Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36597) > Seite 551 nach 610
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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| A3G23H500W17SR3 | NXP USA Inc. |
Description: RF MOSFET GAN 48V NI780 Current - Test: 300 mA Voltage - Test: 48 V Voltage - Rated: 125 V Supplier Device Package: NI-780-4S2S Technology: GaN Gain: 14.3dB Power - Output: 80W Configuration: 2 N-Channel Frequency: 2.3GHz ~ 2.4GHz Mounting Type: Chassis Mount Package / Case: NI-780-4S2S Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MGD3160AM315EKT | NXP USA Inc. |
 Description: IC GATE DRVR HIGH-SIDE 32SOICQualification: AEC-Q100 Grade: Automotive Current - Peak Output (Source, Sink): 15A, 15A Gate Type: IGBT, SiC MOSFET Number of Drivers: 1 Driven Configuration: High-Side Channel Type: Single Supplier Device Package: 32-SOIC Input Type: Non-Inverting Voltage - Supply: 4.5V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Packaging: Tray |
auf Bestellung 176 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT273PW,118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP Number of Bits per Element: 8 Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF Supplier Device Package: 20-TSSOP Input Capacitance: 4 pF Clock Frequency: 150 MHz Trigger Type: Positive Edge Current - Output High, Low: 32mA, 64mA Current - Quiescent (Iq): 190 µA Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Type: D-Type Function: Master Reset Number of Elements: 1 Mounting Type: Surface Mount Output Type: Non-Inverted Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Bulk |
auf Bestellung 22500 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT574PW,118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP Number of Bits per Element: 8 Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF Supplier Device Package: 20-TSSOP Input Capacitance: 4 pF Clock Frequency: 150 MHz Trigger Type: Positive Edge Current - Output High, Low: 32mA, 64mA Current - Quiescent (Iq): 190 µA Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Type: D-Type Function: Standard Number of Elements: 1 Mounting Type: Surface Mount Output Type: Tri-State, Non-Inverted Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Bulk |
auf Bestellung 7640 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF775DHN/N208WBMP | NXP USA Inc. |
Description: CAR DISP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MIMXRT1061CVJ5BR | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 196LFBGA Packaging: Cut Tape (CT) Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-LFBGA (12x12) Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 918 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1061XVN5B | NXP USA Inc. |
Description: IC MCU 32BIT 128KB ROM 225MAPBGA Packaging: Tray Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 500MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 225-MAPBGA (13x13) Number of I/O: 149 DigiKey Programmable: Not Verified |
auf Bestellung 1300 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT106FDVL6A | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196LFBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Number of I/O: 127 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MIMXRT105SCVL5B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 184 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT106CDVL6A | NXP USA Inc. |
Description: I.MXRT106C 196MAPBGA Packaging: Tray |
Produkt ist nicht verfügbar |
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A2V09H400-04NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V OM780-4 Current - Test: 688 mA Voltage - Test: 48 V Voltage - Rated: 105 V Supplier Device Package: OM-780-4L Technology: LDMOS Gain: 17.9dB Power - Output: 107W Frequency: 720MHz ~ 960MHz Mounting Type: Surface Mount Current Rating (Amps): 10µA Package / Case: OM-780-4L Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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A2V09H400-04NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V OM780-4 Current - Test: 688 mA Voltage - Test: 48 V Voltage - Rated: 105 V Supplier Device Package: OM-780-4L Technology: LDMOS Gain: 17.9dB Power - Output: 107W Frequency: 720MHz ~ 960MHz Mounting Type: Surface Mount Current Rating (Amps): 10µA Package / Case: OM-780-4L Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPC18730EP | NXP USA Inc. |
Description: IC PMIC PROGR 5-OUTPUTS 64-QFN Supplier Device Package: 64-QFN (9x9) Current - Supply: 9mA Applications: Handheld/Mobile Devices Voltage - Supply: 0.9V ~ 4.2V Operating Temperature: -10°C ~ 65°C Mounting Type: Surface Mount Package / Case: 64-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
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MC9S08AW32MFGE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44LQFP DigiKey Programmable: Not Verified Number of I/O: 34 Supplier Device Package: 44-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Program Memory Size: 32KB (32K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 44-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX6G3DVM05AA | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 152 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LD6806TD/29P,125 | NXP USA Inc. |
Description: IC REG LINEAR 2.9V 200MA 5TSOP Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 2.9V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 36000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6806TD/14P,125 | NXP USA Inc. |
Description: IC REG LINEAR 1.4V 200MA 5TSOP Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 1.4V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 33000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6806TD/20P,125 | NXP USA Inc. |
Description: IC REG LINEAR 2V 200MA 5TSOP Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 2V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 24000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6806TD/30P,125 | NXP USA Inc. |
Description: IC REG LINEAR 3V 200MA 5TSOP Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 3V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 24000 Stücke: Lieferzeit 10-14 Tag (e) |
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KITFS23BUCKEVM | NXP USA Inc. |
Description: EVAL BOARD FOR FS2320 Embedded: Yes, MCU, 32-Bit Utilized IC / Part: FS2320 Contents: Board(s) Type: Interface Function: System Basis Chip (SBC) Packaging: Bulk |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF51AG128CLF | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 39 Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, LVD, PWM, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 12x12b Core Processor: Coldfire V1 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MF3DH23C0DA4/00J | NXP USA Inc. |
Description: MF3DH23C0DA4 Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: PLLMC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 17500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MCF51MM256VLL | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 8x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 65 DigiKey Programmable: Not Verified |
auf Bestellung 397 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9328MX21CVK | NXP USA Inc. |
Description: IC MPU I.MX21 266MHZ 289LFBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.0V Supplier Device Package: 289-LFBGA (14x14) USB: USB 1.x (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART |
Produkt ist nicht verfügbar |
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MC9328MX21CVK | NXP USA Inc. |
Description: MICROPROCESSOR, 32-BIT, 266MHZ, Packaging: Bulk Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3V Supplier Device Package: 289-PBGA (14x14) USB: USB OTG (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART |
auf Bestellung 461 Stücke: Lieferzeit 10-14 Tag (e) |
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2PB1219AQ,115 | NXP USA Inc. |
Description: TRANS PNP 50V 0.5A SOT-323 Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 150mA, 10V Frequency - Transition: 100MHz Supplier Device Package: SOT-323 Grade: Automotive Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 200 mW Qualification: AEC-Q101 |
auf Bestellung 86190 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC5534EVBE | NXP USA Inc. |
Description: MPC5534 EVAL BRD Utilized IC / Part: MPC5534 Core Processor: e200 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
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N74F374D,602 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SO Number of Bits per Element: 8 Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF Supplier Device Package: 20-SO Clock Frequency: 165 MHz Trigger Type: Positive Edge Current - Output High, Low: 3mA, 24mA Current - Quiescent (Iq): 86 mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Type: D-Type Function: Standard Number of Elements: 1 Mounting Type: Surface Mount Output Type: Tri-State, Non-Inverted Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Tube |
auf Bestellung 3894 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9328MX1VM20 | NXP USA Inc. |
Description: IC MPU I.MX1 200MHZ 256MAPBGA Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART Display & Interface Controllers: LCD, Touch Panel Graphics Acceleration: No RAM Controllers: SDRAM Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 1.x (1) Voltage - I/O: 1.8V, 3.0V Core Processor: ARM920T Operating Temperature: 0°C ~ 70°C (TA) Speed: 200MHz Mounting Type: Surface Mount Package / Case: 256-MAPBGA Packaging: Tray |
Produkt ist nicht verfügbar |
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NCX2200GW,125 | NXP USA Inc. |
Description: IC COMPARATOR 1 GEN PUR 5TSSOP Packaging: Tape & Reel (TR) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 1 Type: Standard (General Purpose) Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 5-TSSOP Propagation Delay (Max): 800ns Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA @ 5.5V CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NCX2200GW,125 | NXP USA Inc. |
Description: IC COMPARATOR 1 GEN PUR 5TSSOP Packaging: Cut Tape (CT) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 1 Type: Standard (General Purpose) Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 5-TSSOP Propagation Delay (Max): 800ns Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA @ 5.5V CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV |
Produkt ist nicht verfügbar |
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| PCA9957HN-ARD | NXP USA Inc. |
Description: PCA9957 LED DRIVER SHIELD Packaging: Bulk Function: LED Driver Type: Power Management Contents: Board(s), Cable(s) Utilized IC / Part: PCA9957 Platform: Arduino |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MSC8157SAG1000A | NXP USA Inc. |
Description: IC DSP 6X 1GHZ SC3850 783FCBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Type: SC3850 Six Core Operating Temperature: 0°C ~ 105°C (TJ) Non-Volatile Memory: ROM (96KB) On-Chip RAM: 6.375MB Voltage - I/O: 1.0V, 1.5V, 2.5V Voltage - Core: 1.00V Clock Rate: 1GHz Supplier Device Package: 783-FCPBGA (29x29) |
Produkt ist nicht verfügbar |
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S9S08RN60W1MLC | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 32LQFP DigiKey Programmable: Not Verified Number of I/O: 26 Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x12b Core Processor: S08 EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 60KB (60K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MGD3162AM551EKR2 | NXP USA Inc. |
Description: MGD3162AM551EKR2 Qualification: AEC-Q100 Voltage - Output Supply: 12V ~ 25V Number of Channels: 1 Grade: Automotive Common Mode Transient Immunity (Min): 100V/ns Supplier Device Package: 32-SOIC Approval Agency: UL, VDE Voltage - Isolation: 8000Vrms Technology: Magnetic Coupling Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MGD3162AM551EKR2 | NXP USA Inc. |
Description: MGD3162AM551EKR2 Qualification: AEC-Q100 Voltage - Output Supply: 12V ~ 25V Number of Channels: 1 Grade: Automotive Common Mode Transient Immunity (Min): 100V/ns Supplier Device Package: 32-SOIC Approval Agency: UL, VDE Voltage - Isolation: 8000Vrms Technology: Magnetic Coupling Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Packaging: Cut Tape (CT) |
auf Bestellung 1598 Stücke: Lieferzeit 10-14 Tag (e) |
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| NCK2911AHN/10200Y | NXP USA Inc. |
Description: NCK2911AHN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFMAJ04QJM | NXP USA Inc. |
Description: QORIVVA MPC5604B 208 PIN 1.0MM P Contents: Board(s) Type: Debugger For Use With/Related Products: MPC5604B Packaging: Bulk |
Produkt ist nicht verfügbar |
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P1010NSE5KHA | NXP USA Inc. |
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA Packaging: Tray Package / Case: 425-FBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 425-TEPBGA I (19x19) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox SATA: SATA 3Gbps (2) Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| LFVCALSRAM2 | NXP USA Inc. |
Description: 16 BIT 2MB VERTICAL CALIBRATION Packaging: Bulk For Use With/Related Products: MPC55xx, MPC5634M Accessory Type: Calibration Unit |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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K32W041Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33FS6525LAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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MAC7116VAG50 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 1MB (1M x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 32K x 8 Core Processor: ARM7® Data Converters: A/D 16x8/10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR Supplier Device Package: 144-LQFP (20x20) Number of I/O: 112 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| LS2084ACE7TTB | NXP USA Inc. |
Description: LAYERSCAPE 64-BIT ARM CORTEX-A72 Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, PCIe, SPI SATA: SATA 6Gbps (2) Security Features: Secure Boot, TrustZone® Graphics Acceleration: No RAM Controllers: DDR4, SDRAM Number of Cores/Bus Width: 8 Core, 64-Bit USB: USB 3.0 + PHY (2) Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16) Supplier Device Package: 1292-BGA (37.5x37.5) Core Processor: ARM® Cortex®-A72 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.8GHz Mounting Type: Surface Mount Package / Case: 1292-BBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 21 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MPC8555EVTAJD | NXP USA Inc. |
Description: IC MPU MPC85XX 533MHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 36 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPC8347EVRAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 36 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC68VZ328CVP | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 144MAPBGA Additional Interfaces: SPI, UART Display & Interface Controllers: LCD, Touch Panel Graphics Acceleration: No RAM Controllers: DRAM Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 144-MAPBGA (13x13) Voltage - I/O: 3.0V Core Processor: FLX68000 Operating Temperature: -40°C ~ 85°C (TA) Speed: 33MHz Mounting Type: Surface Mount Package / Case: 144-LBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC11U68JBD64K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 36K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 10x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 48 DigiKey Programmable: Not Verified |
auf Bestellung 949 Stücke: Lieferzeit 10-14 Tag (e) |
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| LFINTPM3QA | NXP USA Inc. |
Description: 176 PIN 0.5MM EQFP TO 208 1.0MM Packaging: Bulk Module/Board Type: Socket Module - PGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFK46RINTPM3QA | NXP USA Inc. |
Description: QORIVVA MPC5746R ON A 176 PIN 0. Packaging: Bulk For Use With/Related Products: MPC5746R Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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PM823UK/A0CZ | NXP USA Inc. |
Description: POWER MANAGEMENT IC, DUAL SYNCHR Number of Outputs: 3 w/Sequencer: No w/Supervisor: No w/LED Driver: No Voltage/Current - Output 3: 1.8V, 525mA Voltage/Current - Output 2: 2.2V, 1.5A Voltage/Current - Output 1: 1.1V, 1.5A Supplier Device Package: 12-WLCSP (1.55x1.18) Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1) Frequency - Switching: 3MHz Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 12-XFBGA, WLCSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PM823UK/A0CZ | NXP USA Inc. |
Description: POWER MANAGEMENT IC, DUAL SYNCHR Packaging: Cut Tape (CT) Package / Case: 12-XFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 5.5V Frequency - Switching: 3MHz Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1) Supplier Device Package: 12-WLCSP (1.55x1.18) Voltage/Current - Output 1: 1.1V, 1.5A Voltage/Current - Output 2: 2.2V, 1.5A Voltage/Current - Output 3: 1.8V, 525mA w/LED Driver: No w/Supervisor: No w/Sequencer: No Number of Outputs: 3 |
auf Bestellung 728 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN3222EUKZ | NXP USA Inc. |
Description: USB INTERFACE IC PTN3222EUK Packaging: Cut Tape (CT) Package / Case: 12-XFBGA, WLCSP Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 55mA (Max) Data Rate (Max): 480Mbps Supplier Device Package: 12-WLCSP (1.55x1.18) Signal Conditioning: Input Equalization, Output De-Emphasis Capacitance - Input: 10 pF |
auf Bestellung 7719 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN3222DUKZ | NXP USA Inc. |
Description: PTN3222DUKZ Packaging: Tape & Reel (TR) Package / Case: 12-XFBGA, WLCSP Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 11mA (Max) Data Rate (Max): 480Mbps Supplier Device Package: 12-WLCSP (1.55x1.18) Signal Conditioning: Input Equalization, Output De-Emphasis Capacitance - Input: 10 pF |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 8000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PTN3222DUKZ | NXP USA Inc. |
Description: PTN3222DUKZ Packaging: Cut Tape (CT) Package / Case: 12-XFBGA, WLCSP Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 11mA (Max) Data Rate (Max): 480Mbps Supplier Device Package: 12-WLCSP (1.55x1.18) Signal Conditioning: Input Equalization, Output De-Emphasis Capacitance - Input: 10 pF |
auf Bestellung 1946 Stücke: Lieferzeit 10-14 Tag (e) |
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PCMF1USB30Z | NXP USA Inc. |
Description: CMC 2LN SMD ESD Features: TVS Diode ESD Protection Packaging: Bulk Package / Case: 5-UFBGA, WLCSP Filter Type: Signal Line Size / Dimension: 0.046" L x 0.030" W (1.17mm x 0.77mm) Mounting Type: Surface Mount Number of Lines: 2 Operating Temperature: -40°C ~ 85°C Height (Max): 0.024" (0.60mm) DC Resistance (DCR) (Max): 3Ohm (Typ) |
auf Bestellung 53203 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8358EVVAGDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC54101J256BD64QL | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 111 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54101J512BD64QL | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMXRT533SFAWCR | NXP USA Inc. |
Description: IC MCU 32BIT 192KB ROM 141WLCSP Packaging: Tape & Reel (TR) Package / Case: 141-XFBGA, WLCSP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 192KB (192K x 8) RAM Size: 3M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 141-WLCSP (4.53x4.53) Number of I/O: 136 DigiKey Programmable: Not Verified |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| A3G23H500W17SR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V NI780
Current - Test: 300 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Supplier Device Package: NI-780-4S2S
Technology: GaN
Gain: 14.3dB
Power - Output: 80W
Configuration: 2 N-Channel
Frequency: 2.3GHz ~ 2.4GHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4S2S
Packaging: Tape & Reel (TR)
Description: RF MOSFET GAN 48V NI780
Current - Test: 300 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Supplier Device Package: NI-780-4S2S
Technology: GaN
Gain: 14.3dB
Power - Output: 80W
Configuration: 2 N-Channel
Frequency: 2.3GHz ~ 2.4GHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4S2S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MGD3160AM315EKT |
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Hersteller: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 32SOIC
Qualification: AEC-Q100
Grade: Automotive
Current - Peak Output (Source, Sink): 15A, 15A
Gate Type: IGBT, SiC MOSFET
Number of Drivers: 1
Driven Configuration: High-Side
Channel Type: Single
Supplier Device Package: 32-SOIC
Input Type: Non-Inverting
Voltage - Supply: 4.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tray
Description: IC GATE DRVR HIGH-SIDE 32SOIC
Qualification: AEC-Q100
Grade: Automotive
Current - Peak Output (Source, Sink): 15A, 15A
Gate Type: IGBT, SiC MOSFET
Number of Drivers: 1
Driven Configuration: High-Side
Channel Type: Single
Supplier Device Package: 32-SOIC
Input Type: Non-Inverting
Voltage - Supply: 4.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tray
auf Bestellung 176 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 17.34 EUR |
| 10+ | 13.52 EUR |
| 25+ | 12.55 EUR |
| 176+ | 11.17 EUR |
| 74LVT273PW,118 |
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Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
auf Bestellung 22500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1902+ | 0.31 EUR |
| 74LVT574PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
auf Bestellung 7640 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1665+ | 0.35 EUR |
| SAF775DHN/N208WBMP |
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1061CVJ5BR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 918 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.29 EUR |
| 10+ | 18.3 EUR |
| 25+ | 17.06 EUR |
| 100+ | 15.7 EUR |
| 250+ | 15.3 EUR |
| MIMXRT1061XVN5B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 225-MAPBGA (13x13)
Number of I/O: 149
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 225-MAPBGA (13x13)
Number of I/O: 149
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 27.77 EUR |
| 10+ | 21.92 EUR |
| 25+ | 20.46 EUR |
| 80+ | 19.06 EUR |
| 230+ | 18.14 EUR |
| 800+ | 17.35 EUR |
| MIMXRT106FDVL6A |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MIMXRT105SCVL5B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 184 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 32.13 EUR |
| 10+ | 23.12 EUR |
| 25+ | 20.81 EUR |
| 80+ | 18.59 EUR |
| A2V09H400-04NR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM780-4
Current - Test: 688 mA
Voltage - Test: 48 V
Voltage - Rated: 105 V
Supplier Device Package: OM-780-4L
Technology: LDMOS
Gain: 17.9dB
Power - Output: 107W
Frequency: 720MHz ~ 960MHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: OM-780-4L
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 48V OM780-4
Current - Test: 688 mA
Voltage - Test: 48 V
Voltage - Rated: 105 V
Supplier Device Package: OM-780-4L
Technology: LDMOS
Gain: 17.9dB
Power - Output: 107W
Frequency: 720MHz ~ 960MHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: OM-780-4L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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| A2V09H400-04NR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM780-4
Current - Test: 688 mA
Voltage - Test: 48 V
Voltage - Rated: 105 V
Supplier Device Package: OM-780-4L
Technology: LDMOS
Gain: 17.9dB
Power - Output: 107W
Frequency: 720MHz ~ 960MHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: OM-780-4L
Packaging: Cut Tape (CT)
Description: RF MOSFET LDMOS 48V OM780-4
Current - Test: 688 mA
Voltage - Test: 48 V
Voltage - Rated: 105 V
Supplier Device Package: OM-780-4L
Technology: LDMOS
Gain: 17.9dB
Power - Output: 107W
Frequency: 720MHz ~ 960MHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: OM-780-4L
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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| MPC18730EP |
|
Hersteller: NXP USA Inc.
Description: IC PMIC PROGR 5-OUTPUTS 64-QFN
Supplier Device Package: 64-QFN (9x9)
Current - Supply: 9mA
Applications: Handheld/Mobile Devices
Voltage - Supply: 0.9V ~ 4.2V
Operating Temperature: -10°C ~ 65°C
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
Description: IC PMIC PROGR 5-OUTPUTS 64-QFN
Supplier Device Package: 64-QFN (9x9)
Current - Supply: 9mA
Applications: Handheld/Mobile Devices
Voltage - Supply: 0.9V ~ 4.2V
Operating Temperature: -10°C ~ 65°C
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC9S08AW32MFGE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
Description: IC MCU 8BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
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| MCIMX6G3DVM05AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 152 Stücke
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| LD6806TD/29P,125 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.9V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.9V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2.9V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.9V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2959+ | 0.19 EUR |
| LD6806TD/14P,125 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.4V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.4V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 33000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2959+ | 0.2 EUR |
| LD6806TD/20P,125 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2959+ | 0.19 EUR |
| LD6806TD/30P,125 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 3V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2959+ | 0.19 EUR |
| KITFS23BUCKEVM |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS2320
Embedded: Yes, MCU, 32-Bit
Utilized IC / Part: FS2320
Contents: Board(s)
Type: Interface
Function: System Basis Chip (SBC)
Packaging: Bulk
Description: EVAL BOARD FOR FS2320
Embedded: Yes, MCU, 32-Bit
Utilized IC / Part: FS2320
Contents: Board(s)
Type: Interface
Function: System Basis Chip (SBC)
Packaging: Bulk
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 379.3 EUR |
| MCF51AG128CLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
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| MF3DH23C0DA4/00J |
Hersteller: NXP USA Inc.
Description: MF3DH23C0DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Description: MF3DH23C0DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
Mindestbestellmenge: 17500 Stücke
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| MCF51MM256VLL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 65
DigiKey Programmable: Not Verified
auf Bestellung 397 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 31+ | 18.15 EUR |
| MC9328MX21CVK |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9328MX21CVK |
|
Hersteller: NXP USA Inc.
Description: MICROPROCESSOR, 32-BIT, 266MHZ,
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 289-PBGA (14x14)
USB: USB OTG (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
Description: MICROPROCESSOR, 32-BIT, 266MHZ,
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 289-PBGA (14x14)
USB: USB OTG (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
auf Bestellung 461 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 65.64 EUR |
| 2PB1219AQ,115 |
|
Hersteller: NXP USA Inc.
Description: TRANS PNP 50V 0.5A SOT-323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 150mA, 10V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 200 mW
Qualification: AEC-Q101
Description: TRANS PNP 50V 0.5A SOT-323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 150mA, 10V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 200 mW
Qualification: AEC-Q101
auf Bestellung 86190 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10724+ | 0.061 EUR |
| MPC5534EVBE |
|
Hersteller: NXP USA Inc.
Description: MPC5534 EVAL BRD
Utilized IC / Part: MPC5534
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: MPC5534 EVAL BRD
Utilized IC / Part: MPC5534
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| N74F374D,602 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Supplier Device Package: 20-SO
Clock Frequency: 165 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 3mA, 24mA
Current - Quiescent (Iq): 86 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Description: IC FF D-TYPE SNGL 8BIT 20SO
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Supplier Device Package: 20-SO
Clock Frequency: 165 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 3mA, 24mA
Current - Quiescent (Iq): 86 mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
auf Bestellung 3894 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1902+ | 0.32 EUR |
| MC9328MX1VM20 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX1 200MHZ 256MAPBGA
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 3.0V
Core Processor: ARM920T
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 256-MAPBGA
Packaging: Tray
Description: IC MPU I.MX1 200MHZ 256MAPBGA
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 3.0V
Core Processor: ARM920T
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 256-MAPBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NCX2200GW,125 |
|
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NCX2200GW,125 |
|
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9957HN-ARD |
|
Hersteller: NXP USA Inc.
Description: PCA9957 LED DRIVER SHIELD
Packaging: Bulk
Function: LED Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PCA9957
Platform: Arduino
Description: PCA9957 LED DRIVER SHIELD
Packaging: Bulk
Function: LED Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PCA9957
Platform: Arduino
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 265.17 EUR |
| MSC8157SAG1000A |
|
Hersteller: NXP USA Inc.
Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Six Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 6.375MB
Voltage - I/O: 1.0V, 1.5V, 2.5V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Six Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 6.375MB
Voltage - I/O: 1.0V, 1.5V, 2.5V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S08RN60W1MLC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 8BIT 60KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MGD3162AM551EKR2 |
|
Hersteller: NXP USA Inc.
Description: MGD3162AM551EKR2
Qualification: AEC-Q100
Voltage - Output Supply: 12V ~ 25V
Number of Channels: 1
Grade: Automotive
Common Mode Transient Immunity (Min): 100V/ns
Supplier Device Package: 32-SOIC
Approval Agency: UL, VDE
Voltage - Isolation: 8000Vrms
Technology: Magnetic Coupling
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: MGD3162AM551EKR2
Qualification: AEC-Q100
Voltage - Output Supply: 12V ~ 25V
Number of Channels: 1
Grade: Automotive
Common Mode Transient Immunity (Min): 100V/ns
Supplier Device Package: 32-SOIC
Approval Agency: UL, VDE
Voltage - Isolation: 8000Vrms
Technology: Magnetic Coupling
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 12.23 EUR |
| MGD3162AM551EKR2 |
|
Hersteller: NXP USA Inc.
Description: MGD3162AM551EKR2
Qualification: AEC-Q100
Voltage - Output Supply: 12V ~ 25V
Number of Channels: 1
Grade: Automotive
Common Mode Transient Immunity (Min): 100V/ns
Supplier Device Package: 32-SOIC
Approval Agency: UL, VDE
Voltage - Isolation: 8000Vrms
Technology: Magnetic Coupling
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
Description: MGD3162AM551EKR2
Qualification: AEC-Q100
Voltage - Output Supply: 12V ~ 25V
Number of Channels: 1
Grade: Automotive
Common Mode Transient Immunity (Min): 100V/ns
Supplier Device Package: 32-SOIC
Approval Agency: UL, VDE
Voltage - Isolation: 8000Vrms
Technology: Magnetic Coupling
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 1598 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.06 EUR |
| 10+ | 15.72 EUR |
| 25+ | 14.64 EUR |
| 100+ | 13.44 EUR |
| 250+ | 12.86 EUR |
| 500+ | 12.52 EUR |
| NCK2911AHN/10200Y |
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LFMAJ04QJM |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5604B 208 PIN 1.0MM P
Contents: Board(s)
Type: Debugger
For Use With/Related Products: MPC5604B
Packaging: Bulk
Description: QORIVVA MPC5604B 208 PIN 1.0MM P
Contents: Board(s)
Type: Debugger
For Use With/Related Products: MPC5604B
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P1010NSE5KHA |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVCALSRAM2 |
Hersteller: NXP USA Inc.
Description: 16 BIT 2MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC55xx, MPC5634M
Accessory Type: Calibration Unit
Description: 16 BIT 2MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC55xx, MPC5634M
Accessory Type: Calibration Unit
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| K32W041Y |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.92 EUR |
| 10+ | 12.07 EUR |
| 25+ | 11.42 EUR |
| 100+ | 10.54 EUR |
| 250+ | 10.01 EUR |
| 500+ | 9.63 EUR |
| 1000+ | 9.28 EUR |
| MC33FS6525LAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.17 EUR |
| 10+ | 12.54 EUR |
| 25+ | 11.64 EUR |
| 100+ | 10.65 EUR |
| 250+ | 10.17 EUR |
| MAC7116VAG50 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM7®
Data Converters: A/D 16x8/10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM7®
Data Converters: A/D 16x8/10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LS2084ACE7TTB |
|
Hersteller: NXP USA Inc.
Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
SATA: SATA 6Gbps (2)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
Supplier Device Package: 1292-BGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 1292-BBGA
Packaging: Tray
Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
SATA: SATA 6Gbps (2)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
Supplier Device Package: 1292-BGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 1292-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 21 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8555EVTAJD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8347EVRAGDB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
Im Einkaufswagen
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| MC68VZ328CVP |
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144MAPBGA
Additional Interfaces: SPI, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 144-MAPBGA (13x13)
Voltage - I/O: 3.0V
Core Processor: FLX68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
Description: IC MPU M683XX 33MHZ 144MAPBGA
Additional Interfaces: SPI, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 144-MAPBGA (13x13)
Voltage - I/O: 3.0V
Core Processor: FLX68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| LPC11U68JBD64K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
auf Bestellung 949 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.75 EUR |
| 10+ | 6.53 EUR |
| 25+ | 6.52 EUR |
| 100+ | 6.5 EUR |
| LFINTPM3QA |
Hersteller: NXP USA Inc.
Description: 176 PIN 0.5MM EQFP TO 208 1.0MM
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Description: 176 PIN 0.5MM EQFP TO 208 1.0MM
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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| LFK46RINTPM3QA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5746R ON A 176 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746R
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5746R ON A 176 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746R
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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| PM823UK/A0CZ |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, DUAL SYNCHR
Number of Outputs: 3
w/Sequencer: No
w/Supervisor: No
w/LED Driver: No
Voltage/Current - Output 3: 1.8V, 525mA
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 1: 1.1V, 1.5A
Supplier Device Package: 12-WLCSP (1.55x1.18)
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Frequency - Switching: 3MHz
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 12-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Description: POWER MANAGEMENT IC, DUAL SYNCHR
Number of Outputs: 3
w/Sequencer: No
w/Supervisor: No
w/LED Driver: No
Voltage/Current - Output 3: 1.8V, 525mA
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 1: 1.1V, 1.5A
Supplier Device Package: 12-WLCSP (1.55x1.18)
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Frequency - Switching: 3MHz
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 12-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| PM823UK/A0CZ |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, DUAL SYNCHR
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 3MHz
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Supplier Device Package: 12-WLCSP (1.55x1.18)
Voltage/Current - Output 1: 1.1V, 1.5A
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 3: 1.8V, 525mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 3
Description: POWER MANAGEMENT IC, DUAL SYNCHR
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 3MHz
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Supplier Device Package: 12-WLCSP (1.55x1.18)
Voltage/Current - Output 1: 1.1V, 1.5A
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 3: 1.8V, 525mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 3
auf Bestellung 728 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 7+ | 3.31 EUR |
| 10+ | 2.43 EUR |
| 25+ | 2.21 EUR |
| 100+ | 1.96 EUR |
| 250+ | 1.84 EUR |
| 500+ | 1.77 EUR |
| PTN3222EUKZ |
|
Hersteller: NXP USA Inc.
Description: USB INTERFACE IC PTN3222EUK
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Description: USB INTERFACE IC PTN3222EUK
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
auf Bestellung 7719 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 7+ | 3.28 EUR |
| 10+ | 2.42 EUR |
| 25+ | 2.2 EUR |
| 100+ | 1.96 EUR |
| 250+ | 1.84 EUR |
| 500+ | 1.82 EUR |
| PTN3222DUKZ |
|
Hersteller: NXP USA Inc.
Description: PTN3222DUKZ
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 11mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Description: PTN3222DUKZ
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 11mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
Mindestbestellmenge: 8000 Stücke
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| PTN3222DUKZ |
|
Hersteller: NXP USA Inc.
Description: PTN3222DUKZ
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 11mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Description: PTN3222DUKZ
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 11mA (Max)
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
auf Bestellung 1946 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 4.13 EUR |
| 10+ | 3.06 EUR |
| 25+ | 2.8 EUR |
| 100+ | 2.5 EUR |
| 250+ | 2.36 EUR |
| 500+ | 2.27 EUR |
| 1000+ | 2.24 EUR |
| PCMF1USB30Z |
|
Hersteller: NXP USA Inc.
Description: CMC 2LN SMD ESD
Features: TVS Diode ESD Protection
Packaging: Bulk
Package / Case: 5-UFBGA, WLCSP
Filter Type: Signal Line
Size / Dimension: 0.046" L x 0.030" W (1.17mm x 0.77mm)
Mounting Type: Surface Mount
Number of Lines: 2
Operating Temperature: -40°C ~ 85°C
Height (Max): 0.024" (0.60mm)
DC Resistance (DCR) (Max): 3Ohm (Typ)
Description: CMC 2LN SMD ESD
Features: TVS Diode ESD Protection
Packaging: Bulk
Package / Case: 5-UFBGA, WLCSP
Filter Type: Signal Line
Size / Dimension: 0.046" L x 0.030" W (1.17mm x 0.77mm)
Mounting Type: Surface Mount
Number of Lines: 2
Operating Temperature: -40°C ~ 85°C
Height (Max): 0.024" (0.60mm)
DC Resistance (DCR) (Max): 3Ohm (Typ)
auf Bestellung 53203 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1998+ | 0.3 EUR |
| MPC8358EVVAGDGA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
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| LPC54101J256BD64QL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 111 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.27 EUR |
| 10+ | 11.08 EUR |
| 25+ | 10.29 EUR |
| LPC54101J512BD64QL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| MIMXRT533SFAWCR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 3M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 3M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6000+ | 23.24 EUR |