Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
|
T1024NXN7PQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.4GHZ 780FBGAPackaging: Tray Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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T1014NXN7KQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1GHZ 780FBGAAdditional Interfaces: I2C, MMC/SD, PCIe, SPI, UART SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Graphics Acceleration: No RAM Controllers: DDR3L, DDR4 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 + PHY (2) Ethernet: GbE (8) Supplier Device Package: 780-FBGA (23x23) Core Processor: PowerPC e5500 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1GHz Mounting Type: Surface Mount Package / Case: 780-FBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
T1020NSE7PQB | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGAAdditional Interfaces: I2C, MMC/SD, PCIe, SPI, UART SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Graphics Acceleration: No RAM Controllers: DDR3L/4 Number of Cores/Bus Width: 2 Core, 64-Bit USB: USB 2.0 + PHY (2) Ethernet: 1Gbps (12) Supplier Device Package: 780-FCPBGA (23x23) Core Processor: PowerPC e5500 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.4GHz Mounting Type: Surface Mount Package / Case: 780-FBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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T1022NXE7PQB | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGAAdditional Interfaces: I2C, MMC/SD, PCIe, SPI, UART SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Graphics Acceleration: No RAM Controllers: DDR3L, DDR4 Number of Cores/Bus Width: 2 Core, 64-Bit USB: USB 2.0 + PHY (2) Ethernet: 1Gbps (5) Supplier Device Package: 780-FCPBGA (23x23) Core Processor: PowerPC e5500 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.4GHz Mounting Type: Surface Mount Package / Case: 780-FBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| KMI86/WHP | NXP USA Inc. |
Description: KMI86 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| KMI86/PHP | NXP USA Inc. |
Description: KMI86 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| KMI86/P | NXP USA Inc. |
Description: MAG SWITCH ANGULAR SENS SOT1291 Packaging: Tape & Reel (TR) Mounting Type: Through Hole |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
|
S912ZVCA19AMLF | NXP USA Inc. |
Description: IC MCU 16BIT 192KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 192KB (192K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x12b SAR; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
S912ZVC96AMLF | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| TEA8918BAT/2Y | NXP USA Inc. |
Description: POWER MANAGEMENT SPECIALIZEDPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH |
| MPC5534EVBE |
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Hersteller: NXP USA Inc.
Description: MPC5534 EVAL BRD
Utilized IC / Part: MPC5534
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: MPC5534 EVAL BRD
Utilized IC / Part: MPC5534
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| N74F374D,602 |
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Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Supplier Device Package: 20-SO
Clock Frequency: 165 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 3mA, 24mA
Current - Quiescent (Iq): 86 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Description: IC FF D-TYPE SNGL 8BIT 20SO
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Supplier Device Package: 20-SO
Clock Frequency: 165 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 3mA, 24mA
Current - Quiescent (Iq): 86 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
auf Bestellung 3894 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1902+ | 0.27 EUR |
| MC9328MX1VM20 |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX1 200MHZ 256MAPBGA
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 3.0V
Core Processor: ARM920T
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 256-MAPBGA
Packaging: Tray
Description: IC MPU I.MX1 200MHZ 256MAPBGA
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 3.0V
Core Processor: ARM920T
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 256-MAPBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NCX2200GW,125 |
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Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NCX2200GW,125 |
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Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9957HN-ARD |
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Hersteller: NXP USA Inc.
Description: PCA9957 LED DRIVER SHIELD
Packaging: Bulk
Function: LED Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PCA9957
Platform: Arduino
Description: PCA9957 LED DRIVER SHIELD
Packaging: Bulk
Function: LED Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PCA9957
Platform: Arduino
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 222.83 EUR |
| MSC8157SAG1000A |
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Hersteller: NXP USA Inc.
Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Six Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 6.375MB
Voltage - I/O: 1.0V, 1.5V, 2.5V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Six Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 6.375MB
Voltage - I/O: 1.0V, 1.5V, 2.5V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S08RN60W1MLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 8BIT 60KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MGD3162AM551EKR2 |
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Hersteller: NXP USA Inc.
Description: MGD3162AM551EKR2
Qualification: AEC-Q100
Voltage - Output Supply: 12V ~ 25V
Number of Channels: 1
Grade: Automotive
Common Mode Transient Immunity (Min): 100V/ns
Supplier Device Package: 32-SOIC
Approval Agency: UL, VDE
Voltage - Isolation: 8000Vrms
Technology: Magnetic Coupling
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: MGD3162AM551EKR2
Qualification: AEC-Q100
Voltage - Output Supply: 12V ~ 25V
Number of Channels: 1
Grade: Automotive
Common Mode Transient Immunity (Min): 100V/ns
Supplier Device Package: 32-SOIC
Approval Agency: UL, VDE
Voltage - Isolation: 8000Vrms
Technology: Magnetic Coupling
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1000+ | 10.28 EUR |
| MGD3162AM551EKR2 |
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Hersteller: NXP USA Inc.
Description: MGD3162AM551EKR2
Qualification: AEC-Q100
Voltage - Output Supply: 12V ~ 25V
Number of Channels: 1
Grade: Automotive
Common Mode Transient Immunity (Min): 100V/ns
Supplier Device Package: 32-SOIC
Approval Agency: UL, VDE
Voltage - Isolation: 8000Vrms
Technology: Magnetic Coupling
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
Description: MGD3162AM551EKR2
Qualification: AEC-Q100
Voltage - Output Supply: 12V ~ 25V
Number of Channels: 1
Grade: Automotive
Common Mode Transient Immunity (Min): 100V/ns
Supplier Device Package: 32-SOIC
Approval Agency: UL, VDE
Voltage - Isolation: 8000Vrms
Technology: Magnetic Coupling
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 1598 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 16.86 EUR |
| 10+ | 13.21 EUR |
| 25+ | 12.3 EUR |
| 100+ | 11.29 EUR |
| 250+ | 10.81 EUR |
| 500+ | 10.52 EUR |
| NCK2911AHN/10200Y |
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LFMAJ04QJM |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5604B 208 PIN 1.0MM P
Contents: Board(s)
Type: Debugger
For Use With/Related Products: MPC5604B
Packaging: Bulk
Description: QORIVVA MPC5604B 208 PIN 1.0MM P
Contents: Board(s)
Type: Debugger
For Use With/Related Products: MPC5604B
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P1010NSE5KHA |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVCALSRAM2 |
Hersteller: NXP USA Inc.
Description: 16 BIT 2MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC55xx, MPC5634M
Accessory Type: Calibration Unit
Description: 16 BIT 2MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC55xx, MPC5634M
Accessory Type: Calibration Unit
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| K32W041Y |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 11.7 EUR |
| 10+ | 10.14 EUR |
| 25+ | 9.6 EUR |
| 100+ | 8.86 EUR |
| 250+ | 8.41 EUR |
| 500+ | 8.09 EUR |
| 1000+ | 7.8 EUR |
| MC33FS6525LAE |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 13.59 EUR |
| 10+ | 10.54 EUR |
| 25+ | 9.78 EUR |
| 100+ | 8.95 EUR |
| 250+ | 8.55 EUR |
| MAC7116VAG50 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM7®
Data Converters: A/D 16x8/10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM7®
Data Converters: A/D 16x8/10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LS2084ACE7TTB |
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Hersteller: NXP USA Inc.
Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
SATA: SATA 6Gbps (2)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
Supplier Device Package: 1292-BGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 1292-BBGA
Packaging: Tray
Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
SATA: SATA 6Gbps (2)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
Supplier Device Package: 1292-BGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 1292-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 21 Stücke
Im Einkaufswagen
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| MPC8555EVTAJD |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8347EVRAGDB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
Im Einkaufswagen
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| MC68VZ328CVP |
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144MAPBGA
Additional Interfaces: SPI, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 144-MAPBGA (13x13)
Voltage - I/O: 3.0V
Core Processor: FLX68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
Description: IC MPU M683XX 33MHZ 144MAPBGA
Additional Interfaces: SPI, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 144-MAPBGA (13x13)
Voltage - I/O: 3.0V
Core Processor: FLX68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11U68JBD64K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
auf Bestellung 949 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 9.87 EUR |
| 10+ | 5.49 EUR |
| 25+ | 5.48 EUR |
| 100+ | 5.46 EUR |
| LFINTPM3QA |
Hersteller: NXP USA Inc.
Description: 176 PIN 0.5MM EQFP TO 208 1.0MM
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Description: 176 PIN 0.5MM EQFP TO 208 1.0MM
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFK46RINTPM3QA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5746R ON A 176 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746R
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5746R ON A 176 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746R
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PM823UK/A0CZ |
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Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, DUAL SYNCHR
Number of Outputs: 3
w/Sequencer: No
w/Supervisor: No
w/LED Driver: No
Voltage/Current - Output 3: 1.8V, 525mA
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 1: 1.1V, 1.5A
Supplier Device Package: 12-WLCSP (1.55x1.18)
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Frequency - Switching: 3MHz
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 12-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Description: POWER MANAGEMENT IC, DUAL SYNCHR
Number of Outputs: 3
w/Sequencer: No
w/Supervisor: No
w/LED Driver: No
Voltage/Current - Output 3: 1.8V, 525mA
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 1: 1.1V, 1.5A
Supplier Device Package: 12-WLCSP (1.55x1.18)
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Frequency - Switching: 3MHz
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 12-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PM823UK/A0CZ |
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Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, DUAL SYNCHR
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 3MHz
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Supplier Device Package: 12-WLCSP (1.55x1.18)
Voltage/Current - Output 1: 1.1V, 1.5A
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 3: 1.8V, 525mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 3
Description: POWER MANAGEMENT IC, DUAL SYNCHR
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 3MHz
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Supplier Device Package: 12-WLCSP (1.55x1.18)
Voltage/Current - Output 1: 1.1V, 1.5A
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 3: 1.8V, 525mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 3
auf Bestellung 728 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 7+ | 2.78 EUR |
| 10+ | 2.04 EUR |
| 25+ | 1.86 EUR |
| 100+ | 1.65 EUR |
| 250+ | 1.55 EUR |
| 500+ | 1.49 EUR |
| PTN3222EUKZ |
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Hersteller: NXP USA Inc.
Description: USB INTERFACE IC PTN3222EUK
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Description: USB INTERFACE IC PTN3222EUK
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
auf Bestellung 7719 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 7+ | 2.76 EUR |
| 10+ | 2.03 EUR |
| 25+ | 1.85 EUR |
| 100+ | 1.65 EUR |
| 250+ | 1.55 EUR |
| 500+ | 1.53 EUR |
| PTN3222DUKZ |
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Hersteller: NXP USA Inc.
Description: PTN3222DUKZ
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 11mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Description: PTN3222DUKZ
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 11mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
Mindestbestellmenge: 8000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PTN3222DUKZ |
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Hersteller: NXP USA Inc.
Description: PTN3222DUKZ
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 11mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Description: PTN3222DUKZ
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 11mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
auf Bestellung 7990 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 7+ | 2.78 EUR |
| 10+ | 2.04 EUR |
| 25+ | 1.86 EUR |
| 100+ | 1.65 EUR |
| 250+ | 1.56 EUR |
| 500+ | 1.54 EUR |
| PCMF1USB30Z |
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Hersteller: NXP USA Inc.
Description: CMC 2LN SMD ESD
Features: TVS Diode ESD Protection
Packaging: Bulk
Package / Case: 5-UFBGA, WLCSP
Filter Type: Signal Line
Size / Dimension: 0.046" L x 0.030" W (1.17mm x 0.77mm)
Mounting Type: Surface Mount
Number of Lines: 2
Operating Temperature: -40°C ~ 85°C
Height (Max): 0.024" (0.60mm)
DC Resistance (DCR) (Max): 3Ohm (Typ)
Description: CMC 2LN SMD ESD
Features: TVS Diode ESD Protection
Packaging: Bulk
Package / Case: 5-UFBGA, WLCSP
Filter Type: Signal Line
Size / Dimension: 0.046" L x 0.030" W (1.17mm x 0.77mm)
Mounting Type: Surface Mount
Number of Lines: 2
Operating Temperature: -40°C ~ 85°C
Height (Max): 0.024" (0.60mm)
DC Resistance (DCR) (Max): 3Ohm (Typ)
auf Bestellung 53203 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1998+ | 0.25 EUR |
| MPC8358EVVAGDGA |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC54101J256BD64QL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 111 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 11.99 EUR |
| 10+ | 9.31 EUR |
| 25+ | 8.65 EUR |
| LPC54101J512BD64QL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| MIMXRT533SFAWCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 3M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 3M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6000+ | 19.53 EUR |
| MIMXRT533SFAWCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Cut Tape (CT)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 3M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Cut Tape (CT)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 3M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 33.16 EUR |
| 10+ | 26.45 EUR |
| 25+ | 24.77 EUR |
| 100+ | 22.93 EUR |
| 250+ | 22.05 EUR |
| 500+ | 21.52 EUR |
| MRF8S9100HSR3 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 920MHz
Power - Output: 72W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 920MHz
Power - Output: 72W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9646PW,118 |
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Hersteller: NXP USA Inc.
Description: IC BUS SWITCH BUFF 4CH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-TSSOP
Description: IC BUS SWITCH BUFF 4CH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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Stück im Wert von UAH
| PCA9646PW,118 |
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Hersteller: NXP USA Inc.
Description: IC BUS SWITCH BUFF 4CH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-TSSOP
Description: IC BUS SWITCH BUFF 4CH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
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| A5M36SG239T2 |
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Hersteller: NXP USA Inc.
Description: A5M36SG239T2
Packaging: Bulk
Package / Case: 34-LLGA Exposed Pad Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.7dB
Current - Supply: 35mA ~ 38mA
Test Frequency: 3.8GHz
Supplier Device Package: 30-PLGA (12x8)
Description: A5M36SG239T2
Packaging: Bulk
Package / Case: 34-LLGA Exposed Pad Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.7dB
Current - Supply: 35mA ~ 38mA
Test Frequency: 3.8GHz
Supplier Device Package: 30-PLGA (12x8)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| LPC5514JEV59E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 59BGA
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
Description: IC MCU 32BIT 128KB FLASH 59BGA
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 8.89 EUR |
| 10+ | 6.8 EUR |
| 25+ | 6.28 EUR |
| 100+ | 5.71 EUR |
| 490+ | 5.27 EUR |
| MPF5030BMBA0ES |
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Hersteller: NXP USA Inc.
Description: PMIC 3 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: PMIC 3 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 243 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 12.16 EUR |
| 10+ | 9.4 EUR |
| 25+ | 8.71 EUR |
| 100+ | 7.96 EUR |
| MRF8S18120HSR3 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Power - Output: 72W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Power - Output: 72W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| T1023NSE7PQA |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Bulk
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Bulk
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 212.15 EUR |
| SAF7772EL/200Z10AY |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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Stück im Wert von UAH
| T1024NXN7MQA |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| T1023NSN7PQA |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
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| T1013NSE7PQA |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
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| T1014NXN7PQA |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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| T1024NXN7PQA |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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| T1014NXN7KQA |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: GbE (8)
Supplier Device Package: 780-FBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA
Packaging: Tray
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: GbE (8)
Supplier Device Package: 780-FBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| T1020NSE7PQB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L/4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (12)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L/4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (12)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| T1022NXE7PQB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| KMI86/WHP |
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| KMI86/PHP |
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| KMI86/P |
Hersteller: NXP USA Inc.
Description: MAG SWITCH ANGULAR SENS SOT1291
Packaging: Tape & Reel (TR)
Mounting Type: Through Hole
Description: MAG SWITCH ANGULAR SENS SOT1291
Packaging: Tape & Reel (TR)
Mounting Type: Through Hole
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVCA19AMLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| S912ZVC96AMLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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| TEA8918BAT/2Y |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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