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P1011NXE2DFB P1011NXE2DFB NXP USA Inc. QorIQ_P1.pdf Description: IC MPU 533MHZ PBGA689
Supplier Device Package: 689-TEPBGA II (31x31)
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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P1011NXN2DFB P1011NXN2DFB NXP USA Inc. QorIQ_P1.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Produkt ist nicht verfügbar
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KITPF5300FRDMEVM NXP USA Inc. UM11890.pdf Description: EVAL BOARD FOR MPF5302AMBA0ES
Packaging: Box
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 15A
Contents: Board(s)
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MPF5302AMBA0ES
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
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1+293.04 EUR
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MF3D4301DUD/00Z NXP USA Inc. MF3D_H_X3_SDS.pdf Description: MF3D4301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
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MF3DH4301DUD/00Z NXP USA Inc. MF3D_H_X3_SDS.pdf Description: MF3DH4301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MKE04Z8VFK4R MKE04Z8VFK4R NXP USA Inc. MKE04P24M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
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MKE04Z8VFK4R MKE04Z8VFK4R NXP USA Inc. MKE04P24M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
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6+3.15 EUR
10+2.33 EUR
25+2.12 EUR
100+1.89 EUR
250+1.78 EUR
500+1.72 EUR
1000+1.69 EUR
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MC33FS6503NAE MC33FS6503NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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1+18.6 EUR
10+13.07 EUR
25+11.64 EUR
80+10.26 EUR
230+9.33 EUR
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BATT-TPLCABLE50 NXP USA Inc. Description: ELECTRICAL TRANSPORT PROTOCOL LI
Packaging: Bulk
Accessory Type: Cable
Produkt ist nicht verfügbar
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BATT-TPLCABLE20 NXP USA Inc. Description: ELECTRICAL TRANSPORT PROTOCOL LI
Packaging: Bulk
Accessory Type: Cable
Produkt ist nicht verfügbar
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MC33FS6515CAE MC33FS6515CAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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2+12.65 EUR
10+9.8 EUR
25+9.08 EUR
100+8.3 EUR
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MC56F81768MLH MC56F81768MLH NXP USA Inc. MC56F81XXX.pdf Description: 32-BIT DSC, 56800EX CORE, 128KB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
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MPC8241LZQ200D MPC8241LZQ200D NXP USA Inc. MPC8241.pdf Description: IC MPU MPC82XX 200MHZ 357BGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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1+78.46 EUR
10+64.29 EUR
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MPC8248ZQMIBA MPC8248ZQMIBA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 266MHZ PBGA516
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8247CZQMIBA MPC8247CZQMIBA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 266MHZ PBGA516
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
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1+89.46 EUR
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MC9S08DZ16AMLF MC9S08DZ16AMLF NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BUK9506-40B,127 NXP USA Inc. Description: MOSFET N-CH 40V 75A TO220AB
Packaging: Tube
auf Bestellung 5318 Stücke:
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579+0.82 EUR
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FS32K148UIT0VLQR NXP USA Inc. S32K1xx.pdf Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
Produkt ist nicht verfügbar
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8MPNAVQ-8GB-XG 8MPNAVQ-8GB-XG NXP USA Inc. 8MPNAVQQSG.pdf Description: DEV KIT
Core Processor: ARM® Cortex®-A53
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Utilized IC / Part: i.MX 8M Plus
Produkt ist nicht verfügbar
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MC9328MXLVP20R2 MC9328MXLVP20R2 NXP USA Inc. MC9328MXL.pdf Description: IC MPU I.MXL 200MHZ 225MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
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K32W061Y K32W061Y NXP USA Inc. K32W061.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
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2+16.72 EUR
10+12.93 EUR
25+11.81 EUR
100+10.45 EUR
250+9.73 EUR
500+9.27 EUR
1000+8.87 EUR
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PCF2120TK/1,118 PCF2120TK/1,118 NXP USA Inc. PCF2120.pdf Description: IC OSC XTAL 32KHZ 10-HVSON
Packaging: Bulk
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 32kHz
Type: Oscillator, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Supplier Device Package: 10-HVSON (3x3)
Current - Supply: 1.39 µA
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289+1.69 EUR
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MC9S08SH8MTJR MC9S08SH8MTJR NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LD6806F/25P,115 LD6806F/25P,115 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.5V 200MA 6XSON
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFDFN
Packaging: Bulk
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2219+0.23 EUR
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MC35FS6518CAE MC35FS6518CAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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1+18.23 EUR
10+14.29 EUR
25+13.3 EUR
100+12.22 EUR
250+11.7 EUR
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SCVBBK77CWA NXP USA Inc. Description: NXP LEAD FREE MPC5777C 416 PIN 1
Packaging: Bulk
Produkt ist nicht verfügbar
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P1015NSN5FFB P1015NSN5FFB NXP USA Inc. QP1024FS.pdf Description: IC MPU 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 561-TEPBGA I (23x23)
Produkt ist nicht verfügbar
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P1015NXN5FFB P1015NXN5FFB NXP USA Inc. QP1024FS.pdf Description: IC MPU 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 561-TEPBGA I (23x23)
Produkt ist nicht verfügbar
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P1016NXN5FFB P1016NXN5FFB NXP USA Inc. Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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S32K396EHT1MKUST S32K396EHT1MKUST NXP USA Inc. S32K39%2C%20S32K37.pdf Description: S32K396 Arm Cortex-M7
Packaging: Tray
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1+78.16 EUR
10+60.24 EUR
25+55.66 EUR
200+50.72 EUR
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S32K3X8EVB-Q289 S32K3X8EVB-Q289 NXP USA Inc. S32K3xx.pdf Description: EVAL BOARD S32K3X8
Packaging: Box
Produkt ist nicht verfügbar
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S32K310NHT0VLFSR S32K310NHT0VLFSR NXP USA Inc. S32K3xx.pdf Description: S32K310NHT0VLFSR
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K310NHT0VLFST S32K310NHT0VLFST NXP USA Inc. S32K3xx.pdf Description: S32K310NHT0VLFST
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
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S32K311NHT0VPASR S32K311NHT0VPASR NXP USA Inc. S32K3xx.pdf Description: S32K311NHT0VPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K311NHT0MPAIR S32K311NHT0MPAIR NXP USA Inc. S32K3xx.pdf Description: S32K311NHT0MPAIR
Packaging: Bulk
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K312NHT0MPAIR S32K312NHT0MPAIR NXP USA Inc. S32K3xx.pdf Description: S32K312NHT0MPAIR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K312NHT0MPASR S32K312NHT0MPASR NXP USA Inc. S32K3xx.pdf Description: S32K312NHT0MPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K394EHT1MJBSR S32K394EHT1MJBSR NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K394EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K394NHT1MJBST S32K394NHT1MJBST NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K394NHT1MJBST
Qualification: AEC-Q100
Number of I/O: 209
Grade: Automotive
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Quad-Core
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 800K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 320MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
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S32K394EHT1MJBST S32K394EHT1MJBST NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K394EHT1MJBST
Qualification: AEC-Q100
Number of I/O: 209
Grade: Automotive
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Quad-Core
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 800K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 320MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
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S32K396NHT1MJBST S32K396NHT1MJBST NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K396NHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Qualification: AEC-Q100
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S32K396NHT1MKUSR NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K396NHT1MKUSR
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
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S32K396EHT1MKUSR NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K396EHT1MKUSR
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K396NHT1MKUST S32K396NHT1MKUST NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K396NHT1MKUST
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-HLQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
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S32X-MB NXP USA Inc. Description: S32X-MB
Packaging: Bulk
Function: I/O Expansion
Type: Interface
Contents: Board(s)
Utilized IC / Part: S32K37, S32K39
Produkt ist nicht verfügbar
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S32K396BMS-EVB NXP USA Inc. Description: S32K396BMS-EVB
Packaging: Bulk
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+1585.41 EUR
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S32K396-BGA-DC1 NXP USA Inc. Description: S32K396-BGA-DC1
Packaging: Bulk
Produkt ist nicht verfügbar
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AFV10700HR5 AFV10700HR5 NXP USA Inc. AFV10700H.pdf Description: RF MOSFET LDMOS 50V NI780
Packaging: Bulk
Package / Case: NI-780-4
Current Rating (Amps): 1µA
Mounting Type: Chassis Mount
Frequency: 1.03GHz ~ 1.09GHz
Configuration: Dual
Power - Output: 770W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MCIMX6S4AVM08AB MCIMX6S4AVM08AB NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SE050F2HQ1/Z018HZ SE050F2HQ1/Z018HZ NXP USA Inc. SE050-DATASHEET.pdf?pspll=1 Description: IC PLUG/TRUST SEC ELEM 20HX2QFN
DigiKey Programmable: Not Verified
Supplier Device Package: 20-HX2QFN (3x3)
Type: Plug and Trust Secure Element
Mounting Type: Surface Mount
Package / Case: 20-XFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 3000 Stücke
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PCA9481AUKZ NXP USA Inc. PCA9481AUK_SDS.pdf Description: SWITCHED CAPACITOR CHARGER
Packaging: Tape & Reel (TR)
Package / Case: 70-UFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 70-WLCSP (4.16x2.96)
Charge Current - Max: 10A
Programmable Features: Timer
Fault Protection: Over Temperature, Over-Under Voltage
Voltage - Supply (Max): 16.5V
Battery Pack Voltage: 7V (Max)
Current - Charging: Constant
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WPR1500-HVMPP WPR1500-HVMPP NXP USA Inc. WPR1516.pdf Description: WPR1500-HVMPP
Packaging: Bulk
Produkt ist nicht verfügbar
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K32W042S1M2CAVAR NXP USA Inc. Description: MCU KINETIS BT5/FSK/THREAD WLCSP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
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K32W032S1M2VPJAT NXP USA Inc. Description: MCU KINETIS BT5/FSK 176-VFBGA
Packaging: Tray
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 176-VFBGA
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8343CRADDB NXP USA Inc. FSCLS06083-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC II PRO PROCESSOR
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-TEPBGA II (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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8+77.3 EUR
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MPC8343CVRADDB MPC8343CVRADDB NXP USA Inc. Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
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MPC8343EVRADDB MPC8343EVRADDB NXP USA Inc. FSCLS06083-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MPC8343ZQADDB MPC8343ZQADDB NXP USA Inc. MPC8343%28E%29_Man.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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NTP53121G0JUAV NXP USA Inc. Description: NTAG
Packaging: Bulk
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 105°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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MIMXRT106VDVL6B MIMXRT106VDVL6B NXP USA Inc. IMXRT1060XXEC.pdf Description: IC MCU
Packaging: Tray
auf Bestellung 456 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.05 EUR
10+18.69 EUR
25+17.82 EUR
40+17.39 EUR
80+16.77 EUR
240+15.84 EUR
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P1011NXE2DFB QorIQ_P1.pdf
P1011NXE2DFB
Hersteller: NXP USA Inc.
Description: IC MPU 533MHZ PBGA689
Supplier Device Package: 689-TEPBGA II (31x31)
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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P1011NXN2DFB QorIQ_P1.pdf
P1011NXN2DFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Produkt ist nicht verfügbar
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KITPF5300FRDMEVM UM11890.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MPF5302AMBA0ES
Packaging: Box
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 15A
Contents: Board(s)
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MPF5302AMBA0ES
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
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AnzahlPreis
1+293.04 EUR
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MF3D4301DUD/00Z MF3D_H_X3_SDS.pdf
Hersteller: NXP USA Inc.
Description: MF3D4301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MF3DH4301DUD/00Z MF3D_H_X3_SDS.pdf
Hersteller: NXP USA Inc.
Description: MF3DH4301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MKE04Z8VFK4R MKE04P24M48SF0.pdf
MKE04Z8VFK4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE04Z8VFK4R MKE04P24M48SF0.pdf
MKE04Z8VFK4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
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6+3.15 EUR
10+2.33 EUR
25+2.12 EUR
100+1.89 EUR
250+1.78 EUR
500+1.72 EUR
1000+1.69 EUR
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MC33FS6503NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6503NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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1+18.6 EUR
10+13.07 EUR
25+11.64 EUR
80+10.26 EUR
230+9.33 EUR
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BATT-TPLCABLE50
Hersteller: NXP USA Inc.
Description: ELECTRICAL TRANSPORT PROTOCOL LI
Packaging: Bulk
Accessory Type: Cable
Produkt ist nicht verfügbar
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BATT-TPLCABLE20
Hersteller: NXP USA Inc.
Description: ELECTRICAL TRANSPORT PROTOCOL LI
Packaging: Bulk
Accessory Type: Cable
Produkt ist nicht verfügbar
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MC33FS6515CAE FS6500-FS4500-ASILD.pdf
MC33FS6515CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 210 Stücke:
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AnzahlPreis
2+12.65 EUR
10+9.8 EUR
25+9.08 EUR
100+8.3 EUR
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MC56F81768MLH MC56F81XXX.pdf
MC56F81768MLH
Hersteller: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 128KB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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MPC8241LZQ200D MPC8241.pdf
MPC8241LZQ200D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 357BGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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1+78.46 EUR
10+64.29 EUR
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MPC8248ZQMIBA MPC8272EC.pdf
MPC8248ZQMIBA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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MPC8247CZQMIBA MPC8272EC.pdf
MPC8247CZQMIBA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
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1+89.46 EUR
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MC9S08DZ16AMLF MC9S08DZ60.pdf
MC9S08DZ16AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BUK9506-40B,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 75A TO220AB
Packaging: Tube
auf Bestellung 5318 Stücke:
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AnzahlPreis
579+0.82 EUR
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FS32K148UIT0VLQR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
Produkt ist nicht verfügbar
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8MPNAVQ-8GB-XG 8MPNAVQQSG.pdf
8MPNAVQ-8GB-XG
Hersteller: NXP USA Inc.
Description: DEV KIT
Core Processor: ARM® Cortex®-A53
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Utilized IC / Part: i.MX 8M Plus
Produkt ist nicht verfügbar
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MC9328MXLVP20R2 MC9328MXL.pdf
MC9328MXLVP20R2
Hersteller: NXP USA Inc.
Description: IC MPU I.MXL 200MHZ 225MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
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K32W061Y K32W061.pdf
K32W061Y
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+16.72 EUR
10+12.93 EUR
25+11.81 EUR
100+10.45 EUR
250+9.73 EUR
500+9.27 EUR
1000+8.87 EUR
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PCF2120TK/1,118 PCF2120.pdf
PCF2120TK/1,118
Hersteller: NXP USA Inc.
Description: IC OSC XTAL 32KHZ 10-HVSON
Packaging: Bulk
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 32kHz
Type: Oscillator, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Supplier Device Package: 10-HVSON (3x3)
Current - Supply: 1.39 µA
auf Bestellung 10953 Stücke:
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AnzahlPreis
289+1.69 EUR
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MC9S08SH8MTJR MC9S08SH32.pdf
MC9S08SH8MTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LD6806F/25P,115 LD6806_Series.pdf
LD6806F/25P,115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 200MA 6XSON
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 10000 Stücke:
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AnzahlPreis
2219+0.23 EUR
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MC35FS6518CAE FS6500-FS4500-ASILD.pdf
MC35FS6518CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+18.23 EUR
10+14.29 EUR
25+13.3 EUR
100+12.22 EUR
250+11.7 EUR
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SCVBBK77CWA
Hersteller: NXP USA Inc.
Description: NXP LEAD FREE MPC5777C 416 PIN 1
Packaging: Bulk
Produkt ist nicht verfügbar
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P1015NSN5FFB QP1024FS.pdf
P1015NSN5FFB
Hersteller: NXP USA Inc.
Description: IC MPU 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 561-TEPBGA I (23x23)
Produkt ist nicht verfügbar
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P1015NXN5FFB QP1024FS.pdf
P1015NXN5FFB
Hersteller: NXP USA Inc.
Description: IC MPU 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 561-TEPBGA I (23x23)
Produkt ist nicht verfügbar
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P1016NXN5FFB
P1016NXN5FFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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S32K396EHT1MKUST S32K39%2C%20S32K37.pdf
S32K396EHT1MKUST
Hersteller: NXP USA Inc.
Description: S32K396 Arm Cortex-M7
Packaging: Tray
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+78.16 EUR
10+60.24 EUR
25+55.66 EUR
200+50.72 EUR
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S32K3X8EVB-Q289 S32K3xx.pdf
S32K3X8EVB-Q289
Hersteller: NXP USA Inc.
Description: EVAL BOARD S32K3X8
Packaging: Box
Produkt ist nicht verfügbar
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S32K310NHT0VLFSR S32K3xx.pdf
S32K310NHT0VLFSR
Hersteller: NXP USA Inc.
Description: S32K310NHT0VLFSR
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K310NHT0VLFST S32K3xx.pdf
S32K310NHT0VLFST
Hersteller: NXP USA Inc.
Description: S32K310NHT0VLFST
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K311NHT0VPASR S32K3xx.pdf
S32K311NHT0VPASR
Hersteller: NXP USA Inc.
Description: S32K311NHT0VPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K311NHT0MPAIR S32K3xx.pdf
S32K311NHT0MPAIR
Hersteller: NXP USA Inc.
Description: S32K311NHT0MPAIR
Packaging: Bulk
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K312NHT0MPAIR S32K3xx.pdf
S32K312NHT0MPAIR
Hersteller: NXP USA Inc.
Description: S32K312NHT0MPAIR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
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S32K312NHT0MPASR S32K3xx.pdf
S32K312NHT0MPASR
Hersteller: NXP USA Inc.
Description: S32K312NHT0MPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K394EHT1MJBSR S32K39-S32K37-DS.pdf
S32K394EHT1MJBSR
Hersteller: NXP USA Inc.
Description: S32K394EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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S32K394NHT1MJBST S32K39-S32K37-DS.pdf
S32K394NHT1MJBST
Hersteller: NXP USA Inc.
Description: S32K394NHT1MJBST
Qualification: AEC-Q100
Number of I/O: 209
Grade: Automotive
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Quad-Core
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 800K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 320MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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S32K394EHT1MJBST S32K39-S32K37-DS.pdf
S32K394EHT1MJBST
Hersteller: NXP USA Inc.
Description: S32K394EHT1MJBST
Qualification: AEC-Q100
Number of I/O: 209
Grade: Automotive
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Quad-Core
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 800K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 320MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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S32K396NHT1MJBST S32K39-S32K37-DS.pdf
S32K396NHT1MJBST
Hersteller: NXP USA Inc.
Description: S32K396NHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K396NHT1MKUSR S32K39-S32K37-DS.pdf
Hersteller: NXP USA Inc.
Description: S32K396NHT1MKUSR
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K396EHT1MKUSR S32K39-S32K37-DS.pdf
Hersteller: NXP USA Inc.
Description: S32K396EHT1MKUSR
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K396NHT1MKUST S32K39-S32K37-DS.pdf
S32K396NHT1MKUST
Hersteller: NXP USA Inc.
Description: S32K396NHT1MKUST
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-HLQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32X-MB
Hersteller: NXP USA Inc.
Description: S32X-MB
Packaging: Bulk
Function: I/O Expansion
Type: Interface
Contents: Board(s)
Utilized IC / Part: S32K37, S32K39
Produkt ist nicht verfügbar
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S32K396BMS-EVB
Hersteller: NXP USA Inc.
Description: S32K396BMS-EVB
Packaging: Bulk
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+1585.41 EUR
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S32K396-BGA-DC1
Hersteller: NXP USA Inc.
Description: S32K396-BGA-DC1
Packaging: Bulk
Produkt ist nicht verfügbar
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AFV10700HR5 AFV10700H.pdf
AFV10700HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Bulk
Package / Case: NI-780-4
Current Rating (Amps): 1µA
Mounting Type: Chassis Mount
Frequency: 1.03GHz ~ 1.09GHz
Configuration: Dual
Power - Output: 770W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MCIMX6S4AVM08AB IMX6SDLCEC.pdf
MCIMX6S4AVM08AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SE050F2HQ1/Z018HZ SE050-DATASHEET.pdf?pspll=1
SE050F2HQ1/Z018HZ
Hersteller: NXP USA Inc.
Description: IC PLUG/TRUST SEC ELEM 20HX2QFN
DigiKey Programmable: Not Verified
Supplier Device Package: 20-HX2QFN (3x3)
Type: Plug and Trust Secure Element
Mounting Type: Surface Mount
Package / Case: 20-XFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA9481AUKZ PCA9481AUK_SDS.pdf
Hersteller: NXP USA Inc.
Description: SWITCHED CAPACITOR CHARGER
Packaging: Tape & Reel (TR)
Package / Case: 70-UFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 70-WLCSP (4.16x2.96)
Charge Current - Max: 10A
Programmable Features: Timer
Fault Protection: Over Temperature, Over-Under Voltage
Voltage - Supply (Max): 16.5V
Battery Pack Voltage: 7V (Max)
Current - Charging: Constant
Produkt ist nicht verfügbar
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WPR1500-HVMPP WPR1516.pdf
WPR1500-HVMPP
Hersteller: NXP USA Inc.
Description: WPR1500-HVMPP
Packaging: Bulk
Produkt ist nicht verfügbar
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K32W042S1M2CAVAR
Hersteller: NXP USA Inc.
Description: MCU KINETIS BT5/FSK/THREAD WLCSP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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K32W032S1M2VPJAT
Hersteller: NXP USA Inc.
Description: MCU KINETIS BT5/FSK 176-VFBGA
Packaging: Tray
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 176-VFBGA
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8343CRADDB FSCLS06083-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: POWERQUICC II PRO PROCESSOR
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-TEPBGA II (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
8+77.3 EUR
Mindestbestellmenge: 8 Stücke
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MPC8343CVRADDB
MPC8343CVRADDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MPC8343EVRADDB FSCLS06083-1.pdf?t.download=true&u=5oefqw
MPC8343EVRADDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MPC8343ZQADDB MPC8343%28E%29_Man.pdf
MPC8343ZQADDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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NTP53121G0JUAV
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Bulk
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 105°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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MIMXRT106VDVL6B IMXRT1060XXEC.pdf
MIMXRT106VDVL6B
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
auf Bestellung 456 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+21.05 EUR
10+18.69 EUR
25+17.82 EUR
40+17.39 EUR
80+16.77 EUR
240+15.84 EUR
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