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S912ZVML12AVKHR S912ZVML12AVKHR NXP USA Inc. Description: S12Z CORE, 128K FLASH, LIN, 64LQ
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
Produkt ist nicht verfügbar
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S912ZVML64AVKH NXP USA Inc. Description: S12Z CORE, 64K FLASH, LIN, 64LQF
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 24
Produkt ist nicht verfügbar
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S912ZVMC64AVKH NXP USA Inc. Description: S12Z CORE,64K FLASH,CAN,64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
Produkt ist nicht verfügbar
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NCF295EMHN4/0116YY NXP USA Inc. Description: NCF295EMHN4
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12ZVLS3F0MFMR S9S12ZVLS3F0MFMR NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 32KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+5.14 EUR
Mindestbestellmenge: 2500
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S9S12ZVLS3F0MFMR S9S12ZVLS3F0MFMR NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 32KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
auf Bestellung 4900 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.17 EUR
10+7.01 EUR
25+6.47 EUR
100+5.88 EUR
250+5.60 EUR
500+5.43 EUR
1000+5.29 EUR
Mindestbestellmenge: 2
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S912ZVL64F0MFMR S912ZVL64F0MFMR NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 64KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVLA12F0MFMR S912ZVLA12F0MFMR NXP USA Inc. Description: MAGNIV 16-BIT MCU, S12Z CORE, 12
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b, 6x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
Produkt ist nicht verfügbar
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FD32K116LFT0MFMR NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC802M001JHI33Y LPC802M001JHI33Y NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
6000+1.25 EUR
Mindestbestellmenge: 6000
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LPC802M001JHI33Y LPC802M001JHI33Y NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.62 EUR
12+1.52 EUR
25+1.47 EUR
100+1.42 EUR
500+1.41 EUR
1000+1.36 EUR
2500+1.27 EUR
Mindestbestellmenge: 7
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SAF775CHN/N208WDMP NXP USA Inc. Description: CAR DISP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LFK77CINTPWA NXP USA Inc. Description: MPC5777C ON A 416 PIN 1.0 MM BGA
Packaging: Bulk
For Use With/Related Products: MPC5777C
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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MC35FS4507CAER2 NXP USA Inc. 35FS4500-35FS6500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS4507CAE NXP USA Inc. 35FS4500-35FS6500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MF3D43C0DA4/00J NXP USA Inc. Description: MF3D43C0DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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MK10DN32VLH5 MK10DN32VLH5 NXP USA Inc. K10P64M50SF0.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 19x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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UJA1132AHW/3F0/0Y NXP USA Inc. UJA113X_SER.pdf Description: UJA1132AHW/3F0/0Y
Packaging: Bulk
Produkt ist nicht verfügbar
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MC32PF1550A1EP MC32PF1550A1EP NXP USA Inc. Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MPF5032BMMA5ES MPF5032BMMA5ES NXP USA Inc. PF5030_SDS.pdf Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.17 EUR
10+8.36 EUR
25+8.20 EUR
40+8.14 EUR
80+7.31 EUR
230+7.28 EUR
490+6.82 EUR
Mindestbestellmenge: 2
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MPF5032BMMA0ESR2 MPF5032BMMA0ESR2 NXP USA Inc. Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5032BMMA5ESR2 MPF5032BMMA5ESR2 NXP USA Inc. Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5032BMBA0ESR2 MPF5032BMBA0ESR2 NXP USA Inc. Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5032BMDA0ESR2 MPF5032BMDA0ESR2 NXP USA Inc. PF5030_SDS.pdf Description: PMIC 2 BUCKS 2 LDO
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5032BMMA0ES MPF5032BMMA0ES NXP USA Inc. Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5032BMBA0ES MPF5032BMBA0ES NXP USA Inc. Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5032BMDA0ES MPF5032BMDA0ES NXP USA Inc. PF5030_SDS.pdf Description: PMIC 2 BUCKS 2 LDO
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MIMX8MQ6DVAJZIB NXP USA Inc. IMX8MDQLQCEC.pdf Description: IC
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Speed: 1.5GHz
RAM Size: 160kB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 621-FCPBGA (17x17)
Architecture: MPU
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
1+104.39 EUR
10+98.07 EUR
25+94.90 EUR
90+87.94 EUR
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LFK46MINTPM3QA NXP USA Inc. Description: QORIVVA MPC5746M ON A 176 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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MCIMX7D2DVK12SDR NXP USA Inc. IMX7DCEC.pdf Description: I.MX 7 SERIES 32-BIT MPU, DUAL A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMI86HP NXP USA Inc. Description: KMI86
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMI86 NXP USA Inc. Description: MAG SWITCH ANGULAR SENS SOT1291
Packaging: Tape & Reel (TR)
Mounting Type: Through Hole
Produkt ist nicht verfügbar
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LFTAJ56M2T NXP USA Inc. Description: QORIVVA MPC5600 176 LQFP ADAPTER
Packaging: Bulk
For Use With/Related Products: MPC5600
Module/Board Type: Socket Module - LQFP
Produkt ist nicht verfügbar
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MC9S08SH32MTG MC9S08SH32MTG NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 32KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)
70+7.17 EUR
Mindestbestellmenge: 70
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MCHC908QT2MDWE MCHC908QT2MDWE NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BT236X-600F,127 NXP USA Inc. Description: TRIAC 600V 6A TO220-3
Packaging: Bulk
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+0.57 EUR
Mindestbestellmenge: 1000
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MPXV2053GP MPXV2053GP NXP USA Inc. MPX2053.pdf Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-SMD, Gull Wing, Side Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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88W8987SA2-NYEA/BK NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: IC RF TXRX BLE 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W9098-A1-NYGC/AZ NXP USA Inc. Description: 88W9098-A1-NYGC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W9098-A1-NYGC/AK NXP USA Inc. Description: 88W9098-A1-NYGC
Packaging: Tray
Produkt ist nicht verfügbar
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88Q9098RA1-NYIA/AZ NXP USA Inc. Description: 88Q9098RA1-NYIA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88Q9098RA1-NYIA/AK NXP USA Inc. Description: 88Q9098RA1-NYIA
Packaging: Tray
Produkt ist nicht verfügbar
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88W9064-A1-BWPC/AZ NXP USA Inc. 88W9064-FACT-SHEET.pdf Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Produkt ist nicht verfügbar
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88W9064-A1-BWPC/AK NXP USA Inc. 88W9064-FACT-SHEET.pdf Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tray
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Produkt ist nicht verfügbar
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88W9064-A1-BWPI/AZ NXP USA Inc. 88W9064-FACT-SHEET.pdf Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Produkt ist nicht verfügbar
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88W9064-A1-BWPI/AK NXP USA Inc. 88W9064-FACT-SHEET.pdf Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tray
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Produkt ist nicht verfügbar
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SPC5744BBK1AMKU6 SPC5744BBK1AMKU6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6U5EVM10AD MCIMX6U5EVM10AD NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6U1AVM08ADR MCIMX6U1AVM08ADR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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S9S12GN48ACLFR S9S12GN48ACLFR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN48ACLF S9S12GN48ACLF NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NCK2982RHN/00100Y NCK2982RHN/00100Y NXP USA Inc. Description: MANTRA CS
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVL64F0MFM S912ZVL64F0MFM NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC35FS4500NAER2 MC35FS4500NAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS4500CAER2 MC35FS4500CAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS4501NAER2 MC35FS4501NAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS6502NAER2 MC35FS6502NAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS6502CAER2 MC35FS6502CAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS6511CAER2 MC35FS6511CAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NT4H2421TSDUD/020Z NXP USA Inc. Description: NT4H2421TSDUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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S912ZVML12AVKHR
S912ZVML12AVKHR
Hersteller: NXP USA Inc.
Description: S12Z CORE, 128K FLASH, LIN, 64LQ
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
Produkt ist nicht verfügbar
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S912ZVML64AVKH
Hersteller: NXP USA Inc.
Description: S12Z CORE, 64K FLASH, LIN, 64LQF
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 24
Produkt ist nicht verfügbar
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S912ZVMC64AVKH
Hersteller: NXP USA Inc.
Description: S12Z CORE,64K FLASH,CAN,64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
Produkt ist nicht verfügbar
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NCF295EMHN4/0116YY
Hersteller: NXP USA Inc.
Description: NCF295EMHN4
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12ZVLS3F0MFMR S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVLS3F0MFMR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+5.14 EUR
Mindestbestellmenge: 2500
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S9S12ZVLS3F0MFMR S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVLS3F0MFMR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
auf Bestellung 4900 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.17 EUR
10+7.01 EUR
25+6.47 EUR
100+5.88 EUR
250+5.60 EUR
500+5.43 EUR
1000+5.29 EUR
Mindestbestellmenge: 2
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S912ZVL64F0MFMR S9S12ZVL_FamilyRefManual_DS.pdf
S912ZVL64F0MFMR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVLA12F0MFMR
S912ZVLA12F0MFMR
Hersteller: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12Z CORE, 12
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b, 6x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
Produkt ist nicht verfügbar
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FD32K116LFT0MFMR
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC802M001JHI33Y LPC802.pdf
LPC802M001JHI33Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+1.25 EUR
Mindestbestellmenge: 6000
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LPC802M001JHI33Y LPC802.pdf
LPC802M001JHI33Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.62 EUR
12+1.52 EUR
25+1.47 EUR
100+1.42 EUR
500+1.41 EUR
1000+1.36 EUR
2500+1.27 EUR
Mindestbestellmenge: 7
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SAF775CHN/N208WDMP
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LFK77CINTPWA
Hersteller: NXP USA Inc.
Description: MPC5777C ON A 416 PIN 1.0 MM BGA
Packaging: Bulk
For Use With/Related Products: MPC5777C
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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MC35FS4507CAER2 35FS4500-35FS6500SDS-ASILB.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS4507CAE 35FS4500-35FS6500SDS-ASILB.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MF3D43C0DA4/00J
Hersteller: NXP USA Inc.
Description: MF3D43C0DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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MK10DN32VLH5 K10P64M50SF0.pdf
MK10DN32VLH5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 19x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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UJA1132AHW/3F0/0Y UJA113X_SER.pdf
Hersteller: NXP USA Inc.
Description: UJA1132AHW/3F0/0Y
Packaging: Bulk
Produkt ist nicht verfügbar
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MC32PF1550A1EP
MC32PF1550A1EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MPF5032BMMA5ES PF5030_SDS.pdf
MPF5032BMMA5ES
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.17 EUR
10+8.36 EUR
25+8.20 EUR
40+8.14 EUR
80+7.31 EUR
230+7.28 EUR
490+6.82 EUR
Mindestbestellmenge: 2
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MPF5032BMMA0ESR2
MPF5032BMMA0ESR2
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MPF5032BMMA5ESR2
MPF5032BMMA5ESR2
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5032BMBA0ESR2
MPF5032BMBA0ESR2
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5032BMDA0ESR2 PF5030_SDS.pdf
MPF5032BMDA0ESR2
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MPF5032BMMA0ES
MPF5032BMMA0ES
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MPF5032BMBA0ES
MPF5032BMBA0ES
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5032BMDA0ES PF5030_SDS.pdf
MPF5032BMDA0ES
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MIMX8MQ6DVAJZIB IMX8MDQLQCEC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Speed: 1.5GHz
RAM Size: 160kB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 621-FCPBGA (17x17)
Architecture: MPU
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+104.39 EUR
10+98.07 EUR
25+94.90 EUR
90+87.94 EUR
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LFK46MINTPM3QA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5746M ON A 176 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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MCIMX7D2DVK12SDR IMX7DCEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX 7 SERIES 32-BIT MPU, DUAL A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMI86HP
Hersteller: NXP USA Inc.
Description: KMI86
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMI86
Hersteller: NXP USA Inc.
Description: MAG SWITCH ANGULAR SENS SOT1291
Packaging: Tape & Reel (TR)
Mounting Type: Through Hole
Produkt ist nicht verfügbar
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LFTAJ56M2T
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5600 176 LQFP ADAPTER
Packaging: Bulk
For Use With/Related Products: MPC5600
Module/Board Type: Socket Module - LQFP
Produkt ist nicht verfügbar
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MC9S08SH32MTG MC9S08SH32.pdf
MC9S08SH32MTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
70+7.17 EUR
Mindestbestellmenge: 70
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MCHC908QT2MDWE MC68HC908QY4.pdf
MCHC908QT2MDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BT236X-600F,127
Hersteller: NXP USA Inc.
Description: TRIAC 600V 6A TO220-3
Packaging: Bulk
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+0.57 EUR
Mindestbestellmenge: 1000
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MPXV2053GP MPX2053.pdf
MPXV2053GP
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-SMD, Gull Wing, Side Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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88W8987SA2-NYEA/BK 88W8987_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W9098-A1-NYGC/AZ
Hersteller: NXP USA Inc.
Description: 88W9098-A1-NYGC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W9098-A1-NYGC/AK
Hersteller: NXP USA Inc.
Description: 88W9098-A1-NYGC
Packaging: Tray
Produkt ist nicht verfügbar
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88Q9098RA1-NYIA/AZ
Hersteller: NXP USA Inc.
Description: 88Q9098RA1-NYIA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88Q9098RA1-NYIA/AK
Hersteller: NXP USA Inc.
Description: 88Q9098RA1-NYIA
Packaging: Tray
Produkt ist nicht verfügbar
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88W9064-A1-BWPC/AZ 88W9064-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
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88W9064-A1-BWPC/AK 88W9064-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tray
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Produkt ist nicht verfügbar
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88W9064-A1-BWPI/AZ 88W9064-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Produkt ist nicht verfügbar
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88W9064-A1-BWPI/AK 88W9064-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tray
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Produkt ist nicht verfügbar
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SPC5744BBK1AMKU6 MPC5746C.pdf
SPC5744BBK1AMKU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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MCIMX6U5EVM10AD IMX6SDLCEC.pdf
MCIMX6U5EVM10AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6U1AVM08ADR IMX6SDLCEC.pdf
MCIMX6U1AVM08ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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S9S12GN48ACLFR
S9S12GN48ACLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12GN48ACLF
S9S12GN48ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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NCK2982RHN/00100Y
NCK2982RHN/00100Y
Hersteller: NXP USA Inc.
Description: MANTRA CS
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVL64F0MFM S9S12ZVL_FamilyRefManual_DS.pdf
S912ZVL64F0MFM
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
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MC35FS4500NAER2 35FS4500-35FS6500SDS.pdf
MC35FS4500NAER2
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS4500CAER2 35FS4500-35FS6500SDS.pdf
MC35FS4500CAER2
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS4501NAER2 35FS4500-35FS6500SDS.pdf
MC35FS4501NAER2
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS6502NAER2 35FS4500-35FS6500SDS.pdf
MC35FS6502NAER2
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS6502CAER2 35FS4500-35FS6500SDS.pdf
MC35FS6502CAER2
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS6511CAER2 35FS4500-35FS6500SDS.pdf
MC35FS6511CAER2
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NT4H2421TSDUD/020Z
Hersteller: NXP USA Inc.
Description: NT4H2421TSDUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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