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MC33FS4507NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MRF6S19100HR3 MRF6S19100HR3 NXP USA Inc. MRF6S19100H.pdf Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.99GHz
Power - Output: 22W
Gain: 16.1dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 900 mA
Produkt ist nicht verfügbar
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MC50XS4200BEK MC50XS4200BEK NXP USA Inc. MC50XS4200.pdf Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Features: Slew Rate Controlled
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 50mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3.3V ~ 5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
auf Bestellung 42 Stücke:
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42+10.8 EUR
Mindestbestellmenge: 42
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TJR1462BTK/0Z NXP USA Inc. Description: IC 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Produkt ist nicht verfügbar
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TJR1462ATK/0Z NXP USA Inc. Description: IC 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Produkt ist nicht verfügbar
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TJR1462BT/0Z NXP USA Inc. Description: IC 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
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TJR1462AT/0Z TJR1462AT/0Z NXP USA Inc. TJA1462.pdf Description: IC 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
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TJR1463ATK/0Z NXP USA Inc. Description: IC 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 14-HVSON (3x4.5)
Produkt ist nicht verfügbar
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TJR1463AT/0Z TJR1463AT/0Z NXP USA Inc. Description: IC 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Produkt ist nicht verfügbar
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FRDM-K32L2A4S NXP USA Inc. FRDMK32L2A4SUG.pdf Description: FRDM-K32L2A4S
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: K32 L2A
Platform: Freedom
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LPC54016JBD100Y LPC54016JBD100Y NXP USA Inc. LPC540xx.pdf Description: LPC54016JBD100
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 64
Produkt ist nicht verfügbar
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PMPB12UN,115 PMPB12UN,115 NXP USA Inc. Description: MOSFET N-CH 20V 7.9A 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.9A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 7.9A, 4.5V
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-DFN2020MD (2x2)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 886 pF @ 10 V
Produkt ist nicht verfügbar
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PN5190B0EV/C107Y NXP USA Inc. Description: PN5190B0EV
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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MC68360VR25VL MC68360VR25VL NXP USA Inc. MC68360.pdf Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Produkt ist nicht verfügbar
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MFS2303BMMA0EPR2 NXP USA Inc. FS23DS.pdf Description: MFS2303BMMA0EPR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2303BMMA0EP NXP USA Inc. FS23DS.pdf Description: MFS2303BMMA0EP
Packaging: Tray
Produkt ist nicht verfügbar
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IW610BUK/A0ZMIZ NXP USA Inc. Description: IW610BUK/A0ZMIZ
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610BHN/A0ZMIMP NXP USA Inc. Description: IW610BHN/A0ZMIMP
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610BHN/A0ZMIK NXP USA Inc. Description: IW610BHN/A0ZMIK
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610FUK/A0ZMIZ NXP USA Inc. Description: IW610FUK/A0ZMIZ
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610FHN/A0ZMIMP NXP USA Inc. Description: IW610FHN/A0ZMIMP
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610FHN/A0ZMIK NXP USA Inc. Description: IW610FHN/A0ZMIK
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610CUK/A0ZMIZ NXP USA Inc. Description: IW610CUK/A0ZMIZ
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610CHN/A0ZMIMP NXP USA Inc. Description: IW610CHN/A0ZMIMP
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610GUK/A0ZMIZ NXP USA Inc. Description: IW610GUK/A0ZMIZ
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610CHN/A0ZMIK NXP USA Inc. Description: IW610CHN/A0ZMIK
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610GHN/A0ZMIMP NXP USA Inc. Description: IW610GHN/A0ZMIMP
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610GHN/A0ZMIK NXP USA Inc. Description: IW610GHN/A0ZMIK
Packaging: Bulk
Produkt ist nicht verfügbar
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BLF6G20LS-110,112 NXP USA Inc. BLF6G20LS-110--112.PDF Description: FET RF 65V 1.99GHZ SOT502B
Packaging: Tube
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
4+144.47 EUR
Mindestbestellmenge: 4
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BLF6G22LS-130,112 NXP USA Inc. Description: FET RF 65V 2.17GHZ SOT502B
Packaging: Tube
auf Bestellung 77 Stücke:
Lieferzeit 10-14 Tag (e)
4+149.13 EUR
Mindestbestellmenge: 4
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CBT3244ADS,112 CBT3244ADS,112 NXP USA Inc. CBT3244A.pdf Description: IC BUS SWITCH 4 X 1:1 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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J3R200PPU15/0ZA7AV NXP USA Inc. Description: J3R200PPU15
Packaging: Tray
Produkt ist nicht verfügbar
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S912ZVL96AVFMR NXP USA Inc. Description: S12Z CPU, 96K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
Produkt ist nicht verfügbar
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FS32K142HRT0VLLR FS32K142HRT0VLLR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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FS32K142HRT0VLLT FS32K142HRT0VLLT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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NCK2982RHN/10100Y NXP USA Inc. Description: NCK2982RHN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33FS6516NAER2 MC33FS6516NAER2 NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6516NAE MC33FS6516NAE NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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S912ZVMC12AVKHR S912ZVMC12AVKHR NXP USA Inc. Description: S12Z CORE,128K FLASH,CAN,64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
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MC33PF8100A0ESR2 MC33PF8100A0ESR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 NON-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
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S912ZVMC12AVKH S912ZVMC12AVKH NXP USA Inc. Description: S12Z CORE,128K FLASH,CAN,64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
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FS32K146UIT0VLLT FS32K146UIT0VLLT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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TDF8536HH/N1Y TDF8536HH/N1Y NXP USA Inc. 939775017613.pdf Description: TDF8536HH
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 45V
Max Output Power x Channels @ Load: 140W x 4 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
Grade: Automotive
Qualification: AEC-Q100
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TDF8536HH/N1K TDF8536HH/N1K NXP USA Inc. Description: TDF8536HH
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 45V
Max Output Power x Channels @ Load: 140W x 4 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SC21G59268 NXP USA Inc. Description: CUSTOM SPECIAL
Packaging: Tray
Produkt ist nicht verfügbar
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MC33FS8430G4ESR2 NXP USA Inc. Description: SYSTEM BASIS CHIP FS8430
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5747CGK0AVKU6 SPC5747CGK0AVKU6 NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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SP5747CGK0AVKU6R SP5747CGK0AVKU6R NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5747CHK0AVMJ6 SPC5747CHK0AVMJ6 NXP USA Inc. Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5747CHK0AVMJ6R SP5747CHK0AVMJ6R NXP USA Inc. Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LFVBBK77CZD NXP USA Inc. Description: NXP LEAD FREE MPC5777C CSE 2A.17
Packaging: Bulk
For Use With/Related Products: MPCxxxx
Accessory Type: Calibration Unit
Produkt ist nicht verfügbar
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S9S12GN48J1VLC S9S12GN48J1VLC NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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S9S12GN48J0CLH S9S12GN48J0CLH NXP USA Inc. Description: S12 CORE,48K FLASH
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Produkt ist nicht verfügbar
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MC33FS6528CAER2 NXP USA Inc. Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6528CAE NXP USA Inc. Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCHC705JJ7CPE MCHC705JJ7CPE NXP USA Inc. MC68HC705JJ7.pdf Description: IC MCU 8BIT 6KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 20-DIP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9848BSMP PCA9848BSMP NXP USA Inc. PCA9848BS.pdf Description: IC BUS SWITCH 2 X 8:1 24-HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 2 x 8:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.9V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: -, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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PCA9848BSMP PCA9848BSMP NXP USA Inc. PCA9848BS.pdf Description: IC BUS SWITCH 2 X 8:1 24-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 2 x 8:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.9V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: -, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 24-HVQFN (4x4)
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10+2.94 EUR
25+2.69 EUR
100+2.41 EUR
250+2.29 EUR
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FS32K118LAT0VLHR FS32K118LAT0VLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K118LFT0MLHR FS32K118LFT0MLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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MC33FS4507NAE FS6500-FS4500SDS-ASILB.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MRF6S19100HR3 MRF6S19100H.pdf
MRF6S19100HR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.99GHz
Power - Output: 22W
Gain: 16.1dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 900 mA
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MC50XS4200BEK MC50XS4200.pdf
MC50XS4200BEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Features: Slew Rate Controlled
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 50mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3.3V ~ 5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
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42+10.8 EUR
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TJR1462BTK/0Z
Hersteller: NXP USA Inc.
Description: IC 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
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TJR1462ATK/0Z
Hersteller: NXP USA Inc.
Description: IC 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
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TJR1462BT/0Z
Hersteller: NXP USA Inc.
Description: IC 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
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TJR1462AT/0Z TJA1462.pdf
TJR1462AT/0Z
Hersteller: NXP USA Inc.
Description: IC 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
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TJR1463ATK/0Z
Hersteller: NXP USA Inc.
Description: IC 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 14-HVSON (3x4.5)
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TJR1463AT/0Z
TJR1463AT/0Z
Hersteller: NXP USA Inc.
Description: IC 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Produkt ist nicht verfügbar
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FRDM-K32L2A4S FRDMK32L2A4SUG.pdf
Hersteller: NXP USA Inc.
Description: FRDM-K32L2A4S
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: K32 L2A
Platform: Freedom
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Anzahl Preis
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LPC54016JBD100Y LPC540xx.pdf
LPC54016JBD100Y
Hersteller: NXP USA Inc.
Description: LPC54016JBD100
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 64
Produkt ist nicht verfügbar
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PMPB12UN,115
PMPB12UN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 7.9A 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.9A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 7.9A, 4.5V
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-DFN2020MD (2x2)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 886 pF @ 10 V
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PN5190B0EV/C107Y
Hersteller: NXP USA Inc.
Description: PN5190B0EV
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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MC68360VR25VL MC68360.pdf
MC68360VR25VL
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Produkt ist nicht verfügbar
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MFS2303BMMA0EPR2 FS23DS.pdf
Hersteller: NXP USA Inc.
Description: MFS2303BMMA0EPR2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2303BMMA0EP FS23DS.pdf
Hersteller: NXP USA Inc.
Description: MFS2303BMMA0EP
Packaging: Tray
Produkt ist nicht verfügbar
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IW610BUK/A0ZMIZ
Hersteller: NXP USA Inc.
Description: IW610BUK/A0ZMIZ
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610BHN/A0ZMIMP
Hersteller: NXP USA Inc.
Description: IW610BHN/A0ZMIMP
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610BHN/A0ZMIK
Hersteller: NXP USA Inc.
Description: IW610BHN/A0ZMIK
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610FUK/A0ZMIZ
Hersteller: NXP USA Inc.
Description: IW610FUK/A0ZMIZ
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610FHN/A0ZMIMP
Hersteller: NXP USA Inc.
Description: IW610FHN/A0ZMIMP
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610FHN/A0ZMIK
Hersteller: NXP USA Inc.
Description: IW610FHN/A0ZMIK
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610CUK/A0ZMIZ
Hersteller: NXP USA Inc.
Description: IW610CUK/A0ZMIZ
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610CHN/A0ZMIMP
Hersteller: NXP USA Inc.
Description: IW610CHN/A0ZMIMP
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610GUK/A0ZMIZ
Hersteller: NXP USA Inc.
Description: IW610GUK/A0ZMIZ
Packaging: Bulk
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IW610CHN/A0ZMIK
Hersteller: NXP USA Inc.
Description: IW610CHN/A0ZMIK
Packaging: Bulk
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IW610GHN/A0ZMIMP
Hersteller: NXP USA Inc.
Description: IW610GHN/A0ZMIMP
Packaging: Bulk
Produkt ist nicht verfügbar
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IW610GHN/A0ZMIK
Hersteller: NXP USA Inc.
Description: IW610GHN/A0ZMIK
Packaging: Bulk
Produkt ist nicht verfügbar
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BLF6G20LS-110,112 BLF6G20LS-110--112.PDF
Hersteller: NXP USA Inc.
Description: FET RF 65V 1.99GHZ SOT502B
Packaging: Tube
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+144.47 EUR
Mindestbestellmenge: 4
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BLF6G22LS-130,112
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.17GHZ SOT502B
Packaging: Tube
auf Bestellung 77 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+149.13 EUR
Mindestbestellmenge: 4
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CBT3244ADS,112 CBT3244A.pdf
CBT3244ADS,112
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 4 X 1:1 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
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J3R200PPU15/0ZA7AV
Hersteller: NXP USA Inc.
Description: J3R200PPU15
Packaging: Tray
Produkt ist nicht verfügbar
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S912ZVL96AVFMR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 96K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
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FS32K142HRT0VLLR S32K1xx.pdf
FS32K142HRT0VLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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FS32K142HRT0VLLT S32K1xx.pdf
FS32K142HRT0VLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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NCK2982RHN/10100Y
Hersteller: NXP USA Inc.
Description: NCK2982RHN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33FS6516NAER2 F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6516NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6516NAE F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6516NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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S912ZVMC12AVKHR
S912ZVMC12AVKHR
Hersteller: NXP USA Inc.
Description: S12Z CORE,128K FLASH,CAN,64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
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MC33PF8100A0ESR2 PF8100_PF8200.pdf
MC33PF8100A0ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 NON-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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S912ZVMC12AVKH
S912ZVMC12AVKH
Hersteller: NXP USA Inc.
Description: S12Z CORE,128K FLASH,CAN,64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
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FS32K146UIT0VLLT S32K1xx.pdf
FS32K146UIT0VLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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TDF8536HH/N1Y 939775017613.pdf
TDF8536HH/N1Y
Hersteller: NXP USA Inc.
Description: TDF8536HH
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 45V
Max Output Power x Channels @ Load: 140W x 4 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
Grade: Automotive
Qualification: AEC-Q100
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TDF8536HH/N1K
TDF8536HH/N1K
Hersteller: NXP USA Inc.
Description: TDF8536HH
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 45V
Max Output Power x Channels @ Load: 140W x 4 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SC21G59268
Hersteller: NXP USA Inc.
Description: CUSTOM SPECIAL
Packaging: Tray
Produkt ist nicht verfügbar
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MC33FS8430G4ESR2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8430
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5747CGK0AVKU6
SPC5747CGK0AVKU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5747CGK0AVKU6R
SP5747CGK0AVKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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SPC5747CHK0AVMJ6
SPC5747CHK0AVMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
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SP5747CHK0AVMJ6R
SP5747CHK0AVMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
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LFVBBK77CZD
Hersteller: NXP USA Inc.
Description: NXP LEAD FREE MPC5777C CSE 2A.17
Packaging: Bulk
For Use With/Related Products: MPCxxxx
Accessory Type: Calibration Unit
Produkt ist nicht verfügbar
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S9S12GN48J1VLC
S9S12GN48J1VLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
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S9S12GN48J0CLH
S9S12GN48J0CLH
Hersteller: NXP USA Inc.
Description: S12 CORE,48K FLASH
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Produkt ist nicht verfügbar
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MC33FS6528CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6528CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCHC705JJ7CPE MC68HC705JJ7.pdf
MCHC705JJ7CPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 6KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 20-DIP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9848BSMP PCA9848BS.pdf
PCA9848BSMP
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 2 X 8:1 24-HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 2 x 8:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.9V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: -, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 24-HVQFN (4x4)
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PCA9848BSMP PCA9848BS.pdf
PCA9848BSMP
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 2 X 8:1 24-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 2 x 8:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.9V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: -, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 24-HVQFN (4x4)
auf Bestellung 4103 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.94 EUR
10+2.94 EUR
25+2.69 EUR
100+2.41 EUR
250+2.29 EUR
Mindestbestellmenge: 5
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FS32K118LAT0VLHR S32K1xx.pdf
FS32K118LAT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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FS32K118LFT0MLHR S32K1xx.pdf
FS32K118LFT0MLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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